CN110359021B - Target binding method for improving pretreatment - Google Patents
Target binding method for improving pretreatment Download PDFInfo
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- CN110359021B CN110359021B CN201910774125.2A CN201910774125A CN110359021B CN 110359021 B CN110359021 B CN 110359021B CN 201910774125 A CN201910774125 A CN 201910774125A CN 110359021 B CN110359021 B CN 110359021B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
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Abstract
The invention discloses a target binding method for improving pretreatment, which comprises a step a before pretreatment, b, a step of back tube pretreatment, c, a step of metal target tube pretreatment, d and a step of binding.
Description
Technical Field
The invention relates to the technical field of binding pretreatment of a rotary target, in particular to a target binding method for improving pretreatment.
Background
The bonding firmness and the welding rate that rotatory target was bound are directly influenced to the preliminary treatment effect before binding at the back pipe of rotatory target and metal target pipe, and bonding firmness and welding rate are low makes rotatory target appear electrically conductive bad, the heat dissipation is uneven, the condition that easily drops when using, seriously influences the use of product, consequently to the preliminary treatment before binding of rotatory target especially important.
The metal target tube is integrally slender, the length of the metal target tube reaches 2.7 m, the size and the shape of an inner circle of the metal target tube are processed by the inner wall of the metal target tube through the processes of drilling, boring and the like due to the accurate control of the target material structure, but the processing of the inner wall of the long tube inevitably has a tolerance range on the roughness and the size. The roughness variation of the inner wall and the accidental surface defect caused by the vibration of the cutter are inevitable, and the binding quality is inevitably influenced by the problems of wetting, air exhaust and the like of the sunken position during binding. The traditional metallization treatment utilizes ultrasonic waves to enhance the bonding force between the binding welding materials and the target tube, but for the inner wall of a rough long tube target which cannot accurately measure and remove defects, the single ultrasonic metallization cannot ensure the exhaust and coating of deep sunken defects such as tool marks. And because the metal target tube is slender, when the metallization layer is coated on the binding surface of the metal target tube by ultrasonic, the uniformity of the metallization layer on the binding surface of the metal target tube cannot be checked and judged, enough wettability between the binding solder and the metal target tube cannot be effectively ensured, the pretreatment effect of the rotary target before binding is poor, the welding rate of the binding of the rotary target is low, and the binding quality of the rotary target is difficult to ensure.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a target binding method for improving pretreatment, which effectively improves the pretreatment effect before binding of a rotary target and improves the binding quality of the rotary target.
In order to achieve the purpose, the invention adopts the technical scheme that: a target binding method for improving pretreatment comprises the following steps,
a. the method comprises the steps of preprocessing, wherein sand blasting, cleaning and drying are respectively carried out on a binding surface of a metal target tube and a binding surface of a back tube;
b. a back tube pretreatment step of performing ultrasonic coating on the binding surface of the back tube after cleaning and drying to bind metal solder so as to form a back tube metallization layer, comprising the following substeps,
b1, mounting the back tube on a rotating device which can make the back tube rotate at a constant speed,
b2, heating the back tube to a first temperature and keeping the temperature, wherein the first temperature is higher than the melting point temperature of the binding metal solder and lower than the melting point temperature of the metal target tube and the back tube,
b3, starting a rotating device to enable the back tube to rotate at a constant speed, controlling the autorotation speed of the back tube at 3-6 r/min,
b4, starting the ultrasonic coating device, adding molten binding metal solder into a liquid storage tank of the ultrasonic coating device, supplying the binding metal solder to the ultrasonic brush head by the liquid storage tank at a set liquid supply speed, moving the ultrasonic brush head at a constant speed on the binding surface of the back tube at a speed of 100 mm/min until the binding metal solder completely covers the binding surface of the back tube to form a back tube metallization layer with a thickness of 0.05-0.1mm, and removing the heating of the back tube to finish the back tube pretreatment;
c. a metal target tube pretreatment step, in which the cleaned and dried metal target tube is subjected to brush plating by using brush plating solution on the binding surface of the metal target tube to form a reinforced metal layer, and a binding metal solder is used on the basis of the reinforced metal layer to form a target metallization layer, comprising the following substeps,
c1, mounting the metal target tube on a rotating device which can make the metal target tube rotate at a constant speed,
c2, setting the voltage of the brush plating device at 10-15V and the current at 30-50A, electrically connecting the negative pole of the brush plating device to the metal target tube to form a cathode connecting part which is arranged around the tube wall of the metal target tube,
c3, starting the rotating device to make the metal target tube rotate at a constant speed, controlling the autorotation speed of the metal target tube at 0.8-1.2 r/min,
c4, a liquid supply part is arranged in the electric brush plating device, brush plating liquid is stored in the liquid supply part, the liquid supply part is connected with the brush plating head, the liquid supply part supplies the brush plating liquid to the brush plating head according to a set liquid supply speed, the electric brush plating device is started, the metal target tube is a cathode, the brush plating head is an anode, the moving length of the brush plating head in the electric brush plating device is 1-1.5m per time and is a unit length, the metal target tube moves 3-6 times per minute and the unit length, metal ions in the brush plating liquid are discharged and crystallized on the binding surface of the metal target tube to form a reinforced metal layer with the thickness of 0.03-0.08mm until the reinforced metal layer completely covers the binding surface of the metal target tube, and the electric brush plating of the reinforced metal layer is completed,
c5, recycling the brush plating solution in the metal target tube, cleaning the reinforced metal layer of the metal target tube with clean water,
c6, heating the metal target tube to a second temperature and keeping the temperature, wherein the second temperature is higher than the melting point temperature of the binding metal solder and lower than the melting point temperature of the metal target tube and the back tube,
c7, starting a rotating device to enable the metal target tube to rotate at a constant speed, controlling the autorotation speed of the metal target tube at 3-6 r/min,
c8, moving the ultrasonic brush head at a constant speed on the binding surface of the metal target tube at a speed of 10-20 mm/min on the basis of strengthening the metal layer by an ultrasonic coating device until the binding surface of the metal target tube is completely covered by the binding metal solder to form a target metallization layer with a thickness of 0.08-0.1mm, removing the heating of the metal target tube and finishing the pretreatment of the metal target tube;
d. and a binding step, namely, a binding gap with a set distance is arranged between the binding surface of the metal target tube and the binding surface of the back tube, binding metal solder is poured into the binding gap, and the binding metal solder is solidified to form a binding layer.
In a further technical scheme, the electric brush plating solution contains a tin compound, a nickel compound or a copper compound, and the cathode connecting part is made of a metal copper material.
In a further technical scheme, before the step a and the step b, the inner wall of the metal target tube is drilled or bored to form a concave position, and in the step c4, the reinforced metal layer with the thickness of 0.05-0.08 is formed at the concave position of the metal target tube.
In a further technical scheme, in the step c4, the recessed position is filled by crystallizing the inner wall surface of the metal target tube through brush plating solution, a wavy interface is formed between the metal target tube and the reinforcing metal layer, and the other side surface of the reinforcing metal layer opposite to the interface is a smooth surface.
In a further technical scheme, the metal target tube is a molybdenum target material, the back tube is a titanium back tube, the binding metal solder is indium, and in the steps b2 and c6, the first temperature and the second temperature are respectively controlled at 170-300 ℃.
In a further technical scheme, the step a before pretreatment further comprises the substeps of a1) performing sand blasting treatment on the binding surfaces of the metal target tube and the back tube respectively to enable the roughness of the binding surfaces of the metal target tube and the back tube to reach Ra0.8-1.6 respectively; a2) placing the metal target tube and the back tube in an ultrasonic cleaning pool, and sequentially heating water and alcohol in the ultrasonic cleaning pool to clean the binding surfaces of the metal target tube and the back tube; a3) and placing the metal target tube and the back tube into a heating device for drying, wherein the temperature of the heating device is set at 160-300 ℃, and drying the binding surface liquid of the metal target tube and the back tube.
In the step a2, the metal target tube and the back tube are cleaned in hot water at 50-100 ℃ for 1-2 hours, and after the metal target tube and the back tube are cleaned in the hot water, the ultrasonic cleaning tank is cleaned with alcohol for 5-15 minutes.
In a further technical scheme, in the step c8, the ultrasonic coating device generates ultrasonic waves, and the ultrasonic waves act on the molten bonding metal solder to accelerate the atom movement rate in the liquid bonding metal solder and accelerate the flow of the liquid bonding metal solder, and simultaneously further diffuse the molten bonding metal solder towards the reinforcing metal layer, so that the reinforcing metal layer is in wetting contact with the target metallization layer, and a diffusion bonding layer is formed between the metallization layer and the reinforcing metal layer.
In a further technical scheme, the length of the metal target tubes exceeds 1.5m, and the metal target tubes are respectively provided with a cathode connecting part at intervals of 0.8-1.1 m, so that the current in the metal target tubes is uniformly distributed, and the deposition rate of metal ions forming the reinforced metal layer is kept uniform.
In a further technical scheme, in the step b4, the binding surface of the back tube is subjected to vibration friction through ultrasonic waves in an ultrasonic coating device, so that the contact area between the binding metal solder and the binding surface of the back tube is increased, and an adhesion layer is formed between molecular layers of the back tube and the binding metal solder which are mutually rubbed.
After the method is adopted, compared with the prior art, the method has the advantages that:
1. the invention adopts the brush plating mode to brush plate the reinforced metal layer, can effectively ensure the uniformity of the coating effect of the inner wall of the target tube, so as to ensure that the bonding metal solder and the metal target tube have enough wettability and ensure and enhance the bonding effect of the rotary target.
2. The invention uses the binding metal solder to carry out coating through the ultrasonic wave emitted by the ultrasonic coating device, thereby forming the target metallization layer and the back tube metallization layer with stronger bonding force and being beneficial to improving the welding rate.
3. The invention adopts the arrangement of the plurality of cathode connecting parts which are arranged at intervals and set distances respectively, and the whole conductive effect of the long rotary target is uniform in the process of brush plating, so that the deposition rates of metal ions in the brush plating solution are close, the operation difficulty is reduced, and the surface smoothness of the formed enhanced metal layer is high.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIGS. 1 and 2 are schematic microstructures of a metal target tube and a reinforcing metal layer of the present invention, respectively.
Detailed Description
The following are merely preferred embodiments of the present invention, and do not limit the scope of the present invention.
A target binding method for improving pretreatment comprises the following steps:
a. the method comprises the steps of preprocessing, wherein sand blasting, cleaning and drying are respectively carried out on a binding surface of a metal target tube and a binding surface of a back tube;
before the metal target pipe and the back pipe are pretreated, the metal target pipe and the back pipe must be subjected to preliminary treatment, and the preliminary treatment comprises sand blasting and cleaning of a binding surface of the metal target pipe and a binding surface of the back pipe. The sand blasting makes the surface rough, increases the surface area, namely the contact surface, and increases the adhesive force of the coating on the sand blasting surface; the back pipe outer circle machining can achieve low roughness, the surface is smooth, the roughness of the target pipe inner circle is difficult to control due to the difficulty of long pipe inner hole machining, the defects caused by machining such as a small amount of skip cutters exist, the surface condition of a sand blasting surface can be improved through sand blasting, the uniformity of the roughness of the sand blasting surface can be improved, and the binding quality is favorably improved.
Meanwhile, the natural oxide film on the binding surface of the metal target tube and the back tube can be removed by sand blasting. The binding surfaces of the metal target tube and the back tube are cleaned before the coating is added, mainly the particles left in the washing and sand blasting process are removed, meanwhile, the fat grease and other organic dirt on the binding surfaces of the metal target tube and the back tube are removed, the good cleanliness of the binding surfaces of the metal target tube and the back tube is the premise of obtaining a good uniform coating effect, and the pollution to the subsequent processes is effectively prevented.
More specifically, the method further comprises the following substeps: a1) respectively carrying out sand blasting treatment on the binding surfaces of the metal target tube and the back tube to enable the roughness of the binding surfaces of the metal target tube and the back tube to reach Ra0.8-1.6 respectively; the sand blasting roughness of the binding surface of the metal target tube or the back tube is too small, so that poor adhesion of the reinforced metal layer is easily caused, and meanwhile, the natural oxide film of the binding surface of the metal target tube and the back tube cannot be completely removed; the sand blasting roughness of the binding surface of the metal target tube and the back tube is too large, and the required thicknesses of the reinforcing metal layer and the back tube metallization layer are relatively thin, so that the binding surface of the metal target tube cannot be covered after the coating of the reinforcing metal layer if the roughness is too large, the binding surface of the metal target tube is exposed, the coating effect of the metallization layer is influenced, or the binding surface of the back tube cannot be covered after the coating of the back tube metallization layer, the binding surface of the back tube is exposed, and the effect of the binding layer and the back tube metallization layer is influenced. Preferably, the binding surface roughness of the metal target tube and the backing tube of Ra0.8-1.6 is in a suitable range.
a2) Placing the metal target tube and the back tube in an ultrasonic cleaning pool, and sequentially heating water and alcohol in the ultrasonic cleaning pool to clean the binding surfaces of the metal target tube and the back tube; the binding surfaces of the metal target pipe and the back pipe are cleaned by hot water and alcohol through ultrasonic waves, the ultrasonic waves enable vibration generated by the hot water and the alcohol to be beneficial to enhancing the degreasing effect, and meanwhile, particles at the rough small concave positions of the binding surfaces of the metal target pipe and the back pipe can be shaken out or flushed out. The hot water and alcohol can effectively remove organic dirt of the fat grease machine, and the ultrasonic action is combined to clean the binding surface of the metal target tube and the back tube so as to meet the requirement of the surface cleanliness of the electric brush plating. More specifically, in the step a2, the metal target tube and the back tube are cleaned in hot water at 50-100 ℃ for 1-2 hours, and after the metal target tube and the back tube are cleaned in the hot water, the metal target tube and the back tube are cleaned in an ultrasonic cleaning pool with alcohol for 5-15 minutes.
a3) And placing the metal target tube and the back tube into a heating device for drying, wherein the temperature of the heating device is set at 160-300 ℃. And (3) moving the metal target tube and the back tube out of the ultrasonic cleaning pool, drying the cleaned metal target tube and the cleaned back tube, setting the temperature of the heating device at 160-300 ℃, and evaporating residual water or alcohol on the binding surface of the metal target tube and the back tube to prepare for a pretreatment process.
b. A back tube pretreatment step of performing ultrasonic coating on the binding surface of the back tube after cleaning and drying to bind metal solder so as to form a back tube metallization layer, comprising the following substeps,
b1, mounting the back tube in a rotating device which can enable the back tube to rotate at a constant speed, automatically rotating the back tube by mounting the back tube in the rotating device which rotates at a constant speed, reducing the workload of workers, improving the working efficiency, and simultaneously controlling the uniform rotation of the back tube to help to ensure the consistency of the thickness of a back tube metallization layer formed by ultrasonic coating.
b2, heating the back tube to a first temperature and then preserving heat, wherein the first temperature is higher than the melting point temperature of the binding metal solder and lower than the melting point temperature of the metal target tube and the back tube, the melting point of the binding metal solder is lower, the binding metal solder is easy to oxidize at normal temperature to form an oxide film, and the back tube is heated to a temperature higher than the temperature of the binding metal solder to keep the binding metal solder in a molten state, thereby being beneficial to the diffusion of the binding metal solder. More specifically, the first temperature is set at 160-.
b3, starting the rotating device to make the back tube rotate at a constant speed, and controlling the autorotation speed of the back tube at 3-6 r/min.
b4, starting the ultrasonic coating device, adding molten binding metal solder into a liquid storage tank of the ultrasonic coating device, supplying the binding metal solder to the ultrasonic brush head by the liquid storage tank at a set liquid supply speed, moving the ultrasonic brush head at a constant speed on the binding surface of the back tube at a speed of 100 mm/min until the binding metal solder completely covers the binding surface of the back tube to form a back tube metallization layer with a thickness of 0.05-0.1mm, and removing the heating of the back tube to finish the back tube pretreatment; the supply speed of the binding metal solder, the moving speed of the ultrasonic brush head and the rotation speed of the back tube are matched with each other, so that the thickness of the formed back tube metallization layer is more uniform, the ultrasonic action time of the ultrasonic brush head in each unit area can be controlled to be consistent, the diffusion time of the binding metal solder to the back tube binding surface in each unit area is consistent, the binding metal solder is facilitated to form the back tube metallization layer with stronger adhesive force and cohesive force on the back tube binding surface, and the binding welding rate is improved. More specifically, in step b4, ultrasonic waves in the ultrasonic coating device are used for vibrating and rubbing the binding surface of the back tube, so that the contact area between the binding metal solder and the binding surface of the back tube is increased, and the molecular layer of the back tube and the binding metal solder which rub against each other is fused to form an adhesive layer. This adhesion layer is limited to the interpenetration and the diffusion between the molecular layer, does not have the intermetallic compound that produces, and the tensile strength on this adhesion layer is strong, and this adhesion layer is located back pipe metallization layer and back pipe and binds between the face, makes back pipe and the inseparable laminating of back pipe metallization layer, and back pipe metallization layer is the same with the metal material that binds the layer and use simultaneously, and back pipe metallization layer is equivalent to a transition layer, effectively improves the back pipe and binds the infiltration nature between the layer to further improve the seam rate. After the ultrasonic coating device completely coats the binding surface of the back tube by using the binding metal solder, the set distance between the scraper and the binding surface of the back tube is set, the set distance is the thickness of the back tube metallization layer, the scraper and the back tube are coaxially installed, the scraper scrapes off the redundant binding metal solder on the back tube metallization layer, and the consistency of the thickness of the back tube metallization layer is further ensured.
c. And a step of pretreating the metal target tube, namely performing brush plating on the cleaned and dried metal target tube by using brush plating solution on the binding surface of the metal target tube to form a reinforced metal layer, and using binding metal solder on the basis of the reinforced metal layer to form a target metallization layer.
The method comprises the steps of coating and binding indium solder on the outer wall of a back tube to form a back tube metallization layer, performing brush plating on the inner wall of a metal target tube to form an enhanced metal layer, coating and binding indium solder on the basis of the enhanced metal layer to form a target metallization layer, and binding the back tube and the metal target tube, wherein the binding method is set as method 1.
Two groups of comparison experiments are respectively adopted, and the scheme of the method 2 is set to coat and bind the solder indium on the outer wall of the back tube to form a back tube metallization layer, coat and bind the solder indium on the inner wall of the metal target tube to form a target material metallization layer, and then bind the back tube and the metal target tube. The scheme of the method 3 is that the outer wall of the back tube is coated and bound with solder indium to form a back tube metallization layer, a back tube reinforced metal layer is electrically brushed and plated on the outer wall of the back tube on the basis of the back tube metallization layer, the inner wall of the metal target tube is electrically brushed and plated to form a reinforced metal layer, the binding solder indium is coated and bound on the basis of the reinforced metal layer to form a target material metallization layer, the back tube and the metal target tube are bound, and the back tube and the metal target tube adopt the same brush plating process and brush plating solution. Each binding method is subjected to 3 groups of experiments respectively to obtain different binding welding rate data.
| Experimental group | Experimental group 1 | Experimental group 2 | Experimental group 3 |
| Method 1 | 98％ | 98％ | 98％ |
| Method 2 | 96％ | 96％ | 97％ |
| Method 3 | 98％ | 98％ | 98％ |
Table 1.1 binding weld ratio data obtained by 3 different pretreatment schemes for the backing tube and the metal target tube, respectively.
For the binding of the rotating target, the wettability between materials directly influences the bonding rate of the binding. The wettability is greatly related to the shape of the material and the surface of the material, the shape of the surface of the material is uneven, the air exhaust during binding is directly influenced, the air exhaust is not smooth, the binding quality is directly influenced, large-area bubbles are formed, the binding welding rate is low, and therefore the smoothness of the inner wall of the metal target tube needs to be ensured, and the welding rate of the binding of the rotary target can be ensured. The longer the length of the metal target pipe is, the longer the cutter bar for processing the boring hole on the inner wall of the metal target pipe is, the poorer the rigidity is, the roughness and the dimensional tolerance of the inner surface after processing are larger than the excircle processed by a lathe, and the detection means is limited and cannot be observed in detail due to the long and thin shape of the metal target pipe, so that the pre-treatment of the metal target pipe must be carried out by paving before binding, and the smoothness of the inner wall of the metal target pipe is improved. It can be seen from the comparison data between the method 1 and the method 2 in table 1.1 that the inner wall of the metal target tube is rough in surface, difficult to avoid boring and jumping, and difficult to control stably, and the coating of the conventional metallization layer on the concave position is limited to be far insufficient to achieve the high smoothness of the inner wall of the metal target tube, so that the inner wall of the metal target tube needs to be highly smooth by forming an enhanced metal layer by brush plating on the inner wall of the metal target tube, and then coating the target metallization layer on the basis of the enhanced metal layer to achieve the high smoothness of the inner wall of the metal target tube, and improve the bonding rate of the binding of the rotary target. As can be seen from the data in table 1.1, the weld ratio comparison between method 3 and method 1 shows that, since the precision and roughness of the surface is small enough after the back tube is machined by a lathe, the direct coating of the back tube outer wall to form the back tube metallization layer is sufficient to ensure the binding weld ratio, and the weld ratio obtained by method 3 is the same as that obtained by method 1, so that the outer wall of the back tube does not need to be subjected to brush plating.
The method specifically comprises the following substeps:
c1, mounting the metal target tube on a rotating device which can make the metal target tube rotate at a constant speed, and controlling the rotating speed of the metal target tube to be matched with the moving speed of a brush plating head of the electric brush plating device, thereby controlling and forming a reinforced metal layer with uniform thickness.
More specifically, the steps of mounting the metal target tube on the inner tube wall pretreatment processing equipment are as follows: mounting the metal target pipe subjected to sand blasting and cleaning on a rack of inner pipe wall pretreatment processing equipment, wherein an inclined platform with one end capable of lifting is hinged to the rack, a rotary fixing part used for enabling the metal target pipe to rotate is arranged on the inclined platform, and the metal target pipe is fixed in the rotary fixing part; because of the cross-sectional area of metal target pipe is circular, carrying out the brush plating at the face of binding to metal target pipe, being fixed in metal target pipe on one can make its rotatory equipment, the brush plating operation of being more convenient for need not be through artifical rotatory, convenient operation. Meanwhile, the inclined platform is convenient for recovering the brush plating solution after brush plating. When the metal target tube after brush plating is washed, the liquid after washing is convenient to recover. The automation degree is high, and the operation is simple and convenient.
c2, setting the voltage of the brush plating device at 10-15V and the current at 30-50A, electrically connecting the negative pole of the brush plating device to the metal target tube to form a cathode connecting part, wherein the cathode connecting part is arranged around the tube wall of the metal target tube, and setting fixed voltage and current so as to control the discharge crystallization speed of the metal ions in the brush plating solution on the binding surface of the metal target tube.
c3, starting the rotating device to make the metal target tube rotate at a constant speed, and controlling the autorotation speed of the metal target tube at 0.8-1.2 r/min.
c4, a liquid supply part is arranged in the electric brush plating device, electric brush plating liquid is stored in the liquid supply part, the liquid supply part is connected to the brush plating head, the liquid supply part supplies the electric brush plating liquid to the brush plating head according to a set liquid supply speed, the electric brush plating device is started, the metal target tube is a cathode, the brush plating head is an anode, the moving length of the brush plating head in the electric brush plating device is 1-1.5m per time and is a unit length, the metal target tube moves 3-6 times per minute and is a unit length, metal ions in the electric brush plating liquid are discharged and crystallized on the binding surface of the metal target tube, a reinforced metal layer with the thickness of 0.03-0.08mm is formed, and the electric brush plating of the reinforced metal layer is completed until the reinforced metal layer completely covers the binding surface of the metal target tube. Preferably, the thickness of the reinforcing metal layer is controlled to be 0.05-0.07 mm. The liquid supply speed of the electric brush plating solution is controlled and matched with the moving speed of the brush plating head, so that the electric brush plating solution is electroplated to form an enhanced metal layer with uniform ion concentration. Meanwhile, the uniformity of the thickness of the metal layer is controlled and enhanced by controlling and matching the liquid supply speed of the brush plating solution, the rotating speed of the metal target tube and the moving speed of the brush plating head. Meanwhile, the bonding force between the reinforced metal layer formed in the brush plating mode and the metal target material is strong.
Before the step a, before the pretreatment, when the boring or the drilling is carried out on the metal target tube, the conditions of rough inner wall of the metal target tube, boring jump cutter and the like are difficult to avoid and difficult to control, and under the condition, the brush plating is convenient to operate, so that the effective filling or coating of the rough or sunken position surface of the inner wall of the metal target tube caused by machining is easier to ensure, and the reinforced metal layer forms a uniform and smooth plane. The inner wall of the metal target tube forms a smooth and flat surface, so that a bubble area can be effectively prevented from being formed in the subsequent binding process, and the binding rate is effectively improved. In the step c4, a reinforcing metal layer with a thickness of 0.05-0.08mm is formed on the depressed position of the metal target tube, and a reinforcing metal layer with a thickness of 0.03-0.05mm is formed on the portion except the depressed position, so that the difference in uniformity between the surface of the reinforcing metal layer and the outer wall of the metal target tube is controlled within the range of 0.005 mm. During the machining process, the height of the concave position formed by the formed boring hole or the formed cutting mark is generally 0.03-0.08mm, so that the reinforcing metal layer with the thickness of 0.05-0.08mm formed at the concave position can be enough to completely fill the concave position. Preferably, a reinforcing metal layer of 0.08mm thickness is formed at the recessed location. More specifically, in step c4, as shown in fig. 1 and 2, the left side of the interface between fig. 1 and 2 is a reinforced metal layer formed by brush plating, the right side of the interface between fig. 1 and 2 is a metal target tube, the recessed position is filled by crystallization on the inner wall surface of the metal target tube by brush plating solution, the interface between the metal target tube and the reinforced metal layer is formed to be undulated and uneven, and the other side surface of the reinforced metal layer opposite to the interface is a smooth surface. The reinforced metal layer fills the rough or concave position of the metal target tube, so that the interface of the reinforced metal layer and the inner wall of the metal target tube is a coplanar surface, and after the reinforced metal layer forms a certain thickness, the rough or concave position of the inner wall of the metal target tube is completely filled, so that the surface opposite to the interface of the reinforced metal layer and the inner wall of the target tube is a smooth surface. So that the surface uniformity difference from the surface of the reinforcing metal layer to the outer wall of the metal target tube is controlled within the range of 0.005 mm. Preferably, the difference of uniformity between the surface of the reinforcing metal layer and the outer wall of the metal target tube is controlled to be in the range of 0.002 mm.
More specifically, the length of the metal target tube exceeds 1.5m, and the cathode connecting parts are arranged at intervals of 0.8-1.1 m on the metal target tube. The cathode connecting part is preferably made of metal copper material. If the length of the metal target tube is too long, the distance between the brush plating head and the cathode connecting part is too large, so that the current in the metal target tube is dispersed, the conductive effect is poor, the deposition of metal ions during brush plating is influenced, and the effect of the formed reinforced metal layer is poor. The cathode connecting parts are arranged at intervals of 0.8-1.1 m on the metal target tube, so that the current density and the conductive effect of each point in the metal target tube are close, the metal ions in the brush plating solution are kept at a uniform deposition rate, the operation difficulty is reduced, the integral surface of the metal layer is enhanced to be flat, and the brush plating effect of the metal layer of the metal target tube with a longer length can be effectively ensured.
In the treatment method of the cathode connecting part of the metal target tube with the length exceeding 1.5m, the reinforced metal layer is formed by performing brush plating on the binding surface of the metal target tube. Because the metal target tube is slender, bulky and heavy, and need bind the face at the metal target tube and increase the reinforcing metal level, adopt brush plating mode preparation reinforcing metal level, equipment is simple, and the flexible operation, consequently only need the positive pole brush head to metal target tube bind the face carry out brush plating can, the metal target tube outer wall need not do extra processing, if need not do extra cladding protection to metal target tube outer wall etc. or do too much removal to metal target tube. The surface uniformity of the enhanced metal layer can be effectively controlled through brush plating, and the enhanced surface uniformity of the metal layer refers to the uniformity of the distance from the surface of the enhanced metal layer to the outer wall of the metal target tube. Due to accidental surface defects and size deviation caused by vibration of a cutter during machining of the inner wall of the target tube, the binding quality is affected by the problems of wetting, air exhaust and the like of the concave position during binding. The filling of relatively serious positions of deep recesses such as tool marks and the like cannot be ensured only by traditional metallization treatment, the recess positions are obvious, the surface is uneven, unsmooth air exhaust is caused during binding, and the binding and welding rate is low. The reinforcing metal layer is coated between the target material metallization layer and the metal target tube, so that the technical defect that the uniformity of the target material metallization layer on the binding surface of the metal target tube cannot be detected and checked due to the fact that the metal target tube is too long can be effectively overcome, the wettability between the binding metal solder and the metal target tube is directly influenced due to the coating nonuniformity of the target material metallization layer, the uniformity of the target material metallization layer cannot be guaranteed, and the binding quality of the rotary target is unstable. And adding a reinforced metal layer on the binding surface of the metal target tube so as to increase the wettability between the binding metal solder and the metal target tube by using the reinforced metal layer, wherein the wettability between the binding metal solder and the metal target tube is effectively controlled and guaranteed due to the effective control of the uniformity of the reinforced metal layer.
More specifically, the outer wall of the metal target tube is provided with at least two cathode connecting parts, the cathode of the power supply is electrically connected with the cathode connecting parts, and the anode of the power supply is connected with the anode brush head with the brush plating solution.
During electric brush plating, the metal target tube is connected with the negative pole of a power supply, the anode brush head is connected with the positive pole of the power supply, the anode brush head with electric brush plating solution is wiped on the binding surface of the metal target tube, metal ions in the electric brush plating solution generate point-placing crystallization on each point of the surface of the metal target tube, which is contacted with the anode brush head, and the reinforced metal layer formed by the metal ions in the electric brush plating solution is gradually thickened along with the time increase. The brush plating solution contains a tin compound, a nickel compound or a copper compound.
Cathode connecting parts made of metal conductive materials are arranged on the outer wall of the metal target tube in a surrounding mode, and the adjacent cathode connecting parts are arranged at intervals of 80-110cm, so that a uniform conductive area is formed at the electric brush plating position of an anode brush head of the binding surface of the metal target tube;
table 1.2 is the experimental comparison data of setting up 1 cathode connection at the metal target pipe and setting up the cathode connection at the metal target pipe every set distance.
Table 1.2 shows experimental comparison data of the metal target tube with 1 cathode connection part at a length of 2.7 m and 1 cathode connection part at intervals of 80-110 cm. When 1 cathode connection part was provided to the metal target tube, the time taken for brush plating to form the reinforcing metal layer was 4 hours. And when 1 cathode connecting part is respectively arranged at intervals of 80-110cm on the metal target tube, the time for forming the reinforced metal layer by brush plating is 1.5 hours. Because the length of the metal target tube is as long as 1.5m or more, the closer the negative pole of the power supply is to the anode brush head at the connecting position of the metal target tube, the moderate current density, the uniform current density and the good conductive effect are formed, the shorter the time for forming the reinforced metal layer is, and the high efficiency for forming the reinforced metal layer is. In contrast, the farther the negative electrode of the power supply is from the anode brush head at the connection position of the metal target tube, the lower the current density, the dispersed current and the poor conductive effect, the longer the time taken to form the enhanced metal layer, and the longer the brush plating time is required to achieve the required thickness of the enhanced metal layer.
From table 1.3, the cathode connection part is arranged at the position 100cm away from the end head at one side of the rotating target material and is surrounded with a cathode connection part, from table 1.2, the current gathers at the left and right sides of the cathode connection part, the current distribution is uneven, which causes the difference of the reinforced metal layer formed at each point to be larger, the thickness of the reinforced metal layer formed at the position close to the two sides of the cathode connection part is thicker, the thickness of the reinforced metal layer formed at the position far away from the cathode connection part is thinner, 1 annular cathode connection part is arranged on the metal target tube, because the current intensity at the position close to the cathode connection part is strong, the current density is uniform, the conductive effect is good, the time for forming the reinforced metal layer is short, the current intensity at the position far away from the cathode connection part is weak, the current density is dispersed, the conductive effect is poor, the time for, the time for forming the thickness of the reinforced metal layer is difficult to control during operation, so that the uniformity of the formed reinforced metal layer is poor.
Table 1.3 the metal target tube is provided with 1 annular cathode connection part, and the thickness data of the reinforced metal layer detected at different angles at different distances from the same section every 40cm in the length direction of the rotating target.
Table 1.4 the metal target tube is provided with an annular cathode connection part at intervals of 80cm, and the thickness data of the reinforced metal layer detected at different angles at different distances from the same section at intervals of 20cm along the length direction of the rotating target material.
Table 1.3 and Table 1.4 each use a metal target tube having a thickness of 16 mm.
The invention is characterized in that a cathode connecting part made of metal conductive material is arranged on the metal target tube in a surrounding mode, and preferably, the cathode connecting part is made of metal copper material. The conductive performance of the copper metal is better. Therefore, the cathode connecting part plays a role in electric conduction, and the material with good electric conduction performance is selected to play a role in better electric conduction. The cathode connecting part surrounds the metal target pipe, so that a ring contact ring of a layer between the cathode connecting part and the metal target pipe conducts current on the negative electrode of the power supply along the ring contact ring, and the current is diffused to the metal target pipe along the ring contact ring, so that a cylindrical electric brush plating field with uniform current density is formed. As seen from the data in Table 1.4, since the annular cathode connecting parts are respectively arranged on the metal target tube at intervals of 80cm, the current distribution at each point of the section is uniform, the conductivity is good, the thickness of the reinforced metal layer formed at different points on the same section is basically uniform, and the thickness difference of the reinforced metal layer in the same section is kept in a small range. Therefore, the plurality of cathode connecting parts are arranged on the metal target tube at intervals in a surrounding mode, so that the current distribution is more uniform, the conductivity is better, the forming thickness rate of the reinforced metal layer is more easily controlled, and the surface uniformity of the reinforced metal layer is better. The reinforcing metal layer formed by the brush plating is influenced by the distance between the anode brush head and the cathode connecting part, so that the cathode connecting part is arranged at intervals of 80-110cm to keep the distance between the anode brush head and the cathode connecting part in a proper range, the current density in the range is moderate, the current density is uniform, the conductive effect is good, a conductive uniform area is formed, the rate of forming the reinforcing metal layer is more uniform, and the surface uniformity of the reinforcing metal layer is more easily controlled.
It can be seen from tables 1.2, 1.3 and 1.4 that the farther the anode brush head is from the cathode connecting portion, the thinner the thickness of the formed reinforced metal layer is, and the lower the electroplating efficiency, therefore, when the metal target tube with the length of more than 2 meters is subjected to brush electroplating, the distance between the anode brush head and the cathode connecting portion will affect the forming rate of the reinforced metal layer, and because the forming rate of the reinforced metal layer will change with the distance between the anode brush head and the cathode connecting portion, when the metal target tube with the longer length and only provided with 1 cathode connecting portion is subjected to brush electroplating, the difficulty of brush electroplating operation is increased, and the surface uniformity of the reinforced metal layer cannot be guaranteed.
As can be seen from the data in Table 1.4, the thickness difference of the reinforced metal layer detected every 20cm distance of the same straight line and every 20cm point is kept within the range of 0.002mm, the thickness difference of the reinforced metal layer detected every different angle of the same section rotation is kept within the range of 0.002mm, which indicates that an annular cathode connecting part is arranged every 80cm apart, so that the current distribution of the metal target tube is uniform, when the anode brush head is used for brush plating, a conductive uniform area can be formed, and the anode brush head forms the reinforced metal layer with uniform thickness from the surface to the outer wall of the metal target tube in the conductive uniform area.
Because the metal target tube is longer and the moving distance of the anode brush head is 1-1.5 meters in each time, the complete reinforced metal layer can be formed only by completing the brush plating of the metal target tube by sections of the anode brush head.
The existing binding of the rotary target is segmented binding, the length of each segment of metal target tube during segmented binding is short, the formation condition of a metal target tube binding surface metallization layer can be conveniently observed, so that sufficient wettability between a metal solder and the metal target tube during subsequent binding is ensured, and the binding quality of the rotary target can be effectively ensured. As shown in table 1.4, based on the particularity that the metal target tube is too long and too thin, the formation condition of the metallization layer cannot be checked and confirmed, so that the binding quality of the rotary target cannot be guaranteed, and the binding quality of the metal target tube is unstable, therefore, a layer of reinforced metal layer is added between the metallization layer and the binding surface of the metal target tube by means of brush plating to serve as a transition, so that the more obvious position of the concave part is well filled, and the inner wall of the metal target tube forms a good smooth appearance. Meanwhile, cathode connecting parts are arranged at intervals of 80-110cm on the metal target tube, so that a reinforced metal layer with good uniformity is formed, a metallization layer is further coated on the basis of the reinforced metal layer with good uniformity in an ultrasonic mode, a diffusion bonding layer is formed between the metallization layer and the reinforced metal layer, the diffusion bonding layer is formed on the reinforced metal layer with good uniformity, and the bonding property between the target metallization layer and the reinforced metal layer is guaranteed, so that enough wettability between a binding metal solder and the metal target tube is guaranteed when the slender metal target tube is bound, and the binding quality of the rotary target can be effectively guaranteed. Meanwhile, ultrasonic waves generated by the ultrasonic coating device are used for coating the binding metal solder, and under the ultrasonic action, the reinforcing metal layer is in wetting contact with the target material metallization layer, so that a diffusion bonding layer is formed between the target material metallization layer and the reinforcing metal layer, and the bonding force between the target material metallization layer and the reinforcing metal layer is further enhanced. The binding effect of the rotary target material is better. The scheme of the invention is also suitable for the binding scheme of the rotating target with weak metal binding force of binding the metal solder and the metal target tube.
c5, recovering the brush plating solution in the metal target tube, and cleaning the reinforced metal layer of the metal target tube by using clear water. The brush plating solution is recycled, so that the pollution to the environment is prevented. The metal target tube is cleaned by clear water, so that the phenomenon that cross contamination is caused to subsequent steps by the brush plating solution and the effect of a subsequently formed film layer is influenced is prevented.
More specifically, starting an inclined platform of the inner pipe wall pretreatment processing equipment, collecting residual brush plating solution on the binding surface of the metal target pipe, raising one end of the inclined platform to enable the whole metal target pipe to be in an inclined state, arranging a liquid collecting box on one side with a lower position, enabling the residual brush plating solution to flow into the liquid collecting box, washing the metal target pipe by using clean water, heating and drying the metal target pipe, and completing electric brush plating of the reinforced metal layer of the metal target pipe;
after the metal target tube binding surface is subjected to brush plating to form a complete reinforced metal layer, the residual brush plating solution on the metal target tube binding surface needs to be recovered. In the inner pipe wall pretreatment processing equipment, the metal target pipe is fixed on an inclined platform, one end of the inclined platform can be lifted, so that the metal target pipe is in an inclined state, one end of the metal target pipe is aligned to the liquid collecting box, so that residual brush plating solution in the metal target pipe flows into the liquid collecting box along with the metal target pipe, after the liquid collecting box is collected, the liquid collecting box is removed, another liquid collecting box is placed at the original placement position, then the metal target pipe is washed, and the washed liquid directly flows into the changed liquid collecting box for collection because the metal target pipe is still in an inclined state. Increase the reuse to liquid, prevent that harmful liquid from flowing into the environment, green. And then heating and drying the metal target tube to prepare for coating the metallization layer on the binding surface of the metal target tube in the next step.
c6, heating the metal target tube to a second temperature and keeping the temperature, wherein the second temperature is higher than the melting point temperature of the binding metal solder and lower than the melting point temperature of the metal target tube and the back tube, and the action and the effect of the second temperature of the step are respectively the same as those of the second temperature of the step b 2.
The metal target tube is a molybdenum target material, the back tube is a titanium back tube, the binding metal solder is indium, and in the steps b2 and c6, the first temperature and the second temperature are respectively controlled at 170-300 ℃.
c7, starting a rotating device to enable the metal target tube to rotate at a constant speed, and controlling the autorotation speed of the metal target tube to be 3-6 r/min.
c8, moving the ultrasonic brush head at a constant speed on the binding surface of the metal target tube at a speed of 10-20 mm/min on the basis of strengthening the metal layer by an ultrasonic coating device until the binding surface of the metal target tube is completely covered by the binding metal solder to form a target metallization layer with a thickness of 0.08-0.1mm, removing the heating of the metal target tube and finishing the pretreatment of the metal target tube; after the binding surface of the metal target tube is completely coated with the binding metal solder by the ultrasonic coating device, the set distance between the scraper and the binding surface of the metal target tube is set, the set distance is the thickness of the target metalized layer, the scraper and the metal target tube are coaxially installed, the scraper scrapes off the redundant binding metal solder on the target metalized layer, and the consistency of the thickness of the target metalized layer is further ensured. On the basis of the reinforced metal layer with strong binding force and good mechanical property, the ultrasonic coating device generates ultrasonic waves, the ultrasonic waves act on the molten binding metal solder to accelerate the atom moving rate in the liquid binding metal solder and accelerate the flow of the liquid binding metal solder, and the ultrasonic waves rub on the surface of the reinforced metal layer to destroy an oxide film on the surface of the reinforced metal layer, so that the reinforced metal layer is in wetting contact with the target metalized layer, the molten binding metal solder is promoted to further diffuse and combine with the reinforced metal layer, and a diffusion bonding layer is formed between the metalized layer and the reinforced metal layer. The diffusion bonding layer enables the reinforced metal layer to be firmly combined with the target metalized layer, and the mechanical property between the reinforced metal layer and the target metalized layer is improved. The target metallization layer and the binding layer are both made of binding metal solders, binding of the same metal materials is good in wettability, identical in thermal expansion coefficient, identical in heat conduction performance and specific heat capacity, stress aggregation during binding can be effectively avoided, and the target binding welding rate is high.
d. And a binding gap with a set distance is arranged between the binding surface of the metal target tube and the binding surface of the back tube, binding metal solder is poured into the binding gap, and the binding metal solder is solidified to form a binding layer. The binding surfaces of the back tube and the metal target tube are respectively pretreated, so that the side, facing the binding layer, of the back tube and the metal target tube is a film layer made of binding metal solder, when the binding solder is poured into the binding gap and fills the binding gap, the binding metal solder in the binding layer is respectively in full wetting contact with the back tube metallization layer and the target metallization layer, the thicknesses of the coating film layers of the target metallization layer and the back tube metallization layer are uniform, the surfaces of the coating film layers are smooth, the binding metal solder is respectively in full contact fit with the target metallization layer and the back tube metallization layer, bubbles are not generated, and the binding welding rate is high.
The brush plating mode is adopted to brush plate the reinforced metal layer, so that the uniformity of the coating effect of the inner wall of the target tube can be effectively ensured, the sufficient wettability between the binding metal solder and the metal target tube is ensured, and the binding effect of the rotary target is ensured and enhanced. The invention uses the binding metal solder to carry out coating through the ultrasonic wave emitted by the ultrasonic coating device, thereby forming the target metallization layer and the back tube metallization layer with stronger bonding force and being beneficial to improving the welding rate. The invention adopts the arrangement of the plurality of cathode connecting parts which are arranged at intervals and set distances respectively, and the whole conductive effect of the long rotary target is uniform in the process of brush plating, so that the deposition rates of metal ions in the brush plating solution are close, the operation difficulty is reduced, and the surface smoothness of the formed enhanced metal layer is high.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.
Claims (10)
1. A target binding method for improving pretreatment is characterized in that: the method comprises the following steps:
a. the method comprises the steps of preprocessing, wherein sand blasting, cleaning and drying are respectively carried out on a binding surface of a metal target tube and a binding surface of a back tube;
b. a back tube pretreatment step of performing ultrasonic coating on the binding surface of the back tube after cleaning and drying to bind metal solder so as to form a back tube metallization layer, comprising the following substeps,
b1, mounting the back tube on a rotating device which can make the back tube rotate at a constant speed,
b2, heating the back tube to a first temperature and keeping the temperature, wherein the first temperature is higher than the melting point temperature of the binding metal solder and lower than the melting point temperature of the metal target tube and the back tube,
b3, starting a rotating device to enable the back tube to rotate at a constant speed, controlling the autorotation speed of the back tube at 3-6 r/min,
b4, starting the ultrasonic coating device, adding molten binding metal solder into a liquid storage tank of the ultrasonic coating device, supplying the binding metal solder to the ultrasonic brush head by the liquid storage tank at a set liquid supply speed, moving the ultrasonic brush head at a constant speed on the binding surface of the back tube at a speed of 100 mm/min until the binding metal solder completely covers the binding surface of the back tube to form a back tube metallization layer with a thickness of 0.05-0.1mm, and removing the heating of the back tube to finish the back tube pretreatment;
c. a metal target tube pretreatment step, in which the cleaned and dried metal target tube is subjected to brush plating by using brush plating solution on the binding surface of the metal target tube to form a reinforced metal layer, and a binding metal solder is used on the basis of the reinforced metal layer to form a target metallization layer, comprising the following substeps,
c1, mounting the metal target tube on a rotating device which can make the metal target tube rotate at a constant speed,
c2, setting the voltage of the brush plating device at 10-15V and the current at 30-50A, electrically connecting the negative pole of the brush plating device to the metal target tube to form a cathode connecting part which is arranged around the tube wall of the metal target tube,
c3, starting the rotating device to make the metal target tube rotate at a constant speed, controlling the autorotation speed of the metal target tube at 0.8-1.2 r/min,
c4, a liquid supply part is arranged in the electric brush plating device, brush plating liquid is stored in the liquid supply part, the liquid supply part is connected with the brush plating head, the liquid supply part supplies the brush plating liquid to the brush plating head according to a set liquid supply speed, the electric brush plating device is started, the metal target tube is a cathode, the brush plating head is an anode, the moving length of the brush plating head in the electric brush plating device is 1-1.5m per time and is a unit length, the metal target tube moves 3-6 times per minute and the unit length, metal ions in the brush plating liquid are discharged and crystallized on the binding surface of the metal target tube to form a reinforced metal layer with the thickness of 0.03-0.08mm until the reinforced metal layer completely covers the binding surface of the metal target tube, and the electric brush plating of the reinforced metal layer is completed,
c5, recycling the brush plating solution in the metal target tube, cleaning the reinforced metal layer of the metal target tube with clean water,
c6, heating the metal target tube to a second temperature and keeping the temperature, wherein the second temperature is higher than the melting point temperature of the binding metal solder and lower than the melting point temperature of the metal target tube and the back tube,
c7, starting a rotating device to enable the metal target tube to rotate at a constant speed, controlling the autorotation speed of the metal target tube at 3-6 r/min,
c8, moving the ultrasonic brush head at a constant speed on the binding surface of the metal target tube at a speed of 10-20 mm/min on the basis of strengthening the metal layer by an ultrasonic coating device until the binding surface of the metal target tube is completely covered by the binding metal solder to form a target metallization layer with a thickness of 0.08-0.1mm, removing the heating of the metal target tube and finishing the pretreatment of the metal target tube;
d. and a binding step, namely, a binding gap with a set distance is arranged between the binding surface of the metal target tube and the binding surface of the back tube, binding metal solder is poured into the binding gap, and the binding metal solder is solidified to form a binding layer.
2. The method of claim 1, wherein the step of pre-conditioning comprises: the electric brush plating solution comprises a tin compound, a nickel compound or a copper compound, and the cathode connecting part is made of a metal copper material.
3. The method of claim 2, wherein the step of pre-conditioning comprises: drilling or boring the inner wall of the metal target tube to form a concave position before the step a and the step c4, and forming the reinforced metal layer with the thickness of 0.05-0.08 at the concave position of the metal target tube.
4. The method of claim 3, wherein the step of pre-conditioning comprises: in the step c4, the recessed position is filled by crystallizing the inner wall surface of the metal target tube by brush plating solution, an undulating interface is formed between the metal target tube and the reinforcing metal layer, and the other side surface of the reinforcing metal layer opposite to the interface is a smooth surface.
5. The method of claim 1, wherein the step of pre-conditioning comprises: the metal target tube is a molybdenum target material, the back tube is a titanium back tube, the binding metal solder is indium, and in the steps b2 and c6, the first temperature and the second temperature are respectively controlled at 300 ℃.
6. The method of claim 1, wherein the step of pre-conditioning comprises: the step a, the step before pretreatment, also comprises the following substeps,
a1) respectively carrying out sand blasting treatment on the binding surfaces of the metal target tube and the back tube to enable the roughness of the binding surfaces of the metal target tube and the back tube to reach Ra0.8-1.6 respectively;
a2) placing the metal target tube and the back tube in an ultrasonic cleaning pool, and sequentially heating water and alcohol in the ultrasonic cleaning pool to clean the binding surfaces of the metal target tube and the back tube;
a3) and placing the metal target tube and the back tube into a heating device for drying, wherein the temperature of the heating device is set at 160-300 ℃, and drying the binding surface liquid of the metal target tube and the back tube.
7. The method of claim 6, wherein the step of pre-conditioning comprises: in the step a2, the metal target tube and the back tube are cleaned in hot water at 50-100 ℃ for 1-2 hours, and after the metal target tube and the back tube are cleaned in the hot water, the ultrasonic cleaning pool is cleaned by adding alcohol for 5-15 minutes.
8. The method of claim 7, wherein the step of pre-conditioning comprises: in the step c8, the ultrasonic coating device generates ultrasonic waves, and the ultrasonic waves act on the molten bonding metal solder to accelerate the atom moving rate in the liquid bonding metal solder and accelerate the flow of the liquid bonding metal solder, and simultaneously further diffuse the molten bonding metal solder towards the reinforcing metal layer, so that the reinforcing metal layer is in wetting contact with the target metallization layer, and a diffusion bonding layer is formed between the metallization layer and the reinforcing metal layer.
9. A method for improved pre-processing target binding according to any of claims 1 to 8, wherein: and if the length of the metal target tube exceeds 1.5m, the metal target tubes are respectively provided with a cathode connecting part at an interval of 0.8-1.1 m, so that the current in the metal target tubes is uniformly distributed, and the deposition rate of metal ions forming the reinforced metal layer is kept uniform.
10. The method of claim 9, wherein the step of pre-conditioning comprises: in the step b4, the binding surface of the back tube is subjected to vibration friction by ultrasonic waves in an ultrasonic coating device, so that the contact area between the binding metal solder and the binding surface of the back tube is increased, and an adhesive layer is formed between molecular layers of the back tube and the binding metal solder which are rubbed with each other.
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