CN110348071A - Drying and forming-film technique optimization method, device and electronic equipment - Google Patents
Drying and forming-film technique optimization method, device and electronic equipment Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 68
- 238000001035 drying Methods 0.000 title claims abstract description 48
- 238000005457 optimization Methods 0.000 title claims abstract description 40
- 230000002950 deficient Effects 0.000 claims abstract description 83
- 238000013401 experimental design Methods 0.000 claims abstract description 14
- 238000012790 confirmation Methods 0.000 claims abstract description 10
- 238000000151 deposition Methods 0.000 claims abstract description 10
- 239000007792 gaseous phase Substances 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims abstract description 4
- 230000008021 deposition Effects 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 238000004590 computer program Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 238000004062 sedimentation Methods 0.000 claims description 5
- 238000004088 simulation Methods 0.000 claims description 2
- 241000208340 Araliaceae Species 0.000 description 6
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 6
- 235000003140 Panax quinquefolius Nutrition 0.000 description 6
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- 238000005094 computer simulation Methods 0.000 description 2
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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Abstract
The present invention provides a kind of drying and forming-film technique optimization method, device and electronic equipments.The drying and forming-film technique optimization method is applied in chemical gaseous phase deposition technique, the described method comprises the following steps: multiple parameters to be selected to be debugged during confirmation drying and forming-film；It adjusts separately each parameter to be selected and obtains the variable quantity of the fraction defective after adjusting the parameter；Multiple key parameters are selected from the multiple parameter to be selected according to the variable quantity；Successively the multiple key parameter is repeatedly adjusted using method of experimental design and obtains the value of each fraction defective adjusted；Each key parameter adjusted value adjusted obtains the optimal value of each key parameter when adjusting according to the fraction defective obtained after multiple adjustment and every time, so that the fraction defective is minimum.
Description
Technical field
The present invention relates to chemical gaseous phase deposition fields, and in particular to a kind of drying and forming-film technique optimization method, device and electricity
Sub- equipment.
Background technique
At present in the drying and forming-film technique in liquid crystal display panel technique, existing GIN layer grain density is not 0.9, and not
Yield is reaching 0.13% or more.And the yield of chemical gaseous phase deposition CVD requires below 0.11%.And existing particle improves
Means can only improve limited with improvement in short term.
Therefore, the prior art is defective, needs to improve.
Summary of the invention
The present invention provides a kind of drying and forming-film technique optimization method, device and electronic equipment, and drying and forming-film can be improved
Product yield.
The present invention provides a kind of drying and forming-film technique optimization methods, the described method comprises the following steps:
Confirm multiple parameters to be selected to be debugged during drying and forming-film；
It adjusts separately each parameter to be selected and obtains the variable quantity of the fraction defective after adjusting the parameter；
Multiple key parameters are selected from the multiple parameter to be selected according to the variable quantity；
Successively the multiple key parameter is repeatedly adjusted using method of experimental design and obtain every time it is adjusted not
The value of yield；
Each key parameter adjusted value adjusted obtains when adjusting according to the fraction defective obtained after multiple adjustment and every time
To the optimal value of each key parameter, so that the fraction defective is minimum.
In drying and forming-film technique optimization method of the present invention, fraction defective that the basis obtains after repeatedly adjusting with
And each key parameter adjusted value adjusted obtains the optimal value of each key parameter when adjusting every time, so that described bad
The step of rate minimum includes:
Each key parameter adjusted value adjusted is set when adjusting according to the fraction defective obtained after multiple adjustment and every time
It sets and fits corresponding curve graph；
Obtain the optimal value of each key parameter according to the curve graph that different key parameters obtain is adjusted so that it is described not
Yield is minimum.
In drying and forming-film technique optimization method of the present invention, the parameter to be selected includes ambient pressure value, heating
The distance between performance number, the volume value of silane, deposition table and raw material value, sedimentation time value.
It is described to use method of experimental design successively to the multiple in drying and forming-film technique optimization method of the present invention
Key parameter is repeatedly adjusted and includes: the step of obtaining the value of each fraction defective adjusted
The value of one or two key parameters is adjusted every time and obtains the fraction defective obtained after adjustment every time.
In drying and forming-film technique optimization method of the present invention, the song obtained according to different key parameters are adjusted
Line chart obtains the optimal value of each key parameter, so that the step of fraction defective minimum includes:
Each key of minimum fraction defective in the figure is acquired according to the curve graph obtained when adjusting same key parameter
The value of parameter；
Simulation is combined to the value of the multiple each key parameter, to obtain each key when minimum fraction defective
The preliminary optimal value of parameter；
It is finely adjusted according to the multiple preliminary optimal value and each value adjusted is simulated, it is the smallest to obtain
Fraction defective, and record optimal value when obtaining the minimum fraction defective.
A kind of drying and forming-film process optimization device, comprising:
Confirmation module, for confirming multiple parameters to be selected to be debugged during drying and forming-film；
The first adjustment module, for adjusting separately each parameter to be selected and obtaining the fraction defective after adjusting the parameter
Variable quantity；
Selecting module, for selecting multiple key parameters from the multiple parameter to be selected according to the variable quantity；
Second adjustment module, for successively repeatedly being adjusted and being obtained to the multiple key parameter using method of experimental design
To the value of each fraction defective adjusted；
Optimization module, each key parameter adjustment when for adjusting according to the fraction defective obtained after repeatedly adjustment and every time
Adjusted value afterwards obtains the optimal value of each key parameter, so that the fraction defective is minimum.
In drying and forming-film process optimization device of the present invention, the optimization module includes:
Fitting unit, each key parameter adjustment when for adjusting according to the fraction defective obtained after repeatedly adjustment and every time
Adjusted value setting afterwards fits corresponding curve graph；
Optimize unit, the curve graph for obtaining according to the different key parameters of adjustment obtains the optimization of each key parameter
Value, so that the fraction defective is minimum.
In drying and forming-film process optimization device of the present invention, the parameter to be selected includes ambient pressure value, heating
The distance between performance number, the volume value of silane, deposition table and raw material value, sedimentation time value.
In drying and forming-film process optimization device of the present invention, the second adjustment module is used for: adjusting one every time
A or two key parameters value simultaneously obtains the fraction defective obtained after adjustment every time.
A kind of electronic equipment, including processor and memory are stored with computer program, the processing in the memory
Device is excellent for drying and forming-film technique described in any of the above embodiments by calling the computer program stored in the memory
Change method.
From the foregoing, it will be observed that the present invention passes through multiple parameters to be selected to be debugged during confirmation drying and forming-film；It adjusts separately
Each parameter to be selected and the variable quantity for obtaining the fraction defective after adjusting the parameter；According to the variable quantity from it is the multiple to
It selects and selects multiple key parameters in parameter；Repeatedly adjustment is successively carried out simultaneously to the multiple key parameter using method of experimental design
Obtain the value of each fraction defective adjusted；Each crucial ginseng when adjusting according to the fraction defective obtained after multiple adjustment and every time
Number adjusted value adjusted obtains the optimal value of each key parameter, so that the fraction defective is minimum；To realize to drying
The optimization of film forming parameters, to improve yield.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the method flow diagram of the positive drying and forming-film technique optimization method of one of some embodiments of the invention.
Fig. 2 is the structure chart of the positive drying and forming-film process optimization device of one of some embodiments of the invention.
Fig. 3 is the structure chart of the electronic equipment in some embodiments of the invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is itself not indicate discussed various embodiments in order to reach simplified and clear purpose and/or it is arranged
Between relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art
It can be appreciated that the application of other techniques and/or the use of other materials.
Please refer to Fig. 1, one of some embodiments of the invention drying and forming-film technique optimization method, described when Fig. 1
Method the following steps are included:
Multiple parameters to be selected to be debugged during S101, confirmation drying and forming-film.
Wherein, multiple parameter to be selected include but is not limited to ambient pressure value, heating power value, the volume value of silane,
The distance between deposition table and raw material value, sedimentation time value.
S102, it adjusts separately each parameter to be selected and obtains the variable quantity of the fraction defective after adjusting the parameter.
Wherein, which can be the value obtained according to these parameter actual tests adjusted, be also possible to use
The value that computer simulation obtains.
S103, multiple key parameters are selected from the multiple parameter to be selected according to the variable quantity.
Wherein, when the absolute value of variable quantity is greater than preset value, illustrate that the parameter to be selected is key parameter, when variable quantity
When absolute value is smaller, then illustrate the parameter to be selected for not key parameter.Wherein, preset value can be a default ratio of initial value
Example, such as 2%, 3% etc..
S104, successively the multiple key parameter is carried out using method of experimental design (design of experiments)
It repeatedly adjusts and obtains the value of each fraction defective adjusted.
Wherein it is possible to be obtained after adjusting the value of one or two key parameters and each adjustment of acquisition every time bad
Rate.Certainly, which can obtain in the system of being then input to according to actual tests, can also use system mould
It is quasi-, fraction defective adjusted is simulated according to key parameter adjusted.
Each key parameter adjustment adjusted when the fraction defective obtained after the multiple adjustment of S105, basis and each adjustment
Value obtains the optimal value of each key parameter, so that the fraction defective is minimum.
Wherein, step S105 include: S1051, according to obtained fraction defective after repeatedly adjustment and every time adjustment when it is every
The adjusted value setting adjusted of one key parameter fits corresponding curve graph；S1052, it is obtained according to the different key parameters of adjustment
Curve graph obtain the optimal value of each key parameter so that the fraction defective is minimum.Certainly, curve graph therein can adopt
The curve graph is obtained with the approximating method in mathematics in the prior art, the corresponding curve graph of each Adjusted Option.Example
Such as, while A parameter and B parameter are adjusted, and had adjusted repeatedly, by the multiple available curve graph of adjustment.
In some embodiments, step S1052 can be with specifically: according to the curve obtained when adjusting same key parameter
Figure acquires the value of each key parameter of minimum fraction defective in the figure；The value of the multiple each key parameter is carried out
Combine analog, to obtain the preliminary optimal value of each key parameter when minimum fraction defective；According to the multiple preliminary optimal value
It is finely adjusted and each value adjusted is simulated, to obtain the smallest fraction defective, and record and obtain the minimum fraction defective
When optimal value.
From the foregoing, it will be observed that the present invention passes through multiple parameters to be selected to be debugged during confirmation drying and forming-film；It adjusts separately
Each parameter to be selected and the variable quantity for obtaining the fraction defective after adjusting the parameter；According to the variable quantity from it is the multiple to
It selects and selects multiple key parameters in parameter；Repeatedly adjustment is successively carried out simultaneously to the multiple key parameter using method of experimental design
Obtain the value of each fraction defective adjusted；Each crucial ginseng when adjusting according to the fraction defective obtained after multiple adjustment and every time
Number adjusted value adjusted obtains the optimal value of each key parameter, so that the fraction defective is minimum；To realize to drying
The optimization of film forming parameters, to improve yield.
Referring to figure 2., the present invention also provides a kind of drying and forming-film process optimization devices, comprising: confirmation module 201,
One adjustment module 202, selecting module 203, second adjustment module 204 and optimization module 205.
Wherein, which is used to confirm multiple parameters to be selected to be debugged during drying and forming-film；Wherein,
Parameter to be selected includes the distance between ambient pressure value, heating power value, the volume value of silane, deposition table and raw material value, sinks
Product time value.
Wherein, after the first adjustment module 202 is for adjusting separately each parameter to be selected and obtaining the adjustment parameter
Fraction defective variable quantity；Wherein, which can be the value obtained according to these parameter actual tests adjusted, can also
To be the value obtained using computer simulation.
Wherein, which is used to select multiple passes from the multiple parameter to be selected according to the variable quantity
Bond parameter；Wherein, when the absolute value of variable quantity is greater than preset value, illustrate that the parameter to be selected is key parameter, when variable quantity
When absolute value is smaller, then illustrate the parameter to be selected for not key parameter.Wherein, preset value can be a default ratio of initial value
Example, such as 2%, 3% etc..
Wherein, which is used to successively carry out the multiple key parameter using method of experimental design more
Secondary adjustment and the value for obtaining each fraction defective adjusted；The second adjustment module 204 for adjusting one or two every time
The value of a key parameter simultaneously obtains the fraction defective obtained after adjustment every time.Wherein it is possible to adjust one or two keys every time
The value of parameter simultaneously obtains the fraction defective obtained after adjustment every time.Certainly, which can obtain according to actual tests
It is then input in system out, can also be simulated, be simulated according to key parameter adjusted adjusted bad using system
Rate.
Wherein, each pass when which is used for according to the fraction defective obtained after repeatedly adjustment and each adjustment
Bond parameter adjusted value adjusted obtains the optimal value of each key parameter, so that the fraction defective is minimum.Optimization module 205
It include: fitting unit, when for adjusting according to the fraction defective obtained after repeatedly adjustment and every time after each key parameter adjustment
Adjusted value setting fit corresponding curve graph；Optimize unit, the curve graph for obtaining according to different key parameters are adjusted
The optimal value of each key parameter is obtained, so that the fraction defective is minimum.
From the foregoing, it will be observed that the present invention passes through multiple parameters to be selected to be debugged during confirmation drying and forming-film；It adjusts separately
Each parameter to be selected and the variable quantity for obtaining the fraction defective after adjusting the parameter；According to the variable quantity from it is the multiple to
It selects and selects multiple key parameters in parameter；Repeatedly adjustment is successively carried out simultaneously to the multiple key parameter using method of experimental design
Obtain the value of each fraction defective adjusted；Each crucial ginseng when adjusting according to the fraction defective obtained after multiple adjustment and every time
Number adjusted value adjusted obtains the optimal value of each key parameter, so that the fraction defective is minimum；To realize to drying
The optimization of film forming parameters, to improve yield.
The present invention also provides a kind of storage medium, it is stored with computer program in the storage medium, when the calculating
When machine program is run on computers, so that the computer executes method described in any of the above embodiments.
Referring to figure 3., the present invention also provides a kind of electronic equipment, electronic equipment includes processor 301 and memory
302.Wherein, processor 301 and memory 302 are electrically connected.Processor 301 is the control centre of electronic equipment, and utilization is various
The various pieces of interface and the entire electronic equipment of connection, by running or calling the computer being stored in memory 302
Program, and the data being stored in memory 302 are called, the various functions and processing data of electronic equipment are executed, thus right
Electronic equipment carries out integral monitoring.
In the present embodiment, the processor 301 in electronic equipment can be according to following step, will be one or more
The corresponding instruction of the process of computer program is loaded into memory 302, and is stored in memory by processor 301 to run
Computer program in 302, to realize various functions: passing through multiple ginsengs to be selected to be debugged during confirmation drying and forming-film
Number；It adjusts separately each parameter to be selected and obtains the variable quantity of the fraction defective after adjusting the parameter；According to the variable quantity
Multiple key parameters are selected from the multiple parameter to be selected；Using method of experimental design successively to the multiple key parameter into
Row repeatedly adjusts and obtains the value of each fraction defective adjusted；According to the fraction defective and adjustment every time obtained after multiple adjustment
When each key parameter adjusted value adjusted obtain the optimal value of each key parameter so that the fraction defective is minimum.
From the foregoing, it will be observed that the present invention passes through multiple parameters to be selected to be debugged during confirmation drying and forming-film；It adjusts separately
Each parameter to be selected and the variable quantity for obtaining the fraction defective after adjusting the parameter；According to the variable quantity from it is the multiple to
It selects and selects multiple key parameters in parameter；Repeatedly adjustment is successively carried out simultaneously to the multiple key parameter using method of experimental design
Obtain the value of each fraction defective adjusted；Each crucial ginseng when adjusting according to the fraction defective obtained after multiple adjustment and every time
Number adjusted value adjusted obtains the optimal value of each key parameter, so that the fraction defective is minimum；To realize to drying
The optimization of film forming parameters, to improve yield.
It should be noted that those of ordinary skill in the art will appreciate that whole in the various methods of above-described embodiment or
Part steps are relevant hardware can be instructed to complete by program, which can store in computer-readable storage medium
In matter, which be can include but is not limited to: read-only memory (ROM, Read Only Memory), random access memory
Device (RAM, Random Access Memory), disk or CD etc..
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of drying and forming-film technique optimization method is applied in chemical gaseous phase deposition technique, which is characterized in that the method packet
Include following steps:
Confirm multiple parameters to be selected to be debugged during drying and forming-film；
It adjusts separately each parameter to be selected and obtains the variable quantity of the fraction defective after adjusting the parameter to be selected；
Multiple key parameters are selected from the parameter to be selected according to the variable quantity；
Successively the key parameter is repeatedly adjusted using method of experimental design and obtains the value of each fraction defective adjusted；
Each key parameter adjusted value adjusted obtains often when adjusting according to the fraction defective obtained after multiple adjustment and every time
The optimal value of one key parameter, to improve the fraction defective.
2. drying and forming-film technique optimization method according to claim 1, which is characterized in that the basis obtains after repeatedly adjusting
To fraction defective and every time adjustment when each key parameter adjusted value adjusted obtain the optimal value of each key parameter, with
The step of improving the fraction defective includes:
Each key parameter adjusted value setting adjusted is quasi- when adjusting according to the fraction defective obtained after multiple adjustment and every time
Close out corresponding curve graph；
The optimal value of each key parameter is obtained according to the curve graph that different key parameters obtain is adjusted, it is described bad to improve
Rate.
3. drying and forming-film technique optimization method according to claim 1, which is characterized in that the parameter to be selected includes environment
The distance between atmospheric pressure value, heating power value, the volume value of silane, deposition table and raw material value, sedimentation time value.
4. drying and forming-film technique optimization method according to claim 1, which is characterized in that it is described using method of experimental design according to
It is secondary that the multiple key parameter is repeatedly adjusted and includes: the step of obtaining the value of each fraction defective adjusted
The value of one or two key parameters is adjusted every time and obtains the fraction defective obtained after adjustment every time.
5. drying and forming-film technique optimization method according to claim 2, which is characterized in that described according to the different keys of adjustment
The curve graph that parameter obtains obtains the optimal value of each key parameter, and to improve fraction defective the step of includes:
The each of minimum fraction defective in the curve graph figure is acquired according to obtained curve graph when adjusting same key parameter
The value of key parameter；
Simulation is combined to the value of the multiple each key parameter, to obtain each key parameter when minimum fraction defective
Preliminary optimal value；
It is finely adjusted according to the multiple preliminary optimal value and each value adjusted is simulated, it is the smallest bad to obtain
Rate, and record optimal value when obtaining the minimum fraction defective.
6. a kind of drying and forming-film process optimization device characterized by comprising
Confirmation module, for confirming multiple parameters to be selected to be debugged during drying and forming-film；
The first adjustment module, for adjusting separately each parameter to be selected and obtaining the fraction defective after adjusting the parameter to be selected
Variable quantity；
Selecting module, for selecting multiple key parameters from the multiple parameter to be selected according to the variable quantity；
Second adjustment module, it is every for successively repeatedly being adjusted and being obtained to the multiple key parameter using method of experimental design
The value of secondary fraction defective adjusted；
Optimization module, each key parameter is adjusted when for adjusting according to the fraction defective obtained after repeatedly adjustment and every time
Adjusted value obtains the optimal value of each key parameter, to improve the fraction defective.
7. drying and forming-film process optimization device according to claim 6, which is characterized in that the optimization module includes:
Fitting unit, each key parameter is adjusted when for adjusting according to the fraction defective obtained after repeatedly adjustment and every time
Adjusted value setting fits corresponding curve graph；
Optimizing unit, the curve graph for being obtained according to the different key parameters of adjustment obtains the optimal value of each key parameter, with
Improve the fraction defective.
8. drying and forming-film process optimization device according to claim 6, which is characterized in that the parameter to be selected includes environment
The distance between atmospheric pressure value, heating power value, the volume value of silane, deposition table and raw material value, sedimentation time value.
9. drying and forming-film process optimization device according to claim 6, which is characterized in that the second adjustment module is used
In: the value of one or two key parameters is adjusted every time and obtains the fraction defective obtained after adjustment every time.
10. a kind of electronic equipment, which is characterized in that including processor and memory, computer journey is stored in the memory
Sequence, the processor require 1 to 5 by calling the computer program stored in the memory, for perform claim
Drying and forming-film technique optimization method described in one.
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| US20090306807A1 (en) * | 2008-06-09 | 2009-12-10 | International Business Machines Corporation | Multidimensional process window optimization in semiconductor manufacturing |
| CN103472397A (en) * | 2013-08-09 | 2013-12-25 | 江苏欧力特能源科技有限公司 | Key parameter robust identification method in lead acid battery model empirical formula |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252097A (en) * | 2007-02-23 | 2008-08-27 | 台湾积体电路制造股份有限公司 | Improved system and method for optical key dimension measurement accuracy |
| US20090306807A1 (en) * | 2008-06-09 | 2009-12-10 | International Business Machines Corporation | Multidimensional process window optimization in semiconductor manufacturing |
| CN103472397A (en) * | 2013-08-09 | 2013-12-25 | 江苏欧力特能源科技有限公司 | Key parameter robust identification method in lead acid battery model empirical formula |
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