CN110283427A - A kind of halogen-free epoxy resin prepreg and preparation method thereof - Google Patents
A kind of halogen-free epoxy resin prepreg and preparation method thereof Download PDFInfo
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- CN110283427A CN110283427A CN201910626476.9A CN201910626476A CN110283427A CN 110283427 A CN110283427 A CN 110283427A CN 201910626476 A CN201910626476 A CN 201910626476A CN 110283427 A CN110283427 A CN 110283427A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a kind of halogen-free epoxy resin prepregs, component including following parts by weight: 10-25 parts of macromolecular epoxy resin, 6-18 parts of high Tg epoxy resin, 5-15 parts of phosphorous epoxy resin, 3-8 parts of anti-UV organic matter, 10-25 parts of phenolic resin, 10-25 parts of flexible resin, 1-5 parts of curing agent, 0.03-0.1 parts of catalyst, 2-10 parts of additive flame retardant, 0-40 parts and solvent 20-50 parts of filler is the beneficial effects of the present invention are: halogen-free epoxy resin prepreg of the present invention has halogen-free flameproof FV0 level characteristics, high bonding is not lost while with extremely low mobility, infiltration filling and high Tg and high-fire resistance, the Rigid Flex made using halogen-free epoxy resin prepreg of the present invention, just have around board or multi-layer PCB board Have a preferable dimensional stability, filling adhesive property is good fall off, deform without layering plate bursting, copper wire caused by the white silk of white point and dried flower after copper wire displacement it is short-circuit the problems such as, raising product qualification rate and reliability.
Description
Technical field
The present invention relates to and printed circuit board technology more particularly to a kind of halogen-free epoxy resin prepreg and its preparation side
Method.
Background technique
Anti-flammability is important one of the security performance of electronic product.Halogen fire proofing (containing Cl, Br) is with its economy
It with reliability, has been applied in printed circuit substrate industry for many years, however, increasingly high with global environmental protection cry
Rise, the carrying capacity of environment of halogen fire proofing and the influence to human health just attract attention closely.There are many groups of country
It knits and detects dioxin (Dioxin), dibenzofurans in the combustion product of halogen product in succession with mechanism
(Dibenzofuran) carcinogens such as.Smoke amount is very big in combustion for halogen product, can release extremely toxic substance halogenation
Hydrogen seriously threatens human health.Therefore halogen-free type material is researched and developed and applied, environment-friendly type printed circuit substrate is produced, it has also become is close
The new trend that copper-clad plate technology develops over year.
With the development of science and technology with the raising of people's life requirement, " thin, light, short, small ", more function are proposed to electronic product
Energyization and personalized direction are developed, and need that the number of plies of PCB is more thinner, structure is more diversified, such as dress electronics, can roll over
Folded electronics, Rigid Flex, just embedded part, thick copper filling perforation etc. inside board, PCB.The traditional prepreg made now,
It is fire-retardant to guarantee anti-flammability mainly by bromo-containing substance is used, and mobility is big, can not guarantee the dimensional stability of product, and
Filling, caking property, resin system also can not meet the heat resistance that repeatedly pressing is required.After the pressing of traditional prepreg
Usually there are the fillings such as substrate white point, Bai Si and dried flower and contain empty quality problems, machining property is also poor, to easily divide
After layer plate bursting, copper wire fall off, deform the problems such as copper wire displacement short circuit.
Summary of the invention
The present invention, using halogen-containing flame retardant and the problem of product size stability difference, provides one for existing prepreg
Kind halogen-free epoxy resin prepreg and preparation method thereof.
The technical scheme to solve the above technical problems is that a kind of halogen-free epoxy resin prepreg, feature
It is, according to parts by weight, including following component: 10-25 parts of macromolecular epoxy resin, 6-18 parts of high Tg epoxy resin, phosphorous
5-15 parts of epoxy resin, 10-25 parts of phenolic resin, 10-25 parts of flexible resin, 1-5 parts of curing agent, is urged at 3-8 parts of anti-UV organic matter
0.03-0.1 parts of agent, 2-10 parts of additive flame retardant, 0-40 parts of filler and 20-50 parts of solvent.
Further, the weight average molecular weight of the macromolecular epoxy resin is 5000-10000, epoxide equivalent 400-700g/
Mol is bisphenol A-type, bisphenol-f type, polyphenol type diglycidyl ether type, aliphatic glycidyl ether type, glycidyl ester type, shrink
One of glycerol amine type or epoxidation of olefins compound；The epoxide equivalent of the high Tg epoxy resin is 180-300g/mol,
For bisphenol A-type epoxy novolac, bisphenol-f type epoxy novolac, isocyanate-modified epoxy, dicyclic pentylene modified epoxy or naphthol type
One of epoxy resin；The phosphorous epoxy resin phosphorus content is 1.8-3.5wt%, epoxide equivalent 180-500g/
Mol is one of DOPO, DOPO-HQ or DOPO-NQ.
Further, the anti-UV organic matter is tetrafunctional epoxy or anti-UV powder, the tetrafunctional epoxy epoxide equivalent
For 180-300g/mol, have a structure that
Described or anti-UV powder is 1,6- hexamethylene diamine, N, N '-bis- (2,2,6,6- tetramethyl -4- piperidyls), 2,4,6-
Three chloro- 1,3,5- triazines, N- butyl -1- butylamine, N- butyl -2,2,6,6- tetramethyl -4- piperidinamine, 2- (2'- hydroxyl -3',
5'- di-tert-butyl-phenyl) -5- chlorinated benzotriazole, 2- (2'- hydroxyl -3'- tert-butyl -5'- aminomethyl phenyl) -5- chloro benzo
Triazole, ESCALOL 567,2- (2'- hydroxyl -5'- aminomethyl phenyl) benzotriazole or the just pungent oxygen of 2- hydroxyl -4-
One of base benzophenone.
Further, the softening point of the phenolic resin is 65-125 DEG C, hydroxyl equivalent 100-125g/mol, is linear benzene
In phenol phenolic resin, bisphenol A type phenolic resin, bisphenol F type phenolic resin, benzoxazine class phenolic resin phosphorus containing phenolic resin living
One kind；The flexible resin weight average molecular weight is 30000-70000, is isocyanate-modified epoxy, phenoxy resin, organosilicon
One of resin, polybutadiene or polyphenyl ether modified epoxy.
Further, the curing agent is one of dicyandiamide, two amido diphenyl sulphone (DPS)s or two amido diphenyl-methanes；Catalyst
For one of 2 methylimidazoles, 4 methyl, 2 ethyl imidazol(e), hendecane imidazoles, 2 phenylimidazoles or boric acid；The additive flame retardant
Agent is hexaphenoxycyclotriphosphazene, 1,3- phenylene phosphoric acid four (2,6- dimethyl benzene base ester), melamine cyanurate, polyphosphoric acid
In melamine triphenyl phosphate, tricresyl phosphate, tricresyl phosphate (dimethylbenzene) ester, propyl benzene system phosphate or butylbenzene system phosphate
One kind；The granularity of the filler is 0.1-5 μm, is boehmite, a water-aluminum hydroxide, two water-aluminum hydroxides, barium sulfate, sulfuric acid
One of calcium, aluminium oxide, zirconium oxide or melting silicon powder.
Further, the solvent is methanol, ethyl alcohol, acetone, cyclohexanone, butanone, propylene glycol monomethyl ether, ethylene glycol list first
One of ether, dimethylformamide or ethyl acetate.
The invention further relates to the preparation methods of above-mentioned halogen-free epoxy resin prepreg, comprising the following steps:
1) prepare substrate: 0.14 mm of thickness glass-fiber-fabric below is cut into required size；
2) it prepares glue: weighing each component by weight, after ball milling mixing 30-60min, be coated on glass-fiber-fabric, control
Gel content is 40-95wt%；
3) curing molding: 3-4min is toasted at 170 DEG C and obtains halogen-free epoxy resin prepreg, to gained Halogen asphalt mixtures modified by epoxy resin
Rouge prepreg under IPC-4101 standard detection should meet: bubble is not in fluidity 0.05-0.3mm, 10cm*10cm area
More than 5.
The beneficial effects of the present invention are: halogen-free epoxy resin prepreg of the present invention has halogen-free flameproof FV0 level characteristics, tool
Have and do not lose high bonding, infiltration filling and high Tg and high-fire resistance while extremely low mobility, uses Halogen asphalt mixtures modified by epoxy resin of the present invention
The Rigid Flex of rouge prepreg production just around board or multi-layer PCB board has all had preferable dimensional stability, and filling is viscous
Knot performance is good fall off, deform without layering plate bursting, copper wire caused by the white silk of white point and dried flower after copper wire shift short circuit etc.
Problem improves product qualification rate and reliability.
Specific embodiment
Below in conjunction with example, present invention is described, and the given examples are served only to explain the present invention, is not intended to limit this
The range of invention.
A kind of halogen-free epoxy resin prepreg, according to parts by weight, including following component:
Embodiment 1
A kind of halogen-free epoxy resin prepreg, according to parts by weight, including following component: bisphenol f type epoxy resin 10
Part, 18 parts of bisphenol A-type novolac epoxy resin, 5 parts of DOPO, 3 parts of tetrafunctional epoxy, 10 parts of bisphenol A type phenolic resin, phenoxy
25 parts of rouge, 5 parts of dicyandiamide, 0.03 part of 2 methylimidazole, 2 parts of hexaphenoxycyclotriphosphazene, 50 parts of ethyl alcohol.
Wherein, the weight average molecular weight of the bisphenol f type epoxy resin is 5000, epoxide equivalent 700g/mol；It is described double
Phenol A type novolac epoxy resin epoxide equivalent is 180g/mol；The DOPO phosphorus content is 1.8wt%, epoxide equivalent 180g/
mol；The tetrafunctional epoxy epoxide equivalent is 180g/mol, is had a structure that
The bisphenol A type phenolic resin hydroxyl equivalent is 125g/mol；The phenoxy resin weight average molecular weight is 30000.
Embodiment 2
A kind of halogen-free epoxy resin prepreg, according to parts by weight, including following component: bisphenol A type epoxy resin 17
Part, 15 parts of bisphenol F type phenolic resin, has 12 parts of bisphenol-f type novolac epoxy resin, 10 parts of DOPO-HQ, 5 parts of 1,6- hexamethylene diamine
15 parts of machine silicone resin, 3 parts of two amido diphenyl sulphone (DPS), 0.06 part of 4 methyl, 2 ethyl imidazol(e), 6 parts of melamine cyanurate, 0.1 μm of oxidation
40 parts of aluminium, 35 parts of glycol monoethyl ether.
Wherein, the weight average molecular weight of the bisphenol A type epoxy resin is 7000, epoxide equivalent 500g/mol；It is described double
Phenol F type novolac epoxy resin epoxide equivalent is 250g/mol；The DOPO-HQ phosphorus content is 2.6wt%, and epoxide equivalent is
350g/mol；The bisphenol F type phenolic resin hydroxyl equivalent is 110g/mol；The organic siliconresin weight average molecular weight is
50000。
Embodiment 3
A kind of halogen-free epoxy resin prepreg, according to parts by weight, including following component: glycidyl ester type epoxy tree
25 parts of rouge, 6 parts of isocyanate modified epoxy resin, 15 parts of DOPO-NQ, 2- (2'- hydroxyl -3'- tert-butyl -5'- methylbenzene
Base) 8 parts of -5- chlorinated benzotriazole, 25 parts of linear phenol novolacs, 10 parts of polybutadiene, 1 part of two amido diphenyl-methane, ten
One 0.1 part of alkane imidazoles, 10 parts, 05 μm 20 parts of boehmite of tricresyl phosphate, 20 parts of dimethylformamide.
Wherein, it is 400g/mol that the weight average molecular weight of the glycidyl ester type epoxy resin, which is 10000 epoxide equivalents,；Institute
Stating isocyanate modified epoxy resin epoxide equivalent is 300g/mol；The DOPO-NQ phosphorus content is 3.5wt%, epoxide equivalent
For 500g/mol；The linear phenol novolacs hydroxyl equivalent is 100g/mol；The polybutadiene weight average molecular weight is
70000。
Embodiment 4
A kind of halogen-free epoxy resin prepreg, according to parts by weight, including following component: bisphenol f type epoxy resin 10
Part, 6 parts of dicyclic pentylene modified epoxy, 3 parts of tetrafunctional epoxy, 5 parts of the phosphorous epoxy of HQ-DOPO, 10 parts of phosphorus-containing phenolic aldehyde, phenoxy
10 parts of rouge, 1 part of diaminodiphenylsulfone, 0.03 part of hendecane imidazoles, cyclohexanone: 20 parts, 2 parts of hexaphenoxycyclotriphosphazene.
Embodiment 5
A kind of halogen-free epoxy resin prepreg, according to parts by weight, including following component: bisphenol f type epoxy resin 25
Part, 18 parts of dicyclic pentylene modified epoxy, 8 parts of tetrafunctional epoxy, 15 parts of the phosphorous epoxy of HQ-DOPO, 25 parts of phosphorus-containing phenolic aldehyde, benzene oxygen
25 parts of resin, 5 parts of diaminodiphenylsulfone, 0.1 part of hendecane imidazoles, 50 parts of cyclohexanone, 10 parts of hexaphenoxycyclotriphosphazene, two water
40 parts of aluminium hydroxide.
Embodiment 1-5 halogen-free epoxy resin prepreg the preparation method comprises the following steps:
1) prepare substrate: 0.14 mm of thickness glass-fiber-fabric below is cut into required size；
2) it prepares glue: weighing each component by weight, after ball milling mixing 30-60min, be coated on glass-fiber-fabric, control
Gel content is 40-95wt%；
3) curing molding: 3-4min is toasted at 170 DEG C and obtains halogen-free epoxy resin prepreg, to gained Halogen asphalt mixtures modified by epoxy resin
Rouge prepreg under IPC-4101 standard detection should meet: bubble is not in fluidity 0.05-0.3mm, 10cm*10cm area
More than 5.
Comparative example
A kind of prepreg, according to parts by weight, including following component: 100 parts of bisphenol A type bromide epoxy, phenol novolac
20 parts, 2 parts of tetrafunctional epoxy, 1 part of dicyandiamide, 0.067 part of 2 methylimidazole, 50 parts of acetone, 30 parts of silicon powder.
Preparation method are as follows: weigh each component by above-mentioned formula, stirred 30 minutes after mixing, with the 2116 of thickness 0.1mm
Cloth impregnation, at 170 DEG C dry sample 3min to get.
It is as shown in Table 1 and Table 2 that embodiment 1-5 and comparative example prepreg finished product are subjected to performance comparison.Data in middle table
Comparison as can be seen that embodiment 1-5 halogen-free epoxy resin prepreg compared with comparative example conventional solidified, embodiment 1-5 without
Halogen epoxy resin prepreg flow adhesive is low, and glass transition temperature is high, is practically free of halogen, fire-retardant, heat-resist, appearance uniform without
Dust；Caking property is good after Multi-layer force fit, no white silk of white point, good stability of the dimension.
1. single-interval test result of table
2. multi-layer testing result of table
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (7)
1. a kind of halogen-free epoxy resin prepreg, which is characterized in that according to parts by weight, including following component: macromolecular ring
10-25 parts of oxygen resin, 6-18 parts of high Tg epoxy resin, 5-15 parts of phosphorous epoxy resin, 3-8 parts of anti-UV organic matter, phenolic resin
10-25 parts, 10-25 parts of flexible resin, 1-5 parts of curing agent, 0.03-0.1 parts of catalyst, 2-10 parts of additive flame retardant, filler
0-40 parts and solvent 20-50 parts.
2. halogen-free epoxy resin prepreg according to claim 1, which is characterized in that the macromolecular epoxy resin
Weight average molecular weight is 5000-10000, epoxide equivalent 400-700g/mol, is shunk for bisphenol A-type, bisphenol-f type, polyphenol type sweet
One in oily ether type, aliphatic glycidyl ether type, glycidyl ester type, glycidic amine type or epoxidation of olefins compound
Kind；The epoxide equivalent of the high Tg epoxy resin is 180-300g/mol, is bisphenol A-type epoxy novolac, bisphenol-f type phenolic aldehyde ring
One of oxygen, isocyanate-modified epoxy, dicyclic pentylene modified epoxy or naphthol type epoxy resin；The phosphorous asphalt mixtures modified by epoxy resin
Rouge phosphorus content is 1.8-3.5wt%, epoxide equivalent 180-500g/mol, is one in DOPO, DOPO-HQ or DOPO-NQ
Kind.
3. halogen-free epoxy resin prepreg according to claim 1, which is characterized in that the anti-UV organic matter is four officials
Energy epoxy or anti-UV powder, the tetrafunctional epoxy epoxide equivalent are 180-300g/mol, are had a structure that
Described or anti-UV powder is 1,6- hexamethylene diamine, N, N '-bis- (2,2,6,6- tetramethyl -4- piperidyls), 2,4,6- tri-
Chloro- 1,3,5- triazine, N- butyl -1- butylamine, N- butyl -2,2,6,6- tetramethyl -4- piperidinamine, 2- (2'- hydroxyl -3', 5'-
Di-tert-butyl-phenyl) -5- chlorinated benzotriazole, 2- (2'- hydroxyl -3'- tert-butyl -5'- aminomethyl phenyl) -5- chloro benzo three
Azoles, ESCALOL 567,2- (2'- hydroxyl -5'- aminomethyl phenyl) benzotriazole or 2- hydroxyl -4- n-octyloxy
One of benzophenone.
4. halogen-free epoxy resin prepreg according to claim 1, which is characterized in that the softening point of the phenolic resin
It is 65-125 DEG C, hydroxyl equivalent 100-125g/mol is linear phenol novolacs, bisphenol A type phenolic resin, bisphenol-f type
One of phenolic resin, benzoxazine class phenolic resin phosphorus containing phenolic resin living；The flexible resin weight average molecular weight is
30000-70000 is in isocyanate-modified epoxy, phenoxy resin, organic siliconresin, polybutadiene or polyphenyl ether modified epoxy
One kind.
5. halogen-free epoxy resin prepreg according to claim 1, which is characterized in that the curing agent be dicyandiamide,
One of two amido diphenyl sulphone (DPS)s or two amido diphenyl-methanes；Catalyst is 2 methylimidazoles, 4 methyl, 2 ethyl imidazol(e), hendecane
One of imidazoles, 2 phenylimidazoles or boric acid；The additive flame retardant is hexaphenoxycyclotriphosphazene, 1,3- phenylene phosphorus
Sour four (2,6- dimethyl benzene base esters), melamine cyanurate, polyphosphoric acid melamine triphenyl phosphate, tricresyl phosphate,
One of tricresyl phosphate (dimethylbenzene) ester, propyl benzene system phosphate or butylbenzene system phosphate；The granularity of the filler is 0.1-5 μm,
For in boehmite, a water-aluminum hydroxide, two water-aluminum hydroxides, barium sulfate, calcium sulfate, aluminium oxide, zirconium oxide or melting silicon powder
One kind.
6. halogen-free epoxy resin prepreg according to claim 1, which is characterized in that the solvent be methanol, ethyl alcohol,
One of acetone, cyclohexanone, butanone, propylene glycol monomethyl ether, glycol monoethyl ether, dimethylformamide or ethyl acetate.
7. a kind of preparation method of halogen-free epoxy resin prepreg as claimed in any one of claims 1 to 6, which is characterized in that
The following steps are included:
1) prepare substrate: 0.14 mm of thickness glass-fiber-fabric below is cut into required size；
2) it prepares glue: weighing each component by weight, after ball milling mixing 30-60min, be coated on glass-fiber-fabric, control contains glue
Amount is 40-95wt%；
3) curing molding: toasting 3-4min at 170 DEG C and obtain halogen-free epoxy resin prepreg, to gained halogen-free epoxy resin half
Cured sheets under IPC-4101 standard detection should meet: bubble is no more than in fluidity 0.05-0.3mm, 10cm*10cm area
5.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112250995A (en) * | 2020-10-16 | 2021-01-22 | 江苏联鑫电子工业有限公司 | Halogen-free high-flexibility semi-shading insulating plate and preparation method thereof |
| CN113388312A (en) * | 2021-06-18 | 2021-09-14 | 中国船舶重工集团公司第七二五研究所 | High-performance ceramic-based epoxy modified organic silicon coating and preparation and application methods thereof |
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| US4929494A (en) * | 1986-03-05 | 1990-05-29 | Showa Denko Kabushiki Kaisha | Fibrous substrates impregnated with a curable composition |
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| CN107286583A (en) * | 2017-06-20 | 2017-10-24 | 苏州生益科技有限公司 | A kind of resin combination and the low flow prepreg made using it |
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| CN112250995A (en) * | 2020-10-16 | 2021-01-22 | 江苏联鑫电子工业有限公司 | Halogen-free high-flexibility semi-shading insulating plate and preparation method thereof |
| CN113388312A (en) * | 2021-06-18 | 2021-09-14 | 中国船舶重工集团公司第七二五研究所 | High-performance ceramic-based epoxy modified organic silicon coating and preparation and application methods thereof |
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Application publication date: 20190927 |
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