CN110312373A - A kind of production method enhancing COF Film folding resistance - Google Patents
A kind of production method enhancing COF Film folding resistance Download PDFInfo
- Publication number
- CN110312373A CN110312373A CN201910709621.XA CN201910709621A CN110312373A CN 110312373 A CN110312373 A CN 110312373A CN 201910709621 A CN201910709621 A CN 201910709621A CN 110312373 A CN110312373 A CN 110312373A
- Authority
- CN
- China
- Prior art keywords
- cof film
- time
- baking
- solder paste
- tin plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of production methods for enhancing COF Film folding resistance, comprising the following steps: step 1.: carry out refusing solder paste ink print for the first time in bent area；Step is 2.: refusing the baking of solder paste ink for the first time；Step is 3.: tin plating for the first time；Step is 4.: tin plating baking for the first time；Step is 5.: refusing solder paste ink print for the second time；Step is 6.: refusing the baking of solder paste ink for the second time；Step is 7.: second tin plating；Step is 8.: second of tin plating baking.The COF Film folding resistance that the present invention makes is good.
Description
Technical field
The invention shows panel preparation fields, and in particular to a kind of production method for enhancing COF Film folding resistance.
Background technique
COF is used as a kind of electronic material group as a kind of flexible flip chip wiring board in display panel manufacturing process
Among PCB circuit board and panel, driving effect is provided.The assembling mode of most of COF and panel is, at face plate edge
The mode of COF Film is bent to assemble, and (such as Fig. 1) is refused on solder paste ink in signal output end in bent area.Such mode requires
The bending part of Film has good folding resistance.If folding resistance is bad, in panel sectional, the route of bent area will be broken
Phenomenon influences quality.
The processing procedure (such as Fig. 2) of COF Film at present, using 1 time tin plating (+tin plating baking) and refuse for 1 time solder paste ink print (+refuse
Solder paste ink baking) mode.Concrete technology flow process are as follows:
Step is 1.: in a manner of electroless plating, tin tin plating technique: being plated on copper surface.Tin plating effect is in copper wire
Road surfaces form protective layer, prevent route from aoxidizing.
Step is 2.: tin plating baking process: under high-temperature baking, part pure tin becomes copper-tin alloy.The purpose of high-temperature baking is
Control pure tin thickness reaches customer requirement specification.
Step is 3.: refuse weldering printing ink printing art: solder paste ink is refused in the circuit surface printing in specified region.As shown in Fig. 2, referring to
Determining region is active line region, but does not include signal input area, signal output area and IC lead areas.Refuse weldering printing technology
Effect is protection copper wire, avoids route impaired.
Step is 4.: refusing solder paste ink baking process: passing through high-temperature baking, it is ensured that ink layer drying, while controlling ink thickness
Degree reaches customer specifications with pure tin thickness.
Although the thickness for the product tin metal layer that the making technology of existing COF Film is formed reaches customer requirement specification,
But folding resistance is not able to satisfy the demand of high-end customer but.
Summary of the invention
One of the objects of the present invention is to provide it is a kind of enhance COF Film folding resistance production method, this method production
COF Film folding resistance is good.
Technical solution is: a kind of production method enhancing COF Film folding resistance, comprising the following steps: step
Suddenly 1.: carrying out refusing solder paste ink print for the first time in bent area；
Step is 2.: refusing the baking of solder paste ink for the first time；
Step is 3.: tin plating for the first time；
Step is 4.: tin plating baking for the first time；
Step is 5.: refusing solder paste ink print for the second time；
Step is 6.: refusing the baking of solder paste ink for the second time；
Step is 7.: second tin plating；
Step is 8.: second of tin plating baking.
Preferably, the step 5. in, refusing solder paste ink print is except signal input area, signal output area and IC lead
Solder paste ink is refused in active line region coating outside region.
Preferably, the step 7. in, second tin plating for signal input area, signal output area and the plating of IC lead district
Tin.
The second object of the present invention is to provide a kind of COF Film.
Technical solution is: a kind of COF Film, and the COF Film is by the above-mentioned production side for enhancing COF Film folding resistance
Method is made.
The third object of the present invention is to provide a kind of display panel.
Technical solution is: a kind of display panel, including panel, PCB circuit board and COF Film, the COF Film are upper
The COF Film stated.
Compared with prior art, inventive principle of the present invention and the utility model has the advantages that
Inventor it has been investigated that, the ductility of Copper base material itself is good, but tin plating place is carried out in copper wire
After reason, influenced by the characteristic of tin metal fragility, surface is easily broken off.And tin layers are thicker, and metal wire is more fragile, under folding resistance
Drop, therefore bent area is processed as tin-free layer by the present invention, and is increased and refused solder paste ink layer thickness.
The COF Film that the present invention makes is compared with the COF Film that the prior art makes, since bent area does not have tin layers,
The increase of solder paste layer of ink is refused simultaneously, therefore substantially increases its folding resistance.
Detailed description of the invention
Fig. 1 is the assembling mode schematic diagram of COF and panel；
Fig. 2 is the processing procedure schematic diagram of existing COF Film；
Fig. 3 is the processing procedure schematic diagram of COF Film of the present invention.
Specific embodiment
The invention will be further described below.
Embodiment 1
Such as Fig. 3, a kind of production method enhancing COF Film folding resistance, comprising the following steps:
Step is 1.: refuse solder paste ink print for the first time: this is refused solder paste ink print and only carries out refusing solder paste ink print in bent area.
Step is 2.: refuse the baking of solder paste ink for the first time: the baking conditions such as baking temperature and the prior art refuse weldering baking process
It is identical, pass through high-temperature baking, it is ensured that ink layer drying.
Step is 3.: tin plating for the first time: in a manner of electroless plating, to plate one layer of thin tin on copper surface, thin tin thickness is less than existing
There is tin tin plating in technology thick.
Step is 4.: tin plating baking for the first time: the baking conditions such as baking temperature are identical as the tin plating baking process of the prior art.
Pure stannum layer after high-temperature baking is thin compared with the pure stannum layer of the prior art.After high-temperature baking, pure stannum layer reaches most thinning.
Step is 5.: refuse solder paste ink print for the second time: solder paste ink is refused in the circuit surface printing in specified region, and specified region is
Active line region, but do not include signal input area, signal output area and IC lead areas.
Step is 6.: refuse the baking of solder paste ink for the second time: the baking conditions such as baking temperature and the prior art refuse weldering baking process
It is identical, pass through high-temperature baking, it is ensured that ink layer drying, and control ink film thickness and reach customer requirement specification.
Step is 7.: second tin plating: in Fei Juhan ink traces area (including signal input area, signal output area, IC lead
Area) tin required in plating is thick, after second is tin plating, the tin thickness in Fei Juhan ink traces area and tin thickness phase in the prior art
Deng.
Step is 8.: second of tin plating baking: the baking conditions such as baking temperature are identical as the tin plating baking process of the prior art.
By high-temperature baking, Fei Juhan ink traces Qu Xihou reaches customer requirement specification.
Embodiment 2
By COF Film made of embodiment 1 carry out folding resistance test (taking 10 samples at random), and by test result with
The prior art (Fig. 2 technique is made) obtains 10 samples at random and is compared, as a result such as following table one:
Table one
Remarks: test sample, test method and the test condition of table one such as following table two and table three:
Two test method of table and condition
| Project | Content |
| Test sample | COF Film sample |
| Test method | The experiment of resistance to bend(ing) specified in JIS-C5016 |
| Criterion | Route can not be broken |
Three test sample parameter of table
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (5)
1. a kind of production method for enhancing COF Film folding resistance, comprising the following steps:
Step is 1.: carrying out refusing solder paste ink print for the first time in bent area；
Step is 2.: refusing the baking of solder paste ink for the first time；
Step is 3.: tin plating for the first time；
Step is 4.: tin plating baking for the first time；
Step is 5.: refusing solder paste ink print for the second time；
Step is 6.: refusing the baking of solder paste ink for the second time；
Step is 7.: second tin plating；
Step is 8.: second of tin plating baking.
2. the production method of enhancing COF Film folding resistance according to claim 1, it is characterised in that: the step is 5.
In, refusing solder paste ink print region for the second time is in the active line in addition to signal input area, signal output area and IC lead areas
Solder paste ink is refused in region coating.
3. the production method of enhancing COF Film folding resistance according to claim 1, it is characterised in that: the step is 7.
In, it is that signal input area, signal output area and IC lead district are tin plating that second is tin plating.
4. a kind of COF Film, it is characterised in that: the COF Film is resistance to by any enhancing COF Film of claim 1-3
The production method of folding endurance is made.
5. a kind of display panel, including panel, PCB circuit board and COF Film, it is characterised in that: the COF Film is right
It is required that COF Film described in 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910709621.XA CN110312373A (en) | 2019-08-02 | 2019-08-02 | A kind of production method enhancing COF Film folding resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910709621.XA CN110312373A (en) | 2019-08-02 | 2019-08-02 | A kind of production method enhancing COF Film folding resistance |
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| Publication Number | Publication Date |
|---|---|
| CN110312373A true CN110312373A (en) | 2019-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910709621.XA Pending CN110312373A (en) | 2019-08-02 | 2019-08-02 | A kind of production method enhancing COF Film folding resistance |
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| CN (1) | CN110312373A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113125280A (en) * | 2021-03-29 | 2021-07-16 | 合肥奕斯伟材料技术有限公司 | Calculation method for bending resistance test of COF Film finished product |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253247A (en) * | 2005-03-09 | 2006-09-21 | Shindo Denshi Kogyo Kk | Flexible printed wiring board and its manufacturing method |
| CN106211603A (en) * | 2014-10-21 | 2016-12-07 | 现代自动车株式会社 | The method manufacturing printed circuit board (PCB) |
| CN107979920A (en) * | 2017-10-30 | 2018-05-01 | 上达电子（深圳）股份有限公司 | A kind of circuit board processing method |
-
2019
- 2019-08-02 CN CN201910709621.XA patent/CN110312373A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253247A (en) * | 2005-03-09 | 2006-09-21 | Shindo Denshi Kogyo Kk | Flexible printed wiring board and its manufacturing method |
| CN106211603A (en) * | 2014-10-21 | 2016-12-07 | 现代自动车株式会社 | The method manufacturing printed circuit board (PCB) |
| CN107979920A (en) * | 2017-10-30 | 2018-05-01 | 上达电子（深圳）股份有限公司 | A kind of circuit board processing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113125280A (en) * | 2021-03-29 | 2021-07-16 | 合肥奕斯伟材料技术有限公司 | Calculation method for bending resistance test of COF Film finished product |
| CN113125280B (en) * | 2021-03-29 | 2024-01-02 | 合肥颀材科技有限公司 | Calculation method for bending resistance test of finished product COF Film |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 230000 in Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei City, Anhui Province Applicant after: Hefei Qizhong Material Technology Co.,Ltd. Address before: 230000 in Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei City, Anhui Province Applicant before: Hefei Yiswei Material Technology Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 230000 in Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei City, Anhui Province Applicant after: Hefei Qicai Technology Co.,Ltd. Address before: 230000 in Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei City, Anhui Province Applicant before: Hefei Qizhong Material Technology Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191008 |