CN110308620A - A kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method - Google Patents

A kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method Download PDF

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Publication number
CN110308620A
CN110308620A CN201910534138.2A CN201910534138A CN110308620A CN 110308620 A CN110308620 A CN 110308620A CN 201910534138 A CN201910534138 A CN 201910534138A CN 110308620 A CN110308620 A CN 110308620A
Authority
CN
China
Prior art keywords
alignment cameras
imaging equipment
laser direct
direct imaging
mark1
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910534138.2A
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Chinese (zh)
Inventor
尤勇
严孝年
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Xinqi Microelectronic Equipment Co Ltd
Original Assignee
Hefei Xinqi Microelectronic Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Xinqi Microelectronic Equipment Co Ltd filed Critical Hefei Xinqi Microelectronic Equipment Co Ltd
Priority to CN201910534138.2A priority Critical patent/CN110308620A/en
Publication of CN110308620A publication Critical patent/CN110308620A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors

Abstract

The present invention relates to a kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration methods, two circular MARK1 and MARK2 are arranged in this method first on the basic table top (sucker) of laser direct imaging equipment, and make left side alignment cameras and right side alignment cameras in laser direct imaging equipment that can be moved to the center position of MARK1 and MARK2 respectively, then by calculate MARK1 and MARK2 in the X direction with the spacing in Y-direction, and the centre coordinate of left side alignment cameras and right side alignment cameras measurement MARK1 and MARK2 is respectively adopted, finally further according to calculated spacing and the centre coordinate value measured, accurately measure the location error between two alignment cameras.The present invention does not limit the installation site of alignment cameras, solve the problems, such as two alignment cameras distance it is remote just can not Fast Calibration positional relationship, have the characteristics that method is simple and quick, accuracy is high.

Description

A kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method
Technical field
The present invention relates to printed circuit prototypes transfer techniques fields, and in particular to a kind of laser direct imaging equipment alignment Camera position relationship automatic calibration method.
Background technique
For printed circuit board manufacture field, the especially manufacture of high-precision HDI plate and package substrate, image transfer device Undoubtedly wherein most crucial part.Currently, printed circuit board (PCB) image transfer device has two major classes: traditional projection Exposure sources and laser direct imaging equipment (LDI).Traditional projection exposure equipment figure has been printed on film egative film, It is irradiated by ultraviolet light on the PCB that pattern transfer is covered with photosensitive dry film to surface by film egative film, is passed through after the completion of dry film exposure Chemical solution dissolves the dry film of unexposed portion, and remaining dry film is exactly the figure to be made.And laser directly at As exposure figure is passed through the direct scanning imagery of spatial light modulator in photosensitive dry film by the ultraviolet light that in equipment, laser beam is issued On, using same chemical development.In laser direct imaging equipment, exposure figure is passed through spatial light modulator by laser beam On photosensitive dry film, the figure of scanning imagery needs to be accurately positioned on circuit boards direct scanning imagery, this is just needed using arriving Multiple alignment cameras, and the positional relationship between multiple alignment cameras needs accurate calibration in systems.Due to alignment cameras Mechanical erection has trueness error, this must just carry out location position, the accurate location error for measuring camera.Currently, measurement pair The method of quasi- camera position relationship error must multiple cameras can measure the same MARK, which limit the locating distances of camera From distance is unable to measure greatly the same MARK, then can not demarcate.
Summary of the invention
The purpose of the present invention is to provide a kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method, This method is able to solve the deficiencies in the prior art, accurate two alignment cameras measured in laser direct imaging equipment it Between location error.
To achieve the above object, the invention adopts the following technical scheme:
A kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method, method includes the following steps:
(1) rectangular coordinate system of the basic table top of laser direct imaging equipment is established.It is described basis table top refer to laser directly at As the sucker of equipment.
(2) circle MARK1 is pasted on basic table top, moves the alignment cameras in left side in laser direct imaging equipment It moves at the center of the MARK1;If the coordinate at the center MARK1 is (X1, Y1).
(3) circle MARK2 is pasted on basic table top, moves the alignment cameras on right side in laser direct imaging equipment It moves at the center of the MARK2;If the coordinate at the center MARK2 is (X2, Y2).
(4) MARK1 and the space D of MARK2 in the X direction are calculatedX=X2-X1.
(5) MARK1 and the space D of MARK2 in the Y direction are calculatedY=Y2-Y1.
(6) using the coordinate (X1 ', Y1 ') at the alignment cameras measurement center MARK1 in left side in laser direct imaging equipment.
(7) using the coordinate (X2 ', Y2 ') at the alignment cameras measurement center MARK2 on right side in laser direct imaging equipment.
(8) formula E is usedX=X2 '-X1 '-DXIt is right to calculate left side alignment cameras and right side in laser direct imaging equipment The positional relationship error E of quasi- camera in the X directionX
(9) formula E is usedY=Y2 '-Y1 '-DYIt is right to calculate left side alignment cameras and right side in laser direct imaging equipment The positional relationship error E of quasi- camera in the Y directionY
From the above technical scheme, the present invention is arranged on the basic table top (sucker) of laser direct imaging equipment first Two circular MARK1 and MARK2, and make left side alignment cameras and right side alignment cameras point in laser direct imaging equipment It can be moved to the center position of MARK1 and MARK2, then by calculating MARK1 and MARK2 in the X direction and Y-direction On spacing, and be respectively adopted left side alignment cameras and right side alignment cameras measurement MARK1 and MARK2 centre coordinate, finally Further according to calculated spacing and the centre coordinate value measured, the location error between two alignment cameras is accurately measured. The present invention does not limit the installation site of alignment cameras, and efficiently solving two alignment cameras distances far just can not Fast Calibration The problem of positional relationship, has the characteristics that method is simple and quick, accuracy is high.
Detailed description of the invention
Fig. 1 is flow chart of the method for the present invention.
Specific embodiment
The present invention will be further described with reference to the accompanying drawing:
A kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method as shown in Figure 1, this method include with Lower step:
(1) rectangular coordinate system of the basic table top of laser direct imaging equipment is established.It is described basis table top refer to laser directly at As the sucker of equipment.
(2) circle MARK1 is pasted on basic table top, moves the alignment cameras in left side in laser direct imaging equipment It moves at the center of the MARK1;If the coordinate at the center MARK1 is (X1, Y1)=(100mm, 800mm).
(3) circle MARK2 is pasted on basic table top, moves the alignment cameras on right side in laser direct imaging equipment It moves at the center of the MARK2;If the coordinate at the center MARK2 is (X2, Y2)=(500mm, 800mm).
(4) MARK1 and the space D of MARK2 in the X direction are calculatedX=X2-X1=400mm.
(5) MARK1 and the space D of MARK2 in the Y direction are calculatedY=Y2-Y1=0mm.
(6) using the alignment cameras measurement center MARK1 in left side in laser direct imaging equipment coordinate (X1 ', Y1 ')= (100.001mm, 800.002mm).
(7) using the alignment cameras measurement center MARK2 on right side in laser direct imaging equipment coordinate (X2 ', Y2 ')= (500.008mm, 799.996mm).
(8) formula E is usedX=X2 '-X1 '-DXIt is right to calculate left side alignment cameras and right side in laser direct imaging equipment The positional relationship error E of quasi- camera in the X directionX.In the present embodiment, EX=X2 '-X1 '-DX=500.008- 100.001-400=0.007mm.
(9) formula E is usedY=Y2 '-Y1 '-DYIt is right to calculate left side alignment cameras and right side in laser direct imaging equipment The positional relationship error E of quasi- camera in the Y directionY.In the present embodiment, EY=Y2 '-Y1 '-DY=799.996-800.002- 0=- 0.006mm.
Embodiment described above only describe the preferred embodiments of the invention, not to model of the invention It encloses and is defined, without departing from the spirit of the design of the present invention, those of ordinary skill in the art are to technical side of the invention The various changes and improvements that case is made should all be fallen into the protection scope that claims of the present invention determines.

Claims (1)

1. a kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method, it is characterised in that: this method includes Following steps:
(1) rectangular coordinate system of the basic table top of laser direct imaging equipment is established;
(2) circle MARK1 is pasted on basic table top, is moved to the alignment cameras in left side in laser direct imaging equipment At the center of the MARK1;If the coordinate at the center MARK1 is (X1, Y1);
(3) circle MARK2 is pasted on basic table top, is moved to the alignment cameras on right side in laser direct imaging equipment At the center of the MARK2;If the coordinate at the center MARK2 is (X2, Y2);
(4) MARK1 and the space D of MARK2 in the X direction are calculatedX=X2-X1;
(5) MARK1 and the space D of MARK2 in the Y direction are calculatedY=Y2-Y1;
(6) using the coordinate (X1 ', Y1 ') at the alignment cameras measurement center MARK1 in left side in laser direct imaging equipment;
(7) using the coordinate (X2 ', Y2 ') at the alignment cameras measurement center MARK2 on right side in laser direct imaging equipment;
(8) formula E is usedX=X2 '-X1 '-DXLeft side alignment cameras is directed at phase with right side in calculating laser direct imaging equipment The positional relationship error E of machine in the X directionX
(9) formula E is usedY=Y2 '-Y1 '-DYLeft side alignment cameras is directed at phase with right side in calculating laser direct imaging equipment The positional relationship error E of machine in the Y directionY
CN201910534138.2A 2019-06-20 2019-06-20 A kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method Pending CN110308620A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910534138.2A CN110308620A (en) 2019-06-20 2019-06-20 A kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910534138.2A CN110308620A (en) 2019-06-20 2019-06-20 A kind of laser direct imaging equipment alignment cameras positional relationship automatic calibration method

Publications (1)

Publication Number Publication Date
CN110308620A true CN110308620A (en) 2019-10-08

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1797204A (en) * 2004-12-27 2006-07-05 Asml荷兰有限公司 Lithographic apparatus with multiple alignment arrangements and alignment measuring method
CN103365107A (en) * 2012-04-11 2013-10-23 上海微电子装备有限公司 Matching and calibrating method for multi-off-axis aligning system
CN103632364A (en) * 2013-11-06 2014-03-12 同济大学 Camera spatial position relation calibration device in multi-camera photographing measurement system
US20140285652A1 (en) * 2013-03-22 2014-09-25 Kabushiki Kaisha Toshiba Method for measuring pattern misalignment
CN105093856A (en) * 2015-09-09 2015-11-25 合肥芯碁微电子装备有限公司 Method for detecting imaging position error of laser direct imaging equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1797204A (en) * 2004-12-27 2006-07-05 Asml荷兰有限公司 Lithographic apparatus with multiple alignment arrangements and alignment measuring method
CN103365107A (en) * 2012-04-11 2013-10-23 上海微电子装备有限公司 Matching and calibrating method for multi-off-axis aligning system
US20140285652A1 (en) * 2013-03-22 2014-09-25 Kabushiki Kaisha Toshiba Method for measuring pattern misalignment
CN103632364A (en) * 2013-11-06 2014-03-12 同济大学 Camera spatial position relation calibration device in multi-camera photographing measurement system
CN105093856A (en) * 2015-09-09 2015-11-25 合肥芯碁微电子装备有限公司 Method for detecting imaging position error of laser direct imaging equipment

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Address after: 230088 the 11 level of F3 two, two innovation industrial park, No. 2800, innovation Avenue, Hi-tech Zone, Hefei, Anhui.

Applicant after: Hefei Xinqi microelectronics equipment Co., Ltd

Address before: 230088 the 11 level of F3 two, two innovation industrial park, No. 2800, innovation Avenue, Hi-tech Zone, Hefei, Anhui.

Applicant before: HEFEI XINQI MICROELECTRONIC EQUIPMENT CO., LTD.

RJ01 Rejection of invention patent application after publication
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Application publication date: 20191008