CN110354468A - A kind of multichip IC encapsulation - Google Patents
A kind of multichip IC encapsulation Download PDFInfo
- Publication number
- CN110354468A CN110354468A CN201910630688.4A CN201910630688A CN110354468A CN 110354468 A CN110354468 A CN 110354468A CN 201910630688 A CN201910630688 A CN 201910630688A CN 110354468 A CN110354468 A CN 110354468A
- Authority
- CN
- China
- Prior art keywords
- fixed frame
- encapsulating structure
- rubber
- hoop
- driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 42
- 229910000831 Steel Inorganic materials 0.000 claims description 38
- 239000010959 steel Substances 0.000 claims description 38
- 230000005540 biological transmission Effects 0.000 claims description 19
- 241000883990 Flabellum Species 0.000 claims description 18
- 238000004140 cleaning Methods 0.000 claims description 10
- 230000001154 acute effect Effects 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000009434 installation Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A63—SPORTS; GAMES; AMUSEMENTS
- A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
- A63B63/00—Targets or goals for ball games
- A63B63/08—Targets or goals for ball games with substantially horizontal opening for ball, e.g. for basketball
- A63B63/083—Targets or goals for ball games with substantially horizontal opening for ball, e.g. for basketball for basketball
-
- A—HUMAN NECESSITIES
- A63—SPORTS; GAMES; AMUSEMENTS
- A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
- A63B71/00—Games or sports accessories not covered in groups A63B1/00 - A63B69/00
- A63B71/06—Indicating or scoring devices for games or players, or for other sports activities
-
- A—HUMAN NECESSITIES
- A63—SPORTS; GAMES; AMUSEMENTS
- A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
- A63B2225/00—Miscellaneous features of sport apparatus, devices or equipment
- A63B2225/66—Cooled
Landscapes
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Physical Education & Sports Medicine (AREA)
- Vibration Prevention Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to integrated antenna package field, specifically a kind of multichip IC encapsulation, including hoop, access panel, driving structure, encapsulating structure, routing hole and sealing structure；Encapsulating structure is set to the inside of hoop, encapsulating structure vibration is squeezed and deformed during shooting, encapsulating structure consumes the energy of hoop vibration, reduce the vibration energy to chip in the sealing structure inside encapsulating structure, and then effectively prevent wafer damage, encapsulating structure promotes the air circulation of the inside of encapsulating structure by the energy of vibration simultaneously, and then quickly cool down to encapsulating structure, sealing structure is set to the inside of encapsulating structure, reduce influence of the vibration to the chip in sealing structure, the use of sealing structure keeps encapsulating structure easier for installation quick, encapsulating structure keeps the sealing performance between sealing structure and encapsulating structure more preferable while being squeezed and deformed, sealing structure further promotes the heat dissipation performance of encapsulating structure, and then improve the anti-dust performance of chip.
Description
Technical field
The present invention relates to integrated antenna package field, specifically a kind of multichip IC encapsulation.
Background technique
In protectiveness insulative potting material, encapsulating material should be physical for integrated circuit or semiconductor chip packaging
Good balance is provided between energy, chemical property and cost, for conventional semiconductor chips, by the mouldman for needing hydraulic press
Skill manufacture encapsulation.
However, integrated antenna package uses less in the automatic counting of basketball, traditional counter needs artificial record
Data mostly use the mode of visual inspection to observe goal situation, then visually when watching school's Basketball Match at the scene
The case where the logging data in counter, statistics basketball both sides score number, when be directly used in counted on hoop when, hoop
For the material of irony, apply to that outdoor temperature conduction of velocity is fast for a long time, be easy to influence inside chip service performance, and throwing
Hoop vibration frequency is big during basket, is easy the stability of the chip inside influence, and chip is long-term used in outdoor to encapsulation
Leakproofness require, be easy to cause during vibration encapsulation junction damage.
Summary of the invention
For the problems of the prior art, the present invention provides a kind of encapsulation of multichip IC.
The technical solution adopted by the present invention to solve the technical problems is: a kind of multichip IC encapsulation, including basket
Frame, access panel, driving structure, encapsulating structure, routing hole and sealing structure；The end of the hoop is equipped with for connecting power supply line
Cylindrical structure the routing hole, the inside of the hoop is equipped with the encapsulating structure for being packaged to chip,
And the side wall of the hoop is equipped with the access panel for being limited to the plugging structure, the drive on the hoop
Dynamic structure is connected to the plugging structure for carrying out pressure release and cooling to chip；The inside of the plugging structure is equipped with and is used for
The sealing structure of fixed chip, the sealing structure and the plugging structure for being sealed to the plugging structure
It contradicts.
Specifically, the hoop includes support frame, throws frame and fixed frame, the encapsulating structure is set to the interior of the fixed frame
Portion is detachably connected between the access panel and the fixed frame for limiting to the encapsulating structure, the fixed frame
Both ends are symmetrically arranged with two support frames as described above, and the throwing frame of circular ring shape is fixed on support frame as described above, and the throwing frame is fixed on
The fixed frame.
Specifically, the encapsulating structure includes multiple air bags, two blocks of steel plates, two pieces of rubber sleeves, cleaning set, mounting hole, gas
Pipe, two check valves and through-hole engage between two pieces of rubber sleeves, the maintenance for being limited to the rubber sleeve
Crab bolt is connected to the fixed frame, and the back of two pieces of rubber sleeves is symmetrically arranged with two blocks of wavy steel plates, more
The air bag of a semi-cylindrical structure is equidistantly set to the inside of the rubber sleeve, and the through-hole is described through the air bag
Rubber sleeve and the steel plate contradict, and the mounting hole for installing infrared sensor, which runs through, is connected to the rubber sleeve and extension
The fixed frame out, two check valves are respectively symmetrically fixed on two rubber sleeves, described in the check valve and two
The accommodating cavity conducting that rubber sleeve surrounds, one end of the tracheae is connected to a check valve for exhaust, the gas
The other end of pipe extends to the mounting hole, and the cleaning set of circular ring shape is fixed on the rubber sleeve, the cleaning set with
It is slidably connected between the mounting hole on the fixed frame, the sealing structure and the rubber sleeve contradict.
Specifically, the driving structure include limit plate, driving circle, transmission shaft, driving wheel, accommodating cavity, multiple flabellums,
Drive shaft, two gears and multiple stomatas, the limit plate are fixed on the fixed frame, the driving circle and the fixed frame bottom
The steel plate at end contradicts, the company of sliding between the driving circle of the semi-cylindrical structure with storage cavities and the limit plate
It connects, the accommodating cavity is set to the inside of the fixed frame, and the driving circle is set to the accommodating cavity with the limit plate
Inside, the transmission shaft is through being connected to the driving wheel and the fixed frame, the axle center of the transmission shaft to the driving wheel
The distance between axle center be equal to the driving circle deformation distance half, the drive shaft and the flabellum are set to institute
The inside of accommodating cavity is stated, the drive shaft is through the fixed frame, the company of rotation between the drive shaft and the fixed frame
It connects, multiple flabellum circumference array are fixed on the drive shaft, and the drive shaft and the transmission shaft are embedded in the fixed frame
Inside another cavity in end be equipped with the gear, two gears engagements, the institute in the drive shaft
State the diameter of the diameter of gear much smaller than the gear on the transmission shaft, the stomatas of multiple truncated cone-shapeds is through the maintenance
The angle between plane where plate, the axis of the stomata and the throwing frame is acute angle.
Specifically, the sealing structure includes rubber ring, elastic slice and limit hole, it is truncated rectangular pyramids close to one end of the steel plate
The rubber ring and the rubber sleeve of structure contradict, and the inside of the rubber ring is equipped with multiple equidistant rings symmetrically arranged two-by-two
The elastic slice of shape structure, the inside of the rubber ring are equipped with the limit hole of ring structure.
Beneficial effects of the present invention:
(1) a kind of multichip IC encapsulation of the present invention, encapsulating structure are set to the inside of hoop, were shooting
Encapsulating structure vibration is squeezed and deformed in journey, and encapsulating structure consumes the energy of hoop vibration, is reduced to close inside encapsulating structure
The vibration energy of chip on seal structure, and then wafer damage is effectively prevented, while encapsulating structure is promoted by the energy of vibration
The air circulation of the inside of encapsulating structure, and then quickly cool down to encapsulating structure, the stability in use of chip is improved,
The driving structure inside hoop is connected to encapsulating structure simultaneously, and driving structure drives encapsulating structure extruding to become by the air of flowing
Shape, and then promote the inner air circulation of encapsulating structure, and then keep the heat dissipation performance of encapsulating structure more preferable.
(2) a kind of multichip IC encapsulation of the present invention, sealing structure is set to the inside of encapsulating structure, into one
Influence of the reduction vibration of step to the chip in sealing structure, while the use of sealing structure keeps encapsulating structure easier for installation
Fast, encapsulating structure keeps the sealing performance between sealing structure and encapsulating structure more preferable while being squeezed and deformed, and then improves
The anti-dust performance of chip, sealing structure further promote the heat dissipation performance of encapsulating structure.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is a kind of a kind of preferred embodiment overall structure signal of multichip IC encapsulation provided by the invention
Figure；
Fig. 2 is the portion A shown in FIG. 1 enlarged diagram；
Fig. 3 is the attachment structure schematic diagram of fixed frame shown in Fig. 2 and transmission shaft；
Fig. 4 is the portion B shown in FIG. 1 enlarged diagram；
Fig. 5 is the portion C shown in FIG. 1 enlarged diagram；
Fig. 6 is the attachment structure schematic diagram of hoop shown in FIG. 1 and routing hole.
In figure: 1, hoop, 11, support frame, 12, throwing frame, 13, fixed frame, 2, access panel, 3, driving structure, 31, limit
Plate, 32, driving circle, 33, transmission shaft, 34, driving wheel, 35, accommodating cavity, 36, flabellum, 37, drive shaft, 38, gear, 39, gas
Hole, 4, encapsulating structure, 41, air bag, 42, steel plate, 43, rubber sleeve, 44, cleaning set, 45, mounting hole, 46, tracheae, 47, unidirectional
Valve, 5, routing hole, 6, sealing structure, 61, rubber ring, 62, elastic slice, 63, limit hole.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Specific embodiment is closed, the present invention is further explained.
As shown in figs 1 to 6, a kind of multichip IC encapsulation of the present invention, including hoop 1, access panel 2, drive
Dynamic structure 3, encapsulating structure 4, routing hole 5 and sealing structure 6；The end of the hoop 1 is equipped with the cylinder for connecting power supply line
The routing hole 5 of body structure, the inside of the hoop 1 are equipped with the encapsulating structure 4 for being packaged to chip, and institute
The side wall for stating hoop 1 is equipped with the access panel 2 for being limited to the plugging structure 4, the drive on the hoop 1
Dynamic structure 3 is connected to the plugging structure 4 for carrying out pressure release and cooling to chip；The inside of the plugging structure 4 is equipped with
For the sealing structure 6 of fixed chip, the sealing structure 6 for being sealed to the plugging structure 4 with it is described
Plugging structure 4 contradicts；The encapsulating structure 4 is set to the inside of the hoop 1, and the encapsulating structure 4 shakes during shooting
It is squeezed and deformed, the encapsulating structure 4 consumes the energy that the hoop 1 shakes, and reduces to described in inside the encapsulating structure 4
The vibration energy of chip in sealing structure 6, and then wafer damage is effectively prevented, while the encapsulating structure 4 passes through vibration
Energy promotes the air circulation of the inside of the encapsulating structure 4, and then quickly cools down to the encapsulating structure 4, improves
The stability in use of chip, while the driving structure 3 inside the hoop 1 is connected to the encapsulating structure 4, the drive
Dynamic structure 3 drives the encapsulating structure 4 to be squeezed and deformed by the air of flowing, and then promotes the inside of the encapsulating structure 4 empty
Gas circulation, and then keep the heat dissipation performance of the encapsulating structure 4 more preferable；The sealing structure 6 is set to the interior of the encapsulating structure 4
Portion, the further influence for reducing vibration to the chip in the sealing structure 6, while the use of the sealing structure 6 makes institute
It is easier for installation quick to state encapsulating structure 4, the encapsulating structure 4 makes the sealing structure 6 and institute while being squeezed and deformed
The sealing performance stated between encapsulating structure 4 is more preferable, and then improves the anti-dust performance of chip.
Specifically, the hoop 1 includes support frame 11, throws frame 12 and fixed frame 13, the encapsulating structure 4 is set to described solid
The inside for determining frame 13 detachably connects between the access panel 2 and the fixed frame 13 for limiting to the encapsulating structure 4
It connects, the both ends of the fixed frame 13 are symmetrically arranged with two support frames as described above 11, and the institute of circular ring shape is fixed on support frame as described above 11
It states and throws frame 12, the throwing frame 12 is fixed on the fixed frame 13；Support frame as described above 11 there are two being set on the fixed frame 13, it is described
The use of support frame 11 improves the tensile capacity for throwing frame 12, effectively prevents the throwing frame 12 during dunk shot from becoming
Shape improves the security performance in basketball movement.
Specifically, the encapsulating structure 4 include 41, two blocks of multiple air bags, 42, two pieces of steel plate rubber sleeve 43, cleaning set 44,
Mounting hole 45,46, two check valves 47 of tracheae and through-hole 48 engage between two pieces of rubber sleeves 43, for the rubber
The access panel 2 that set 43 is limited is bolted in the fixed frame 13, and the back of two pieces of rubber sleeves 43 is symmetrical
Equipped with two blocks of wavy steel plates 42, the air bag 41 of multiple semi-cylindrical structures is equidistantly set on the rubber sleeve 43
Inside, the through-hole 48 is through the air bag 41, and the rubber sleeve 43 is contradicted with the steel plate 42, for installing infrared sensing
Through being connected to the rubber sleeve 43 and extending the fixed frame 13, two check valves 47 divide the mounting hole 45 of device
It is not symmetrically fixed on two rubber sleeves 43, the accommodating cavity that the check valve 47 is surrounded with two rubber sleeves 43 is led
Logical, one end of the tracheae 46 is connected to a check valve 47 for exhaust, and the other end of the tracheae 46 extends
To the mounting hole 45, the cleaning set 44 of circular ring shape is fixed on the rubber sleeve 43, the cleaning set 44 and the fixation
It is slidably connected between the mounting hole 45 on frame 13, the sealing structure 6 is contradicted with the rubber sleeve 43；First by power supply line
The chip being connected in the sealing structure 6 is passed through from the routing hole 5, and infrared sensor is mounted on the rubber sleeve 43
The mounting hole 45 in, when basketball was thrown from the throwing frame 12, shelter from the infrared sensing of the inside of the mounting hole 45
When the light of device, infrared sensor connects the counting chip of the inside of the sealing structure 6, starts counting, and impinges upon in basketball
The throwing frame 12 and its fixed frame 13 generate vibration when on the throwing frame 12, and the vibration of fixed frame 13 contradicts the steel plate
42, the steel plate 42 is waveform, when the fixed frame 13, which shakes, squeezes the steel plate 42, when the steel plate 42 is squeezed and deformed
The air bag 41 is squeezed and deformed, and the steel plate 42 cooperates the air bag 41 to consume the energy of the vibration that the fixed frame 13 generates,
The air bag 41, two rubber sleeves are discharged from the through-hole 48 in air of the air bag 41 when deforming inside the air bag 41
The pressure of the inside of accommodating cavity between 43 becomes larger, and is emitted into air then by the tracheae 46 from the check valve 47
In the mounting hole 45, and then effectively dust is avoided to block the mounting hole 45, influences the service performance of infrared sensor, together
When make air between two rubber sleeves 43 that accommodating cavity be discharged, when the steel plate 42 resets, the air bag 41 resets,
Air makes gas in the accommodating cavity between two rubber sleeves 43 from the through-hole 48 and then the air bag 41
Pressure becomes smaller, under atmospheric pressure, air from unidirectional described in another, 47 so accommodating cavity in, and then to core
Promote the air circulation of the inside of the rubber sleeve 43 while piece pressure release, and then outdoor high temperature is avoided to damage chip.
Specifically, the driving structure 3 includes limit plate 31, driving circle 32, transmission shaft 33, driving wheel 34, accommodating cavity
35, multiple flabellums 36,37, two gears 38 of drive shaft and multiple stomatas 39, the limit plate 31 are fixed on the fixed frame 13,
The driving circle 32 and the steel plate 42 of 13 bottom end of fixed frame contradict, the institute of the semi-cylindrical structure with storage cavities
It states and is slidably connected between driving circle 32 and the limit plate 31, the accommodating cavity 35 is set to the inside of the fixed frame 13, institute
The inside that driving circle 32 is set to the accommodating cavity 35 with the limit plate 31 is stated, the transmission shaft 33, which runs through, is connected to the biography
Driving wheel 34 and the fixed frame 13, the distance between axle center of the transmission shaft 33 to the axle center of the driving wheel 34 are equal to described
The half of the deformation distance of driving circle 32, the drive shaft 37 and the flabellum 36 are set to the interior of the accommodating cavity 35
Portion, the drive shaft 37 is rotatablely connected between the drive shaft 37 and the fixed frame 13 through the fixed frame 13, multiple
36 circumference array of flabellum is fixed on the drive shaft 37, and the drive shaft 37 and the transmission shaft 33 are embedded in the fixed frame
End in another cavity of 13 inside is equipped with the gear 38, and two gears 38 engage, the drive shaft
Diameter of the diameter of the gear 38 on 37 much smaller than the gear on the transmission shaft 33, the stomata 39 of multiple truncated cone-shapeds
Through the access panel 2, the angle between the axis of the stomata 39 and the plane for throwing 12 place of frame is acute angle；Work as room
When blowing outside, then air brushes on the flabellum 36 from the inside of accommodating cavity 35 described in 39 steel plate of stomata, described
The drive shaft 37 on flabellum 36 drives the gear 38 to rotate, and the gear 38 on the flabellum 36 drives the driving
The gear 38 on axis 37 rotates, and the rotation of drive shaft 37 drives the driving wheel 34 to contradict the driving circle 32, described
Driving circle 32 is squeezed and deformed, and the driving circle 32 contradicts the steel disc 42, and then makes to pass through nature in the case where no vibration
The wind on boundary drives the flabellum 36, slides between the driving circle 32 and the limit plate 31, described in 32 conflict of driving circle
Steel plate 42, and then so that the steel plate 424 is squeezed the air bag 41 and deform, and then the inner air of the encapsulating structure 4 is promoted to follow
Ring, and then keep the heat dissipation performance of the encapsulating structure 4 more preferable, the diameter of the gear in the drive shaft 37 is much smaller than the transmission
The diameter of the gear 38 on axis 33 and then using more laborsaving, and then make have drive shaft 37 described in enough power drives
Rotation, while the stomata 39 of multiple truncated cone-shapeds is through the access panel 2, the axis of the stomata 39 and the throwing frame 12
Angle between the plane at place is acute angle, and then effectively prevents dust from entering the accommodating cavity 35.
Specifically, the sealing structure 6 includes rubber ring 61, elastic slice 62 and limit hole 63, close to the one of the steel plate 42
End is that the rubber ring 61 of truncated rectangular pyramids structure and the rubber sleeve 43 contradict, and the inside of the rubber ring 61 is equipped with multiple equidistant
The elastic slice 62 of symmetrically arranged ring structure two-by-two, the inside of the rubber ring 61 are equipped with the limit hole of ring structure
63；Chip is mounted on to the inside of the limit hole 63, when squeezing the rubber ring 61, the elastic slice 62 is squeezed and deformed, together
Shi Suoshu rubber ring 61 is truncated rectangular pyramids structure close to one end of the steel plate 42, and then makes the rubber sleeve 43 and the rubber ring
It is easier for installation quick between 61, while being to connect stronger between the rubber ring 61 and the rubber sleeve 43, work as institute
The extrusion deformation of rubber sleeve 43 is stated, when the rubber ring 61 is by pressure, the elastic slice 62 is deformed, and then makes the rubber sleeve 43 and institute
It states and connects stronger between rubber ring 61, and then effectively chip is avoided to slip, while being the rubber sleeve 43 and the rubber
Sealing performance between cushion rubber 61 is more preferable, while the extrusion deformation of the elastic slice 62 is conducive to the rubber sleeve 43 and resets, Jin Erti
The high anti-dust performance of chip, the elastic slice 62 cooperate the use of the rubber ring 61 to make the reseting performance of the rubber sleeve 43 more
It is good, keep the heat dissipation performance of the encapsulating structure 4 more preferable.
When in use, power supply line is passed through into the chip being connected in sealing structure 6 from routing hole 5 first, by infrared sensing
Device is mounted in the mounting hole 45 on rubber sleeve 43, when basketball from throw frame 12 in threw, shelter from the red of the inside of mounting hole 45
When the light of outer sensor, infrared sensor connects the counting chip of the inside of sealing structure 6, starts counting, and hits in basketball
Frame 12 to be thrown when throwing on frame 12 and its fixed frame 13 generates vibration, the vibration of fixed frame 13 contradicts steel plate 42, and steel plate 42 is waveform,
When fixed frame 13 shakes pressing steel plate 42, air bag 41 is squeezed and deformed when steel plate 42 is squeezed and deformed, and steel plate 42 cooperates air bag 41 to disappear
Consume fixed frame 13 generate vibration energy, air bag 41 deform when air bag 41 inside air from through-hole 48 discharge air bag 41, two
The pressure of the inside of accommodating cavity between a rubber sleeve 43 becomes larger, and is emitted into air then by tracheae 46 from check valve 47
In mounting hole 45, and then effectively dust is avoided to block mounting hole 45, influences the service performance of infrared sensor, while making two
Accommodating cavity is discharged in air between rubber sleeve 43, and when steel plate 42 resets, air bag 41 resets, and air is from through-hole 48 and then air bag
41, and then the pressure of the gas in the accommodating cavity between two rubber sleeves 43 is made to become smaller, under atmospheric pressure, air from
Another is unidirectional, 47 so that accommodating cavity in, and then promote while to chip pressure release the air of the inside of rubber sleeve 43
Circulation, and then outdoor high temperature is avoided to damage chip, when outdoor blows, air from the inside of 39 steel plate accommodating cavity 35 of stomata,
Then it brushes on flabellum 36, the drive shaft 37 on flabellum 36 is rotated with moving gear 38, and the gear 38 on flabellum 36 drives driving
Gear 38 on axis 37 rotates, and the rotation of drive shaft 37 drives driving wheel 34 to contradict driving circle 32, and driving circle 32 is squeezed and deformed, driving
Circle 32 contradicts steel disc 42, and then makes to drive flabellum 36, driving circle 32 and limit by the wind of nature in the case where no vibration
It is slided between the plate 31 of position, driving circle 32 contradicts steel plate 42, and then deforms 424 extruding gasbag 41 of steel plate, and then promotes encapsulation knot
The inner air of structure 4 recycles, and then keeps the heat dissipation performance of encapsulating structure 4 more preferable, and the diameter of the gear in drive shaft 37 is much smaller than
The diameter of gear 38 on transmission shaft 33 and then using more laborsaving, and then make there is enough power to drive 37 turns of drive shaft
It is dynamic, while folder of the stomata 39 of multiple truncated cone-shapeds through access panel 2, between the axis of stomata 39 and the plane for throwing 12 place of frame
Angle is acute angle, and then effectively prevents dust from entering accommodating cavity 35, and chip is mounted on to the inside of limit hole 63, is squeezing rubber
When cushion rubber 61, elastic slice 62 is squeezed and deformed, while rubber ring 61 is truncated rectangular pyramids structure close to one end of steel plate 42, and then makes rubber sleeve
It is easier for installation quick between 43 and rubber ring 61, at the same be connected between rubber ring 61 and rubber sleeve 43 it is stronger, when
Rubber sleeve 43 is squeezed and deformed, and when rubber ring 61 is by pressure, elastic slice 62 is deformed, and then makes to connect between rubber sleeve 43 and rubber ring 61
It is stronger, and then effectively chip is avoided to slip, while being that sealing performance between rubber sleeve 43 and rubber ring 61 is more preferable, together
When the extrusion deformation of elastic slice 62 be conducive to the reset of rubber sleeve 43, and then improve the anti-dust performance of chip, 62 compound rubber circle of elastic slice
61 use keeps the reseting performance of rubber sleeve 43 more preferable, keeps the heat dissipation performance of encapsulating structure 4 more preferable.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the description in above embodiment and specification only illustrates the present invention
Principle, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these variation and
Improvement is both fallen in the scope of protection of present invention.The claimed scope of the invention is by appended claims and its equivalent
Object defines.
Claims (5)
1. a kind of multichip IC encapsulation, it is characterised in that: including hoop (1), access panel (2), driving structure (3), envelope
Assembling structure (4), routing hole (5) and sealing structure (6)；The end of the hoop (1) is equipped with the cylindrical body for connecting power supply line
The routing hole (5) of structure, the inside of the hoop (1) are equipped with the encapsulating structure (4) for being packaged to chip,
And the side wall of the hoop (1) is equipped with the access panel (2) for being limited to the plugging structure (4), the hoop
(1) driving structure (3) on is connected to the plugging structure (4) for carrying out pressure release and cooling to chip；The envelope
The inside of bridging structure (4) is equipped with the sealing structure (6) for fixed chip, close for carrying out to the plugging structure (4)
The sealing structure (6) of envelope and the plugging structure (4) contradict.
2. a kind of multichip IC encapsulation according to claim 1, it is characterised in that: the hoop (1) includes branch
Support (11) throws frame (12) and fixed frame (13), and the encapsulating structure (4) is set to the inside of the fixed frame (13), is used for pair
It is detachably connected between the access panel (2) and the fixed frame (13) of encapsulating structure (4) limit, the fixed frame
(13) both ends are symmetrically arranged with two support frames as described above (11), and the throwing frame of circular ring shape is fixed on support frame as described above (11)
(12), the throwing frame (12) is fixed on the fixed frame (13).
3. a kind of multichip IC encapsulation according to claim 2, it is characterised in that: encapsulating structure (4) packet
Include multiple air bags (41), two pieces of steel plates (42), two pieces of rubber sleeves (43), cleaning set (44), mounting hole (45), tracheae (46), two
A check valve (47) and through-hole (48) engage between two pieces of rubber sleeves (43), for limiting the rubber sleeve (43)
The access panel (2) of position is bolted in the fixed frame (13), and the back of two pieces of rubber sleeves (43) is symmetrically arranged with
Two pieces of wavy steel plates (42), the air bag (41) of multiple semi-cylindrical structures are equidistantly set to the rubber sleeve (43)
Inside, the through-hole (48) is through the air bag (41), and the rubber sleeve (43) and the steel plate (42) contradict, for pacifying
The mounting hole (45) of dress infrared sensor, which runs through, to be connected to the rubber sleeve (43) and extends the fixed frame (13), two
A check valve (47) is respectively symmetrically fixed on two rubber sleeves (43), the check valve (47) and two rubber
The accommodating cavity conducting that set (43) surrounds, one end of the tracheae (46) is connected to a check valve for exhaust
(47), the other end of the tracheae (46) extends to the mounting hole (45), and the cleaning set (44) of circular ring shape is fixed on
The rubber sleeve (43), the cleaning covers to be slidably connected between the mounting hole (45) on (44) and the fixed frame (13),
The sealing structure (6) and the rubber sleeve (43) contradict.
4. a kind of multichip IC encapsulation according to claim 3, it is characterised in that: driving structure (3) packet
Include limit plate (31), driving circle (32), transmission shaft (33), driving wheel (34), accommodating cavity (35), multiple flabellums (36), driving
Axis (37), two gears (38) and multiple stomatas (39), the limit plate (31) are fixed on the fixed frame (13), the driving
The steel plate (42) for enclosing (32) and the fixed frame (13) bottom end contradicts, described in the semi-cylindrical structure with storage cavities
It is slidably connected between driving circle (32) and the limit plate (31), the accommodating cavity (35) is set to the interior of the fixed frame (13)
Portion, the driving circle (32) and the limit plate (31) are set to the inside of the accommodating cavity (35), and the transmission shaft (33) is passed through
It wears and is connected to the driving wheel (34) and the fixed frame (13), the axle center of the transmission shaft (33) to the driving wheel (34)
The distance between axle center is equal to the half of the deformation distance of the driving circle (32), the drive shaft (37) and the flabellum
(36) it is set to the inside of the accommodating cavity (35), the drive shaft (37) is through the fixed frame (13), the drive shaft
(37) it is rotatablely connected between the fixed frame (13), multiple flabellum (36) circumference array are fixed on the drive shaft
(37), in another cavity for the inside that the drive shaft (37) and the transmission shaft (33) are embedded in the fixed frame (13)
End is equipped with the gear (38), two gear (38) engagements, the gear (38) on the drive shaft (37)
Diameter is much smaller than the diameter of the gear on the transmission shaft (33), and the stomatas (39) of multiple truncated cone-shapeds is through the maintenance
The angle between plane where plate (2), the axis of the stomata (39) and throwing frame (12) is acute angle.
5. a kind of multichip IC encapsulation according to claim 3, it is characterised in that: sealing structure (6) packet
Rubber ring (61), elastic slice (62) and limit hole (63) are included, one end close to the steel plate (42) is the rubber of truncated rectangular pyramids structure
Cushion rubber (61) and the rubber sleeve (43) contradict, and the inside of the rubber ring (61) is equipped with multiple equidistant rings symmetrically arranged two-by-two
The elastic slice (62) of shape structure, the inside of the rubber ring (61) are equipped with the limit hole (63) of ring structure.
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