CN110306170A - A kind of waveguide assemblies and microwave plasma CVD device - Google Patents
A kind of waveguide assemblies and microwave plasma CVD device Download PDFInfo
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- CN110306170A CN110306170A CN201910578365.5A CN201910578365A CN110306170A CN 110306170 A CN110306170 A CN 110306170A CN 201910578365 A CN201910578365 A CN 201910578365A CN 110306170 A CN110306170 A CN 110306170A
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- 238000005268 plasma chemical vapour deposition Methods 0.000 title claims abstract description 74
- 238000000429 assembly Methods 0.000 title claims abstract description 54
- 230000000712 assembly Effects 0.000 title claims abstract description 54
- 230000001939 inductive effect Effects 0.000 claims abstract description 320
- 238000007664 blowing Methods 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 64
- 238000006243 chemical reaction Methods 0.000 claims description 34
- 238000009423 ventilation Methods 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 5
- 238000003032 molecular docking Methods 0.000 claims description 4
- 238000009738 saturating Methods 0.000 claims 1
- 239000003570 air Substances 0.000 abstract description 319
- 239000008358 core component Substances 0.000 abstract description 21
- 239000012080 ambient air Substances 0.000 abstract description 11
- 239000000110 cooling liquid Substances 0.000 description 33
- 239000007788 liquid Substances 0.000 description 17
- 239000000306 component Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000012808 vapor phase Substances 0.000 description 10
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000010453 quartz Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000428 dust Substances 0.000 description 5
- 238000000259 microwave plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 230000035515 penetration Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- -1 polytetrafluoroethylene Polymers 0.000 description 4
- 238000013475 authorization Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 206010044565 Tremor Diseases 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
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- 230000002787 reinforcement Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/274—Diamond only using microwave discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/276—Diamond only using plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/517—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The present invention relates to microwave plasma CVD technical fields, more particularly to a kind of waveguide assemblies and microwave plasma CVD device, waveguide assemblies include air inducing pipeline section, for being arranged between microwave generator and mode converter, air-inducing passage is provided on air inducing pipeline section side wall, for air inducing pipeline section inner cavity to be connected to the external world, it further include blower, it is docked with air-inducing passage, for blowing at air-inducing passage into air inducing pipeline section inner cavity, or the air draught from air inducing pipeline section inner cavity, to form air-flow in waveguide cavities, wave transparent wind deflector is installed in air inducing pipeline section, for stopping air flow direction microwave generator.When work, by the air-supply or air draught of blower, the core component in device is cooled down so that cool ambient air is able to enter in device, it is ensured that device can steadily work.
Description
Technical field
The present invention relates to microwave plasma CVD technical field more particularly to a kind of waveguide assemblies and microwaves
Plasma CVD device.
Background technique
Microwave plasma CVD (Microwave plasma chemical vapor deposition)
Abbreviation MPCVD is to prepare excellent diamonds product most efficient method, has become high speed, large area, high quality Buddha's warrior attendant
The prefered method of stone film preparation.According to international control regulations, two kinds of industrial MPCVD equipment are primarily present, microwave is respectively as follows:
The low-power MPCVD equipment of frequency 2.45GHz, 6-8kW and the high power MPCVD equipment of microwave frequency 915MHz, 60-100kW.
Such as, Authorization Notice No. is a kind of microwave plasma chemical gas disclosed in the Chinese invention patent of CN104726850B
Phase depositing device, the equipment can produce the microwave that frequency is 915MHz, production efficiency big with depositional area at work
High feature.But microwave frequency be 915MHz high power MPCVD equipment in the process of running, the microwave energy of transmission is big,
Cause the core components temperature such as converter resonant cavity higher, not only bad at high speed, the deposition of excellent diamonds product,
The stability that service life of related components runs equipment can be also reduced to adversely affect.
Summary of the invention
The purpose of the present invention is to provide a kind of waveguide assemblies, to solve microwave plasma chemical gas in the prior art
It is excessively high and lead to microwave plasma CVD to be easy to appear temperature for its core component in phase precipitation equipment operational process
The technical problem of device operating status shakiness.The object of the invention is also to provide a kind of microwave plasma CVDs
Device is easy to solve its core component in microwave plasma CVD device operational process in the prior art
Existing temperature is excessively high and leads to the technical problem of microwave plasma CVD device operating status shakiness.
To achieve the above object, waveguide assemblies adopt the following technical scheme that in the present invention
A kind of waveguide assemblies, including air inducing pipeline section, are arranged between microwave generator and mode converter to transmit microwave, draw
It is provided with air-inducing passage on air hose section side wall, further includes blower, with air inducing for air inducing pipeline section inner cavity to be connected to the external world
Channel docking, for blowing at air-inducing passage into air inducing pipeline section inner cavity, or the air draught from air inducing pipeline section inner cavity, to draw
Cooling air-flow is formed in air hose section inner cavity, wave transparent wind deflector is installed in air inducing pipeline section, for stopping air flow direction microwave to occur
Device.
The beneficial effects of the present invention are: it is arranged in the side wall of the waveguide assemblies between microwave generator and mode converter
On open up air-inducing passage, and air-inducing passage, when blower work, cool ambient air is blown in air inducing pipeline section to blower is connected to
Intracavitary, cold air can flow to mode converter through air inducing pipeline section inner cavity, cool down to components such as mode converter, resonant cavities,
Meanwhile wave transparent wind deflector is provided in the inner cavity of air inducing pipeline section again, the microwave that wave transparent wind deflector will not generate microwave generator
It causes to hinder, while the cooling air-flow flowed into air inducing pipeline section inner cavity through air-inducing passage can be formed and be hindered again, it is ensured that is cooling
Air-flow will not flow to microwave generator, to avoid the dust being mingled in cooling air-flow to three pin tuners and microwave generator
Etc. polluting.Similarly, when blower air draught from air inducing pipeline section inner cavity, the microwave plasma chemical of the waveguide assemblies is used
Air pressure in vapor phase growing apparatus is lower than ambient pressure, and cool ambient air can enter inside device from corresponding vent passages, right
The core component of device is cooled down, thus in the microwave plasma CVD device for using the waveguide assemblies
Core component is cooled down, it is ensured that is worked to microwave plasma CVD device normal table.
Further, air inducing pipeline section has length extending direction corresponding with microwave transmission direction, the inclination of wave transparent wind deflector
Arrangement, wave transparent wind deflector are corresponding with the air-inducing passage on the length extending direction of air inducing pipeline section.
The utility model has the advantages that wave transparent wind deflector be in tilted layout and wave transparent wind deflector on the length extending direction of air inducing pipeline section with institute
It is corresponding to state air-inducing passage, so that wave transparent wind deflector forms the slope towards mode converter in waveguide cavities, when
When blower is blown at air-inducing passage into air inducing pipeline section inner cavity, slope guides air-flow to flow towards mode converter.
Further, air-inducing passage is the air inducing hole being arranged in array, and is provided at air inducing hole for installing the blower
Blower flange.
The utility model has the advantages that directly opening up air inducing hole on air inducing pipeline section side wall to form air-inducing passage, air-inducing passage is simplified
Structure, to simplify the structure of waveguide assemblies, meanwhile, the flange for installing blower is set at air-inducing passage, it is convenient
The installation of blower, while also further simplifying the structure of waveguide assemblies.
Further, the blower is blown at air inducing hole into air inducing pipeline section, and liquid cooling system is additionally provided on air inducing pipeline section
System, cools down air inducing pipeline section.
The utility model has the advantages that be provided with liquid cooling system on air inducing pipeline section, so that air inducing pipeline section itself has a lower temperature, and wind
Machine is blown at air inducing hole again, then can be by the lower induced duct of temperature from the air-flow entered in air inducing pipeline section inner cavity from air inducing hole
Duan Jinhang is cooling, so that flowing to the air-flow of the core components such as converter, reaction chamber with lower temperature and having more preferable
Cooling effect.
Further, air inducing pipeline section is seperated rectangular tube structure, including upper waveguide plate, lower waveguide plate, left waveguide plate and
Right waveguide plate, air-inducing passage are arranged on upper waveguide plate, and liquid cooling system includes being provided with left waveguide plate, right waveguide plate and lower waveguide
Cooling liquid bath on plate is sealed and installed with tank cover plate on each cooling liquid bath, is provided with cooling liquid inlet and cooling in each tank cover plate
Liquid outlet.
The utility model has the advantages that it is relatively independent to set upper waveguide plate, lower waveguide plate, left waveguide plate and right waveguide plate for air inducing pipeline section
Separate structure, convenient to fabricate to each piece of waveguide plate, especially cooling liquid bath opens up, and can be directed to each piece
Waveguide plate carries out the processing of cooling liquid bath, then fits together each waveguide plate to form waveguide assemblies again.
Further, the cooling liquid bath opened up on left waveguide plate is U-shaped structure, and tank cover plate is mutually to fit with coolant liquid groove shape
The U-shaped structure cover board matched offers bolt through hole in the middle part of the U-shaped structure of cooling liquid bath, keeps out the wind for installing to wave transparent
The bolt that plate is fixed, the structure of right waveguide plate are identical as the structure of left waveguide plate.
The utility model has the advantages that setting U-shaped structure for cooling liquid bath, distribution density of the cooling liquid bath on waveguide plate is increased,
Meanwhile it the intermediate position of the cooling liquid bath of U-shaped structure is used into setting is used to install and wave transparent wind deflector is fixed
The screw hole of screw gets up the space utilization among cooling liquid bath, so that entire waveguide assemblies structure is more compact.It is right simultaneously
The structure of waveguide plate is identical as the structure of left waveguide plate, allows left and right waveguide plate general, for left and right waveguide plate, production
When only produce the waveguide plate of structure a kind of so that waveguide assemblies production is more convenient.
The technical solution of rate microwave plasma CVD device in the present invention is as follows:
A kind of microwave plasma CVD device including microwave generator, mode converter, forms the outer of resonant cavity
Cavity and reaction chamber further include connection waveguiding structure, are arranged between microwave generator and mode converter with conducts microwaves, outside
Cavity and mode converter docking, reaction chamber are located in outer chamber, and connection waveguiding structure includes waveguide assemblies, and waveguide assemblies include
Air inducing pipeline section is arranged between microwave generator and mode converter with conducts microwaves, is provided with and is drawn on air inducing pipeline section side wall
Wind channel further includes blower, docks with air-inducing passage, in air inducing for air inducing pipeline section inner cavity to be connected to the external world
It blows at channel into air inducing pipeline section inner cavity, or the air draught from air inducing pipeline section inner cavity, it is cold to be formed in air inducing pipeline section inner cavity
But air-flow is installed with wave transparent wind deflector in air inducing pipeline section, for stopping air flow direction microwave generator；It is arranged on the outer chamber
There are vent passages, for resonant cavity to be connected to the external world, vent passages pass through the resonant cavity, mode converter, connection
Waveguiding structure is connected to the air-inducing passage in the waveguide assemblies, when blower is blown at air-inducing passage into air inducing pipeline section inner cavity
When, vent passages are used for outlet air, to form cooling air-flow between air-inducing passage and vent passages, alternatively, working as blower from air inducing
In pipeline section inner cavity when air draught, vent passages are for entering the wind, to form cooling air-flow between air-inducing passage and vent passages.
The beneficial effects of the present invention are: it is arranged in the side wall of the waveguide assemblies between microwave generator and mode converter
On open up air-inducing passage, and air-inducing passage, when blower work, cool ambient air is blown in air inducing pipeline section to blower is connected to
Intracavitary, cold air can flow to the core components such as mode converter, plasma deposition chambers, outer chamber through air inducing pipeline section inner cavity, and from
It is flowed out in vent passages, to cool down to microwave plasma CVD device.Meanwhile in the inner cavity of air inducing pipeline section
It is provided with wave transparent wind deflector again, the microwave that wave transparent wind deflector will not generate microwave generator causes to hinder, while again can be right
The cooling air-flow flowed into air inducing pipeline section inner cavity through air-inducing passage, which is formed, to be hindered, it is ensured that cooling air-flow will not flow to microwave
Device, so that the dust being mingled in cooling air-flow be avoided to pollute microwave generator.Similarly, when blower at air-inducing passage from
In air inducing pipeline section inner cavity when air draught, the gas in the high power microwave plasma chemical vapor deposition unit of the waveguide assemblies is used
Force down in ambient pressure, cool ambient air can enter in outer chamber from vent passages, and from air-inducing passage flow out, to microwave etc. from
Core component in daughter chemical vapor deposition unit is cooled down, it is ensured that microwave plasma CVD device is normal
Steadily work.
Further, air inducing pipeline section has length extending direction corresponding with microwave transmission direction, the inclination of wave transparent wind deflector
Arrangement, wave transparent wind deflector are corresponding with the air-inducing passage on the length extending direction of air inducing pipeline section.
The utility model has the advantages that wave transparent wind deflector be in tilted layout and wave transparent wind deflector on the length extending direction of air inducing pipeline section with institute
It is corresponding to state air-inducing passage, so that wave transparent wind deflector forms the slope towards mode converter in waveguide cavities, when
When blower is blown at air-inducing passage into air inducing pipeline section inner cavity, slope guides air-flow to flow towards mode converter.
Further, air-inducing passage is the air inducing hole for the array arrangement being provided on air inducing pipeline section upper side wall, at air inducing hole
It is provided with the blower flange for installing blower.
The utility model has the advantages that directly opening up air inducing hole on air inducing pipeline section side wall to form air-inducing passage, air-inducing passage is simplified
Structure, to simplify the structure of waveguide assemblies, meanwhile, the flange for installing blower is set at air-inducing passage, it is convenient
The installation of blower, while also further simplifying the structure of waveguide assemblies.
Further, the blower is blown at air inducing hole into air inducing pipeline section, and liquid cooling system is additionally provided on air inducing pipeline section
System, cools down air inducing pipeline section.
The utility model has the advantages that be provided with liquid cooling system on air inducing pipeline section, so that air inducing pipeline section itself has a lower temperature, and wind
Machine is blown at air inducing hole again, then can be by the lower induced duct of temperature from the air-flow entered in air inducing pipeline section inner cavity from air inducing hole
Duan Jinhang is cooling, so that flowing to the air-flow of the core components such as converter, reaction chamber with lower temperature and having more preferable
Cooling effect.
Further, air inducing pipeline section is seperated rectangular tube structure, including upper waveguide plate, lower waveguide plate, left waveguide plate and
Right waveguide plate, air-inducing passage are arranged on upper waveguide plate, and liquid cooling system includes being provided with left waveguide plate, right waveguide plate and lower waveguide
Cooling liquid bath on plate is sealed and installed with tank cover plate on each cooling liquid bath, is provided with cooling liquid inlet and cooling in each tank cover plate
Liquid outlet.
The utility model has the advantages that it is relatively independent to set upper waveguide plate, lower waveguide plate, left waveguide plate and right waveguide plate for air inducing pipeline section
Separate structure, convenient to fabricate to each piece of waveguide plate, especially cooling liquid bath opens up, and can be directed to each piece
Waveguide plate carries out the processing of cooling liquid bath, then fits together each waveguide plate to form waveguide assemblies again.
Further, the cooling liquid bath opened up on left waveguide plate is U-shaped structure, and tank cover plate is mutually to fit with coolant liquid groove shape
The U-shaped structure cover board matched offers bolt through hole in the middle part of the U-shaped structure of cooling liquid bath, keeps out the wind for installing to wave transparent
The bolt that plate is fixed, the structure of right waveguide plate are identical as the structure of left waveguide plate.
The utility model has the advantages that setting U-shaped structure for cooling liquid bath, distribution density of the cooling liquid bath on waveguide plate is increased,
Meanwhile it the intermediate position of the cooling liquid bath of U-shaped structure is used into setting is used to install and wave transparent wind deflector is fixed
The screw hole of screw gets up the space utilization among cooling liquid bath, so that entire waveguide assemblies structure is more compact.It is right simultaneously
The structure of waveguide plate is identical as the structure of left waveguide plate, allows left and right waveguide plate general, for left and right waveguide plate, production
When only produce the waveguide plate of structure a kind of so that waveguide assemblies production is more convenient.
Further, outer chamber includes outer outlet body and support plate, and vent passages are arranged on the supporting plate.
The utility model has the advantages that vent passages are arranged in the support plate of outer chamber, it is ensured that cooling air-flow is in microwave plasma
Learning has stroke as big as possible in vapor phase growing apparatus, realize more preferable, more thorough cooling effect.
Further, annular space formed on outer outlet body bottom and reaction chamber bottom, support plate interior cover and outer outlet body it
Between region be annular region around reaction chamber, vent passages are by multiple ventilation holes for being arranged in the annular region of support plate
Composition.
The utility model has the advantages that ventilation hole is arranged on the supporting plate in the annular region of reaction chamber, so that vent passages
Be around reaction chamber arrange so that air-flow from vent passages be discharged or enter outer chamber when, can be circumferentially right along reaction chamber
Reaction chamber is uniformly cooled down.
Further, blast switch is equipped in the air inducing pipeline section, microwave plasma CVD device also wraps
Controller is included, for controlling microwave generator work, the controller is connect with the blast switch signal, in blast switch
Control microwave generator is shut down when detecting ventilation pressure loss down to setting value.
The utility model has the advantages that cooling can not be formed in microwave plasma CVD device when blower breaks down
When air-flow, the blast switch being arranged in air inducing pipeline section can monitor the variation of the wind pressure in air inducing pipeline section, and by monitoring result
It is transferred to controller, controller controls microwave generator shutdown according to the monitoring result of blast switch, avoids microwave plasma
Body chemical vapor phase growing apparatus works on when blower can not provide cooling air-flow and leads to device inner core part temperatures mistake
It is high.
To achieve the above object, the technical solution of microwave plasma CVD device is as follows in the present invention:
A kind of microwave plasma CVD device, comprising: microwave generator, forms resonant cavity at mode converter
Outer chamber and reaction chamber further include the connection waveguide junction being arranged between mode converter and microwave generator with conducts microwaves
Structure, outer chamber are docked with mode converter, and reaction chamber is located in outer chamber, connection waveguiding structure include successively seperated concatenation draw
Air hose section and distance piece, distance piece are located at the side towards microwave generator of air inducing pipeline section, and the air inducing pipeline section, which is equipped with, to be used
In the air-inducing passage that air inducing pipeline section inner cavity is in communication with the outside, the distance piece has wave transparent wind deflector, sets on the outer chamber
Have vent passages, for resonant cavity to be in communication with the outside, the vent passages by the resonant cavity, mode converter with it is described
Air-inducing passage connection, microwave plasma CVD device further includes blower, and blower is docked with air-inducing passage, is used for
Blow at air-inducing passage into air inducing pipeline section inner cavity, or the air draught from air inducing pipeline section inner cavity, when blower at air-inducing passage to
When blowing in air inducing pipeline section inner cavity, vent passages are used for outlet air, to form cooling air-flow between air-inducing passage and vent passages,
Alternatively, when blower air draught from air inducing pipeline section inner cavity at air-inducing passage, vent passages for entering the wind, in air-inducing passage and
Cooling air-flow is formed between vent passages.
The beneficial effects of the present invention are: it is arranged between microwave generator and mode converter and plays conducts microwaves
Being connected to waveguiding structure includes air inducing pipeline section and distance piece, wherein air-inducing passage is arranged on air inducing pipeline section, and docks on air-inducing passage
There is blower, it is corresponding, the vent passages being connected to air-inducing passage are set on outer chamber, when blower work, by cool ambient air
Be blown to the interior intracavitary formation cooling air-flow of air inducing pipeline section, cooling air-flow can be flow to through air inducing pipeline section inner cavity mode converter, etc. from
The core components such as sub- settling chamber, outer chamber, and flowed out from vent passages, to microwave plasma CVD device
Cool down, and the distance piece with wave transparent wind deflector is under the premise of will not cause obstruction to microwave, it is ensured that cooling air-flow is not
It can be flow to microwave generator, so that the dust being mingled in cooling air-flow be avoided to pollute microwave generator.Similarly, if blower
The air draught from waveguide body inner cavity, the air pressure in microwave plasma CVD device is lower than ambient pressure, extraneous cold
Air can enter in outer chamber from vent passages, and flow out from air-inducing passage, to microwave plasma CVD device
Interior core component is cooled down, it is ensured that is worked to microwave plasma CVD device normal table.
Further, the outer chamber includes outer outlet body and support plate, and vent passages are arranged on the supporting plate.
The utility model has the advantages that vent passages are arranged in the support plate of outer chamber, it is ensured that cold airflow is in microwave plasma chemical
There is stroke as big as possible in vapor phase growing apparatus, realizes more preferable, more efficient cooling effect.
Further, annular space formed on outer outlet body bottom and reaction chamber bottom, support plate interior cover and outer outlet body it
Between region be annular region around reaction chamber, air-inducing passage is by multiple ventilation holes for being arranged in the annular region of support plate
It is formed.
The utility model has the advantages that air inducing hole is arranged on the supporting plate around the annular region of vapor phase growing apparatus, so that ventilation
Channel be around vapor phase growing apparatus arrange so that air-flow from vent passages be discharged or enter outer chamber when, can be to gas
Phase precipitation equipment carries out circumferential uniformly cooling.
Further, the reaction chamber is surrounded by support plate and the interior cover being sealingly fitted in support plate, support plate
Towards the inside of interior cover, liner plate is set.
The utility model has the advantages that reaction chamber is formed by the inner cover body being sealingly fitted in support plate, and vent passages are provided with branch
It on fagging, and is arranged around reaction chamber, it is ensured that cold airflow passes through interior cover on flow path, and along the circumferential internal of interior cover
Cover is uniformly cooled down.
Further, the distance piece includes outward flange frame, and wave transparent wind deflector is mounted in outward flange frame, outward flange
Frame is equipped with the mounting hole being circumferentially sequentially arranged, and distance piece is serially connected in connection waveguiding structure.
The utility model has the advantages that wave transparent wind deflector is mounted in outward flange frame, then by outward flange frame microwave etc. from
Installation of the wave transparent wind deflector on microwave plasma CVD device is realized on daughter chemical vapor deposition unit,
It is not necessary that mounting structure is arranged on wave transparent wind deflector, meanwhile, outward flange frame can also carry out reinforcement protection to wave transparent wind deflector
And prevent microwave from leaking from distance piece.
Further, the wave transparent wind deflector is made of polytetrafluoroethylene (PTFE).
The utility model has the advantages that polytetrafluoroethylene (PTFE) has fabulous microwave penetration rate, and cost is relatively low for polytetrafluoroethylene (PTFE).
Further, air inducing pipeline section includes the flange end plate of intermediate rectangular waveguide and both ends, flange end plate and square
The welding of corrugated waveguide respective end is connected, and flange end plate is equipped with the flange mounting hole being circumferentially sequentially arranged, by air inducing pipeline section
It is serially connected in connection waveguiding structure.
The utility model has the advantages that there is the flange end plate of flange mounting hole in the setting of the both ends of air inducing pipeline section, air inducing pipeline section is facilitated to exist
The concatenation being connected in waveguiding structure.
Further, the air inducing pipeline section is rectangular configuration, and the upper wall surface and lower wall surface of air inducing pipeline section are broadside wall surface, left
Wall surface and right wall are narrow side wall surface, and air-inducing passage is arranged on the broadside wall surface of air inducing pipeline section.
The utility model has the advantages that setting air inducing pipeline section to broadside wall structure, and air-inducing passage is arranged in broadside wall surface
On, a matrix as big as possible is provided for the setting of air-inducing passage, the setting of air-inducing passage is facilitated, so that air-inducing passage can
Big opening is arranged.
Further, the air inducing hole of array arrangement is offered on the upper wall surface of the air inducing pipeline section, air inducing hole, which constitutes, draws
Wind channel is provided with the blower flange for installing blower at air inducing hole.
The utility model has the advantages that opening up air inducing hole on waveguide body side wall directly to form air-inducing passage, air-inducing passage is simplified
Structure, to simplify the structure of waveguide assemblies, meanwhile, the flange for installing blower is set at air-inducing passage, it is convenient
The installation of blower, while also further simplifying the structure of waveguide assemblies.
Further, blast switch is equipped in the air inducing pipeline section, microwave plasma CVD device also wraps
Controller is included, for controlling microwave generator work, the controller is connect with the blast switch signal, in blast switch
Control microwave generator is shut down when detecting ventilation pressure loss down to setting value.
The utility model has the advantages that cooling can not be formed in microwave plasma CVD device when blower breaks down
When air-flow, the blast switch being arranged in air inducing pipeline section can monitor the variation of the wind pressure in air inducing pipeline section, and by monitoring result
It is transferred to controller, controller controls microwave generator shutdown according to the monitoring result of blast switch, avoids microwave plasma
Body chemical vapor phase growing apparatus works on when blower can not provide cooling air-flow and leads to device inner core part temperatures mistake
It is high.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the embodiment 1 of microwave plasma CVD device in the present invention；
Fig. 2 is the structural schematic diagram of the support plate of microwave plasma CVD device in the present invention；
Fig. 3 is the air inducing pipe segment structure schematic diagram of the embodiment 1 of microwave plasma CVD device in the present invention；
Fig. 4 is the structural schematic diagram of the upper waveguide plate of the embodiment 1 of microwave plasma CVD device in the present invention；
Fig. 5 is not install slot cover on the left waveguide plate of the embodiment 1 of microwave plasma CVD device in the present invention
Structural schematic diagram in the state of plate；
Fig. 6 is to be equipped with slot cover on the left waveguide plate of the embodiment 1 of microwave plasma CVD device in the present invention
Structural schematic diagram in the state of plate；
Fig. 7 is the wave transparent wind deflector of the embodiment 1 of microwave plasma CVD device in the present invention in air inducing pipeline section
Interior arrangement schematic diagram；
Fig. 8 is the structural schematic diagram of the embodiment 4 of microwave plasma CVD device in the present invention；
Fig. 9 is the structural schematic diagram of the air inducing pipeline section of the embodiment 4 of microwave plasma CVD device in the present invention；
Figure 10 is the structural schematic diagram of the distance piece of the embodiment 4 of microwave plasma CVD device in the present invention；
In figure: 11. microwave generators；12. circulator；13. three pin tuners；2. mode converter；21. Tapered Cup；22. same
Axis antenna；3. resonant cavity；4. outer outlet body；5. support plate；51. ventilation hole；52. seal groove；53. substrate groove；6. waveguide assemblies；
61. air inducing pipeline section；1611. upper waveguide plate；6111. bolt through hole；6112. air inducing hole；6113. blower flange；6114. upper ripple
Guide plate ontology；6115. rectangular boss；1612. left waveguide plate；6121. tank cover plate；6122. cooling liquid inlet；6123. coolant liquid
Outlet；6124. cooling liquid bath；1613. lower waveguide plate；1614. right waveguide plate；62. blower；63. wave transparent wind deflector；7. reaction
Room；Cover in 71.；72. plasma；73. substrate；8. sliding plunger；9. being connected to waveguiding structure；91. air inducing pipeline section；92. every
From section；2611- upper wall surface；2612- air inducing hole；2613- blower flange；2614- blast switch fixation hole；621- outward flange frame
Frame；622- wave transparent wind deflector.
Specific embodiment
Microwave plasma CVD device can be divided into low power microwave etc. at work, according to its watt level
Ion body chemical vapor phase growing apparatus and high power microwave plasma chemical vapor deposition unit, wherein power is 6-8kW's
For low power microwave plasma CVD device, power is high power microwave plasma chemistry in 60-100kW
Vapor phase growing apparatus.Waveguide assemblies are mainly used for high-power microwave plasma CVD device in the present invention, with
Solve the problems, such as that its core component is also easy to produce high temperature to high-power microwave plasma CVD device at work, when
So, if low power microwave plasma CVD device be also required under certain operating conditions to its internal core component into
Row cools down, and the waveguide assemblies in the present invention can also be used in low power microwave plasma CVD device.First below
The microwave plasma CVD device that waveguide assemblies are provided in the present invention is introduced.
The embodiment 1 of microwave plasma CVD device in the present invention, as shown in Fig. 1-Fig. 7, microwave etc. from
Daughter chemical vapor deposition unit mainly include microwave generator 11, circulator 12, three pin tuners 13, mode converter 2,
Sliding plunger 8, the outer chamber for surrounding resonant cavity 3, the reaction chamber 7 in resonant cavity 3, outer chamber and mode converter 2 dock.
It further include the connection waveguiding structure being arranged between mode converter 2 and microwave generator 11 with conducts microwaves.
Wherein, mode converter 2 includes Tapered Cup 21 and coaxial antenna 22, and mode converter 2 is used for the mode of microwave
It is converted, working principle belongs to the prior art, and the Chinese invention patent if Authorization Notice No. is CN104726850B discloses
A kind of microwave plasma CVD equipment, the microwave mode converter in the equipment at work can be by TE mould
The microwave of formula is converted into the microwave of TEM mode, therefore, the structure and work no longer to the mode converter 2 in the application herein
Principle is repeated.
Outer chamber includes outer outlet body 4 and support plate 5, and outer outlet body 4 is located in support plate 5, and reaction chamber 7 is then filled by sealing
The interior cover 71 fitted in support plate 5 surrounds, wherein support plate 5 is for carrying interior cover 71 and corresponding substrate, support plate 5
It can be slided up and down relative to outer outlet body 4, to adjust the height of support plate.In other embodiments, in support plate height without adjusting
In the case where whole, support plate can not also be slided relative to outer outlet body.
For the structure of support plate 5 as shown in Fig. 2, being provided with seal groove 52 in support plate 5, interior cover 71 is mounted on seal groove 52
It is interior, realize sealing assembly of the interior cover 71 in support plate 5.The inside towards interior cover 71 of support plate 5 is provided with substrate groove
53, for placing substrate 73, plasma 72 is placed on substrate 73.In the present embodiment, interior cover 71 is quartz bell cover, at it
In his embodiment, the material of interior cover can also select the materials such as polytetrafluoroethylene (PTFE) or the sapphire of high microwave penetration rate.
Annular space is formed at the lower part of outer outlet body 4 and 7 lower part of reaction chamber, and corresponding, support plate 5 is in interior cover 71 and outer cover
Region between body 4 is the annular region around reaction chamber 7, and multiple ventilation holes 51,51 structure of ventilation hole is arranged in the annular region
At vent passages, resonant cavity 3 is in communication with the outside by vent passages.In other embodiments, for convenience of processing and manufacturing, ventilation hole
It can also be that the aperture of setting on the supporting plate meets the circular hole of air-conditioning requirement.Certainly, vent passages can also be arranged in
On outer outlet body.
When specific works, the microwave generated in microwave generator 11 is by circulator 12, three pin tuners 13, connection wave
Enter in resonant cavity 3 after guide structure, mode converter 2 and sliding plunger 8, microwave is assembled at the substrate 73 of quartz bell cover, will
Low-pressure gas in quartz bell cover ionizes to form plasma, and deposition obtains diamond film on substrate 73.For tuner
Selection can also use the tuner of other modes, e.g., three E-T tuners, double T tuners etc. in other embodiments.?
Tuner and circulator can be saved.
In order to avoid its internal associated components temperature is excessively high at work for microwave plasma CVD device, even
Logical waveguiding structure wherein one section can to include air inducing by the waveguide assemblies 6 in cool ambient air introducing device, waveguide assemblies 6
Pipeline section 61, air inducing pipeline section 61 are arranged between microwave generator 11 and mode converter 2 with conducts microwaves, are set on air inducing pipeline section 61
It is equipped with air-inducing passage, air-inducing passage is connected to by the waveguide assemblies 6, mode converter 2, resonant cavity 3 with vent passages.Pass through
The disengaging of air-flow at air-inducing passage and vent passages, by extraneous cooling air-flow introducing device to form the mode of flowing through in the device
The cooling air-flow of the components such as converter 2, reaction chamber 7, cools down to device.
Specifically, to being connected to blower 62 on air-inducing passage, in the present embodiment, when blower 62 works, the shape at air-inducing passage
Cool ambient air is streamed in waveguide assemblies 6 at positive pressure, intracavitary formation cooling air-flow, cooling air-flow in air inducing pipeline section 61
It flows through the vent passages opened up from outer chamber after the components such as mode converter 2, reaction chamber 7 and flows out to the external world.
Wherein, the specific structure is shown in FIG. 3 for the air inducing pipeline section 61 of waveguide assemblies 6, and air inducing pipeline section 61 is rectangular tube structure,
Including upper waveguide plate 1611, left waveguide plate 1612, lower waveguide plate 1613 and right waveguide plate 1614, upper waveguide plate 1611, which constitutes, to be drawn
The upper wall surface of air hose section, air-inducing passage are arranged on upper waveguide plate 1611.In this implementation, air-inducing passage is by being provided with upper waveguide plate
The air inducing hole 6112 of array arrangement on 1611 is constituted, and the aperture in air inducing hole 6112, which meets microwave, to let out from air inducing hole 6112
Leakage.In order to facilitate the installation of blower 62, blower flange 6113 is provided at air-inducing passage, when installing blower 62, directly by blower
62 are docked on blower flange 6113.
In other embodiments, air-inducing passage can also be arranged on other side walls of air inducing pipeline section, certainly, air inducing pipeline section
Four structures can also be greater than for section seamed edge quantity, e.g., the cross section of air inducing pipeline section is hexagon, octagon etc., can also
To set pipe of the cross section seamed edge less than four for air inducing pipeline section, e.g., the cross section of air inducing pipeline section is triangle.Certainly, draw
Air hose section may be round tubular structure.
Further, air inducing pipeline section 61 is set as separate structure, upper waveguide plate 1611, lower waveguide plate 1613, left waveguide plate
1612 and right waveguide plate 1614 it is relatively independent in structure.
It is additionally provided with liquid cooling system in waveguide assemblies 6, specifically, liquid cooling system includes being separately positioned on left waveguide plate
1612, the cooling liquid bath on lower waveguide plate 1613 and right waveguide plate 1614 is sealed and installed with tank cover plate 6121 on each cooling liquid bath,
Cooling liquid inlet 6122 and cooling liquid outlet 6123 are set in tank cover plate 6121.In the present embodiment, as shown in figure 5, cooling liquid bath
6124 be U-shaped structure, corresponding, and tank cover plate 6121 is also U-shaped structure, wherein cooling liquid inlet 6122 and cooling liquid outlet
6123 are separately positioned in the Liang Ge branch of tank cover plate 6121.
The setting of liquid cooling system can cool down to air inducing pipeline section 61, and then to the external world entered in 61 inner cavity of air inducing pipeline section
Air cools down, and improves cooling air-flow to the cooling efficiency of device inner core component.Meanwhile the induced duct that temperature is relatively low
Section 61 can also cool down to the device for being in direct contact with it connection by heat transfer.
In other embodiments, the structure of liquid cooling system can also be that the China that Authorization Notice No. is CN208590129U is real
The structure of water-cooling system in a kind of microwave crevasse device for high temperature cavity disclosed in new patent, specifically in air inducing
Toroidal cavity is arranged in pipe section exterior, and cooling water inlet and cooling water outlet are arranged on cavity.Certainly, can expire in outside air
In the case where the cooling requirement of foot unit, liquid cooling system can also be not provided on air inducing pipeline section.
The structure of upper waveguide plate 1611 is as shown in figure 4, upper waveguide plate 1611 includes upper waveguide board body 6114, upper waveguide plate
The rear and front end of the upper surface of ontology 6114 is provided with rectangular boss 6115, the left and right ends of rectangular boss 6115 and upper waveguide plate
The corresponding left and right end face of ontology 6114 is concordant, positioned at upper 6114 front end of waveguide board body rectangular boss 6115 front end face with it is upper
The front end face of waveguide board body 6114 is concordant, positioned at upper 6114 rear end of waveguide board body rectangular boss 6115 rear end face with it is upper
The rear end face of waveguide board body 6114 is concordant.Spiral shell is offered on the left and right side of upper waveguide board body 6114 and rectangular boss 6115
Pit.The structure of lower waveguide plate 1613 the difference is that only with the structure of upper waveguide plate 1611, upper waveguide board body 6114
On be provided with air inducing hole 6112, and in lower waveguide board body then be setting liquid cooling system.
The structure of left waveguide plate 1612 is as shown in figure 5, left waveguide plate 1612 includes left waveguide board body, left waveguide board body
Both ends be provided with crossbeam, the upper and lower ends of crossbeam overhang relative to the upper and lower side of left waveguide board body, and cantilevered length is equal to
The thickness of rectangular boss 6115 in upper waveguide board body.It is offered on left waveguide plate 612 and upper waveguide plate 1611, lower waveguide plate
The corresponding counterbore of threaded hole on 1613.The structure of right waveguide plate 1614 is identical as the structure of left waveguide plate 1613, so that left
Waveguide plate 1612 and right waveguide plate 1614 can be interchanged.When assembly, upper waveguide plate 1611, lower waveguide plate 1613, left waveguide plate
1612 and right waveguide plate 1614 be assembled together by the bolt being screwed in threaded hole.
After the assembly is completed, the rectangular boss of upper and lower waveguide front edge of board and the crossbeam of left and right waveguide front edge of board are correspondingly connected with,
The front baffle of air inducing pipeline section 61 is formed, the rectangular boss of upper and lower waveguide plate rear end is corresponding with the crossbeam of left and right waveguide plate rear end to be connected
Connect, form the afterframe of air inducing pipeline section 61, offer on the forward and backward frame of air inducing pipeline section 61 for by air inducing pipeline section 61 in device
On the mounting hole installed.In other embodiments, air inducing pipeline section can be set to integral structure.
The dust particles in air enter three pin tuners 13, circulator 12, microwave generator 11 etc. in order to prevent
In core component, wave transparent wind deflector 63 is additionally provided in waveguide assemblies 6, wave transparent wind deflector 63 is poly- the four of high microwave penetration rate
Vinyl fluoride plate, the setting of wave transparent wind deflector 63, under the premise of not influencing microwave and passing through, can inner cavity to air inducing pipeline section 61 into
Row blocks, it is ensured that cooling air-flow will not flow to the core components such as three pin tuners 13, circulator 12, microwave generator 11.?
In other embodiments, the material of wave transparent wind deflector can also be the quartz or sapphire of high microwave penetration rate.
The specific structure of wave transparent wind deflector 63 and its arrangement in air inducing pipeline section 61 are as shown in fig. 7, wave transparent is kept out the wind
Plate 63 is the plate structure of cross section parallelogram, and wave transparent wind deflector peace is provided on the side of four, upper and lower, left and right
Hole is filled, it is corresponding, spiral shell corresponding with wave transparent wind deflector mounting hole is offered on the upper and lower, left and right waveguide plate of air inducing pipeline section 61
Bolt through hole 6111, bolt through hole 6111 are counter bore structure, can be kept off wave transparent by screwing bolt in wind deflector mounting hole
Aerofoil 63 is fixed on intracavitary in air inducing pipeline section 61.In order to enable the structure of entire waveguide assemblies 6 is more compact, left and right waveguide plate
On bolt through hole 6111 be provided with cooling liquid bath U-shaped structure middle part, the central space of U-shaped cooling liquid bath is utilized
Get up.
Wave transparent wind deflector 63 has corresponding with microwave transmission direction in the tilted arrangement of air inducing pipeline section 61, air inducing pipeline section 61
Length extending direction, wave transparent wind deflector 63 be in tilted layout, wave transparent wind deflector 63 on the length extending direction of air inducing pipeline section 61 with
The air-inducing passage is corresponding, and wave transparent wind deflector 63 tilts 40 ° to 45 ° arrangements, and the wave transparent wind deflector 63 using inclination arrangement is to blowing
The cooling air-flow entered in 7 inner cavity of air inducing pipeline section guides.For the tilt angle of wave transparent wind deflector, in other embodiments,
According to actual condition, 40 ° are also less than, 45 ° can also be greater than, it is, of course, also possible to by wave transparent wind deflector in air inducing pipeline section
It is vertically arranged.
At work, blower 62 is formed microwave plasma CVD device in the present invention at air-inducing passage
Extraneous cold air is sent into 61 inner cavity of air inducing pipeline section by positive pressure, and cooling air-flow, cooling air are formed in the inner cavity of air inducing pipeline section 61
Stream flows in the way of vent passages, can be by cores such as mode converter 2, resonant cavity 3 and the reaction chambers 7 in resonant cavity 3
Component cools down to core component, it is ensured that microwave plasma CVD device is not in core at work
The excessively high phenomenon of part temperatures, so that it is guaranteed that microwave plasma CVD device has stable working performance.
Further, in order to avoid event occurs to microwave plasma CVD device in blower 62 in the process of running
Hinder and cause each components temperature excessively high, blast switch is set in air inducing pipeline section 61, for detecting microwave plasma chemical
The vapor phase growing apparatus wind pressure in air inducing pipeline section 61 in the process of running, it is accordingly, micro- to judge whether blower 62 breaks down
Wave plasma CVD device further includes controller, and controller can receive the signal of blast switch sending, and root
It is believed that the start and stop of number control microwave generator 11.
Specifically, the corresponding upper wall surface of air inducing pipeline section opens up blast switch fixation hole, by blast switch fixation hole
Screw is installed to fix blast switch.Controller uses PLC controller.If blower 62 is because failure stops working, air inducing pipeline section
Wind pressure in 61 is lower than the setting value of blast switch, and blast switch can issue signal to PLC controller, and PLC controller is according to wind
The signal control microwave generator 11 for compressing switch issued stops working, so that microwave plasma CVD be avoided to fill
Set in the process of running that the part temperatures such as mode converter, resonant cavity, quartz bell cover occur excessively high because blower 62 stops working
The phenomenon that, guarantee the stability and safety of equipment operation.
It, can not be in the upper of air inducing pipeline section in order to guarantee the leakproofness of air inducing pipeline section for the set-up mode of blast switch
Blast switch fixation hole is opened up on wall surface, but setting is used to place the mounting groove of blast switch on the inner wall of air inducing pipeline section.
Controller can also be singlechip controller.Certainly, it is if can directly judge the working condition of blower by external observation
It is no it is normal if, blast switch and corresponding control system can be not provided with.
The embodiment 2 of microwave plasma CVD device, the difference of the present embodiment and embodiment 1 in the present invention
Place is only that the blower in embodiment 1 is formed just pressing at air-inducing passage and be blown in induced duct section inner cavity, and the present embodiment
In blower negative pressure air draught from air inducing pipeline section inner cavity is formed at air-inducing passage, to form negative pressure in a device, so that extraneous
Air can enter in resonant cavity from vent passages, the components such as the reacted room of cocurrent, mode converter and waveguide assemblies, and from
It is discharged in air-inducing passage.
The embodiment 3 of microwave plasma CVD device, the difference of the present embodiment and embodiment 1 in the present invention
Place is only that the air-inducing passage in embodiment 1 is made of the air inducing hole that the array being provided on air inducing pipeline section upper side wall is arranged,
In the present embodiment, gauze screen is arranged to prevent microwave in pipeline for branch line is arranged on the side wall of air inducing pipeline section in air-inducing passage
Leakage, blower are docked with branch line.
The embodiment of waveguide assemblies in the present invention: the present invention involved in waveguide assemblies include air inducing pipeline section, blower and thoroughly
Wave wind deflector, wherein air inducing pipeline section is arranged between microwave generator and mode converter with conducts microwaves, and extension set setting is being drawn
In air hose section, blower can form air-flow in air inducing pipeline section at work, thus to microwave for using the waveguide assemblies etc. from
Core in daughter chemical vapor deposition unit, which is not added, to be cooled down, about the waveguide assemblies specific structure and working method with
The structure of waveguide assemblies in above-mentioned microwave plasma CVD device is identical, is no longer repeated herein.
The embodiment 4 of microwave plasma CVD device in the present invention, it is with embodiment 1 the difference is that real
It applies in example 1, is arranged between mode converter 2 and microwave generator 11 with wherein one section of the connection waveguiding structure of conducts microwaves
For waveguide assemblies 6, waveguide assemblies 6 can will be in cool ambient air introducing device.
Microwave plasma CVD device and embodiment 1 the difference is that only in the present embodiment, such as Fig. 8
It is shown, it is disposed with the connection waveguiding structure 9 of conducts microwaves between mode converter 2 and microwave generator 11, is connected to waveguide junction
Structure 9 includes that the air inducing pipeline section 91 in cool ambient air introducing device can be provided with air-inducing passage, air inducing on air inducing pipeline section 91
Road is connected to by the air inducing pipeline section 91, mode converter 2, resonant cavity 3 with vent passages.Pass through air-inducing passage and vent passages
The disengaging for locating air-flow, will flow through the portions such as mode converter 2, reaction chamber 7 in cool ambient air introducing device to be formed in the device
The cooling air-flow of part, cools down to device.
Specifically, docking blower 63 on air-inducing passage, when blower 63 works, positive pressure is formed at air-inducing passage will be extraneous cold
Air is sent into air inducing pipeline section 91, and intracavitary formation cooling air-flow, cooling air-flow flow through mode converter in air inducing pipeline section 91
2, the vent passages opened up from outer chamber after the components such as reaction chamber 7 flow out to the external world.
Wherein, the specific structure of air inducing pipeline section 91 is as shown in figure 9, air inducing pipeline section 91 includes intermediate rectangular waveguide,
Rear and front end is fixed with flange end plate, and flange end plate is weldingly fixed on rectangular waveguide, flange end plate be equipped with circumferentially according to
The flange mounting hole of secondary arrangement, for air inducing pipeline section 91 to be serially connected in connection waveguiding structure 9.In the present embodiment, air inducing pipeline section
91 upper wall surface 2611 and the width of lower wall surface are greater than the width in left wall face and right wall.Air-inducing passage is arranged in air inducing pipeline section 91
Upper wall surface 2611 on.
In other embodiments, for the setting position of air-inducing passage, air-inducing passage can also be arranged in air inducing pipeline section
Other side walls on.For the structure of air inducing pipeline section, four structures, e.g., air inducing pipeline section can be greater than for section seamed edge quantity
Cross section be hexagon, octagon etc., air inducing pipeline section can also be set to pipe of the cross section seamed edge less than four and e.g. drawn
The cross section of air hose section is triangle.Certainly, air inducing pipeline section may be round tube.The rear and front end of air inducing pipeline section can not also be set
Air inducing pipeline section mounting flange is set, at this point, inserting connection between air inducing pipeline section and corresponding component.
For the specific structure of air-inducing passage, air-inducing passage is arranged by the array being provided on upper wall surface 2611 in the present embodiment
The air inducing hole 2612 of cloth is constituted, and the aperture in air inducing hole 2612, which meets microwave, to be leaked from air inducing hole 2612.In order to facilitate wind
The installation of machine 62 is provided with blower flange 2613 at air-inducing passage, when installing blower 62, directly by 62 abutting joint of blower in wind
On machine flange 2613.
Enter in order to prevent the dust particles that are mingled in the outside air in air inducing pipeline section enter three pin tuners 13,
In the core components such as circulator 12, microwave generator 11, connection waveguiding structure 9 further includes seperated with air inducing pipeline section 91 being serially connected in one
The side towards microwave generator 11 of air inducing pipeline section 91 is arranged in the distance piece 92 risen, distance piece 92.
Specifically, as shown in Figure 10, distance piece 92 includes outward flange frame 621 and is inlaid in outward flange frame 621
Wave transparent wind deflector 622, wave transparent wind deflector 622 are the polyfluortetraethylene plate of high microwave penetration rate, it is ensured that microwave can pass through isolation
Section 92.The structure snd size of outward flange frame 621 and the structure snd size of the flange end plate of air inducing tube section ends match.In order to
Realize that distance piece 92 is installed on microwave plasma CVD device, outward flange frame 621 was equipped with along week
To the mounting hole being sequentially arranged, distance piece 92 is serially connected in connection waveguiding structure 9.The setting of distance piece 92 is not influencing
Under the premise of microwave passes through, the closure of one end towards microwave generator 11 to connection waveguiding structure 9 is realized, it is ensured that air inducing
Cooling air-flow in pipeline section 91 will not flow to the core components such as three pin tuners 13, circulator 12, microwave generator 11.For
The material of wave transparent wind deflector can also select quartz or sapphire in other embodiments.
In the present embodiment, the structure for installing blast switch is blast switch fixation hole 2614, blast switch fixation hole
2614 are provided on the upper wall surface 2611 of air inducing pipeline section.It, can also be using institute in embodiment 1 for the set-up mode of blast switch
Other mounting means stated, similarly, if can directly judge whether the working condition of blower is normal by external observation
Words, can be not provided with blast switch and corresponding control system.
At work, blower 62 is formed microwave plasma CVD device in the present invention at air-inducing passage
Positive pressure will be intracavitary in extraneous cold air feeding air inducing pipeline section 91, and cooling air-flow is formed in the inner cavity of air inducing pipeline section 91, cooling
It, can be by cores such as mode converter 2, resonant cavity 3 and the reaction chambers 7 in resonant cavity 3 in the way of air flow direction vent passages
Center portion part, cools down to core component, it is ensured that microwave plasma CVD device is not in core at work
The excessively high phenomenon of heart part temperatures, so that it is guaranteed that microwave plasma CVD device has stable working performance.
The embodiment 5 of microwave plasma CVD device, the difference of the present embodiment and embodiment 4 in the present invention
Place is only that the blower in embodiment 4 is formed just pressing at air-inducing passage and be blown in induced duct section inner cavity, and the present embodiment
In blower negative pressure air draught from air inducing pipeline section inner cavity is formed at air-inducing passage, to form negative pressure in a device, so that extraneous
Air can enter in resonant cavity from vent passages, the components such as the reacted room of cocurrent, mode converter and waveguide assemblies, and from
It is discharged in air-inducing passage.
The embodiment 6 of microwave plasma CVD device, the difference of the present embodiment and embodiment 4 in the present invention
Place is only that the air-inducing passage in embodiment 4 is made of the air inducing hole that the array being provided on air inducing pipeline section side wall is arranged, this
In embodiment, gauze screen is arranged to prevent microwave from letting out in pipeline for branch line is arranged on the side wall of waveguide body in air-inducing passage
Leakage, blower are docked with branch line.
Claims (10)
1. a kind of waveguide assemblies, characterized in that including air inducing pipeline section, blower and wave transparent wind deflector,
The air inducing pipeline section is arranged between microwave generator and mode converter with conducts microwaves,
It is provided with air-inducing passage on the air inducing pipeline section side wall, for air inducing pipeline section inner cavity to be connected to the external world,
Further include blower, docked with air-inducing passage, for blowing at air-inducing passage into air inducing pipeline section inner cavity, or from air inducing
Air draught in pipeline section inner cavity, to form cooling air-flow in air inducing pipeline section inner cavity,
Wave transparent wind deflector is installed in air inducing pipeline section, for stopping air flow direction microwave generator.
2. waveguide assemblies according to claim 1, characterized in that air inducing pipeline section has length corresponding with microwave transmission direction
Spend extending direction, wave transparent wind deflector be in tilted layout, wave transparent wind deflector on the length extending direction of air inducing pipeline section with the air inducing
Channel is corresponding.
3. waveguide assemblies according to claim 1, characterized in that air-inducing passage is the air inducing hole being arranged in array, air inducing
The blower flange for installing the blower is provided at hole.
4. a kind of microwave plasma CVD device including microwave generator, mode converter, forms resonant cavity
Outer chamber and reaction chamber,
Further include connection waveguiding structure, be arranged between microwave generator and mode converter with conducts microwaves,
Outer chamber and mode converter docking,
Reaction chamber is located in outer chamber, characterized in that
Connection waveguiding structure includes the waveguide assemblies in claim 1-3 any one,
Vent passages are provided on the outer chamber, for resonant cavity to be connected to the external world, vent passages pass through described humorous
Vibration chamber, mode converter, connection waveguiding structure are connected to the air-inducing passage in the waveguide assemblies,
When blower is blown at air-inducing passage into air inducing pipeline section inner cavity, vent passages are used for outlet air, in air-inducing passage and
Cooling air-flow is formed between vent passages,
Alternatively, vent passages are for entering the wind, when blower air draught from air inducing pipeline section inner cavity at air-inducing passage with logical in air inducing
Cooling air-flow is formed between road and vent passages.
5. microwave plasma CVD device according to claim 4, characterized in that outer chamber includes outer cover
Body and support plate, vent passages are arranged on the supporting plate.
6. a kind of microwave plasma CVD device, comprising:
Microwave generator, mode converter, the outer chamber and reaction chamber for forming resonant cavity,
It further include the connection waveguiding structure being arranged between mode converter and microwave generator with conducts microwaves,
Outer chamber is docked with mode converter,
Reaction chamber is located in outer chamber,
It is characterized in that
Connection waveguiding structure includes the air inducing pipeline section and distance piece of successively seperated concatenation, distance piece be located at air inducing pipeline section towards micro-
The side of wave producer,
The air inducing pipeline section is equipped with the air-inducing passage for air inducing pipeline section inner cavity to be in communication with the outside, and the distance piece has saturating
Wave wind deflector,
The outer chamber is equipped with vent passages, and for resonant cavity to be in communication with the outside, the vent passages pass through the resonance
Chamber, mode converter are connected to the air-inducing passage,
Microwave plasma CVD device further includes blower, and blower is docked with air-inducing passage, in air-inducing passage
Place blows into air inducing pipeline section inner cavity, or the air draught from air inducing pipeline section inner cavity,
When blower is blown at air-inducing passage into air inducing pipeline section inner cavity, vent passages are used for outlet air, in air-inducing passage and
Cooling air-flow is formed between vent passages,
Alternatively, vent passages are for entering the wind, when blower air draught from air inducing pipeline section inner cavity at air-inducing passage with logical in air inducing
Cooling air-flow is formed between road and vent passages.
7. microwave plasma CVD device according to claim 6, characterized in that the outer chamber includes
Outer outlet body and support plate, vent passages are arranged on the supporting plate.
8. microwave plasma CVD device according to claim 7, characterized in that outer outlet body bottom and anti-
Room bottom is answered to form annular space, region of the support plate between interior cover and outer outlet body is the annular region around reaction chamber,
Air-inducing passage is formed by the multiple ventilation holes being arranged in the annular region of support plate.
9. microwave plasma CVD device according to claim 6, characterized in that the reaction chamber is by propping up
Fagging and the interior cover being sealingly fitted in support plate surround, and liner plate is arranged in the inside towards interior cover of support plate.
10. according to microwave plasma CVD device described in claim 6-9 any one, characterized in that institute
Stating distance piece includes outward flange frame, and wave transparent wind deflector is mounted in outward flange frame, outward flange frame be equipped with circumferentially according to
Distance piece is serially connected in connection waveguiding structure by the mounting hole of secondary arrangement.
Priority Applications (1)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112410751A (en) * | 2020-10-30 | 2021-02-26 | 杭州电子科技大学 | Oval microwave plasma diamond film deposition device |
| CN114759333A (en) * | 2022-06-14 | 2022-07-15 | 成都纽曼和瑞微波技术有限公司 | Microwave transmission device and microwave plasma equipment |
| CN118086860A (en) * | 2024-04-29 | 2024-05-28 | 成都晨发泰达航空科技股份有限公司 | Device and method for chemical vapor deposition aluminum coating of rotor blade |
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| JP2008066159A (en) * | 2006-09-08 | 2008-03-21 | Noritsu Koki Co Ltd | Plasma generator and workpiece treatment device using it |
| CN208590129U (en) * | 2018-06-22 | 2019-03-08 | 昆山九华电子设备厂 | A kind of microwave feedback mouth device for high temperature cavity |
| CN211005615U (en) * | 2019-06-28 | 2020-07-14 | 郑州磨料磨具磨削研究所有限公司 | Waveguide assembly and microwave plasma chemical vapor deposition device |
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| JP2008066159A (en) * | 2006-09-08 | 2008-03-21 | Noritsu Koki Co Ltd | Plasma generator and workpiece treatment device using it |
| CN208590129U (en) * | 2018-06-22 | 2019-03-08 | 昆山九华电子设备厂 | A kind of microwave feedback mouth device for high temperature cavity |
| CN211005615U (en) * | 2019-06-28 | 2020-07-14 | 郑州磨料磨具磨削研究所有限公司 | Waveguide assembly and microwave plasma chemical vapor deposition device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112410751A (en) * | 2020-10-30 | 2021-02-26 | 杭州电子科技大学 | Oval microwave plasma diamond film deposition device |
| CN114759333A (en) * | 2022-06-14 | 2022-07-15 | 成都纽曼和瑞微波技术有限公司 | Microwave transmission device and microwave plasma equipment |
| CN118086860A (en) * | 2024-04-29 | 2024-05-28 | 成都晨发泰达航空科技股份有限公司 | Device and method for chemical vapor deposition aluminum coating of rotor blade |
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