CN110310907B - 一种Micro-LED芯片转移方法及显示装置 - Google Patents
一种Micro-LED芯片转移方法及显示装置 Download PDFInfo
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- CN110310907B CN110310907B CN201910588798.9A CN201910588798A CN110310907B CN 110310907 B CN110310907 B CN 110310907B CN 201910588798 A CN201910588798 A CN 201910588798A CN 110310907 B CN110310907 B CN 110310907B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
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Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910588798.9A CN110310907B (zh) | 2019-07-02 | 2019-07-02 | 一种Micro-LED芯片转移方法及显示装置 |
PCT/CN2019/100968 WO2021000384A1 (zh) | 2019-07-02 | 2019-08-16 | 一种Micro-LED芯片转移方法及显示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910588798.9A CN110310907B (zh) | 2019-07-02 | 2019-07-02 | 一种Micro-LED芯片转移方法及显示装置 |
Publications (2)
Publication Number | Publication Date |
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CN110310907A CN110310907A (zh) | 2019-10-08 |
CN110310907B true CN110310907B (zh) | 2022-06-14 |
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CN201910588798.9A Active CN110310907B (zh) | 2019-07-02 | 2019-07-02 | 一种Micro-LED芯片转移方法及显示装置 |
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CN (1) | CN110310907B (zh) |
WO (1) | WO2021000384A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110931520B (zh) * | 2019-10-30 | 2022-04-12 | 武汉大学 | 一种Micro-LED制备方法 |
CN110767582B (zh) * | 2019-11-06 | 2020-05-26 | 广东工业大学 | 一种Micro-LED芯片的转移方法 |
CN111341682A (zh) * | 2020-02-09 | 2020-06-26 | 纳晶科技股份有限公司 | 一种显示基板的芯片检修装置及检修方法 |
CN112117297A (zh) * | 2020-10-22 | 2020-12-22 | 中国科学院长春光学精密机械与物理研究所 | 全彩色Micro LED阵列结构及其制备方法 |
CN113451274B (zh) * | 2020-10-28 | 2022-08-05 | 重庆康佳光电技术研究院有限公司 | Led芯片组件、显示面板及制备方法 |
CN112967951B (zh) * | 2021-01-29 | 2023-02-17 | 天马微电子股份有限公司 | 一种发光元件组装系统及组装方法 |
CN114551656B (zh) * | 2022-01-28 | 2022-11-22 | 福建兆元光电有限公司 | 一种彩色Micro LED显示芯片模组的制造方法 |
WO2024092560A1 (zh) * | 2022-11-02 | 2024-05-10 | 京东方科技集团股份有限公司 | 多坐标系标定与设备对位方法、巨量转移设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108615742A (zh) * | 2018-07-10 | 2018-10-02 | 南方科技大学 | 一种显示面板制作方法、显示面板及显示装置 |
WO2018214205A1 (zh) * | 2017-05-23 | 2018-11-29 | 深圳市华星光电技术有限公司 | 彩色微发光二极管阵列基板的制作方法 |
CN109585342A (zh) * | 2018-11-30 | 2019-04-05 | 天马微电子股份有限公司 | 一种微发光二极管的转移方法及显示面板 |
CN109637966A (zh) * | 2018-12-20 | 2019-04-16 | 广东工业大学 | 一种Micro-LED的转移方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002280174A (ja) * | 2001-03-22 | 2002-09-27 | Sharp Corp | ドナーフィルムおよびそれを用いて製造された有機led表示パネル |
JP2003168559A (ja) * | 2001-11-30 | 2003-06-13 | Sharp Corp | 有機led用ドナーフィルムと基板、及び、それらを用いた有機led表示パネルとその製造方法 |
US10217729B2 (en) * | 2016-09-30 | 2019-02-26 | Intel Corporation | Apparatus for micro pick and bond |
CN108231653B (zh) * | 2018-01-04 | 2020-08-04 | 厦门大学 | 一种MicroLED芯片转印方法及装置 |
CN109473532B (zh) * | 2018-11-20 | 2020-11-06 | 合肥京东方光电科技有限公司 | 一种Micro LED显示基板的制作方法 |
CN109859646B (zh) * | 2019-03-29 | 2021-12-24 | 上海天马微电子有限公司 | 显示面板、显示装置和显示面板的制作方法 |
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2019
- 2019-07-02 CN CN201910588798.9A patent/CN110310907B/zh active Active
- 2019-08-16 WO PCT/CN2019/100968 patent/WO2021000384A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018214205A1 (zh) * | 2017-05-23 | 2018-11-29 | 深圳市华星光电技术有限公司 | 彩色微发光二极管阵列基板的制作方法 |
CN108615742A (zh) * | 2018-07-10 | 2018-10-02 | 南方科技大学 | 一种显示面板制作方法、显示面板及显示装置 |
CN109585342A (zh) * | 2018-11-30 | 2019-04-05 | 天马微电子股份有限公司 | 一种微发光二极管的转移方法及显示面板 |
CN109637966A (zh) * | 2018-12-20 | 2019-04-16 | 广东工业大学 | 一种Micro-LED的转移方法 |
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CN110310907A (zh) | 2019-10-08 |
WO2021000384A1 (zh) | 2021-01-07 |
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