CN211191243U

CN211191243U - Integrated dust removal device for integrated circuit packaging

Info

Publication number: CN211191243U
Application number: CN201922085901.6U
Authority: CN
Inventors: 谢卫国; 杨浩
Original assignee: Jiangsu Gelite Electronic Ltd By Share Ltd
Current assignee: Jiangsu Gelite Electronic Ltd By Share Ltd
Priority date: 2019-11-28
Filing date: 2019-11-28
Publication date: 2020-08-07
Anticipated expiration: 2029-11-28

Abstract

The utility model relates to the technical field of integrated circuit packaging, in particular to an integrated dust removal device for integrated circuit packaging, which comprises a mounting plate, wherein the surface of the mounting plate is provided with a butt joint groove, a packaging box is inserted into the butt joint groove, a reinforced rubber ring is arranged on the inner wall of the butt joint groove, the top surface of the packaging box is provided with a mounting port, the inner wall of the mounting port is provided with a bearing net plate, the upper part of the bearing net plate is provided with a leather bag, the opening part of the mounting port is screwed with a closing plate, and a side plate of the packaging box is provided with a placing groove; the beneficial effects are that: the utility model provides an integrated circuit packaged's integral type dust collector sets up the installing port on encapsulation box upper portion, adds in the installing port and establishes the leather bag, and the air current that the in-process that presses the leather bag repeatedly produced raises the dust on integrated circuit board surface, and the dust of raising is bonded by adhesion board surface colloid, so realize the clearance to the inside dust of packaging structure under the condition with the help of external equipment not.

Description

Integrated dust removal device for integrated circuit packaging

Technical Field

The utility model relates to a relevant technical field of integrated circuit encapsulation specifically is an integral type dust collector for integrated circuit encapsulation.

Background

One of the functions of integrated circuit packaging is to protect the chip from the environment and avoid the chip from being damaged due to the contact with external objects, the surface of the traditional packaging structure is provided with radiating holes for radiating the chip, but dust can be mixed in the radiating holes and adsorbed on the surface of the chip, the power consumption is high when the dust is cleaned by external equipment, and the dust on the surface of the chip cannot be cleaned when dust removing equipment is not arranged around the chip due to the fact that the dust is collected by using a scene; therefore, the utility model provides an integral type dust collector for integrated circuit encapsulation is used for solving above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an integral type dust collector for integrated circuit encapsulation to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an integral type dust collector for integrated circuit encapsulation, includes the mounting panel, the butt joint groove has been seted up on the surface of mounting panel, it has the packaging box to peg graft in the inside in butt joint groove, and is provided with the reinforced rubber circle on the inner wall in butt joint groove, the installing port has been seted up to the top surface of packaging box, be provided with on the inner wall of installing port and bear the otter board, the upper portion that bears the otter board is provided with the leather bag, and the opening part spiro union of installing port has the shrouding, has seted up the standing groove on the curb plate of packaging box, the inside of standing groove is provided with the sack piece, and the surface of standing groove is provided with the card material arch, and the spiro union has the seal ring on the.

Preferably, the surface of mounting panel is provided with integrated circuit board, and the bottom surface of mounting panel is provided with fastening screw, and fastening screw spiro union is in the bottom surface of packaging box, and the butt joint groove is the loop configuration, and the reinforced rubber circle is annular platelike structure, and the reinforced rubber circle is provided with two sets ofly, and two sets of reinforced rubber circle distribute respectively on two lateral walls of butt joint groove.

Preferably, the mounting opening is of a circular cylinder structure, the leather bag is of an arc-shaped plate structure, the sealing plate is of a circular plate structure, the top surface of the sealing plate is provided with a concave groove, a handle is arranged inside the concave groove, and the handle is of a cross-shaped plate structure.

Preferably, the standing groove is circular cylinder structure, has seted up the louvre on the inner wall of encapsulation box, and the louvre communicates with each other with the standing groove, and the card material arch is provided with a plurality ofly, and a plurality of card material archs are the circumference and arrange on the surface of standing groove.

Preferably, the seal ring is of a circular structure, the inner annular surface of the seal ring is provided with the isolation screen plate, the inner annular surface of the seal ring is provided with the screwing handle, and the screwing handle is of a cross-shaped structure.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model provides an integrated dust collector of integrated circuit encapsulation sets up the installing port on packaging box upper portion, adds in the installing port and establishes the leather bag, and the air current that produces in the process of repeatedly pressing the leather bag lifts the dust on integrated circuit board surface, and the dust that lifts is adhered by adhesion plate surface colloid, realizes the clearance to the inside dust of packaging structure like this under the condition of not relying on external equipment;

2. the utility model provides an it communicates with each other with the louvre to set up the standing groove on integrated circuit encapsulation's the curb plate, and there is the sack piece standing groove is inside through the seal ring centre gripping, and the sack piece protection is in the louvre outside, avoids the dust to get into inside the packaging box from the louvre.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the leather bag of the present invention in a state of being bounced;

FIG. 3 is an enlarged view of the structure at A in FIG. 1;

fig. 4 is a schematic view of the seal ring structure of the present invention.

In the figure: the packaging structure comprises a mounting plate 1, an integrated circuit board 101, fastening screws 102, a butt joint groove 2, a packaging box 3, a reinforced rubber ring 4, a mounting opening 5, a bearing screen plate 6, a leather bag 7, a sealing plate 8, a placing groove 9, a cloth bag sheet 10, a clamping protrusion 11, a sealing ring 12, an isolation screen plate 121, a screwing handle 122 and an adhesive plate 13.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 4, the present invention provides a technical solution: an integrated dust removal device for integrated circuit packaging comprises a mounting plate 1, wherein a butt joint groove 2 is formed in the surface of the mounting plate 1, a packaging box 3 is inserted into the butt joint groove 2, a reinforcing rubber ring 4 is bonded on the inner wall of the butt joint groove 2, an integrated circuit board 101 is arranged on the surface of the mounting plate 1, a fastening screw 102 is arranged on the bottom surface of the mounting plate 1, the fastening screw 102 is screwed on the bottom surface of the packaging box 3, the butt joint groove 2 is of an annular structure, the reinforcing rubber ring 4 is of an annular plate-shaped structure, two groups of reinforcing rubber rings 4 are arranged, the two groups of reinforcing rubber rings 4 are respectively distributed on two side walls of the butt joint groove 2, the integrated circuit board 101 is bonded on the surface of the mounting plate 1, then the packaging box 3 is covered above the mounting plate 1, the bottom end of the packaging box 3 is inserted into the butt joint groove 2, and the two groups of reinforcing rubber rings 4 are wrapped on the outer side of the packaging, then the packaging box 3 is fixed from the bottom of the mounting plate 1 by means of the fastening screw 102;

the top surface of the packaging box 3 is provided with a mounting port 5, a bearing screen plate 6 is bonded on the inner wall of the mounting port 5, a leather bag 7 is bonded on the upper part of the bearing screen plate 6, the bottom end of the leather bag 7 is bonded on the edge of the bearing screen plate 6 to avoid dust leakage at the edge of the bearing screen plate 6, a sealing plate 8 is screwed at the opening part of the mounting port 5, the mounting port 5 is in a circular cylinder structure, the leather bag 7 is in an arc-shaped plate structure, the sealing plate 8 is in a circular plate structure, the top surface of the sealing plate 8 is provided with a concave groove, a handle is arranged in the concave groove and is in a cross-shaped plate structure, an adhesive plate 13 is bonded on the inner wall of the packaging box 3, the sealing plate 8 is removed from the mounting port 5 by pinching the handle on the top surface of the sealing plate 8 with fingers, at the moment, the leather bag 7 in a pressurized state is restored to be protruded out of the opening of the mounting, the dust is adhered to the surface of the adhesive plate 13, the dust on the surface of the integrated circuit board 101 is cleaned without the help of external dust removing equipment, and new dust cannot enter the packaging box 3 under the protection of the cloth bag piece 10;

the side plate of the packaging box 3 is provided with a placing groove 9, the interior of the placing groove 9 is provided with a cloth bag piece 10, the surface of the placing groove 9 is bonded with a plurality of clamping bulges 11, the placing groove 9 is in a circular cylinder structure, the inner wall of the packaging box 3 is provided with a plurality of radiating holes which are communicated with the placing groove 9, the plurality of clamping bulges 11 are arranged on the surface of the placing groove 9 in a circular shape, the inner wall of the placing groove 9 is screwed with a seal ring 12, the seal ring 12 is in a circular ring structure, the inner ring surface of the seal ring 12 is provided with an isolation screen plate 121, the inner ring surface of the seal ring 12 is provided with a screwing handle 122, the screwing handle 122 is in a cross-shaped structure, heat generated by the integrated circuit board 101 is discharged through convection formed by the radiating holes arranged at two sides of the radiating holes, the cloth bag piece 10 covers the outer side to prevent external dust from entering the interior of the packaging box 3, fingers pinch the screwing handle 122 to screw and unscrew the seal ring 12 from the, be convenient for clear up or change sack piece 10, when seal ring 12 was to the sack piece 10 centre gripping of standing groove 9 inside, keep apart otter board 121 and sack piece 10 surface contact, avoid sack piece 10 surface because the air current strikes the fold, and seal ring 12 is convenient for the extrusion of sack piece 10 to form the card structure of holding in card material arch 11 department.

The working principle is as follows: in actual operation, the integrated circuit board 101 is adhered to the surface of the mounting plate 1, then the packaging box 3 is covered above the mounting plate 1, the bottom end of the packaging box 3 is inserted into the butt joint groove 2, two groups of reinforced rubber rings 4 are wrapped on the outer side of the packaging box 3 from two sides to seal a gap between the butt joint groove 2 and the packaging box 3, then the packaging box 3 is fixed from the bottom of the mounting plate 1 by means of the fastening screws 102, heat generated by the integrated circuit board 101 is discharged through convection formed by the heat dissipation holes arranged on the two sides, the cloth bag pieces 10 are covered on the outer sides of the heat dissipation holes to prevent external dust from entering the inside of the packaging box 3 from the heat dissipation holes, the sealing ring 12 is screwed and removed from the placing groove 9 by pinching the screwing handle 122 with fingers, so that the cloth bag pieces 10 can be cleaned or replaced conveniently, when the cloth bag pieces 10 in the placing groove 9 are clamped by the sealing ring 12, the isolation screen, avoid the fold on sack piece 10 surface because the air current strikes, and seal ring 12 is convenient for the extrusion of sack piece 10 to form the card and is held the structure in card material arch 11 department, the handle that the finger held the 8 top surfaces of shrouding is demolishd shrouding 8 from installing port 5, originally, the leather bag 7 that is in the pressurized state this moment kick-backs and recovers the opening setting of outstanding installing port 5, press down leather bag 7 repeatedly, the inside formation air current of packaging box 3 lifts up integrated circuit board 101 surface dust, the dust bonds on adhesion board 13 surface, realize the clearance to integrated circuit board 101 surface dust under the condition of not with the help of outside dust collecting equipment, under sack piece 10's protection, packaging box 3 inside can not get into new dust.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An integral type dust collector for integrated circuit package, includes mounting panel (1), its characterized in that: the surface of mounting panel (1) has been seted up and has been docked groove (2), the inside grafting of docking groove (2) has packaging box (3), and is provided with reinforced rubber circle (4) on the inner wall of docking groove (2), mounting port (5) have been seted up to the top surface of packaging box (3), be provided with on the inner wall of mounting port (5) and bear otter board (6), the upper portion that bears otter board (6) is provided with leather bag (7), and the opening part spiro union of mounting port (5) has shrouding (8), has seted up standing groove (9) on the curb plate of packaging box (3), the inside of standing groove (9) is provided with sack piece (10), and the surface of standing groove (9) is provided with card material arch (11), and the spiro union has seal ring (12) on the inner wall of standing groove (9), and is provided with on the inner wall of packaging box (3) and adheres to board (13).

2. An integrated dust removal device for integrated circuit packages as claimed in claim 1, wherein: the surface of mounting panel (1) is provided with integrated circuit board (101), and the bottom surface of mounting panel (1) is provided with fastening screw (102), and fastening screw (102) spiro union is on the bottom surface of packaging box (3), and butt joint groove (2) are the loop configuration, and reinforced rubber circle (4) are annular platelike structure, and reinforced rubber circle (4) are provided with two sets ofly, and two sets of reinforced rubber circle (4) distribute respectively on two lateral walls of butt joint groove (2).

3. An integrated dust removal device for integrated circuit packages as claimed in claim 1, wherein: the mounting opening (5) is of a circular cylinder structure, the leather bag (7) is of a circular arc-shaped plate-shaped structure, the sealing plate (8) is of a circular plate-shaped structure, a concave groove is formed in the top surface of the sealing plate (8), a handle is arranged inside the concave groove, and the handle is of a cross-shaped plate-shaped structure.

4. An integrated dust removal device for integrated circuit packages as claimed in claim 1, wherein: the storage groove (9) is of a circular cylinder structure, heat dissipation holes are formed in the inner wall of the packaging box (3), the heat dissipation holes are communicated with the storage groove (9), a plurality of clamping material protrusions (11) are arranged on the surface of the storage groove (9) in a circumferential mode, and the clamping material protrusions (11) are arranged on the surface of the storage groove (9).

5. An integrated dust removal device for integrated circuit packages as claimed in claim 1, wherein: the seal ring (12) is of a circular structure, an isolation screen plate (121) is arranged on the inner annular surface of the seal ring (12), a screwing handle (122) is arranged on the inner annular surface of the seal ring (12), and the screwing handle (122) is of a cross-shaped structure.