CN110281471A - A kind of accurate rapid shaping auto electronics mold based on vibration wave processing - Google Patents

A kind of accurate rapid shaping auto electronics mold based on vibration wave processing Download PDF

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Publication number
CN110281471A
CN110281471A CN201910656277.2A CN201910656277A CN110281471A CN 110281471 A CN110281471 A CN 110281471A CN 201910656277 A CN201910656277 A CN 201910656277A CN 110281471 A CN110281471 A CN 110281471A
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CN
China
Prior art keywords
vibration wave
mold
mold holder
injection
main body
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Granted
Application number
CN201910656277.2A
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Chinese (zh)
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CN110281471B (en
Inventor
陈宗德
邵金元
李惠明
万日兴
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ZHEJIANG ZHONGZHI AUTOMOBILE ELECTRIC Co.,Ltd.
Original Assignee
Quanzhou Fengze Hourong Machinery Technology Co Ltd
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Priority to CN201910656277.2A priority Critical patent/CN110281471B/en
Publication of CN110281471A publication Critical patent/CN110281471A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/40Removing or ejecting moulded articles

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention discloses a kind of accurate rapid shaping auto electronics molds based on vibration wave processing, its structure includes upper mounted plate, die main body, bottom plate, demoulding driving structure, injection hole, auto electronics mold adjusts structure by being equipped with vibration wave, mold is during the work time, raw material is by after injection mold cavity, vibration wave drive mechanism is by forming lateral mechanical wave to raw material, raw material injection is set to be more evenly distributed in a mold, the bubble in raw material is eliminated simultaneously, situation cracked after cooling down is avoided, the quality of moulded products is improved;And it during demoulding, can effectively avoid surface at left and right sides of moulded products from the case where rubbing trace with the hands occur, promote the smoothness on mold moulded products surface.

Description

A kind of accurate rapid shaping auto electronics mold based on vibration wave processing
Technical field
The present invention relates to a kind of field of die equipment, are a kind of accurate rapid shaping vapour based on vibration wave processing particularly Vehicle electrical type mold.
Background technique
With automobile fast development, the fining degree of automobile is higher and higher, and the requirement for automobile parts is also increasingly Height, this requirement is not only embodied in the quality of accessory, is also embodied in the control for accessories manufacturing process, and automotive interior The protecting crust of electronic equipment usually using be molded into mold be integrally formed produced, but at present technology consider it is incomplete, When having the disadvantages that 1, automobile injection raw material is feeding-up, raw material after injection mold cavity, is easily generated bubble, stomata, and then is dropped The density of low injection molding material, while it being easy to produce crackle during cooling and shaping, cause to generate quality decline;2, traditional mould Tool is released finished product by the push rod of bottom after cooling and shaping from the bottom up, and finished product left and right ends are not completely de- with mold From to cause finished product by the thrust of bottom and the torsion of two sides, both side surface, which is formed, when finished product being caused to be released rubs trace with the hands, influences Product is beautiful.
Summary of the invention
In view of the above-mentioned problems, the present invention provides a kind of accurate rapid shaping auto electronics mold based on vibration wave processing.
To achieve the goals above, the present invention is to realize by the following technical solutions: a kind of handled based on vibration wave Accurate rapid shaping auto electronics mold, structure include upper mounted plate, die main body, bottom plate, demoulding driving structure, Injection hole, the bottom plate are rectangular configuration and are horizontally installed to above workbench that the die main body is located at bottom plate Top and integrally change structure with bottom plate, fixed plate is installed at the top of die main body and mutually flat with bottom plate Row, the demoulding driving structure are nested in inside die main body, and the injection hole, which runs through, to be connected among die main body upper surface, The die main body adjusts structure composition by top mold holder, mold cavity, lower mold holder, demoulding positioning guide sleeve, vibration wave, in the top mold holder Surface is closely packed together with upper mounted plate bottom surface, and the lower mold holder is located at below top mold holder, and the demoulding positioning guide sleeve is installed on Between top mold holder and lower mold holder, the vibration wave adjustment structure is fixed below top mold holder, and the mold cavity is by mold cavity and demoulding Positioning guide sleeve is surrounded.
As a further improvement of the present invention, the vibration wave adjustment structure is by injection-moulding nozzle, driving device, vibration wave transmission knot Structure, adjustment structural shielding cover composition, the adjustment structural shielding cover are that simultaneously horizontal nest is described in top mold holder bottom for rectangular configuration Injection-moulding nozzle is located above adjustment structural shielding cover, and with injection-moulding nozzle using being electrically connected, the vibration wave is driven the driving device Structure is located at left and right sides of mold cavity and is closely packed together respectively with driving device.
As a further improvement of the present invention, the injection-moulding nozzle by physical contact, nozzle body, Self-resetting spring, Conductive sheet set is at for conical structure and through being connected among top mold holder upper surface, the conductive sheet is the nozzle body Circular ring structure and with conductive sheet be in integral structure, the Self-resetting spring is intertwined with nozzle body outer surface, described Physical contact sets there are two and is located at the top of top mold holder.
As a further improvement of the present invention, the driving device is by fixing axle, fixed idler whell, drive link, driving horse It reaches, drive rail, Frictional Slipping block composition, the drive motor is fixed by bolts in the adjustment structural shielding cover upper left corner, institute It states fixing axle to be located on the right side of drive motor, the fixed idler whell is nested in left end and drive motor on the left of fixing axle and is fastened on one It rises, the drive rail is installed below fixing axle and is parallel to each other with fixing axle, and the Frictional Slipping block is located at drive rail It lower section and is gap-matched with drive rail, the drive link bottom and Frictional Slipping block are mutually perpendicular to simultaneously integrally change knot Structure, and top fits together with fixed idler whell.
As a further improvement of the present invention, the vibration wave drive mechanism is by demoulding driving device, vibration wave drive rod, vibration Block composition, the vibrating mass top are bonded with Frictional Slipping block bottom surface, and the vibration wave drive rod is located at below vibrating mass, described de- Mould driving device fits together with vibration wave drive rod.
As a further improvement of the present invention, the demoulding driving device is by electromagnetic block, fixed form, helical spring, mould The fixed guide rail composition of plate, the fixed form inner wall fit together with vibration wave drive rod, and the fixed guide rail of the template is located at solid It is gap-matched at the top of solid plate and with fixed form, the helical spring left and right ends are solid with fixed form, template respectively Determine guide rail to be closely packed together, the electromagnetic block is used with physical contact and is electrically connected.
As a further improvement of the present invention, the vibration wave drive rod be E type structure, therefore can to injection molding liquid in Lower Vibration propagation, the vibration wave for promoting injection molding liquid to be subject to are more uniform.
As a further improvement of the present invention, the fixed idler whell is cylindrical structure and surface is equipped with spiral shell connected in star, and It is bonded with drive link, when fixed idler whell rotation, fixed idler whell traction drive connecting rod horizontally slips.
As a further improvement of the present invention, when the conductive sheet is bonded with physical contact, the coil of electromagnetic block performance It is powered, and then there are repulsion, fixed form extrusion spiral spring and mobile to mold cavity with fixed form.
As a further improvement of the present invention, the conductive sheet use copper core structure, and bottom set there are two convex block and electricity Source contact abuts.
The beneficial effects of the present invention are: auto electronics mold adjusts structure by being equipped with vibration wave, mold is worked Cheng Zhong, for raw material by after injection mold cavity, vibration wave drive mechanism makes raw material be infused in mold by forming lateral mechanical wave to raw material In be more evenly distributed, while eliminating the bubble in raw material, avoid it is cooling after cracked situation, improve the matter of moulded products Amount;And it during demoulding, can effectively avoid surface at left and right sides of moulded products from the case where rubbing trace with the hands occur, promote mold The smoothness on moulded products surface.
1, inventive drive means are combined with vibration wave drive mechanism, and when in use, nozzle body squeezes Self-resetting bullet Spring is simultaneously mutually communicated with mold cavity, and conductive sheet is bonded with physical contact, and then drive motor is powered and starts, drive motor Fixed idler whell is driven to rotate taking the fixed axis as the center of a circle, and fixed idler whell drives Frictional Slipping block in drive rail by drive link On swing, therefore Frictional Slipping block bottom surface is bonded with vibrating mass upper surface and generates vibration, and vibration wave passes through vibration wave and passes Lever is transmitted to the raw material in mold cavity, keeps raw material more uniform, and bubble is discharged under vibration wave effect, promotes molding system The quality of product.
2, when in use, when conductive sheet is bonded with physical contact, electromagnetic block is powered demoulding driving device of the invention And form electromagnetic field and fixed form extrusion spiral spring pushed to move along the fixed guide rail of template to mold cavity, and part cooling at After type, injection-moulding nozzle resets, and conductive sheet is separated with physical contact, and then electromagnetic field disappears, the stent at left and right sides of product Plate is first detached under helical spring effect with product, and then is released mold by demoulding driving structure, effectively improves system The smoothness on product surface.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the accurate rapid shaping auto electronics mold based on vibration wave processing of the present invention.
Fig. 2 is the structural schematic diagram of inventive die body interior.
Fig. 3 is the structural schematic diagram that vibration wave of the present invention adjusts structure section view.
Fig. 4 is the structural schematic diagram that driving device is overlooked in Fig. 3 of the present invention.
Fig. 5 is the structural schematic diagram that demoulding driving device is overlooked in Fig. 3 of the present invention.
Fig. 6 is the schematic perspective view of vibration wave drive rod of the present invention.
In figure: upper mounted plate -1, die main body -2, bottom plate -3, demoulding driving structure -4, injection hole -5, top mold holder - 2a, mold cavity -2b, lower mold holder -2c, demoulding positioning guide sleeve -2d, vibration wave adjust structure -2e, injection-moulding nozzle-e1, driving device - E2, vibration wave drive mechanism-e3, adjustment structural shielding cover-e4, physical contact-e11, nozzle body-e12, Self-resetting spring- E13, conductive sheet-e14, fixing axle-e21, fixed idler whell-e22, drive link-e23, drive motor-e24, drive rail- E25, it Frictional Slipping block-e26, demoulding driving device-e31, vibration wave drive rod-e32, vibrating mass-e33, electromagnetic block -311, fixes The fixed guide rail -314 of template -312, helical spring -313, template.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, FIG. 1 to FIG. 6 The structure of the auto electronics mold of embodiment of the present invention is schematically shown, With reference to embodiment, into one Step illustrates the present invention.
Embodiment
Fig. 1-Fig. 2 is please referred to, the present invention provides a kind of accurate rapid shaping auto electronics mold based on vibration wave processing, Its structure includes upper mounted plate 1, die main body 2, bottom plate 3, demoulding driving structure 4, injection hole 5, and the bottom plate 3 is Rectangular configuration and be horizontally installed to above workbench, the die main body 2 be located above bottom plate 3 and with bottom plate 3 at Integral structure, fixed plate 1 are installed on 2 top of die main body and are parallel to each other with bottom plate 3, the demoulding driving Structure 4 is nested in inside die main body 2, and the injection hole 5, which runs through, to be connected among 2 upper surface of die main body, the mold master Body 2 is made of top mold holder 2a, mold cavity 2b, lower mold holder 2c, demoulding positioning guide sleeve 2d, vibration wave adjustment structure 2e, the top mold holder The upper surface 2a is closely packed together with 1 bottom surface of upper mounted plate, and the lower mold holder 2c is located at below top mold holder 2a, and the demoulding positioning is led Set 2d is installed between top mold holder 2a and lower mold holder 2c, and the vibration wave adjustment structure 2e is fixed below top mold holder 2a, the mould Tool chamber 2b is surrounded by mold cavity 2b and demoulding positioning guide sleeve 2d.
Referring to Fig. 3, the vibration wave adjustment structure 2e is by injection-moulding nozzle e1, driving device e2, vibration wave drive mechanism e3, tune Whole structural shielding cover e4 composition, the adjustment structural shielding cover e4 is rectangular configuration and horizontal nest is in the bottom top mold holder 2a, institute It states injection-moulding nozzle e1 to be located above adjustment structural shielding cover e4, the driving device e2 is used with injection-moulding nozzle e1 and is electrically connected, institute Vibration wave drive mechanism e3 is stated to be located at left and right sides of mold cavity 2b and be closely packed together with driving device e2 respectively.The injection-moulding nozzle E1 is made of physical contact e11, nozzle body e12, Self-resetting spring e13, conductive sheet e14, and the nozzle body e12 is circle Pyramidal structure and through being connected among the upper surface top mold holder 2a, the conductive sheet e14 are circular ring structure and with conductive sheet e14 are in Integral structure, the outer surface the Self-resetting spring e13 and nozzle body e12 are intertwined, and the physical contact e11 is set There are two and be located at the top of top mold holder 2a.The driving device e2 is by fixing axle e21, fixed idler whell e22, drive link E23, drive motor e24, drive rail e25, Frictional Slipping block e26 composition, the drive motor e24 are fixed by bolts in tune The whole upper left corner structural shielding cover e4, the fixing axle e21 are located on the right side of drive motor e24, and the fixed idler whell e22 is nested in solid Left end is snapped together with drive motor e24 on the left of dead axle e21, the drive rail e25 be installed on the lower section fixing axle e21 and with Fixing axle e21 is parallel to each other, and the Frictional Slipping block e26 is located at below drive rail e25 and with drive rail e25 using gap Cooperation, the bottom the drive link e23 and Frictional Slipping block e26 are mutually perpendicular to simultaneously integrally change structure, and top and fixed rolling Wheel e22 fits together.The fixed idler whell e22 is that cylindrical structure and surface are equipped with spiral shell connected in star, and with drive link e23 Fitting, when fixed idler whell e22 rotation, fixed idler whell e22 traction drive connecting rod e23 horizontally slips.The conductive sheet e14 and electricity When source contact e11 is bonded, the coil that electromagnetic block 311 shows is powered, and then there are repulsion, fixed forms with fixed form 312 312 extrusion spiral springs 313 are simultaneously mobile to mold cavity 2b, and when product process finishing, 311 magnetic field of electromagnetic block disappears, spiral bullet Spring 313 pushes fixed form 312 mobile to two sides and is detached from product, avoids thrust and two sides of the product simultaneously by bottom Torsion causes surface to occur rubbing trace with the hands.The conductive sheet e14 uses copper core structure, and bottom is set there are two convex block and physical contact After e11 is abutted, therefore conductive sheet e14 is bonded with two physical contact e11, the circuit of physical contact e11 is connected.
Fig. 4-Fig. 6 is please referred to, the vibration wave drive mechanism e3 is by demoulding driving device e31, vibration wave drive rod e32, vibration Block e33 composition, the top vibrating mass e33 are bonded with the bottom surface Frictional Slipping block e26, and the vibration wave drive rod e32 is located at vibration Below block e33, the demoulding driving device e31 fits together with vibration wave drive rod e32.The demoulding driving device e31 by The fixed guide rail 314 of electromagnetic block 311, fixed form 312, helical spring 313, template forms, 312 inner wall of fixed form and vibration Wave drive rod e32 fits together, and the fixed guide rail 314 of the template is located at 312 top of fixed form and adopts with fixed form 312 With clearance fit, 313 left and right ends of helical spring abut against one with fixed form 312, the fixed guide rail 314 of template respectively It rises, the electromagnetic block 311 is used with physical contact e11 and is electrically connected.The vibration wave drive rod e32 is E type structure, therefore can be with To injection molding liquid upper, middle and lower Vibration propagation, the vibration wave for promoting injection molding liquid to be subject to is more uniform.
When in use, nozzle body e12 is pressed down against Self-resetting spring e13 and is mutually communicated with mold cavity 2b, and then will Raw material injects inside mold cavity 2b from nozzle body e12, and when nozzle body e12 is pressed down against Self-resetting spring e13, nozzle Conductive sheet e14 on main body e12 is bonded with physical contact e11, and then physical contact e11 circuit is connected, while electromagnetism Block 311 generates electromagnetic field and pushes 312 extrusion spiral spring 313 of fixed form and fix guide rail 314 to mold cavity 2b along template Close, drive motor e24 is powered at this time, and drive motor e24 drives fixed idler whell e22 to rotate by the center of circle of fixing axle e21, To which fixed idler whell e22 drives Frictional Slipping block e26 to swing along drive rail e25 by drive link e23, due to rubbing It slips the bottom motion block e26 to be bonded with vibrating mass e33, therefore when Frictional Slipping block e26 promotes vibrating mass e33 to send out during the swing Raw friction generates vibration, and then is transmitted to the injection molding liquid in mold cavity 2b by vibration wave drive rod e32, makes injection raw material in mold It is vibrated more uniform after wave in chamber 2b, and bubble is discharged under vibration wave effect, promotes shaped article quality;And work as product After cooling and shaping, injection-moulding nozzle e1 resets, and conductive sheet e14 is separated with physical contact e11, and 311 electromagnetic field of electromagnetic block disappears, Then helical spring 313 is unfolded and fixed form 312 is pushed to separate with moulded products, avoids thrust of the moulded products by bottom Both side surface, which is formed, when causing finished product to be released with the torsion of two sides rubs trace with the hands, promotes finished surface smoothness.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this The range of invention is indicated by the appended claims rather than the foregoing description, it is intended that the equivalent requirements of the claims will be fallen in All changes in meaning and scope are included within the present invention.It should not treat any reference in the claims as limitation institute The claim being related to.

Claims (3)

1. a kind of accurate rapid shaping auto electronics mold based on vibration wave processing, structure includes upper mounted plate (1), mold Main body (2), bottom plate (3), demoulding driving structure (4), injection hole (5), it is characterised in that:
The bottom plate (3) is located above workbench, and structure is integrally changed in the die main body (2) and bottom plate (3), institute Upper mounted plate (1) to be stated to be installed at the top of die main body (2), the demoulding driving structure (4) is nested in die main body (2) inside, The injection hole (5), which is run through, to be connected to above die main body (2).
2. a kind of accurate rapid shaping auto electronics mold based on vibration wave processing according to claim 1, feature Be: the die main body (2) is by top mold holder (2a), mold cavity (2b), lower mold holder (2c), demoulding positioning guide sleeve (2d), vibration wave Structure (2e) composition is adjusted, the top mold holder (2a) is closely packed together with upper mounted plate (1), and the lower mold holder (2c) is located at upper mold Below frame (2a), the demoulding positioning guide sleeve (2d) is installed between top mold holder (2a) and lower mold holder (2c), the vibration wave adjustment Structure (2e) is fixed below top mold holder (2a), and the mold cavity (2b) is enclosed by mold cavity (2b) and demoulding positioning guide sleeve (2d) At vibration wave adjustment structure (2e) is by injection-moulding nozzle (e1), driving device (e2), vibration wave drive mechanism (e3), adjustment structure Shield (e4) composition, the adjustment structural shielding cover (e4) are rectangular configuration and are nested in the bottom top mold holder (2a), the note It moulds nozzle (e1) to be located above adjustment structural shielding cover (e4), the driving device (e2) uses with injection-moulding nozzle (e1) and is electrically connected It connects, the vibration wave drive mechanism (e3) is closely packed together with driving device (e2).
3. a kind of accurate rapid shaping auto electronics mold based on vibration wave processing according to claim 2, feature Be: the injection-moulding nozzle (e1) is by physical contact (e11), nozzle body (e12), Self-resetting spring (e13), conductive sheet (e14) it forms, the nozzle body (e12) is intermediate through top mold holder (2a) is connected to, the conductive sheet (e14) and conductive sheet It (e14) is in integral structure, the Self-resetting spring (e13) is intertwined with nozzle body (e12), the physical contact (e11) it is located at the top of top mold holder (2a).
CN201910656277.2A 2019-07-19 2019-07-19 Precision rapid molding automobile electronic mold based on vibration wave treatment Active CN110281471B (en)

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Application Number Priority Date Filing Date Title
CN201910656277.2A CN110281471B (en) 2019-07-19 2019-07-19 Precision rapid molding automobile electronic mold based on vibration wave treatment

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Application Number Priority Date Filing Date Title
CN201910656277.2A CN110281471B (en) 2019-07-19 2019-07-19 Precision rapid molding automobile electronic mold based on vibration wave treatment

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CN110281471A true CN110281471A (en) 2019-09-27
CN110281471B CN110281471B (en) 2021-08-31

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312308A (en) * 1996-05-21 1997-12-02 Oki Electric Ind Co Ltd Method and apparatus for manufacturing semiconductor device
JPH10305459A (en) * 1997-05-07 1998-11-17 Meisei Kinzoku Kogyosho:Kk Hot runner type mold using ultrasonic energy
CN202029320U (en) * 2011-03-22 2011-11-09 常州信息职业技术学院 Electromagnetic vibration mechanism for injection mould
CN207077703U (en) * 2017-08-23 2018-03-09 苏州日光耐热塑料有限公司 A kind of plastic mould with vibrating function
CN208392503U (en) * 2018-04-08 2019-01-18 深圳市凯迪模具有限公司 A kind of automobile injection mold of automatic demoulding mechanism
CN109878024A (en) * 2019-03-05 2019-06-14 邹云雅 A kind of plastic toy mold wiped out using Acoustic Wave Propagation bubble

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312308A (en) * 1996-05-21 1997-12-02 Oki Electric Ind Co Ltd Method and apparatus for manufacturing semiconductor device
JPH10305459A (en) * 1997-05-07 1998-11-17 Meisei Kinzoku Kogyosho:Kk Hot runner type mold using ultrasonic energy
CN202029320U (en) * 2011-03-22 2011-11-09 常州信息职业技术学院 Electromagnetic vibration mechanism for injection mould
CN207077703U (en) * 2017-08-23 2018-03-09 苏州日光耐热塑料有限公司 A kind of plastic mould with vibrating function
CN208392503U (en) * 2018-04-08 2019-01-18 深圳市凯迪模具有限公司 A kind of automobile injection mold of automatic demoulding mechanism
CN109878024A (en) * 2019-03-05 2019-06-14 邹云雅 A kind of plastic toy mold wiped out using Acoustic Wave Propagation bubble

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