CN110337762B - 用于电力模块的互连部件 - Google Patents
用于电力模块的互连部件 Download PDFInfo
- Publication number
- CN110337762B CN110337762B CN201880015739.6A CN201880015739A CN110337762B CN 110337762 B CN110337762 B CN 110337762B CN 201880015739 A CN201880015739 A CN 201880015739A CN 110337762 B CN110337762 B CN 110337762B
- Authority
- CN
- China
- Prior art keywords
- power terminal
- connector portion
- auxiliary
- power
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 7
- 229910000639 Spring steel Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003362 replicative effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
- H01R4/34—Conductive members located under head of screw
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17159030.0 | 2017-03-03 | ||
EP17159030 | 2017-03-03 | ||
PCT/EP2018/055219 WO2018158449A1 (en) | 2017-03-03 | 2018-03-02 | Interconnecting member for power module |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110337762A CN110337762A (zh) | 2019-10-15 |
CN110337762B true CN110337762B (zh) | 2021-03-12 |
Family
ID=58227964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201880015739.6A Active CN110337762B (zh) | 2017-03-03 | 2018-03-02 | 用于电力模块的互连部件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11031323B2 (zh) |
EP (1) | EP3577729B1 (zh) |
JP (1) | JP7043508B2 (zh) |
CN (1) | CN110337762B (zh) |
WO (1) | WO2018158449A1 (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5744861A (en) * | 1995-11-13 | 1998-04-28 | Asea Brown Boveri Ag | Power semiconductor module |
CN201421842Y (zh) * | 2009-04-01 | 2010-03-10 | 华东科技股份有限公司 | 内存模块封装的可挠性连接结构 |
CN202797558U (zh) * | 2012-07-23 | 2013-03-13 | 西安永电电气有限责任公司 | Igbt模块短接桥 |
CN105321919A (zh) * | 2014-08-01 | 2016-02-10 | 恩智浦有限公司 | 无引线半导体封装和方法 |
DE102014115812A1 (de) * | 2014-10-30 | 2016-05-04 | Infineon Technologies Ag | Halbleitermodul und Halbleitermodulanordnung mit geringen Kriechströmen |
CN105990284A (zh) * | 2014-08-22 | 2016-10-05 | 株式会社东芝 | 半导体装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6196884B1 (en) * | 1997-07-22 | 2001-03-06 | Harness System Technologies Research, Ltd. | Female metal terminal that stably connects with male metal terminal |
US6078501A (en) * | 1997-12-22 | 2000-06-20 | Omnirel Llc | Power semiconductor module |
JP4218184B2 (ja) * | 2000-05-19 | 2009-02-04 | 株式会社デンソー | 半導体装置の実装構造 |
JP4301096B2 (ja) * | 2004-06-29 | 2009-07-22 | 富士電機デバイステクノロジー株式会社 | 半導体装置 |
EP2363919B1 (en) * | 2010-02-22 | 2012-07-04 | Tyco Electronics Nederland B.V. | Contact member for electrical connectors |
EP2673803B1 (en) | 2011-02-08 | 2021-04-14 | ABB Power Grids Switzerland AG | Power semiconductor module and method to produce a power semiconductor module |
US9426883B2 (en) * | 2014-01-30 | 2016-08-23 | Cree Fayetteville, Inc. | Low profile, highly configurable, current sharing paralleled wide band gap power device power module |
US9236677B2 (en) | 2014-04-09 | 2016-01-12 | Xerox Corporation | Spring power contact having non-linear slot |
-
2018
- 2018-03-02 EP EP18707722.7A patent/EP3577729B1/en active Active
- 2018-03-02 CN CN201880015739.6A patent/CN110337762B/zh active Active
- 2018-03-02 JP JP2019547635A patent/JP7043508B2/ja active Active
- 2018-03-02 WO PCT/EP2018/055219 patent/WO2018158449A1/en unknown
-
2019
- 2019-09-03 US US16/558,906 patent/US11031323B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5744861A (en) * | 1995-11-13 | 1998-04-28 | Asea Brown Boveri Ag | Power semiconductor module |
CN201421842Y (zh) * | 2009-04-01 | 2010-03-10 | 华东科技股份有限公司 | 内存模块封装的可挠性连接结构 |
CN202797558U (zh) * | 2012-07-23 | 2013-03-13 | 西安永电电气有限责任公司 | Igbt模块短接桥 |
CN105321919A (zh) * | 2014-08-01 | 2016-02-10 | 恩智浦有限公司 | 无引线半导体封装和方法 |
CN105990284A (zh) * | 2014-08-22 | 2016-10-05 | 株式会社东芝 | 半导体装置 |
DE102014115812A1 (de) * | 2014-10-30 | 2016-05-04 | Infineon Technologies Ag | Halbleitermodul und Halbleitermodulanordnung mit geringen Kriechströmen |
CN105575925A (zh) * | 2014-10-30 | 2016-05-11 | 英飞凌科技股份有限公司 | 半导体模块和具有小的爬电电流的半导体模块装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2020509598A (ja) | 2020-03-26 |
CN110337762A (zh) | 2019-10-15 |
EP3577729A1 (en) | 2019-12-11 |
EP3577729B1 (en) | 2020-05-13 |
US20190393135A1 (en) | 2019-12-26 |
US11031323B2 (en) | 2021-06-08 |
WO2018158449A1 (en) | 2018-09-07 |
JP7043508B2 (ja) | 2022-03-29 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210603 Address after: Baden, Switzerland Patentee after: ABB grid Switzerland AG Address before: Baden, Switzerland Patentee before: ABB Switzerland Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: Swiss Baden Patentee after: Hitachi energy Switzerland AG Address before: Swiss Baden Patentee before: ABB grid Switzerland AG |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240119 Address after: Zurich, SUI Patentee after: Hitachi Energy Co.,Ltd. Address before: Swiss Baden Patentee before: Hitachi energy Switzerland AG |
|
TR01 | Transfer of patent right |