CN110358457A - The manufacturing method of splicing tape, article, motor and article - Google Patents
The manufacturing method of splicing tape, article, motor and article Download PDFInfo
- Publication number
- CN110358457A CN110358457A CN201910264095.0A CN201910264095A CN110358457A CN 110358457 A CN110358457 A CN 110358457A CN 201910264095 A CN201910264095 A CN 201910264095A CN 110358457 A CN110358457 A CN 110358457A
- Authority
- CN
- China
- Prior art keywords
- adhesive layer
- mentioned
- splicing tape
- adherend
- dilatancy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to the manufacturing methods of splicing tape, article, motor and article.The subject to be solved by the invention is to provide a kind of splicing tape that can be expanded by the stimulation such as heating, which also has excellent initial cementability under room temperature (23 DEG C), excellent adhesive strength is able to maintain upon inflation.The present invention relates to a kind of splicing tapes, wherein, directly have in the single side of the dilatancy adhesive layer (A) containing heat-curing resin or there is pressure-sensitive adhesive layer (B) across other layers, the pressure-sensitive adhesive layer (B) with a thickness of 1 μm or more and 100 μm hereinafter, 180 degree peeling adhesion force under room temperature (23 DEG C) is 1N/20mm or more.
Description
Technical field
The present invention relates to have to make the splicing tape of this composition of volume expansion by applying the stimulation such as heating.
Background technique
Above-mentioned splicing tape can compatibly be used when being fixed more than two adherends, therefore, such as automobile,
The manufacturing site location of the various products such as power equipment is widely used.
Splicing tape is usually suitble to when an adherend is fixed on the planar section of another adherend, curvature portion etc.
Ground uses, and is widely used in the manufacturing site location of the various products headed by automotive part, power equipment etc..On the other hand, exist
In the case that the use scope of splicing tape is gradually expanded in expectation, it is desirable that an adherend can be for example fixed to by above-mentioned splicing tape
It is compatibly used under this case in gap possessed by another adherend.Specifically, as hybrid power vapour is equipped on
The motor of vehicle etc. is embedded with magnet this composition in the specified position (gap) of core (rotor core) it is commonly known that having
Motor has studied when above-mentioned magnet to be fixed in gap possessed by above-mentioned core and uses above-mentioned splicing tape.As
Workable splicing tape in such use, it is known that the Thermocurable thermal expansivity splicing tape for being expanded and being bonded by heating
(patent document 1).But the splicing tape needs between by being inserted into component before heating expansion to make being fixed to one another of component
Gap in, therefore, the initial cementability of the bonding belt surface under room temperature is low or without initial cementability.Therefore, even if making it
It is inserted into the gap between component, can not also be adhered to component immediately thereafter, therefore, so that splicing tape is expanded and is carried out in early period
Before bonding/fixation, there are above-mentioned splicing tapes to shift from specified position, it is bonding with above-mentioned component to generate above-mentioned splicing tape
The risk of positional shift.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2013-023559 bulletin
Summary of the invention
Subject to be solved by the invention
The problem to be solved by the present invention is to provide the splicing tapes that can be expanded by the stimulation such as heating, this is viscous
Tape splicing also has excellent initial cementability under room temperature (23 DEG C), and it is strong that excellent bonding is able to maintain upon inflation
Degree.
Means for solving the problems
The inventors of the present invention's discovery is able to solve the above subject by following splicing tape: it is in dilatancy adhesive layer
(A) single side directly has or has across other layers the splicing tape of pressure-sensitive adhesive layer (B), above-mentioned pressure-sensitive adhesive layer (B)
With a thickness of 1 μm or more and 100 μm hereinafter, 180 degree peeling adhesion force under room temperature (23 DEG C) is 1N/20mm or more.
The effect of invention
Even if splicing tape of the invention also shows that the initial bonding force to component under room temperature (23 DEG C) before inflation
(pre-fixing property), therefore after being inserted into gap, splicing tape can be attached at component immediately, therefore, it is difficult to bonding location occurs
Offset.In addition, being able to maintain that excellent adhesive strength after inflation, therefore, it can be used in two needless to say
The fixation of the above adherend, apply also for the purposes being fixed to an adherend in gap possessed by another adherend,
The purposes etc. that will be filled in gap possessed by adherend with above-mentioned splicing tape.
Detailed description of the invention
Fig. 1 is the concept map for indicating the measuring method of shear bond power of splicing tape.
Specific embodiment
Splicing tape of the invention is characterized in that, in the list of the dilatancy adhesive layer (A) containing heat-curing resin
Face directly have or across other layers have pressure-sensitive adhesive layer (B), above-mentioned pressure-sensitive adhesive layer (B) with a thickness of 1~100 μ
M, the 180 degree peeling adhesion force under room temperature (23 DEG C) are 1N/20mm or more.
Above-mentioned dilatancy adhesive layer (A) expands because from external stimulation.It, can as the stimulation from outside
Heat, light etc. are enumerated, wherein preferably heat.
As above-mentioned dilatancy adhesive layer (A), the expansion rate of the thickness direction of above-mentioned dilatancy adhesive layer (A) is used
(thickness of the above-mentioned dilatancy adhesive layer (A) before thickness/heating of the dilatancy adhesive layer (A ') after heating) × 100 reach
To 150% or more dilatancy adhesive layer.Above-mentioned expansion rate is preferably 175% or more, more preferably 200%~1000%.
If it is the splicing tape, though then the gap possessed by adherend (C1) or adherend (C1) and adherend (C2) it
Between gap height (thickness) it is big in the case where, another adherend can also be fitted and expanding above-mentioned splicing tape
It is fixed in above-mentioned gap with closing, or will be filled in above-mentioned gap with above-mentioned splicing tape.In addition, if it is above-mentioned bonding
Band, even if then also can be compatibly fixed to another adherend above-mentioned in the case where the surface of adherend is rough surface
Rough surface.
It should be noted that above-mentioned expansion rate refers to: at a temperature of 30 points of the placement by above-mentioned splicing tape at 50 DEG C~250 DEG C
Zhong Shi, the thickness for the dilatancy adhesive layer (A1) that dilatancy adhesive layer (A) is expanded and formed by above-mentioned placement
The ratio of thickness relative to the dilatancy adhesive layer (A) before above-mentioned placement (before expansion), preferably in 60 DEG C~230 DEG C of temperature
Under degree, at a temperature of more preferably 70 DEG C~200 DEG C.
From obtaining superior adhesive strength aspect, the dilatancy adhesive layer (A) of above-mentioned splicing tape is constituted
Thickness is preferably 1 μm or more, more preferably 10 μm~250 μm of range, further preferably 15 μm~150 μm of range, spy
Range that You Xuanwei be 20 μm~100 μm.
On the other hand, it from obtaining superior adhesive strength aspect, is sent out by above-mentioned dilatancy adhesive layer (A)
Life expands and the thickness of the adhesive layer (A ') of formation is preferably 20 μm~2500 μm of range, is more preferably 40 μm~1500 μm
Range.In addition, above-mentioned dilatancy adhesive layer (A ') preferably has porous structure.
In addition, as above-mentioned splicing tape, it is preferable to use the thickness of above-mentioned dilatancy adhesive layer (A) is relative to above-mentioned bonding
The splicing tape that the overall thickness of band is 10% or more, more preferably using the thickness of above-mentioned dilatancy adhesive layer (A) relative to above-mentioned
The splicing tape that the overall thickness of splicing tape is 30% or more.By being set as above range, for example, being easy for an adherend to be fixed to
In gap possessed by another adherend, or it will be filled in above-mentioned gap with above-mentioned splicing tape.
As above-mentioned dilatancy adhesive layer (A), can be used can be sent out by applying the stimulation such as heat, light as described above
The dilatancy adhesive layer of raw expansion, specifically, the layer containing various resins and swelling agent can be used.
It, can be for example, by the bonding agent of above-mentioned resin and swelling agent etc. will be contained as above-mentioned dilatancy adhesive layer (A)
Composition (a) is coated on release liner etc. and makes it dry to be formed.
As the adhesive composite (a) that can be used in being formed above-mentioned dilatancy adhesive layer (A), as set forth above, it is possible to
Use the composition containing resin, swelling agent, solvent as needed etc..
As above-mentioned dilatancy adhesive layer (A), the adhesive composite containing aftermentioned heat-curing resin etc. is used
(a)。
As above-mentioned heat-curing resin, can be used for example poly- selected from carbamate resins, phenolic resin, unsaturation
One kind or two or more heat-curing resin in ester resin, epoxy resin and acrylic resin etc..Wherein, as above-mentioned heat
Curable resin, from assign be heating and curing when to the good adaptation of adherend in terms of, it is preferable to use epoxy resin and/
Or acrylic resin, in addition, more preferably using epoxy resin in terms of ensuring good being heating and curing property.
As above-mentioned epoxy resin, specifically, it is double that bisphenol A type epoxy resin, bisphenol f type epoxy resin etc. can be used
The dicyclopentadiene-type epoxy resins, biphenyl type such as phenol-type epoxy resin, Dicycldpentadiene-phenol addition reaction-type epoxy resin
Epoxy resin, tetramethyl biphenyl type epoxy resin, poly- hydroxyl naphthalene type epoxy resin, isocyanate modified epoxy resin, 10- (2,
5- dihydroxy phenyl) -9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide modified epoxy, phenol novolak type
Epoxy resin, cresol novolac type epoxy resin, triphenylmethane type epoxy resin, tetraphenyl ethane type epoxy resin, benzene
Phenol aralkyl-type epoxy resin, naphthols novolac type epoxy resin, naphthols aralkyl-type epoxy resin, naphthols-phenol cocondensation
Novolac type epoxy resin, naphthols-cresols cocondensation novolac type epoxy resin, aromatic hydrocarbon formaldehyde resin modified phenolic resin
Epoxy-type epoxy resin, biphenyl modified phenolic novolak type epoxy resin etc..
It is whole relative to above-mentioned adhesive layer (A), preferably comprise the above-mentioned epoxy resin etc. of 10 mass of mass %~99 %
Heat-curing resin.
In addition, as above-mentioned dilatancy adhesive layer (A), it is preferable to use containing that can occur with above-mentioned heat-curing resin
The dilatancy adhesive layer of the curing agent of reaction.
It is if it is for example using the case where epoxy resin is as above-mentioned heat-curing resin, then excellent as above-mentioned curing agent
Choosing uses the curing agent with the functional group that can be reacted with its epoxy group.
The solidification temperature of above-mentioned thermoset materials is preferably the expansion temperature of aftermentioned swelling agent or more, in addition, when solidification
Between preferably more than Bulking Time.As a result, by heating among the thermoset materials softened, can make to expand
Agent sufficiently expands, and the piece thickness after capable of making expansion becomes uniform.
As above-mentioned curing agent, amine compound, amide based compound, acid anhydrides based compound, phenol system chemical combination can be enumerated
Object etc..For example, as amine compound, can be used diaminodiphenyl-methane, diethylenetriamines, trien,
Diamino diphenyl sulfone, isophorone diamine, imdazole derivatives, BF3- amine complex, guanidine derivatives etc..
As above-mentioned amide based compound, such as dicyandiamide can be enumerated, by linolenic dimer and ethylenediamine
The polyamide etc. of synthesis, as above-mentioned acid anhydrides based compound, can enumerate for example phthalic anhydride, trimellitic anhydride,
Pyromellitic dianhydride, maleic anhydride, tetrabydrophthalic anhydride, methyl tetrahydrophthalic anhydride, methylnadic anhydride, hexahydro
Phthalic anhydride, methylhexahydrophthalic anhydride etc. can enumerate such as phenol phenol as above-mentioned phenol system compound
Urea formaldehyde, cresol novolaks, aromatic hydrocarbon formaldehyde resin phenol-formaldehyde resin modified, dicyclopentadiene phenol add-on type tree
Rouge, phenol aralkyl resin (XYLOC resin), naphthols aralkyl resin, Pehanorm resin, four hydroxy phenyl ethane trees
Rouge, naphthols linear phenol-aldehyde resin, naphthols-phenol cocondensation linear phenol-aldehyde resin, naphthols-cresols cocondensation linear phenol-aldehyde resin, biphenyl
Modified naphthol resin (the benzene of base phenol-formaldehyde resin modified (polyphenol compound that phenol nucleus is linked by dimethylene), xenyl
The polyphenol compound that phenol core is linked by dimethylene), amino triazine phenol-formaldehyde resin modified (in the molecular structure have benzene
The compound of phenol skeleton, triazine ring and primary amino group), aromatic rings modified linear phenol-aldehyde resin containing alkoxy (phenol nucleus and contain alkane
The polyphenol compound that the aromatic rings of oxygroup is linked by formaldehyde) etc. polyphenol compounds.
As above-mentioned curing agent, preferably with total 100 mass parts relative to heat-curing resins such as above-mentioned epoxy resin
For the use of 0.1 mass parts~60 mass parts range, preferably with the use of 0.5 mass parts~45 mass parts range, from can make
The sufficiently cured aspect of above-mentioned heat-curing resin is set out, more preferably with the use of 1 mass parts~30 mass parts range.
In addition, the thermoset materials containing curing accelerator can be used as above-mentioned thermoset materials.As upper
Curing accelerator is stated, phosphorus series compound, amine compounds, imdazole derivatives etc. can be used.When using above-mentioned curing accelerator
Dosage relative to total 100 mass parts of the heat-curing resins such as above-mentioned epoxy resin be preferably 0.1 mass parts~10 mass parts,
More preferably 0.5 mass parts~5 mass parts range.
As above-mentioned curing agent and curing accelerator, it is preferable to use the substance of powder shaped.The solidification of above-mentioned powder shaped promotes
Compared with the curing accelerator of liquid, the heat cure reaction under low temperature is suppressed for agent, therefore, can further improve thermosetting
The storage stability of thermoset materials at normal temperature before change.
In addition, as above-mentioned dilatancy adhesive layer (A), even if in the dilatancy adhesive layer being made of the thermosetting compound
(A ') in the case where use, can also be used under the big environment of temperature change in the range of not damaging the stationarity at joint portion
Contain thermoplastic resin person.
It as above-mentioned thermoplastic resin, can be used for example: the amino first such as polyurethane (PU), thermoplastic polyurethane (TPU)
Acid esters system resin；Polycarbonate (PC)；The vinyl chlorides trees such as polyvinyl chloride (PVC), Chlorovinyl-acetate vinyl copolymer resins
Rouge；Polyacrylic acid, polymethylacrylic acid, polymethyl acrylate, polymethyl methacrylate (PMMA), polyethyl methacrylate
Equal acrylic resins；Polyethylene terephthalate (PET), polybutylene terephthalate (PBT), poly terephthalic acid 1,
The polyester based resins such as 3-propanediol ester, polyethylene naphthalate, polybutylene naphthalate；Nylon (registered trademark) etc.
Polyamide resin；Polystyrene (PS), imide-modified polystyrene, acrylonitrile-butadiene-styrene (ABS) (ABS) resin, acyl
Imine modified ABS resin, styrene-acrylonitrile are copolymerized (SAN) resin, acrylonitrile/Ethylene-Propylene-Diene/styrene (AES)
The olefin-based resins such as the polystyrene resins such as resin, polyethylene (PE) resin, polypropylene (PP) resin, cyclic olefin resins；Nitre
The cellulose-based resins such as base cellulose, cellulose acetate；Silicone-based resin；The thermoplastic resins such as fluorine resin, polystyrene heat
Thermoplastic elastic, olefin series thermoplastic elastomer, vinyl chloride thermoplastic elastomer (TPE), carbamate system thermoplastic elastomer (TPE),
The thermoplastic elastomer (TPE)s such as ester based thermoplastic elastomer, amide based thermoplastic elastomer.
For that reason, above-mentioned thermoplastic resin preferably with relative to above-mentioned 100 mass parts of heat-curing resin be 1 matter
Part~100 mass parts range is measured to use.
In addition, as above-mentioned thermoset materials, it in addition to the materials noted above, can be in the model for not damaging effect of the present invention
In enclosing, set using containing such as filler, softening agent, stabilizer, adhesion promoters, levelling agent, defoaming agent, plasticizer, thickening
The additives such as the colorants such as rouge, fiber-like, antioxidant, ultraviolet absorbing agent, anti-hydrolysis agent, thickener, pigment, filler
Material.
It should be noted that above-mentioned curing agent and curing accelerator are preferably before making thermoset materials carry out heat cure
Or it is used before being configured to sheet etc..
As the swelling agent that may include in above-mentioned dilatancy adhesive layer (A), it is preferable to use as swollen after above-mentioned expansion
Swollen property adhesive layer (A ') and the swelling agent for being capable of forming porous structure, can be used such as ammonium carbonate, ammonium hydrogen carbonate, nitrous acid
The azos such as fluoric ethers, the azobis isobutyronitriles such as inorganic compounds, the trichlorofluoromethanes such as ammonium, boron hydride ammonium, azide
The semicarbazide compounds, morpholinyl -1 5- such as hydrazine compounds, the p-toluenesulfonyl semicarbazides such as object, p-toluenesulfonyl hydrazides are closed,
The triazole compounds such as 2,3,4- thiatriazoles, N, the N- nitroso compound such as N '-dinitroso pentamethylene tetramine.
In addition, can be used and hydrocarbon system solvent is for example carried out dilatancy capsule made of microencapsulation as above-mentioned swelling agent
Deng.As above-mentioned swelling agent, it can be used alone or be applied in combination and is two or more.
As above-mentioned swelling agent, the deterioration of dilatancy adhesive layer (A) caused by for example preventing the influence by heat etc.
Deng aspect from the point of view of, among above-mentioned, more preferable use is by dilatancy capsule made of hydrocarbon system solvent progress microencapsulation.
In addition, as above-mentioned swelling agent, it is preferable to use can from the point of view of it can make the adequately expanded reason of above-mentioned splicing tape
In the swelling agent that the temperature of the softening point of above-mentioned dilatancy adhesive layer (A) or so expands.
As the commercially available product of above-mentioned dilatancy capsule, can enumerate for example: XPANCEL (Japanese Fillite corporation),
Matsumoto Microsphere (Matsumoto Yushi-Seiyaku Co., Ltd.'s system), Microsphere (KUREHA corporation) etc..Make
For above-mentioned dilatancy capsule, it is preferable to use volume (cubical expansivity) of the volume relative to the above-mentioned capsule before expansion after expansion
For 8 times~60 times of dilatancy capsule.
The dosage of the dosage of above-mentioned swelling agent, preferably above-mentioned thermal expansivity capsule, relative to above-mentioned thermal expansivity bonding agent
100 mass parts of solid component of the whole components of layer (A) are preferably 0.3 mass parts~30 mass parts range, more preferably 0.5
Mass parts~25 mass parts range, further preferably 1 mass parts~20 mass parts range.By being set as above range
Dosage can sufficiently be expanded to gap possessed by filling adherend etc., and can obtain superior bonding force.
In addition, there is pressure-sensitive adhesive layer using the single side in above-mentioned dilatancy adhesive layer (A) as above-mentioned splicing tape
(B) splicing tape.Above-mentioned pressure-sensitive adhesive layer (B) can be laminated directly to a surface side of above-mentioned dilatancy adhesive layer (A),
It can also be laminated across other layers such as the so-called substrates for being referred to as core.
As above-mentioned pressure-sensitive adhesive layer (B), it is preferable to use with a thickness of 1 μm or more and 100 μm of pressure adhesives below
Layer, preferably 2 μm or more and 80 μm hereinafter, more preferably 3 μm or more and 60 μm or less.By the way that thickness is set as above range,
Even if can also follow adherend in the case where the surface of for example above-mentioned adherend (C1) is rough surface or has concave-convex
Surface obtains good pre-fixing property, even if applying stimulation to splicing tape in early period, thermal expansivity adhesive layer (A) generation is swollen
It is swollen, after filling the gap between adherend and fixing, excellent bonding force can be also obtained, so it is preferred that.
As the bonding force of above-mentioned pressure-sensitive adhesive layer (B), based on the 180 degree peeling adhesion force of JIS Z 0237 in room temperature
It is 1N/20mm or more, preferably 1.25N/20mm or more, more preferably 1.5N/20mm or more under (23 DEG C), more preferably
More than 1.75N/20mm, further preferably 2N/20mm or more.By the way that 180 degree peeling adhesion force is set as above range, inciting somebody to action
After surface side above-mentioned pressure-sensitive adhesive layer (B) of above-mentioned splicing tape is attached at adherend (C1), such as by above-mentioned adherend (C1)
When being assembled with adherend (C2), the above-mentioned splicing tape for being pasted to above-mentioned adherend (C1) can be prevented by above-mentioned adherend
(C2) it pulls and batches or the sticking position of above-mentioned splicing tape shifts.
As above-mentioned pressure-sensitive adhesive layer (B), placing to the identical heating condition with above-mentioned dilatancy adhesive layer (A)
In the case where lower, the expansion rate (pressure-sensitive adhesive layer (B) after above-mentioned placement of the thickness direction of above-mentioned pressure-sensitive adhesive layer (B)
Thickness/above-mentioned placement before pressure-sensitive adhesive layer (B) thickness) × 100 preferably 120% or less.
The expansion rate of above-mentioned pressure-sensitive adhesive layer (B) is preferably 115% or less, more preferably 100%~115%.
The expansion rate of above-mentioned pressure-sensitive adhesive layer (B) refers to: placing to identical with above-mentioned dilatancy adhesive layer (A)
In the case where under heating condition, the thickness of the pressure-sensitive adhesive layer (B ') after above-mentioned placement is relative to the above-mentioned pressure before above-mentioned placement
The ratio of the thickness of quick adhesive layer (B).Specifically, above-mentioned expansion rate refers to the value calculated using following methods.
In the environment of 23 DEG C, measurement is formed in placement to the identical heating condition with above-mentioned dilatancy adhesive layer (A)
The thickness of the pressure-sensitive adhesive layer (B) of above-mentioned splicing tape before lower (before expansion).By above-mentioned splicing tape be placed on it is above-mentioned swollen
Under the identical heating condition of swollen property adhesive layer (A).Splicing tape after above-mentioned placement is taken out to 23 DEG C of environment, is measured immediately
With the thickness of above-mentioned pressure-sensitive adhesive layer (B) comparable pressure-sensitive adhesive layer (B ').Based on said determination result and following formula, calculate
Above-mentioned expansion rate out.
[the bonding before the above-mentioned placement of thickness/composition of the pressure-sensitive adhesive layer (B ') of the splicing tape after constituting above-mentioned placement
The thickness of the pressure-sensitive adhesive layer (B) of band] × 100
As adhesive composite (b) used in above-mentioned pressure-sensitive adhesive layer (B), it is preferable to use under room temperature (23 DEG C)
The bonding agent combination of excellent bonding force is shown with excellent bonding force, even if after enabling above-mentioned splicing tape to expand
Object.
As workable adhering resin in above-mentioned adhesive composite (b), it can choose and use previously known tree
Rouge.
As above-mentioned adhesive composite (b), such as acrylic resin, rubber series resin, polyurethane series can be used
Resin, polyester based resin, silicone-based resin etc..
As above-mentioned acrylic resin, it can be used and for example gather the monomer comprising (methyl) alkyl acrylate
Acrylic resin obtained from conjunction, can will such as (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propylene
Sour N-butyl, (methyl) isobutyl acrylate, (methyl) tert-butyl acrylate, (methyl) n-octyl, (methyl) propylene
1 in the different monooctyl ester of acid, the different nonyl ester of (methyl) acrylic acid, (methyl) cyclohexyl acrylate, (methyl) 2-EHA etc.
It plants or two or more is applied in combination.Wherein, as (methyl) alkyl acrylate, from obtaining to the adherend with concave-convex surface
Tracing ability, excellent adhesion, and attach workability also in terms of excellent adhesive tape from the point of view of, more preferably use the carbon number of alkyl
For 4~12 (methyl) alkyl acrylate.
In addition, other than above-mentioned monomer, acrylonitrile, (methyl) acrylic acid, maleic acid can be used as above-mentioned monomer
Acid anhydride, acrylamide, itaconic acid, styrene, vinyl acetate etc..
As above-mentioned rubber it is resin, can enumerates for example: the polystyrene such as styrene-ethylene-butadiene copolymer (SEB)
AB type diblock copolymer；Hydride (the styrene-ethylene-fourth of styrene-butadiene-styrene (SBS), SBS
Alkene-styrol copolymer (SEBS)), styrene-isoprene-styrene copolymer (SIS), SIS hydride (styrene-
Ethylene-propylene, Styrene copolymer (SEPS)), the polystyrenes ABA type such as styreneisobutylene-styrol copolymer (SIBS)
Triblock copolymer；The polystyrenes ABAB type Tetrablock copolymer such as s-B-S-butadiene (SBSB)；Benzene
Five block copolymer of the polystyrenes ABABA such as ethylene-butadiene-styrene-butadiene-styrene (SBSBS) type；With these
The polystyrene segmented copolymer of above AB repetitive unit；The polystyrenes such as SBR styrene butadiene rubbers (SBR) are randomly total
Hydride made of the olefinic double bond of polymers is hydrogenated etc..Commercially available product also can be used in styrene series thermoplastic elastomer.
As above-mentioned pressure-sensitive adhesive layer (B), the pressure-sensitive adhesive layer under room temperature (23 DEG C) with cementability is used.Make
For above-mentioned pressure-sensitive adhesive layer (B), it is preferable to use utilizing 1Hz, the spectrometric storage shear modulus of 23 DEG C of dynamic viscoelastic
G23It is 1.0 × 103~5.0 × 107The pressure-sensitive adhesive layer of this range of Pa more preferably uses 5.0 × 103Pa~4.0 ×
107The pressure-sensitive adhesive layer of Pa, further preferably 1.0 × 104Pa~3.0 × 107The range of Pa.By being set as above range,
It can prevent above-mentioned splicing tape from peeling off from adherend, positional shift, especially, even if adherend surface is rough surface or bumps
Shape, the surface of above-mentioned adhesive layer (B) and the adaptation of adherend also further improve, therefore can show very excellent
Adhesive strength.It should be noted that above-mentioned storage shear modulus G23Refer to 23 when being measured using following measuring methods
The value of storage modulus at DEG C.
Into the test for viscoelastic machine (ARES 2kSTD) of T.A.Instrument Japan corporation, installation diameter is
Thickness is adjusted the above-mentioned pressure-sensitive adhesive layer (B) to 2mm with above-mentioned parallel-plate with the compression of 40~60g by the parallel-plate of 7.9mm
Load is clamped, and is measured under conditions of 2 DEG C frequency 1Hz, temperature region -60~150 DEG C and heating rate/min.
As above-mentioned adhesive composite (b), can be used for example containing above-mentioned resin and tackifying resin as needed,
The adhesive composite of crosslinking agent, other additives etc..
It can be used for example as above-mentioned tackifying resin for the purpose of the strong cementability of adjustment pressure-sensitive adhesive layer (B)
It is rosin series tackifying resin, newtrex system tackifying resin, newtrex ester system tackifying resin, rosin phenol system tackifying resin, steady
Surely change rosin ester system tackifying resin, disproportionated rosin ester system tackifying resin, terpenic series tackifying resin, terpene phenol system tackifying resin,
Petropols system tackifying resin etc..
It can be used well known different as above-mentioned crosslinking agent for the purpose for the cohesive force for improving pressure-sensitive adhesive layer (B)
Cyanate system crosslinking agent, epoxy crosslinking agent, aziridine system crosslinking agent, multivalent metal salt system crosslinking agent, metallo-chelate system hand over
Join agent, ketone-hydrazides system crosslinking agent, oxazoline system crosslinking agent, carbodiimide system crosslinking agent, silane system crosslinking agent, glycidyl
(alkoxy) epoxy silane system crosslinking agent etc..
As above-mentioned additive, use can according to need in the range of not damaging desired effects of the invention for adjusting
The alkali (ammonium hydroxide etc.) of whole pH, acid, foaming agent, plasticizer, softening agent, antioxidant, glass, plastic threadiness, hollow sphere
The colorants such as shape, pearl, the filler of metallic powder, pigment, dyestuff, pH adjusting agent, overlay film formed adjuvant, levelling agent,
Object known in tackifier, water repellent, defoaming agent etc..
As the form of above-mentioned adhesive composite (b), solvent system, Emulsion Adhesive, water soluble adhesive can be enumerated
Solvent-free system such as the water systems such as agent, heat-fusible adhesive, UV curing adhesive, EB curing adhesive etc..
As above-mentioned adhesive composite (b), from maintain good coating operations etc. in terms of from the point of view of, can be used and contain
There is the adhesive composite of solvent.As above-mentioned solvent, can be used for example toluene, dimethylbenzene, ethyl acetate, butyl acetate,
Acetone, methyl ethyl ketone, hexane etc..In addition, when using water system adhesive composite as above-mentioned adhesive composite (b), as
Water or the aqueous solvent based on water can be used in above-mentioned solvent.
Splicing tape of the invention can be by manufacturing via for example following processes: by by above-mentioned adhesive composite (a)
It is coated on release liner and drying, to form the process [1] of dilatancy adhesive layer (A)；Differently with above-mentioned operation [1],
By the way that above-mentioned adhesive composite (b) is coated on release liner and drying etc., thus the process for forming pressure-sensitive adhesive layer (B)
[2]；And above-mentioned pressure-sensitive adhesive layer (B) is transferred to the single side of above-mentioned dilatancy adhesive layer (A), and they are carried out
The process [3] of crimping etc..
Above-mentioned dilatancy adhesive layer (A) can be partially cured during manufacturing above-mentioned splicing tape, but preferred essence
On do not expand or solidify.Above-mentioned pressure-sensitive adhesive layer (B) can also be partially cured during manufacturing above-mentioned splicing tape,
But it is preferred that not solidifying substantially.
In addition, as splicing tape of the invention, can according to need and use in above-mentioned dilatancy adhesive layer (A) and pressure
Splicing tape between quick adhesive layer (B) with nonwoven layer or resin film layer or the metalliferous layer (Z) of packet.The bonding belt
There is good rigidity, therefore it is excellent to attach workability.
Paper pulp, artificial silk, Manila are then preferably comprised as material if it is such as non-woven fabrics as above-mentioned layer (Z)
Fiber crops, acrylonitrile, nylon, polyester etc. can according to need progress: in copy paper process to meet the tensile strength of non-woven fabrics
The either simplex sequence infiltration processing adding polyamide, and being coated after the drying；Using viscose glue, thermoplastic resin as the two of binder
Process infiltration processing etc..As resin film, it can enumerate using polyester film, polyethylene film, polypropylene screen, polychloroethylene film, gather
Plastic foils such as acid imide film etc. and the resin film layer formed can enumerate the metal layers such as aluminium, copper as metalliferous layer is wrapped.
As above-mentioned layer (Z), it is preferable to use the layer with 1 μm or more and 200 μm thickness below, more preferable use have
The layer of 2 μm or more and 150 μm thickness below, further preferably using the layer with 3 μm or more and 100 μm thickness below.
By being set as above range, when the above-mentioned pressure-sensitive adhesive layer (B) of above-mentioned splicing tape is attached at adherend, in above-mentioned adherend
In the case that surface is rough surface or has bumps, adherend surface shape also can be sufficiently followed, excellent bonding is obtained
Property.
Splicing tape with above-mentioned layer (Z) can be by manufacturing via for example following processes: by by above-mentioned bonding agent group
It closes object (a) and is coated on release liner and drying, to form the process [I] of dilatancy adhesive layer (A)；With above-mentioned operation [I]
Differently, by the way that above-mentioned adhesive composite (b) is coated on release liner and drying etc., to form pressure-sensitive adhesive layer
(B) process [II]；The process [IV] of above-mentioned layer (Z) is laminated in the single side of above-mentioned dilatancy adhesive layer (A)；And it will be upper
The process [V] stated pressure-sensitive adhesive layer (B) and be transferred to the face comprising above-mentioned layer (Z), and they are crimped.
Splicing tape of the invention can be and integrally applying stimulation to above-mentioned dilatancy adhesive layer (A) or above-mentioned splicing tape
Make its expansion.As above-mentioned stimulation, as described above, heat, light etc. can be enumerated.As the method for applying stimulation, it can enumerate and add
The methods of heat or light irradiation are, it is preferable to use the method for heating.
Above-mentioned heating temperature is preferably for example corresponding with temperature (the expansion start temperature) that above-mentioned swelling agent expands
Temperature, specifically, it is preferable that for 50 DEG C~250 DEG C, preferably 60 DEG C~230 DEG C, more preferably 70 DEG C~200 DEG C.
Splicing tape of the invention preferably after applying the stimulation such as above-mentioned heating, is expanded along its thickness direction.It is another
Aspect, splicing tape of the invention are not sent out substantially in its flow direction or width direction preferably after applying the stimulation such as above-mentioned heating
Raw expansion.
As the method for using splicing tape of the invention that more than two adherends are fixed etc., example can be enumerated
As: production obtained from attaching the above-mentioned pressure-sensitive adhesive layer (B) of an adherend and the above-mentioned splicing tape of composition
Object is placed in defined position, and at least applies above-mentioned stimulation to above-mentioned dilatancy adhesive layer (A) and make its expansion, thus makes
The above-mentioned dilatancy adhesive layer (A) expanded is in contact with other adherends and be bonded method.At this point, above-mentioned stimulation can be with
It is applied to the above-mentioned dilatancy adhesive layer (A) for constituting above-mentioned splicing tape, it is whole that above-mentioned splicing tape can also be applied to.
Splicing tape of the invention can be suitably employed in manufacture for example with the article constituted as follows, and compositions refers to: general
Constitute the position (c1-1) of adherend (C1) and other positions (c1-2) or the other adherends of the above-mentioned adherend (C1) of composition
(C2) it is constituted made of being bonded.
Above-mentioned article can be by manufacturing via following processes: making the above-mentioned pressure-sensitive adhesive layer for constituting above-mentioned splicing tape
(B), the process [1] be bonded in advance with the position (c1-1) for constituting adherend (C1)；And by least stimulating above-mentioned dilatancy
Adhesive layer (A) and make its expansion, to make the above-mentioned dilatancy adhesive layer (A) expanded and constitute above-mentioned adherend (C1)
Position (c1-2) or the process [2] that is bonded of above-mentioned adherend (C2).
As above-mentioned article, the motor such as being equipped on hybrid vehicle can be enumerated.Specifically, above-mentioned electricity
Motivation can manufacture in the following way: make a part of the components such as the pressure-sensitive adhesive layer (B) for constituting above-mentioned splicing tape and magnet
Bonding in advance, after thus obtained sticky object to be placed in gap possessed by the core components for constituting motor, at least in stimulation
It states dilatancy adhesive layer (A) and makes its expansion.
In addition, above-mentioned splicing tape can come for the purpose possessed by filling adherend in gap using can also be in example
Use when such as forming following composition, the composition refer to: after above-mentioned splicing tape is placed in gap possessed by adherend, at least
It stimulates above-mentioned dilatancy adhesive layer (A) and makes its expansion, more than two positions in above-mentioned gap are consequently formed by above-mentioned viscous
It is constituted made of tape splicing bonding.
Embodiment
(preparation example 1)
<preparation of adhesive composite (a-1)>
By the way that by epoxy resin 1, (epoxide equivalent 403g/eq., liquid (25 DEG C), viscosity are 1,400,000 mPas (25
DEG C)) 7.0 mass parts, (melt viscosity when epoxide equivalent 162g/eq., solid-state (25 DEG C), 150 DEG C is epoxy resin 2
0.2dPas, softening point are 25 DEG C) 28 mass parts, epoxy resin 3 (epoxide equivalent 8000g/eq., solid-state (25 DEG C), softening
Point be 200 DEG C or more) methyl ethyl ketone solution (solid component is 30 mass %) 216.7 mass parts, curing agent (2,4- diamino-
The secondary triazine isocyanuric acid adduct of 6- [2 '-methylimidazolyls-(1 ')]-ethyl -) 2.0 mass parts are mixed, thus prepare heat
Curability adhesive composite (a-1).
(preparation example 2)
Epoxy resin 1 is changed to 2 mass parts by 7 mass parts, uses epoxy resin 4 (epoxide equivalent 130g/eq., liquid
Shape (25 DEG C), viscosity are 300mPas (25 DEG C)) in addition to this 5 mass parts using method identical with preparation example 1, obtain
Thermocurable adhesive composite (a-2).
(preparation example 3)
<preparation of adhesive composite (b-1)>
In the reaction vessel for having blender, reflux condenser, thermometer, dropping funel and nitrogen inlet, by third
It is 80 mass parts of olefin(e) acid butyl ester, 15 mass parts of acrylic acid, 5 mass parts of Hydroxyethyl Acrylate, even as the 2 of polymerization initiator, 2 '-
Double 0.1 mass parts of isobutyronitrile of nitrogen are dissolved in 100 mass parts of ethyl acetate, polymerize 10 hours at 70 DEG C, thus obtain Weight-average molecular
Acrylic acid series copolymer (S-1) solution that amount is 1,000,000.
Then, it adds in Xiang Shangshu acrylic copolymer (S-1) solution relative to 100 mass parts of acrylic copolymer
For the epoxy crosslinking agent (" E-05X ", solid component of Soken Chemical & Engineering Co., Ltd. are 0.5 mass %) of 10 mass parts, add
Add ethyl acetate and stir 20 minutes, thus obtains the pressure-sensitive adhesive composite (b-1) that nonvolatile component is 30 mass %.
(preparation example 4)
<preparation of adhesive composite (b-2)>
In the reaction vessel for having blender, reflux condenser, thermometer, dropping funel and nitrogen inlet, by third
44.9 mass parts of olefin(e) acid butyl ester, 50 mass parts of 2-EHA, 2 mass parts of acrylic acid, 3 mass parts of vinyl acetate,
0.1 mass parts of acrylic acid 4- hydroxybutyl are dissolved in second as 0.1 mass parts of the 2 of polymerization initiator, 2 '-azobis isobutyronitrile
100 mass parts of acetoacetic ester polymerize 10 hours at 70 DEG C, thus obtain the acrylic acid series copolymer (T- that weight average molecular weight is 800,000
1) solution.
Then, relative to 100 mass parts of acrylic acid series copolymer (T-1), the newtrex ester system for adding 30 mass parts increases
Viscosity resin D-135 (Arakawa Chemical Industries, Ltd.'s system), addition ethyl acetate simultaneously stir 20 minutes, thus obtain it is non-volatile at
It is divided into the pressure-sensitive adhesive composite (b-2) of 45 mass %.
(embodiment 1)
In the Thermocurable adhesive composite (a-1) obtained by preparation example 1, put into as swelling agent relative to
100 mass parts of solid component of heat-curing resin contained by above-mentioned Thermocurable adhesive composite (a-1) be 15 mass parts,
And the thermal expansivity that expansion starting temperature is 108~113 DEG C, maximum swelling temperature is 142~151 DEG C, partial size is 9~15 μm is micro-
Thus capsule obtained Thermocurable dilatancy adhesive composite (X-1) using dispersator 10 minutes.
Then, using rodlike metal applicator, by above-mentioned Thermocurable dilatancy adhesive composite (X-1) with drying
The mode that thickness afterwards reaches 50 μm is applied to release liner (using silicone compounds to 50 μm of thickness of poly terephthalic acid second
The single side of diol ester film has carried out liner obtained by lift-off processing) surface.
Then, above-mentioned coating material is put into 85 DEG C of drying machine 5 minutes and is dried, thus obtain 50 μm of thickness of piece
The Thermocurable dilatancy adhesive layer (A-1) of shape.
Then, using rodlike metal applicator, above-mentioned pressure-sensitive adhesive composite (b-1) is reached with the thickness after drying
Release liner is applied to (using silicone compounds to 50 μm of thickness of polyethylene terephthalate film to 10 μm of modes
Single side pad obtained by lift-off processing) surface, 5 minutes dry in setting drying machine to 85 DEG C, thus production pressure
Quick adhesive layer (B-1).
Above-mentioned pressure-sensitive adhesive layer (B-1) is attached to the Thermocurable dilatancy adhesive layer (A-1) as above obtained, is made
It thus obtains being bonded in above-mentioned Thermocurable dilatancy in the upper surface round trip of above-mentioned attaching object with the hand-held roller of 2kg
The single side of oxidant layer (A-1) is laminated with the splicing tape of above-mentioned pressure-sensitive adhesive layer (B-1).
(embodiment 2)
It is coated in such a way that the thickness after the drying of pressure-sensitive adhesive layer (B-1) reaches 50 μm, in addition to this, utilizes
Method same as Example 1 obtains splicing tape.
(embodiment 3)
The Thermocurable dilatancy adhesive layer (A-1) obtained by embodiment 1 is attached at 12 μm of thickness poly- to benzene
Naphthalate film, using the hand-held roller of 2kg, thus the round trip on the face of above-mentioned attaching object is obtained above-mentioned
The single side of Thermocurable dilatancy adhesive layer (A-1) is laminated with the splicing tape of polyethylene terephthalate film.Then, will
The pressure-sensitive adhesive layer (B-1) obtained using method same as Example 1 is attached to be bonded in above-mentioned Thermocurable dilatancy
The single side of oxidant layer (A-1) is laminated with the polyethylene terephthalate side of the splicing tape of polyethylene terephthalate film,
Using the hand-held roller of 2kg, thus the round trip on the surface of above-mentioned attaching object is obtained in polyethylene terephthalate
A surface layer be laminated with Thermocurable thermal expansivity adhesive layer (A-1) and be laminated with pressure-sensitive adhesive layer in another surface side
(B-1) splicing tape.
(embodiment 4)
Pressure-sensitive adhesive layer (B-2) is obtained using pressure-sensitive adhesive composite obtained in preparation example 4 (b-2), to
Instead of pressure-sensitive adhesive layer (B-1), in addition to this, splicing tape is obtained using method same as Example 1.
(embodiment 5)
Thermocurable dilatancy bonding is obtained using Thermocurable adhesive composite (a-2) obtained in preparation example 2
Oxidant layer (A-2), in addition to this to utilize side same as Example 1 instead of Thermocurable dilatancy adhesive layer (A-1)
Method obtains splicing tape.
(comparative example 1)
It is coated in such a way that the thickness after the drying of pressure-sensitive adhesive layer (B-1) reaches 200 μm, in addition to this, benefit
Splicing tape is obtained with method same as Example 1.
(comparative example 2)
Using method same as Example 1, the splicing tape comprising Thermocurable dilatancy adhesive layer (A-1) is obtained.
[measuring method of expansion rate]
Using thickness gauge, the Thermocurable dilatancy of the splicing tape made in measurement composition Examples 1 to 3, Comparative Examples 1 and 2
The thickness of adhesive layer (A-1) and pressure-sensitive adhesive layer (B-1).Then, by putting above-mentioned splicing tape in the environment of 130 DEG C
It sets 10 minutes and makes its expansion, and measure the thickness of the splicing tape after above-mentioned expansion respectively using thickness gauge.
About above-mentioned expansion rate, calculates according to following formulas and expanded relative to the Thermocurable that will constitute above-mentioned splicing tape
Property adhesive layer (A-1) and pressure-sensitive adhesive layer (B-1) placed 10 minutes in the environment of 130 DEG C before above-mentioned Thermocurable
Splicing tape ratio after the thickness of dilatancy adhesive layer (A-1) and pressure-sensitive adhesive layer (B-1), above-mentioned placement.
[Thermocurable before thickness/above-mentioned placement of the Thermocurable dilatancy adhesive layer (A-1) after above-mentioned placement is swollen
The thickness of swollen property adhesive layer (A-1)] × 100
[pressure-sensitive adhesive layer (B-1) before thickness/above-mentioned placement of the pressure-sensitive adhesive layer (B-1) after above-mentioned placement
Thickness] × 100
[measuring method of initial bonding force]
180 degree peeling adhesion force is measured according to JIS Z 0237.It peels Examples 1 to 3 off, make in comparative example 1~2
Splicing tape the side dilatancy adhesive layer (A) surface release liner, with 25 μm of polyethylene terephthalate of thickness
Ester film carries out lining.At this point, above-mentioned splicing tape falls off from polyethylene terephthalate in order to prevent, make above-mentioned splicing tape
In the state of being bonded with polyethylene terephthalate, with 60 DEG C apply 1 minute, the load of 1kN and crimped.
Splicing tape after above-mentioned lining is sufficiently let cool at 23 DEG C, and after cutting into wide 20mm, peels the pressure of splicing tape off
The release liner on the surface of quick adhesive layer (B) side makes pressure-sensitive adhesive layer (B) fit in the flat through ungrease treatment of SUS plate
Sliding surface, as test film after using 2kg roller round-trip 1 time.It should be noted that peeling dilatancy adhesive layer off in comparative example 2
(A) release liner in another face fits in the smooth surface through ungrease treatment of SUS plate, is made with after 2kg roller round-trip 1 time
For test film.After above-mentioned test film is placed 1 hour under 23 DEG C of environment, under identical environment, is stretched and tried using TENSILON
It tests machine [A&D corporation, model: RTM-100], measurement will constitute the splicing tape of above-mentioned test film from SUS plate along 180 degree direction
Bonding force when being removed with 300mm/ minutes speed.
[to the adhesion of component]
By the splicing tape made in Examples 1 to 3, comparative example 1~2 cut under 23 DEG C of environment short side be 25.12mm,
Long side is the rectangle of 30mm.Thereafter, side pressure-sensitive adhesive layer (B) of the splicing tape of above-mentioned severing is peeled off under 23 DEG C of environment
The release liner on surface, be attached in such a way that long side is perpendicular to cylinder the SUS of diameter 8mm, length 30mm through degreasing at
On the cylinder of reason, above-mentioned splicing tape is wound in a manner of coiling column 1 week thereafter.About the splicing tape made in comparative example 2, stripping
Fall the release liner in a face of dilatancy adhesive layer (A), and is wound in cylinder.At this point, will not occur to float from cylinder or
The case where peeling, is evaluated as [zero], and the case where floating or peel off from cylinder will have occurred and be evaluated as [×].
[storage shear modulus G at 23 DEG C of pressure-sensitive adhesive layer (B)23Measuring method]
Into the test for viscoelastic machine (ARES 2kSTD) of T.A.Instrument Japan corporation, installation diameter is
The parallel-plate of 7.9mm adjusts the pressure-sensitive adhesive layer made in embodiment (B-1) and (B-2) to 2mm thickness, with above-mentioned parallel
Plate is clamped with the compressive load of 40~60g, in frequency 1Hz, temperature region -60~150 DEG C and heating rate 2 DEG C/min
Under the conditions of be measured.
[measuring method of shear bond strength]
Wide 15mm × long 70mm × thickness 0.5mm two panels smooth surface aluminium sheet is subjected to ungrease treatment, as shown in Figure 1,
Two spacers of the compartment of terrain 12mm 5mm wide arranged in parallel are separated in the end of the upper surface (C1-1) of an aluminium sheet (C1), and
It is bonded.The thickness of above-mentioned spacer uses adjusted in a manner of thickening 50 μm relative to the total thickness of above-mentioned splicing tape
Thickness.
Then, the splicing tape for cutting into 10mm × 10mm size is peeled off to the pressure-sensitive adhesive layer (B) of above-mentioned splicing tape
The mode of the mold release film of side is attached between the upper surface side (C1-1) of above-mentioned aluminium sheet (C1) and above-mentioned two spacers, is used
The hand-held roller of 2kg is crimped.
Then, the mold release film for peeling side adhesive layer (A) of above-mentioned splicing tape off, in the adhesive layer (A) of above-mentioned splicing tape
The upper surface of mounting other aluminium sheets (C2) (wide 15mm × long 70mm × thickness 0.5mm) with smooth surface through ungrease treatment, general
They are fixed with fixture.After object after above-mentioned fixation is heated 30 minutes with 130 DEG C, 30 minutes are placed under 23 DEG C of environment simultaneously
It is cooling.Then, using the object after the above-mentioned fixture of removal as test film, the end of above-mentioned 2 aluminium sheets is clamped respectively, is used
TENSILON cupping machine [A&D corporation, model: RTM-100], measurement were drawn along 180 degree direction with 10mm/ minutes
Stretch the bonding force of shear direction when test.
[table 1]
[table 2]
Description of symbols
1 aluminium sheet (C1)
2 aluminium sheets (C2)
3 spacers
4 splicing tapes
Gap between 5 splicing tapes and aluminium sheet (C2)
Claims (6)
1. a kind of splicing tape directly has or in the single side of the dilatancy adhesive layer A containing heat-curing resin across it
Its layer has pressure-sensitive adhesive layer B,
The pressure-sensitive adhesive layer B with a thickness of 1 μm or more and 100 μm hereinafter, 180 degree under 23 DEG C of room temperature removes bonding
Power is 1N/20mm or more.
2. splicing tape according to claim 1, wherein the expansion rate of the thickness direction of the dilatancy adhesive layer A, i.e.
(thickness of the dilatancy adhesive layer A before thickness/heating of the dilatancy adhesive layer A1 after heating) × 100 be 150% with
On.
3. splicing tape according to claim 1 or 2, wherein the pressure-sensitive adhesive layer B by 1Hz, 23 DEG C under the conditions of
The spectrometric storage shear modulus G of dynamic viscoelastic23It is 1.0 × 103Pa~5.0 × 107The range of Pa.
4. splicing tape described in any one of claim 1 to 3, wherein the dilatancy adhesive layer A with a thickness of 1 μ
M or more.
5. a kind of adhering method, which is characterized in that it is the position c1-1 and the composition adherend C1 that will constitute adherend C1
Other position c1-2 or other adherend C2 be bonded using splicing tape described in any one of Claims 1 to 44 it is viscous
Method is connect, has following process:
The process for keeping the pressure-sensitive adhesive layer B for constituting the splicing tape be bonded in advance with the position c1-1 for constituting adherend C1
1；And
By stimulating at least described dilatancy adhesive layer A to make its expansion, to make to constitute having expanded for the splicing tape
Dilatancy adhesive layer A carries out be bonded process 2 with the position c1-2 or the adherend C2 for constituting the adherend C1.
6. a kind of manufacturing method of article, which is characterized in that it is the position c1-1 and the composition quilt that will constitute adherend C1
The other position c1-2 or other adherend C2 of viscous object C1 are carried out using splicing tape described in any one of Claims 1 to 44
The manufacturing method of the article of bonding, has following process:
The process for keeping the pressure-sensitive adhesive layer B for constituting the splicing tape be bonded in advance with the position c1-1 for constituting adherend C1
1；And
By stimulating at least described dilatancy adhesive layer A to make its expansion, to make to constitute having expanded for the splicing tape
Dilatancy adhesive layer A carries out be bonded process 2 with the position c1-2 or the adherend C2 for constituting the adherend C1.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-074676 | 2018-04-09 | ||
| JP2018074676A JP7077735B2 (en) | 2018-04-09 | 2018-04-09 | Adhesive tape, articles, motors and manufacturing methods for articles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110358457A true CN110358457A (en) | 2019-10-22 |
Family
ID=68215517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910264095.0A Pending CN110358457A (en) | 2018-04-09 | 2019-04-02 | The manufacturing method of splicing tape, article, motor and article |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7077735B2 (en) |
| CN (1) | CN110358457A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210372041A1 (en) * | 2020-06-02 | 2021-12-02 | The A Story Co. Ltd. | Resin composition for preventing fibers from unraveling |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63186791A (en) * | 1987-01-27 | 1988-08-02 | Nitto Electric Ind Co Ltd | Foamable pressure-sensitive member |
| CN104263264A (en) * | 2014-08-13 | 2015-01-07 | 隆昌羽玺新材料科技有限公司 | Novel thermally-bonded double-sided tape and making and use methods thereof |
| CN105940071A (en) * | 2014-01-31 | 2016-09-14 | 索马龙株式会社 | Adhesive sheet |
| CN106414640A (en) * | 2015-04-10 | 2017-02-15 | 株式会社寺冈制作所 | Adhesive sheet |
| CN106459679A (en) * | 2014-06-11 | 2017-02-22 | Dic株式会社 | Adhesive tape, article, motor, and method for producing article |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003020458A (en) * | 2001-07-09 | 2003-01-24 | Sliontec Corp | Adhesive tape substrate and adhesive tape using the same |
-
2018
- 2018-04-09 JP JP2018074676A patent/JP7077735B2/en active Active
-
2019
- 2019-04-02 CN CN201910264095.0A patent/CN110358457A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63186791A (en) * | 1987-01-27 | 1988-08-02 | Nitto Electric Ind Co Ltd | Foamable pressure-sensitive member |
| CN105940071A (en) * | 2014-01-31 | 2016-09-14 | 索马龙株式会社 | Adhesive sheet |
| CN106459679A (en) * | 2014-06-11 | 2017-02-22 | Dic株式会社 | Adhesive tape, article, motor, and method for producing article |
| CN104263264A (en) * | 2014-08-13 | 2015-01-07 | 隆昌羽玺新材料科技有限公司 | Novel thermally-bonded double-sided tape and making and use methods thereof |
| CN106414640A (en) * | 2015-04-10 | 2017-02-15 | 株式会社寺冈制作所 | Adhesive sheet |
Non-Patent Citations (2)
| Title |
|---|
| 张开 主编: "《粘合与密封材料》", 30 June 1996, 化学工业出版社 * |
| 曾毅等: "《装甲防护材料技术》", 31 January 2014, 国防工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210372041A1 (en) * | 2020-06-02 | 2021-12-02 | The A Story Co. Ltd. | Resin composition for preventing fibers from unraveling |
| US11859343B2 (en) * | 2020-06-02 | 2024-01-02 | The A Story Co. Ltd. | Resin composition for preventing fibers from unraveling |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7077735B2 (en) | 2022-05-31 |
| JP2019182977A (en) | 2019-10-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI741489B (en) | Adhesive sheet | |
| CN105102565B (en) | Bonding sheet | |
| CN1930262B (en) | Heat-peelable pressure-sensitive adhesive sheet and method of processing adhered with the heat-peelable pressure-sensitive adhesive sheet | |
| TWI714815B (en) | Articles, article manufacturing methods and void filling methods | |
| CN106459679B (en) | Adhesive tape, article, motor, and method for manufacturing article | |
| TW201623509A (en) | Double-sided adhesive tape, article, and separation method | |
| CN103328592A (en) | Double-sided adhesive tape or sheet, and adherend processing method | |
| CN111601860B (en) | Adhesive tape, article, and method for producing article | |
| WO2017038913A1 (en) | Adhesive sheet and method for producing semiconductor device | |
| CN110499116A (en) | Bonding sheet | |
| CN108977111A (en) | The manufacturing method of jointing tape, article and article | |
| CN110358457A (en) | The manufacturing method of splicing tape, article, motor and article | |
| US20230312995A1 (en) | Adhesive sheet, article, and method for manufacturing article | |
| JP7155210B2 (en) | Adhesive sheet | |
| CN109312196B (en) | Adhesive sheet and article | |
| JP5132064B2 (en) | Heat-peelable adhesive sheet | |
| KR20210137084A (en) | adhesive sheet | |
| JP6417838B2 (en) | Double-sided pressure-sensitive adhesive tape, method for producing double-sided pressure-sensitive adhesive tape, adhesion method, and separation method | |
| JP6417837B2 (en) | Double-sided pressure-sensitive adhesive tape, method for producing double-sided pressure-sensitive adhesive tape, adhesion method and separation method | |
| CN110832045A (en) | Adhesive tape, article, and method for manufacturing article | |
| JP6529310B2 (en) | Thermosetting adhesive sheet, adhesive sheet with substrate and method for producing adhesive sheet with substrate | |
| WO2019131167A1 (en) | Method for manufacturing article using adhesive tape | |
| JP2012207076A (en) | Thermally active adhesive and thermally active adhesive film | |
| JP2020066184A (en) | Manufacturing method of materials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191022 |
|
| RJ01 | Rejection of invention patent application after publication |