CN110351943A - Surface mount contact part - Google Patents
Surface mount contact part Download PDFInfo
- Publication number
- CN110351943A CN110351943A CN201810305670.2A CN201810305670A CN110351943A CN 110351943 A CN110351943 A CN 110351943A CN 201810305670 A CN201810305670 A CN 201810305670A CN 110351943 A CN110351943 A CN 110351943A
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- Prior art keywords
- conductive
- layer
- surface mount
- contact part
- mount contact
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- 239000004744 fabric Substances 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 32
- 239000011248 coating agent Substances 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 14
- 239000003365 glass fiber Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 171
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 238000012545 processing Methods 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 7
- 239000011135 tin Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- 239000006260 foam Substances 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 229920002323 Silicone foam Polymers 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000004079 fireproofing Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000013514 silicone foam Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
Surface mount contact part.A kind of surface mount contact part includes: conductive elastic layer, which includes multiple sides；With solderable conductive layer.Solderable conductive layer is attached at least one of multiple sides of conductive elastic layer.Solderable conductive layer includes glass fabric.Also disclose other example surfaces installation contact, conductive elastic layer and solderable conductive layer.
Description
Technical field
This disclosure relates to surface mount contact part.
Background technique
This section provides background informations related with the disclosure, are not necessarily the prior art.
Printed circuit board (PCB) generally includes the electrical components of radiated electromagnetic wave, these electromagnetic waves will lead to noise or not wish
The signal of prestige appears in the specific electric installation close in range of radiation electrical components.Therefore, it is not uncommon that for transmitting electricity
Magnetic radiation or circuit vulnerable to electromagnetic radiation provide ground connection, so that it is aggressive to allow to dissipate in the case where not interrupt operation
Charge and electric field.
In order to realize the ground connection, some printed circuit boards are provided with Plastic Package microcircuit (pem) type bracket.Connecing in addition
Ground solution may include the customization contact specially designed for specific application, for example, liner.In this applications, it customizes
Design for example often relies on exact printed circuit board layout and construction.It includes metal spring that other examples, which are grounded solution,
Abutment part (for example, switch jaw contact part) or the hard fastener for using nut.
Summary of the invention
The disclosure provides a kind of surface mount contact part, which includes: conductive elastic layer, the conduction bullet
Property layer includes multiple sides；With the conductive layer that can be welded, which is attached to the conductive elastic layer
At least one side in the multiple side, the conductive layer that can be welded includes glass fabric.
The conductive elastic layer includes the multiple conductive particles spread in the conductive elastic layer.
The conductive elastic layer includes the conductive coating object on a side in its side.
The conductive elastic layer limits one or more openings.
One or more opening includes rectangular aperture.
The surface mount contact part further includes leading between the conductive elastic layer and the conductive layer that can be welded
Electric adhesive layer.
The glass fabric includes multiple glass fibres.
The multiple glass fibre is braided.
The multiple glass fibre includes silica.
The conductive layer that can be welded includes the material that can be welded at least part of the glass fabric.
The material that can be welded includes tin.
The material that can be welded is plated on the glass fabric.
The outer surface of the conductive elastic layer and the distance between the outer surface of conductive layer that can be welded be less than or
Equal to one millimeter.
The conductive layer that can be welded does not include plastics.
Detailed description of the invention
Attached drawing as described herein is only used for illustrating selected embodiment rather than all possible implementation, and is not intended to
It limits the scope of the present disclosure.
Fig. 1 be according to an example embodiment of the disclosure include elastic layer and the solderable layer for being attached to elastic layer
Surface mount contact part front view.
Fig. 2 is the isometric view of the surface mount contact part of Fig. 1.
Fig. 3 be according to another example embodiment include the elastic layer that conductive particle is scattered in conductive elastic layer
With the front view of the surface mount contact part for the solderable layer for being attached to the elastic layer via adhesive.
Fig. 4 be according to another example embodiment include the surface mount contact part with the elastic layer of rectangular aperture
Front view.
Fig. 5 is according to another example embodiment including having the installation of the surface of the elastic layer there are two elliptical openings
The front view of contact.
Fig. 6 is according to another example embodiment including being positioned on PCB, Fig. 1 surface mount contact part
System front view.
Specific embodiment
Example embodiment is more fully described now with reference to attached drawing.
Surface mount contact part is typically soldered to the substrate of the PCB of such as electronic device, to provide electromagnetic shielding, ground connection
Deng.But inventor has realized that at least some conventional surface installation contacts weld during reflow processing at them in this
It may puncture when to substrate.For example, inventor has realized that the conventional surface including fabrics such as plastics, nylon is installed in this
Contact often due to prolonged high temperature and puncture during reflow processing.
In addition, surface mount contact part is usually wrapped up and/or is attached to film fabric when being set in an electronic
Foil (for example, copper foil) layer.For example dimensionally become due to industry requirement using these electronic devices of surface mount contact part
It is small.Certainly, size reduction also forces the contact used in the device to become smaller.But inventor in this have realized that with
Contact size reduces, and being wrapped up surface mount contact part with film fabric and/or contact is attached to layers of foil becomes more difficult.This
Then it will lead to contact fault.
After recognizing drawbacks described above, the present inventor is configured in this exploitation as surface-mount devices (SMD)
The example embodiment of surface mount contact part.Contact can manually and/or using surface mounting technique (SMT) (for example, through
Picked up by such as clamp, pneumatic head, vacuum pick and setting head, sucker and be arranged first-class suitable pickup and setting equipment) it sets
It sets on the surface of the substrate.For example, as described further below, contact can be surface mounted to PCB surface by welding etc.
(for example, solder pad, ground connection trace of PCB etc. for arriving PCB).Further, the example embodiment of surface mount contact part
It can keep with the associated various advantages (for example, good elasticity etc.) of conventional contacts part and associated each with switch jaw contact part
Kind advantage (for example, weldability etc.), while avoiding the unable drawbacks described above for such as welding contact.
According to various aspects, disclosed herein is showing for the surface mount contact part for being adapted to provide for ground connection and/or function of shielding
Example embodiment.Surface mount contact part generally comprises elastic layer (for example, core), which has fixed around flexible core
The conductive layer of position, setting, deposition, coating, plating, package etc. and the conductive particle being arranged in flexible core etc..The contact can
For it is expected application, such as, cabinet (for example, telecommunication cabinet etc.), TV, Medical Devices, server, printing
Machine, computer, networked devices, projector etc..
As described further below, the example embodiment of contact may be used as the earthed circuit of PCB, for example, with
In (for example, as SMD contact etc.) the SMT processing for constructing electronic circuit etc..In these embodiments, contact is by structure
It makes to be installed to the expectation surface of PCB (for example, being mounted directly to PCB surface, being installed to the pad etc. for being coupled to PCB surface),
Contact is electrically connected to PCB (for example, to provide grounding function etc.).To achieve it, surface mount contact part can
To include solderable layer, which is formed by glass fabric, and glass fabric allows contact to be for example attached to by solder
PCB surface.
The example embodiment of surface mount contact part is more fully hereinafter described now with reference to attached drawing.For example, Fig. 1 and Fig. 2
In instantiate the surface mount contact part (for example, surface installation liner) of an example embodiment according to the disclosure, and
Contact generally is installed come indication surface by appended drawing reference 100.As depicted in figs. 1 and 2, surface mount contact part 100 includes
Conductive elastic layer 102 and solderable conductive layer 104.Conductive elastic layer 102 include multiple sides, wherein show side 106,
108,110,112,114.As depicted in figs. 1 and 2, it can weld the side 112 that conductive layer 104 is attached to conductive elastic layer 102.
Solderable conductive layer 104 (and another solderable conductive layer disclosed herein) includes glass fabric.Some
In preferred embodiment, can weld conductive layer (including conductive layer 104) does not include plastics (for example, organic plastic material).Pass through
In this way, can have the temperature tolerance improved than the layer for including the fabric based on plastics by the conductive layer that glass fabric is formed.
The glass fabric of conductive layer 104 may include glass fibre and/or other suitable glass materials.Glass fibre can
Think based on silica.For example, substantially pure silicon dioxide can be used in glass fibre.In other examples, two are based on
The glass fibre of silica may include boroaluminosilicate, with minimum or not boron oxide content soda lime glass, tool
There is the soda lime glass of high oxidation boron content, aluminium lime silica salt, borosilicate glass, there is no magnesia (MgO) and calcium oxide
(CaO) alumina silicate glass, alumina silicate glass with high content of MgO etc., and/or a combination thereof.
In some embodiments, the glass fabric of layer 104 is formed by the multiple glass fibres for working out together.Glass fibers
The braiding structure of dimension provides improved tensile strength compared with other non woven structure.Alternatively, if it is desired to, then glass fibers
Dimension can not be braided.
Conductive layer 104 can also include the weldable material at least part of glass fabric.For example, this is solderable
Material can be in one or more sides of glass fabric, to ensure that layer 104 is conductive and solderable.Weldable material can be with
The side of glass fabric, including such as plating (for example, plating), coating, sputtering is arranged in (for example, film in any appropriate mode
Deposition, vapor deposition etc.) etc..For example, if the conductive layer 104 for including glass fabric is as depicted in figs. 1 and 2 rectangle,
Weldable material can be with plating, coating etc. on all six sides of glass fabric, to ensure that layer 104 is conductive and solderable.
In other embodiments, weldable material can three sides, four sides, five with plating, coating etc. in glass fabric
Side etc..
Weldable material may include one or more suitable metal materials.For example, weldable material may include
Tin, copper, gold, nickel, aluminium, palladium aluminium, silver etc., and/or a combination thereof.In some preferred embodiments, weldable material includes tin.
In some instances, glass fabric can play heat insulator.It can be seen that in conductive layer 104 with solderable
When connecing material and being welded to substrate (as described further below), contact 100 can lead in the case where not breakdown
Cross reflow processing.For example, contact 100 can be subjected in a long time from about 20 degrees Celsius of (rooms during reflow processing
Temperature) up to the various temperature in about 265 degree Celsius ranges.During reflow processing, including its glass fabric layer 104
Contact 100 can bear the temperature of these variations in the case where not breakdown.For example, test has been shown including its glass
The contact 100 of tissue layer 104 can bear reflow temperature about 30 seconds of at least 265 degrees Celsius.It can be seen that contact
100 can be complete by the operation of its structure (for example, in the case that the engagement between layer 102,104 is not failed), performance etc.
Whole property, which is maintained, follows reflow processing.
As described above, it can weld conductive layer 104 and be attached to elastic layer 102.For example, solderable conductive layer 104 wraps
Include multiple sides, wherein side 116,118,120,122,124 is shown in Fig. 1 and Fig. 2.It is real in the example of such as Fig. 1 and Fig. 2
It applies in mode, the side 118 of solderable conductive layer 104 is attached to the side 112 of elastic layer 102.In other example embodiments
In, it can weld any one or more one or more sides that can be attached to elastic layer 102 in the side of conductive layer 104
Face.For example, the side 122 of solderable conductive layer 104 can be attached to the side 108 of elastic layer 102, conductive layer 104 can weld
Side 116 can be attached to side 110 of elastic layer 102, etc..
Solderable conductive layer 104 can be attached to conductive elastic layer 102 in any suitable manner.For example, in Fig. 1 and figure
In 2 specific embodiment, conductive elastic layer 102 is applied directly on solderable conductive layer 104.For example, solderable conductive layer
104 can be arranged on substrate (for example, being welded to PCB as described further below).It then, can be by conductive elastic layer
102 are coated on solderable conductive layer 104, with creation scene forming (FIP) type contact.In such examples, it will can weld
Conductive layer 104 and conductive elastic layer 102 are attached together and do not need adhesive.
In other example embodiments, can weld conductive layer 104 can be to be attached to conductive bullet via electroconductive binder
Property layer 102.For example, Fig. 3 instantiates another surface mount contact part 300, the surface of the surface mount contact part 300 and Fig. 1
It is substantially similar that contact 100 is installed, but the electroconductive binder including welding together conductive elastic layer and solderable conductive layer.
As shown in figure 3, surface mount contact part 300 includes: conductive elastic layer 302, the conductive elastic layer and Fig. 1 and Fig. 2
Conductive elastic layer 102 it is similar；The solderable conductive layer 104 of Fig. 1 and Fig. 2；And conductive adhesion layer 304, in electrically conductive elastic
Between layer 302 and solderable conductive layer 104.
Conductive adhesion layer 304 can be any conjunction that conductive elastic layer 302 and solderable conductive layer 104 are bonded together
Suitable electroconductive binder.This may insure that well leading between elastic layer 302 and conductive layer 104 is presented in surface mount contact part 300
Electrical property.For example, conductive adhesion layer 304 may include the electroconductive binder based on silicone (for example, silicone pressure-sensitive adhesive
(PSA) etc.).In other embodiments, conductive adhesion layer 304 may include with conduction PSA metallization (for example,
Nickel, copper etc.) film double-sided adhesive (for example, one or more items).In yet other embodiment, conductive adhesion layer 304 can
To include adhesive, solvent-based polyester binder, the adhesive based on epoxy resin, hot melt adhesive, a combination thereof etc..
In some example embodiments, conductive elastic layer disclosed herein can limit one or more openings.
For example, Fig. 4 and Fig. 5 instantiate surface mount contact part 400,500, the surface installation of the surface mount contact part and Fig. 1 to Fig. 3
Contact 100,300 is substantially similar, but respectively includes one or more openings in its conductive elastic layer.With other elastic layers
(including elastic layer disclosed herein) is compared, which can reduce the hardness of its each elastic layer, improves compressibility etc..With
Other elastic layers are compared, and hardness, compressibility of raising of the reduction etc. can cause changing between elastic layer and other component
Kind surface contact.
Opening can extend to the other side of elastic layer from the side of elastic layer, so that opening passes completely through elastic layer.?
In other example embodiments, opening can not extend completely through elastic layer.
Specifically and as shown in figure 4, surface mount contact part 400 includes defining 402 He of conductive elastic layer of opening 404
It is attached to elastic layer 402, Fig. 1 and Fig. 2 solderable conductive layer 104.Elastic layer 402 can be applied directly as described above
It overlays on conductive layer 104.Opening 404 can be according to expectation come scale cun, forming etc..For example, opening 404 is rectangular aperture.?
In other example embodiments, other than rectangular aperture 404 or rectangular aperture 404 is replaced, elastic layer 402 can also limit it
He is open and (has identical or different shape).
As shown in figure 5, surface mount contact part 500 include limit two opening 504A, 504B conductive elastic layer 502 with
And the solderable conductive layer 104 and conductive adhesion layer 304 of Fig. 3.In the particular example of Fig. 5, opening 504A, 504B are ellipses
Opening.Alternatively, one or two of opening 504A, 504B can be different shape, size etc..
Any one or more in surface mount contact part disclosed herein can install, be attached and wait until circuit board
The surface of (for example, PCB etc.) or other suitable substrates.For example, Fig. 6 is instantiated including PCB 602 and the figure for being attached to PCB 602
The system 600 of 1 surface mount contact part 100.In the particular implementation of Fig. 6, conductive layer 104 is (for example, at via reflow
Reason) it is welded to PCB 602, so that establishing electric pathway between printed circuit board and conductive elastic layer 102 by conductive layer 104.
In some instances, conductive layer 104 can be soldered to PCB 602 reference potential connection (for example, ground connection trace,
Ground terminal etc.).In such examples, soldering paste, pad etc. can be arranged in reference potential connection.The examples such as soldering paste, pad
It such as may include the metal material of such as tin, copper.Conductive layer 104 can (for example, via SMT machine, artificial etc.) setting welding
On cream, pad etc., and reference potential connection is welded to reflow processing.Alternatively, surface mount contact part 100 can be with another
A kind of suitable mode (for example including via machanical fastener, frictional fit etc.) is attached to PCB 602, is located in PCB 602
It is first-class.
(and/or in surface mount contact part disclosed herein another) can be in addition, surface mount contact part 100
It is positioned between PCB 602 and another component.Such as and as shown in fig. 6, surface mount contact part 100 can be positioned in
Between PCB 602 and a part of EMI shielding part 604.In such examples, the part of shielding part 604 can wrap rubbing board grade
Lid, cover of shielding part etc..Conductive layer 104 positioned (for example, being clipped in) PCB602 reference potential connection with shielding part it
Between when, surface mount contact part 100 can be with auxiliary selenoid interference shielding (including radio shielding).In some instances, surface is pacified
Attaching contact element 100 can assist the heat transmitting between PCB 602 and/or shielding part 604 (and/or another suitable component).
Conductive elastic layer disclosed herein can be formed by any appropriate material.For example, in some embodiments
In, conductive elastic layer can be by foamed material (for example, silica gel foamed material, polymeric-elastomer material, such as open celled foam is in this way
Porous polymeric foam, closed-cell foam, neoprene foams, urethane foam (for example, polyester form, polyether foam,
A combination thereof etc.), polyurethane foam etc.), silicone rubber material etc. formed.In some example embodiments, conductive elastic layer can
To be extruded.
In addition, conductive elastic layer may include the conductive particle (for example, filler etc.) spread in conductive elastic layer, at it
Conductive coating object (for example, metalized film) etc. on one or more in side.It is in elastic layer and/or upper using conductive
Particle, conductive coating object etc. ensure elastic layer conduction.It, can be with as a result, when conductive elastic layer and solderable layer are attached together
Conductive path is formed between the side (for example, elastic layer) of contact and the other side (for example, solderable layer) of contact.
For example, conductive elastic layer 302 shown in Fig. 3 in conductive elastic layer by being scattered with the polymerization bullet of conductive particle 306
Elastomer material is formed.This is sometimes referred to as conductive elastomer (EcE).Conductive particle 306 can be by the various of such as metal material
Different materials are formed.For example, conductive particle 306 can be combined by nickel, copper, silver, gold, aluminium, nickel/graphite, silver/copper combination, silver/aluminium
Combination, silver/nickel combination etc., and/or a combination thereof are formed.Size, shape, density of particle 306 in elastic layer 302 etc. for example may be used
With thermal characteristics based on expectations, conductive characteristic, electromagnetic shielding characteristic, compressibility etc..
In addition, the conductive elastic layer 402 of Fig. 4 on side by having the polymeric-elastomer material shape of conductive coating object 406
At.Specifically, conductive coating object 406 can be arranged on each lateral surface (for example, six sides) of elastic layer 402.At other
In example embodiment, conductive coating object 406 and/or another suitable applicator are (for example, conductive coating object, non-conductive coating
Object etc.) can be on the medial surface of elastic layer 402 for limiting opening 404, conductive coating object 406 can be set in elastic layer 402
Four sides on etc..Conductive coating object 406 can coat, plating (for example, via electroplating processes) etc. elastic layer 402 table
On face.Conductive coating object 406 can be formed by various different metal materials.For example, conductive coating object 406 may include tin, nickel,
Gold, silver, copper etc., and/or a combination thereof.
Although the conductive elastic layer 302,402 of Fig. 3 and Fig. 4 is shown respectively including conductive particle 306 and conductive coating
Object 406, but to those skilled in the art it should be apparent that any of conductive elastic layer disclosed herein can wrap
Include conductive particle, conductive coating object etc..For example, the elastic layer 102 of Fig. 1 and Fig. 2 may include conductive particle, the elastic layer of Fig. 3
302 may include conductive coating object, and the elastic layer 402 of Fig. 4 may include conductive particle etc..
Surface mount contact part can have any appropriate shape.For example, any one surface installation disclosed herein
Contact can have rectangular cross-sectional shape as shown in Figures 1 to 6.Alternatively, any one contact can have trapezoidal
Cross-sectional shape, substantially hourglass cross-sectional shape, triangular cross-sectional shape etc..In this embodiment, under contact
Surface can be generally planar, to be installed to PCB (as described here).
In addition, in some example embodiments, surface mount contact part generally can be fire-retardant.For example, as above
Described, elastic layer (for example, core) may include fire proofing, such as silicone material, silicone foam material etc..In other embodiment party
In formula, elastic layer can by it is non-flame resistant and without add fire retardant (material does not add flame-retardant additive in end product, and
And without addition flame-retardant additive before or during material manufacture) (for example, material not ammonium-containing compound, no matter in manufacture
It is preceding or manufacture during or in the final product addition etc.).In addition, electroconductive binder disclosed herein may include being loaded with
The adhesive (such as without such as bromine, the halogen lamp halogen-free flame retardants of chlorine etc. etc.) of the fire retardant of effect amount.
Metal material disclosed herein may include pure metal material or its alloy.For example, when as described above
When using tin as weldable material, which can be formed by pure tin and/or one or more of tin alloys.
By using any one or more in contact feature disclosed herein, surface mount contact part can have
There is the total occupy-place smaller than conventional contacts part.In some embodiments, any one surface mount contact part can have be less than or
Height equal to one millimeter.Such as and referring to Fig. 2, the height (H) in Z-direction can be less than or equal to one millimeter.Show this
In example, the outer surface (for example, side 122) of the outer surface (for example, side 108) of elastic layer 102 and solderable conductive layer 104 it
Between distance can be less than or equal to one millimeter.In other embodiments, if it is desired to, then any one surface mount contact part
Height can be more than one millimeter.
The height (such as thickness) of conductive elastic layer disclosed herein, conductive layer and/or electroconductive binder, which can be, appoints
What suitable height.For example, conductive layer 104 and electroconductive binder (if being used) respectively can have 0.1 millimeter of thickness.
In other embodiments, the thickness of conductive layer 104 and/or electroconductive binder can be more than or less than 0.1 millimeter.
In addition, elastic layer disclosed herein can have any suitable density.In some embodiments, elastic layer can
With about 2g/cm3Density.In other embodiments, density can be more than or less than 2g/cm3。
In addition, conductive layer disclosed herein can have any suitable weight.For example, conductive layer 104 can have about
115g/m2Weight.In other embodiments, conductive layer 104 can have more than or less than 115g/m2Weight.
In some embodiments, test is shown does not have to glue and conductive elastic layer is attached to solderable conductive layer
Mixture (as described above) can improve the resistance of contact.For example, table 1 below shows the surface peace for Fig. 1
Three exemplary compressions of attaching contact element 100 test and (test 1, test 2 and test 3) and what three were tested is averaged.At this
In exemplary test, contact 100 has 1 mm length (in Y-direction), 2 mm in width (X-directions under its uncompressed state
On) and 1.3 height (in Z-direction).As shown, being connect when applying the mean force of 1.0 newton (N) to contact 100
Contact element is compressed to 1.2 height.In the compression height (CH), contact has 0.2747 Ω of average resistance.Applying 8.2N
Mean force when, contact 100 is compressed to 0.70 millimeter.In the compression height (CH), contact has 0.0150 Ω of resistance.
Table 1
In addition, with including the conventional contacts part phase for wrapping up and/or being attached to the surface mount contact part of layers of foil with film fabric
Than by using any one or more in contact feature disclosed herein, the production of surface mount contact part can be with
It is easier to and more efficient.Compared with conventional contacts part, these production benefits transfer that contact disclosed herein can be provided
Larger flexibility in size.
Example embodiment is provided so that the disclosure will be thorough, and will convey completely model to those skilled in the art
It encloses.Illustrate a large amount of details, the example of such as specific component, device and method, to provide embodiment of the present disclosure
Thoroughly understand.Will be apparent to one skilled in the art is, it is not necessary to use detail, example embodiment can be with
Many different forms should be interpreted to limit the scope of the present disclosure to be embodied without content.It is real in some examples
It applies in mode, is not described in detail known processing, known device structure and well-known technique.
Specific dimension, specific material and/or concrete shape disclosed herein are inherently example, and do not limit this
Scope of disclosure.Here the disclosure for the particular value of given parameters and specific range of values not can be used for disclosed herein show
Example in it is one or more in other values and value range it is exhaustive.Moreover, it is contemplated that the specific ginseng for being used to describe here
Several any two particular values can limit the endpoint for the value range that may be adapted to given parameters (that is, for given parameters
The disclosure of one value and second value can be interpreted open times that can also be used for given parameters between the first and second values
Meaning value).Similarly, it is contemplated that, two or more ranges of the value for parameter are (regardless of this range is nested, overlapping
Or it is different) disclosure the endpoint that disclosed range can be used is come claimed value range all possible combinations packet
Including including.
Terminology used here is merely to describing the purpose of particular example embodiment and being not intended to be limited to.Such as institute here
, singular " one ", "one" and " described " can be intended to also include plural form, unless in addition context clearly refers to
Show.Term " includes " and " having " include, therefore specified institute's narrating characteristic, integer, step, operations, elements, and/or components
Presence, but be not excluded for other one or more features, integer, step, operation, component, assembly unit and/or its group presence or
Increase.Method and step, processing and operation described here is not interpreted to be necessarily required to specific suitable with what is discussed or illustrate
Sequence carries out their execution, except being non-specifically identified as executing sequence.It is also to be understood that can be using alternatively or additionally step.
When element or layer be referred to another element or layer "upper", " being engaged to ", " being connected to " or " being couple to " it is another
When a element or layer, element or layer can be engaged directly on another element or layer, directly, be connected or coupled to another yuan
Part or layer or intervening element or layer may exist.On the contrary, when element is referred to as on " directly existing " another element or layer, " directly
Connect and be engaged to ", " being directly connected to " or " being directly coupled to " another element or when layer, can be deposited without intervening element or layer
?.For describe the relationship between element other words should with same pattern come explain (for example, " ... between " to " straight
Between connecing ... ", " adjacent " to " direct neighbor " etc.).As used herein, term "and/or" includes in association institute's list
One or more any and all combinations.
Although term first, second, third, etc. can be used for describing herein various component, assembly units, region, layer and/or
Part, but these component, assembly units, regions, layers, and/or portions should not be limited by these terms.These terms can be only used for area
Divide a component, assembly unit, region, layer or part and another region, layer or part.Such as " first ", " second " and other
The term of numerical terms does not imply that sequence when for here, unless context clearly indicates.First yuan discussed below as a result,
Part, component, region, layer or part can be referred to as second element, portion without departing from the teaching of example embodiment
Part, region, layer or part.
Spatially opposite term ("inner", "outside", " under ", " lower section ", "lower", " top ", "upper" etc.) at this
In can be used for for convenience one elements or features of description as illustrated in attached drawing to another elements or features relationship.
Spatially opposite term can be intended to other than the orientation described in comprising attached drawing also comprising device in using or operating
Different direction.For example, being described as be in other elements or feature " below " or " under " if overturning the device in attached drawing
Element then will be oriented in other elements or feature " top ".As a result, exemplary term " lower section " may include top and
Both lower section orientation.Device can be oriented otherwise and (be rotated by 90 ° or in other orientation), therefore explained here
Spatially opposite descriptor used.
The previously mentioned of embodiment is provided for purpose of illustration and description.It is not intended to be exhaustive or limits this
It is open.The independent component or feature of particular implementation are typically not limited to the particular implementation, instead in appropriate circumstances
It is interchangeable, and can be used for selected embodiment (even if the not specifically shown or described embodiment).Same content is also
It can be varied in many ways.This variation is not considered as the deviation of the disclosure, and all this modifications are intended to be wrapped
It includes within the scope of this disclosure.
Claims (14)
1. a kind of surface mount contact part, which includes: conductive elastic layer, which includes multiple
Side；With the conductive layer that can be welded, which is attached to the multiple side of the conductive elastic layer
In at least one side, the conductive layer that can be welded includes glass fabric.
2. surface mount contact part according to claim 1, wherein the conductive elastic layer is included in the electrically conductive elastic
The multiple conductive particles spread in layer.
3. surface mount contact part according to claim 1, wherein the conductive elastic layer includes one in its side
Conductive coating object on a side.
4. surface mount contact part according to claim 1, wherein the conductive elastic layer limits one or more open
Mouthful.
5. surface mount contact part according to claim 4, wherein one or more opening is opened including rectangle
Mouthful.
6. surface mount contact part according to claim 1, the surface mount contact part further includes the electrically conductive elastic
Conductive adhesion layer between layer and the conductive layer that can be welded.
7. surface mount contact part according to claim 1, wherein the glass fabric includes multiple glass fibres.
8. surface mount contact part according to claim 7, wherein the multiple glass fibre is braided.
9. surface mount contact part according to claim 8, wherein the multiple glass fibre includes silica.
10. surface mount contact part according to claim 7, wherein the conductive layer that can be welded is included in described
The material that can be welded at least part of glass fabric.
11. surface mount contact part according to claim 10, wherein the material that can be welded includes tin.
12. surface mount contact part according to claim 10, wherein the material that can be welded is plated on described
On glass fabric.
13. surface mount contact part according to claim 1, wherein the outer surface of the conductive elastic layer and the energy
The distance between outer surface of conductive layer enough welded is less than or equal to one millimeter.
14. surface mount contact part according to any one of the preceding claims, wherein the conductive layer that can be welded
It does not include plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810305670.2A CN110351943A (en) | 2018-04-08 | 2018-04-08 | Surface mount contact part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810305670.2A CN110351943A (en) | 2018-04-08 | 2018-04-08 | Surface mount contact part |
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| Publication Number | Publication Date |
|---|---|
| CN110351943A true CN110351943A (en) | 2019-10-18 |
Family
ID=68173063
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810305670.2A Pending CN110351943A (en) | 2018-04-08 | 2018-04-08 | Surface mount contact part |
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|---|---|---|---|---|
| JPH06216167A (en) * | 1993-01-20 | 1994-08-05 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| KR100899953B1 (en) * | 2008-08-05 | 2009-06-01 | 최철수 | A manufacture method of electro conductive grounding gasket |
| CN102428767A (en) * | 2009-05-18 | 2012-04-25 | 斗星产业株式会社 | Conductive Contact Terminal To Be Mounted On A Substrate Surface |
| CN104509231A (en) * | 2012-07-28 | 2015-04-08 | 莱尔德技术股份有限公司 | Metallized film-over-foam contacts |
| CN207947945U (en) * | 2018-04-08 | 2018-10-09 | 莱尔德电子材料(深圳)有限公司 | Surface mount contact part |
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2018
- 2018-04-08 CN CN201810305670.2A patent/CN110351943A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06216167A (en) * | 1993-01-20 | 1994-08-05 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| KR100899953B1 (en) * | 2008-08-05 | 2009-06-01 | 최철수 | A manufacture method of electro conductive grounding gasket |
| CN102428767A (en) * | 2009-05-18 | 2012-04-25 | 斗星产业株式会社 | Conductive Contact Terminal To Be Mounted On A Substrate Surface |
| CN104509231A (en) * | 2012-07-28 | 2015-04-08 | 莱尔德技术股份有限公司 | Metallized film-over-foam contacts |
| CN207947945U (en) * | 2018-04-08 | 2018-10-09 | 莱尔德电子材料(深圳)有限公司 | Surface mount contact part |
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