CN110344089A - A kind of gold sodium sulfide plating solution and its electro-plating method - Google Patents
A kind of gold sodium sulfide plating solution and its electro-plating method Download PDFInfo
- Publication number
- CN110344089A CN110344089A CN201910562116.7A CN201910562116A CN110344089A CN 110344089 A CN110344089 A CN 110344089A CN 201910562116 A CN201910562116 A CN 201910562116A CN 110344089 A CN110344089 A CN 110344089A
- Authority
- CN
- China
- Prior art keywords
- gold
- plating solution
- sodium sulfide
- gold sodium
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Abstract
A kind of gold sodium sulfide plating solution and its electro-plating method, the present invention relates to gold plating liquid field, cyaniding craft of gilding is replaced to find a kind of gold plating liquid stable without cyanide ion, property, reduces the harm to environment and operator, plating solution chemical physical property is stablized simultaneously, can satisfy transport and storage.The present invention proposes that a kind of cyanogen-less gold liquid, the gold sodium sulfide plating solution include sulfurous acid gold salt, complexing agent, conductive agent, electric current stabilizer, buffer solution.The beneficial effects of the present invention are: the gold ion in solution is more stable, plating solution storage time is longer；Brightener is added in composition makes gold-plated layer surface more careful smooth, and gap is reduced, and Gold plated Layer surface gloss is more preferable；Dispersing agent is added in composition, bath stability, good dispersion, uniformity is good, and cathode efficiency is high, and coating good welding performance, corrosion resistance is good, and binding force is good.
Description
Technical field
The present invention relates to a kind of gold sodium sulfide plating solutions, be related to gold plating liquid field, and in particular to a kind of gold sodium sulfide
Gold plating liquid composition and its application method.
Technical background
Fitting has golden yellow metal luster good, and hardness is low, and ductility is good, and chemical property is stablized, conductive, hot good,
Therefore it is widely used in the fields such as electric appliance, plug receptacle, circuit plate face, decoration.The storage of gold in the world is limited, is rare money
Source generallys use plating gold process in use to obtain the excellent properties of metallic gold.
In electroplating process, golden elementary process are as follows: it is that monovalence is golden that the gold of trivalent, which obtains two electron reductions, one
It is elemental gold that valence gold obtains an electron reduction again.In the presence of no complexing stabilizer, monovalence gold is easy gold ion
Disproportionated reaction occurs, cannot be stable in the presence of among solution；Comparatively, trivalent gold is more stable compared with monovalence gold.Among solution,
Due to the presence of complexing agent, tervalence gold ion has higher reduction potential, and coating Jin Jing's grain of acquisition is more careful close, simultaneously
Due to current potential height, it is easy to be reduced to elemental gold, monovalence gold ion forms monovalence gold compound and is difficult to be formed, therefore can obtain purer
The coat of metal.And common complex compound is cyanide ion.It is common mature plating gold process that cyaniding is gold-plated, wherein cyanogen root from
Son is very strong with the complexing power of monovalence gold ion, occupies key player position always in metal electroplating process.Due to cyaniding
Object toxicity is huge, can be entered by alimentary canal, respiratory tract and skin in vivo, and cryanide ion is precipitated after entering in vivo in cyanide, with
The ferric iron of cell mitochondrial internal oxidition type cytochrome oxidase combines, and prevents the ferric iron back in oxidizing ferment, interferes thin
Born of the same parents' eupnea, histocyte cannot utilize oxygen, cause histanoxia, body is caused to fall into interior smother.This causes in life
During production, transport, blowdown etc. also gradually eliminate it is this there are the great person, the production technology of Environmental security hidden danger, therefore
Exploitation cyanogen-less gold liquid has been an inexorable trend of industry, and after cyanide, the biggest problem that gold plating liquid faces is just
It is stability.
Non- cyanogen gold salts many at present is mostly trivalent gold, such as common gold trichloride, aluminium alloy hydrochlorate etc., in addition to matching
Because the reason of generating gas reaches reaction in chemical gilding solution there are outside certain operational risk during setting
Potential, need to be added more reducing agents, one impurity is more introducing, and the difficulty for obtaining pure gold plate is bigger, two, add
Enter more reducing agent, be easy to happen disproportionated reaction, is unfavorable for the long-term preservation of plating solution.In other words, substitution pollution, harmfulness compared with
The key of big cyanide ion gold plating liquid is the substance substitution cyanide ion that finds one kind and can be complexed with gold ion, while again
Meet certain potential, electric conductivity, stability.
Summary of the invention
Replace cyaniding craft of gilding to find a kind of gold plating liquid stable without cyanide ion, property, reduce to environment and
The harm of operator, while plating solution chemical physical property is stablized, and can satisfy transport and storage.The present invention proposes a kind of no cyanogen
Gold plating liquid, specially gold sodium sulfide plating solution.The gold sodium sulfide plating solution include sulfurous acid gold salt, complexing agent, conductive agent,
Electric current stabilizer, buffer solution.Gold ion in the composition exists in the form of sulfurous acid gold salt, with its in composition
The complexing of his ingredient, it is in stable condition, so that the storage cycle of plating solution is long, the stoste of cylinder Storage period under conditions of room temperature sealing is not opened
At 12 months or more.
Technical solution provided by the invention is as follows:
A kind of gold sodium sulfide plating solution, the gold sodium sulfide plating solution include
Gold salt, sulfurous acid gold salt 8-15g/L；
Main complexing agent, preferably anhydrous sodium sulfite (chemistry is pure): ammonium sulfite, mass ratio=5:1,70-100g/L；Second
Complexing agent, preferably dipotassium hydrogen phosphate (chemistry is pure): potassium citrate (chemistry is pure) mass ratio=2.0-2.5:1,10-30g/L；
Electric current stabilizer, organic aldehyde material: alcohol ethers mass ratio=1:1,1-5g/L；
PH buffer, preferred boric acid-borax buffer solution, mass ratio=6.5-7.2:1,0.2M borate, 30-50g/
L；
Antioxidant, three ammonium of optimization citric acid, 0.06-0.1g/L；
Dispersing and disintegrating agent, preferably polyoxyethylene aliphatic alcohol ether 1-3g/L；
Screening agent, preferably EDTA-2Na: triethanolamine (chemistry is pure), mass ratio=3:1,20-30g/L；
Brightener, preferably betanaphthol ethoxylate, 0.5-1.5g/L.
Second object of the present invention is to provide a kind of electro-plating method of gold sodium sulfide plating solution, wherein Engineering operation work
Skill parameter is as follows:
50-60 DEG C of temperature
PH value 7.8-8.5
Deposition rate 80-150mg/Amin
Anode cathode quantity (area) ratio >=1:1
Bath filter stirring frequency filters 4-6 times per hour, uses filter element filtering aperture≤1.5 μm.
The beneficial effects of the present invention are:
Gold sodium sulfide plating solution is formed by the comprehensive function between sulfurous acid gold salt, stabilizer and other compositions
Stable complex ion cluster, so that the gold ion in solution is more stable, plating solution storage time is longer, does not open cylinder stoste normal
Energy storage time was more than 12 months under warm air-proof condition；Brightener is added in composition makes gold-plated layer surface more careful flat
Whole, gap is reduced, and Gold plated Layer surface gloss is more preferable；It is added to dispersing agent in composition, bath stability, good dispersion,
Even property is good, and cathode efficiency is high, and coating good welding performance, corrosion resistance is good, and binding force is good.
The gold-plated ideal substitute of alternative cyanide, meets environment-protection electroplating requirement, is satisfied with electronic communication industry extensively
The gold-plated demand of component, applied to the surface gold-plating of copper, nickel and silver-based material, ceramic ornament, spectacle frame material are gold-plated, use sulfurous
Hydrochlorate is gold-plated, and coating light is careful, is firmly combined.
Detailed description of the invention
Fig. 1 is that inventive formulation composition obtains gold plate in atomic force microscopy diagram；
Fig. 2 is the scanning figure of control group workpiece.
Specific embodiment
The gold-plated composition of sulphite includes:
Gold salt sulfurous acid gold salt 10g/L；
Main complexing agent anhydrous sodium sulfite (chemistry is pure): ammonium sulfite, mass ratio=5:1,80g/L；
Second complexing agent dipotassium hydrogen phosphate (chemistry is pure): potassium citrate (chemistry is pure), mass ratio=2.4:1,15g/L；
The organic aldehyde material of electric current stabilizer: alcohol ethers select furfural: cyclohexanediol monomethyl ether, mass ratio=1:1,2g/L；
PH buffer boric acid-borax buffer solution, mass ratio=6.6:1,0.2M borate, 40g/L；
Antioxidant Triammonium citrate, 0.06-0.1g/L；
Dispersing and disintegrating agent polyoxyethylene aliphatic alcohol ether 1-3g/L；
Screening agent EDTA-2Na: triethanolamine (chemistry is pure), mass ratio=3:1,20-30g/L；
Brightener betanaphthol ethoxylate, 0.5-1.5g/L.
It is electroplated using above-mentioned electroplate liquid, wherein Engineering operation technological parameter
55 DEG C of temperature；
PH value 8.0；
Deposition rate 120mg/Amin；
Anode cathode ratio=2:1；
Bath filter stirring frequency filters 5 times per hour, and filter core uses 1 μm of pore size filter.
First: being electroplated using above-mentioned technique, as experimental group, experimental group workpiece is obtained, in addition, using commercially available non-cyanide plating
Golden liquid (gold trichloride) carries out identical plating using identical method, and other than plating solution is different, other parameters are all the same,
Control group workpiece is obtained, following experimental verification is done to the two:
(1) surface topography map of the control group workpiece and experimental group workpiece come out respectively to plating is observed, and can visually be seen
It is compared out with control group workpiece, the layer gold surface of experimental group workpiece is more careful, smooth, uniform, control group workpiece surface gold
Coating is rougher.
(2) furthermore, to control group workpiece and experiment then workpiece surface progress microstructure observation, equipment: Brooker AFM is surveyed
Examination, surface sweeping range: 50um, scan frequency: 0.8HZ pixel: 256 × 256, Fig. 1 are the scanning figure of experimental group workpiece, and Fig. 2 is pair
According to the scanning figure of group workpiece.
It is showed under an atomic force microscope from figure 1 it appears that obtaining gold plate using inventive formulation composition
Graininess, particle size distribution is more uniform, and crystalline state is good, and crystal grain is relatively flat, and for entire surface at planar, layer gold is layer
Shape crystallization.
From figure 2 it can be seen that the gold plate obtained using commercially available cyanogen-less gold liquid (gold trichloride) is in atomic force microscopy
Under mirror, gold plate surface does not form apparent roundlet grain particles, bonds and is covered on bottom plate between entire Jin Jing's grain, there is height
Low fluctuating drop, gold are column crystallizations, have notable difference with undesirable golden face.
Second: storage test verifying is carried out to liquid medicine
Gold plating liquid in above-described embodiment is contained in beaker, preservative film covering prevents the impurity such as dust from entering body
System, but do not completely cut off air, it is endless hermetically sealed, it is put into stirrer stirring, is placed under room temperature environment, avoids strong light direct beam, is seen daily
Examine its situation of change.Gold plating liquid stand 20 days after macroscopic appearance color change, the present invention in gold plating liquid place 20 days after, face
Color does not have significant change, is clear, colorless, without precipitating or solid suspension, solution clarification in solution.
After commercially available gold plating liquid (gold trichloride) stands 20 days, solution colour turns yellow, and has brown color precipitating to generate in solution.
Because the inoxidizability of commercially available gold plating liquid (gold trichloride) solution is relatively low, initial concentration of sodium sulfite is high (about 120g/L), puts
Sodium sulfite oxidation by air is sodium sulphate after setting a period of time, loses complexing power, and solution gold is precipitated.
It is to sum up compared with existing technology, gold plating liquid and the workpiece impact of performance comparison provided by the invention, in the present invention
Gold plating liquid has better stability, can storage time it is more long, the test of the binding force of workpiece coating is better than commercially available.
The Comprehensive Correlation of the two is as shown in the table:
Claims (10)
1. a kind of gold sodium sulfide plating solution, which is characterized in that the gold sodium sulfide plating solution includes
Sulfurous acid gold salt 8-15g/L；
Complexing agent 80-130g/L；
Electric current stabilizer 1-5g/L；
PH buffer 30-50g/L；
Antioxidant 0.06-0.1g/L；
Dispersing and disintegrating agent 1-3g/L；
Screening agent 20-30g/L.
2. gold sodium sulfide plating solution as described in claim 1, which is characterized in that the gold sodium sulfide plating solution further includes having
Brightener 0.5-1.5g/L.
3. gold sodium sulfide plating solution as described in claim 1, which is characterized in that the complexing agent includes 70-100g/L
Main complexing agent and 10-30g/L the second complexing agent.
4. gold sodium sulfide plating solution as claimed in claim 3, which is characterized in that the main complexing agent be include mass ratio
For the anhydrous sodium sulfite and ammonium sulfite of 5:1.
5. gold sodium sulfide plating solution as claimed in claim 4, which is characterized in that second complexing agent be include quality
Than for (2.0-2.5): 1 dipotassium hydrogen phosphate and potassium citrate.
6. gold sodium sulfide plating solution as described in claim 1, which is characterized in that the electric current stabilizer be include quality
Than the organic aldehyde material and alcohol ethers for 1:1.
7. gold sodium sulfide plating solution as described in claim 1, which is characterized in that the antioxidant is Triammonium citrate.
8. gold sodium sulfide plating solution as described in claim 1, which is characterized in that the dispersing and disintegrating agent is polyoxyethylene rouge
Fat alcohol ether.
9. gold sodium sulfide plating solution as described in claim 1, which is characterized in that the screening agent is that mass ratio is 3:1's
EDTA-2Na and triethanolamine.
10. a kind of electro-plating method of gold sodium sulfide plating solution as claim in any one of claims 1 to 9, feature exist
In the plating is electroplated using following technical parameter:
50-60 DEG C of temperature；
PH value 7.8-8.5；
Deposition rate 80-150mg/Amin；
Anode cathode quantitative proportion >=1:1；
Bath filter stirring frequency filters 4-6 times per hour, uses filter element filtering aperture≤1.5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910562116.7A CN110344089B (en) | 2019-06-26 | 2019-06-26 | Gold sodium sulfite plating solution and electroplating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910562116.7A CN110344089B (en) | 2019-06-26 | 2019-06-26 | Gold sodium sulfite plating solution and electroplating method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110344089A true CN110344089A (en) | 2019-10-18 |
| CN110344089B CN110344089B (en) | 2021-11-09 |
Family
ID=68183202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910562116.7A Active CN110344089B (en) | 2019-06-26 | 2019-06-26 | Gold sodium sulfite plating solution and electroplating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110344089B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110699720A (en) * | 2019-10-30 | 2020-01-17 | 深圳市金百泰珠宝实业有限公司 | Gold electroforming solution, preparation method of gold electroforming solution and electroforming method |
| CN110699713A (en) * | 2019-11-21 | 2020-01-17 | 长春黄金研究院有限公司 | Cyanide-free gold alloy electroforming solution and using method thereof |
| CN111411376A (en) * | 2020-03-09 | 2020-07-14 | 中国工程物理研究院激光聚变研究中心 | Electroplating solution and electroplating method for cyanide-free sulfite system |
| CN113046790A (en) * | 2021-02-04 | 2021-06-29 | 德诚珠宝集团有限公司 | Electroforming liquid for gold cyanide-free electroforming process and electroforming process thereof |
| CN113122890A (en) * | 2021-04-19 | 2021-07-16 | 深圳市缤纷珠宝开发有限公司 | Cyanide-free alkaline gold plating solution and electroplating method thereof |
| CN113403652A (en) * | 2021-06-17 | 2021-09-17 | 深圳市联合蓝海黄金材料科技股份有限公司 | Protective film electrolyte, gold-plated silver ornament and preparation method thereof |
| CN114836794A (en) * | 2021-06-25 | 2022-08-02 | 深圳市铭轩珠宝首饰有限公司 | Gold-copper alloy electroforming process and application thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5439326A (en) * | 1977-09-02 | 1979-03-26 | Inoue Japax Res Inc | Electrolyte |
| CN1561407A (en) * | 2001-08-24 | 2005-01-05 | 法国梅塔勒科技公司 | Electrolyte tank for electrochemical deposition of gold and its alloys |
| CN101198721A (en) * | 2005-06-16 | 2008-06-11 | 恩伊凯慕凯特股份有限公司 | Electroless gold plating liquid for forming gold plating film for wire bonding |
| CN101293852A (en) * | 2007-04-03 | 2008-10-29 | 罗门哈斯电子材料有限公司 | Metal plating compositions and methods |
| JP2011012314A (en) * | 2009-07-02 | 2011-01-20 | Ne Chemcat Corp | Gold plating bath for forming electrode and method for forming electrode by using the same |
| CN105112953A (en) * | 2015-09-17 | 2015-12-02 | 深圳市瑞世兴科技有限公司 | Cyanide-free gold plating solution |
| CN105386048A (en) * | 2015-11-26 | 2016-03-09 | 深圳市瑞世兴科技有限公司 | Gold plating method for nanosilicon dioxide-epoxy resin composite material |
| CN108441902A (en) * | 2018-06-26 | 2018-08-24 | 厦门大学 | Monovalence gold cyanogen-less gold plating solution based on the compound coordination of alkaloid and its application |
-
2019
- 2019-06-26 CN CN201910562116.7A patent/CN110344089B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5439326A (en) * | 1977-09-02 | 1979-03-26 | Inoue Japax Res Inc | Electrolyte |
| CN1561407A (en) * | 2001-08-24 | 2005-01-05 | 法国梅塔勒科技公司 | Electrolyte tank for electrochemical deposition of gold and its alloys |
| CN101198721A (en) * | 2005-06-16 | 2008-06-11 | 恩伊凯慕凯特股份有限公司 | Electroless gold plating liquid for forming gold plating film for wire bonding |
| CN101293852A (en) * | 2007-04-03 | 2008-10-29 | 罗门哈斯电子材料有限公司 | Metal plating compositions and methods |
| JP2011012314A (en) * | 2009-07-02 | 2011-01-20 | Ne Chemcat Corp | Gold plating bath for forming electrode and method for forming electrode by using the same |
| CN105112953A (en) * | 2015-09-17 | 2015-12-02 | 深圳市瑞世兴科技有限公司 | Cyanide-free gold plating solution |
| CN105386048A (en) * | 2015-11-26 | 2016-03-09 | 深圳市瑞世兴科技有限公司 | Gold plating method for nanosilicon dioxide-epoxy resin composite material |
| CN108441902A (en) * | 2018-06-26 | 2018-08-24 | 厦门大学 | Monovalence gold cyanogen-less gold plating solution based on the compound coordination of alkaloid and its application |
Non-Patent Citations (1)
| Title |
|---|
| 张允诚 著: "《电镀手册》", 31 January 2007, 国防工业出版社 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110699720A (en) * | 2019-10-30 | 2020-01-17 | 深圳市金百泰珠宝实业有限公司 | Gold electroforming solution, preparation method of gold electroforming solution and electroforming method |
| CN110699713A (en) * | 2019-11-21 | 2020-01-17 | 长春黄金研究院有限公司 | Cyanide-free gold alloy electroforming solution and using method thereof |
| CN111411376A (en) * | 2020-03-09 | 2020-07-14 | 中国工程物理研究院激光聚变研究中心 | Electroplating solution and electroplating method for cyanide-free sulfite system |
| CN113046790A (en) * | 2021-02-04 | 2021-06-29 | 德诚珠宝集团有限公司 | Electroforming liquid for gold cyanide-free electroforming process and electroforming process thereof |
| CN113122890A (en) * | 2021-04-19 | 2021-07-16 | 深圳市缤纷珠宝开发有限公司 | Cyanide-free alkaline gold plating solution and electroplating method thereof |
| CN113122890B (en) * | 2021-04-19 | 2022-06-10 | 深圳市缤纷珠宝开发有限公司 | Cyanide-free alkaline gold plating solution and electroplating method thereof |
| CN113403652A (en) * | 2021-06-17 | 2021-09-17 | 深圳市联合蓝海黄金材料科技股份有限公司 | Protective film electrolyte, gold-plated silver ornament and preparation method thereof |
| CN114836794A (en) * | 2021-06-25 | 2022-08-02 | 深圳市铭轩珠宝首饰有限公司 | Gold-copper alloy electroforming process and application thereof |
| CN114836794B (en) * | 2021-06-25 | 2024-01-30 | 深圳市铭轩珠宝首饰有限公司 | Gold-copper alloy electroforming process and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110344089B (en) | 2021-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110344089A (en) | A kind of gold sodium sulfide plating solution and its electro-plating method | |
| CN107829116B (en) | Cyanide-free alkaline copper plating electroplate liquid | |
| TWI409367B (en) | Electrolytic gold plating and the use of its gold film | |
| CN108441902B (en) | Monovalent gold cyanide-free gold-plating electroplating solution based on alkaloid composite coordination and application thereof | |
| CN107841771A (en) | It is a kind of based on the non-cyanide plating silvering solution composition of complexing ligands system and its application | |
| EP3725920A1 (en) | Trivalent chromium plating solution and method for chromium-plating using same | |
| Nagai et al. | Relationship between film composition and microhardness of electrodeposited Ni–W–B films prepared using a citrate–glycinate bath | |
| CN103469264A (en) | Method for preparing Au-Sn alloy coating with nanocrystalline structure by use of electroplating deposition | |
| EP3159435B1 (en) | Additive for silver palladium alloy electrolytes | |
| CN113930812B (en) | Tin plating liquid and tin plating method for chip electronic component | |
| DE60202378T2 (en) | ELECTROLYTIC BATH FOR THE ELECTROCHEMICAL SEPARATION OF GOLD AND GOLD ALLOYS | |
| CN106567109B (en) | Cyanide-free silver plating electroplating solution and electroplating method thereof | |
| CN102732918B (en) | A kind of gold-tin eutectic solder (AuSn20) electroplate liquid and preparation method | |
| CN110219026A (en) | A kind of alkaline non-cyanide brush plating liquor of polynary coordination system and preparation method thereof | |
| EP2730682B1 (en) | Alkaline, cyanide-free solution for electroplating of gold alloys, a method for electroplating and a substrate comprising a bright, corrosion-free deposit of a gold alloy | |
| Ding et al. | Effects of four N-based additives on imitation gold plating | |
| Ding et al. | The electrodeposition of low-Sn imitation gold Cu–Sn alloy from EDTA-tartrate double complexing agents | |
| CN114016096B (en) | Cyanide-free electroplated 18K rose gold liquid, preparation method and application thereof, and preparation method of 18K rose gold coating | |
| CN109440162A (en) | A kind of aluminium alloy anode oxide film is without nickel hole sealing agent and preparation method | |
| CN105463534A (en) | Nano-composite electroplating solution, preparing method of nano-composite electroplating solution and zinc alloy electroplated part | |
| CN109280945A (en) | PCB/FPC the dry film pre-treatment anti-oxidation reinforcing agent of Metal Substrate copper face and its processing method | |
| US4253920A (en) | Composition and method for gold plating | |
| CN105586614A (en) | Electroplating solution and method for electrically depositing invar alloy in ferric iron system alkaline solution | |
| CN109252196B (en) | Preparation of MnCo2O4Method for preparing micro-nano fiber | |
| Ding et al. | Theory and technology for electroplating a rose golden Cu–Zn–Sn alloy using a disodium ethylenediamine tetraacetate system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |