CN110365889A - A kind of chip sunk type camera module - Google Patents
A kind of chip sunk type camera module Download PDFInfo
- Publication number
- CN110365889A CN110365889A CN201910747833.7A CN201910747833A CN110365889A CN 110365889 A CN110365889 A CN 110365889A CN 201910747833 A CN201910747833 A CN 201910747833A CN 110365889 A CN110365889 A CN 110365889A
- Authority
- CN
- China
- Prior art keywords
- chip
- hardboard
- steel disc
- camera lens
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
A kind of chip sunk type camera module, including wiring board, steel disc and camera lens, chip receiving opening is offered in the circuit board, is equipped with chip conformable region in the upper surface middle part of the steel disc, is offered circumferential excessive glue groove along the chip conformable region in the upper surface of the steel disc；The upper surface of the steel disc is fitted in the bottom surface of the wiring board, and the chip conformable region and the circumferential excessive glue groove are located at the chip receiving opening；The camera lens is mounted on the upper surface of the wiring board, chip receiving opening described in the light hole face of the camera lens.Chip receiving opening is offered in the circuit board, chip is mounted on the steel disc upper surface in chip receiving opening, since the distance of the optical centre of chip sensitivity centre to camera lens is fixed value, therefore, the camera lens height that the camera lens opposite chip that the present invention uses uses when being directly installed in PCB surface is lower.The height of whole mould group tradition relatively reduces.
Description
Technical field
The present invention relates to camera module fields, and in particular to a kind of chip sunk type camera module.
Background technique
The existing camera suitable for mobile phone photograph, mainly by camera lens, microscope base, chip, optical filter, capacitor, connector, plate
Son, the components such as gold thread composition.Filter set is inside the microscope base, and then lens lock is attached to inside microscope base, formed one and half at
Product are whole.Capacitor, connector beat the one semi-finished product entirety of formation on plank by SMT.Then chip passes through gold thread and plate
Son bridge joint, optical center pass through board again and are assembled on plank with chip center automatically, and group carries out focusing test after installing, focusing
It takes pictures after.
The Rigid Flex that the plank of traditional mould group is done in the industry at present is generally in 0.45mm or so, then on thick hardboard
In addition camera chip, camera chip thickness itself cannot be thinned, and microscope base thickness is finally added on camera chip,
Its whole thickness can not be thinned again, thus cause camera integral thickness thicker than fuselage and protrude.Such as the present volume production of our company
Traditional mould group, plank thickness 0.45mm, in addition the thickness 0.15mm of Sensor, along with the height 3.34mm and glue of TTL
The height of thick 0.02mm, mould group entirety are exactly 3.96mm.
Summary of the invention
In view of the deficiencies of the prior art, the present invention proposes a kind of chip sunk type camera modules, and specific technical solution is such as
Under:
A kind of chip sunk type camera module, it is characterised in that: including wiring board (1), steel disc (2) and camera lens (3),
Chip receiving opening (4) are offered on wiring board (1), are equipped with chip conformable region (5) in the upper surface middle part of the steel disc (2),
Circumferential excessive glue groove (6) are offered along the chip conformable region (5) in the upper surface of the steel disc (2)；
The upper surface of the steel disc (2) is fitted in the bottom surface of the wiring board (1), the chip conformable region (5) and described
Circumferential excessive glue groove (6) is located at the chip receiving opening (4)；
The camera lens (3) is mounted on the upper surface of the wiring board (1), core described in the light hole face of the camera lens (3)
Piece receiving opening (4).
Further: the wiring board (1) includes upper hardboard, lower hardboard and internal layer soft board, and the internal layer soft board is located at institute
It states between hardboard and the lower hardboard；
The upper hardboard includes the upper hardboard copper foil layer being arranged successively, upper hardboard FR4 layers and upper cementing layer；
The lower hardboard includes lower cementing layer, lower hardboard FR4 layers and lower hardboard copper foil layer；
The internal layer soft board includes cover layer on soft board, copper foil layer and soft under copper foil layer, PI layers of soft board, soft board on soft board
Cover film under plate.
Further: the steel disc (2) is attached with the wiring board (1) by gluing.
Further: chip (7) is fixed on chip conformable region (5) by gluing.
The invention has the benefit that first, chip receiving opening is offered in the circuit board, and chip is mounted on core
On steel disc upper surface in piece receiving opening, since the distance of the optical centre of chip sensitivity centre to camera lens is fixed value, benefit
Sunk with chip, after chip installation on the steel plate, the camera lens opposite chip that the present invention uses is directly installed on PCB surface
The camera lens height used when upper is lower.The height of whole mould group tradition relatively reduces.
Second, since steel plate and wiring board are when being combined using adhesive means, in chip receiving opening and wiring board
Binding face on to wiring board overflow can go out glue, the glue of spilling is located in chip receiving opening, will affect chip conformable region
Surface smoothness, offer circumferential excessive glue groove, can guarantee overflow glue be flowed into circumferential excessive glue groove, facilitate automation
Processing.
Detailed description of the invention
Fig. 1 is circuit board structure figure of the present invention；
Fig. 2 is the installation diagram of the prior art；
Fig. 3 is circuit board structure figure of the invention；
Fig. 4 is installation diagram of the invention；
Number explanation is in attached drawing, and wiring board 1, steel disc 2, camera lens 3, chip receiving opening 4, chip conformable region 5, circumferential direction overflow
Glue groove 6, chip 7.
Specific embodiment
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawing, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
As shown in Figure 3 and Figure 4, a kind of chip sunk type camera module, including wiring board 1, steel disc 2 and camera lens 3, online
Chip receiving opening 4 is offered on road plate 1, chip conformable region 5 is equipped in the upper surface middle part of the steel disc 2, in the steel disc 2
Upper surface offer circumferential excessive glue groove 6 along the chip conformable region 5；
The upper surface of the steel disc 2 is fitted in the bottom surface of the wiring board 1, and the chip conformable region 5 and the circumferential direction overflow
Glue groove 6 is located at the chip receiving opening 4；
The camera lens 3 is mounted on the upper surface of the wiring board 1, and chip described in the light hole face of the camera lens 3 accommodates
Through-hole 4.
The wiring board 1 includes upper hardboard, lower hardboard and internal layer soft board, and the internal layer soft board is located at the upper hardboard and institute
It states between lower hardboard；
The upper hardboard includes the upper hardboard copper foil layer being arranged successively, upper hardboard FR4 layers and upper cementing layer；
The lower hardboard includes lower cementing layer, lower hardboard FR4 layers and lower hardboard copper foil layer；
The internal layer soft board includes cover layer on soft board, copper foil layer and soft under copper foil layer, PI layers of soft board, soft board on soft board
Cover film under plate.
In the present embodiment, as in Fig. 3 and Fig. 4, wiring board 1 with a thickness of 0.25mm, steel disc 2 with a thickness of 0.2mm, chip
With a thickness of 0.15mm, for camera lens 3 with a thickness of 3.34mm, the glue thickness between wiring board 1 and steel disc 2 is 0.02mm, arrives core at the top of camera lens 3
The distance of piece upper surface is 3.34mm, and it is 3.71mm that the distance between steel plate bottom is arrived at the top of camera lens 3.In Fig. 1 and Fig. 2,
It is 3.96mm that the distance between wiring board bottom is arrived in 3 mould group of conventional lenses, at the top of camera lens 3.It is passed it can be seen that the present invention is opposite
The integral thickness for mould group of uniting is thinning, and volume becomes smaller.
Claims (4)
1. a kind of chip sunk type camera module, it is characterised in that: including wiring board (1), steel disc (2) and camera lens (3), online
Chip receiving opening (4) are offered on road plate (1), are equipped with chip conformable region (5) in the upper surface middle part of the steel disc (2),
The upper surface of the steel disc (2) offers circumferential excessive glue groove (6) along the chip conformable region (5)；
The upper surface of the steel disc (2) is fitted in the bottom surface of the wiring board (1), the chip conformable region (5) and the circumferential direction
Excessive glue groove (6) is located at the chip receiving opening (4)；
The camera lens (3) is mounted on the upper surface of the wiring board (1), and chip described in the light hole face of the camera lens (3) holds
It receives through-hole (4).
2. a kind of chip sunk type camera module according to claim 1, it is characterised in that: the wiring board (1) includes
Upper hardboard, lower hardboard and internal layer soft board, the internal layer soft board is between the upper hardboard and the lower hardboard；
The upper hardboard includes the upper hardboard copper foil layer being arranged successively, upper hardboard FR4 layers and upper cementing layer；
The lower hardboard includes lower cementing layer, lower hardboard FR4 layers and lower hardboard copper foil layer；
The internal layer soft board includes cover layer on soft board, on soft board under copper foil layer, PI layers of soft board, soft board under copper foil layer and soft board
Cover film.
3. a kind of chip sunk type camera module according to claim 1, it is characterised in that: the steel disc (2) with it is described
Wiring board (1) is attached by gluing.
4. a kind of chip sunk type camera module according to claim 1, it is characterised in that: chip (7) is solid by gluing
It is scheduled on chip conformable region (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910747833.7A CN110365889A (en) | 2019-08-14 | 2019-08-14 | A kind of chip sunk type camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910747833.7A CN110365889A (en) | 2019-08-14 | 2019-08-14 | A kind of chip sunk type camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110365889A true CN110365889A (en) | 2019-10-22 |
Family
ID=68224538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910747833.7A Pending CN110365889A (en) | 2019-08-14 | 2019-08-14 | A kind of chip sunk type camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110365889A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312675A (en) * | 2020-11-12 | 2021-02-02 | 昆山丘钛光电科技有限公司 | Chip attaching method and camera module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202056787U (en) * | 2011-06-03 | 2011-11-30 | 山东三晶照明科技有限公司 | Frame for light-emitting diode (LED) street light |
| CN103163617A (en) * | 2013-03-05 | 2013-06-19 | 南昌欧菲光电技术有限公司 | Lens module |
| CN106559957A (en) * | 2016-04-01 | 2017-04-05 | 昆山丘钛微电子科技有限公司 | Rigid Flex and cell-phone camera module |
| CN208169849U (en) * | 2018-05-08 | 2018-11-30 | 重庆市天实精工科技有限公司 | The dirty camera bracket of resistance to movement |
| CN209016049U (en) * | 2018-12-11 | 2019-06-21 | 杰群电子科技（东莞）有限公司 | A kind of lead frame and the packaging semiconductor comprising it |
-
2019
- 2019-08-14 CN CN201910747833.7A patent/CN110365889A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202056787U (en) * | 2011-06-03 | 2011-11-30 | 山东三晶照明科技有限公司 | Frame for light-emitting diode (LED) street light |
| CN103163617A (en) * | 2013-03-05 | 2013-06-19 | 南昌欧菲光电技术有限公司 | Lens module |
| CN106559957A (en) * | 2016-04-01 | 2017-04-05 | 昆山丘钛微电子科技有限公司 | Rigid Flex and cell-phone camera module |
| CN208169849U (en) * | 2018-05-08 | 2018-11-30 | 重庆市天实精工科技有限公司 | The dirty camera bracket of resistance to movement |
| CN209016049U (en) * | 2018-12-11 | 2019-06-21 | 杰群电子科技（东莞）有限公司 | A kind of lead frame and the packaging semiconductor comprising it |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312675A (en) * | 2020-11-12 | 2021-02-02 | 昆山丘钛光电科技有限公司 | Chip attaching method and camera module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191022 |
|
| RJ01 | Rejection of invention patent application after publication |