Intelligent probe testing module and testing method thereof
Technical Field
The invention relates to an intelligent probe testing module and a testing method thereof.
Background
The traditional probe test PogoBlock module pays attention to structural improvement, the probe test module integrated on line has no detection function, and only after a major fault is stopped, the fault module is disassembled and replaced into a spare part of the probe module, and the fault module adopts an off-line test mode to find a fault source.
In order to cope with the fault condition of the production line, a large number of module spare parts are required to be reserved in the workshop site, so that the stock and the cost are increased, and the flexible space for equipment upgrading is reduced. In case of failure, the failure module is replaced by new hardware to ensure that the production line is still producing normally without stopping, but the specific failure cause of the production line stop can not be determined accurately. When the shutdown fault is not in the module structure, the fault phenomenon cannot be repeated in the offline detection, and the fault can be caused again in the operation process of the production line.
In the offline fault finding process of the conventional probe test Pogoslock module, the problems that field faults cannot be reproduced, the non-production environment is debugged and the like exist.
The fault module needs to be detached, then the fault is confirmed offline, and the root cause is searched for repair. The off-line diagnosis mode can not reproduce the fault phenomenon because the off-line diagnosis mode is separated from the actual application scene. In addition, a great number of verification experiments can be performed to determine whether the module mechanism has a problem. And even if the module repeats the fault phenomenon on the production line, a large number of auxiliary experiments are still needed to determine the specific cause of the fault.
The mechanical action in the probe test PogoBlock module is completely independent from the feedback of the test system, and closed loop feedback is avoided. The structure, control and test of the traditional probe test module are three mutually independent parts. When the structure fails, the control system can only diagnose through own abnormality, and the running states of the structure and the control part greatly influence the test data.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an intelligent probe testing module and a testing method thereof. The invention builds a closed loop for detecting and monitoring the whole system aiming at the probe test module, and firstly provides an intelligent analysis framework in the field of online probe test and increases real-time fault early warning and fault diagnosis.
The technical scheme adopted by the invention is as follows: the intelligent probe testing module comprises a sensing module group, a centralized data acquisition module, a real-time monitoring module and an intelligent analysis module, wherein the sensing module group, the real-time monitoring module and the intelligent analysis module are respectively connected with the centralized data acquisition module.
The sensing module group comprises an automatic movement mechanism module, a precise alignment module, a temperature control module, a wear detection module, an electronic test module and a stress test module.
The automatic motion mechanism module controls the overall operation of the probe module, and the structural component of the probe module comprises a carrier fixing plate, a needle plate carrier plate, a probe clamp, a dual precise positioning floating structure, a stress detection unit, a wear detection unit, a temperature control unit and an electronic test card.
The temperature control module is connected with the temperature control unit, the wear detection module is connected with the wear detection unit, the electronic test module is connected with the electronic test card, and the stress test module is connected with the stress detection unit.
The testing method realized according to the intelligent probe testing module comprises the following steps:
A. and (3) starting detection: the precise carrier flows into the test station, the carrier is buckled on the carrier fixing plate, the pin positioning structure can precisely position the carrier once, the needle plate carrier is matched with the probe clamp to be wholly pressed down, the probe is tightly matched with a product to be tested on the carrier, and in the pressing fit process, the double positioning floating structure can perform fine adjustment perpendicular to the movement direction once in contact with the carrier, so that accurate alignment is ensured when the probe is contacted with the product, and manufacturing deviation caused by a plurality of parts such as the carrier, the clamp, the carrier plate fixing piece and the like is eliminated;
B. and (3) data transmission: the automatic motion mechanism module, the precise alignment module, the temperature control module, the wear detection module, the electronic test module and the stress test module transmit respective data to the centralized data acquisition module, and the centralized data acquisition module transmits the collected comprehensive data to the real-time monitoring module and the intelligent analysis module respectively;
C. data monitoring analysis: the real-time monitoring module monitors the collected comprehensive data in real time, and the intelligent analysis module performs real-time intelligent analysis on the collected comprehensive data;
D. aging detection report: the intelligent analysis center can also perform statistical analysis on the historical collected data, and perform comparative analysis on the latest data collected in real time and the historical classified data to obtain an aging detection report;
E. fault diagnosis: the possible abnormality or fault of the whole system can be diagnosed or forecasted through the real-time monitoring of the data.
The beneficial effects of the invention are as follows: the invention constructs a closed loop for detecting and monitoring the whole system aiming at the probe test module. The intelligent feedback system for collection, monitoring and analysis is constructed by carrying out data and monitoring on links such as motion control, precise alignment, abrasion detection, stress test, temperature detection and the like and combining intelligent analysis such as test performance, stability detection and the like; in the field of online probe testing, an intelligent analysis architecture is provided for the first time, and real-time fault early warning and fault diagnosis are added. The intelligent analysis system is used for comprehensively analyzing the data acquired in real time, so that possible faults and anomalies can be early warned in advance, and major faults are effectively avoided; for the probe test, the system is designed to a plurality of professional technologies such as machinery, electronics, automation, software and the like, and key parts thereof have small size and high precision, and the system efficiency can be effectively improved, the cost can be reduced and faults can be reduced by performing intelligent control on an expensive and precise module. And (5) analyzing the service life of key parts, monitoring the state in real time and controlling the statistical process.
Drawings
Fig. 1 is a schematic view of the overall module connection structure of the present invention.
Detailed Description
As shown in fig. 1, the intelligent probe test module of the present invention is characterized in that: the intelligent data acquisition system comprises a sensing module group, a centralized data acquisition module 1, a real-time monitoring module 2 and an intelligent analysis module 3, wherein the sensing module group, the real-time monitoring module 2 and the intelligent analysis module 3 are respectively connected with the centralized data acquisition module 1.
The sensing module group comprises an automatic movement mechanism module 4, a precise alignment module 5, a temperature control module 6, a wear detection module 7, an electronic test module 8 and a stress test module 9.
The automatic motion mechanism module 4 controls the overall operation of the probe module, and the structural components of the probe module comprise a carrier fixing plate, a needle plate carrier plate, a probe clamp, a double precise positioning floating structure, a stress detection unit, a wear detection unit, a temperature control unit and an electronic test card.
The temperature control module 6 is connected with the temperature control unit, the wear detection module 7 is connected with the wear detection unit, the electronic test module 8 is connected with the electronic test card, and the stress test module 9 is connected with the stress detection unit.
The testing method realized according to the intelligent probe testing module comprises the following steps:
A. and (3) starting detection: the precise carrier flows into the test station, the carrier is buckled on the carrier fixing plate, the pin positioning structure can precisely position the carrier once, the needle plate carrier is matched with the probe clamp to be wholly pressed down, the probe is tightly matched with a product to be tested on the carrier, and in the pressing fit process, the double positioning floating structure can perform fine adjustment perpendicular to the movement direction once in contact with the carrier, so that accurate alignment is ensured when the probe is contacted with the product, and manufacturing deviation caused by a plurality of parts such as the carrier, the clamp, the carrier plate fixing piece and the like is eliminated; and the tail end of the probe clamp is connected with a stress detection sensor for feeding back the compression condition of each probe in the test action process. The risk of partial probe overpressure may result when stress imbalance occurs in multiple repeated pressing movements, so real-time pressure data feedback can be used to monitor the active state of the probe. The tail end of the probe clamp is also connected with an electronic test board card which is used for electrifying the probe and collecting electronic signals through the probe. In addition, still be connected with the control by temperature change unit, the action together with electronic test integrated circuit board after the probe anchor clamps push down the action and accomplish for with the temperature control of product at steady state, produce excessive heat after the product is electrified, then carry out temperature regulation through the control by temperature change module, the cooling is the setting value, and when the temperature is too low, the control by temperature change module then controls PID regulation temperature and rises. This application has good adaptability to temperature sensitive sensors or electronic products. In the whole action process, a nondestructive testing probe is arranged on the side face, and the probe can dynamically detect the abrasion degree of a core positioning mechanical part in the movement process of the module, and early warn and draw a maintenance plan in advance before aging or serious abrasion occurs;
B. and (3) data transmission: the automatic movement mechanism module 4, the precise alignment module 5, the temperature control module 6, the wear detection module 7, the electronic test module 8 and the stress test module 9 transmit respective data to the centralized data acquisition module 1, and the centralized data acquisition module 1 transmits the collected comprehensive data to the real-time monitoring module 2 and the intelligent analysis module 3 respectively;
C. data monitoring analysis: the real-time monitoring module 2 monitors the collected comprehensive data in real time, and the intelligent analysis module 3 performs real-time intelligent analysis on the collected comprehensive data;
D. aging detection report: the intelligent analysis center can also perform statistical analysis on the historical collected data, and perform comparative analysis on the latest data collected in real time and the historical classified data to obtain an aging detection report;
E. fault diagnosis: the possible abnormality or fault of the whole system can be diagnosed or forecasted through the real-time monitoring of the data.
The intelligent system provided by the invention acquires the process parameters of the automatic action and the operation of key parts by adding more data perception terminals. Meanwhile, the bottom communication of the automatic action is combined with the analysis result of the electronic test, and the bottom communication and the analysis result of the electronic test are connected to the intelligent data analysis center through the data acquisition framework, so that the interoperability of the system is improved, and the intelligent optimization and control of the system can be further realized under the centralized control of the intelligent analysis center.
And carrying out online real-time monitoring and analysis on key core components such as a probe, a Pogoslock precise positioning mechanism and test result data. The traditional aging data analysis stores the test steps and result data in a file format of a hard disk through test software, and then copies the file and performs offline report analysis on the independent PC. In the intelligent system, the intelligent analysis center can independently collect and intensively store the data of each module such as automation, test and the like, and present the data in a report form updated in real time. In the running process of the system, the report forms show dynamic changes of test and running data in real time, and when partial data are abnormal locally, the system gives an automatic alarm prompt or shows related abnormal data marks.
In the running process of the system, the intelligent analysis center can also perform statistical analysis on the historical collected data and perform comparison analysis on the latest data collected in real time and the historical classification data. Besides the real-time collection and monitoring of the data, the intelligent analysis center can conduct correlation analysis and quantitative relation fitting on a plurality of different data sources, so that the operation mechanism inside the test machine can be revealed in a deeper level. Through the customization of data presentation, test SPC analysis and aging SPC analysis can be simultaneously carried out in the system, so that the quality process control of test and aging is enhanced.
The probe test module has intelligent analysis and diagnosis functions, wherein the possible abnormality or fault of the whole system can be diagnosed or forecasted through data real-time monitoring, including mechanical fault diagnosis (abrasion detection and stress detection), electronic fault diagnosis (temperature detection and electronic signal detection), and statistical process control (test data SPC and automatic action SPC). By carrying out historical traceability on each detection parameter and combining the functions of real-time monitoring and analysis, evaluating newly generated data through mechanical learning of a large amount of stored historical data, when the latest detection data is abnormal in a learning model in a large probability, the intelligent analysis center gives an early warning to the parameter, and further carries out correlation analysis on other parameters related to the action logic to finally determine whether the detection parameter is abnormal.
The invention is suitable for the field of probe testing.