CN110324984A - Connection method, circuit board assemblies and the electronic equipment of electronic component and circuit board - Google Patents
Connection method, circuit board assemblies and the electronic equipment of electronic component and circuit board Download PDFInfo
- Publication number
- CN110324984A CN110324984A CN201910680922.4A CN201910680922A CN110324984A CN 110324984 A CN110324984 A CN 110324984A CN 201910680922 A CN201910680922 A CN 201910680922A CN 110324984 A CN110324984 A CN 110324984A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- conducting resinl
- electronic component
- hole
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses the connection method of a kind of electronic component and circuit board, circuit board assemblies and electronic equipments.The electronic component includes at least one pad, and circuit board includes through-hole corresponding with pad, which includes: the first surface placement electronic component in circuit board, so that pad is aligned one by one with corresponding through-hole；It is formed and is located at pad and/or the first conducting resinl positioned at the through hole of first surface；Reverse circuit plate, so that the second surface of circuit board is upward；The second conducting resinl being filled in through-hole is formed, the first conducting resinl and the second conducting resinl provide being electrically connected between circuit board and electronic component.The two sides dispensing of the connection method can greatly improve the reliability of electrical connection between electronic component and circuit board, avoid the occurrence of the problem of electronic component and circuit board virtual connection or open circuit.
Description
Technical field
The present invention relates to electronic circuit technology fields, more particularly, to the connection side of a kind of electronic component and circuit board
Method, circuit board assemblies and electronic equipment.
Background technique
With universal and electronic circuit the continuous development of electronic product, circuit board assemblies are applied to implantation dress
It sets, in the electronic equipments such as wearable device, mobile phone, computer, camera, display.
Electronic component (electronic component) is the basic element in electronic circuit, has at least one pad
(metal pad), circuit board are the carriers of electronic component, and multiple electronic components are connected with each other and encapsulate via circuit board, are formed
Circuit board assemblies.One of the normal method that electronic component is connected to circuit board is welded on circuit board.However, with electronics
The miniaturization of equipment and electronic component, volume shared by pad also become smaller therewith, when by electronic component soldered circuit board, can go out
The problem of showing solder joint virtual connection, being not connected firmly, or even it is easy to appear short circuit and pad and electricity caused by multiple interconnecteds
The open circuit that the metal layer of road plate is not connected and occurs.
Therefore, it needs that the connection method of the electronic component and circuit board of the prior art is further improved, to solve
The above problem.
Summary of the invention
In view of the above problems, the purpose of the present invention is to provide the connection methods of a kind of electronic component and circuit board, circuit
Board group part and electronic equipment, to increase the connection reliability of electronic component and circuit board.
According to the first aspect of the invention, the connection method of a kind of electronic component and circuit board, the electronic component are provided
Including at least one pad, the circuit board includes through-hole corresponding with the pad, and the connection method includes: described
The first surface of circuit board places the electronic component, so that the pad is aligned one by one with the corresponding through-hole；Form position
In the pad and/or the first conducting resinl positioned at the through hole of the first surface；The circuit board is overturn, so that institute
The second surface of circuit board is stated upward, wherein the second surface and the first surface are relative to each other；And it is formed and is filled in
The second conducting resinl in the through-hole, first conducting resinl and second conducting resinl provide the circuit board and the electronics
Electrical connection between element.
Preferably, the circuit board includes the first insulating layer, second insulating layer and metal layer, and the metal layer is located at institute
It states between the first insulating layer and the second insulating layer, the through-hole is through first insulating layer, the metal layer and described
Second insulating layer；Wherein, the through-hole is greater than the sectional area in first insulating layer in the sectional area of the second insulating layer,
To expose the part of the surface of the metal layer；The first surface be first insulating layer exposed surface, described second
Surface is the exposed surface of the second insulating layer.
Preferably, first conducting resinl closes the through-hole for being located at the first surface.
Preferably, further includes: after forming first conducting resinl, dry first conducting resinl；And/or it is being formed
After second conducting resinl, second conducting resinl is dried.
Preferably, first conducting resinl and second conducting resinl are metal or carbon tube/epoxy resin adhesive.
Preferably, after forming second conducting resinl, further includes: formation is integrally wrapped in the circuit board and described
The protective film on the surface of electronic component.
Preferably, the electronic component is capacitor, inductor, resistor, oscillator, filter, sensor and integrates
Any one in circuit chip.
According to the second aspect of the invention, a kind of circuit board assemblies are provided, comprising: circuit board, the circuit board have extremely
A few through-hole；Electronic component, the electronic component are located at the first surface of the circuit board, and the electronic component has and institute
State the corresponding pad of through-hole；And bonding agent, the bonding agent provide being electrically connected between the circuit board and the electronic component
It connects；Wherein, the bonding agent includes the steps that the first conducting resinl and the second conducting resinl formed at least different at two, described
First conducting resinl is located at the first surface, and second conductive paste is in the through-hole.
According to the third aspect of the invention we, a kind of electronic equipment is provided, comprising: be made of connection method as described above
Circuit board assemblies.
Preferably, the electronic equipment be artificial cochlear implant, retina stimulate vision prosthesis, cortex stimulator,
Any one in spinal stimulator and deep brain stimulator (brain pacemaker).
Electronic component is connected to the first surface of circuit board by technical solution provided by the invention by the first conducting resinl,
The second conducting resinl is filled in the through-hole of circuit board, two sides dispensing can greatly improve the electricity between electronic component and circuit board
Connection reliability avoids the occurrence of the problem of electronic component and circuit board virtual connection or open circuit.Program simple process, improves simultaneously
Technique yields guarantees that electronic component works normally in the case where size-constrained, is particularly suitable for small electronic equipment.
Further, the through-hole of the circuit board in the present invention has different sections at first surface and second surface
Product, exposes the part of the surface of metal layer, can not only reduce the contact resistance between circuit board and electronic component, moreover it is possible to form tool
There is the second conducting resinl of step structure, increases the bond strength of circuit board and electronic component.
Further, technical solution provided by the invention, the first conducting resinl closes the through-hole of first surface, thus in shape
When at the second conducting resinl, the case where being not in bottom surface or the side wall that conducting resinl leaks into electronic component, multiple welderings are avoided the occurrence of
Short circuit problem caused by disk interconnection or the side wall interconnection of pad and electronic component.
Further, technical solution provided by the invention forms after completing the connection of electronic component and circuit board
It is integrally wrapped in the protective film of electronic component and circuit board surface, can be increased to prevent mechanical damage, moisture attacks and chemical attack
The reliability and stability of electronic component.
Detailed description of the invention
By referring to the drawings to the description of the embodiment of the present invention, above-mentioned and other purposes of the invention, feature and
Advantage will be apparent from, in the accompanying drawings:
Fig. 1 a to 1d shows each stage of the connection method of electronic component and circuit board according to an embodiment of the present invention
Sectional view.
Fig. 2 shows the partial perspective views of circuit board assemblies according to an embodiment of the present invention；
Fig. 3 shows the partial exploded view of circuit board assemblies according to an embodiment of the present invention；
Fig. 4 shows the top view of circuit board according to an embodiment of the present invention；
Fig. 5 a to 5h shows the sectional view in each stage of the manufacturing method of circuit board according to an embodiment of the present invention.
Reference signs list
100 circuit boards
101 substrates
102 first photoresist layers
103 second photoresist layers
104 first openings
105 exposure masks
106 second openings
110 introducing portions
111 first insulating layers
112 metal layers
113 second insulating layers
114 through-holes
120 coupling parts
130 stimulated sides
131 stimulating electrodes
200 electronic components
201 pads
300 binders
301 first conducting resinls
302 second conducting resinls
310 point glue equipments
Specific embodiment
The various embodiments that the present invention will be described in more detail that hereinafter reference will be made to the drawings.In various figures, identical element
It is indicated using same or similar appended drawing reference.For the sake of clarity, the various pieces in attached drawing are not necessarily to scale.
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.
Fig. 1 a to 1d shows each stage of the connection method of electronic component and circuit board according to an embodiment of the present invention
Sectional view.
As shown in Figure 1a, electronic component 200 is connected to the first surface of circuit board 100.Electronic component 200 includes at least
One pad 201, circuit board 100 include through-hole 114 corresponding with pad 201.In this step, make the first of circuit board 100
Electronic component 200 upward, and is placed in the first surface of circuit board 100 in surface, so that pad 201 and corresponding through-hole 114 1
One alignment, forms the first conducting resinl 301, by electronic component 200 at pad 201 and/or through-hole 114 positioned at first surface
The first surface of circuit board 100 is connected to via the first conducting resinl 301.Preferably, it is formed after the first conducting resinl 201, drying
First conducting resinl 301.
Preferably, circuit board 100 includes the first insulating layer 111, metal layer 112 and second insulating layer 113, metal layer
112 between the first insulating layer 111 and second insulating layer 113, and through-hole 114 runs through the first insulating layer 111,112 and of metal layer
Second insulating layer 123.Through-hole 114 is greater than the sectional area in the first insulating layer 111 in the sectional area of second insulating layer 113, with sudden and violent
Expose the part of the surface of metal layer 112, the exposed surface of metal layer 112 is for being electrically connected.The exposed surface of first insulating layer 111
For the first surface of circuit board 100, the exposed surface of second insulating layer 113 is the second surface of circuit board 100.Circuit board 100
Preferably flexible cable (Flexible Printed Circuit, FPC).In alternate embodiments, circuit board 100 is any
Circuit board with through-hole.
Further, reverse circuit plate 100, so that the second surface of circuit board 100 is upward, as shown in Figure 1 b.In the reality
It applies in example, it is preferable that the first conducting resinl 301 closes the through-hole 114 for being located at the first surface of circuit board 100, in reverse circuit
After plate 100, the through-hole side wall of the first conducting resinl 301 and circuit board 100 forms the open semi-closed structure in top, is forming the
When two conducting resinls, the case where being not in bottom surface or the side wall that conducting resinl leaks into electronic component 200, avoiding the occurrence of conducting resinl will
Short circuit problem caused by multiple interconnection of pad 201 or the side wall interconnection of pad 201 and electronic component 200.
Further, the second conducting resinl 302 is filled in Xiang Tongkong 114, as shown in figs. lc and ld.In this step, such as
Instiled using point glue equipment 310 into through-hole 114 second conducting resinl 302, and dries the second conducting resinl 302.Preferably implementing
In example, the exposed surface of metal layer 112 is connected to pad 201 via the second conducting resinl 302 and the first conducting resinl 301, can not only
Reduce the contact resistance between circuit board 100 and electronic component 200, the step structure of the second conducting resinl 302 also adds circuit
The bond strength of plate and electronic component.
In this embodiment, the first conducting resinl 301 and the second conducting resinl 302 are silver system conducting resinl, gold system conducting resinl, platinum
Any one in gold system conducting resinl, aluminium system conducting resinl, copper system conducting resinl and carbon series conductive glue, it is preferable that the first conducting resinl 301
It is metal epoxy adhesive with the second conducting resinl 302.
In circuit board assemblies as shown in Figure 1 d, electronic component 200 is connected to circuit board by the first conducting resinl 301
100 first surface, fills the second conducting resinl 302 in the through-hole 114 of circuit board 100, and the first conducting resinl 301 can guarantee electricity
The reliability of mechanical connection between subcomponent 200 and circuit board 100, the second conducting resinl 302 can guarantee electronic component 200 with
The reliability of electrical connection between circuit board 100, two sides dispensing greatly improve between electronic component 200 and circuit board 100
Connection reliability, avoid the occurrence of the problem of electronic component 200 and 100 virtual connection of circuit board or open circuit.Program simple process, together
When improve technique yields, guarantee that electronic component 200 can work normally in the case where size-constrained, be particularly suitable for micro-
Type electronic equipment.
Preferably, after forming circuit board assemblies as shown in Figure 1 d, the guarantor for being integrally wrapped in circuit board assemblies is formed
Cuticula (not shown), protective film are in Parylene film, polyimide film, polypropylene screen, poly terephthalic acid film and pellosil
One or more, using chemical vapor deposition process, spin-coating method or injection moulding form protective film.Protective film can be to prevent machinery damage
Wound, moisture attacks and chemical attack, increase the reliability and stability of electronic component.
In this embodiment, circuit board assemblies as described above are powered, or are electrically connected to other electronic circuits, it can shape
At electronic equipment.Electronic equipment is for example including implanted device, wearable device, mobile phone, computer, camera, display etc., due to this
Scheme can form small size flexible circuit board component, therefore be particularly suitable for small electronic equipment.
Fig. 2 and Fig. 3 respectively illustrates partial perspective view and the exploded of circuit board assemblies according to an embodiment of the present invention
Figure.Circuit board assemblies include circuit board 100, electronic component 200 and bonding agent 300.
Circuit board 100 includes at least one through-hole 114, and electronic component 200 includes pad 201 corresponding with through-hole 114, is led to
Hole 114 and pad 201 correspond.Electronic component 200 is connected to the first surface of circuit board 100 via bonding agent 300, bonding
Agent 300 includes the steps that the first conducting resinl 301 and the second conducting resinl 302 formed at least different at two, the first conducting resinl
301 from the first surface dispensing of circuit board 100, second surface dispensing of second conducting resinl 302 from circuit board 100.Electronic component
200 be, for example, appointing in the elements such as capacitor, inductor, resistor, oscillator, filter, sensor and IC chip
It anticipates one kind.
Fig. 4 shows the top view of circuit board according to an embodiment of the present invention.Circuit board 100 includes introducing portion 110, connects
Socket part points 120 and stimulated side 130, the circuit board 100 are flexible cable, are suitable for implanted device, such as artificial cochlear implant,
Retina stimulates the implanted devices such as vision prosthesis, cortex stimulator, spinal stimulator and deep brain stimulator (brain pacemaker),
And flexible cable can avoid injuring tissue when contacting with tissue, and can guarantee biocompatibility and reliability.
There is at least one through-hole 114, through-hole 114 is for filling conductive material, in introducing portion in introducing portion 110
Connecting electronic component on 110.The surface or inside of coupling part 120 include metal layer (not shown) corresponding with stimulated side 130.
There are multiple stimulating electrodes 131 on stimulated side 130, and be connected to introducing portion 110, stimulating electrode 131 via coupling part 120
Via 114 connecting electronic component of through-hole, to form complete circuit.
It is to illustrate the structure of circuit board by taking the circuit board of implanted device as an example, but circuit board of the invention is not in the present embodiment
It is limited to flexible cable, electronic equipment is also not necessarily limited to implanted device, and circuit board 100 can be is appointed by what insulating layer and metal layer were formed
The circuit board for shape of anticipating, to provide electrical connection between electronic component or provide being electrically connected for electronic component and other electronic circuits
It connects, to form other electronic equipments.
Fig. 5 a to 5h shows the sectional view in each stage of the manufacturing method of circuit board according to an embodiment of the present invention.It cuts
Face figure is intercepted along the AA line in Fig. 2.
This method starts from the first photoresist layer 102 on substrate 101 and substrate 101, as shown in Figure 5 a.Substrate 101
For providing mechanical support, the first photoresist layer 102 is used to protect substrate 101 in cutting technique, and in release circuit plate
Sacrificial layer is used as in step.In alternate embodiments, the first photoresist layer 102 can be saved, to reduce cost, simplifies technique
Process.
In this step, substrate 101 is preferably wafer (wafer), convenient for forming the circuit board of small area.Wafer cleaner is complete
Cheng Hou carries out hard baking in the negative photoresist of surface spin coating of wafer, and to negative photoresist.
Further, the first insulating layer 111 is formed on the first photoresist layer 102, as shown in Figure 5 b.First insulating layer
111 material is PMMA (poly (methyl methacrylate)-polymethyl methacrylate), teflon, silicone resin, gathers
Acid imide, poly terephthalic acid (polyethylene terephthalate), Parylene (especially Parylene-C).At this
In step, preferably the first insulating layer 111 is Parylene film, and uses chemical vapor deposition (Chemical Vapor
Deposition, CVD) technique formation Parylene film.
Further, it is formed on the surface of the first insulating layer 111 and has figuratum second photoresist layer 103, such as Fig. 5 c institute
Show.In this step, for example, forming the second photoresist layer 103 on the surface of the first insulating layer 111, and to the second photoresist layer
103 exposures, development have figuratum second photoresist layer 103 to be formed.
Further, patterned metal layer 112 is formed, as fig 5d.In this step, it is formed and is filled in the second light
Metal layer 112 in the pattern of photoresist layer 103, and the second photoresist layer 103 is removed, to form patterned metal layer 112, gold
Belonging to layer 112 has the first opening 104, and the first opening 104 will be used to form a part of through-hole.
In alternate embodiments, the step of forming the second lithography layer 103 can be saved, in the table of the first insulating layer 111
After face forms metal layer 112, patterned process is carried out to metal layer 112.
Further, the second insulating layer 113 of covering metal layer 112 is formed, as depicted in fig. 5e.In this step, second
The material of the material of insulating layer 113 and the first insulating layer is identical, and preferably second insulating layer 113 is Parylene film, and using chemistry
Gas-phase deposition forms Parylene film, and Parylene film covers the exposed surface of metal layer 112 and the first insulating layer 111, preferably
Planarization process also is carried out to Parylene film.
Further, exposure mask 105 is formed in second insulating layer 113, as shown in figure 5f.The surface of exposure mask 105 has the
Two openings 106, the sectional area of the second opening 106 are greater than the sectional area of the first opening 104.It preferably, can be according to electronic component
Pad locations and multiple first openings 104 of shape design and multiple second openings 106, be adapted to various electronic components to be formed
Circuit board.
Further, the through-hole 114 through the first insulating layer 111, metal layer 112 and second insulating layer 113 is formed, is such as schemed
Shown in 5g.In this step, through-hole 114 is formed using anisotropic dry method etch technology, is located at second insulating layer when being formed
After through-hole 114 in 113, since the first opening of metal layer 112 is less than the second opening of exposure mask 105, metal layer 112
As the exposure mask for blocking the first insulating layer 111, continue to etch, insulate so as to form in second insulating layer 113 and first
Through-hole 114 of the layer 111 with different cross-sectional, the part of the surface of metal layer 112 are exposed.
Further, exposure mask 105, the first photoresist layer 102 and substrate 101 are removed, with release circuit plate 100, such as Fig. 5 h
It is shown.In this step, it is impregnated for example, by using remover to remove exposure mask 105, dissolves the first photoresist layer 102, and remove lining
Bottom 101, the step of carrying out water flushing later and toast.
It is to illustrate the manufacturing method of circuit board by taking the manufacturing method of flexible cable as an example in the present embodiment, but electricity of the invention
Road plate is not limited to flexible cable, and the structure of circuit board is also not necessarily limited to this, and circuit board 100 can be to be formed by insulating layer and metal layer
Arbitrary structures circuit board.
It is as described above according to the embodiment of the present invention, these embodiments details all there is no detailed descriptionthe, also not
Limiting the invention is only the specific embodiment.Obviously, as described above, can make many modifications and variations.This explanation
These embodiments are chosen and specifically described to book, is principle and practical application in order to better explain the present invention, thus belonging to making
Technical field technical staff can be used using modification of the invention and on the basis of the present invention well.The present invention is only by right
The limitation of claim and its full scope and equivalent.
Claims (10)
1. the connection method of a kind of electronic component and circuit board, the electronic component includes at least one pad, the circuit board
Including through-hole corresponding with the pad, which is characterized in that the connection method includes:
The electronic component is placed in the first surface of the circuit board, so that the pad and the corresponding through-hole one are a pair of
Together；
It is formed and is located at the pad and/or the first conducting resinl positioned at the through hole of the first surface；
The circuit board is overturn, so that the second surface of the circuit board is upward, wherein the second surface and first table
Face is relative to each other；And
The second conducting resinl being filled in the through-hole is formed, first conducting resinl and second conducting resinl provide the electricity
Being electrically connected between road plate and the electronic component.
2. connection method according to claim 1, which is characterized in that the circuit board include the first insulating layer, second absolutely
Edge layer and metal layer, between first insulating layer and the second insulating layer, the through-hole runs through the metal layer
First insulating layer, the metal layer and the second insulating layer；
Wherein, the through-hole is greater than the sectional area in first insulating layer in the sectional area of the second insulating layer, with exposure
The part of the surface of the metal layer out；
The first surface is the exposed surface of first insulating layer, and the second surface is the exposure of the second insulating layer
Surface.
3. connection method according to claim 1, which is characterized in that first conducting resinl will be located at the first surface
The through-hole closing.
4. connection method according to claim 1, which is characterized in that further include:
After forming first conducting resinl, first conducting resinl is dried；And/or
After forming second conducting resinl, second conducting resinl is dried.
5. connection method according to claim 1, which is characterized in that first conducting resinl and second conducting resinl are
Metal system or carbon system epoxyn.
6. connection method according to any one of claims 1 to 5, which is characterized in that formed second conducting resinl it
Afterwards, further includes: form the protective film for being integrally wrapped in the surface of the circuit board and the electronic component.
7. connection method according to any one of claims 1 to 5, which is characterized in that the electronic component is capacitor, electricity
Any one in sensor, resistor, oscillator, filter, sensor and IC chip.
8. a kind of circuit board assemblies characterized by comprising
Circuit board, the circuit board have at least one through-hole；
Electronic component, the electronic component are located at the first surface of the circuit board, and the electronic component has and the through-hole
Corresponding pad；And
Bonding agent, the bonding agent provide being electrically connected between the circuit board and the electronic component；
Wherein, the bonding agent includes the steps that the first conducting resinl and the second conducting resinl formed at least different at two, institute
It states the first conducting resinl and is located at the first surface, second conductive paste is in the through-hole.
9. a kind of electronic equipment characterized by comprising be made of connection method as described in any one of claim 1 to 7
Circuit board assemblies or circuit board assemblies according to any one of claims 8.
10. electronic equipment according to claim 9, which is characterized in that the electronic equipment is artificial cochlear implant, view
Nethike embrane stimulates any one in vision prosthesis, cortex stimulator, spinal stimulator and brain pacemaker.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910680922.4A CN110324984B (en) | 2019-07-26 | 2019-07-26 | Connection method of electronic element and circuit board, circuit board assembly and electronic equipment |
| CN201911411630.7A CN111083879B (en) | 2019-07-26 | 2019-07-26 | Connection method of electronic element and circuit board, circuit board assembly and electronic equipment |
| PCT/CN2020/103026 WO2021017922A1 (en) | 2019-07-26 | 2020-07-20 | Connection method between electronic element and circuit board, circuit board assembly, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910680922.4A CN110324984B (en) | 2019-07-26 | 2019-07-26 | Connection method of electronic element and circuit board, circuit board assembly and electronic equipment |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911411630.7A Division CN111083879B (en) | 2019-07-26 | 2019-07-26 | Connection method of electronic element and circuit board, circuit board assembly and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN110324984A true CN110324984A (en) | 2019-10-11 |
| CN110324984B CN110324984B (en) | 2020-01-17 |
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|---|---|---|---|
| CN201911411630.7A Active CN111083879B (en) | 2019-07-26 | 2019-07-26 | Connection method of electronic element and circuit board, circuit board assembly and electronic equipment |
| CN201910680922.4A Active CN110324984B (en) | 2019-07-26 | 2019-07-26 | Connection method of electronic element and circuit board, circuit board assembly and electronic equipment |
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| CN201911411630.7A Active CN111083879B (en) | 2019-07-26 | 2019-07-26 | Connection method of electronic element and circuit board, circuit board assembly and electronic equipment |
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| WO (1) | WO2021017922A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111629519A (en) * | 2020-05-18 | 2020-09-04 | 微智医疗器械有限公司 | Chip and circuit board connecting method, circuit board assembly and electronic equipment |
| WO2021017922A1 (en) * | 2019-07-26 | 2021-02-04 | 微智医疗器械有限公司 | Connection method between electronic element and circuit board, circuit board assembly, and electronic device |
| CN113131291A (en) * | 2021-03-11 | 2021-07-16 | 东莞市晟合科技有限公司 | Connecting wire carrying electronic component and manufacturing method thereof |
| CN113784500A (en) * | 2021-08-09 | 2021-12-10 | 维沃移动通信有限公司 | Circuit board structure and manufacturing method thereof |
| CN114900955A (en) * | 2022-05-07 | 2022-08-12 | 微智医疗器械有限公司 | Connection method of electronic element and circuit board, circuit board assembly and electronic equipment |
| CN114900953A (en) * | 2022-04-19 | 2022-08-12 | 微智医疗器械有限公司 | Method and assembly for connecting multiple electronic elements and circuit board and electronic equipment |
| CN117330234A (en) * | 2023-11-28 | 2024-01-02 | 微智医疗器械有限公司 | Pressure sensor assembly manufacturing method and pressure sensor assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113301718B (en) * | 2021-05-28 | 2022-11-04 | 淮南师范学院 | Method for overhauling micro electronic element |
| CN114645243A (en) * | 2022-03-04 | 2022-06-21 | 微智医疗器械有限公司 | Processing method of bonding pad of electronic element, circuit board assembly and electronic equipment |
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| WO2021017922A1 (en) * | 2019-07-26 | 2021-02-04 | 微智医疗器械有限公司 | Connection method between electronic element and circuit board, circuit board assembly, and electronic device |
| CN111629519A (en) * | 2020-05-18 | 2020-09-04 | 微智医疗器械有限公司 | Chip and circuit board connecting method, circuit board assembly and electronic equipment |
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| WO2021232893A1 (en) * | 2020-05-18 | 2021-11-25 | 微智医疗器械有限公司 | Connection method for chip and circuit board, and circuit board assembly and electronic device |
| CN113131291A (en) * | 2021-03-11 | 2021-07-16 | 东莞市晟合科技有限公司 | Connecting wire carrying electronic component and manufacturing method thereof |
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| CN114900953A (en) * | 2022-04-19 | 2022-08-12 | 微智医疗器械有限公司 | Method and assembly for connecting multiple electronic elements and circuit board and electronic equipment |
| CN114900955A (en) * | 2022-05-07 | 2022-08-12 | 微智医疗器械有限公司 | Connection method of electronic element and circuit board, circuit board assembly and electronic equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110324984B (en) | 2020-01-17 |
| CN111083879A (en) | 2020-04-28 |
| CN111083879B (en) | 2021-02-02 |
| WO2021017922A1 (en) | 2021-02-04 |
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