CN110359582A - PC component joining method and PC component splicing construction - Google Patents

PC component joining method and PC component splicing construction Download PDF

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Publication number
CN110359582A
CN110359582A CN201910650395.2A CN201910650395A CN110359582A CN 110359582 A CN110359582 A CN 110359582A CN 201910650395 A CN201910650395 A CN 201910650395A CN 110359582 A CN110359582 A CN 110359582A
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CN
China
Prior art keywords
component
cover board
splicing
assembling groove
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910650395.2A
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Chinese (zh)
Inventor
姚树国
杨宇
贾晓明
刘文蓉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Baoye Construction Engineering Co Ltd
Shanghai Baoye Group Corp Ltd
Original Assignee
Shanghai Baoye Construction Engineering Co Ltd
Shanghai Baoye Group Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Baoye Construction Engineering Co Ltd, Shanghai Baoye Group Corp Ltd filed Critical Shanghai Baoye Construction Engineering Co Ltd
Priority to CN201910650395.2A priority Critical patent/CN110359582A/en
Publication of CN110359582A publication Critical patent/CN110359582A/en
Pending legal-status Critical Current

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    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/38Connections for building structures in general
    • E04B1/61Connections for building structures in general of slab-shaped building elements with each other
    • E04B1/6108Connections for building structures in general of slab-shaped building elements with each other the frontal surfaces of the slabs connected together
    • E04B1/612Connections for building structures in general of slab-shaped building elements with each other the frontal surfaces of the slabs connected together by means between frontal surfaces
    • E04B1/6145Connections for building structures in general of slab-shaped building elements with each other the frontal surfaces of the slabs connected together by means between frontal surfaces with recesses in both frontal surfaces co-operating with an additional connecting element
    • E04B1/6162Connections for building structures in general of slab-shaped building elements with each other the frontal surfaces of the slabs connected together by means between frontal surfaces with recesses in both frontal surfaces co-operating with an additional connecting element the connection made by an additional locking key
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F13/00Coverings or linings, e.g. for walls or ceilings
    • E04F13/02Coverings or linings, e.g. for walls or ceilings of plastic materials hardening after applying, e.g. plaster
    • E04F13/04Bases for plaster

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Finishing Walls (AREA)

Abstract

The invention discloses a kind of PC component joining method, include the following steps: on the interface being mutually connected on two PC components, opens up groove body respectively at side mutually to combine the assembling groove for being developed across splicing gap;One cover board is closely embedded in the assembling groove, to cover the splicing gap;Dope layer is coated, continuously to cover the interface of the cover board and two PC components, the dope layer outer surface is smooth.Cover board is across entire splicing gap, to be covered to splicing gap, to play the role of support to part of the dope layer at splicing gap, and support effect when guaranteeing dope layer coating everywhere.And cover board is embedded in the groove body that interface opens up, to guarantee that entire lateral surface keeps smooth again, to guarantee the coating effect of later period dope layer.The invention also discloses a kind of PC component splicing constructions.

Description

PC component joining method and PC component splicing construction
Technical field
The present invention relates to technical field of buildings to further relate to a kind of PC more specifically to a kind of PC component joining method Component splicing construction.
Background technique
At present in building trade, in order to improve built speed and reduce building cost, for some building parts, use PC component is manufactured.PC (precast concrete) component, i.e. mixed mud prefabricated component, specifically, such as precast reinforced coagulation Earth pillar foundation, Prefabricated steel construction steel-column foundation, street lamp advertisement board column reinforced concrete foundation, precast floor slab etc..
The deviation within the scope of existential specification when PC component producer tooling member;The existential specification when PC component assembling construction Deviation in range.Cause alien invasion there are deviation when the two exists simultaneously deviation, alien invasion therefore out-of-flatness is popular at present to assemble The sandwich outer wall heat preservation system of formula, therefore exterior wall only remains dope layer construction, if plate stitch deviation processing is not appropriate to will affect alien invasion sight Feel quality.
In conclusion how to efficiently solve splicing gap trace is difficult the problem of eliminating, it is current this field skill Art personnel's urgent problem.
Summary of the invention
In view of this, the first purpose of this invention is to provide a kind of PC component joining method, the PC component splicing side Method can efficiently solve splicing gap trace and be difficult the problem of eliminating, and a second object of the present invention is to provide a kind of PC components Splicing construction.
In order to reach above-mentioned first purpose, the invention provides the following technical scheme:
A kind of PC component joining method, includes the following steps:
On the interface being mutually connected on two PC components, mutually opens up groove body respectively at side and be developed across with combining Splice the assembling groove in gap;
One cover board is closely embedded in the assembling groove, to cover the splicing gap;
Dope layer is coated, continuously to cover the interface of the cover board and two PC components, outside the dope layer Surfacing.
In the PC component joining method, when being spliced, sand is no longer simply filled for reserved splicing gap Slurry, but by cover board across entire splicing gap, to be covered to splicing gap, to splice gap to dope layer Support is played the role of in the part at place, support effect when guaranteeing dope layer coating everywhere.And cover board is embedded in interface and opens If groove body in, to guarantee that entire lateral surface keeps smooth again, to guarantee the coating effect of later period dope layer.And cover board with It can very easily be formed and be fitted closely between assembling groove, so new gap will not be formed between PC component, this makes After coating dope layer, entire lateral surface seems very smooth, and then guarantees beautiful.In conclusion the PC component joining method energy It enough efficiently solves splicing gap trace and is difficult the problem of eliminating.
Preferably, the thickness of the cover board is not more than the depth of the assembling groove, and the cover board is embedded in the dress Medial surface is bonded the slot bottom setting of the assembling groove when in groove.
Preferably, described that a cover board is closely embedded in the assembling groove, to cover the splicing gap, are as follows:
Uniformly coating forms grout layer in the assembling groove, in the not solidified grout layer outer side covering one The grid member that block mutually agrees with the assembling groove, the grid member and the grout layer combine to form the cover board.
Preferably, further include following steps before being embedded in the cover board and after opening up the groove body:
After pouring into mortar into the splicing gap, barrier stick is filled in into the splicing gap;
On the outside of the barrier stick, waterproof gasket cement is injected into the splicing gap;
On the outside of the waterproof gasket cement, using polymer cement mortar stuff up a crack, and on the outside of the polymer cement mortar Face is concordant with the slot bottom of the assembling groove.
Preferably, the coating dope layer are as follows:
Water proof exterior wall putty is coated, in the water proof exterior wall putty outer side covering real stone paint decoration surface layer.
In order to reach above-mentioned second purpose, the present invention also provides a kind of PC component splicing construction, PC component splicings Structure includes the PC component of two splicings, and the interface being mutually connected on two PC components mutually opens up slot at side respectively Body is developed across the assembling groove in splicing gap to combine, and further includes cover board and dope layer, and the cover board is closely embedded in described In assembling groove, to cover the splicing gap, the dope layer continuously covers the cover board and two PC components Interface, the dope layer outer surface are smooth.Since above-mentioned PC component joining method has above-mentioned technique effect, so by PC Component joining method, which is formed by PC component splicing construction, should also have corresponding technical effect.
Preferably, the cover board includes coated in the grout layer in the assembling groove and being embedded in the assembling groove The interior grid member with grout layer solidification connection.
Preferably, the splicing gap has been sequentially filled from inside to outside: joint filling mortar obstructs stick, waterproof gasket cement and gathers Object cement mortar is closed, the lateral surface of the polymer cement mortar is concordant with the slot bottom of the assembling groove.
Preferably, the dope layer includes water proof exterior wall putty layer and is covered on true on the outside of the water proof exterior wall putty layer Stone paint decoration surface layer.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with It obtains other drawings based on these drawings.
Fig. 1 is the flow chart of PC component joining method provided in an embodiment of the present invention;
Fig. 2 is the structural schematic diagram of PC component splicing construction provided in an embodiment of the present invention;
Fig. 3 is the relative position structural schematic diagram of two PC components provided in an embodiment of the present invention when having opened up groove body.
It is marked in attached drawing as follows:
PC component 1, splicing gap 2, cover board 3, dope layer 4, joint filling mortar 5, barrier stick 6, waterproof gasket cement 7, polymer Cement mortar 8, assembling groove 9.
Specific embodiment
The embodiment of the invention discloses a kind of PC component joining methods, are difficult to eliminate to efficiently solve splicing gap trace The problem of.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Fig. 1-Fig. 3 is please referred to, Fig. 1 is the flow chart of PC component joining method provided in an embodiment of the present invention;Fig. 2 is this hair The structural schematic diagram for the PC component splicing construction that bright embodiment provides;Fig. 3 is provided in an embodiment of the present invention when having opened up groove body The relative position structural schematic diagram of two PC components.
In a specific embodiment, a kind of PC component joining method is present embodiments provided, is used for two PC components 1 (mixed mud prefabricated component) is stitched together, to form entirety.For two PC components 1 signified in the application, along splicing side To splicing, so that at least one side at least one side on a PC component 1, with another PC component 1 is smooth Transition, to form linking, then the side is known as interface, and after splicing, the interface of two 1 phases of PC component linking is located at same It on one side, can be on same plane, be also possible to be located on same smooth surface.If two PC components 1 are walls, generally After carrying out two splicings of PC components 1, which should be respectively positioned on same plane.
Along stitching direction, the mutually close side side of two PC components 1 be in parastate, between form gap, that is, splice The width in gap 2 is spliced generally at 20 millimeters or so in gap 2.The width direction in the splicing gap 2 refers to two PC components 1 Stitching direction, the depth direction in the splicing gap 2 refers to the direction perpendicular to interface, and wherein splices prolonging for gap 2 It stretches direction and refers to the direction vertical with depth direction and width direction.Being such as two PC components 1 is wall, wherein spelling The depth direction of seam gap 2 is the thickness direction of PC component 1.
It should be noted that context illustrate the application technical solution when, for the convenience of description, for two splice PC component 1, one of them be the first PC component, another be the 2nd PC component.
After the completion of splicing corresponding two PC components 1, so that the interface of two 1 phases of PC component linking is located at together On on one side, and between form splicing gap 2 after, further, also packet following steps:
Step 100: on the interface of two 1 phases of PC component linking, opening up groove body respectively at side mutually to be formed Assembling groove 9 across splicing gap 2.
The interface of 1 phase of two of them PC component linking is located at the side in the same face after splicing, and behind the side Phase needs to cover dope layer 4.Interface mutually opens up groove body respectively at side to be developed across splicing seams on two PC components 1 The assembling groove 9 of gap 2 opens up a groove body, and slot close to the edge of the 2nd PC component 1 in the interface of the first PC component 1 Body vallecular cavity extends at splicing gap 2, and corresponding, the interface of the 2nd PC component 1 opens up one close to the edge of the first PC component 1 A groove body, and groove body vallecular cavity extends at splicing gap 2, is all extended at splicing gap 2 by two groove bodies, so that the first PC Connection to combine to form a big groove between the groove body of component 1 and the groove body of the 2nd PC component 1, i.e. referred to as assembling groove 9, which is developed across arranges in splicing gap 2.
Specifically, for any of two PC components 1 PC component 1, in its interface close to another PC component 1 Edge along splicing 2 extending direction of gap open up a rectangle groove body.The width of the rectangle groove body, i.e., in stitching direction Length, the extending direction along splicing gap 2 is equal, such as between 130 millimeters to 170 millimeters, and preferably 150 millimeters; And the depth of the rectangle groove body, that is, splice the length of 2 depth direction of gap between 2 millimeters to 4 millimeters, preferably 3 millimeters, this When assembling groove 9 depth, i.e., it is consistent with the depth of single groove body, and the width in stitching direction is two PC components 1 Groove body width plus splicing gap 2 width.It should also be noted that, wherein opening up groove body, generally chisel is set.
Step 200: a cover board 3 being closely embedded in the assembling groove 9, to cover the splicing gap 2.
It is formed by assembling groove 9 for opening up corresponding groove body on above-mentioned two PC component 1, is embedded in cover board 3, It should be noted that its cover plate 3 should be closely embedded in assembling groove 9, and wherein closely it is embedded in assembling groove 9, refers to It is that after cover board 3 is embedded in, the edge of 3 transverse direction of cover board, the especially edge of stitching direction two sides should be with corresponding assembling grooves 9 cell wall fits closely, i.e., fits closely with the groove body cell wall of corresponding PC component 1, to avoid new gap is formed, and by tight It is close to be embedded in assembling groove 9, splice gap 2 to cover, to play branch to part of the post-coatings layer 4 at splicing gap 2 The effect of support.
Step 300: coating dope layer 4, continuously to cover the interface of the cover board 3 and two PC components 1, institute It is smooth to state 4 outer surface of dope layer.
The dope layer 4 for needing to be coated in entire 1 splicing component of PC component linking surface side at this time, should be covered on cover board simultaneously 3 outsides, the i.e. the dope layer 4 continuously interface of covering cover board 3 and two PC components 1, and 4 outer surface of dope layer after coating Should be smooth, i.e., the interface joining place not at 3 edge of cover board and PC component 1 forms protrusion or gap.It should be noted that On the depth direction in splicing gap 2, wherein the relative positional relationship between 3 outer surface of the interface of PC component 1 and cover board, is answered It is adapted when with 4 thickness requirement of dope layer, to guarantee that later period 4 outer surface of dope layer of coating is smooth.
In the PC component joining method, when being spliced, sand is no longer simply filled for reserved splicing gap 2 Slurry, but by cover board 3 across entire splicing gap 2, to be covered to splicing gap 2, to splice to dope layer 4 Support is played the role of in part at gap 2, support effect when guaranteeing that dope layer 4 coats everywhere.And cover board 3 is embedded in rank In the groove body that junction opens up, to guarantee that entire lateral surface keeps smooth again, to guarantee the coating effect of later period dope layer 4.And And can very easily be formed and be fitted closely between cover board 3 and assembling groove 9, so new gap is formed between PC component 1, This makes after coating dope layer 4, and entire lateral surface seems very smooth, and then guarantees beautiful.In conclusion the PC component splices Method can efficiently solve splicing 2 trace of gap and be difficult the problem of eliminating.
Further, in above-mentioned steps 200, the thickness of cover board 3 preferably wherein is not more than the depth of assembling groove 9, And it is preferably equal, and when cover board 3 to be embedded in assembling groove 9, the slot bottom of the medial surface and assembling groove 9 that make cover board 3 pastes Close setting.So that after cover board 3 is embedded in assembling groove 9, the interface of the non-bulging PC component 1 of the lateral surface of cover board 3, and it is excellent The interface of the lateral surface surrounding edge of cover board 3 and PC component 1 seamlessly transits at this time for choosing.It should be noted that when outside cover board 3 When side is arranged relative to the interface of PC component 1 slightly biased to inside, it can be looked at this time by the dope layer 4 in later period It mends, even if coating of the dope layer 4 at cover board 3 slightly thickens, the outer surface to guarantee entire dope layer 4 is smooth, i.e., in cover board 3 Lateral surface and the interface joining place of PC component 1 can still guarantee to seamlessly transit.
It should be noted that its cover plate 3 forms, it can be preforming, be then fitted in assembling groove 9, it can also Injection molding is carried out with the later period, later period injection molding can effectively improve the compatible degree between cover board 3 and assembling groove 9.Base In this, preferred above-mentioned steps 200 herein specifically: uniformly coating forms grout layer in assembling groove 9, in not solidified institute One piece of grid member agreed with 9 phase of assembling groove of grout layer outer side covering is stated, wherein grid member and grout layer combination Form above-mentioned cover board 3.It should be noted that the cover board 3 can also be included on the outside of grid member joints cement pulp layer again, wherein Grout layer can be plain-water slurry layer, i.e., do not mix grit.Wherein grid member plays the role of skeleton in cover board 3, with Being effectively prevented from the later period expands with heat and contract with cold the crack of generation.Specifically, wherein grid member is preferably alkali-resisting glass fiber grid part, certainly also It can be other grid members.
Further, in order to preferably fill up splicing gap 2, to guarantee that later period overall structure is more stable, herein preferably In above-mentioned steps 100 to further including step 400 between step 200, i.e., also wrapped before being embedded in cover board 3 and after opening up groove body Include step 400.Wherein step 400 specifically: after pouring into mortar into splicing gap 2, barrier stick 6 is filled in into splicing gap 2; In 6 outside of barrier stick, waterproof gasket cement 7 is injected into splicing gap 2;In 7 outside of waterproof gasket cement, using polymer water silt particle 8 stuff up a cracks are starched, and 8 lateral surface of polymer cement mortar is concordant with the slot bottom of assembling groove 9.With splicing gap 2 in, from the inside to the outside Sequentially form joint filling mortar 5, barrier stick 6, waterproof gasket cement 7 and polymer cement mortar 8.Wherein barrier stick 6 primarily serves resistance The joint filling mortar 5 of formation of being only in the milk leaks, while certain supporting role is played to waterproof gasket cement 7, it is specific obstruct stick 6 can To use PE stick (polyethylene stick), materials are convenient, and pliability is moderate, after the stuff up a crack that is in the milk, can fill in splicing gap 2 In, to play barrier action, and the later period plays a supporting role.The effect of waterproof gasket cement 7 is to prevent water along splicing gap 2 Depth direction flowing.Wherein outer polymer cement mortar 8 mainly plays a part of undertaking, two sides can respectively with cement slurry and Waterproof gasket cement 7 forms bonding.
In general practical application, often will appear at least one in two PC components 1 is exterior wall, and wherein exterior wall refers to One side wall is different from indoor partition wall towards interior towards outdoor, another side wall.At this point, specifically, above-mentioned steps 300 In, coating dope layer 4 can be specific are as follows: coating water proof exterior wall putty, in the water proof exterior wall putty outer side covering lacquer Finish coat.
The PC component joining method provided in based on the above embodiment, the present invention also provides a kind of splicings of PC component to tie Structure, the PC component splicing construction include the PC components 1 of two splicings, and the interface phase being mutually connected on two PC components 1 Groove body is respectively set to combine the assembling groove 9 for being developed across splicing gap 2 at side, further includes cover board 3 and dope layer 4, the cover board 3 is closely embedded in the assembling groove 9, to cover the splicing gap 2, the continuously covering of dope layer 4 The interface of the cover board 3 and two PC components 1,4 outer surface of dope layer are smooth.Concrete implementation mode can be with With reference to above-described embodiment, as described in above-described embodiment, wherein after splicing gap 2 refers to that two PC components 1 splice, splicing The gap formed between face.It is provided with groove body, the specific can be that open up groove body, i.e., it is close on the interface of PC component 1 The edge of another PC component 1 opens up groove body, and the groove body vallecular cavity extends at splicing gap 2, this makes two PC components 1 Upper groove body combines to form an assembling groove 9, specifically can be on the interface of PC component 1 close to another PC component 1 Edge, opening up a depth along splicing 4 extending direction of gap is 3 millimeters, the groove body that stitching direction width is 15 millimeters, this fashionable dress Depth with groove 9 is 3 millimeters, and the width in stitching direction is that (two 1 upper groove bodies of PC component are wide to be set for twice of 15 millimeters Set) plus the width in splicing gap 2.Wherein close insertion refer to two sides side wall of the cover board 3 in stitching direction respectively with dress Cell wall with groove 9 fits.Wherein coat is located at the stacked PC component 1 for being covered on two sides of two side portions in splicing gap 2 On, and middle part is covered on 3 outside of cover board.It in the PC component splicing construction, can be formed by above-mentioned PC component joining method Splicing construction, so the beneficial effect of the PC component splicing construction please refers to above-described embodiment.It should be noted that being provided with Groove body can be the reserved setting in the production of PC component, can also be when two PC components splice, carry out chisel and set.
Further, herein preferably in the PC component splicing construction, above-mentioned cover board 3 includes being coated in assembling groove 9 Cement sand bed and it is embedded in the grid member in assembling groove 9 with grout layer solidification connection.Wherein grout layer and net The solidification connection of lattice part, specifically, grid member is immersed or is fitted on the outside of grout layer at this time when grout layer does not solidify, After grout layer solidification, i.e., solidification connection can be formed with grid member.3 implementation of specific cover board, can refer to above-mentioned reality Apply example.Wherein grid member such as above-described embodiment is preferably alkaline-resisting grid member.It is corresponding, the preferably lateral surface of cover board 3 and PC component 1 Interface be located on the same face, with formed smoothly transit.
Further, such as above-described embodiment, in order to preferably fill splicing gap 2, and the water on cover board 3 is preferably supported Mud layer, the preferably splicing gap 2 has been sequentially filled from inside to outside herein: joint filling mortar 5, barrier stick 6, waterproof gasket cement 7 It is concordant with the slot bottom of assembling groove 9 with the lateral surface of polymer cement mortar 8, the polymer cement mortar 8.Such as above-mentioned implementation Example, wherein barrier stick 6 preferably uses PE stick.
Further, such as above-described embodiment, dope layer 4 preferably wherein includes water proof exterior wall putty layer and is covered on waterproof Real stone paint decoration surface layer on the outside of exterior wall putty layer.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one The widest scope of cause.

Claims (9)

1. a kind of PC component joining method, which comprises the steps of:
On the interface being mutually connected on two PC components, mutually opens up groove body respectively at side and be developed across splicing to combine The assembling groove in gap;
One cover board is closely embedded in the assembling groove, to cover the splicing gap;
Dope layer is coated, continuously to cover the interface of the cover board and two PC components, the dope layer outer surface It is smooth.
2. PC component joining method according to claim 1, which is characterized in that the thickness of the cover board is not more than the dress Depth with groove, and the slot bottom that medial surface is bonded the assembling groove when cover board is embedded in the assembling groove is set It sets.
3. PC component joining method according to claim 2, which is characterized in that it is described a cover board is closely embedded in it is described In assembling groove, to cover the splicing gap, are as follows:
Uniformly coating forms grout layer in the assembling groove, one piece of the not solidified grout layer outer side covering with The grid member that the assembling groove mutually agrees with, the grid member and the grout layer combine to form the cover board.
4. PC component joining method according to claim 3, which is characterized in that before being embedded in the cover board and opening up Further include following steps after the groove body:
After pouring into mortar into the splicing gap, barrier stick is filled in into the splicing gap;
On the outside of the barrier stick, waterproof gasket cement is injected into the splicing gap;
On the outside of the waterproof gasket cement, using polymer cement mortar stuff up a crack, and the polymer cement mortar lateral surface with The slot bottom of the assembling groove is concordant.
5. PC component joining method according to claim 4, which is characterized in that the coating dope layer are as follows:
Water proof exterior wall putty is coated, in the water proof exterior wall putty outer side covering real stone paint decoration surface layer.
6. a kind of PC component splicing construction, the PC component spliced including two, which is characterized in that mutually held in the mouth on two PC components Mutually groove body is respectively set to combine the assembling groove for being developed across splicing gap at side in the interface connect, further includes cover board And dope layer, the cover board are closely embedded in the assembling groove, to cover the splicing gap, the dope layer continuously covers The interface of the cover board and two PC components is covered, the dope layer outer surface is smooth.
7. PC component splicing construction according to claim 6, which is characterized in that the cover board includes being coated in the assembly Grout layer in groove and it is embedded in the grid member in the assembling groove with grout layer solidification connection.
8. PC component splicing construction according to claim 7, which is characterized in that the splicing gap is successively filled out from inside to outside Filled with: joint filling mortar, barrier stick, waterproof gasket cement and polymer cement mortar, the lateral surface of the polymer cement mortar with The slot bottom of the assembling groove is concordant.
9. PC component splicing construction according to claim 8, which is characterized in that the dope layer includes water proof exterior wall putty Layer and the real stone paint decoration surface layer being covered on the outside of the water proof exterior wall putty layer.
CN201910650395.2A 2019-07-18 2019-07-18 PC component joining method and PC component splicing construction Pending CN110359582A (en)

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CN208763212U (en) * 2018-07-12 2019-04-19 成都城投建筑科技投资管理集团有限公司 A kind of up concave type one-way slabs piece structure
CN109610648A (en) * 2018-12-20 2019-04-12 五冶集团上海有限公司 Piece processing method before a kind of assembled architecture concrete members pour

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Application publication date: 20191022