CN110320762B - Method and system for measuring imaging position error of laser direct imaging equipment - Google Patents
Method and system for measuring imaging position error of laser direct imaging equipment Download PDFInfo
- Publication number
- CN110320762B CN110320762B CN201910534140.XA CN201910534140A CN110320762B CN 110320762 B CN110320762 B CN 110320762B CN 201910534140 A CN201910534140 A CN 201910534140A CN 110320762 B CN110320762 B CN 110320762B
- Authority
- CN
- China
- Prior art keywords
- mark
- substrate
- splicing
- measuring
- graph
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a method and a system for measuring imaging position error of laser direct imaging equipment, which belong to the technical field of pattern transfer of printed circuit boards and comprise the following steps: inputting a splicing error measurement graph to be detected into laser direct imaging equipment; placing a substrate on an exposure workbench of laser direct imaging equipment, and projecting the appearance of the splicing error measurement graph on the substrate to perform exposure imaging on the substrate; fixing the substrate after projection imaging on measuring equipment capable of measuring the central coordinates of the MARK circles, and measuring the central coordinates of the three MARK circles by using the measuring equipment; and calculating the splicing position error of the splicing error measurement graph according to the central coordinates of the three MARK circles. The invention greatly improves the measurement efficiency and the measurement accuracy and has wider application range.
Description
Technical Field
The invention relates to the technical field of pattern transfer of printed circuit boards, in particular to a method and a system for measuring imaging position errors of laser direct imaging equipment.
Background
For the field of printed circuit board processing, particularly the manufacture of high-precision HDI boards and package substrates, the image transfer apparatus is undoubtedly the most central part thereof. There are two main categories of Printed Circuit Board (PCB) image transfer devices today: conventional projection exposure apparatuses and laser direct imaging apparatuses (LDIs). The traditional projection type exposure equipment pattern is printed on a film negative, the film negative is irradiated by ultraviolet rays to transfer the pattern to a PCB (printed circuit board) with a photosensitive dry film on the surface, the unexposed part of the dry film is dissolved by chemical solution after the dry film exposure is finished, and the residual dry film is the pattern to be manufactured. In the laser direct imaging device, an exposure pattern is directly scanned and imaged on a photosensitive dry film through a spatial light modulator by ultraviolet light emitted by a laser beam, and then the exposure pattern is chemically developed in the same way.
In the laser direct imaging device, the laser beam directly scans and images the exposure pattern on the photosensitive dry film through the spatial light modulator, however, since the spatial light modulator has a small size, the original complete pattern needs to be divided into a plurality of small patterns with the same size as the spatial light modulator, and the small patterns are spliced into the complete pattern again when being exposed on the surface of the printed circuit board. In actual work, due to the precision errors of the motion control system in the X direction and the Y direction, the position relation calibration errors of all parts of the equipment and the like, the splicing position between small graphs can generate deformation, namely splicing errors, the deformation can cause splicing traces in finally obtained complete graphs, and further the quality problem of products can be caused in factory production.
The commonly adopted splicing error measuring method at present is to use a microscope to measure errors at the splicing positions of graphs after exposure and development are carried out on PCBs coated with dry films, and the method has the problems of low efficiency, low detection precision, large manual measurement error, incapability of measuring large line widths and the like.
Disclosure of Invention
The invention aims to solve the problems in the background technology and quickly and accurately measure the error value of the imaging splicing position.
To achieve the above object, in one aspect, the present invention adopts a method for measuring an imaging position error of a laser direct imaging apparatus, comprising the steps of:
a concatenation department error for measuring concatenation error measurement figure has arranged the three MARK circle that is located same water flat line and diameter equal on this concatenation error measurement figure, three MARK circle is respectively for arranging first MARK circle, the second MARK circle of left side figure head end and the tail end of concatenation error measurement figure to and arrange the third MARK circle at the right side figure head end of concatenation error measurement figure, include:
inputting a splicing error measurement graph to be detected into laser direct imaging equipment;
placing a substrate on an exposure workbench of the laser direct imaging equipment, and projecting the appearance of the splicing error measurement graph on the substrate to perform exposure imaging on the substrate;
fixing the substrate after projection imaging on a measuring device capable of measuring the central coordinates of the MARK circles, and measuring the central coordinates of the three MARK circles by using the measuring device;
and calculating the splicing position error of the splicing error measurement graph according to the central coordinates of the three MARK circles.
On the other hand, the system for measuring the imaging position error of the laser direct imaging device comprises a substrate, a measuring device, a calculating device and the laser direct imaging device, wherein a splicing error measuring graph is input into the laser direct imaging device; the PCB board covered with a layer of photosensitive dry film is arranged on the surface of the substrate, and before exposure imaging of the substrate, the substrate is arranged on an exposure workbench of the laser direct imaging equipment; after the substrate is exposed and imaged, the substrate is fixed on a measuring table of measuring equipment, and the output end of the measuring equipment is connected with computing equipment;
three MARK circles which are located on the same horizontal line and have the same diameter are arranged on the splicing error measurement graph, wherein the three MARK circles are respectively arranged on a first MARK circle at the head end of the right graph of the splicing error measurement graph, and a second MARK circle and a third MARK circle at the head end and the tail end of the left graph of the splicing error measurement graph;
and the computing equipment is used for computing the splicing position error of the splicing error measurement graph according to the central coordinates of the three MARK circles.
Compared with the prior art, the invention has the following technical effects: the method comprises the steps of inputting a splicing error measurement graph into laser direct imaging equipment, imaging the splicing error measurement graph on a substrate covered with a photosensitive dry film through a spatial light modulator, measuring circle center coordinates of MARK points of the graph through any measuring equipment capable of measuring the center coordinates of the MARK points, and calculating an error value of the splicing position of the graph by utilizing a space geometric relationship between the circle center coordinates. Compared with the prior art, the method and the device have the advantages that the steps of chemical development, microscope measurement and the like are omitted, the problem that the precision of a measurement system is insufficient due to the fact that a laser direct imaging device cannot measure the system is solved, the measurement efficiency and the measurement accuracy are greatly improved, and the application range is large.
Drawings
The following detailed description of embodiments of the invention refers to the accompanying drawings in which:
FIG. 1 is a schematic flow chart of a method for measuring an imaging position error of a laser direct imaging device;
FIG. 2 is a schematic illustration of a stitching error measurement profile;
FIG. 3 is a schematic view of a substrate placed under a measuring device after exposure imaging for Y2> Y1;
FIG. 4 is a schematic representation of the substrate being exposed imaged and measured under a measuring device at Y2< Y1.
Detailed Description
To further illustrate the features of the present invention, refer to the following detailed description of the invention and the accompanying drawings. The drawings are for reference and illustration purposes only and are not intended to limit the scope of the present disclosure.
As shown in fig. 1, the present embodiment discloses a method for measuring an imaging position error of a laser direct imaging apparatus, which is used to measure a splice error of a splice error measurement pattern on which three MARK circles are arranged, the three MARK circles being located on the same horizontal line and having the same diameter, the three MARK circles being a first MARK circle and a second MARK circle for arranging a head end and a tail end of a left side pattern of the splice error measurement pattern, and a third MARK circle for arranging a head end of a right side pattern of the splice error measurement pattern, and the method includes the following steps S1-S4:
s1, inputting the splicing error measurement graph to be detected into laser direct imaging equipment;
s2, placing a substrate on an exposure workbench of the laser direct imaging equipment, and projecting the appearance of the splicing error measurement graph on the substrate to perform exposure imaging on the substrate;
s3, fixing the substrate after projection imaging on a measuring device capable of measuring the central coordinates of the MARK circles, and measuring the central coordinates of the three MARK circles by using the measuring device;
and S4, calculating the splicing position error of the splicing error measurement graph according to the central coordinates of the three MARK circles.
Specifically, as shown in fig. 2, the diameters of the three MARK circles are the same, the diameter D ranges from 1mm to 2mm, two MARK circles are located at the head end and the tail end of the left graph of the stitching error measurement graph, and another MARK circle is located at the head end of the right graph of the stitching error measurement graph. The distance between the centers of the three MARK circles in the Y direction is 0mm, and the distance L between the center of the MARK circle at the tail end of the left graph of the splicing graph and the center of the MARK circle at the head end of the right graph of the splicing graph in the X direction ranges from 5mm to 10 mm.
In this embodiment, the distance between the centers of the three MARK circles in the Y direction is 0mm, which ensures that the centers are at the same horizontal height, the graphic design is not dislocated in the Y direction, the distance between the second MARK and the third MARK can be adjusted according to the precision of the imaging device, which ensures that the two MARK circles are located at both sides of the splice and the distance is greater than the diameter of the MARK, even if the spliced positions are overlapped, the two MARK circles are not overlapped and are also located at both sides of the splice.
It should be noted that the value ranges of the pitch L and the dot diameter D can be adjusted according to the precision of the imaging device, that is, it is ensured that the two MARKs are located at the two sides of the splice and the distance is greater than the MARK diameter, and even if the spliced positions are overlapped, the two MARK circles are not overlapped and are also located at the two sides of the splice.
Further, the substrate is a PCB board covered with a photosensitive dry film, and in the laser direct imaging device, the splicing error measurement graph is directly scanned and imaged on the photosensitive dry film by an ultraviolet light beam emitted by a laser beam through a spatial light modulator.
Further, the execution environments of the above steps S2 and S3 are both yellow light environments. Because the photosensitive dry film covers on the substrate, the photosensitive dry film is not sensitized by setting a yellow light environment, other lights can make the dry film photosensitive, the laser used by the imaging equipment is used for pattern transfer, and imaging on the failed dry film is blurred or cannot be imaged.
Further, the above step S4: calculating the splicing error of the splicing error measurement graph according to the central coordinates of the three MARK circles, and comprising the following subdivision steps S41-S42:
s41, calculating the board placing angle theta of the substrate under the coordinate system of the measuring equipment by using the central coordinates of the MARK circles positioned at the head end and the tail end of the left side graph;
and S42, calculating the splicing position error of the splicing error measurement pattern by using the center coordinate of the MARK circle at the tail end of the left side pattern, the center coordinate of the MARK circle at the head end of the right side pattern and the substrate placing angle theta.
Specifically, assuming that the coordinates of the center point M of the first MARK circle are (X0, Y0), the coordinates of the center point a of the second MARK circle are (X1, Y1), and the coordinates of the center point B of the third MARK circle are (X2, Y2), there are:
the board placing angle theta of the substrate is as follows:
θ＝arctan[(Y1-Y0)/(X1-X0)]；
the calculation formula of the splicing error measurement graph in the Y direction is as follows:
ΔY＝[(Y2-Y1)-(X2-X1)×tanθ]×cosθ；
the calculation formula of the splicing error measurement graph in the X direction is as follows:
it should be noted that, the derivation process of the calculation of the error result at the splicing position of the splicing error measurement pattern is as follows:
case 1: the angle of the panel is positive, Y2> Y1, as shown in FIG. 3:
under a rectangular coordinate system XOY of measuring equipment, the plate placing angle of a substrate is an angle theta, a point A is crossed to make a horizontal line and a point B is crossed to a point C, a point A is crossed to make a line segment AD cross BC at a point D to make & lt DAC & gttheta, the line segment AD is extended to a point F, a point B is crossed to make a perpendicular line AF of AF at a point F, and then & lt DBF & gtDAC & lttheta & gt is deduced:
plate placing angle: theta-arctan [ (Y1-Y0)/(X1-X0) ]
Distance of line segment AC: AC-X2-X1
Distance of line segment BC: BC-Y2-Y1
Distance of line segment CD: CD ═ AC × tan θ ═ X2-X1 × tan θ
Distance of line segment BD: BD-BC-CD (Y2-Y1) - (X2-X1) × tan θ
The calculation formula of the splicing error value in the Y direction is as follows: Δ Y ═ BF × cos θ ═ [ (Y2-Y1) - (X2-X1) × tan θ ] × cos θ
Distance of line segment AB:
distance of line segment AF:
the calculation formula of the splicing error value in the X direction is as follows:
case 2: the deck angle is positive, Y2< Y1, as shown in fig. 4:
under a rectangular coordinate system XOY of measuring equipment, the plate placing angle of a substrate is an angle theta, a point A is crossed to be used as a horizontal line, and a point B is crossed to be used as a vertical line, the point A is crossed to be used as a point C, the point A is crossed to be used as an extension line of a line segment AD, the intersection BC is crossed to be a point D, so that & lt DAC & gttheta is caused, a point B is crossed to be used as a perpendicular line AD of AD to be a point F, and then & lt DBF & gtDAC & gttheta is deduced:
plate placing angle: theta-arctan [ (Y1-Y0)/(X1-X0) ]
Distance of line segment AC: AC-X2-X1
Distance of line segment BC: BC Y1-Y2- (Y2-Y1)
Distance of line segment CD: CD ═ AC × tan θ ═ X2-X1 × tan θ
Distance of line segment BD: BD ═ BC + CD ═ Y2-Y1) + (X2-X1) × tan θ
The calculation formula of the splicing error value in the Y direction is as follows: Δ Y ═ BF ═ BD × cos θ ═ [ (Y2-Y1) - (X2-X1) × tan θ ] × cos θ;
distance of line segment AB:
distance of line segment AF:
the calculation formula of the splicing error value in the X direction is as follows:
it should be noted that similar derivation can be performed in other cases, and the error calculation formulas at the splicing positions of the splicing error measurement patterns are the same.
The embodiment discloses a system for measuring imaging position errors of laser direct imaging equipment, which comprises a substrate, measuring equipment, computing equipment and the laser direct imaging equipment, wherein a splicing error measurement graph is input into the laser direct imaging equipment; the PCB board covered with a layer of photosensitive dry film is arranged on the surface of the substrate, and before exposure imaging of the substrate, the substrate is arranged on an exposure workbench of the laser direct imaging equipment; after the substrate is exposed and imaged, the substrate is fixed on a measuring table of measuring equipment, and the output end of the measuring equipment is connected with computing equipment;
three MARK circles which are located on the same horizontal line and have the same diameter are arranged on the splicing error measurement graph, wherein the three MARK circles are respectively arranged on a first MARK circle at the head end of the right graph of the splicing error measurement graph, and a second MARK circle and a third MARK circle at the head end and the tail end of the left graph of the splicing error measurement graph;
and the computing equipment is used for computing the splicing position error of the splicing error measurement graph according to the central coordinates of the three MARK circles.
Further, the computing device includes: the device comprises a plate placing angle calculation module and a splicing position error calculation module;
the plate placing angle calculating module is used for calculating a plate placing angle theta of the substrate in a coordinate system of the measuring equipment by using the central coordinates of MARK circles positioned at the head end and the tail end of the left side graph;
and the splicing error calculation module is used for calculating the splicing error of the splicing error measurement graph by using the central coordinate of the MARK circle positioned at the tail end of the left side graph, the central coordinate of the MARK circle positioned at the head end of the right side graph and the substrate angle.
Specifically, the coordinates of the center point M of the first MARK circle are (X0, Y0), the coordinates of the center point a of the second MARK circle are (X1, Y1), the coordinates of the center point B of the third MARK circle are (X2, Y2), and the distance between the center point a of the second MARK circle and the center point B of the third MARK circle in the X direction is L;
the board placing angle theta of the substrate is as follows: θ ═ arctan [ (Y1-Y0)/(X1-X0) ];
the calculation formula of the splicing error measurement graph in the Y direction is as follows:
ΔY＝[(Y2-Y1)-(X2-X1)×tanθ]×cosθ；
the calculation formula of the splicing error measurement graph in the X direction is as follows:
it should be noted that, the specific implementation process of the present solution for measuring the imaging position error of the laser direct imaging device is as follows:
(1) inputting a graph for measuring splicing errors to a laser direct imaging device by an operator, wherein the graph comprises three MARK circles with equal diameters, the three MARKs are positioned on the same horizontal line, namely the distance between the circle centers in the Y direction is 0mm, the head ends and the tail ends of the two MARKs positioned on the left side of the spliced graph are respectively marked as M and A, the head end of the other MARK positioned on the right side of the spliced graph is marked as B, the distance between the circle center of the MARK A at the tail end of the spliced graph and the circle center of the MARK B at the head end of the spliced graph in the X direction is 10mm, and the diameter D of the circle is 2mm, which is shown in FIG. 2;
(2) arranging a substrate B on an exposure worktable of the laser direct imaging device in a yellow environment;
(3) under the environment of yellow light, directly projecting laser generated by a laser head of laser direct imaging equipment on the substrate according to the shape of the splicing error measurement graph recorded in the step (1), namely completing exposure imaging of the substrate;
(4) under the environment of yellow light, the substrate after projection imaging is placed on a measuring table of other measuring equipment capable of measuring the central coordinate of the MARK and fixed;
(5) under the environment of yellow light, measuring the center coordinates M (X0, Y0) of a circular MARK at the head end of a graph on the left side of the spliced graph as M (140.209, 314.553) in mm by using other measuring equipment capable of measuring the center coordinates of the MARK;
(6) under the environment of yellow light, measuring the center coordinates A (X1, Y1) of a circular MARK at the tail end of the left graph to be spliced as A (270.205, 314.288) in mm by using other measuring equipment capable of measuring the center coordinates of the MARK;
(7) calculating the plate placing angle of the substrate according to the center coordinates M (X0, Y0) of the MARK circle obtained in the step (5) as M (140.209, 314.553) and the center coordinates A (X1, Y1) of the MARK circle obtained in the step six as A (270.205, 314.288) in mm:
θ＝arctan[(Y1-Y0)/(X1-X0)]
＝arctan[(314.288-314.553)/(270.205-140.209)]
0.117 degree ═ 0.117 degree
(8) Under the environment of yellow light, measuring the center coordinates B (X2, Y2) of a circular MARK at the head end of a graph on the right side of the spliced graph as B (280.201, 314.285) in mm by using other measuring equipment capable of measuring the center coordinates of the MARK;
(9) calculating a splicing error value according to the fact that the center coordinates A (X1, Y1) of the MARK circle obtained in the step (6) are A (270.205, 314.288), the center coordinates B (X2, Y2) of the MARK circle obtained in the step eight are B (280.201, 314.285), the unit is mm, the theoretical distance L between the center of the MARK at the tail end of the left graph and the center of the MARK at the head end of the right graph in the X direction is 10mm, and the panel placing angle theta obtained in the step seven is-0.117 degrees:
the calculation formula of the splicing error value in the Y direction is as follows:
ΔY＝[(Y2-Y1)-(X2-X1)×tanθ]×cosθ
＝[(314.285-314.288)-(280.201-270.205)×tan(-0.117°)]×cos(-0.117°)＝0.017mm
the calculation formula of the splicing error value in the X direction is as follows:
and finally, calculating a result that the delta X is-0.004 mm and the delta Y is 0.017mm, namely measuring the error value of the obtained graph splicing in the X direction to be-0.004 mm and the error value in the Y direction to be 0.017 mm.
According to the scheme of the embodiment, the splicing error measurement graph is input into laser direct imaging equipment, the graph is imaged on a substrate covered with a photosensitive dry film through a spatial light modulator, the center coordinates of the graph MARK are measured through any other measurement equipment capable of measuring the center coordinates of the MARK, and the splicing error is calculated. The method saves the steps of chemical development and microscope measurement, solves the problem that the equipment has no measurement system or the measurement system has insufficient precision, and greatly improves the measurement efficiency, the accuracy and the application range.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. The utility model provides a measurement method of laser direct imaging equipment formation of image position error, characterized in that for measuring the concatenation department error of concatenation error measurement figure, this concatenation error measurement figure is arranged and is located the same horizontal line and three MARK circles that the diameter is equal, three MARK circles are respectively the first MARK circle of arranging at the left side figure head end and the tail end of concatenation error measurement figure, the second MARK circle to and arrange the third MARK circle at the right side figure head end of concatenation error measurement figure, include:
inputting a splicing error measurement graph to be detected into laser direct imaging equipment;
placing a substrate on an exposure workbench of the laser direct imaging equipment, and projecting the appearance of the splicing error measurement graph on the substrate to perform exposure imaging on the substrate;
fixing the substrate after projection imaging on a measuring device capable of measuring the central coordinates of the MARK circles, and measuring the central coordinates of the three MARK circles by using the measuring device;
calculating the splicing position error of the splicing error measurement graph according to the central coordinates of the three MARK circles, wherein the method comprises the following steps:
calculating a plate placing angle theta of the substrate under a coordinate system of the measuring equipment by using the central coordinates of the first MARK circle and the central coordinates of the second MARK circle;
and calculating the splicing position error of the splicing error measurement graph by using the central coordinate of the second MARK circle, the central coordinate positioned in the third MARK circle and the substrate placing angle theta.
2. The method for measuring the imaging position error of the laser direct imaging device according to claim 1, wherein the substrate is a PCB board coated with a photosensitive dry film.
3. The method of measuring an imaging position error of a laser direct imaging apparatus of claim 1, wherein the coordinates of the center point M of the first MARK circle are (X0, Y0), the coordinates of the center point a of the second MARK circle are (X1, Y1), and the coordinates of the center point B of the third MARK circle are (X2, Y2); the board placing angle theta of the substrate is as follows: θ ═ arctan [ (Y1-Y0)/(X1-X0) ].
4. The method for measuring imaging position error of laser direct imaging device of claim 3, wherein the distance between the center point A of the second MARK circle and the center point B of the third MARK circle in X direction is L;
the calculation formula of the splicing error measurement graph in the Y direction is as follows:
ΔY＝[(Y2-Y1)-(X2-X1)×tanθ]×cosθ；
the calculation formula of the splicing error measurement graph in the X direction is as follows:
5. the method for measuring the imaging position error of the laser direct imaging device according to claim 4, wherein the distance between the center point of the second MARK circle and the center point of the third MARK circle in the X direction ranges from 5mm to 10mm, and the diameters of the three MARK circles range from 1mm to 2 mm.
6. The method for measuring the imaging position error of the laser direct imaging device according to any one of claims 1 to 5, wherein the substrate exposure imaging process and the measurement process of the center coordinates of the three MARK circles are both performed in a yellow light environment.
7. A measurement system for an imaging position error of a laser direct imaging device is characterized by comprising a substrate, a measurement device, a calculation device and a laser direct imaging device with a splicing error measurement graph input; the PCB board covered with a layer of photosensitive dry film is arranged on the surface of the substrate, and before exposure imaging of the substrate, the substrate is arranged on an exposure workbench of the laser direct imaging equipment; after the substrate is exposed and imaged, the substrate is fixed on a measuring table of measuring equipment, and the output end of the measuring equipment is connected with computing equipment;
three MARK circles which are located on the same horizontal line and have the same diameter are arranged on the splicing error measurement graph, wherein the three MARK circles are a first MARK circle and a second MARK circle which are arranged at the head end and the tail end of the left graph of the splicing error measurement graph, and a third MARK circle which is arranged at the head end of the right graph of the splicing error measurement graph;
the computing equipment is used for computing the splicing position error of the splicing error measurement graph according to the central coordinates of the three MARK circles;
the computing device includes: the device comprises a plate placing angle calculation module and a splicing position error calculation module;
the plate placing angle calculating module is used for calculating a plate placing angle theta of the substrate in a coordinate system of the measuring equipment by using the central coordinates of MARK circles positioned at the head end and the tail end of the left side graph;
and the splicing error calculation module is used for calculating the splicing error of the splicing error measurement graph by using the central coordinate of the MARK circle positioned at the tail end of the left side graph, the central coordinate of the MARK circle positioned at the head end of the right side graph and the plate placing angle of the substrate.
8. The system of claim 7, wherein the coordinates of the center point M of the first MARK circle are (X0, Y0), the coordinates of the center point A of the second MARK circle are (X1, Y1), the coordinates of the center point B of the third MARK circle are (X2, Y2), and the distance between the center point A of the second MARK circle and the center point B of the third MARK circle in the X direction is L;
the board placing angle theta of the substrate is as follows: θ ═ arctan [ (Y1-Y0)/(X1-X0) ];
the calculation formula of the splicing error measurement graph in the Y direction is as follows:
ΔY＝[(Y2-Y1)-(X2-X1)×tanθ]×cosθ；
the calculation formula of the splicing error measurement graph in the X direction is as follows:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910534140.XA CN110320762B (en) | 2019-06-20 | 2019-06-20 | Method and system for measuring imaging position error of laser direct imaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910534140.XA CN110320762B (en) | 2019-06-20 | 2019-06-20 | Method and system for measuring imaging position error of laser direct imaging equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110320762A CN110320762A (en) | 2019-10-11 |
| CN110320762B true CN110320762B (en) | 2021-08-13 |
Family
ID=68119862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910534140.XA Active CN110320762B (en) | 2019-06-20 | 2019-06-20 | Method and system for measuring imaging position error of laser direct imaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110320762B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04252016A (en) * | 1991-01-28 | 1992-09-08 | Sharp Corp | Pattern drawing method |
| CN102573308A (en) * | 2012-01-12 | 2012-07-11 | 合肥芯硕半导体有限公司 | Correction method of graphic splicing errors of printed circuit board (PCB) |
| CN102681369A (en) * | 2012-05-10 | 2012-09-19 | 中国科学院光电技术研究所 | Aligning method suitable for maskless photo-etching machine |
| CN105093856A (en) * | 2015-09-09 | 2015-11-25 | 合肥芯碁微电子装备有限公司 | Method for detecting imaging position error of laser direct imaging equipment |
| CN105115426A (en) * | 2015-09-06 | 2015-12-02 | 合肥芯硕半导体有限公司 | Detection method of figure splicing errors of laser direct imaging device |
| CN106227002A (en) * | 2016-09-21 | 2016-12-14 | 中山新诺科技股份有限公司 | A kind of method improving the efficiency adjusting splicing and multiplying power size |
-
2019
- 2019-06-20 CN CN201910534140.XA patent/CN110320762B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04252016A (en) * | 1991-01-28 | 1992-09-08 | Sharp Corp | Pattern drawing method |
| CN102573308A (en) * | 2012-01-12 | 2012-07-11 | 合肥芯硕半导体有限公司 | Correction method of graphic splicing errors of printed circuit board (PCB) |
| CN102681369A (en) * | 2012-05-10 | 2012-09-19 | 中国科学院光电技术研究所 | Aligning method suitable for maskless photo-etching machine |
| CN105115426A (en) * | 2015-09-06 | 2015-12-02 | 合肥芯硕半导体有限公司 | Detection method of figure splicing errors of laser direct imaging device |
| CN105093856A (en) * | 2015-09-09 | 2015-11-25 | 合肥芯碁微电子装备有限公司 | Method for detecting imaging position error of laser direct imaging equipment |
| CN106227002A (en) * | 2016-09-21 | 2016-12-14 | 中山新诺科技股份有限公司 | A kind of method improving the efficiency adjusting splicing and multiplying power size |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110320762A (en) | 2019-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105629678B (en) | A kind of orthogonality assay method of straight-writing system motion platform | |
| CN106647180B (en) | Error correction and compensation method based on scaling board in direct write exposure machine | |
| CN109916342A (en) | A kind of locating platform straight line degree measurement system and method | |
| CN105291564A (en) | Silk-screen alignment method and device | |
| US20240094648A1 (en) | Dynamic generation of layout adaptive packaging | |
| CN101097407B (en) | Tracing system, tracing material correction device and method, substrate manufacture method | |
| WO2020029509A1 (en) | Measurement method for inner layer alignment accuracy | |
| CN110672037A (en) | Linear light source grating projection three-dimensional measurement system and method based on phase shift method | |
| TW201802623A (en) | Projection exposure apparatus and method | |
| JP2022078075A (en) | Exposure system alignment and calibration method | |
| CN105093856A (en) | Method for detecting imaging position error of laser direct imaging equipment | |
| CN110320762B (en) | Method and system for measuring imaging position error of laser direct imaging equipment | |
| CN105115426A (en) | Detection method of figure splicing errors of laser direct imaging device | |
| JP6502504B2 (en) | Pre-alignment measurement apparatus and method | |
| CN109597283A (en) | A kind of detection method of laser direct imaging equipment front and back sides imaging bit errors | |
| CN216210467U (en) | Standard sheet and mask plate assembly | |
| KR100984271B1 (en) | the method of calibrating the mask test apparatus | |
| CN110275399B (en) | Method for measuring position relation error of alignment camera of laser direct imaging equipment | |
| JP5355245B2 (en) | Exposure apparatus, exposure method, and manufacturing method of display panel substrate | |
| TWI419298B (en) | Sample holding device for laser marking machine | |
| JP2005292323A (en) | Exposure method of maskless exposure apparatus, and maskless exposure apparatus | |
| US20220308468A1 (en) | Method for determining a center of a radiation spot, sensor and stage apparatus | |
| TWI821617B (en) | Exposure device and article manufacturing method | |
| JP2005338357A (en) | Method and apparatus for manufacturing printed wiring board | |
| CN110308620A (en) | A kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 230088 the 11 level of F3 two, two innovation industrial park, No. 2800, innovation Avenue, Hi-tech Zone, Hefei, Anhui. Applicant after: Hefei Xinqi microelectronics equipment Co., Ltd Address before: 230088 the 11 level of F3 two, two innovation industrial park, No. 2800, innovation Avenue, Hi-tech Zone, Hefei, Anhui. Applicant before: HEFEI XINQI MICROELECTRONIC EQUIPMENT CO., LTD. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |