CN110352100A - The method of component for cleaning material sedimentary origin, for the method for manufacture material sedimentary origin and the equipment of the component for cleaning material sedimentary origin - Google Patents
The method of component for cleaning material sedimentary origin, for the method for manufacture material sedimentary origin and the equipment of the component for cleaning material sedimentary origin Download PDFInfo
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- CN110352100A CN110352100A CN201780087719.5A CN201780087719A CN110352100A CN 110352100 A CN110352100 A CN 110352100A CN 201780087719 A CN201780087719 A CN 201780087719A CN 110352100 A CN110352100 A CN 110352100A
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- component
- source
- cleaning
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- supersonic source
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
- B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
- B08B9/0321—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2209/00—Details of machines or methods for cleaning hollow articles
- B08B2209/005—Use of ultrasonics or cavitation, e.g. as primary or secondary action
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Present disclosure provides a kind of method (100) of component (20) for cleaning material sedimentary origin (400).The method (100) includes: that the component (20) are inserted into (110) cleaning solution (201)；It will be in the inside of supersonic source (220) insertion (120) described component (20)；With operation (130) supersonic source (220).
Description
Technical field
The embodiment of present disclosure is related to a kind of method of component for cleaning material sedimentary origin, one kind for making
Make the method and a kind of equipment of the component for cleaning material sedimentary origin of material deposition source.The embodiment of present disclosure is special
It is not related to the method and apparatus for manufacturing Organic Light Emitting Diode (OLED) device.
Background technique
Technology for carrying out layer deposition on substrate includes such as thermal evaporation, physical vapour deposition (PVD) (PVD) and chemical gas
Mutually deposition (CVD).Coated substrate can be used in several applications and several technical fields.For example, can be in organic hair
Coated substrate is used in optical diode (OLED) devices field.OLED manufacture television screen, computer prison can be used
Visual organ, mobile phone, other hand-held devices and analog are for showing information.OLED device, such as OLED display, can be with
Including the one or more organic material layers being placed between two electrodes, these organic material layers are all deposited on substrate.
OLED device may include the stacked structure of several organic materials, and the stacked structure of these organic materials is for example being located
It manages and is evaporated in the vacuum chamber of equipment.Organic material is set to be deposited on substrate in a continuous manner by shadow mask using evaporation source
On.The indoor vacuum condition of vacuum chamber is for the material layer deposited and the quality of the OLED device manufactured using these material layers
It is vital.
Therefore, it is necessary to can improve the method and apparatus of the indoor vacuum condition of vacuum chamber.Present disclosure, which is intended in particular to, to be changed
The cleannes of the kind indoor component of vacuum chamber, allow to improve the quality for the organic material layer being deposited on substrate.
Summary of the invention
In view of above-mentioned, a kind of method of component for cleaning material sedimentary origin is provided, a kind of is deposited for manufacture material
The method in source and a kind of equipment of the component for cleaning material sedimentary origin.Other aspect, benefit and features of present disclosure
It is apparent from claims, the description and the appended drawings.
According to one aspect of the present disclosure, a kind of method of component for cleaning material sedimentary origin is provided.It is described
Method includes: that the component is inserted into cleaning solution；Supersonic source is inserted into the inside of the component；With the operation ultrasound
Source.
According to the other side of present disclosure, a kind of method for manufacture material sedimentary origin is provided.The method
It include: to clean the one or more of the material deposition source by the way that supersonic source to be inserted into the inside of one or more components
A component；With use one or more of components to assemble the material deposition source.
According to the other aspect of present disclosure, a kind of equipment of component for cleaning material sedimentary origin is provided.It is described
Equipment includes: tank, and the tank is configured as accommodating the component；And supersonic source, the supersonic source are configured as being inserted into the portion
In the inside of part.
According to the aspect of present disclosure still further, a kind of equipment of component for cleaning material sedimentary origin is provided.Institute
Stating equipment includes: tank, and the tank is configured as accommodating the component；First supersonic source, first supersonic source are configured as clearly
The inside of the clean component；With the second supersonic source, second supersonic source is configured as cleaning the outside of the component.
Embodiment further relates to the equipment for executing disclosed method and including each described for executing
Environment division in terms of method.In terms of these methods can by hardware component, by appropriate software programming computer, pass through two
Any combination of person executes in any other way.In addition, being further related to according to the embodiment of the present disclosure for grasping
Make the method for described equipment.Method for operating described equipment includes the side for executing each function of equipment
In terms of method.
Detailed description of the invention
Being discussed in greater detail for the disclosure being briefly outlined above can be obtained by reference to embodiment, it in this way can be detailed
Carefully understand the mode of the features described above of present disclosure.Attached drawing is related to the embodiment of present disclosure, and hereinafter retouches
It states:
Fig. 1, which is shown, to sink according to embodiment as described herein for material used in clean in the manufacture of OLED device
The flow chart of the method for the component in product source；
Fig. 2 shows the signals according to the equipment of the component for cleaning material sedimentary origin of embodiment as described herein
Figure；
Fig. 3 shows the flow chart of the method for manufacture material sedimentary origin according to embodiment as described herein；
Fig. 4 show according to embodiment as described herein in the manufacture of OLED device used in material deposition source show
It is intended to；And
Fig. 5 shows the signal of the system for manufacturing the device with organic material according to embodiment as described herein
Figure.
Specific embodiment
With detailed reference to the various embodiments of present disclosure, the one or more for being shown in figure embodiment is shown
Example.In the description below to picture, identical reference number indicates identical component.In general, it only describes relative to a
The difference of other embodiment.Each example is to be provided in a manner of explaining present disclosure, and do not mean that in the disclosure
The limitation of appearance.In addition, can be used in other embodiment as the part diagram of an embodiment or the feature of description
Or be used in combination with other embodiment, to generate still other implementations.This specification be intended to include such modification and
Variation.
The quality of material layer of the indoor vacuum condition of vacuum chamber for being deposited on substrate is most important.Particularly, right
It is produced in batches in OLED, the cleannes of all vacuum components are all important.Even the surface of electropolishing and other smooth gold
Metal surface for OLED device manufacture for may also be too dirty, and need special cleaning procedure to realize UCV (ultra-clean is true
It is empty).Present disclosure is using the supersonic source in the component (distribution pipe of such as evaporation source) of insertion material sedimentary origin, with from inside
Effectively cleaning member.It can go to decontaminate from such as hollow space of interior welds, fringe region and/or lap
Dye.Cleannes level can be improved significantly, and can improve the quality for the layer being deposited on substrate.This is in vacuum chamber
The service life of production/manufacture OLED device is particularly advantageous in room.
Fig. 1 show according to embodiment as described herein for clean for example in the manufacture of OLED device used in material
Expect the flow chart of the method 100 of the component of sedimentary origin.
Method 100 includes that component is inserted into or is immersed in cleaning solution (frame 110), by supersonic source (such as ultrasonic generator
(sonotrode)) in the inside of insertion part (frame 120), and supersonic source (frame 130) is operated.Component can be improved significantly
The cleannes of (such as distribution pipe of the evaporation source used in OLED manufacture), and can improve using the clean component system of institute
The quality for the OLED device made.
High hydrocarbon (HC) and/or plasticizer cleaning angle value may be implemented (for example, amu=45 is to 100 Hes in present disclosure
For amu=101 to 200), this is beneficial to OLED manufacture.For example, RGA grade B1 or B2 may be implemented:
B1 (purity):
Total desorption includes water, after 1 hour: < 5E-8mbarl/ (s*cm2), or the < 5E- after 10 hours
9mbarl/(s*cm2)
The hydrocarbon of quality <=100, after 10 hours: < 5E-12mbarl/ (s*cm2)
Optional RGA proves amu 1 to 200: first time article cleans must provide (the optional quantity of every batch of)
B2 (purity):
Total desorption includes water, after 1 hour: < lE-8mbarl/ (s*cm2), or after 10 hours or < lE-
9mbarl/(s*cm2)
The hydrocarbon of quality <=100, after 10 hours: < 4E-12mbarl/ (s*cm2)
The hydrocarbon of quality > 100 and quality <=200, after 10 hours: < 3E-13mbarl/ (s*cm2)
It need not carry out the vacuum annealing of (for example, 24 hours) for a long time or be toasted under high temperature (such as 500 DEG C or higher).
Particularly, RGA (residual gas analysis) shows (such as 5 to 10 minutes) and to realize in a short time with reduced cost
High cleanliness level (UCV).Therefore, vacuum condition can be improved and therefore improve the pure of the organic material being deposited on substrate
Degree, so as to improve the service life of manufactured OLED device.
0018 according to some embodiments that can combine with other embodiment as described herein, can operate supersonic source with
Carry out one or more cleaning circulations.One or more cleaning circulations can be carried out up to predetermined lasting time (that is, the predetermined time
Section).Duration, which may be selected so that, can provide such as amu=101 to 200 (300) after completing cleaning process
Amu=(40) 45 to 100 cleaning angle value (using RGA measure).Cleaning angle value " amu " can be defined as point of RGA measurement
Press quality (AMU) and (40) 45 to 100 and 101 to 200 (300).In some embodiments, each cleaning circulation continues
Time can be between 60s and 240s, especially between 100s and 200s, and can be particularly
It is about 240s.
It, can be with repetitive operation supersonic source to execute two or more cleaning circulations, such as three according to some embodiments
A or more (for example, six) cleaning circulation.The duration of each cleaning circulation can range between 60s and 240s
It is interior, especially between 100s and 200s, and particularly from about 240s.In some illustrative embodiments, two
The duration of a or more cleaning circulation can be substantially the same.In other examples embodiment, additional two clear
The duration of clean circulation can be different.For example, the duration can be elongated or shortens during the process of cleaning process.It can
To be sequentially performed two or more cleaning circulations, wherein having interruption between two continuous cleaning circulations.Supersonic source can be with
It opens, and can be closed during interruption during cleaning circulation, for example, using ON/OFF parameter setting.
In some embodiments, generator may be coupled to supersonic source to operate supersonic source.Generator can be with predetermined
Power and/or preset frequency operate supersonic source.Predetermined power can be to be transmitted to from supersonic source super for example under resonance state
The power of cleaning solution around sound source.Preset frequency may be at or close to by supersonic source, the component of material deposition source, tank and/
Or the resonant frequency that cleaning solution limits.
In the exemplary embodiment, supersonic source is configured to supply the predetermined function between 0.2kW and 2kW
Rate, especially between 0.2kW to 1kW, more particularly between 0.3kW and 0.5kW.Preset frequency
It can be between 20kHz and 40kHz, especially between 25kHz and 35kHz, especially in 29kHz
Between 31kHz, and it can be about 29kHz or 30kHz.
According to some embodiments that can be combined with other embodiment as described herein, cleaning solution has at 40 DEG C and 80
(predetermined) temperature between DEG C, particularly between 50 DEG C with 70 DEG C, and can more particularly have
There is about 60 DEG C of temperature.One or more heating devices can be provided to adjust the temperature of cleaning solution.For example, can control one
Or multiple heating devices are to be maintained at predetermined temperature for the temperature of cleaning solution.Cleaning solution (also referred to as " clean solution " or " bath ")
One or more components, such as at least one of surfactant, detergent and water can be contained.For example, cleaning solution can be with
Including one or more organic acids, and can the acid expanding foam solution based on organic acid in particular.
According to some embodiments that can be combined with other embodiment as described herein, method 100 further includes removal work
Skill is with the cleaning solution remaining from component removal.Can using supersonic source cleaning procedure after, especially from cleaning solution and/
Or after tank removal (for example, pull-out) component, it is removed technique.Water can be used from the clear of component removal remnants in removal technique
Clean liquid.For example, removal technique may include DI (deionization) water injection and/or cleaning and/or immersion technique.Additionally or substitute
Ground, method 100 may further include drying process with drying part.Drying process may include heating element.For example, described
Component can be dried in toilet, such as measure for RGA.
In some embodiments, method 100 further includes in the mobile supersonic source of components interior.For example, ultrasound can be moved
Source is to be located in tank and/or part innerside for supersonic source, so that being transferred to power (the i.e. predetermined function in cleaning solution from supersonic source
Rate) it is adjusted or maximizes.Supersonic source can for example in the longitudinal direction of supersonic source (for example, in vertical direction) and/or
It is mobile in transverse direction (for example, in a horizontal direction), to optimize cleaning result.
According to some embodiments that can be combined with other embodiment as described herein, method 100 further includes control bath
The filling of (that is, cleaning solution).For example, can control the filling of bath and/or refill.It can control the fill level of bath, such as
After the cleaning process for completing component and before the cleaning process of another component starts.It can control the filling water of bath
It is flat, so that component to be cleaned is fully immersed in cleaning solution.In other examples, such as in the cleaning for completing component
After journey and before the cleaning process of another component starts, bath can be refilled to compensate the loss of cleaning solution.
In some embodiments, method 100 may include one or more parameters of the group selected from following item composition
Adjustment: the duration of cleaning circulation, the quantity of cleaning circulation, the preset frequency of ultrasound, predetermined power, predetermined amplitude, ultrasound
The position in source, the ON/OFF setting of supersonic source, bath filling, bath temperature (predetermined temperature) and analog.Adjustable one or more
Parameter is to optimize cleaning result.In some embodiments, the chemistry and/or physics product of cleaning solution for example can continuously be controlled
Matter.For example, the cleaning solution of a part can be continuously pumped through device appropriate.Optionally or alternatively, cleaning solution can
To use such as outer pot or reservoir continuously updated.
According to some embodiments that can be combined with other embodiment as described herein, method 100 further includes that operation is another
One supersonic source, such as another ultrasonic generator, another supersonic source are located in tank and cleaning solution and are located in material
Outside the component of sedimentary origin.In other words, supersonic source in addition can be positioned between the inner surface of tank and the outer surface of component.Separately
Outer supersonic source can be used for the outside of cleaning member.In other embodiment, can be other in tank or the outer offer of bath
Supersonic source.For example, other supersonic source may be coupled to the wall of tank.
According to some embodiments that can be combined with other embodiment as described herein, the component of material deposition source is selected from
The group being made of following item: the combination of distribution pipe (for example, titanium distribution pipe or pipeline), evaporator crucible and the above item.For example, material
Sedimentary origin can be evaporation source, be configurable for evaporating the organic material for manufacturing OLED device.
During exemplary cleaning, the component (such as distribution pipe or pipeline) of material deposition source undergoes three cleanings to follow
Ring, each cleaning circulation have the duration of about 140s.Supersonic source is ultrasonic generator, with the frequency of about 29kHz and 40%
Amplitude to 50% operates, and provides the power of 300W to 500W.About 60 DEG C of the temperature that cleaning solution (bath) has.Bath is can be every
The standard detergent refilled after a pipeline.After the ultrasonic clean of 3 × l40s, it will be cleaned with standard DI water injection process
Agent is dried from removal in pipeline and by pipeline in toilet to carry out RGA measurement.RGA is the result shows that the HC limit (limit)
From as little as 1.4 times of 12 demultiplications.Therefore, HC cleannes are increased to about 8 to 9 times.
According to embodiment as described herein, computer journey is can be used in the method for the component for cleaning material sedimentary origin
Sequence, software, computer software product and the controller that is mutually related carry out, and controller can have CPU, memory, user
Interface and tool device is output and input with what the corresponding component of the equipment for handling large-area substrates communicated.
Fig. 2 shows according to the equipment 200 of the component 20 for cleaning material sedimentary origin of embodiment as described herein
Schematic diagram.In some embodiments, equipment 200 is (complete) automatic equipment 200, and the equipment is configured as automatically carrying out clear
Clean process.
Equipment 200 includes the tank 210 for being configured as containing component 20, and is configured as super in the inside of insertion part 20
Sound source 220, especially when component 20 is contained in tank 210.Equipment 200 may include controller 230, and the controller is matched
It is set to the method for carrying out the component for cleaning material sedimentary origin according to present disclosure.
In some embodiments, component 20 be selected from including following item group: distribution pipe (or pipeline), evaporator crucible and with
The combination of upper item.Tank 210, which can be configured as, accommodates distribution pipe and/or evaporator crucible.For example, tank 210 can be configured as appearance
It receives or distribution pipe or evaporator crucible, or can be configured as and accommodate both distribution pipe and evaporator crucible.In latter situation
Under, distribution pipe and evaporator crucible can be separated or are installed together.Exemplary materials sedimentary origin is explained with reference to Fig. 4.
The tank 210 that can be pipeline is configured as accommodating cleaning solution 201, and cleaning solution also referred to as " is bathed " or " cleaning bath ".
Tank 210 can have at least 10 liters, particularly at least 100 liters more particularly at least 1000 liters of volume.In some embodiment party
In formula, tank 210 can have at least height of 1m, and particularly can have the height between 1m and 2m.
In some embodiments, tank 210 can be made of metal, such as steel, steel alloy or aluminium.For example, tank 210 can be DN250 or
DN320 pipeline.
It, can lifting component 20, and then use carrying (handling)/hoisting tool first for cleaning member 20
Component 20 is reduced into (for example, immersion) into tank 210, so that component 20 is fully immersed in cleaning solution 201.It hereafter, can be with
The insertion of supersonic source 220 (for example, reduction) into component 20 and therefore is inserted into tank 210 and cleaning solution 201.In other embodiment party
In formula, component 20 and supersonic source 220 can assemble outside tank 210, and carrying/hoisting tool then can be used and jointly mention
It rises and then reduces (for example, immersion) into tank 210, so that component 20 is fully immersed in cleaning solution 201.
Before dropping to component 20 in tank 210, component 20 can be prepared for carrying out cleaning process.For example, can be with
Precleaning component 20.Supersonic source 220 can be used outer retainer and feel relieved (center) or make relative to component 20 to be cleaned
Spacer between supersonic source 220 and component 20 is felt relieved.For example, supersonic source can be used one or more spacers with
As at least one of under type is felt relieved: in the outside of component 20 and relative to component 20.
Component 20 can have first end and the second end opposite with first end.First end can be component 20
Top side, and the second end can be the bottom side of component 20.In other embodiment, first end can be component 20
Bottom side, and the second end can be the top side of component 20.For example, at least one centring means can be mountable (or being mounted)
To the bottom of distribution pipe.Distribution pipe can be reduced to upside down in tank 210.It particularly, can be in the bottom of distribution pipe
Equipped with opening, supersonic source 220 can be inserted into distribution pipe by the opening.Distribution pipe can have the cross side in distribution pipe
One or more openings (such as nozzle) at face flow into cleaning solution in distribution pipe.Other components may must use liquid
Body filling or filling (plunge).It will be it is particularly advantageous that because the opening of distribution pipe, all in 220 insertion part 20 of supersonic source
Such as nozzle and in the opening of bottom, it is generally too small and enough ultrasonic powers cannot be transmitted on the outside of distribution pipe inside.
Equipment 200 may include the power supply 232 for being configured as operation supersonic source 220.Power supply 232 and controller 230 can be with
It is provided as an entity (" ultrasonic generator ").Power supply 232, which can be configured as, to be provided preset frequency, predetermined power and makes a reservation for
Amplitude is to operate supersonic source 220.Preset frequency, predetermined power, predetermined amplitude and/or (multiple) cleaning circulation duration can
To be referred to as " generator settings ".Generator settings be can choose to optimize cleaning result.
According to some embodiments that can be combined with other embodiment as described herein, supersonic source 220 is ultrasonic generation
Device.Ultrasonic generator is configured as generating ultrasonic vibration and the vibrational energy is applied to cleaning solution.Ultrasonic generator can be with
Including resonating body 222 and the one or more piezoelectric elements 224 for being attached to resonating body 222.Resonating body 222 can be tapered
(tapering) metallic rod.It is vibrated with preset frequency (that is, supersonic frequency) and the alternating current with predetermined amplitude is by power supply 232
It is applied to one or more piezoelectric elements 224.Electric current makes one or more piezoelectric elements 224 expand and shrink.Electric current makes a reservation for
Frequency can be selected as the resonant frequency of ultrasonic generator, therefore entire ultrasonic generator serves as half-wavelength resonator, with
With standing wave extensional vibration under resonant frequency.
Supersonic source 220 (and resonating body 222 of especially supersonic source 220) can have at least length of 0.5m, especially
It is at least 1m, and more particularly at least 1.5m.It, can be with for example, the length of supersonic source 220, the especially length of resonating body 222
Between 0.5m and 2m, particularly between 1m and 1.5m, and about 1.3m more particularly can be,
Such as 1.28 meters.The resonating body 222 of supersonic source 220, especially supersonic source 220 can have the model between 10mm and 50mm
Interior diameter is enclosed, particularly between 20mm and 40mm, and more particularly can be about 30mm.
In some embodiments, the volume of the volume of supersonic source 220, especially resonating body 222 is (for example, be defined as altogether
The height of vibration body multiplies diameter), it can correspond at least the 10% of the volume of the inside of component 20, especially at least 25%, especially
At least 50%, especially at least 75%, and more particularly at least 90%, to limit fill factor.Fill factor can be through selecting
It selects to optimize cleaning result.
According to some embodiments that can be combined with other embodiment as described herein, the equipment includes supersonic source
220 (the first supersonic sources) and it is located in another supersonic source (second ultrasound in tank 210 but outside the component of material deposition source 20
Source) (such as another ultrasonic generator).In other words, supersonic source in addition can be positioned at the inner surface and component of tank 210
Between 20 outer surface.Other supersonic source can be used for the outside of cleaning member 20.In some embodiments, use is identical
Both inner side and outer side of supersonic source (for example, first supersonic source) sequentially cleaning member 20.Provided that other supersonic source,
So tank 210 can be larger, and if only providing supersonic source 220, tank 210 can be smaller.In some embodiments,
Other supersonic source can be fixed to tank 210, and supersonic source 220 is removable.
According to some embodiments that can be combined with other embodiment as described herein, equipment 200 includes one or more
A heating device 240, heating device are configured as cleaning solution 201 being heated to predetermined temperature.Predetermined temperature can 40 DEG C with
Between 80 DEG C, especially between 50 DEG C with 70 DEG C, and it more particularly can be about 60 DEG C.One
Or multiple heating devices 240 can be resistance heater.
According to some embodiments, equipment 200 includes horizon sensor (level sensor), and horizon sensor is configured
For the level for sensing cleaning solution 201.The level of component 20 can be limited by the surface 202 of cleaning solution 201.Controller 230 can be with
It is configured as the filling of control bath (that is, cleaning solution).For example, can control the filling of bath and/or refill, so that being passed by level
The level of sensor sensing corresponds to predeterminated level.Can control the fill level of bath, for example, the cleaning process for completing component it
Afterwards and before the cleaning process for starting another component.It can control the fill level of bath, so that component to be cleaned is complete
It is immersed in cleaning solution entirely, that is, so that whole part is below the surface of cleaning solution 201 202.In other examples, it bathes
It can for example be refilled after the cleaning process for completing component and before the cleaning process for starting another component, to mend
Repay the loss of cleaning solution.
Fig. 3 shows the flow chart of the method 300 for manufacture material sedimentary origin, and the material deposition source is used in substrate
Vacuum deposition is to manufacture OLED device.Method 300 may include the portion for cleaning material sedimentary origin according to present disclosure
The aspect of the method for part.
Method 300 includes in a block 310 by the way that supersonic source to be inserted into the inside of one or more components come cleaning material
One or more components of sedimentary origin, and carry out assembled material sedimentary origin using one or more components in a block 320.It can assemble
Material deposition source in vacuum deposition system to use, such as manufacturing the vacuum deposition system of OLED device.Particularly, method
300 can also include that the material deposition source of assembling is mounted in the vacuum chamber of vacuum deposition system.
Fig. 4 shows the schematic diagram of the material deposition source for manufacturing OLED device according to embodiment as described herein.
The material deposition source can be evaporation source.
Fig. 4 shows the schematic diagram of evaporation source 400, and evaporation source 400 has allocation component 430, evaporator crucible 440 and optional
Former device 420, former device 420 are configured as defining the distribution cone of the material evaporated by evaporation source 400.
Evaporation source 400 may include the allocation component 430 for being connected to evaporator crucible 440.For example, allocation component 430 can be with
Distribution pipe including can be slender pipeline.For example, distribution pipe can be provided with multiple openings and/or spray as described herein
The line source of mouth, opening and/or nozzle are arranged at least one line along the length of distribution pipe.Alternatively, can provide along extremely
The elongated open that a few line extends.For example, elongated open can be slit.According to can be with other implementations as described herein
Some embodiments that mode combines, line can be substantially vertical.
In some embodiments, allocation component 430 may include distribution pipe, and the distribution pipe is set as linear distribution spray
Head, for example, having the multiple openings being arranged in linear distribution showerhead.Spray head as understood herein have housing, in it is absolutely empty
Between or manage, wherein can for example from evaporator crucible 440 provide or guiding material.It is (or elongated narrow that spray head can have multiple openings
Seam) so that the pressure in spray head is higher than the pressure outside spray head.For example, the pressure in spray head can be than the pressure outside spray head up to
Few an order of magnitude.
According to some embodiments that can be combined with any other embodiment as described herein, the length of distribution pipe can be with
At least correspond to the height of substrate to be coated.Particularly, the length of distribution pipe can be longer than the height of substrate to be coated extremely
Few 10% or even 20%.For example, the length of distribution pipe can be 1.3 meters or bigger, such as 2.5 meters or bigger.It therefore, can be with
Uniform deposition at the upper end of substrate and/or the lower end of substrate is provided.According to alternative configuration, allocation component 430 may include
One or more point sources, the point source can be arranged along vertical axis.
According to some embodiments that can be combined with other embodiment as described herein, evaporator crucible 440 and distribution group
Part 430 is in fluid communication, and is located at the lower end of allocation component 430.Particularly, connector, such as flange unit can be provided,
The connector is configured as providing connection between evaporator crucible 440 and allocation component 430.For example, evaporator crucible 440 and point
Distribution assembly 430 can be used as individual unit and provide, evaporator crucible and allocation component can separate and connect at connector or
Assembling, such as the operation of evaporation source 400.Evaporator crucible 440 can be reservoir, for pass through heating evaporation crucible
The material (such as organic material) of 440 evaporations.The material of evaporation can enter allocation component 430, especially at the bottom of distribution pipe
Portion enters, and can be basic in the multiple openings being substantially conducted through in lateral in distribution pipe, such as direction
On the substrate that is vertically oriented.
According to some embodiments, heating unit 410 can be provided to heat allocation component 430, especially distribution pipe.Add
The wall of allocation component 430 can be installed or be attached to hot cell 410.Allocation component 430 can be heated to a temperature, so that by
The steam for the material that evaporator crucible 440 provides is not in the internal condensation of the wall of allocation component 430.Furthermore, it is possible in distribution pipe week
Setting heat shield piece is enclosed, the thermal energy that heating unit 410 provides is reflected back towards distribution pipe.
Evaporation source 400 may include former device 420 (also referred to as " screening arrangement ", " former screening arrangement " or
" heat former "), to define the distribution cone of the material for the evaporation for being supplied to substrate.In addition, former device 420 can be configured
To reduce the heat radiation towards deposition region.In some embodiments, former device 420 can be cold by cooling element 422
But.It for example, cooling element 422 can be installed to the back side of former device 420, and may include leading for cooling fluid
Pipe.
In some embodiments, evaporation source 400 can be configured as to enclose and rotate about the axis, especially during evaporation.
For example, rotating driver can be provided in junction of the source vehicle (source cart) between (not shown) and evaporation source 400.Rotation
Turn driver and can be configured as that evaporation source 400 is made to be arranged essentially parallel to substrate rotating before coated substrate.For OLED device
The various applications of part manufacture include the technique for simultaneously evaporating two or more organic materials.In some embodiments, may be used
With adjacent to providing each other with two or more allocation components, especially distribution pipe and corresponding evaporator crucible.Such evaporation
Source is referred to as evaporation source array, such as wherein evaporates more than one organic material simultaneously.
Fig. 5 is shown according to embodiment as described herein for depositing one or more of such as organic material on substrate
A layer of system 500.System 500 illustrates static substrate and mobile sedimentary origin.However, present disclosure is not limited to
This, and sedimentary origin can be static, and and substrate can move during layer depositing operation.
System 500 is included in vacuum chamber 540 to be cleaned according to embodiment as described herein during manufacture
Material deposition source.System 500 may also include the load locking cavity 501 for being connected to vacuum chamber 540 for filling substrate
It is downloaded in vacuum chamber 540, and is connected to the unloading locking cavity 502 of vacuum chamber 540 for unloading from vacuum chamber 540
The substrate being deposited on one or more layers on substrate.System 500 can be configured as depositing organic material.
Material deposition source can be set on track or linear guide 522.Linear guide 522 can be configured as material
Expect the translational movement of sedimentary origin.It is furthermore possible to also provide the driver of the translational movement for providing material deposition source.Vacuum chamber
540 can be connected to load locking cavity 501 and unloading locking cavity 502 via corresponding gate valve.Gate valve can permit adjacent true
Vacuum sealing between plenum chamber, and can open and close so that substrate and/or mask are into and out vacuum chamber
540。
According to some embodiments that can be combined with any other embodiment as described herein, two substrates are (for example,
One substrate 10A and the second substrate 10B) it can be supported on the corresponding transmission rail in vacuum chamber 540.It is furthermore possible to also provide
Two tracks, for providing mask on the track.Particularly, the coating of substrate may include with corresponding mask (for example,
Edge exclusion mask or shadow mask) masking substrate.According to some embodiments, mask is provided in mask frame 530, such as
The first mask 30A corresponding to first substrate 10A and the second mask 30B corresponding to the second substrate 10B, mask is maintained at
Pre-position.
According to some embodiments that can be combined with other embodiment as described herein, substrate can be by respective carrier branch
Support, the carrier may be coupled to Barebone 550, for example, passing through connecting element 552.To the adjustable substrate of Barebone 550
Position relative to mask.Substrate can be mobile relative to mask, to mention between substrate and mask during material deposits
For being properly aligned with.According to the other embodiment that can be combined with other embodiment as described herein, alternatively or additionally,
The mask frame 530 of mask and/or holding mask may be coupled to Barebone 550.Mask can relative to substrate position or
Both person's mask and substrate can be positioned relative to each other.
According to some embodiments, can be provided arranged to move for material deposition source along the translation of linear guide 522
Dynamic source supporting element 531.Source supporting element 531 can support evaporator crucible 440 and be located at the allocation component of 440 top of evaporator crucible
430.The steam generated in evaporator crucible 440 can move up and move out one or more outlets of allocation component 430.Point
Distribution assembly 430 is configurable for providing the material of evaporation, the plumage of the source material especially evaporated from allocation component 430 to substrate
Stream.
Material deposition source may include former device 420.In addition, material collector unit 560 can be arranged in vacuum chamber
To collect the evaporation emitted from material deposition source (for example, evaporation source) when material deposition source is in rotation position in room 540
Source material.Heating device 570 can be provided, to clean former device 420 for the maintenance position in material deposition source.With go out
The deposition position of mouth towards the allocation component 430 of substrate to be coated is compared, and maintenance position can be the position of material deposition source,
Wherein the outlet of allocation component 430 is in the position of rotation.
Embodiment as described herein can be used for the evaporation on the large-area substrates for example for display manufacturing.Tool
Body, providing the substrate according to used in the structures and methods of embodiment as described herein is large-area substrates.For example, big face
Product substrate or carrier can be for the 4.5th generation (corresponding to about 0.67m2The surface area of (0.73m × 0.92m)), the 5th generation (corresponded to
About 1.4m2The surface area of (1.1m × 1.3m)), the 7.5th generation (correspond to about 4.29m2The surface area of (1.95m × 2.2m)),
In 8.5 generations, (corresponded to about 5.7m2The surface area of (2.2m × 2.5m)) or even the 10th generation (correspond to about 8.7m2(2.85m×
Surface area 3.05m)).Even higher generation (such as the 11st generation and the 12nd generation) and corresponding surface area can be similarly implemented.
The half size in GEN generation can also be provided in OLED display manufacture.
Present disclosure is using the supersonic source in the component (distribution pipe of such as evaporation source) of insertion material sedimentary origin, to have
Component on effect ground cleaning inside.It can be gone from such as hollow space of interior welds, fringe region and/or lap
Depollution.Cleannes level can be improved significantly, and can improve the quality for the layer being deposited on substrate.
Although foregoing teachings are directed to the embodiment of present disclosure, the basic of present disclosure is not being departed from
In the case where range, the other and further embodiment of present disclosure can be designed, and scope of the present disclosure
It is determined by the appended claims.
Claims (15)
1. a kind of method of the component for cleaning material sedimentary origin, comprising:
The component is inserted into cleaning solution；
Supersonic source is inserted into the inside of the component；With
Operate the supersonic source.
2. the method as described in claim 1, wherein the component of the material deposition source is selected from the group being made of following item:
The combination of distribution pipe, evaporator crucible and the above item.
3. method according to claim 1 or 2, wherein supersonic source described in repetitive operation is followed with carrying out two or more cleanings
Ring.
4. method according to any one of claims 1 to 3, wherein each of the two or more cleaning circulations are clear
Clean circulation has the duration between 60 seconds with 240 seconds.
5. method according to any one of claims 1 to 4, wherein the supersonic source provides the model between 0.2kW and 2kW
Enclose interior power.
6. the method as described in any one of claims 1 to 5, wherein the cleaning solution has the model between 50 DEG C and 70 DEG C
Enclose interior temperature.
7. further comprising at least one of the following such as method described in any one of claims 1 to 6:
Removal technique, the removal technique are used for the cleaning solution remaining from component removal；
Drying process, the drying process is for drying the component；With
The mobile supersonic source in the inside of the component.
8. the method as described in any one of claims 1 to 7, further comprises:
Make the supersonic source at least one of as follows centering using one or more spacers: in the outer of the component
Portion and relative to the component.
9. a kind of method for manufacture material sedimentary origin, comprising:
By one or more to clean in the inside for one or more components that supersonic source is inserted into the material deposition source
A component；With
The material deposition source is assembled using one or more of components.
10. a kind of equipment of the component for cleaning material sedimentary origin, comprising:
Tank, the tank are configured as accommodating the component；With
Supersonic source, the supersonic source are configured as in the inside for being inserted into the component.
11. equipment as claimed in claim 10 further comprises another supersonic source in the inner or outer side of the tank,
Described in another supersonic source be configured as cleaning the component from outside.
12. equipment as described in claim 10 or 11, wherein the tank is configured as accommodating the distribution of the material deposition source
At least one of pipe and evaporator crucible.
13. the equipment as described in any one of claim 10 to 12, wherein the tank has at least height of 1m.
14. the equipment as described in any one of claim 10 to 13, wherein the supersonic source be have at least length of 1m and/
Or the ultrasonic generator of the diameter between 10mm and 50mm.
15. the equipment as described in any one of claim 10 to 14 further comprises controller, the controller is configured as
Carry out such as method described in any item of the claim 1 to 8.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2017/067918 WO2019011449A1 (en) | 2017-07-14 | 2017-07-14 | Method for cleaning a component of a material deposition source, method for the manufacture of a material deposition source, and apparatus for cleaning a component of a material deposition source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110352100A true CN110352100A (en) | 2019-10-18 |
Family
ID=59350949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780087719.5A Pending CN110352100A (en) | 2017-07-14 | 2017-07-14 | The method of component for cleaning material sedimentary origin, for the method for manufacture material sedimentary origin and the equipment of the component for cleaning material sedimentary origin |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110352100A (en) |
| WO (1) | WO2019011449A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024137175A1 (en) * | 2022-12-19 | 2024-06-27 | The Coca-Cola Company | High efficiency washing of plastic bottles using ultrasonic energy |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3421939A (en) * | 1965-12-27 | 1969-01-14 | Branson Instr | Method and apparatus for cleaning a pipe with sonic energy |
| DE2546818A1 (en) * | 1975-10-18 | 1977-04-21 | Schoeller & Co Elektrotech | Ultrasonic cleaning plant for pipes - transmitter having stacked vibrators mounted inside pipe for complete bore cleaning |
| US5830127A (en) * | 1996-08-05 | 1998-11-03 | Cybersonics, Inc. | Method and apparatus for cleaning endoscopes and the like |
| WO2002015255A1 (en) * | 2000-08-11 | 2002-02-21 | Chem Trace Corporation | System and method for cleaning semiconductor fabrication equipment parts |
| EP1777589A2 (en) * | 2005-10-24 | 2007-04-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Immersion lithography apparatus and method |
| EP1787598A1 (en) * | 2005-11-21 | 2007-05-23 | Vanguard AG Medical Services for Europe | Method and device for ultrasonically cleaning hollow bodies |
| WO2007059632A1 (en) * | 2005-11-24 | 2007-05-31 | Kks Ultraschall Ag | Ultrasonic cleaning system for hollow bodies |
-
2017
- 2017-07-14 CN CN201780087719.5A patent/CN110352100A/en active Pending
- 2017-07-14 WO PCT/EP2017/067918 patent/WO2019011449A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3421939A (en) * | 1965-12-27 | 1969-01-14 | Branson Instr | Method and apparatus for cleaning a pipe with sonic energy |
| DE2546818A1 (en) * | 1975-10-18 | 1977-04-21 | Schoeller & Co Elektrotech | Ultrasonic cleaning plant for pipes - transmitter having stacked vibrators mounted inside pipe for complete bore cleaning |
| US5830127A (en) * | 1996-08-05 | 1998-11-03 | Cybersonics, Inc. | Method and apparatus for cleaning endoscopes and the like |
| WO2002015255A1 (en) * | 2000-08-11 | 2002-02-21 | Chem Trace Corporation | System and method for cleaning semiconductor fabrication equipment parts |
| EP1777589A2 (en) * | 2005-10-24 | 2007-04-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Immersion lithography apparatus and method |
| EP1787598A1 (en) * | 2005-11-21 | 2007-05-23 | Vanguard AG Medical Services for Europe | Method and device for ultrasonically cleaning hollow bodies |
| WO2007059632A1 (en) * | 2005-11-24 | 2007-05-31 | Kks Ultraschall Ag | Ultrasonic cleaning system for hollow bodies |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019011449A1 (en) | 2019-01-17 |
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