CN110391353A - The production method of OLED device - Google Patents
The production method of OLED device Download PDFInfo
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- CN110391353A CN110391353A CN201810350502.5A CN201810350502A CN110391353A CN 110391353 A CN110391353 A CN 110391353A CN 201810350502 A CN201810350502 A CN 201810350502A CN 110391353 A CN110391353 A CN 110391353A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Abstract
The invention discloses a kind of production methods of OLED device, comprising: provides electrode base board；Pixel defining layer is formed on the electrode base board, wherein the pixel defining layer includes spaced multiple through-holes, the through-hole and the electrode base board surround pixel hole；Functional ink is printed to pixel hole using printing technology；Curing and drying processing is carried out to the functional ink, to form luminescent layer.A kind of production method of OLED device disclosed by the invention, functional ink is squeezed into pixel hole by inkjet printing or aerosol printing technology, and functional ink is dried using techniques such as vacuum drying, infrared baking and xenon flash lamp bakings, obtain the luminescent layer that caliper uniformity is greater than 90%, to improve the quality of OLED device, and the production method simple process, cost is relatively low.
Description
Technical field
The present invention relates to field of photoelectric devices more particularly to a kind of production methods of OLED device.
Background technique
Organic Light Emitting Diode (Organic Light-Emitting Diode, abbreviation OLED) has self-luminous, height right
Than degree, low-power consumption, wide viewing angle, the response time is short, can prepare many advantages, such as flexible device, therefore OLED display technology is considered
It is the third generation display technology for replacing liquid crystal display (Liquid Crystal Display, abbreviation LCD).
Traditional OLED device in the production process, generally requires to prepare functional layer, such as electronics using small organic molecule
Transport layer, hole transmission layer and luminescent layer etc..In the preparation process of the functional layer of this organic micromolecule, generally adopt at present
With the method for thermal evaporation film-forming, i.e., material is become into steam condition by distillation or thawing by solid-state by way of heating, it is high
The gaseous molecular of speed movement reaches glass substrate and the deposition cure on substrate, then becomes the solid film of OLED material again.It is this
Production method needs to use expensive vacuum evaporation equipment, higher cost, and the evaporation speed of material is difficult to control during being deposited
Degree, to be difficult to ensure the uniformity of film forming.Therefore, how to reduce the production cost of OLED device and improve the uniform of film forming
Property become industry in technical problem urgently to be solved.
Summary of the invention
In order to solve the shortcomings of the prior art, the present invention provides one kind, cost is relatively low and the film forming uniformity is higher
The production method of OLED device.
In order to achieve the above purpose, present invention employs the following technical solutions:
A kind of production method of OLED device, comprising:
Electrode base board is provided；
Pixel defining layer is formed on the electrode base board, wherein the pixel defining layer includes spaced multiple logical
Hole, the through-hole and the electrode base board surround pixel hole；
Functional ink is printed to pixel hole using printing technology；
Curing and drying processing is carried out to the functional ink, to form luminescent layer.
Preferably, being printed the functional ink to the method in pixel hole using printing technology is specially using spray
Black printing technology prints the functional ink to pixel hole；
Wherein the functional ink includes emitting layer material and organic solvent, and the emitting layer material is bis- (2- (2'- benzene
Bithiophene base) pyridine-N, C3') (acetylacetone,2,4-pentanedione) conjunction iridium, the organic solvent is indane, and the solid content of the functional ink is 6
~8mg/ml, the viscosity of the functional ink are 2~4cP, 28~30mN/m of surface tension of the functional ink.
Preferably, curing and drying processing is carried out to the functional ink to specifically include in the method for forming luminescent layer:
The OLED device after the functional ink will be printed and stand 5 minutes to 8 minutes；
OLED device after standing is placed in vacuum drying oven, and heats 30 points under the conditions of 70 DEG C~80 DEG C of temperature
Clock was to 45 minutes；
Taking-up OLED device is cooled to room temperature to the temperature in vacuum drying oven.
Alternatively, being printed the functional ink to the method in pixel hole using printing technology is specially to use gas molten
Glue printing technology prints the functional ink to pixel hole；
Wherein the functional ink includes emitting layer material and organic solvent, and the emitting layer material is bis- (2- (2'- benzene
Bithiophene base) pyridine-N, C3') (acetylacetone,2,4-pentanedione) conjunction iridium, the organic solvent is Ergol, and the functional ink is consolidated
Content is 8~10mg/ml, and the viscosity of the functional ink is 9~12cP, the surface tension 27-30mN/m of the functional ink.
It is specifically included alternatively, carrying out curing and drying processing to the functional ink in the method for forming luminescent layer:
The OLED device after the functional ink will be printed and stand 2~4 minutes；
The functional ink is irradiated using xenon flash lamp multiple；
OLED device after xenon flash lamp is irradiated is put into infrared baking oven and toasts 10~12 minutes, and temperature is set as 100~
120℃；
Taking-up OLED device is cooled to room temperature to the temperature in infrared baking oven.
Alternatively, being printed the functional ink to the method in pixel hole using printing technology is specially to use ink-jet
Printing technology prints the functional ink to pixel hole；
Wherein the functional ink includes emitting layer material and organic solvent, and the emitting layer material is that three [2- is (to toluene
Base) pyridine-C2, N) iridium (III) is closed, the organic solvent includes butyl benzoate and Ergol, the functional ink
Solid content is 10~15mg/ml, and the viscosity of the functional ink is 8~12cP, the surface tension 29- of the functional ink
32mN/m。
It is specifically included alternatively, carrying out curing and drying processing to the functional ink in the method for forming luminescent layer:
The OLED device after the functional ink will be printed and stand 2~4 minutes；
OLED device is placed on hot plate and is toasted 20~25 minutes, temperature setting is 100~120 DEG C；
Temperature to hot plate is cooled to room temperature taking-up OLED device.
Alternatively, being printed the functional ink to the method in pixel hole using printing technology is specially to use ink-jet
Printing technology prints the functional ink to pixel hole；
Wherein the functional ink includes emitting layer material and organic solvent, and the emitting layer material is acetopyruvic acid two
(2- phenylpyridine) iridium, the organic solvent include butyl benzoate and ethyl benzoate, and the solid content of the functional ink is
10~12mg/ml, the viscosity of the functional ink are 8~12cP, 28~33mN/m of surface tension of the functional ink.
It is specifically included alternatively, carrying out curing and drying processing to the functional ink in the method for forming luminescent layer:
The OLED device after the functional ink will be printed and stand 2~4 minutes；
OLED device is placed on hot plate and is toasted 20~25 minutes, temperature setting is 100 DEG C~120 DEG C；
Temperature to hot plate is cooled to room temperature taking-up OLED device.
Preferably, the specific steps of formation pixel defining layer include: on the electrode base board
Photoresist is coated on the electrode base board；
To the photoresist curing process；
The photoresist after solidification is exposed and development treatment, to form multiple through-holes, wherein described logical
The shape in hole is ellipse, and the long axis of the through-hole is 150~160um, and the short axle of the through-hole is 50~60um, described logical
The depth in hole is 1.1um~1.3um.
The utility model has the advantages that a kind of production method of OLED device disclosed by the invention, is beaten by inkjet printing or aerosol
Print technique squeezes into functional ink in pixel hole, and using techniques such as vacuum drying, infrared baking and xenon flash lamp bakings to function
Energy ink is dried, and the luminescent layer that caliper uniformity is greater than 90% is obtained, to improve the quality of OLED device, and the production
Method and process is simple, and cost is relatively low.
Detailed description of the invention
Fig. 1 is the flow chart of the production method of the OLED device of the embodiment of the present invention；
Fig. 2A to Fig. 2 E is the processing procedure figure of the OLED device of the embodiment of the present invention one；
Fig. 3 A to Fig. 3 C is the curing and dying process processing procedure figure of the functional ink of the embodiment of the present invention one；
Fig. 4 A to Fig. 4 C is the curing and dying process processing procedure figure of the functional ink of the embodiment of the present invention two；
Fig. 5 A to Fig. 5 B is the curing and dying process processing procedure figure of the functional ink of the embodiment of the present invention three.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further described.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and do not have to
It is of the invention in limiting.
Fig. 1 shows the flow chart of the production method of the OLED device of embodiment according to the present invention, the production method packet
Step 1 is included to step 4:
Step 1: electrode base board is provided.
Step 2: forming pixel defining layer on the electrode substrate, and wherein pixel defining layer includes spaced multiple logical
Hole, through-hole and electrode base board through-hole surround pixel hole.
Step 3: functional ink is printed to pixel hole using printing technology.
Step 4: curing and drying processing is carried out to functional ink, to form luminescent layer.
The preparation method of OLED device in the present embodiment limits each pixel by pixel defining layer and electrode base board
Region is printed the functional ink with emitting layer material in each pixel region by printing technology, after curing and drying
Form luminescent layer.The thickness of the luminescent layer as made from above-mentioned technique is more uniform, and cost is relatively low by the preparation process.
In order to clearly illustrate OLED device of the invention production method detailed process and technical effect, below
It is described in detail by several embodiments.
Embodiment one
Fig. 2A to Fig. 2 E shows the processing procedure figure of the OLED device of embodiment according to the present invention one, the system of the OLED device
Include step S01 to step S04 as method:
Specifically, step S01: as shown in Figure 2 A, providing electrode base board 10, and wherein electrode base board 10 is anode grid substrate.Make
For preferred embodiment, which includes glass substrate 11 and the electrode layer 12 on glass substrate 11, the electrode layer
12 material is preferably transparent electrode material, such as ITO.
Step S02: as shown in Figure 2 B, pixel defining layer 20 is formed on electrode base board 10, wherein pixel defining layer 20 is wrapped
Spaced multiple through-holes 21 are included, through-hole 21 and 10 through-hole of electrode base board surround pixel hole.Specifically, which includes step
S021 to S023:
Step S021: as shown in Figure 3A, photoresist 30 is coated on electrode base board 10.As a preferred embodiment, photoresist
30 material is preferably polyimides, and polyimide coating is formed uniform photoresist on electrode base board 10 using spin coater
Wet film, photoresist wet film with a thickness of 1.5um~1.8um.Wherein the coating stage includes low speed spin coating stage and height spin coating rank
Section, the revolving speed in low speed spin coating stage are 400rpm~600rpm, and the revolving speed in height spin coating stage is 1800rpm~2200rpm.
Step S022: as shown in Figure 3B, curing process is carried out to photoresist 30.Specifically, it is coated with photoresist wet film
Electrode base board 10 be placed on hot plate 100 heating 3min~4min, heating temperature is 90 DEG C~110 DEG C, so that photoresist is wet
Film becomes surface uniformly without the photoresist dry film of obvious hole, photoresist dry film with a thickness of 1.2um~1.5um.
Step S023: as shown in Figure 3 C, being exposed the photoresist 30 after solidification and development treatment, multiple logical to be formed
Hole 21.Specifically, photoresist 30 is exposed using the light shield of the pattern with pixel defining layer 20 as mask plate, then
It removes photoresist part where exposure area to form through-hole 21 using developer solution.Further, plasma cleaning process is gone
Except the remaining photoresist in 21 bottom of through-hole, then formation 21 photoresist of through-hole is placed on hot plate 100 and is toasted, specifically 80 DEG C
~300 DEG C of Gradient heating 6h~8h are toasted after carrying out, and the depth of finally formed through-hole 21 is 1.1um~1.3um, through-hole 21
Shape is ellipse, it is preferable that the long axis of through-hole 21 is 150~160um, and short axle is 50~60um.
Step S03: as shown in Figure 2 C, functional ink 40 is printed to pixel hole using InkJet printing processes.
As a preferred embodiment, functional ink 40 includes emitting layer material and organic solvent, and emitting layer material is bis- (2-
(2'- benzothienyl) pyridine-N, C3') (acetylacetone,2,4-pentanedione) conjunction iridium, the English name of the emitting layer material are as follows: bis (2-benzo
[b] thiophen-2-ylpyridine) (acetylacetonate) iridium (III), No. CAS of the emitting layer material be
343978-79-0, organic solvent are indane, and the solid content of functional ink 40 is 6~8mg/ml, and the viscosity of functional ink 40 is 2
~4cP, 28~30mN/m of surface tension of functional ink 40, the boiling point of functional ink 40 are 180 DEG C.Using model
Functional ink 40 is printed along the long axis direction of through-hole 21 into pixel and is cheated by the ink-jet printer 200 of Fujifilm DMP2831
Interior, wherein the capacity of the print cartridge of ink-jet printer is 10pl, 19~21 drop ink droplets is uniformly squeezed into each pixel hole, so that function
Ink 40 is cheated interior uniform fold in pixel and is sprawled.
Step S04: curing and drying processing is carried out to functional ink 40, to form luminescent layer 40a.
As a preferred embodiment, which specifically comprises the following steps:
Step S041: the OLED device after printing function ink 40 is stood 5 minutes to 8 minutes, so that functional ink 40
It loses flowability；
Step S042: as shown in Figure 2 D, the OLED device after standing is placed in vacuum drying oven 300, and 70 DEG C~
It is heated 30 minutes to 45 minutes under the conditions of 80 DEG C of temperature, solvent is dried；
Step S043: as shown in Figure 2 E, heat source is cut off, is cooled to room temperature to the temperature in vacuum drying oven and takes out OLED device
Part.The luminescent layer 40a formed in this way with a thickness of 35nm~40nm, the caliper uniformity of luminescent layer 40 is greater than 90%.
The present embodiment provides a kind of production methods of OLED device, squeeze into function in pixel hole by InkJet printing processes
Ink 40, and functional ink 40 is toasted in vacuum environment to obtain uniform good luminescent layer, to improve OLED device
The quality of part, and the production method simple process, cost is relatively low.
Embodiment two
The production method of the OLED device of embodiment according to the present invention two includes step S11 to step S14:
Specifically, electrode base board 10, the specific structure and embodiment of the electrode base board 10 in the step step S11: are provided
Electrode base board 10 in one step S01 is identical, and details are not described herein.
Step S12: forming pixel defining layer 20 on electrode base board 10, and wherein pixel defining layer 20 includes spaced
Multiple through-holes 21, through-hole 21 and 10 through-hole of electrode base board surround pixel hole.The specific side of pixel defining layer 20 is made in the step
Method is consistent with the production method of pixel defining layer 20 in the step S02 of embodiment one, and details are not described herein.
Step S13: functional ink 40 is printed to pixel hole using aerosol printing technology.
As a preferred embodiment, functional ink 40 includes emitting layer material and organic solvent, and emitting layer material is bis- (2-
(2'- benzothienyl) pyridine-N, C3') (acetylacetone,2,4-pentanedione) conjunction iridium, the English name of the emitting layer material are as follows: bis (2-benzo
[b] thiophen-2-ylpyridine) (acetylacetonate) iridium (III), No. CAS of the emitting layer material be
343978-79-0, organic solvent are Ergol, and the solid content of functional ink 40 is 8~10mg/ml, functional ink 40
Viscosity is 9~12cP, and 27~30mN/m of surface tension of functional ink 40, the boiling point of functional ink 40 is 300 DEG C.It is molten using gas
Glue printer prints functional ink 40 into pixel hole along the long axis direction of through-hole 21, wherein the spray head of aerosol printer
Diameter be 200um, print speed be 0.2~0.4m/min, continuously printed twice along the long axis direction of through-hole 21, so that function
Energy ink 40 is cheated interior uniform fold in pixel and is sprawled.
Step S14: curing and drying processing is carried out to functional ink 40, to form luminescent layer 40a.
As a preferred embodiment, which specifically comprises the following steps:
Step S141: the OLED device after the functional ink 40 will be printed and stand 2~4 minutes, so that functional ink 40
It loses flowability.
Step S142: as shown in Figure 4 A, functional ink 40 is irradiated repeatedly using xenon flash lamp 400.As preferred implementation
Example irradiates functional ink 40 50 times using xenon flash lamp 400, and each irradiation time is 150us, the work of xenon flash lamp 400
Voltage is 2kv, can make 40 rapid draing of functional ink in pixel hole in this way.
Step S143: as shown in Figure 4 B, the OLED device after xenon flash lamp 400 is irradiated is put into infrared baking oven 500 and toasts
10~12 minutes, temperature was set as 100~120 DEG C, to remove remaining solvent in luminescent layer 40a.
Step S144: as shown in Figure 4 C, heat source is cut off, is cooled to room temperature to the temperature in infrared baking oven 500 and takes out OLED
Device.The homogeneity of the thickness of the luminescent layer 40a formed in this way be greater than 90%, luminescent layer 40a with a thickness of 35nm~40nm.
Embodiment three
The production method of the OLED device of embodiment according to the present invention three includes step S21 to step S24:
Specifically, electrode base board 10, the specific structure and embodiment of the electrode base board 10 in the step step S21: are provided
Electrode base board 10 in one step S01 is identical, and details are not described herein.
Step S22: forming pixel defining layer 20 on electrode base board 10, and wherein pixel defining layer 20 includes spaced
Multiple through-holes 21, through-hole 21 and 10 through-hole of electrode base board surround pixel hole.The specific side of pixel defining layer 20 is made in the step
Method is consistent with the production method of pixel defining layer 20 in the step S02 of embodiment one, and details are not described herein.
Step S23: functional ink 40 is printed to pixel hole using aerosol printing technology.
As a preferred embodiment, functional ink 40 includes emitting layer material and organic solvent, and emitting layer material is three [2-
(p-methylphenyl) pyridine-C2, N) iridium (III) is closed, the English name of the emitting layer material is tris [2- (p-tolyl)
Pyridine] iridium (III), No. CAS of the emitting layer material is 800394-58-5, and organic solvent includes butyl benzoate
And Ergol, wherein the volume ratio of butyl benzoate and Ergol is 3:2, the solid content of functional ink 40 is 10~
15mg/ml, the viscosity of functional ink 40 are 8~12cP, 29~32mN/m of surface tension of functional ink 40, functional ink 40
Boiling point is 230 DEG C.Using II ink-jet printer of model Microfab Jetlab by functional ink 40 along the long axis of through-hole 21
Direction is printed into pixel hole, and wherein the diameter of the spray head of aerosol printer is 50um, so that functional ink 40 is cheated in pixel
It interior uniform fold and sprawls.
Step S24: curing and drying processing is carried out to functional ink 40, to form luminescent layer 40a.
As a preferred embodiment, which specifically comprises the following steps:
Step S241: standing 2~4 minutes for the OLED device after printing function ink 40, so that functional ink 40 loses
Go mobility.
Step S242: as shown in Figure 5A, OLED device being placed on hot plate 100 and is toasted 20~25 minutes, temperature setting
It is 120 DEG C, to completely remove the solvent in luminescent layer 40a.
Step S243: as shown in Figure 5 B, heat source is cut off, the temperature to hot plate 100 is cooled to room temperature taking-up OLED device.This
Sample formed luminescent layer 40a thickness homogeneity be greater than 90%, luminescent layer 40a with a thickness of 30nm~35nm.
Example IV
The production method of the OLED device of embodiment according to the present invention four includes step S31 to step S34:
Specifically, electrode base board 10, the specific structure and embodiment of the electrode base board 10 in the step step S31: are provided
Electrode base board 10 in one step S01 is identical, and details are not described herein.
Step S32: forming pixel defining layer 20 on electrode base board 10, and wherein pixel defining layer 20 includes spaced
Multiple through-holes 21, through-hole 21 and 10 through-hole of electrode base board surround pixel hole.The specific side of pixel defining layer 20 is made in the step
Method is consistent with the production method of pixel defining layer 20 in the step S02 of embodiment one, and details are not described herein.
Step S33: functional ink 40 is printed to pixel hole using InkJet printing processes.
As a preferred embodiment, functional ink 40 includes emitting layer material and organic solvent, and emitting layer material is levulinic
Ketone acid two (2- phenylpyridine) iridium, the English name of the emitting layer material are bis (2-phenylpyridine)
(acetylacetonate) No. CAS of iridium (III), the emitting layer material is 337526-85-9, and organic solvent includes benzene
Butyl formate and ethyl benzoate, wherein the volume ratio of butyl benzoate and ethyl benzoate is 5:2, and consolidating for functional ink 40 contains
Amount is 10~12mg/ml, and the viscosity of functional ink 40 is 8~12cP, 28~33mN/m of surface tension of functional ink 40, function
The boiling point of ink 40 is 220 DEG C.Using the ink-jet printer of model Fujifilm DMP 2831 by functional ink 40 along logical
The long axis direction in hole 21 is printed into pixel hole, and wherein the capacity of the print cartridge of ink-jet printer is 10pl, in each pixel hole
It is even to squeeze into 19-21 drop ink droplet, so that functional ink 40 is cheated interior uniform fold in pixel and is sprawled.
Step S34: curing and drying processing is carried out to functional ink 40, to form luminescent layer 40a.
As a preferred embodiment, which specifically comprises the following steps:
Step S241: standing 2~4 minutes for the OLED device after printing function ink 40, so that functional ink 40 loses
Go mobility.
Step S242: OLED device being placed on hot plate 100 and is toasted 20~25 minutes, and temperature setting is 100 DEG C~120
DEG C, to completely remove the solvent in luminescent layer 40a.
Step S243: cutting heat source, the temperature to hot plate 100 are cooled to room temperature taking-up OLED device.The hair formed in this way
The homogeneity of the thickness of photosphere 40a be greater than 90%, luminescent layer 40a with a thickness of 40nm~45nm.
The above is only the specific embodiment of the application, it is noted that for the ordinary skill people of the art
For member, under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also answered
It is considered as the protection scope of the application.
Claims (10)
1. a kind of production method of OLED device characterized by comprising
It provides electrode base board (10)；
Pixel defining layer (20) are formed on the electrode base board (10), wherein the pixel defining layer (20) includes interval setting
Multiple through-holes (21), the through-hole (21) and the electrode base board (10) surround pixel hole；
Functional ink (40) are printed to pixel hole using printing technology；
Curing and drying processing is carried out to the functional ink (40), to form luminescent layer (40a).
2. the production method of OLED device according to claim 1, which is characterized in that utilize printing technology by the function
Method in ink (40) printing to pixel hole is specially that InkJet printing processes is used to print the functional ink (40)
To pixel hole；
Wherein the functional ink (40) includes emitting layer material and organic solvent, and the emitting layer material is bis- (2- (2'- benzene
Bithiophene base) pyridine-N, C3') (acetylacetone,2,4-pentanedione) conjunction iridium, the organic solvent is indane, and the consolidating for functional ink (40) contains
Amount is 6~8mg/ml, and the viscosity of the functional ink (40) is 2~4cP, the surface tension 28 of the functional ink (40)~
30mN/m。
3. the production method of OLED device according to claim 2, which is characterized in that carried out to the functional ink (40)
Curing and drying processing is specifically included in the method for forming luminescent layer (40a):
OLED device after the functional ink (40) will be printed stands 5 minutes to 8 minutes；
OLED device after standing is placed in vacuum drying oven (300), and heats 30 under the conditions of 70 DEG C~80 DEG C of temperature
Minute was to 45 minutes；
Taking-up OLED device is cooled to room temperature to the temperature in the vacuum drying oven (300).
4. the production method of OLED device according to claim 1, which is characterized in that utilize printing technology by the function
Method in ink (40) printing to pixel hole is specially that aerosol printing technology is used to beat the functional ink (40)
In print to pixel hole；
Wherein the functional ink (40) includes emitting layer material and organic solvent, and the emitting layer material is bis- (2- (2'- benzene
Bithiophene base) pyridine-N, C3') (acetylacetone,2,4-pentanedione) conjunction iridium, the organic solvent is Ergol, the functional ink (40)
Solid content be 8~10mg/ml, the viscosity of the functional ink (40) is 9~12cP, the surface of the functional ink (40)
Power 27-30mN/m.
5. the production method of OLED device according to claim 1, which is characterized in that carried out to the functional ink (40)
Curing and drying processing is specifically included in the method for forming luminescent layer (40a):
OLED device after the functional ink (40) will be printed stands 2~4 minutes；
The functional ink (40) are irradiated using xenon flash lamp (400) multiple；
OLED device after xenon flash lamp (400) irradiation is put into infrared baking oven (500) to toast 10~12 minutes, temperature is set as
100~120 DEG C；
Taking-up OLED device is cooled to room temperature to the temperature in infrared baking oven (500).
6. the production method of OLED device according to claim 1, which is characterized in that utilize printing technology by the function
Method in ink (40) printing to pixel hole is specially that InkJet printing processes is used to print the functional ink (40)
To pixel hole；
Wherein the functional ink (40) includes emitting layer material and organic solvent, and the emitting layer material is that three [2- is (to toluene
Base) pyridine-C2, N) iridium (III) is closed, the organic solvent includes butyl benzoate and Ergol, the functional ink
(40) solid content is 10~15mg/ml, and the viscosity of the functional ink (40) is 8~12cP, the functional ink (40)
Surface tension 29-32mN/m.
7. the production method of OLED device according to claim 6, which is characterized in that carried out to the functional ink (40)
Curing and drying processing is specifically included in the method for forming luminescent layer (40a):
OLED device after the functional ink (40) will be printed stands 2~4 minutes；
OLED device is placed on hot plate (100) and is toasted 20~25 minutes, temperature setting is 100-120 DEG C；
Temperature to hot plate (100) is cooled to room temperature taking-up OLED device.
8. the production method of OLED device according to claim 1, which is characterized in that utilize printing technology by the function
Method in ink (40) printing to pixel hole is specially that InkJet printing processes is used to print the functional ink (40)
To pixel hole；
Wherein the functional ink (40) includes emitting layer material and organic solvent, and the emitting layer material is acetopyruvic acid two
(2- phenylpyridine) iridium, the organic solvent include butyl benzoate and ethyl benzoate, and the consolidating for functional ink (40) contains
Amount is 10~12mg/ml, and the viscosity of the functional ink (40) is 8~12cP, the surface tension 28 of the functional ink (40)
~33mN/m.
9. the production method of OLED device according to claim 8, which is characterized in that carried out to the functional ink (40)
Curing and drying processing is specifically included in the method for forming luminescent layer (40a):
OLED device after the functional ink (40) will be printed stands 2~4 minutes；
OLED device is placed on hot plate (100) and is toasted 20~25 minutes, temperature setting is 100 DEG C~120 DEG C；
Temperature to hot plate (100) is cooled to room temperature taking-up OLED device.
10. the production method of OLED device according to any one of claims 1 to 9, which is characterized in that in the electrode base
The specific steps that pixel defining layer (20) is formed on plate (10) include:
Photoresist (30) are coated on the electrode base board (10)；
To the photoresist (30) curing process；
The photoresist (30) after solidification is exposed and development treatment, to form multiple through-holes (21), wherein institute
The shape of through-hole (21) is stated as ellipse, the long axis of the through-hole (21) is 150~160um, and the short axle of the through-hole (21) is
50~60um, the depth of the through-hole (21) are 1.1~1.3um.
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