CN110332699A - Calandria - Google Patents
Calandria Download PDFInfo
- Publication number
- CN110332699A CN110332699A CN201910734753.8A CN201910734753A CN110332699A CN 110332699 A CN110332699 A CN 110332699A CN 201910734753 A CN201910734753 A CN 201910734753A CN 110332699 A CN110332699 A CN 110332699A
- Authority
- CN
- China
- Prior art keywords
- thermally conductive
- conductive carrier
- cavity
- calandria
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000004321 preservation Methods 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
- F24H1/10—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
- F24H1/12—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/02—Casings; Cover lids; Ornamental panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/18—Arrangement or mounting of grates or heating means
- F24H9/1809—Arrangement or mounting of grates or heating means for water heaters
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Devices For Use In Laboratory Experiments (AREA)
Abstract
The invention discloses calandria, including thermally conductive carrier, thermally conductive carrier is columnar hollow structure, and the projected side wall of thermally conductive carrier forms cavity, is provided with euthermic chip in cavity.Cavity has multiple, is evenly distributed on the side wall of thermally conductive carrier.Insulating layer is provided with outside thermally conductive carrier, insulating layer wraps up thermally conductive carrier.Calandria in the present invention, the heat that euthermic chip issues transmit water supply by thermally conductive carrier, euthermic chip are avoided directly to contact water, to avoid water in the euthermic chip surface scale of high temperature, while avoiding occurring booster situation, guarantee the heating efficiency of euthermic chip.
Description
Technical field
The present invention relates to heating art more particularly to a kind of calandrias.
Background technique
In the related prior art, general to be put in water using round or abnormity steel plate, water is directly heated.Due to
Surface of steel plate temperature is very high, and water is easy to form scale in surface of steel plate, reduces the contact area of steel plate and water, and it is hidden to form booster
Suffer from, while steel plate being hindered to transmit heat into water, causes energy waste.
Summary of the invention
The calandria that embodiment of the present invention provides, including thermally conductive carrier, thermally conductive carrier is columnar hollow structure, thermally conductive
The projected side wall of carrier forms cavity, is provided with euthermic chip in cavity.
Calandria in the present invention, the heat that euthermic chip issues transmit water supply by thermally conductive carrier, avoid euthermic chip
Water is directly contacted, to avoid water in the euthermic chip surface scale of high temperature, while avoiding occurring booster situation, guarantees fever
The heating efficiency of chip.
Further, cavity is evenly distributed on the side wall of thermally conductive carrier.
Further, cavity includes the chip seal face opposite with thermally conductive carrier, connects chip seal face and thermally conductive carrier
Side wall to cavity internal bend.
Further, euthermic chip is wrapped up by heat conductive insulating protective film.
Further, chip protection layer is additionally provided in cavity, chip protection layer is located at heat conductive insulating protective film and cavity
Between inner wall.
Further, the cavity is located at the outside of thermally conductive carrier, forms water stream channel in thermally conductive carrier, cavity has more
It is a, it is spaced apart from each other.
Further, multiple heat transmission fins, the internal stretch of heat transmission fin guide heat carrier are formed in thermally conductive carrier.
Further, insulating layer is provided with outside thermally conductive carrier, insulating layer wraps up thermally conductive carrier.
Further, insulating layer is water conservation set, and heat preservation water route is connected in water conservation set.
Further, the cavity is located at thermally conductive carrier inside, and thermally conductive carrier forms heating rod.
The additional aspect and advantage of embodiment of the present invention will be set forth in part in the description, partially will be from following
Become obvious in description, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the planar structure schematic diagram of one embodiment of the calandria of embodiment of the present invention；
Fig. 2 is enlarged diagram of the Fig. 1 at I；
Fig. 3 is the planar structure schematic diagram of second embodiment of the calandria of embodiment of the present invention；
Fig. 4 is the structural schematic diagram in the heat preservation water route of the calandria of embodiment of the present invention.
Specific embodiment
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1-Fig. 4, the calandria that embodiment of the present invention provides, including thermally conductive carrier 1 are please referred to, thermally conductive carrier 1 is column
The hollow structure of shape, the projected side wall of thermally conductive carrier 1 form cavity 2, are provided with euthermic chip 3 in cavity 2.
Calandria in the present invention, the heat that euthermic chip 3 issues transmit water supply by thermally conductive carrier 1, avoid heat generating core
Piece 3 directly contacts water, to avoid water in 3 surface scale of euthermic chip of high temperature, while avoiding occurring booster situation, guarantees
The heating efficiency of euthermic chip 3.
Specifically, after euthermic chip 3 being placed into cavity 2, squeezing cavity 2 deforms cavity 2, thus by euthermic chip
3 are fixed in cavity 2, will not be subjected to displacement, and guarantee the stability of heating structure.
Further, cavity 2 is evenly distributed on the side wall of thermally conductive carrier 1.Specifically, cavity 2 is along the thermally conductive carrier 1 of column
Side wall is uniformly distributed, and can be so evenly heated to water body, guarantees heating effect.
In the present invention, thermally conductive carrier 1 is hexa-prism, and each faceted pebble is provided with a cavity 2, is arranged in each cavity 2
One euthermic chip 3.
Further, cavity 2 includes the chip seal face 21 opposite with thermally conductive carrier 1, connects chip seal face 21 and leads
The side wall 22 of heat carrier 1 is to 2 internal bend of cavity.In this way, squeezing cavity 2 after putting euthermic chip 3 into cavity 2, chip is compressed
Face 21 contacts and fixed euthermic chip 3, and euthermic chip 3 is prevented to be subjected to displacement in cavity 2；To the side wall of 2 internal bend of cavity
22 be squeezed after be easier to internal motion to cavity 2, contact heating chip 3 further fixes euthermic chip 3.
Further, euthermic chip 3 is wrapped up by heat conductive insulating protective film 4.In this way, heat conductive insulating protective film 4 plays protection
Effect, avoids euthermic chip 3 and water from directly contacting, so that euthermic chip 3 be avoided to be damaged, extends making for euthermic chip 3
Use the service life.
Further, chip protection layer 5 is additionally provided in cavity 2, chip protection layer 5 is located at 4 He of heat conductive insulating protective film
Between 2 inner wall of cavity.The effect of chip protection layer 5 mainly during squeezing cavity 2, protects chip not to be damaged.
Chip protection layer 5 in the present invention is made of material thermally conductive, resistant to high temperature.
Further, cavity 2 is located at the outside of thermally conductive carrier 1, forms water stream channel in thermally conductive carrier 1, cavity 2 has more
It is a, it is spaced apart from each other.
This is the first embodiment of the invention.The position of cavity 2 is in the outside of thermally conductive carrier 1, and water is from thermally conductive carrier 1
Inside is flowed through, and the heat that euthermic chip 3 generates is absorbed, and realizes heating.
Further, multiple heat transmission fins 6, the internal stretch of 6 guide heat carrier 1 of heat transmission fin are formed in thermally conductive carrier 1.
In one embodiment, since water passes through from the inside of thermally conductive carrier 1, thermally conductive wing is set in the inside of thermally conductive carrier 1
Piece 6, to form more heating sources, considerably increases water in the heat transfer on thermally conductive carrier 1 to each heat transmission fin 6
With the area of high temperature source contact, heating efficiency is improved.
It is worth noting that, the heat transmission fin 6 in the present invention is evenly distributed on the inside of thermally conductive carrier 1 and length is identical,
Avoid length it is different in the case where, water route changes, and water forms turbulent flow when the inside of thermally conductive carrier 1 passes through, influence plus
The thermal efficiency.
Further, insulating layer 7 is provided with outside thermally conductive carrier 1, insulating layer 7 wraps up thermally conductive carrier 1.One embodiment
In thermally conductive carrier 1 outside wrap up one layer of heat preservation layer 7, reduce the heat that thermally conductive carrier 1 outwardly transmits.
Further, insulating layer 7 is water conservation set, and heat preservation water route 8 is connected in water conservation set.Wrap up thermally conductive in heat preservation water route 8
Carrier 1 is equipped with water inlet 81 and water outlet 82, had both completely cut off thermally conductive carrier 1 and the external world, and reduced the thermal losses of thermally conductive carrier 1, again
The heat that a part of thermally conductive carrier 1 can be absorbed, forms hot water, is discharged from water outlet, is easy to use, takes full advantage of the energy.
Specifically, in the present invention, water inlet 81 is fixed by the way of outer tooth or interior tooth encryption seal rotatable engagement, significantly
It ensure that the leakproofness of water inlet.
Further, cavity 2 is located inside thermally conductive carrier 1, and thermally conductive carrier 1 forms heating rod.
This is second embodiment of the invention, after cavity 2 is located at thermally conductive 1 inside of carrier, the function class of calandria entirety
Like a heating rod, heated into the water.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle of the present invention and objective and become
Type, the scope of the present invention are defined by the claims and their equivalents.
Claims (10)
1. calandria, which is characterized in that including thermally conductive carrier (1), thermally conductive carrier is columnar hollow structure, the side of thermally conductive carrier
Wall convexes to form cavity (2), and euthermic chip (3) are provided in cavity.
2. calandria according to claim 1, which is characterized in that cavity has multiple, and cavity is evenly distributed on thermally conductive carrier
Side wall.
3. calandria according to claim 1, which is characterized in that cavity includes the chip seal face opposite with thermally conductive carrier
(21), the side wall (22) of chip seal face and thermally conductive carrier is connected to cavity internal bend.
4. calandria according to claim 1, which is characterized in that euthermic chip is wrapped up by heat conductive insulating protective film (4).
5. calandria according to claim 4, which is characterized in that be additionally provided in cavity chip protection layer (5), chip is protected
Sheath is between heat conductive insulating protective film and cavity inner wall.
6. calandria according to claim 1, which is characterized in that the cavity is located at the outside of thermally conductive carrier, thermally conductive load
Form water stream channel in body, cavity has multiple, is spaced apart from each other.
7. calandria according to claim 6, which is characterized in that multiple heat transmission fins (6) are formed in thermally conductive carrier, it is thermally conductive
The internal stretch of fin guide heat carrier.
8. calandria according to claim 6, which is characterized in that be provided with insulating layer (7), insulating layer outside thermally conductive carrier
Wrap up thermally conductive carrier.
9. calandria according to claim 8, which is characterized in that insulating layer is water conservation set, is connected with guarantor in water conservation set
Warm water road (8).
10. calandria according to claim 1, which is characterized in that the cavity is located at thermally conductive carrier inside, thermally conductive carrier
Form heating rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910734753.8A CN110332699A (en) | 2019-08-09 | 2019-08-09 | Calandria |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910734753.8A CN110332699A (en) | 2019-08-09 | 2019-08-09 | Calandria |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110332699A true CN110332699A (en) | 2019-10-15 |
Family
ID=68149230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910734753.8A Pending CN110332699A (en) | 2019-08-09 | 2019-08-09 | Calandria |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110332699A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1293745A (en) * | 1998-03-20 | 2001-05-02 | 澳大利亚绍斯考尔有限公司 | Flue and hot water heater |
| CN203132145U (en) * | 2012-12-07 | 2013-08-14 | 李健 | Heating device of liquid and fluid |
| CN207262704U (en) * | 2017-09-26 | 2018-04-20 | 大庆市鸿润升锅炉科技有限公司 | Water flowing heater |
| CN208920576U (en) * | 2018-05-24 | 2019-05-31 | 九阳股份有限公司 | A kind of hot-water heating system |
-
2019
- 2019-08-09 CN CN201910734753.8A patent/CN110332699A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1293745A (en) * | 1998-03-20 | 2001-05-02 | 澳大利亚绍斯考尔有限公司 | Flue and hot water heater |
| CN203132145U (en) * | 2012-12-07 | 2013-08-14 | 李健 | Heating device of liquid and fluid |
| CN207262704U (en) * | 2017-09-26 | 2018-04-20 | 大庆市鸿润升锅炉科技有限公司 | Water flowing heater |
| CN208920576U (en) * | 2018-05-24 | 2019-05-31 | 九阳股份有限公司 | A kind of hot-water heating system |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191015 |