CN110391158B - 一种半导体圆晶清洗装置 - Google Patents

一种半导体圆晶清洗装置 Download PDF

Info

Publication number
CN110391158B
CN110391158B CN201910668936.4A CN201910668936A CN110391158B CN 110391158 B CN110391158 B CN 110391158B CN 201910668936 A CN201910668936 A CN 201910668936A CN 110391158 B CN110391158 B CN 110391158B
Authority
CN
China
Prior art keywords
fixedly connected
semiconductor wafer
semicircular seat
wafer cleaning
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910668936.4A
Other languages
English (en)
Other versions
CN110391158A (zh
Inventor
王欣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Jinggong Semiconductor Equipment Co ltd
Original Assignee
Shandong Star Chain Information Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong Star Chain Information Technology Co ltd filed Critical Shandong Star Chain Information Technology Co ltd
Priority to CN201910668936.4A priority Critical patent/CN110391158B/zh
Publication of CN110391158A publication Critical patent/CN110391158A/zh
Application granted granted Critical
Publication of CN110391158B publication Critical patent/CN110391158B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • B01D29/01—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • B01D29/01—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
    • B01D29/03—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements self-supporting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

本发明公开了一种半导体圆晶清洗装置，包括箱体，箱体的两侧设置有缸体，缸体的活塞杆上设置有衔接板，箱体上设置有条形孔，衔接板与条形孔的内壁滑动接触，衔接板上设置有第一内置孔，第一内置孔内滑动设置有支撑杆，支撑杆的下端固定安装有板条，板条上设置有第一半圆座，第一半圆座上铰接有第二半圆座，第一半圆座与第二半圆座之间包围有圆晶本体，第一半圆座与第二半圆座的张口位置通过锁扣连接。该半导体圆晶清洗装置，通过缸体能够推动板条上的多组半圆座进行升降移动，方便对圆晶本体的装配。

Description

一种半导体圆晶清洗装置
技术领域
本发明涉及半导体技术领域，具体为一种半导体圆晶清洗装置。
背景技术
现有的清洗工艺通常采用将晶圆利用酸碱有机物等液体化学品等进行浸泡或冲洗，用以达到清洗表面颗粒、去除反应聚合物、刻蚀表面膜层等目的，在化学液体清洗晶圆表面颗粒后，通常使用去离子水将化学液体冲洗去除。
但是目前的清洗容器，结构相对简单，在浸泡时，圆晶本体一般处于静止状态，这样容易导致容器内壁与圆晶本体接触的部分，出现浸泡不完全的情况，同时现有的容器功能单一，在清洗环节，仅具有浸泡效果或冲洗效果当中的一点，实用性较差。
发明内容
本发明的目的在于提供一种半导体圆晶清洗装置，以解决目前的清洗容器结构单一，且圆晶本体与容器内壁接触部分容易出现浸泡不完全的问题。
为实现上述目的，本发明提供如下技术方案：一种半导体圆晶清洗装置，包括箱体，所述箱体的两侧设置有缸体，所述缸体的活塞杆上设置有衔接板，所述箱体上设置有条形孔，所述衔接板与条形孔的内壁滑动接触，所述衔接板上设置有第一内置孔，所述第一内置孔内滑动设置有支撑杆，所述支撑杆的下端固定安装有板条，所述板条上设置有第一半圆座，所述第一半圆座上铰接有第二半圆座，所述第一半圆座与第二半圆座之间包围有圆晶本体，所述第一半圆座与第二半圆座的张口位置通过锁扣连接。
优选的，所述支撑杆上固定连接有第一压板，第一压板上固定连接有第一弹簧，第一弹簧的一端固定连接衔接板。
优选的，所述箱体上设置有盖板，所述衔接板上固定连接有定位套，定位套内滑动设置有定位销，定位销上固定连接有第二弹簧，第二弹簧的一端固定连接定位套，盖板上设置有定位槽，定位销插入定位槽内。
优选的，所述盖板上设置有第二内置孔，第二内置孔内滑动设置有挤压杆，挤压杆上固定连接有第二压板，第二压板上固定连接有第三弹簧，第三弹簧的一端固定连接盖板。
优选的，所述盖板上固定连接有电机，电机上设置有转轴，转轴上固定连接有凸轮，凸轮始终与第二压板紧贴。
优选的，所述盖板上固定嵌入有过渡接口，过渡接口的下端固定安装有喷头。
优选的，所述盖板上固定连接有把手。
优选的，所述箱体的下端嵌入有过滤箱，过滤箱的内壁上嵌入有滤网。
优选的，所述过滤箱上嵌入有泵体，泵体通过软管与过渡接口连接。
优选的，所述衔接板、支撑杆、第一半圆座和第二半圆座的表面均覆盖有防腐蚀层。
与现有技术相比，本发明的有益效果是：该半导体圆晶清洗装置：1、通过缸体能够推动板条上的多组半圆座进行升降移动，方便对圆晶本体的装配；
2、通过电机带动凸轮的往复挤压效果，在配合挤压杆与支撑杆的联动挤压效果，从而使得在浸泡时，圆晶本体能够上下振荡，提高浸泡效果；
3、通过过滤网、水泵以及喷头能够形成对圆晶本体循环喷洒且杂质过滤的效果。
附图说明
图1为本发明的整体结构示意图；
图2为本发明的盖板局部放大示意图；
图3为本发明的两个半圆座局部放大示意图；
图4为本发明的两个半圆座正面放大示意图；
图5为本发明的用电器电路简图。
图中：1箱体、11缸体、12衔接板、13条形孔、14第一内置孔、15支撑杆、16板条、17第一半圆座、18第二半圆座、19圆晶本体、2第一压板、21弹簧、3盖板、31定位套、32定位销、33第二弹簧、34定位槽、4第二内置孔、41挤压杆、42第二压板、43第三弹簧、5电机、51转轴、52凸轮、53过渡接口、54喷头、55把手、6过滤箱、61滤网、62泵体。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1、图2、图3和图4，本发明提供一种技术方案：一种半导体圆晶清洗装置，包括箱体1，箱体1的两侧设置有缸体11，缸体11为液压缸，缸体11的活塞杆上设置有衔接板12，衔接板12与活塞杆固定连接，箱体1上设置有条形孔13，衔接板12与条形孔13的内壁滑动接触，衔接板12上设置有第一内置孔14，第一内置孔14内滑动设置有支撑杆15，支撑杆15的下端固定安装有板条16，支撑杆15与板条16固定连接，板条16上设置有第一半圆座17，第一半圆座17上铰接有第二半圆座18，衔接板12、支撑杆15、第一半圆座17和第二半圆座18的表面均覆盖有防腐蚀层，防腐蚀层由陶瓷聚合物制成，第一半圆座17与第二半圆座18之间包围有圆晶本体19，第一半圆座17与第二半圆座18的张口位置通过锁扣连接，第一半圆座17和第二半圆座18形成一个环状结构，且两个半圆座内均设置有可以插入圆晶本体19的槽沟，且两个半圆座均为镂空结构，便于清洗液的通过。
参阅图1和图2，支撑杆15上固定连接有第一压板2，第一压板2上固定连接有第一弹簧21，第一弹簧21的一端固定连接衔接板12，第一压板2与挤压杆41为接触紧贴。
参阅图1和图2，箱体1上设置有盖板3，衔接板12上固定连接有定位套31，定位套31内滑动设置有定位销32，定位销32上固定连接有第二弹簧33，第二弹簧33的一端固定连接定位套31，盖板3上设置有定位槽34，定位销32插入定位槽34内。
参阅图1和图2，盖板3上设置有第二内置孔4，第二内置孔4内滑动设置有挤压杆41，挤压杆41上固定连接有第二压板42，第二压板42上固定连接有第三弹簧43，第三弹簧43的一端固定连接盖板3。
参阅图1，盖板3上固定连接有电机5，电机5上设置有转轴51，转轴51上固定连接有凸轮52，凸轮52始终与第二压板42紧贴，盖板3上固定嵌入有过渡接口53，过渡接口53的下端固定安装有喷头54，盖板3上固定连接有把手55，能够起到一个上下往复移动施力的效果。
参阅图1，箱体1的下端嵌入有过滤箱6，过滤箱6的内壁上嵌入有滤网61，滤网61的孔径与普通纱布孔洞半径相同，滤网61为耐酸碱腐蚀的材料制成，过滤箱6上嵌入有泵体62，泵体62通过软管与过渡接口53连接，在处理废液时，泵体62与软管的接触端可拆卸，然后实现废液的排放清理。
参阅图1和图5，电机5的型号为51K90GU-C，电机5通过导线插头与室内电源插排插接通电，泵体62为防腐蚀泵，泵体62通过导线插头与室内电源插排插接通电，以上用电器均与适配电源连接，保证电压电流的正常稳定。
本发明在具体实施时：当需要进行清洗时，先根据清洗需要对箱体1进行操作，当需要浸泡时，将缸体11上升到最高位置，使得多组第一半圆座17和第二半圆座18能够漏出箱体1，然后通过第一半圆座17和第二半圆座18的铰接效果，打开两个半圆座，将圆晶本体19放入到两个半圆座内，并通过锁扣固定，然后通过缸体11将衔接板12释放，至最低位置，然后向箱体1内倒入酸或碱，漫过第二半圆座18的上端面，然后将盖板3覆盖在箱体1上，当定位销32的位置与定位槽34的位置对应时，通过第二弹簧33的复位效果，使得定位销32能够插入到定位槽34内，从而完成盖板3的固定，然后接通电机5的电源，电机5带动凸轮52转动，使其高低面不断的与第二压板42接触，再配合第三弹簧43的压缩再复位，从而实现上下往复移动，在挤压杆41上下移动时，会带动支撑杆15连接的板条16上下移动，从而使得两个半圆座内的圆晶本体19可以具有一个振荡效果，提高浸泡的效果，当需要冲洗时，将冲洗液先导入到过滤箱6内，经过接通泵体62的电源，实现冲洗效果。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同物限定。

Claims (9)

1.一种半导体圆晶清洗装置，包括箱体(1)，其特征在于：所述箱体(1)的两侧设置有缸体(11)，所述缸体(11)的活塞杆上设置有衔接板(12)，所述箱体(1)上设置有条形孔(13)，所述衔接板(12)与条形孔(13)的内壁滑动接触，所述衔接板(12)上设置有第一内置孔(14)，所述第一内置孔(14)内滑动设置有支撑杆(15)，所述支撑杆(15)的下端固定安装有板条(16)，所述板条(16)上设置有第一半圆座(17)，所述第一半圆座(17)上铰接有第二半圆座(18)，所述第一半圆座(17)与第二半圆座(18)之间包围有圆晶本体(19)，所述第一半圆座(17)与第二半圆座(18)的张口位置通过锁扣连接；所述衔接板(12)、支撑杆(15)、第一半圆座(17)和第二半圆座(18)的表面均覆盖有防腐蚀层；所述第一半圆座(17)和第二半圆座(18)均为镂空结构。
2.根据权利要求1所述的一种半导体圆晶清洗装置，其特征在于：所述支撑杆(15)上固定连接有第一压板(2)，第一压板(2)上固定连接有第一弹簧(21)，第一弹簧(21)的一端固定连接衔接板(12)。
3.根据权利要求2所述的一种半导体圆晶清洗装置，其特征在于：所述箱体(1)上设置有盖板(3)，所述衔接板(12)上固定连接有定位套(31)，定位套(31)内滑动设置有定位销(32)，定位销(32)上固定连接有第二弹簧(33)，第二弹簧(33)的一端固定连接定位套(31)，盖板(3)上设置有定位槽(34)，定位销(32)插入定位槽(34)内。
4.根据权利要求3所述的一种半导体圆晶清洗装置，其特征在于：所述盖板(3)上设置有第二内置孔(4)，第二内置孔(4)内滑动设置有挤压杆(41)，挤压杆(41)上固定连接有第二压板(42)，第二压板(42)上固定连接有第三弹簧(43)，第三弹簧(43)的一端固定连接盖板(3)。
5.根据权利要求4所述的一种半导体圆晶清洗装置，其特征在于：所述盖板(3)上固定连接有电机(5)，电机(5)上设置有转轴(51)，转轴(51)上固定连接有凸轮(52)，凸轮(52)始终与第二压板(42)紧贴。
6.根据权利要求5所述的一种半导体圆晶清洗装置，其特征在于：所述盖板(3)上固定嵌入有过渡接口(53)，过渡接口(53)的下端固定安装有喷头(54)。
7.根据权利要求6所述的一种半导体圆晶清洗装置，其特征在于：所述盖板(3)上固定连接有把手(55)。
8.根据权利要求1所述的一种半导体圆晶清洗装置，其特征在于：所述箱体(1)的下端嵌入有过滤箱(6)，过滤箱(6)的内壁上嵌入有滤网(61)。
9.根据权利要求8所述的一种半导体圆晶清洗装置，其特征在于：所述过滤箱(6)上嵌入有泵体(62)，泵体(62)通过软管与过渡接口(53)连接。
CN201910668936.4A 2019-07-23 2019-07-23 一种半导体圆晶清洗装置 Active CN110391158B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910668936.4A CN110391158B (zh) 2019-07-23 2019-07-23 一种半导体圆晶清洗装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910668936.4A CN110391158B (zh) 2019-07-23 2019-07-23 一种半导体圆晶清洗装置

Publications (2)

Publication Number Publication Date
CN110391158A CN110391158A (zh) 2019-10-29
CN110391158B true CN110391158B (zh) 2021-05-07

Family

ID=68287069

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910668936.4A Active CN110391158B (zh) 2019-07-23 2019-07-23 一种半导体圆晶清洗装置

Country Status (1)

Country Link
CN (1) CN110391158B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113020084A (zh) * 2021-04-22 2021-06-25 通威太阳能(金堂)有限公司 一种石墨舟清洗装置及使用方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103489814A (zh) * 2013-09-24 2014-01-01 深圳市凯尔迪光电科技有限公司 全自动兆声波半导体晶圆清洗设备
CN103801536A (zh) * 2012-11-13 2014-05-21 沈阳芯源微电子设备有限公司 一种晶片清洗装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6830057B2 (en) * 2002-11-01 2004-12-14 Semitool, Inc. Wafer container cleaning system
US7360985B2 (en) * 2002-12-30 2008-04-22 Tdk Corporation Wafer processing apparatus including clean box stopping mechanism

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103801536A (zh) * 2012-11-13 2014-05-21 沈阳芯源微电子设备有限公司 一种晶片清洗装置
CN103489814A (zh) * 2013-09-24 2014-01-01 深圳市凯尔迪光电科技有限公司 全自动兆声波半导体晶圆清洗设备

Also Published As

Publication number Publication date
CN110391158A (zh) 2019-10-29

Similar Documents

Publication Publication Date Title
CN110639914B (zh) 一种玻璃罐清洗装置
CN110391158B (zh) 一种半导体圆晶清洗装置
CN204544902U (zh) 一种手机清洁杀菌装置
CN103065996B (zh) 晶圆表面处理装置
CN103151291B (zh) 晶圆夹持旋转装置及晶圆清洗槽
CN107175245B (zh) 一种化学工程用的高效环保的试管自动除污设备
CN211679163U (zh) 一种便于冲洗的反应釜
CN113385507A (zh) 一种医用管具清洗设备
CN115672842B (zh) 一种铁工艺品加工用的清洁装置
CN108185940A (zh) 一种高效杯子清洗装置
CN208944709U (zh) 一种电子器件用清洗烘干装置
CN217043660U (zh) 一种晶片生产用快速冲洗装置
JP3239433U (ja) 電動モップクリーナーのモップクロス洗浄装置
CN204298915U (zh) 厕所小便池清洗装置
CN209303327U (zh) 一种螺栓清洗设备
CN218555065U (zh) 一种石斛培养瓶清洗装置
CN210936325U (zh) 一种化工原料桶快速清洗装置
CN213675493U (zh) 一种3d打印设备喷头清洗装置
CN214184441U (zh) 一种化工环保用化工桶清洗装置
TWM608724U (zh) 擦地機的擦拭物清洗裝置
CN209334317U (zh) 一种制造包衣机用新型清洗装置
CN203225246U (zh) 晶圆夹持旋转装置及晶圆清洗槽
CN211330363U (zh) 清洗装置
CN214638604U (zh) 一种日用陶瓷自动清洗装置
CN217191205U (zh) 一种用于建筑工程机械的清洗设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20210407

Address after: 261061 room 201-037, 2nd floor, Yinfeng Zhongchuang, blue wisdom Valley, No. 503, Yinfeng Road, Yulong community, Xincheng street, high tech Zone, Weifang City, Shandong Province

Applicant after: Shandong Star Chain Information Technology Co.,Ltd.

Address before: 100083 Beijing City, Haidian District Institute of Rutosids No. 11

Applicant before: Wang Xin

GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230413

Address after: No. 1133, Nanyuan West Road, Qidong Economic Development Zone, Qidong City, Nantong City, Jiangsu Province, 226200

Patentee after: Jiangsu Jinggong Semiconductor Equipment Co.,Ltd.

Address before: 261061 room 201-037, 2nd floor, Yinfeng Zhongchuang, blue wisdom Valley, No. 503, Yinfeng Road, Yulong community, Xincheng street, high tech Zone, Weifang City, Shandong Province

Patentee before: Shandong Star Chain Information Technology Co.,Ltd.