CN110323157A - Adhesive tape joining method and adhesive tape joining apparatus - Google Patents
Adhesive tape joining method and adhesive tape joining apparatus Download PDFInfo
- Publication number
- CN110323157A CN110323157A CN201910232150.8A CN201910232150A CN110323157A CN 110323157 A CN110323157 A CN 110323157A CN 201910232150 A CN201910232150 A CN 201910232150A CN 110323157 A CN110323157 A CN 110323157A
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- adhesive tape
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- width direction
- pulling force
- holding
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 387
- 238000000034 method Methods 0.000 title claims abstract description 108
- 238000005304 joining Methods 0.000 title claims abstract description 62
- 230000007246 mechanism Effects 0.000 claims abstract description 106
- 238000005520 cutting process Methods 0.000 claims description 38
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 3
- 238000002372 labelling Methods 0.000 claims description 2
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical group OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 description 17
- 238000011144 upstream manufacturing Methods 0.000 description 16
- 238000003825 pressing Methods 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000004064 recycling Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 235000013399 edible fruits Nutrition 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 241000283086 Equidae Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention provides a kind of adhesive tape joining method and adhesive tape joining apparatus, by structure of the adhesive tape joining in workpiece, can more reliably eliminate the difference that adhesive tape is cut into the tension in each region generated when scheduled shape corresponding with workpiece.2nd tensile machine (37) has the 1st draw-off mechanism (53) and the 2nd draw-off mechanism (55) arranged side by side on release direction (L).1st draw-off mechanism (53) and the 2nd draw-off mechanism (55) are controlled as, independently mobile to width direction and pull adhesive tape (DT) in the direction of the width.1st draw-off mechanism (53) is held away from the closer region (L1) cut-away area (C), assigns biggish pulling force (P1) in the direction of the width to region (L1).2nd draw-off mechanism (55) is held away from the farther away region (L2) cut-away area (C), assigns lesser pulling force (P2) in the direction of the width to region (L2).
Description
Technical field
The present invention relates to the back of the semiconductor crystal wafer (hereinafter, appropriately referred to as work " wafer ") across the center for being placed in ring frame
The adhesive tape of bearing is pasted to make the adhesive tape joining method and bonding for their integrated operations with the ring frame in face
Band sticker.
Background technique
After the circuit forming surface pattern of wafer, it is ground the back side of wafer by back side grinding process, and leads to
It crosses cutting action and the wafer is divided into many chip elements.In this case, in order to prevent in cutting action from wafer point
The chip element cut out disperses, propose a kind of adhesive tape by bearing by across wafer the back side and ring frame be close in a manner of into
Row is pasted and integrated method.
In the case where carrying out such adhering processes, band-like adhesive tape is released and is supplied, and by the adhesive tape across
It pastes to the back side of wafer and ring frame, is then circle by adhesive tape cutting along ring frame.As a result, to shown in appended drawing reference L
Direction release band-like part shown in reference number C adhesive tape DT ((a) of Figure 16) in be cut into circle (Figure 16
(b)).
The state of affairs of fold, ripple is generated in adhesive tape DT when releasing adhesive tape DT in order to prevent, to the length of adhesive tape DT
Degree direction (release direction L) equably assigns pulling force.But when a part of adhesive tape DT is cut, such as (c) institute of Figure 16
Show, near the part of cutting, that is, cut-away area C, generates to high-frequency the fold F mainly extended to release direction L.Especially
When adhesive tape DT is soft material, the generation of fold F becomes significant.
As its reason, it is contemplated that because formed cut-away area C caused by pulling force unevenness homogenize.That is, bonding
In band DT, adhesive tape DT is continuous in two end sides of width direction, and still, the central portion of the width direction of adhesive tape DT is because cutting off area
Domain C and become discontinuous.As a result, two end sides of width direction are endowed biggish pulling force, both ends on release direction L
The difference of the pulling force of the pulling force and central portion of side causes to generate fold F.
Therefore, in recent years it has been proposed that one kind applies drawing when cutting adhesive tape DT every time in the width direction of adhesive tape DT
The adhesive tape joining method of power (referring for example to patent document 1,2).That is, as Figure 16 (d) shown in, cutting adhesive tape DT it
Afterwards, adhesive tape is held on the predetermined length of release direction L using the clamping components 103 of plate possessed by tensile machine 101
The both ends of the width direction of DT.
Then, each clamping components 103 are led to width direction R by cylinder 105 possessed by tensile machine 101
It draws, to assign pulling force to adhesive tape DT to width direction R.It is desirable that as shown in (d) of Figure 16, by width direction
Pulling force is assigned, fold F is completely removed, and adhesive tape DT becomes flat, and adhesive tape DT can be tightly attached to the side of wafer again
Formula is pasted.
Patent document 1: Japanese Unexamined Patent Publication 2008-205363 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2013-135053 bulletin
Summary of the invention
Problems to be solved by the invention
But there is a problem of in above-mentioned existing apparatus following.
That is, existing structure from it is ideal different, however, it is difficult to reliably remove the fold F for resulting from adhesive tape DT.
That is, the following state of affairs continually occurs as shown in (b) of Figure 17: even if assigning pulling force, pleat using existing tensile machine 101
Although wrinkle F can be reduced, but not be completely removed and have residual.In addition, when using existing tensile machine 101 to assign pulling force
When, as shown in (c) of Figure 17, also worry is new generates other problems as the fold G that R extends in the width direction.
The adhesive tape DT for remaining the part of fold is not suitable as the object for being closely pasted on wafer and cutting.It is tied
Fruit is to need to avoid the part of fold to set next cut-away area C, and therefore, the spacing of cut-away area C becomes larger.Therefore, it glues
The discarding amount of crossed belt DT increases.
About such problems, inventor is constantly conscientiously studied, and is as a result obtained to draw a conclusion.That is, fold F is not
It is equably generated on release direction L, but as shown in (a) of Figure 17, in away from the closer region L1 of cut-away area C more
It generates.On the other hand, on the release direction L of adhesive tape DT, the fold F that is generated in away from the farther away region L2 of cut-away area C
Amount it is less.
I.e. it is capable to expect, because the shrinkage on width direction R caused by fold F is larger in the L1 of region, in area
Because the shrinkage on width direction R caused by fold F is smaller in the L2 of domain.That is, acting on area in the state of having generated fold F
The tension T1 of domain L1 is less than the tension T2 for acting on region L2.Therefore, in order to reliably remove fold F and put down adhesive tape integrally
Smoothization needs to assign pulling force more energetically in the L1 of region compared with the L2 of region, homogenizes the pulling force of effect on the whole.
But, it is known that existing draw-off mechanism 103 be directed to away from the closer region L1 of cut-away area C and away from cut-away area C compared with
Remote region L2 assigns the pulling force of uniform power respectively.That is, area can properly be removed by imparting in tensile machine 101
In the case where this level of pulling force J1 of fold F in the L2 of domain, pulling force J1 does not fill the fold F in removal region L1
Point.As a result, as shown in (b) of Figure 17, the still remaining fold F in the L1 of region.
On the other hand, bigger lead is being imparted by tensile machine 101 in order to reliably remove the fold F in the L1 of region
In the case where pulling force J2, in the L1 of region, the size of traction force J2 is appropriate, and fold F is removed.But in the L2 of region, drawing
Power J2 becomes excessive power, that is, allows to remove the fold F along release direction, but assign excessive power to width direction R, ties
Fruit is that have the stylish fold G ((c) of Figure 17) for generating and extending in the width direction.In addition, also worrying the following state of affairs, pass through tax
The pulling force of excessive power is given, so that adhesive tape DT is deformed in a manner of extending in the direction of the width, Huo Zhe in region L2 etc.
Adhesive tape DT generates cracking equivalent damage.
The present invention has been made in view of such circumstances, and main purpose is to provide adhesive tape joining method and bonding
Band sticker, the adhesive tape joining method and adhesive tape joining apparatus, can by structure of the adhesive tape joining in workpiece
More reliably eliminate the tension in each region generated when adhesive tape is cut into predetermined shape corresponding with workpiece
Difference.
The solution to the problem
The present invention takes following structure to reach such purpose.
That is, the structure is characterized in that, include
Paste process, in this process, by band-like adhesive tape joining in workpiece；
The adhesive tape for being pasted on the workpiece is cut into opposite with the workpiece by cutting-off process in this process
The scheduled shape answered；And
Pulling force assign process, in this process, by the adhesive tape joining when workpiece, in the adhesive tape
Pulling force is assigned to the adhesive portion of the adhesive tape in width direction,
The pulling force assign during, in the width direction of the adhesive tape respectively in the adhesive tape along institute
State at least two region of the length direction arrangement of adhesive tape, that is, away from being cut into the scheduled shape in cutting-off process before
Closer 1st region of the cut-away area of shape and different drawings is assigned far from the 2nd region of the cut-away area than the 1st region
Power.
(function and effect) according to this structure, have pulling force assign process, in this process, by adhesive tape joining in work
When part, pulling force is assigned to the adhesive portion of adhesive tape in the width direction of adhesive tape.During pulling force assigns, in adhesive tape
Width direction on assign respectively different drawing to the 1st region arranged on the length direction of adhesive tape and the 2nd region respectively
Power.1st region is closer away from the cut-away area for being cut into scheduled shape in cutting-off process before, and the 2nd region is than the 1st area
Domain is far from cut-away area.
Therefore, even if can also divide in the state that there is respectively different tension in the 1st region and the 2nd each self-applying in region
It is other to assign respectively different pulling force to the 1st region and the 2nd region.As a result, can reliably make during pulling force assigns
It is respectively acting on uniform in sizeization of the tension in the 1st region and the 2nd region.
In addition, in the present invention as stated above, it is preferred that the pulling force assigns process and includes
Holding process holds institute from the two sides of the width direction of the adhesive tape using the 1st handle sturcture in this process
The 1st region is stated, and holds the 2nd region from the two sides of the width direction of the adhesive tape using the 2nd handle sturcture；And
Traction process pulls the 1st holding machine in this process with the 1st power in the width direction of the adhesive tape
Structure, and the 2nd handle sturcture is pulled in the width direction of the adhesive tape with 2nd power different from the 1st power.
(function and effect) according to this structure, the 1st region and the 2nd region are held by different handle sturctures respectively, and with
Respectively different power is pulled in the width direction of adhesive tape.Therefore, can control is to make in the 1st region in adhesive tape
Width direction on the pulling force assigned and the pulling force assigned in the width direction of adhesive tape in the 2nd region it is reliably different.
In addition, in the present invention as stated above, it is preferred that the pulling force assigns process and includes
Holding process, in this process, using described in two sides holding of the handle sturcture from the width direction of the adhesive tape
1st region and the 2nd region；And
Traction process is pulled in the handle sturcture in the width direction of the adhesive tape with the 1st power in this process
Holding the 1st region part, and with 2nd power different from the 1st power in the width direction of the adhesive tape
Pull the part in holding the 2nd region in the handle sturcture.
(function and effect) hold institute from the two sides of the width direction of the adhesive tape according to this structure, using handle sturcture
State the 1st region and the 2nd region.Also, the holding in handle sturcture is pulled in the width direction of adhesive tape with the 1st power
The part in 1 region, and the holding in handle sturcture is pulled with 2nd power different from the 1st power in the width direction of adhesive tape
The part in the 2nd region.In this case, it can control and be, it is not necessary to handle sturcture be made to separate the drawing that can make to assign to the 1st region
Power and the pulling force assigned to the 2nd region are reliably different.
In addition, in the present invention as stated above, it is preferred that the pulling force assigns process and includes
Holding process, in this process, using described in two sides holding of the handle sturcture from the width direction of the adhesive tape
1st region and the 2nd region；And
Inclined direction traction process, in this process, by the handle sturcture to the width direction from the adhesive tape to
The inclined direction drawing of the length direction of the adhesive tape.
(function and effect) hold institute from the two sides of the width direction of the adhesive tape according to this structure, using handle sturcture
State the 1st region and the 2nd region.Also, it is inclined in the length direction of the width direction from adhesive tape to the adhesive tape
Side pulls up handle sturcture.Even such structure, can also control to make the pulling force assigned to the 1st region and to the 2nd
The pulling force that region assigns is reliably different.
In addition, in the present invention as stated above, it is preferred that the pulling force assigns process and includes
Holding process, in this process, using described in two sides holding of the handle sturcture from the width direction of the adhesive tape
1st region and the 2nd region；And
Traction process pulls the holding using drawing component in this process in the width direction of the adhesive tape
Mechanism, the part in holding the 1st region which is set in the handle sturcture and the portion for holding the 2nd region
That side of the part by holding the 1st region in point.
(function and effect) hold the 1st area from the two sides of the width direction of adhesive tape according to this structure, using handle sturcture
Domain and the 2nd region.Also, handle sturcture is pulled in the width direction of adhesive tape using drawing component, which is set to
The part in the 1st region of holding in handle sturcture and that for holding the part by the 1st region of holding in the part in the 2nd region
Side.In this case, the power that drawing component is pulled to width direction more strongly acts on that side in the 1st region.Therefore, it is not necessary to
There are the multiple handle sturctures and multiple draw-off mechanisms of separation simultaneously, it will be able to control for make the pulling force that the 1st region is assigned and
The pulling force assigned to the 2nd region is reliably different.
In addition, in the present invention as stated above, it is therefore preferred to have: both ends detection process detects the described 1st in this process respectively
The width direction of the position at the both ends of the width direction of the adhesive tape in region and the adhesive tape in the 2nd region
Both ends position；And
Pulling force calculating process based on each position at the both ends detected, is calculated separately described in this process
In the width direction of adhesive tape to the 1st region assign pulling force and in the width direction of the adhesive tape to the described 2nd
The pulling force that region assigns.
(function and effect) according to this structure, detect the position at the both ends of the width direction of the adhesive tape in the 1st region respectively
Set the position with the both ends of the width direction of the adhesive tape in the 2nd region.Also, each position based on the both ends detected,
The pulling force for calculating separately the pulling force to the imparting of the 1st region and the 2nd region being assigned.In this case, by suitably detecting both ends
Position variation, can correctly and critically calculate to the 1st region assign pulling force and to the 2nd region assign pulling force respectively
It is whether appropriate.Therefore, it can more reliably make the pulling force for acting on the 1st region and the pulling force for acting on the 2nd region critically equal
It homogenizes.
The present invention can also take structure below to reach such purpose.
That is, the structure is characterized in that, comprising:
Labelling machine, by band-like adhesive tape joining in workpiece；
The adhesive tape for being pasted on the workpiece is cut into corresponding with the workpiece scheduled by cutting mechanism
Shape；And
Pulling force imparting mechanism, by the adhesive tape joining when workpiece, in the width direction of the adhesive tape
On assign pulling force to the adhesive portion of the adhesive tape,
The pulling force imparting mechanism is in the width direction of the adhesive tape respectively to gluing in the adhesive tape along described
At least two region of the length direction arrangement of crossed belt, that is, away from being cut into the scheduled shape in cutting-off process before
Closer 1st region of cut-away area and different pulling force is assigned far from the 2nd region of the cut-away area than the 1st region.
(function and effect) according to this structure, which has pulling force imparting mechanism, by adhesive tape
When being pasted on workpiece, pulling force is assigned to the adhesive portion of adhesive tape in the width direction of adhesive tape.During pulling force assigns,
Difference is assigned to the 1st region arranged on the length direction of adhesive tape and the 2nd region respectively in the width direction of adhesive tape
Different pulling force.1st region is closer away from the cut-away area for being cut into scheduled shape in cutting-off process before, the 2nd region
Than the 1st region far from cut-away area.
Therefore, even if can also divide in the state that the 1st region and the 2nd region act on respectively respectively different tension
It is other to assign respectively different pulling force to the 1st region and the 2nd region.As a result, assigning process by pulling force, can reliably make
Uniform in sizeization for the tension that the 1st region and the 2nd region are acted on respectively.
In addition, in the present invention as stated above, it is preferred that the pulling force imparting mechanism includes
1st handle sturcture holds the 1st region from the two sides of the width direction of the adhesive tape；
2nd handle sturcture holds the 2nd region from the two sides of the width direction of the adhesive tape；
1st drawing component, pulls the 1st handle sturcture with the 1st power in the width direction of the adhesive tape；And
2nd drawing component, pulls institute with 2nd power different from the 1st power in the width direction of the adhesive tape
State the 2nd handle sturcture.
(function and effect) according to this structure, the 1st region and the 2nd region are held by different handle sturctures respectively, and with
Respectively different power is pulled in the width direction of adhesive tape.Therefore, can control is to make to the 1st region in adhesive tape
The pulling force assigned in width direction and the pulling force assigned in the width direction of adhesive tape to the 2nd region are reliably different.
In addition, in the present invention as stated above, it is preferred that the pulling force imparting mechanism includes
Handle sturcture holds the 1st region and the 2nd region from the two sides of the width direction of the adhesive tape；
1st drawing component, the holding in the handle sturcture is pulled with the 1st power in the width direction of the adhesive tape
The part in the 1st region；And
2nd drawing component, pulls institute with 2nd power different from the 1st power in the width direction of the adhesive tape
State the part in holding the 2nd region in handle sturcture.
(function and effect) according to this structure, using single handle sturcture, can control to make to the imparting of the 1st region
Pulling force and the pulling force assigned to the 2nd region are reliably different.
In addition, in the present invention as stated above, it is preferred that the pulling force imparting mechanism includes
Handle sturcture holds the 1st region and the 2nd region from the two sides of the width direction of the adhesive tape；
And
Inclined direction pulls component, tilts to the width direction from the adhesive tape to the length direction of the adhesive tape
Direction pull the handle sturcture.
(function and effect) according to this structure, using single handle sturcture and single draw-off mechanism, can control and be
Keep the pulling force assigned to the 1st region and the pulling force assigned to the 2nd region reliably different.
In addition, in the present invention as stated above, it is preferred that the pulling force imparting mechanism includes
Handle sturcture holds the 1st region and the 2nd region from the two sides of the width direction of the adhesive tape；
Component is pulled, the part and holding the 2nd region in holding the 1st region in the handle sturcture are set to
Part in the part by holding the 1st region that side, and in the width direction of the adhesive tape described in drawing
Handle sturcture.
(function and effect) hold the 1st area from the two sides of the width direction of adhesive tape according to this structure, using handle sturcture
Domain and the 2nd region.Also, handle sturcture is pulled in the width direction of adhesive tape using drawing component, wherein the drawing component
The part in the 1st region of holding in handle sturcture and the part by holding the 1st region in the part for holding the 2nd region
That side.In this case, the power that drawing component is pulled to width direction more strongly acts on that side in the 1st region, therefore,
It can control and be, it is not necessary to which separating handle sturcture can make the pulling force assigned to the 1st region and the pulling force assigned to the 2nd region can
By ground difference.
In addition, in the present invention as stated above, it is therefore preferred to have:
Both ends testing agency is used to detect the both ends of the width direction of the adhesive tape in the 1st region respectively
Position and the adhesive tape in the 2nd region width direction both ends position；And
Pulling force is calculated mechanism and is calculated separately based on each position at the both ends detected in the adhesive tape
The 2nd region is assigned to the pulling force of the 1st region imparting and in the width direction of the adhesive tape in width direction
Pulling force.
(function and effect) according to this structure, the variation of the position by suitably detecting both ends can correctly and critically
Calculate the pulling force assigned to the 1st region and pulling force that the 2nd region is assigned respectively whether appropriately.Therefore, can more reliably make
The pulling force for acting on the 1st region and the pulling force for acting on the 2nd region critically homogenize.
The effect of invention
Adhesive tape joining method according to the present invention and adhesive tape joining apparatus, in workpiece and cut by adhesive tape joining
In structure for scheduled shape corresponding with the workpiece, it can more reliably eliminate and each of be generated when adhesive tape is cut
The difference of the tension in region.
Detailed description of the invention
Fig. 1 is the main view for indicating the basic structure of adhesive tape joining apparatus of embodiment 1.
Fig. 2 is the figure for indicating the structure of the 2nd tensile machine of embodiment 1.
(a) of Fig. 2 is the top view of the 2nd tensile machine, and (b) of Fig. 2 is the left view of the 2nd tensile machine.
Fig. 3 is the figure for indicating the movement of adhesive tape joining apparatus of embodiment 1.
(a) of Fig. 3 is the flow chart for indicating the summary of process of fabrication and installation frame, and (b) of Fig. 3 is the knot for indicating installing frame
The perspective view of structure.
Fig. 4 is the figure for indicating the movement of step S3 of embodiment 1.
(a) of Fig. 4 is the figure for indicating to paste the state before adhesive tape, and (b) of Fig. 4 is to indicate adhesive tape joining in wafer
With the figure of the state after ring frame.
Fig. 5 is the figure for indicating the movement of step S4 of embodiment 1.
Fig. 6 is the figure for indicating the movement of step S5 of embodiment 1.
Fig. 7 is the figure for indicating the movement of step S6 of embodiment 1.
Fig. 8 is the figure for indicating the movement of step S7 of embodiment 1.
(a) of Fig. 8 is the top view for indicating the state of the adhesive tape before step S7 starts, and (b) of Fig. 8 is to indicate step S7
The top view of the state of adhesive tape after implementation.
Fig. 9 is the figure for indicating the movement of step S8 of embodiment 1.
(a) of Fig. 9 is to indicate that the 2nd tensile machine holds the top view of the state of adhesive tape, and (b) of Fig. 9 is the 2nd puller system
Structure holds the left side view of the state of adhesive tape.
Figure 10 is the figure for indicating the movement of step S8 of embodiment 1.
(a) of Figure 10 is to indicate that the 2nd tensile machine assigns the left side view of the state of pulling force, and (b) of Figure 10 is to indicate the 2nd
Tensile machine assigns the top view of the state of pulling force.
Figure 11 is the skeleton diagram for illustrating the step S8 of embodiment 1.
(a) of Figure 11 is the top view for indicating the width of initial adhesive tape, and (b) of Figure 11 is after the completion of indicating step S4
Adhesive tape width approximate vertical view, (c) of Figure 11 is to indicate that the outline of the width of the adhesive tape after the completion of step S8 is bowed
View.
Figure 12 is the figure for indicating the structure of the 2nd tensile machine of embodiment 2.
(a) of Figure 12 is the top view of the 2nd tensile machine, and (b) of Figure 12 is the main view of the 2nd tensile machine.
Figure 13 is the figure for indicating the movement of step S8 of embodiment 2.
(a) of Figure 13 is to indicate that the 2nd tensile machine holds the top view of the state of adhesive tape, and (b) of Figure 13 is to indicate the 2nd
Tensile machine assigns the top view of the state of pulling force.
Figure 14 is the figure for indicating the movement of step S8 of variation.
(a) of Figure 14 is to indicate that the 2nd tensile machine of the 1st variation assigns the top view of the state of pulling force, (b) of Figure 14
It is to indicate that the 2nd tensile machine of the 2nd variation assigns the top view of the state of pulling force.
Figure 15 is the figure for illustrating the adhesive tape joining apparatus of variation.
(a) of Figure 15 is the perspective view for indicating the structure of wafer used in variation, and (b) of Figure 15 is to indicate variation
In an example of preferred holding station and the structure with cutting unit main view, (c) of Figure 15 is the step for illustrating variation
The main view of the movement of rapid S4, (d) of Figure 15 are an examples of the cutting track for indicating that adhesive tape is cut in variation
Top view, (e) of Figure 15 are the top views for the example for indicating that the cutting track that adhesive tape is cut in variation is different, Figure 15's
(f) be the example for indicating that the structure of preferred holding station in variation is different main view.
Figure 16 is the figure for illustrating the adhesive tape joining apparatus of conventional example.
(a) of Figure 16 is to indicate adhesive tape by the figure of the state before cutting, and (b) of Figure 16 is to indicate that adhesive tape is cut
The figure of state later, (c) of Figure 16 are to indicate that adhesive tape is generated the figure of the state of fold by cutting, and (d) of Figure 16 is table
Show the figure of the ideal state using existing tensile machine removal fold.
The figure for the problem of Figure 17 is the adhesive tape joining apparatus for illustrating conventional example.
(a) of Figure 17 is the non-uniform figure for the fold for indicating to be formed, and (b) of Figure 17 is to indicate to impart weaker drawing
The figure of the problem of figure of the problem of in the case where power, (c) of Figure 17 is in the case where indicating to impart stronger pulling force.
Description of symbols
1, adhesive tape joining apparatus；3, band supply unit；4, the 1st tensile machine；5, holding station；7, band application unit；9, band
Cutting unit；11, band stripping unit；13, band recoverer；15, separate sheet recoverer；27, cylinder；28, dummy roll；29, it adjusts
Save roller；31, wafer maintaining part；33, frame maintaining part；37, the 2nd tensile machine；40, control unit；43, cutter；45, pressing roller；47,
Nip roll；50, input unit；53, the 1st draw-off mechanism；51, the 2nd draw-off mechanism；61, component is held；63, cylinder；65, motor；
71, sensor；DT, adhesive tape；S, separate sheet；C, cut-away area；F, G, fold.
Specific embodiment
[embodiment 1]
Illustrate the embodiment of the present invention referring to the drawings.Fig. 1 is the base for indicating the adhesive tape joining apparatus 1 of embodiment 1
The main view of this structure.In addition, the bearing part for supporting various structures is omitted in the figure for indicating adhesive tape joining apparatus 1
With the diagram of the driving part of the various structures of driving etc..
The purpose of the adhesive tape joining apparatus 1 of embodiment 1 is, across semiconductor crystal wafer W (following only referred to as " wafer W ")
A face and ring frame f paste the adhesive tape DT of bearing, to make installing frame MF shown in (b) of Fig. 3.In addition, this reality
It applies example and uses back side grinding treated wafer W.
In addition, in the present embodiment, " upstream " and " downstream " is defined along the release direction L of adhesive tape DT.
That is, the meaning of " upstream " is, on the release direction L of adhesive tape DT, away from the closer side of aftermentioned band supply unit 3.
<integrally-built explanation>
As shown in Figure 1, the adhesive tape joining apparatus 1 of the present embodiment has band supply unit 3, the 1st tensile machine 4, holding station
5, band application unit 7, band cutting unit 9, band stripping unit 11, band recoverer 13, separate sheet recoverer 15 and the 2nd puller system
Structure 37.
Band supply unit 3 has supply spool 19 and stripper roll 21 etc..Adhesive tape volume 20 is loaded on supply spool 19.Bearing is used
Adhesive tape DT with add the state for having separate sheet S be wound in adhesive tape volume 20.
Supply spool 19 and electromagnetic brake 23 interlock connection and are applied appropriate rotational resistance.Electromagnetic brake 23 is used
Adhesive tape DT is supplied in preventing from excessively releasing from supply spool 19.
Stripper roll 21 draws the separate sheet S being stripped to separate sheet recoverer 15 from adhesive tape DT peel separation piece S
It leads.
As shown in Figure 1, the 1st tensile machine 4 has the cylinder 27 that swing arm 25 can be made to vibrate.Swing arm 25 is by freedom
Rotating roller 28 is pivotally supported the fulcrum in fixing axle, has regulating roller 29 in free end side.1st tensile machine 4 is configured to, and makes and makees
The regulating roller 29 of the free end side for the swing arm 25 that the work of dynamic cylinder 27 is linkedly swung declines, and adhesive tape DT is depressed downwards
And pulling force is assigned to release direction L.
Holding station 5 has wafer maintaining part 31, frame maintaining part 33 and base portion 17 as shown in Figure 1.Wafer maintaining part 31 will be
Circuit forming face is pasted with the wafer W of the adhesive tape PT of protection so that the circuit forming face state directed downwardly is loaded and kept.
In the present embodiment, keep the chuck table of wafer W as wafer maintaining part 31 using can adsorb, but wafer maintaining part 31
It's not limited to that for structure.
Frame maintaining part 33 is made of the cricoid base station for erectting setting in a manner of surrounding wafer maintaining part 31, is loaded and is protected
Support ring frame f.In addition, to be placed in the upper of the upper surface of the wafer W of wafer maintaining part 31 and the ring frame f that is placed in frame maintaining part 33
The mode that surface flushes constitutes wafer maintaining part 31 and frame maintaining part 33.Base portion 17 is configured to keep with wafer maintaining part 31 and frame
The respective lower part in portion 33 is connected, and is able to carry out lifting moving.
With application unit 7 to be placed in holding station 5 and be adsorbed holding wafer W circuit face paste adhesive tape DT.Such as
Shown in Fig. 1, with application unit 7 have the movable table 34 that is moved back and forth along guide rail left and right horizontal (not shown) and by with movable table
The Sticking roller 35 that 34 brackets being connected are pivotally supported.
The top of holding station 5 is configured at cutting unit 9, with frame 38, fulcrum 39, supporting arm 41, cutter 43 and
Pressing roller 45.
Fulcrum 39 can carry out lifting moving along frame 38, and be driven to around the supercentral vertical axis for being located at holding station 5
Line P rotation.Supporting arm 41 is extended a plurality of radially centered on fulcrum 39.Cutter 43 is set to the top of supporting arm 41a, will
The adhesive tape DT pasted to transannular frame f and wafer W is cut off along ring frame f.Pressing roller 45 simultaneously exists on one side set on the top of supporting arm 41b
The band place of incision rolling of ring frame f is pressed on one side.
Make the adhesive tape DTw and adhesive tape DTw quilt on the surface for being cut and being pasted on wafer W by cutter 43 with stripping unit 11
Become unwanted adhesive tape DT, that is, unwanted band DTn separation after cutting.Band stripping unit 11 has and the 1st tensile machine
4 cooperate and maintain the guide reel 46 and nip roll 47 of the pulling force of adhesive tape DT.
Nip roll 47 is made of the pinch roll 47a and the conveying roller 47b being driven by a motor for being able to carry out lifting moving.Band stripping
It is configured to move back and forth along guide rail left and right horizontal (not shown) from unit 11.
It is disposed in the downstream with stripping unit 11 with recoverer 13, for winding the recycling spool 49 of unwanted band DTn
It is driven and is rotated to coiling direction.In separate sheet recoverer 15, for winding returning from the adhesive tape DT separate sheet S removed
Scroll 51 is driven and is rotated to coiling direction.Recycling spool 49 and recycling spool 51 respectively form as by horse (not shown)
It is to rotate forward reversion up to rotation drive control.
In addition, adhesive tape joining apparatus 1 also has control unit 40 and input unit 50.Control unit 40 has CPU (center calculation
Processing unit) etc., for being uniformly controlled the various movements of adhesive tape joining apparatus 1.Example as input unit 50 can be enumerated
Deck plate, keyboard etc. are controlled, operator is able to use input unit 50 and inputs various instructions.The instruction content inputted by input unit 50
It is sent to control unit 40, control unit 40 can carry out various be uniformly controlled according to the instruction.
<structure of the 2nd tensile machine>
Illustrate the structure of the 2nd tensile machine 37 herein.2nd tensile machine 37 is held in the presumptive area H of adhesive tape DT
The both ends of width direction R.2nd tensile machine 37 is made of multiple draw-off mechanisms of independent drive control.In the present embodiment by 2
A draw-off mechanism i.e. the 1st draw-off mechanism 53 and the 2nd draw-off mechanism 55 are constituted.1st draw-off mechanism 53 and the 2nd draw-off mechanism 55 are viscous
Configuration side by side on the release direction L of crossed belt DT.2nd tensile machine 37 is equivalent to pulling force imparting mechanism of the invention.
1st draw-off mechanism 53 is set to the downstream side of the 2nd draw-off mechanism 55 as shown in (a) of Fig. 2, by across 5 phase of holding station
A pair of of holding unit 53A, 53B of outfit are constituted.2nd draw-off mechanism 55 is by across opposite a pair of of the holding being equipped with of holding station 5
Unit 55A, 55B are constituted.
Holding unit 53A, 53B hold the both ends of the width direction R of adhesive tape DT respectively, move on width direction R
Preset distance.By the movement, in the region that the 1st draw-off mechanism 53 in adhesive tape DT is held, assigned to width direction R
The pulling force P1 of predefined size.In addition, holding unit 55A, 55B are similarly, the two of the width direction R of adhesive tape DT are held respectively
End, the mobile preset distance on width direction R.By the movement, the region of the 2nd draw-off mechanism 55 holding in adhesive tape DT
In, the pulling force P2 of predefined size is assigned to width direction R.
The structure of holding unit 53A, 53B, 55A and 55B be it is common, all have hold component 61, cylinder 63 with
And motor 65.It holds component 61 and holds adhesive tape DT from the two sides of thickness direction (being in the present embodiment the direction y).In addition, handle
Component 61 is held to be configured to suitably decontrol the holding.
Cylinder 63 is configured to be connected with holding component 61, and inverts with the rotating forward of motor 65 linkedly in width direction
Expanding-contracting action is carried out on R.That is, hold component 61 along with the expanding-contracting action of cylinder 63, it can be hold adhesive tape DT's
It is moved on width direction R under state.According to the rotation amount of motor 65 and direction of rotation, to determine to hold component 61 in width side
The distance moved on R and direction.
As shown in (b) of Fig. 2, holding component 61 has fixed receiving sheet 67, movable plate 68, cylinder 69 and motor
70.Cylinder 69 is connected with movable plate 68, and inverts linkedly on the thickness direction of adhesive tape DT with the rotating forward of motor 70
It is flexible.That is, movable plate 68 carries out lifting moving along with the expanding-contracting action of cylinder 69 on the thickness direction of adhesive tape DT.
Component 61 is held to be configured to that movement is opened and closed using fixed receiving sheet 67 and movable plate 68, by as closed state come
Adhesive tape DT is steadily held, releases the holding by becoming opening state.
Set on each holding unit 53A, 53B, 55A and 55B motor 65 rotation respectively by control unit 40 independently
Control.It is especially respectively arranged on the rotation of the motor 65 of holding unit 53A, 53B and is respectively arranged on the horse of holding unit 55A, 55B
Rotation up to 65 is independently controlled.It in the present embodiment, can be to be led by the 1st by independently controlling the rotation of motor 65
The size for the pulling force P1 that drawing mechanism 53 the assigns mode respectively different with the size of pulling force P2 assigned by the 2nd draw-off mechanism 55 into
Row control.
In embodiment 1, the holding component 61 set on each holding unit 53A, 53B is equivalent to of the invention the 1st and holds
Mechanism.Holding component 61 set on each holding unit 55A, 55B is equivalent to the 2nd handle sturcture of the invention.Set on each one or two
The cylinder 63 and motor 65 for holding unit 53A, 53B are equivalent to the 1st drawing component of the invention.Set on each holding unit 55A,
The cylinder 63 and motor 65 of 55B is equivalent to the 2nd drawing component of the invention.
In addition, adhesive tape joining apparatus 1 has sensor 71.As shown in Figure 1, sensor 71 by release direction L simultaneously
The sensor 71a and sensor 71b for arranging configuration are constituted.Sensor 71a and sensor 71b is made of 1 pair of sensor respectively.
Sensor 71a and sensor 71b is on the width direction R as shown in (a) of Figure 10 etc. for detecting adhesive tape DT
The position at both ends.That is, sensor 71a detects adhesive tape DT for the region held by the 1st draw-off mechanism 53 in adhesive tape DT
Width direction R on both ends position.Sensor 71b is directed to the region held by the 2nd draw-off mechanism 55 in adhesive tape DT,
Detect the position at the both ends on the width direction R of adhesive tape DT.
As the structure of sensor 71, it can be properly used optical sensor, voltage sensitive sensor etc. and be able to detect adhesive tape
The structure of the position of the end of DT.The position of end of the control unit 40 based on the adhesive tape DT detected by sensor 71, to count
Calculation is by the pulling force P1 that the 1st draw-off mechanism 53 the assigns and pulling force P2 assigned by the 2nd draw-off mechanism 55.The detailed description of calculation method
It sees below.Sensor 71 is equivalent to both ends testing agency of the invention, and control unit 40 is equivalent to pulling force of the invention and calculates mechanism.
<summary with sticking placement>
Here, explanation carrys out a series of elemental motion of fabrication and installation frame MF using adhesive tape joining apparatus 1.Fig. 3 is to say
The flow chart of the bright process for pasting across the wafer W of adhesive tape DT of bearing and ring frame f.
At this moment, holding station 5, with application unit 7, with cutting unit 9 and with stripping unit 11 respectively to (a) institute of Fig. 4
The initial position shown is mobile.That is, mobile to the right side of holding station 5 with application unit 7, with stripping unit 11 to a left side for holding station 5
Side is mobile.In addition, standby in the top of holding station 5 with cutting unit 9.Holding station 5 with loading ring frame f and wafer W not
The mode that can be interfered with adhesive tape DT phase moves base portion 17 downwards.
In addition, the adhesive tape for having separate sheet S will be added by rolling up 20 from the adhesive tape for being loaded on spool 19 in band supply unit 3
DT is downstream released and is supplied, and is adhesive tape DT and separate sheet S using the removing of stripper roll 21.Then, adhesive tape DT is by viscous to band
It pastes unit 7 and is guided with stripping unit 11.In addition, using the 1st tensile machine 4, guide reel 46 and nip roll 47 to adhesive tape
DT moderately assigns pulling force to release direction L.
When issuing stickup instruction, the wafer W of scheduled wafer incorporating section is accommodated in after alignment tool contraposition, using not
The wafer conveying mechanism of diagram is placed in the wafer maintaining part 31 of holding station 5.It is placed in the wafer W rotation of wafer maintaining part 31,
By the center of wafer W be located at wafer maintaining part 31 it is supercentral in a manner of align, wafer W is adsorbed holding in this state.(step
Rapid S1).
Then, the ring frame f of scheduled frame incorporating section is accommodated in after alignment tool contraposition, utilizes frame conveyer (not shown)
Structure is placed in frame maintaining part 33.The upper surface for being placed in the ring frame f of frame maintaining part 33 flushes (step with the upper surface of wafer W
S2)。
Then, as shown in (b) of Fig. 4, the base portion 17 of holding station 5, which rises, to be moved, and the upper surface of wafer W and ring frame f become
The height roughly the same with adhesive tape DT.Also, the Sticking roller 35 with application unit 7 on one side presses downwards adhesive tape DT,
(in Fig. 4 be left) is rolled forwards on wafer W on one side, and the initial position shown in the dotted line is to terminal position shown in solid
Set movement.The back side of the adhesive tape DT across wafer W is whole as a result, closely pastes with ring frame f, thus fabrication and installation frame MF (step
Rapid S3).
After wafer W and ring frame f are pasted with adhesive tape DT, band cutting unit 9 works, and begins to switch off adhesive tape
DT.That is, as shown in figure 5, being worked by band cutting unit 9 standby above, fulcrum 39 drops to scheduled height, knife
Tool 43 pierces through adhesive tape DT.
In this state, fulcrum 39 is rotated around the axis of vertical axis line P.By the rotation, supporting arm 41 is with vertical axis
Line P is that rotation center is rotated.Cutter 43 rolls on ring frame f along with the rotation of supporting arm 41, by the edge adhesive tape DT
Ring frame f is cut to round (step S4).At this moment, pressing roller 45 rolls at the rear of the cutter 43 of rolling.That is, the quilt of adhesive tape DT
The part that cutter 43 is cut off is pressed the pressing of roller 45, therefore, can prevent the cut-off parts from floating from the upper surface of ring frame f.
At the end of the cutting along the adhesive tape DT of ring frame f, original position of readiness is risen to cutting unit 9.Then,
Band application unit 7 is returned from terminal location to initial position.Band application unit 7 is returned to initial position, and as shown in fig. 6,
Band stripping unit 11 is mobile forwards (being right in Fig. 6).That is, slightly increase pinch roll 47 with stripping unit 11, and
It is moved to the right from initial position shown in dotted lines in Figure 6 to terminal location shown in solid.
Band stripping unit 11 is mobile to terminal location, and by cutting in adhesive tape DT on wafer W and cuts off and remain
Under unwanted band DTn roll and remove (step S5).In addition, for the surface for being pasted on wafer W in adhesive tape DT
Part mark appended drawing reference DTw, to be distinguished with unwanted band DTn.
At this moment, shown in (a) from ring frame f and wafer W adhesive tape DT such as Fig. 8 removed, the part C cut off by cutter 43
(cut-away area C) is cut into circle.Also, it by forming cut-away area C, the especially upstream vicinity in cut-away area C, bonds
The fold F extended to release direction L is generated with DT high-frequency.In the present embodiment, 2 will arranged on release direction L
Region, that is, region L1 and region L2 is set as generating the region of fold F.
Due to generating fold F, the width of adhesive tape DT when vertical view narrows compared with width M when adhesive tape DT is flat.
At this moment, more fold F are generated compared with region L2 slightly more by the upstream than region L1 away from the closer region L1 of cut-away area C.
That is, the width M1 that fold F generates the adhesive tape DT in more region L1 is actually generated in less region L2 than fold F
The width M2 of adhesive tape DT narrow ((b) of Figure 11).In addition, at this moment, acting on the width direction that fold F generates more region L1
Tension T1 be compared to generate for fold F the width direction of less region L2 tension T2 it is small.In embodiment 1, region L1
It is equivalent to the 1st region of the invention, region L2 is equivalent to the 2nd region of the invention.
When with stripping unit 11 reach overburden operation terminal location, to step S5 until everywhere in reason at the end of, as Fig. 7
It is shown like that, decline holding station 5 while keep out of the way from adhesive tape DT, returning to band stripping unit 11 to initial position.
When holding station 5 drops to initial position shown in solid in Fig. 7, the absorption in holding station 5 is released from.After absorption releases,
The installing frame MF for being pasted with adhesive tape DTw is mounted frame conveying mechanism and conveys and be recycled to installing frame recoverer (not shown)
(step S6).
When recycling installing frame MF, a certain amount of unwanted band DTn is wound and guides to band recoverer 13, and one
Quantitative adhesive tape DT is released (step S7) from band supply unit 3.By releasing a certain amount of adhesive tape DT, such as (b) institute of Fig. 8
Show, moves the amount of preset distance downstream positioned at the cut-away area C of the top of wafer maintaining part 31.
Adhesive tape DT is being released and the cut-away area C positioned at the top of wafer maintaining part 31 is made to move it downstream
Afterwards, the correction process of the adhesive tape DT of step S8 is carried out, removal is formed in the fold F of adhesive tape DT.Illustrate step S8's below
Process.
When starting step S8, firstly, making the holding component 61 in each 1st draw-off mechanism 53 and the 2nd draw-off mechanism 55
Driving holds adhesive tape DT.That is, keeping each holding unit 53A, 53B suitable to the inside of width direction R as shown in (a) of Fig. 9
Work as movement.By the movement, the end of the width direction of adhesive tape DT is respectively enterd between fixed receiving sheet 67 and movable part 68.
Also, in the state that the end of the width direction of adhesive tape DT enters, control unit 40 rotates motor 70.In horse
Up under 70 rotation, as shown in (b) of Fig. 9, cylinder 69 extends downwards.By the elongation of cylinder 69, movable part 68 to
Lower section is mobile.As a result, the interval between fixed receiving sheet 67 and movable part 68 shortens, using fixed receiving sheet 67 and movably
Portion 68 holds the end of the adhesive tape DT of region L1.
In addition, (b) of Fig. 9 shows the movement for constituting holding unit 53A, 53B of the 1st draw-off mechanism 53, but constitute the 2nd
The movement of holding unit 55A, 55B of draw-off mechanism 55 are also the same.
As shown in (a) of Fig. 9, the upstream vicinity of the 1st draw-off mechanism 53 and the 2nd draw-off mechanism 55 in cut-away area C is held
The both ends of adhesive tape DT.Holding unit 53A, 53B of 1st draw-off mechanism 53 are held away from cut-away area C closer region L1
The both ends of the width direction R of adhesive tape DT.Holding unit 55A, 55B of 2nd draw-off mechanism 55 are held than region L1 slightly by upstream
The both ends of the width direction R of the adhesive tape DT of the region L2 of side.
The both ends of the width direction of adhesive tape DT are held when being utilized respectively the 1st draw-off mechanism 53 and the 2nd draw-off mechanism 55
When, control unit 40 rotates each motor 65.Pass through the respective rotation of motor 65, as shown in (a) of Figure 10, holding unit 53A
Holding component 61 and holding unit 53B holding component 61 on width direction R outward i.e. move in the opposite directions to each other
It is dynamic.
Moved on width direction R by each holding component 61, it is each hold component 61 hold adhesive tape DT by
Two outside drawings of width direction.Be pulled by adhesive tape DT, to the adhesive tape DT of the pulling force for having been assigned release direction L into
The pulling force of one step imparting width direction R.As a result, the fold F for resulting from adhesive tape DT is removed, adhesive tape DT becomes flat
It is smooth.
(a) of Figure 10 shows the movement for constituting holding unit 53A, 53B of the 1st draw-off mechanism 53.In addition, about composition
Holding unit 55A, 55B of 2nd draw-off mechanism 55, by making to hold component 61 respectively on width direction R outward i.e. to that
This opposite direction is mobile, to assign the pulling force of width direction R to adhesive tape DT.
As feature of the invention, control unit 40 independently controls the rotation of each motor 65 set on the 1st draw-off mechanism 53
With the rotation for each motor 65 for being set to the 2nd draw-off mechanism 55.Specifically, mobile to width direction R with holding unit 55A, 55B
Distance compare, increase holding unit 53A, 53B distance mobile to width direction R.As a result, with to the 2nd draw-off mechanism
The pulling force P2 of the 55 region L2 impartings for holding and pulling is compared, what the region L1 that the 1st draw-off mechanism 53 is held and pulled was assigned
Pulling force P1 is bigger.
As described above, the width that fold F generates the adhesive tape DT in more region L1 is real at the time of generating fold F
Narrow (the reference of width of the adhesive tape DT in less region L2 is generated than fold F on border
(b) of Figure 11).Therefore, so that the moving distance of the 1st draw-off mechanism 53 than the 2nd draw-off mechanism 55 moving distance
Long mode independently controls each motor 65.Also, by carrying out the independent control, the 2nd tensile machine 37 can be with region
The width of adhesive tape DT in the width and region L2 of adhesive tape DT in L1 becomes the mode of same widths on width direction R
Assign respectively different pulling force P1 and pulling force P2.
By assigning biggish pulling force P1, many fold F for resulting from region L1 are reliably removed.Also, pass through tax
Lesser pulling force P2 is given, the less amount of fold F for resulting from region L2 is also reliably removed, and can be prevented in region L2
It is middle to generate new fold.
In other words, there is the region L1 of lesser tension T1 to assign biggish pulling force P1 effect, have biggish to effect
The region L2 of power T2 assigns lesser pulling force P2.Therefore, respectively different pulling force P1 and pulling force are assigned by the 2nd tensile machine 37
P2, so as to keep the tension T1 for acting on region L1 roughly the same with the size of tension T2 of region L2 is acted on (referring to figure
11 (c)).
Thus, under the action of the 2nd tensile machine 37, adhesive tape DT is in region L1 and region L2 with higher precision
Planarization.As a result, region near cut-away area C, that is, region L1 and region L2 can be used as in next paste process
In be pasted on the i.e. next cut-away area C in region of ring frame f and wafer W.By keeping adhesive tape DT flat using the 2nd tensile machine 37
Smoothization, so that the process of step S8 is completed.By a series of process formed by above step S1~S8, adhesive tape is completed
1 circulation of gluing treatment.
After, repeat step S1~step S8 process, the installing frame MF until producing specified quantity.Additionally, it is preferred that
In the circulation next time of adhesive tape joining processing, before the adhering processes (step S3) for carrying out adhesive tape DT, the 2nd maintain
Tensile machine 37 assigns the state of the pulling force P1 and pulling force P2 of width direction R to adhesive tape DT.
Explanation calculates separately an example of the process of pulling force P1 and pulling force P2 herein.In the present embodiment, using sensing
Device 71 calculates separately the moving distance of the 1st draw-off mechanism 53 and the 2nd draw-off mechanism 55 in step S8, draws to determine respectively
Power P1 and pulling force P2.
That is, the both ends of the width direction R of adhesive tape DT are all parallel to release direction L in the case where adhesive tape DT is flat
Ground extends.Therefore, the width of adhesive tape DT when vertical view is all identical length M (Figure 11 (a)) in any region.But
It is, in the case where generating fold F because of the formation of cut-away area C, correspondingly to shorten the length of width V with the yield of fold F
Degree.Thus, when looking down, the length M1 of the width in fold F more region L1 is shorter than the length M2 of the width in the L2 of region
((b) of Figure 11).
Therefore, the position at the both ends of adhesive tape DT when being overlooked always using the detection of sensor 71, with the width in the L1 of region
The length of degree and the length of the width in the L2 of region all become the mode of equal length, determine that the 1st draw-off mechanism 53 and the 2nd pulls
The moving distance of mechanism 55.
The width of adhesive tape DT in the L1 of region is detected in due course by sensor 71a.The width of adhesive tape DT in the L2 of region
It is detected in due course by sensor 71b.Therefore, the information that control unit 40 can be detected based on sensor 71a and sensor 71b, with
The mode that the width of adhesive tape DT in the width and region L2 of adhesive tape DT in the L1 of region is equal respectively properly calculates drawing
The size of power P1 and the size of pulling force P2.
Specifically, the difference of the difference ratio M and M2 of M and M1 is big, therefore, it is greater than the 2nd with the moving distance of the 1st draw-off mechanism 53
The mode of the moving distance of draw-off mechanism 55 calculates the moving distance of the 1st draw-off mechanism 53.To the width direction of adhesive tape DT
The size of the pulling force of imparting is according to the 1st draw-off mechanism 53 or the 2nd drawing for holding adhesive tape DT and moving on width direction R
The moving distance of mechanism 55 and change.The distance that 1st draw-off mechanism 53 and the 2nd draw-off mechanism 55 difference mobile computing go out,
As a result, overlook when adhesive tape DT width length with respectively in region L1 and region L2 generate fold F before
Length M identical ((c) of Figure 11).
In this way, the method for detecting the end of adhesive tape DT by using sensor 71, can correctly calculate step S8
In the 1st draw-off mechanism 53 moving distance and the 2nd draw-off mechanism 55 moving distance.Further, it is possible to avoid making to adhesive tape
The state of affairs that the pulling force P1 and pulling force P2 that DT is assigned excessively increase.
In addition, preferably consideration adhesive tape DT's is flexible especially in the case where adhesive tape DT is made of soft material
The moving distance of rate and determining 1st draw-off mechanism 53 and the 2nd draw-off mechanism 55.In this case, after imparting pulling force P1, P2
The length of the width direction of adhesive tape DT and the expansion and contraction are correspondingly longer than M.
<by the structure bring effect of embodiment>
Existing adhesive tape joining apparatus is held when assigning pulling force in the width direction of adhesive tape using clamping components etc.
Certain region at the both ends of adhesive tape.Also, in the whole region of the holding, uniform draw is assigned in the direction of the width
Power.Specifically, 101 pairs of existing draw-off mechanism the region L1 and region L2 that hold adhesive tape DT as shown in (d) of Figure 15
All apply uniform power and pulls.
Therefore, in the existing method, respectively to away from adhesive tape be cut region (cut-away area) closer region and
Pulling force is equably assigned away from the farther away region of the cut-away area.It acts on away from cut-away area compared with close and more fold region L1's
Pulling force is lower, acts on away from cut-away area farther out and the pulling force of the less region L2 of fold is higher.
That is, after pulling adhesive tape DT using existing draw-off mechanism 101, in the pulling force that acts on region L1 and
Act between the pulling force of region L2 that there is also biggish differences.As a result, even if imparting pulling force in the direction of the width, also without
Method reliably removes the fold for resulting from adhesive tape, and therefore, the spacing that can be set as the part of cut-away area becomes larger.
On the other hand, in the adhesive tape joining apparatus of the present embodiment, the 2nd tensile machine 37 has the 1st draw-off mechanism 53
With the 2nd draw-off mechanism 55.Also, in adhesive tape DT away from the closer region L1 of cut-away area C, use the 1st draw-off mechanism
53 assign biggish pulling force P1 in the direction of the width, in away from the farther away region L2 of cut-away area C, use the 1st draw-off mechanism 53
Lesser pulling force P2 is assigned in the direction of the width.That is, the 1st draw-off mechanism 53 can be independently controlled to the expansionary force of adhesive tape DT
With the 2nd draw-off mechanism 55 to the expansionary force of adhesive tape DT.
It is being generated in more region L1 to release direction L with the fold F in the adhesive tape DT of band-like extension, is utilizing the 1st
Draw-off mechanism 53 assigns biggish pulling force P1.Therefore, adhesive tape DT is led with sufficiently large power to two end sides of width direction R
It draws, therefore, the fold F more generated is reliably removed.As a result, the face of adhesive tape DT can be reliable in the L1 of region
Ground becomes flat ((b) of Figure 10).
On the other hand, in the less region L2 of the generation of fold F, lesser pulling force is assigned using the 2nd draw-off mechanism 55
P2.Since the fold F generated in the L2 of region is less, the size of power needed for removing fold F in the L2 of region is smaller.Cause
This, also can reliably remove the fold F in the L2 of region.
Also, compared with pulling force P1, pulling force P2 is made to become smaller, although so as to prevent the fold F in the L2 of region from having been gone
It removes but continues the state of affairs for assigning excessive pulling force in the direction of the width.Thus, it is possible to avoid following problem, that is, because assigning
Big pulling force and cause newly to generate the fold G (7 (c) referring to Fig.1) extended on width direction R in the L2 of region.
In this way, adhesive tape DT to be expanded to the knot of (correction) in the direction of the width using the 2nd tensile machine 37 of the present embodiment
Fruit is to act on the pulling force of the width direction of adhesive tape DT after expansion to become in the whole region that the 2nd tensile machine 37 is held
More evenly.That is, by complete step S8 process, respectively the 2nd tensile machine 37 hold region in away from cut-away area C compared with
Close region L1 and away from the farther away region L2 of cut-away area C, makes the pulling force for acting on width direction R become roughly the same.
Thus, in the region for the being easy to produce fold i.e. upstream vicinity region of cut-away area C, also it is able to use the 2nd drawing
Force mechanisms 37 planarize adhesive tape DT reliably.It is recycled as a result, the upstream vicinity region can be used as next time
The middle region pasted and cut to workpiece.Thus, it is possible to shorten the spacing of cut-away area C and reduce the discarding amount of adhesive tape DT.
[embodiment 2]
Then, illustrate the embodiment of the present invention 2.In addition, being directed to structure identical with the adhesive tape joining apparatus of embodiment 1
Identical appended drawing reference is marked, the structure of i.e. the 2nd tensile machine of different structure divisions is described in detail.
2nd tensile machine 37 of embodiment 1 has independent multiple draw-off mechanisms the i.e. the 1st arranged side by side on release direction L
Draw-off mechanism 53 and the 2nd draw-off mechanism 55.That is, the 2nd tensile machine 37 has multipair holding unit.On the other hand, embodiment 2
2nd tensile machine 80 is as shown in figure 12 by a pair of of holding unit 81A, 81B structure of the scheduled region H in holding adhesive tape DT
At.Holding unit 81A, 81B are across the opposite outfit of holding station 5.Holding unit 81A, 81B hold the width side of adhesive tape DT respectively
To the both ends of R, to the mobile preset distance of width direction R.
Holding unit 81A, 81B, which are respectively provided with, holds component 82, the 1st cylinder 83 and the 2nd cylinder 84.Hold component
82 hold the end of the width direction R of adhesive tape DT in entire presumptive area H.
1st cylinder 83 and the 2nd cylinder 84 are connected with holding component 82 respectively.1st cylinder 83 and the 2nd cylinder
84 are arranged in mode arranged side by side on the release direction L of adhesive tape DT, and the 1st cylinder 83 is disposed in than the 2nd cylinder 84 by putting
The position in the downstream side of direction L out.1st cylinder 83 and the 2nd cylinder 84 be preferably disposed on release direction L across handle
Hold the symmetrical position in center of component 82.
It is connected with the 1st motor 86 in the 1st cylinder 83, is connected with the 2nd motor 87 in the 2nd cylinder 84.1st cylinder 83
Expanding-contracting action is linkedly carried out on width direction R with the rotating forward of the 1st motor 86 reversion, the 2nd cylinder 84 and the 2nd motor 87
It rotates forward reversion and linkedly carries out expanding-contracting action on width direction R.Also, along with the 1st cylinder 83 and the 2nd cylinder 84
Expanding-contracting action, holding component 82 can be mobile to width direction R in the state of adhesive tape DT is hold.According to the 1st motor 86
Amount and direction with each spinning of the 2nd motor 87, to determine to hold component 82 to width direction R mobile distance and direction.
By making the 1st cylinder 83 and the 2nd in the state of holding component 82 and hold the presumptive area H of adhesive tape DT
Dynamic cylinder 84 stretches, and the pulling force P1 of size corresponding with the stroke of the 1st cylinder 83 is affixed on width direction R
Downstream side in presumptive area H.Also, the pulling force P2 of size corresponding with the stroke of the 2nd cylinder 84 is in width direction R
On be affixed to upstream side in presumptive area H.
As feature of the invention, control unit 40 can separately control rotation and the 2nd motor 87 of the 1st motor 86
Rotation.That is, the expanding-contracting action of the 1st cylinder 83 and the expanding-contracting action of the 2nd cylinder 84 are also independently controlled.Therefore, can
It is independently adjusted the size for the pulling force P1 that the downstream side into presumptive area H assigns and the upstream side into presumptive area H assigns
Pulling force P2 size.
In example 2, it holds component 82 and is equivalent to handle sturcture of the invention.1st cylinder 83 and 86 phase of the 1st motor
When in the 1st drawing component of the invention.2nd cylinder 84 and the 2nd motor 87 are equivalent to the 2nd drawing component of the invention.
In example 2, by adhesive tape DT be pasted on the process of workpiece (ring frame f and wafer W) other than step S8 its
The process of he and embodiment 1 shown in Fig. 3 shares.In the step S8 of embodiment 2, firstly, making handle as shown in (a) of Figure 13
Unit 81A, 81B is held suitably to move to the inside of width direction R respectively.
Then, the state between fixed receiving sheet 67 and movable part 68 is entered in the end of the width direction of adhesive tape DT
Under, control unit 40 rotates motor 70.By the rotation of motor 70, cylinder 69 extends downwards, the end quilt of adhesive tape DT
Fixed receiving sheet 67 and movable part 68 are held (referring to (b) of Fig. 9).
By the driving of motor 70, the both ends of the adhesive tape DT on width direction R are whole including region L1 and region L2
It is held in a presumptive area H.At this moment, as shown in (a) of Figure 13, the part in the downstream side in component 82 is held hold away from cutting
Except the both ends of the adhesive tape DT in the closer region L1 of region C, the 1st cylinder 83 is connected in the part in the downstream side.It is another
Aspect, hold the part of the upstream side in component 82 hold than the adhesive tape DT in region L1 region L2 on the upstream side two
End, is connected with the 2nd cylinder 84 in the part of the upstream side.
When adhesive tape DT is held by each holding component 82, control unit 40 respectively revolves the 1st motor 86 and the 2nd motor 87
Turn.By rotating the 1st motor 86 and the 2nd motor 87 respectively, as shown in (b) of Figure 13, the holding structure of holding unit 81A, 81B
Part 82 moves on width direction R in the opposite directions to each other respectively.
At this moment, control unit 40 separately controls the 1st motor 86 and the 2nd motor 87.Specifically, with the 1st motor 86
Rotation amount be greater than the mode of rotation amount of the 2nd motor 87 and control.
By the control, the stroke of the 1st cylinder 83 is larger, therefore, holds in component 82 and is connected with the 1st cylinder
83 downstream side part is longer to the mobile distance of width direction R.On the other hand, the stroke of the 2nd cylinder 84 is smaller, because
This, the upstream part for being connected with the 2nd cylinder 84 held in component 82 is shorter to the mobile distance of width direction R.
Moving distance to hold the upstream part in component 82 mode different from the moving distance of downstream side part
It is controlled, as a result, as shown in (b) of Figure 13, for the region L1 and region L2 in adhesive tape DT, respectively to width direction
R assigns different size of pulling force.That is, in the region L1 that the part for holding the downstream side in component 82 is held, by the 1st actuation
The influence of the stroke of cylinder 83 assigns bigger pulling force P1 to width direction R.On the other hand, upper in holding component 82
It swims in the region L2 of part holding of side, the stroke by the 2nd cylinder 84 is influenced, and is assigned to width direction R smaller
Pulling force P2.
By on release direction L to respectively different region L1 and region L2 assign the respectively different pulling force P1 of size and
Pulling force P2, can reliably remove the fold F for resulting from adhesive tape DT, and adhesive tape DT becomes flat.That is, being generated in fold F
Bigger pulling force P1 is assigned in more region L1, therefore, can reliably remove fold F.On the other hand, it is generated in fold F
Lesser pulling force P2 is assigned in less region L2, therefore, can fully remove fold F, and can prevent because exceedingly
Assign the generation that pulling force leads to fold.
In this way, becoming such structure in the 2nd tensile machine of embodiment 2, that is, in each holding unit 81A, 81B
In, using the 1st cylinder 83 and the 2nd cylinder 84, single holding component is being pulled along multiple positions that release direction L is arranged
82.And by the power for being independently controlled in each position drawing, the pulling force P1 and pulling force P2 that opposite each position assigns are adjusted
It is whole, so that they become respective different size.
2nd tensile machine 80 assigns pulling force P1 and pulling force P2 to width direction, as a result, similarly to Example 1,
In the structure of embodiment 2, adhesive tape DT also can accurately be planarized in the larger range of release direction L.
Before step S8 starts, acts on the tension T1 of the width direction of region L1 and act on the width side of region L2
To the difference of tension T2 be eliminated by the correction process of the band of step S8.That is, to lesser tension T1 assign pulling force P1, to compared with
Big tension T2 assigns pulling force P2.Thus, (after completion step S8), the width of adhesive tape DT can be reduced after assigning pulling force
The tension spent on direction is uneven.As a result, can by near cut-away area C region L1 and region L2 be used as to next work
The region that part is pasted, therefore the discarding amount of adhesive tape DT can be reduced.
The present invention is not limited to above embodiment, being capable of deformation implementation as follows.
(1) in embodiment 1, instantiating the 2nd tensile machine 37 has 2 arranged on the release direction L of adhesive tape DT
A independent draw-off mechanism i.e. structure of the 1st draw-off mechanism 53 and the 2nd draw-off mechanism 55 is but it is also possible to be with 3 or more
The structure of draw-off mechanism.It is equally possible that being following structure, that is, be connected with and releasing in the holding component 82 of embodiment 2
3 or more cylinders arranged side by side on the L of direction, the power of each cylinder in different sizes are pulled to width direction R.
(2) adhesive tape in each embodiment and each variation, as the object as the pulling force for being endowed width direction
The example of DT, the bearing that semiconductor crystal wafer is supported by transannular frame are illustrated for adhesive tape (cutting belt), but not
It is defined in this.That is, other than cutting belt, as long as the adhesive tape of the protection of the circuit face for protecting semiconductor crystal wafer
The adhesive tape of the lengthwises shapes such as the adhesive tape of (protection band), protection band removing, it will be able to which application adhesive tape joining of the invention fills
The structure set.
(3) as long as the present invention can be for the multiple regions along release direction L arrangement in adhesive tape DT in adhesive tape
The structure of respectively different pulling force is assigned in the width direction of DT, the structure of the 2nd tensile machine is just not limited to each embodiment,
It can be suitably changed.As respectively in the release direction L multiple regions L1 arranged and region L2 on width direction R
Assign other examples of the structure of respectively different pulling force, the example that can be listed below.
2nd tensile machine 90 of variation is as shown in (a) of Figure 14 by for holding the scheduled region H in adhesive tape DT
A pair of of holding unit 90A, 90B constitute.Holding unit 90A, 90B, which are respectively provided with, holds component 91, cylinder 92 and motor
93.It holds component 91 and holds adhesive tape DT in scheduled whole region H.Portion downstream in cylinder 92 and holding component 91
Split-phase connection.Cylinder 92 is flexible to width direction R along with the rotation of motor 93, makes to hold component 91 to width direction R shifting
It is dynamic.
Region L1 is closer away from the part that cylinder 92 is connected with holding component 91, and region L2 is away from cylinder 92 and holds structure
The part that part 91 is connected is farther out.That is, compared with the L2 of region, by the flexible power generated of cylinder 92 more efficiently in area
Domain L1 transmitting.Therefore, when making to hold the movement of component 91 when cylinder 92 is flexible, bigger pulling force P1 is assigned to region L1, separately
On the one hand, smaller to the size of the region L2 pulling force P2 assigned.
In this way, however it is not limited to make separation multiple holding components 61 embodiment 1 release direction L arranged side by side structure,
Multiple positions pull the structure of the embodiment 2 of single holding component 82.As this variation in this way, being pulled at single position single
The structure of one holding component 91 also can in the same manner as each embodiment, by pulling force P1 respectively different on release direction L and
Pulling force P2 is assigned to width direction R.
As other variations, it is also possible to as shown in (b) of Figure 14, in a pair of of holding unit 95A, 95B,
The cylinder 97 of telescopic moving is carried out on the inclined direction D in the upstream side of from R to release direction L in the width direction and holds component 96
The structure being connected.By the rotation along with motor 98, cylinder 97 stretches in the directiond, also can for region L1 and
Region L2 assigns size respectively different pulling force P1 and pulling force P2 in the direction of the width.Cylinder 97 and motor 98 are equivalent to this hair
Bright inclined direction pulls component.
In each embodiment and variation, in step s 8, the adhesive tape DT in each region is detected using sensor 71
Width direction R end, calculate to region L1 assign pulling force P1 size and to region L2 assign pulling force P2 it is big
It is small.This is the one of the structure for the size for calculating the size to the region L1 pulling force P1 assigned and the pulling force P2 to region L2 imparting
A example, but it is not limited to the structure using sensor 71.
As other example, it is also possible to make to glue and simulating to find out in advance and can reliably remove fold F
The distance that 1st draw-off mechanism 53 as crossed belt DT general planarization and the 2nd draw-off mechanism 55 are respectively moved to width direction R,
Pulling force P1 and pulling force P2 is calculated based on the calculated result.In addition it is also possible to be that the face of adhesive tape DT is monitored using sensor 71,
The imparting of pulling force P1 and pulling force P2 are completed according to the Disappearance Scenarios of fold, ripple.
(4) it in embodiment and each variation, instantiates and ring frame f and wafer W is set as workpiece and pasted to the workpiece viscous
The adhesive tape joining apparatus of crossed belt DT, but the workpiece for becoming the object of stickup adhesive tape is not limited to ring frame f and wafer W.As
Wafer W can also be set as workpiece by other examples.The adhesive tape T of circuit protection is being pasted on wafer that is, can enumerate
Circuit face after adhesive tape T is cut into the structure of scheduled shape (circle etc.).It is further possible to be set by ring frame f
Structure of the invention is applied in structure for workpiece etc..
Here, being illustrated to the variation in the case where different from the workpiece of embodiment using attached drawing.In the variation
In, as shown in (a) of Figure 15, as workpiece, it is set as the wafer Wa using the notch N for being formed with positioning.In addition, being formed in crystalline substance
The notch N of circle Wa is in letter V shape, but the shape of notch N is not limited to alphabetical V shape, such as is also possible to letter U shape.In addition, making
For wafer Wa, the wafer for being formed with directional plane both can be used, not formed notch etc. can also be used as each embodiment
Circular wafer W.
It using wafer Wa as the structures different from each embodiment in the variation of workpiece is holding station 5a and with cutting unit
9a, and different appended drawing references is marked, it is shown in (b) of Figure 15.Holding station 5a omits frame maintaining part 33, has for loading
The wafer maintaining part 31a of wafer Wa.The diameter of wafer maintaining part 31a is configured to shorter than the diameter of wafer Wa.
With cutting unit 9a in the lower part for the movable table 10 that can be gone up and down by driving, can be protected around being located at by driving
The mode of supercentral vertical axis line P rotation of platform 5a is held equipped with supporting arm 12.In addition, in the free end side of the supporting arm 12
The cutter 14 of down-bite jaw is installed.That is, being configured in this variation, it is with vertical axis line P by supporting arm 12
Rotation center is rotated, and cutter 14 moves to cut adhesive tape T along the periphery of wafer W.
Here, illustrating the process for pasting adhesive tape T to the i.e. wafer Wa of workpiece in the variation of (4).Firstly, in step
In S1, wafer Wa determines the position of direction of rotation based on notch N, and is placed in wafer maintaining part 31a.In addition, due to not
Using ring frame f, therefore the process for omitting step S2.Then, in step s3, using with application unit 7 across the entire of wafer Wa
Outwardly paste adhesive tape T (referring to (b) of Fig. 4).
The movement of the step S4 of this variation is shown in (c) of Figure 15.That is, above under standby band cutting unit 9a
Drop, cutter 14 pierce through adhesive tape T.When cutter 14 pierces through adhesive tape T, supporting arm 12 is carried out by rotation center of vertical axis line P
Rotation.It is accompanied by this, outer peripheral edge moving in rotation of the cutter 14 along wafer Wa.
By the moving in rotation, as shown in (d) of Figure 15, adhesive tape T is cut into circle along cutting track K.In this way, logical
It crosses and cuts off adhesive tape T with scheduled shape corresponding with wafer Wa, the process for completing step S4.Each work of step S5~S8
Sequence is identical as each embodiment, therefore omits later explanation.
As long as adhesive tape T's cuts in addition, cutting the structure of adhesive tape T with scheduled shape corresponding with workpiece
Broken rail mark K is just not limited to circle.As an example, as shown in (e) of Figure 15, cutting track K is also possible to also will be with notch N
The comparable adhesive tape T in part cutting made of track, the i.e. shape along the shape of wafer Wa.As long as also, with workpiece
The structure of corresponding scheduled shape cutting adhesive tape T, so that it may suitably change holding station 5a and the knot with cutting unit 9a
Structure.For example, cutter 14 is not limited to the structure of the outer peripheral edge moving in rotation along wafer Wa.
That is, as shown in (f) of Figure 15, in the case where the diameter of wafer maintaining part 31a is greater than the diameter of wafer Wa, preferably
For outer peripheral edge moving in rotation of the cutter 14 along wafer maintaining part 31a for piercing through adhesive tape T.In this case, adhesive tape T and wafer
Wa is correspondingly cut to the circular shape more slightly larger than the diameter of wafer Wa.
(5) in each embodiment and each variation, workpiece is not limited to circular shape or circular shape.As one
A example, also can be viscous applied to pasting using the substrate of rectangular shape, polygonal shape as workpiece by structure of the invention
The structure etc. of crossed belt T.
(6) in each embodiment and each variation, as the structure for the size for independently controlling pulling force P1 and pulling force P2, example
The rotation of the various motors by independent control by taking motor 65 as an example is shown independently to adjust the knot of the position of each holding unit
Structure.But as long as the structure of the size of independent control pulling force P1 and pulling force P2, is just not limited to the knot controlled using motor
Structure.
The other examples of the structure of size as independent control pulling force P1 and pulling force P2 list each work of independent control
The structure of dynamic cylinder 63.That is, to the actuation being arranged in holding holding unit 53A, 53B away from the closer region L1 of cut-away area C
Cylinder 63 supplies the air (example is 0.4MPa or so) of elevated pressures, thus with stronger power draw area L1.Another party
Face supplies an air (example for lower pressure to the cylinder 63 being arranged in holding unit 55A, the 55B for holding region L2
For 0.2MPa or so), thus with weaker power draw area L2.
In this way, even if independently controlling the power and draw area L2 of draw area L1 by controlling cylinder 63
Power, can also make that pulling force P1's and pulling force P2 is of different sizes.In this configuration, the various horses by taking motor 65 as an example can be deleted
It reaches.
(7) it in each embodiment and each variation, instantiates through 5 lifting moving of holding station and carries out the viscous of adhesive tape DT
The structure of patch, but be not limited to for holding station 5 to be configured to the structure of lifting moving.That is, as other examples, being also possible to
By the structure for carrying out the stickup of adhesive tape DT with application unit 7 and with 11 lifting moving of stripping unit.
Claims (12)
1. a kind of adhesive tape joining method, which is characterized in that
The adhesive tape joining method includes
Paste process, in this process, by band-like adhesive tape joining in workpiece；
The adhesive tape for being pasted on the workpiece is cut into corresponding with the workpiece by cutting-off process in this process
Scheduled shape；And
Pulling force assign process, in this process, by the adhesive tape joining when workpiece, in the width of the adhesive tape
Pulling force is assigned to the adhesive portion of the adhesive tape on direction,
During the pulling force assigns, respectively to being glued along described in the adhesive tape in the width direction of the adhesive tape
At least two region of the length direction arrangement of crossed belt, that is, away from being cut into the scheduled shape in cutting-off process before
Closer 1st region of cut-away area and different pulling force is assigned far from the 2nd region of the cut-away area than the 1st region.
2. adhesive tape joining method according to claim 1, which is characterized in that
The pulling force assigns process and includes
Holding process holds described the from the two sides of the width direction of the adhesive tape using the 1st handle sturcture in this process
1 region, and the 2nd region is held from the two sides of the width direction of the adhesive tape using the 2nd handle sturcture；And
Traction process pulls the 1st handle sturcture in this process with the 1st power in the width direction of the adhesive tape, and
And the 2nd handle sturcture is pulled in the width direction of the adhesive tape with 2nd power different from the 1st power.
3. adhesive tape joining method according to claim 1, which is characterized in that
The pulling force assigns process and includes
Holding process holds the 1st area from the two sides of the width direction of the adhesive tape using handle sturcture in this process
Domain and the 2nd region；And
Traction process pulls the handle in the handle sturcture with the 1st power in this process in the width direction of the adhesive tape
The part in the 1st region is held, and is pulled in the width direction of the adhesive tape with 2nd power different from the 1st power
The part in holding the 2nd region in the handle sturcture.
4. adhesive tape joining method according to claim 1, which is characterized in that
The pulling force assigns process and includes
Holding process holds the 1st area from the two sides of the width direction of the adhesive tape using handle sturcture in this process
Domain and the 2nd region；And
Inclined direction traction process, in this process, by the handle sturcture to the width direction from the adhesive tape to described
The inclined direction drawing of the length direction of adhesive tape.
5. adhesive tape joining method according to claim 1, which is characterized in that
The pulling force assigns process and includes
Holding process holds the 1st area from the two sides of the width direction of the adhesive tape using handle sturcture in this process
Domain and the 2nd region；And
Traction process pulls the handle sturcture using drawing component in this process in the width direction of the adhesive tape,
The drawing component is set in the part in holding the 1st region in the handle sturcture and the part in holding the 2nd region
The part by holding the 1st region that side.
6. adhesive tape joining method according to any one of claims 1 to 5, which is characterized in that
The adhesive tape joining method includes
Both ends detection process detects the both ends of the width direction of the adhesive tape in the 1st region in this process respectively
Position and the adhesive tape in the 2nd region width direction both ends position；And
Pulling force calculating process based on the position at each both ends detected, is calculated separately in the bonding in this process
In the width direction of band to the 1st region assign pulling force and in the width direction of the adhesive tape to the 2nd region
The pulling force of imparting.
7. a kind of adhesive tape joining apparatus, which is characterized in that
The adhesive tape joining apparatus includes
Labelling machine, by band-like adhesive tape joining in workpiece；
The adhesive tape for being pasted on the workpiece is cut into scheduled shape corresponding with the workpiece by cutting mechanism
Shape；And
Pulling force imparting mechanism, by the adhesive tape joining when workpiece, it is right in the width direction of the adhesive tape
The adhesive portion of the adhesive tape assigns pulling force,
The pulling force imparting mechanism in the width direction of the adhesive tape respectively in the adhesive tape along the adhesive tape
Length direction arrangement at least two region, that is, away from the excision for being cut into the scheduled shape in cutting-off process before
Closer 1st region in region and different pulling force is assigned far from the 2nd region of the cut-away area than the 1st region.
8. adhesive tape joining apparatus according to claim 7, which is characterized in that
The pulling force imparting mechanism includes
1st handle sturcture holds the 1st region from the two sides of the width direction of the adhesive tape；
2nd handle sturcture holds the 2nd region from the two sides of the width direction of the adhesive tape；
1st drawing component, pulls the 1st handle sturcture with the 1st power in the width direction of the adhesive tape；And
2nd drawing component, pulls the described 2nd with 2nd power different from the 1st power in the width direction of the adhesive tape
Handle sturcture.
9. adhesive tape joining apparatus according to claim 7, which is characterized in that
The pulling force imparting mechanism includes
Handle sturcture holds the 1st region and the 2nd region from the two sides of the width direction of the adhesive tape；
1st drawing component, is pulled with the 1st power in the width direction of the adhesive tape described in the holding in the handle sturcture
The part in the 1st region；And
2nd drawing component, pulls described with 2nd power different from the 1st power in the width direction of the adhesive tape
Hold the part in holding the 2nd region in mechanism.
10. adhesive tape joining apparatus according to claim 7, which is characterized in that
The pulling force imparting mechanism includes
Handle sturcture holds the 1st region and the 2nd region from the two sides of the width direction of the adhesive tape；And
Inclined direction pulls component, to the inclined side of length direction of the width direction from the adhesive tape to the adhesive tape
To the drawing handle sturcture.
11. adhesive tape joining apparatus according to claim 7, which is characterized in that
The pulling force imparting mechanism includes
Handle sturcture holds the 1st region and the 2nd region from the two sides of the width direction of the adhesive tape；
Component is pulled, the part in holding the 1st region being set in the handle sturcture and the portion for holding the 2nd region
That side of the part by holding the 1st region in point, and the holding is pulled in the width direction of the adhesive tape
Mechanism.
12. the adhesive tape joining apparatus according to any one of claim 7~11, which is characterized in that
The adhesive tape joining apparatus includes
Both ends testing agency is used to detect the position at the both ends of the width direction of the adhesive tape in the 1st region respectively
Set the position with the both ends of the width direction of the adhesive tape in the 2nd region；And
Pulling force calculates mechanism and calculates separately the width in the adhesive tape based on the position at each both ends detected
To the pulling force of the 1st region imparting and the drawing assigned in the width direction of the adhesive tape to the 2nd region on direction
Power.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018064696A JP7130401B2 (en) | 2018-03-29 | 2018-03-29 | Adhesive tape applying method and adhesive tape applying apparatus |
| JP2018-064696 | 2018-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110323157A true CN110323157A (en) | 2019-10-11 |
| CN110323157B CN110323157B (en) | 2024-07-02 |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP7130401B2 (en) | 2022-09-05 |
| KR20190114730A (en) | 2019-10-10 |
| KR102599436B1 (en) | 2023-11-06 |
| TW201943011A (en) | 2019-11-01 |
| TWI795468B (en) | 2023-03-11 |
| JP2019176072A (en) | 2019-10-10 |
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