CN110333433A - A kind of micro- heat distribution tester and test method - Google Patents
A kind of micro- heat distribution tester and test method Download PDFInfo
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- CN110333433A CN110333433A CN201910628813.8A CN201910628813A CN110333433A CN 110333433 A CN110333433 A CN 110333433A CN 201910628813 A CN201910628813 A CN 201910628813A CN 110333433 A CN110333433 A CN 110333433A
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- 238000010998 test method Methods 0.000 title claims abstract description 17
- 238000012360 testing method Methods 0.000 claims abstract description 128
- 239000000523 sample Substances 0.000 claims abstract description 94
- 238000001931 thermography Methods 0.000 claims abstract description 57
- 230000003287 optical effect Effects 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000033001 locomotion Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
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- 238000000034 method Methods 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
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- 230000005855 radiation Effects 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 238000002310 reflectometry Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/48—Thermography; Techniques using wholly visual means
- G01J5/485—Temperature profile
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
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Abstract
The present invention provides a kind of micro- heat distribution tester, which includes carrying apparatus, probe unit, thermal imaging camera device, probe power supply and host computer;Carrying apparatus includes objective table, and the probe unit includes test probe;It tests probe to be arranged above objective table, test probe and probe power supply are electrically connected;Thermal imaging camera device includes thermal imaging camera and micro-lens, and thermal imaging camera is arranged above objective table, and micro-lens is arranged on the camera lens of thermal imaging camera, and micro-lens is opposite with objective table;Thermal imaging camera and host computer are electrically connected.The micro- microcosmic thermal imaging effect of heat distribution tester is good, has good practicability.In addition, the present invention also provides a kind of micro- heat distribution test methods.
Description
Technical field
The present invention relates to temperature detection fields, and in particular to arrives a kind of micro- heat distribution tester and test method.
Background technique
Semiconductor devices in use along with many failures the problems such as, the arch-criminal of these problems
Head refers to the heating problem of semiconductor devices.Uneven its function that often becomes of the fever of semiconductor devices reduces the original even to fail
Because, and semiconductor devices is made of fining structure small one by one mostly, structure size it is too small so that its temperature and
Thermo parameters method is always the difficult point detected, hampers the development of semiconductor industry.
Summary of the invention
In order to carry out heat distribution test to semiconductor devices, the present invention provides a kind of micro- heat distribution tester and tests
Method, the micro- microcosmic thermal imaging effect of heat distribution tester is good, has good practicability.
Correspondingly, the micro- heat distribution tester includes loading the present invention provides a kind of micro- heat distribution tester
Device, probe unit, thermal imaging camera device, probe power supply and host computer;
The carrying apparatus includes objective table, and the probe unit includes test probe;
The test probe is arranged above the objective table, and the test probe and the probe power supply are electrically connected;
The thermal imaging camera device includes thermal imaging camera and micro-lens, and the thermal imaging camera is arranged in the load
Above object platform, the micro-lens is arranged on the camera lens of the thermal imaging camera, the micro-lens and the objective table phase
It is right;
The thermal imaging camera and the host computer are electrically connected.
The carrying apparatus further includes two axis adjustment devices that output end moves in the horizontal direction, and the objective table setting exists
On the output end of two axis adjustment device.
The probe unit includes probe lifting seat, probe adjusting seat and spring probe fixture;
The probe lifting seat is arranged on the objective table side, and the probe adjusting seat setting is gone up and down in the probe
On seat lifting group output end, the spring probe fixture is arranged on the probe adjusting seat output end, and the test probe is set
It sets on the spring probe fixture.
The micro- heat distribution tester further includes temperature controller and water cooling module, further includes temperature in the carrying apparatus
Spend sensor and heating head;
The temperature sensor and heating head are separately positioned in the objective table, and water cooling stream is also set up in the objective table
Road;
The water cooling module is connect with the water cooling runner, the temperature controller respectively with the temperature sensor, plus
Hot head and temperature controller are electrically connected.
The micro- heat distribution tester further includes optical camera device, and the optical camera device includes optical camera;
The optical camera is arranged above the objective table, and the optical camera and the host computer are electrically connected.
The micro- heat distribution tester further includes optical dark room, the carrying apparatus, probe unit, thermal imaging camera dress
It installs in the optical dark room.
Correspondingly, the present invention also provides a kind of micro- heat distribution test method, the micro- heat distribution test method packet
Include following steps:
The exemplary position temperature for testing device is adjusted to the first temperature, the first temperature is the test device exemplary position
Temperature in normal operation;
The input current for testing device is adjusted to the first current value based on probe power supply, first current value is described
Test the current value of device in normal operation;
Host computer receives the heat distribution data under the test device job state obtained based on thermal imaging camera.
The exemplary position includes testing the pin or substrate of device.
The exemplary position temperature that device will be tested be adjusted to the first temperature the following steps are included:
The test device is placed on the objective table, the exemplary position of the test device connects with the objective table
Touching;
The objective table temperature is adjusted to the first temperature based on temperature controller.
After the heat distribution data that the host computer receives under the test device job state obtained based on thermal imaging camera,
The micro- heat distribution test method is further comprising the steps of:
The host computer receives the test device material object photo obtained based on optical camera;
The host computer is overlapped the test device material object photo and the heat distribution data, obtains the test
The heat distribution data of device any position.
The present invention provides a kind of micro- heat distribution tester, the setting of optical dark room can prevent external heat radiation light
Into inside optical dark room, test data is accurate;Objective table own temperature is adjustable, can be to the exemplary position temperature of test device
It is adjusted, there is good simulated effect;The setting of probe clamp, test probe is close with the contact for testing device, guarantees
The energization stability of test device;Two axis adjustment devices, optical camera adjusting seat, thermal imaging camera adjusting seat, probe lifting
The setting of seat and probe adjusting seat, make in the micro- heat distribution tester the equipment of adjusting position in need can be by dedicated
Structure is adjusted, and degree of regulation is high, and adjusting convenience is good, has good operation ease.In addition, the embodiment of the present invention is also
A kind of micro- heat distribution test method is provided, by carrying out temperature adjusting, simulation test device to test device exemplary position
Actual working environment, simulated effect is good, heat distribution data be more bonded test device actual condition, based on this method obtain
Device data is tested, there is good actual reference.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 shows the micro- heat distribution tester positive structure diagram of the embodiment of the present invention;
Fig. 2 shows the micro- heat distribution tester overlooking structure diagrams of the embodiment of the present invention;
Fig. 3 shows the micro- heat distribution test method flow diagram of the embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1 shows the positive structure diagram of the micro- heat distribution tester of the embodiment of the present invention,
Fig. 2 shows the micro- heat distribution tester overlooking structure diagrams of the embodiment of the present invention.
The micro- heat distribution tester of the embodiment of the present invention includes optical dark room 17, carrying apparatus, probe unit, optics phase
Machine device, thermal imaging camera device and host computer 2.
Wherein, the carrying apparatus, probe unit, optical camera device, thermal imaging camera device are arranged in the optics
In darkroom 17.
The setting of optical dark room 17 can prevent external heat radiation light from entering inside optical dark room 17, make to test data
At influence.
Specifically, 17 bottom of optical dark room is provided with cellular board 12, for absorbing part heat radiation, prevent bottom anti-
The heat radiation penetrated impacts the imaging of thermal imaging camera device good person's optical camera device.
The carrying apparatus includes objective table 8, and the objective table 8 is arranged on the cellular board 12, is needed for carrying
The device of test.
The probe unit includes test probe 20, the test probe 20 setting above the objective table 8, for for
Device to be tested is needed to be powered.
The optical camera device includes optical camera 5, and the optical camera is arranged above the objective table 8, is used for
Obtain the surface image of objective table 8 and the surface image of required test device.Obtain the purpose of the photo in kind of test device
Be, data acquired in thermal imaging camera be infrared emittance (reflectivity) for each substance, host computer exists
In specific processing, it is necessary first to the material of each position on photo in kind is drawn a circle to approve, thus make host computer by heat at
The image as acquired in camera is converted to temperature value according to the material property (emissivity or reflectivity) of different location.
The thermal imaging camera device includes thermal imaging camera 4 and micro-lens 3, and the thermal imaging camera 4 is arranged in institute
It states above objective table, the micro-lens is arranged on 4 camera lens of thermal imaging camera.The thermal imaging camera is carried for obtaining
The thermal image of thermal image and test device on object platform 8.
The optical camera 5 and thermal imaging camera 4 are connect with host computer 2 respectively.
When it is implemented, being arranged test device on the objective table 8, is shot, obtained first by optical camera 5
Test device material object photo;Then test probe 20 is contacted with test device pin or electrode, is powered for test device;
Then the thermal imaging distribution of test device is obtained by thermal imaging camera 4;Finally by the photo in kind of tester part and thermal imaging
Distribution overlapping obtains the heat distribution situation of test device when in use.Due to the setting of micro-lens 3, point of thermal imaging camera 4
Resolution is greatly improved, and has good heat distribution detection function for miniature and miniature device.
Specifically, in order to improve the accuracy of the convenience of operation and experimental data, the micro- heat of the embodiment of the present invention
Distribution detector has carried out following improvement:
Objective table 8 is made of metal material, temperature sensor, heating head and water cooling runner is internally provided with, in Optical Dark Solitary Pulse
Outside room 17, it is provided with temperature controller 9 and water cooling module 10.The water cooled pipeline of water cooling module 10 accesses the water of the objective table
In cold runner, wherein temperature controller 9 is electrically connected with temperature sensor, water cooling module 10 and heating head respectively, temperature sensing
Device is by the temperature Real-time Feedback of objective table 8 to temperature controller, and temperature controller is according to set preset temperature, control heating
Head and 10 coordinating operation of water cooling module, adjust the temperature of objective table on demand.
When it is implemented, being covered with one layer of heat-conducting silicone grease on objective table, the exemplary position for testing device is conformed to thermally conductive
On silicone grease;By the temperature of set temperature controller, the temperature of objective table is made to reach preset value, due to silicone grease thermal conductivity compared with
Good, the exemplary position temperature for testing device can be consistent with objective table.
Specifically, exemplary position is the position of the test device and external connection such as substrate, pin, electrode for testing device.
Temperature sensor, heating head, water cooling module and the purpose of temperature sensor setting are, can pass through control objective table
Temperature simulation tests environment temperature of the device exemplary position in normal operation, makes heat distribution test closer to actual use feelings
Condition tests the heat distribution test of device with more practical directive significance, has good practicability.
Further, since thermal imaging camera acquisition data need calibrate after could it is corresponding with actual temperature on, therefore, can lead to
Objective table is crossed to calibrate thermal imaging camera.Objective table temperature is adjusted by temperature controller, to objective table temperature
After stabilization, thermal imaging distributed image is obtained using thermal imaging camera, using the temperature of objective table to the phase of thermal imaging distributed image
It answers region to carry out Temperature Scaling, realizes the calibration of thermal imaging camera.
Further, when photo in kind or thermal imaging distributed data obtain, it may be necessary to which adjustment test device is in loading
Position on platform 8, since test device needs to be arranged on objective table by heat-conducting silicone grease, heat-conducting silicone grease has certain glue
Property, lead to the silicone grease covering for testing device surface adhesion in order to avoid repeatedly adjusting test device, influence data acquisition effect,
The objective table 8 of the embodiment of the present invention is arranged on two axis adjustment devices 13, two axis adjustment devices 13 can driving objective table 8 in stroke
Inside move in the horizontal direction, it, can be by two axis adjustment devices, 13 driving objective table in plane after test device is placed in objective table 8
It is interior movement without directly testing position of the device on objective table, on the one hand, test device horizontal direction position adjust compared with
For convenience, on the other hand, mobile by two axis adjustment devices, 13 driving objective table, kinematic accuracy is higher and moves more controllable, tool
There is good practicability.
Similar, since test device can be miniature or miniature device, test the electrode of device or the size of pin
Smaller, the energization enforcement difficulty for carrying out test device by traditional fixation probe is larger, therefore, the probe of the embodiment of the present invention
Device further includes probe lifting seat 16, probe adjusting seat 14 and spring probe fixture 15.Specifically, the setting of probe lifting seat 16 exists
On 8 side of objective table, probe adjusting seat 14 is arranged on 8 top surface of objective table, and spring probe fixture 15 is arranged in probe tune
On bed rearrangement 14, test probe 20 is arranged on the spring probe fixture 15.
Specifically, probe lifting seat 16 drives probe adjusting seat 14 vertically moving, probe adjusting seat 14 drives bullet
Spring probe clamp 15 is fixed on spring probe fixture 15 along diagram horizontal motion (rectilinear direction), test probe 20, when
When the electrode or pin of test probe 20 and test device contact, spring probe fixture 15 can provide certain pressure, make to test
Probe 20 keeps contacting with the electrode of test device or pin.
When specific operation, according to the position of the electrode of test device or pin, probe lifting seat 16 and probe adjustment are adjusted
Seat 14, meanwhile, in conjunction with objective table 8 horizontal movement, it can be achieved that test probe 20 and test the opposite three axis movement of device, work as survey
After exploration needle 20 is contacted with the electrode or pin for testing device, the height of probe lifting seat 16 is turned down, spring probe fixture is made
15 are compressed, so that making spring probe fixture 15 provide an elastic pressure gives test probe 20, make to test probe 20 and test
The electrode or pin of device remain contact.
Optical camera and thermal imaging camera need that clear image could be obtained by focusing, since loading sample platform is only capable of along water
Square to movement and different test device has difference in height anisotropic, and therefore, the optical camera device of the embodiment of the present invention includes
Optical camera adjusting seat 7, optical camera 5 are arranged on the end of optical camera adjusting seat 7.The end of optical camera adjusting seat 7
With lifting freedom degree and rotational freedom, on the one hand, the end of optical camera adjusting seat 7 is right by optical camera 5 by rotating
Quasi- objective table 8, on the other hand, the end of optical camera adjusting seat 7 pass through between lift adjustment optical camera and test device
Distance enables optical camera accurately to focus.Further, in order to obtain the higher photo in kind of resolution ratio, in optical camera
It finds a view end, is provided with straight tube microscope, amplify picture in kind for obtaining high-resolution.
Similar, thermal imaging camera device further includes thermal imaging camera adjusting seat 18, and thermal imaging camera 4 is arranged in thermal imaging
On the end of camera adjusting seat 18.The end of thermal imaging camera adjusting seat 18 is moveable to appointing for three-dimensional space in stroke range
One position.
In addition, the limit heat distribution tester of the embodiment of the present invention is other than above-described components, it further include probe
Power supply, optionally, the probe power supply are programmable DC power supply 11, and programmable DC power supply 11 is used to supply to test probe 20
Electricity.
In addition, in embodiments of the present invention, optical camera and thermal imaging camera are attached with host computer 2 respectively, it is used for
Data feedback is handled to host computer.
Correspondingly, the embodiment of the invention provides a kind of micro- heat distribution test mode, the micro- heat distribution test side
Method includes:
S101: the exemplary position temperature for testing device is adjusted to the first temperature;
First temperature is the temperature of the test device exemplary position in normal operation, in the embodiment of the present invention
In, optionally, the test device is placed on the objective table, the exemplary position of the test device connects with the objective table
Touching optionally can cover one layer of heat-conducting silicone grease on objective table, and the exemplary position of enhancing test device is contacted with the objective table
Heat-conducting effect;It is then based on temperature controller and adjusts the objective table temperature to the first temperature.
Since the exemplary position of test device is contacted with objective table, the temperature of objective table is to test the exemplary position of device
Temperature;Objective table temperature is adjusted to the first temperature, i.e., the exemplary position temperature for testing device is adjusted to the first temperature.
S102: the input current for testing device is adjusted to by the first current value based on probe power supply;
First current value is the current value of the test device in normal operation, is adjusted using probe power supply
Test device input current, simulation test device normal operating conditions operating current, due to test device typical position
Set identical as the temperature under working condition, acquired data have good reference price to test device in this test condition
Value.
S103: host computer receives the heat distribution data under the test device job state obtained based on thermal imaging camera;
After step S101 and S102, the heat distribution number for the related test device that host computer is obtained based on thermal imaging camera
According to identical as the heat distribution data of test device in the operating condition.
S104: the host computer receives the test device material object photo obtained based on optical camera;
S105: the host computer sets the material of any position on the test device material object photo;
S106: the host computer handles the test device material object photo and the heat distribution data, obtains institute
State the temperature value of test device any position.
Actual temp information in heat distribution data and including object, actual temp information need the reflectivity according to material
(emissivity) carries out operation, is set using material of the host computer to different location on test device material object photo, determines material
The parameter of the design parameter of material, host computer combination heat distribution data and material carries out operation, show that test device is taken up an official post a position
Temperature value.
The embodiment of the invention provides a kind of micro- heat distribution tester, the setting of optical dark room can prevent external hot spoke
It penetrates light to enter inside optical dark room, test data is accurate;Objective table own temperature is adjustable, can be to the typical position of test device
It sets temperature to be adjusted, there is good simulated effect;The setting of probe clamp, test probe are tight with the contact for testing device
It is close, it ensure that the energization stability of test device;Two axis adjustment devices, thermal imaging camera adjusting seat, are visited optical camera adjusting seat
The setting of needle lifting seat and probe adjusting seat, make in the micro- heat distribution tester the equipment of adjusting position in need can lead to
It crosses application specific architecture to be adjusted, degree of regulation is high, and adjusting convenience is good, has good operation ease.In addition, the present invention is real
It applies example and additionally provides a kind of micro- heat distribution test method, by carrying out temperature adjusting to test device exemplary position, simulation is surveyed
The actual working environment of device is tried, simulated effect is good, and heat distribution data are more bonded test device actual condition, is based on this method
The test device data of acquisition has good actual reference.
It is provided for the embodiments of the invention a kind of micro- heat distribution tester above and test method has carried out detailed Jie
It continues, used herein a specific example illustrates the principle and implementation of the invention, and the explanation of above embodiments is only
It is to be used to help understand method and its core concept of the invention;At the same time, for those skilled in the art, according to this hair
Bright thought, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification should not manage
Solution is limitation of the present invention.
Claims (10)
1. a kind of micro- heat distribution tester, which is characterized in that the micro- heat distribution tester includes carrying apparatus, probe dress
It sets, thermal imaging camera device, probe power supply and host computer;
The carrying apparatus includes objective table, and the probe unit includes test probe;
The test probe is arranged above the objective table, and the test probe and the probe power supply are electrically connected;
The thermal imaging camera device includes thermal imaging camera and micro-lens, and the thermal imaging camera is arranged in the objective table
Top, the micro-lens are arranged on the camera lens of the thermal imaging camera, and the micro-lens is opposite with the objective table;
The thermal imaging camera and the host computer are electrically connected.
2. micro- heat distribution tester as described in claim 1, which is characterized in that the carrying apparatus further includes output end edge
Two axis adjustment devices of horizontal motion, the objective table are arranged on the output end of two axis adjustment device.
3. micro- heat distribution tester as described in claim 1, which is characterized in that the probe unit includes probe lifting
Seat, probe adjusting seat and spring probe fixture;
The probe lifting seat is arranged on the objective table side, and the probe adjusting seat is arranged in the probe lifting seat liter
It comes down to a lower group on output end, the spring probe fixture is arranged on the probe adjusting seat output end, and the test probe setting exists
On the spring probe fixture.
4. micro- heat distribution tester as described in claim 1, which is characterized in that the micro- heat distribution tester further includes
Temperature controller and water cooling module, the carrying apparatus further include temperature sensor and heating head;
The temperature sensor and heating head are separately positioned in the objective table, and water cooling stream is additionally provided in the objective table
Road;
The water cooling module is connect with the water cooling runner, the temperature controller respectively with the temperature sensor, heating head
It is electrically connected with temperature controller.
5. micro- heat distribution tester as described in claim 1, which is characterized in that the micro- heat distribution tester further includes
Optical camera device, the optical camera device includes optical camera;
The optical camera is arranged above the objective table, and the optical camera and the host computer are electrically connected.
6. micro- heat distribution tester as described in claim 1, which is characterized in that the micro- heat distribution tester further includes
Optical dark room, the carrying apparatus, probe unit and thermal imaging camera device are arranged in the optical dark room.
7. a kind of micro- heat distribution test method, which is characterized in that the micro- heat distribution test method the following steps are included:
The exemplary position temperature for testing device is adjusted to the first temperature, the first temperature is the test device exemplary position just
Temperature under normal working condition;
The input current for testing device is adjusted to the first current value based on probe power supply, first current value is the test
The current value of device in normal operation;
Host computer receives the heat distribution data under the test device job state obtained based on thermal imaging camera.
8. micro- heat distribution test method as claimed in claim 7, which is characterized in that the exemplary position is test device
Pin or substrate.
9. micro- heat distribution test method as claimed in claim 7, which is characterized in that the exemplary position that device will be tested
Temperature be adjusted to the first temperature the following steps are included:
The test device is placed on the objective table, the exemplary position of the test device is contacted with the objective table;
The objective table temperature is adjusted to the first temperature based on temperature controller.
10. micro- heat distribution test method as claimed in claim 7, which is characterized in that receive in the host computer based on heat
Image camera obtain test device job state under heat distribution data after, the micro- heat distribution test method further include with
Lower step:
The host computer receives the test device material object photo obtained based on optical camera;
The host computer sets the material of any position on the test device material object photo;
The host computer handles the test device material object photo and the heat distribution data, obtains the test device
The temperature value of any position.
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Cited By (1)
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CN112630620A (en) * | 2020-12-14 | 2021-04-09 | 清华大学 | Testing device, testing system and testing method for semiconductor sample |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1718513A (en) * | 2005-08-12 | 2006-01-11 | 北京工业大学 | Temperature controllable cultural relic exhibition cabinet |
CN2810380Y (en) * | 2005-08-12 | 2006-08-30 | 北京工业大学 | Temperature controllable cultural relics showcase |
CN101435851A (en) * | 2008-12-10 | 2009-05-20 | 中山大学 | Method for detecting solar cell leakage current by infrared thermal imager |
CN102183542A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | System for detecting solder joint reliability of circuit board by using infrared multipoint temperature measuring heat resistance method |
CN202083773U (en) * | 2011-01-18 | 2011-12-21 | 上海理工大学 | Semiconductor parameter testing system |
CN103645333A (en) * | 2013-12-25 | 2014-03-19 | 嘉善加斯戴克医疗器械有限公司 | Reagent preheating device |
CN104864966A (en) * | 2015-04-03 | 2015-08-26 | 燕山大学 | Microscopic thermal imaging method |
CN105371965A (en) * | 2015-11-30 | 2016-03-02 | 上海仪电分析仪器有限公司 | Temperature measurement device of atomizer graphite furnace |
CN205483496U (en) * | 2016-01-25 | 2016-08-17 | 陕西科技大学 | Luminescent device temperature characteristic measuring device |
CN107702817A (en) * | 2016-08-08 | 2018-02-16 | 安萨尔多能源瑞士股份公司 | Temperature-detecting device for combustion gas turbine power-equipment and the combustion gas turbine power-equipment including the temperature-detecting device |
CN207301256U (en) * | 2017-09-11 | 2018-05-01 | 马步智 | A kind of semiconductor device for testing functions based on electromechanical integration |
CN109164508A (en) * | 2018-09-05 | 2019-01-08 | 北京雨根科技有限公司 | Thermostatic control module and microwave scintiloscope |
CN109596222A (en) * | 2018-12-06 | 2019-04-09 | 广东金鉴实验室科技有限公司 | A kind of micro- heat distribution test method and system |
-
2019
- 2019-07-11 CN CN201910628813.8A patent/CN110333433A/en active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1718513A (en) * | 2005-08-12 | 2006-01-11 | 北京工业大学 | Temperature controllable cultural relic exhibition cabinet |
CN2810380Y (en) * | 2005-08-12 | 2006-08-30 | 北京工业大学 | Temperature controllable cultural relics showcase |
CN101435851A (en) * | 2008-12-10 | 2009-05-20 | 中山大学 | Method for detecting solar cell leakage current by infrared thermal imager |
CN202083773U (en) * | 2011-01-18 | 2011-12-21 | 上海理工大学 | Semiconductor parameter testing system |
CN102183542A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | System for detecting solder joint reliability of circuit board by using infrared multipoint temperature measuring heat resistance method |
CN103645333A (en) * | 2013-12-25 | 2014-03-19 | 嘉善加斯戴克医疗器械有限公司 | Reagent preheating device |
CN104864966A (en) * | 2015-04-03 | 2015-08-26 | 燕山大学 | Microscopic thermal imaging method |
CN105371965A (en) * | 2015-11-30 | 2016-03-02 | 上海仪电分析仪器有限公司 | Temperature measurement device of atomizer graphite furnace |
CN205483496U (en) * | 2016-01-25 | 2016-08-17 | 陕西科技大学 | Luminescent device temperature characteristic measuring device |
CN107702817A (en) * | 2016-08-08 | 2018-02-16 | 安萨尔多能源瑞士股份公司 | Temperature-detecting device for combustion gas turbine power-equipment and the combustion gas turbine power-equipment including the temperature-detecting device |
CN207301256U (en) * | 2017-09-11 | 2018-05-01 | 马步智 | A kind of semiconductor device for testing functions based on electromechanical integration |
CN109164508A (en) * | 2018-09-05 | 2019-01-08 | 北京雨根科技有限公司 | Thermostatic control module and microwave scintiloscope |
CN109596222A (en) * | 2018-12-06 | 2019-04-09 | 广东金鉴实验室科技有限公司 | A kind of micro- heat distribution test method and system |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112630620A (en) * | 2020-12-14 | 2021-04-09 | 清华大学 | Testing device, testing system and testing method for semiconductor sample |
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