CN110392492A - A kind of bed die component and its application method for circuit board crimping processing procedure - Google Patents
A kind of bed die component and its application method for circuit board crimping processing procedure Download PDFInfo
- Publication number
- CN110392492A CN110392492A CN201910736405.4A CN201910736405A CN110392492A CN 110392492 A CN110392492 A CN 110392492A CN 201910736405 A CN201910736405 A CN 201910736405A CN 110392492 A CN110392492 A CN 110392492A
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- China
- Prior art keywords
- bed die
- die component
- locating
- circuit board
- processing procedure
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0173—Template for holding a PCB having mounted components thereon
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of bed die components and its application method for circuit board crimping processing procedure, and wherein the bed die component includes: bed die main body, which has the fixed slot position of bracket；And locating support, the locating support include locating clip, the cradling piece extended downwardly from the first end of the locating clip and through the fixing axle of the cradling piece, locating support is removably secured in the fixed slot position of bracket by the fixing axle.The present invention positions firm part to be crimped by installing locating support additional in bed die main body, material part is prevented to generate sliding when carrying out crimping processing procedure with circuit board, reduce contact pin foot it is disconnected, it is askew, collapse and/or board damage, the problems such as even material part and board are scrapped, it avoids adverse consequences caused by part dislocation and/or skew and influences the risk of product quality, the qualities hidden danger such as electrical property is bad of product is further reduced, the reliability of product is improved.
Description
Technical field
The present invention relates to circuit boards to process technical field.The invention further relates to one kind for circuit board crimping system
The bed die component and its application method of journey.
Background technique
During electronics industry high speed development, circuit board PCBA (Printed Circuit Board+Assembly) is
Through becoming the hardware important carrier in server architecture, in the quick R&D process of server, to the quality requirements of PCBA
It is higher and higher.During PCBA in factory is manufactured, crimping processing procedure PF (Press Fit) is surface mounting technique SMT
The piece uploading processing procedure of the most common PCBA except (Surface mounting technology) and wave-soldering.In PF operation process
In, often have partial material part etc. causes positioning inaccurate due to various reasons, or puts imbalance, so as to cause pressure
It is bad to connect process quality.Due to crimped when PF contact pin foot (pin) when have skew or dislocation the case where or due to PF tool
The reasons such as unstable, easily generation contact pin foot are disconnected, it is askew, collapse and/or PCBA is damaged or even material part and PCBA scrap etc. asks
Topic.Furthermore partial quality problem is more difficult due to examining, and easily drains in back segment process, further results in electrically bad
Etc. qualities hidden danger, or even influence product reliability.
It is, therefore, desirable to provide a kind of technical solution to solve the above problems is to prevent, part from misplacing and/or skew is to board
It is interfered caused by PF process operations in the PCBA manufacturing, avoids adverse consequences and influence caused by part dislocation and/or skew
The risk of product quality.
Summary of the invention
On the one hand, the present invention is based on above-mentioned purposes to propose a kind of bed die component for circuit board crimping processing procedure, wherein
The bed die component includes:
Bed die main body, the bed die main body have the fixed slot position of bracket；With
Locating support, the locating support include:
Locating clip；
The cradling piece extended downwardly from the first end of the locating clip；
Through the fixing axle of the cradling piece,
Wherein, locating support is removably secured in the fixed slot position of bracket by the fixing axle.
It is according to the present invention for circuit board crimping processing procedure bed die component embodiment, wherein locating clip have with wait press
The U-shaped structure that the shape of pipe fitting matches.
The embodiment of bed die component according to the present invention for circuit board crimping processing procedure, wherein the second end of locating clip has
There is the reinforcement part extended downwardly.
It is according to the present invention for circuit board crimping processing procedure bed die component embodiment, wherein cradling piece further comprise
The support portion and horizontal-extending base portion extended vertically, one end of support portion is connected with the first end of locating clip and the other end
It is connected with the first end of base portion, base portion has through-hole, and fixing axle passes through the through-hole.
The embodiment of bed die component according to the present invention for circuit board crimping processing procedure, wherein the of the base portion of cradling piece
Two ends have limit inclined-plane, the position that locating support can rotate to limit inclined-plane and the fixed slot position of bracket abuts against.
The embodiment of bed die component according to the present invention for circuit board crimping processing procedure, wherein the fixed slot position of bracket has
Limit stops, the limit stops have the matched inclined-plane in limit inclined-plane with base portion.
The embodiment of bed die component according to the present invention for circuit board crimping processing procedure, wherein the height of locating clip is less than
The height after the crimping for crimping part.
The embodiment of bed die component according to the present invention for circuit board crimping processing procedure, wherein locating clip is by having elasticity
Stainless steel alloy material be made.
The embodiment of bed die component according to the present invention for circuit board crimping processing procedure, wherein the fixed slot position of bracket is recessed
Sunken fan groove, the center of circle of the fan groove are the axle center of fixing axle.
On the other hand, the invention also provides a kind of any of the above-described to be used for answering for the bed die component of circuit board crimping processing procedure
With method, wherein method includes the following steps:
Around the upward rotational positioning bracket of fixing axle；
Circuit board is placed in bed die main body；
Locating support is rotated down to minimum around fixing axle；
Part to be crimped is put into the locating clip of locating support；
Execute crimping processing procedure.
By adopting the above technical scheme, the present invention at least has the following beneficial effects: that the invention proposes one kind for PCBA
General PF bed die component in processing positions firm part to be crimped by installing locating support additional in bed die main body, can
To effectively prevent part to misplace and/or skew interference caused by the PF process operations in the board PCBA manufacturing, reduces and insert
Stitch is disconnected, it is askew, collapse and/or the problems such as PCBA damage or even material part and PCBA scrap, it is therefore prevented that material part with PCBA
Circuit board carries out generating sliding when PF crimping processing procedure, avoids adverse consequences caused by part dislocation and/or skew and influences to produce
The risk of product quality further reduces the qualities hidden danger such as electrical property is bad of product, improves the reliability of product.
The present invention provides the various aspects of embodiment, should not be taken to limit protection scope of the present invention.According to retouching herein
The technology stated is contemplated that other embodiment, this is to those skilled in the art in research the following drawings and specific
It will be apparent after embodiment, and these embodiments intention is comprised in scope of the present application.
Below with reference to the accompanying drawings it is explained in greater detail and describes the embodiment of the present invention, but they should not be construed as this
The limitation of invention.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be in the prior art and embodiment description
Required attached drawing is briefly described, and the component in attached drawing is not drawn necessarily to scale, and can be omitted relevant
Component, or ratio may be amplified in some cases, it is described herein novel special to emphasize and to be clearly shown
Sign.In addition, as it is known in the art, structure member can be arranged differently.
In different drawings, functionally identical component appended drawing reference having the same, therefore these components are usual
It is only illustrated primary.
In figure:
Fig. 1 shows schematically bowing for the embodiment of the bed die component 10 according to the present invention for circuit board crimping processing procedure
View；
Fig. 2 shows the schematic masters of the embodiment of the bed die component 10 according to the present invention for circuit board crimping processing procedure
View；
Fig. 3 shows the schematic of the embodiment of bed die component 10 ' according to the present invention for circuit board crimping processing procedure
Main view；
Fig. 4 shows the signal of the locating support 30 in the embodiment of bed die component 10 shown in Fig. 2 according to the present invention
Property side view；
Fig. 5 shows showing for 30 ' of locating support in the embodiment of 10 ' of bed die component shown in Fig. 3 according to the present invention
Meaning property side view；
Fig. 6 shows the implementation of the locating support 30 of the bed die component 10 according to the present invention for circuit board crimping processing procedure
The schematic side elevational top view of example；
Fig. 7 shows the schematic part of the Section A-A of the embodiment of bed die component 10 shown in FIG. 1 according to the present invention
Enlarged side view；
Fig. 8 shows the embodiment of the bed die component 10 according to the present invention for circuit board crimping processing procedure in application state
Schematic side elevation and partial enlarged view.
Specific embodiment
Although the present invention can be implemented in a variety of manners, it is shown in the accompanying drawings and will be described below some show
Example property and non-limiting embodiment, it is understood that, the disclosure will be considered as that example of the invention is not intended this
Invention is limited to illustrated specific embodiment.
In order to solve to crimp during the aforementioned PF existing in the prior art referred to part dislocation and/or skew-caused
Contact pin foot is disconnected, it is askew, collapse and/or the problems such as PCBA damage or even material part and PCBA scrap, the invention proposes a kind of improvement
Bed die component.For example, Fig. 1 shows the embodiment of the bed die component 10 according to the present invention for circuit board crimping processing procedure
Schematic plan.As shown in Figure 1, the bed die component 10 includes: bed die main body 20, which has bracket fixing groove
Position 22；The bracket for including locating clip 31 with locating support 30, the locating support 30, being extended downwardly from the first end of the locating clip 31
Bar 32 and fixing axle 33 through the cradling piece 32, locating support 30 are removably secured to bed die main body by the fixing axle 33
In the fixed slot position 22 of 20 bracket.
Bed die main body 20 of the invention is based on original universal design, mostly aluminum alloy material, according to PCB or PCBA board
Card design data opens up board slot position 21.Bed die main body 20 is improved on the basis of original universal design according at it simultaneously
The locating support 30 of upper setting increases the fixed slot position 22 of bracket.
In locating support 30 of the invention, locating clip 31 is for clamping part 50 to be crimped to position and fix wait press
Pipe fitting 50 (see Fig. 8), cradling piece 32 are used to support locating clip 31 while confirming height and the position of locating clip 31, fixing axle 33
It can be revolved within a certain angle around fixing axle 33 for locating support 30 to be assembled in bed die main body 20 locating support 30 simultaneously
Turn.Part 50 to be crimped can be positioned and fixed by locating support 30 according to the present invention, effectively prevents part to be crimped
50 put the problems such as uneven, contact pin foot misplaces, while part 50 to be crimped being prevented to crimp system with PCBA circuit board progress PF
Sliding is generated when journey, reduce contact pin foot it is disconnected, it is askew, collapse and/or PCBA is damaged or even the problems such as material part and PCBA scrap, from
And it ensure that the quality during PF piece uploading to the full extent.
Fig. 2 shows the schematic masters of the embodiment of the bed die component 10 according to the present invention for circuit board crimping processing procedure
View.It can be seen that the locating clip 31 and cradling piece 32 of locating support 30 are prominent from 20 upper surface of bed die main body in Fig. 2, and
The locating clip 31 of locating support 30 is parallel to 20 horizontal extension of bed die main body, and the distance of extension is with part to be crimped 50 in circuit board
On crimping position it is related, cradling piece 32 is perpendicular downwards from the first end of locating clip 31 right end of the locating clip 31 (such as in Fig. 2)
It is straight to extend.Horizontal-extending locating clip 31 is conducive to that part 50 to be crimped is made to keep stablizing in crimping processing procedure, for wait crimp zero
Part 50 provides lateral fixation, it is ensured that part 50 to be crimped will not slide laterally in crimping processing procedure.In addition, vertical
The cradling piece 32 of extension not only supports locating clip 31, while also clamping in locating clip 31 and ensuring when crimping part 50 wait press
Pipe fitting 50 crimping prelocalization and carry the weight of part 50 to be crimped itself.
In some embodiments of the bed die component 10 for circuit board crimping processing procedure of the invention, locating clip 31 have with
The U-shaped structure that the shape of part 50 to be crimped matches.It, can be according to the outer of part 50 to be crimped when designing the locating clip 31
Portion's shape determines the interior shape of locating clip 31, part 50 to be crimped can be clamped among U-shaped structure with this configuration.Such as
Shown in Fig. 1 and Fig. 2, locating clip 31 is the semi-surrounding U-shaped structure of sheet.The locating clip 31 of sheet is providing enough stabilizations
The weight of locating clip 31 itself has been minimized while property.Difference can be designed for the shape of different parts to be crimped
Locating clip so that locating support 30 of the invention can be applied to most PF parts.
In several embodiments of the bed die component 10 for circuit board crimping processing procedure of the invention, the of 31 ' of locating clip
Two ends have the reinforcement part 311 extended downwardly.Fig. 3 shows the schematic master of the embodiment of 10 ' of bed die component according to the present invention
View.In addition, Fig. 5 shows the schematic side elevation of 30 ' of locating support in the embodiment of 10 ' of bed die component shown in Fig. 3.
It is extending vertically into bed die main body 20 downwards as shown in figure 3, the second end (such as left end shown in Fig. 3) of 31 ' of locating clip has
The reinforcement part 311 on surface.For example, reinforcement part 311 can play auxiliary in the biggish situation of the weight of part 50 to be crimped itself
Cradling piece 32 carries the effect of 50 weight of part to be crimped.
In one or more embodiments of the bed die component 10 for circuit board crimping processing procedure of the invention, cradling piece 32
It further comprise the support portion 321 and horizontal-extending base portion 322 extended vertically, the first end of support portion 321 (such as Fig. 4,5
In upper end) be connected with the first end of locating clip 31 (such as Fig. 4, the left end in 5), the second end of support portion 321 (such as is schemed
4, the lower end in 5) it is connected with the first end of base portion 322 (such as Fig. 4, the right end in 5), there is through-hole 323 in base portion 322,
Fixing axle 33 passes through the through-hole 323, such as shown in Fig. 4, Fig. 5.33 phase of fixing axle being permanently connected with the fixed slot position 22 of bracket
To rotatable with through-hole 323, so that locating support 30 is removably secured to bed die main body 20 by the fixing axle 33
In the fixed slot position 22 of bracket.Arrow R in Fig. 6 and Fig. 7 indicates locating support 30 and surrounds the rotation side that fixing axle 33 rotates
To.
In some embodiments of the bed die component 10 for circuit board crimping processing procedure of the invention, the base portion of cradling piece 32
322 second end (such as Fig. 4, the left end in 5) has limit inclined-plane 324, such as shown in Fig. 4, Fig. 5.The limit inclined-plane 324 can
To be, for example, 322 second end end lateral angle lead angle of base portion, locating support 30 is limited for cooperating with corresponding stop part
Rotate angle.
In several embodiments of the bed die component 10 for circuit board crimping processing procedure of the invention, the fixed slot position 22 of bracket
With limit stops 221, which has the matched inclined-plane in limit inclined-plane 324 with base portion 322.Fig. 7 shows figure
The schematic Partial enlarged side view of the Section A-A of the embodiment of 1 bed die component 10.It is in Fig. 7 it can be seen that solid in bracket
Determine the limit stops that slot position 22 has protrusion close to limit 324 side of inclined-plane of the second end (i.e. left end in Fig. 7) of base portion 322
221, which has the inclined-plane to match with limit inclined-plane 324 in downside.Pass through the oblique of 221 downside of limit stops
The cooperation in face and limit inclined-plane 324, can be by the rotary stopper of locating support 30 within certain angle.In order to make positioning branch
Frame 30 can more stably positioning and fixing part 50 to be crimped, the rotation of locating support 30, which is preferably limited in, keeps it parallel
In the angle of bed die main body 20, such as shown in Fig. 7 keep locating support 30 clockwise with the axle center C rotation center of fixing axle 33
Maximum rotates to the position for keeping locating clip 31 parallel with bed die main body 20.
In one or more embodiments of the bed die component 10 for circuit board crimping processing procedure of the invention, support portion
321 height is less than the height after crimping the crimping of part 50.Wait highly refer to part to be crimped after crimping the crimping of part 50
50 itself height and the part contact pin foot by crimping after remain in the sum of the length on circuit board surface.In part
After crimping, contact pin foot will not be usually completely inserted into circuit board, but have it is certain remaining, part and circuit board it
Between therefore there are certain gaps.The reserved length of this part is usually millimetre-sized, and for example, about 1-3 millimeters.More than this part
Height after staying length to constitute crimping wait crimp part 50 plus the height of part itself.The height of support portion 321 be less than to
Height is in order not to interfere crimping process tool to treat being normally carried out for the crimping crimping of part 50 after crimping the crimping of part 50.It is excellent
Selection of land, height after the height of support portion 321 is slightly less than the crimping wait crimp part 50.
In some embodiments of the bed die component 10 for circuit board crimping processing procedure of the invention, locating clip 31 is by having
The stainless steel alloy material of elasticity is made.If the aforementioned locating clip 31 having been described above is for clamping part 50 to be crimped to position
And fixed part 50 to be crimped.Flexible stainless steel alloy material can provide more excellent clamping effect for locating clip 31
Fruit.
In several embodiments of the bed die component 10 for circuit board crimping processing procedure of the invention, the fixed slot position 22 of bracket
For the fan groove of recess, the center of circle of the fan groove is the axle center C of fixing axle 33.As shown in fig. 7, the fixed slot position 22 of bracket is the bottom of from
Fan groove of the upper surface of mould main body 20 to lower recess.The fan groove provides space for the rotation of locating support 30, more specifically
It is to provide the space of rotation for the base portion 321 of cradling piece 32 that ground, which is said,.
Another aspect of the present invention also proposed a kind of bed die component 10 of any of the above-described for circuit board crimping processing procedure
Or 10 ' application method.The embodiment that Fig. 8 shows the bed die component 10 according to the present invention for circuit board crimping processing procedure exists
The schematic side elevation and partial enlarged view of application state.With reference to bed die component 10 shown in Fig. 8 and associated components, this method is extremely
Less the following steps are included:
S1: the upward rotational positioning bracket 30 of fixing axle 33 is surrounded；
S2: circuit board 40 is placed in bed die main body 20；
S3: locating support 30 is rotated down to minimum around fixing axle 33；
S4: part 50 to be crimped is put into the locating clip 31 of locating support 30；
S5: crimping processing procedure is executed.
Specifically, step S1 is in order to which locating support 30 to be placed in not around the upward rotational positioning bracket 30 of fixing axle 33
Interfere the position for being put into circuit board 40.As shown in figure 8, step S2 circuit board 40 is placed in bed die main body 20, further say
It is in the board slot position 21 (see Fig. 7) of bed die main body 20.After placing circuit board 40, step S3 surrounds fixing axle 33 to backspin
Turn locating support 30 to minimum, further says it is by the rotation of locating support 30 to the position parallel with bed die component 20.Then
Part 50 to be crimped is put into the locating clip 31 of locating support 30 by step S4, clamps part 50 to be crimped by locating clip 31.Most
Confirm that subsequent crimping processing procedure can be performed in the contact pin foot alignment of part 50 to be crimped afterwards.After crimping to be done, positioning is first opened
Bracket 30 first surrounds the upward rotational positioning bracket 30 of fixing axle 33, then taking out circuit board.
By adopting the above technical scheme, the present invention at least has the following beneficial effects: that the invention proposes one kind for circuit
General PF bed die component in plate processing positions firm part to be crimped by installing locating support additional in bed die main body,
The interference caused by the PF process operations in the board manufacturing of part dislocation and/or skew can be effectively prevented, reduce contact pin
Foot is disconnected, it is askew, collapse and/or the problems such as board damage or even material part and board are scrapped, it is therefore prevented that material part with board into
Row PF generates sliding when crimping processing procedure, avoids adverse consequences caused by part dislocation and/or skew and influences product quality
Risk further reduces the qualities hidden danger such as electrical property is bad of product, improves the reliability of product.
It should be understood that technically in feasible situation, above in relation to technical characteristic cited by different embodiments
It can be combined with each other, to form the additional embodiment in the scope of the invention.In addition, particular example as described herein and embodiment
It is non-limiting, and structure explained above, material and size can be revised accordingly without departing from the present invention
Protection scope.
In this application, the use of disjunctive is intended to include conjunction.Fixed or indefinite article use is not intended to
Indicate radix.Specifically, be intended to indicate that the reference of "the" object or " one " and "one" object can in multiple such objects
One of energy.However, removing and non-clearly limiting although element disclosed by the embodiments of the present invention can be described or be required in the form of individual
It is made as odd number, it is understood that be multiple.In addition it is possible to use conjunction "or" conveys simultaneous feature, rather than
Repelling programs.In other words, conjunction "or" is understood to include "and/or".Term " includes " is inclusiveness and has
Range identical with "comprising".
Above-described embodiment, especially any " preferably " embodiment are the possibility examples of embodiment, and just to clear
Chu understands the principle of the present invention and proposes.It, can without departing substantially from the spirit and principle of technique described herein
To make many change and modification to above-described embodiment.All modifications are intended to be included in the scope of the present disclosure.
Claims (10)
1. a kind of bed die component for circuit board crimping processing procedure characterized by comprising
Bed die main body, the bed die main body have the fixed slot position of bracket；With
Locating support, the locating support include:
Locating clip；
The cradling piece extended downwardly from the first end of the locating clip；
Through the fixing axle of the cradling piece,
Wherein, the locating support is removably secured in the fixed slot position of the bracket by the fixing axle.
2. bed die component according to claim 1, which is characterized in that the locating clip has and the shape of part to be crimped
The U-shaped structure to match.
3. bed die component according to claim 1, which is characterized in that the second end of the locating clip, which has, to be extended downwardly
Reinforcement part.
4. bed die component according to claim 1, which is characterized in that the cradling piece further comprises the branch extended vertically
Support part and horizontal-extending base portion, one end of the support portion is connected with the first end of the locating clip and the other end and institute
The first end for stating base portion is connected, and the base portion has through-hole, and the fixing axle passes through the through-hole.
5. bed die component according to claim 4, which is characterized in that the second end of the base portion of the cradling piece has
Limit inclined-plane, the position that the locating support can rotate to the limit inclined-plane and the fixed slot position of the bracket abuts against.
6. bed die component according to claim 5, which is characterized in that the fixed slot position of the bracket has limit stops, institute
Limit stops are stated with the matched inclined-plane in limit inclined-plane with the base portion.
7. bed die component according to claim 1, which is characterized in that the height of the locating clip is less than described wait crimp zero
Height after the crimping of part.
8. bed die component according to claim 1, which is characterized in that the locating clip is by flexible stainless steel alloy
Material is made.
9. bed die component according to claim 1, which is characterized in that the fixed slot position of the bracket is the fan groove of recess,
The center of circle of the fan groove is the axle center of the fixing axle.
10. a kind of application side of the bed die component according to any one of claims 1 to 9 for circuit board crimping processing procedure
Method, which is characterized in that the described method comprises the following steps:
Around the upward rotational positioning bracket of fixing axle；
Circuit board is placed in bed die main body；
Locating support is rotated down to minimum around fixing axle；
Part to be crimped is put into the locating clip of the locating support；
Execute crimping processing procedure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910736405.4A CN110392492B (en) | 2019-08-09 | 2019-08-09 | Bottom die assembly for circuit board crimping process and application method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910736405.4A CN110392492B (en) | 2019-08-09 | 2019-08-09 | Bottom die assembly for circuit board crimping process and application method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110392492A true CN110392492A (en) | 2019-10-29 |
| CN110392492B CN110392492B (en) | 2021-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910736405.4A Active CN110392492B (en) | 2019-08-09 | 2019-08-09 | Bottom die assembly for circuit board crimping process and application method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5815243A (en) * | 1981-07-20 | 1983-01-28 | Seiko Epson Corp | Mounting structure for semiconductor integrated circuit |
| CN207382694U (en) * | 2017-11-08 | 2018-05-18 | 无锡基隆电子有限公司 | A kind of LED circuit board wave soldering carrier |
| CN208483350U (en) * | 2018-07-06 | 2019-02-12 | 东莞万钧电子科技有限公司 | Fixture for pcb board |
| CN209218472U (en) * | 2018-10-23 | 2019-08-06 | 杨书印 | A kind of electronic component installation packaging system |
-
2019
- 2019-08-09 CN CN201910736405.4A patent/CN110392492B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5815243A (en) * | 1981-07-20 | 1983-01-28 | Seiko Epson Corp | Mounting structure for semiconductor integrated circuit |
| CN207382694U (en) * | 2017-11-08 | 2018-05-18 | 无锡基隆电子有限公司 | A kind of LED circuit board wave soldering carrier |
| CN208483350U (en) * | 2018-07-06 | 2019-02-12 | 东莞万钧电子科技有限公司 | Fixture for pcb board |
| CN209218472U (en) * | 2018-10-23 | 2019-08-06 | 杨书印 | A kind of electronic component installation packaging system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110392492B (en) | 2021-03-02 |
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