CN110278655A - A kind of high conducting transparent glass base circuit board production method can be used as building materials - Google Patents
A kind of high conducting transparent glass base circuit board production method can be used as building materials Download PDFInfo
- Publication number
- CN110278655A CN110278655A CN201910672636.3A CN201910672636A CN110278655A CN 110278655 A CN110278655 A CN 110278655A CN 201910672636 A CN201910672636 A CN 201910672636A CN 110278655 A CN110278655 A CN 110278655A
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- China
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- glass
- circuit board
- silver paste
- circuit
- tempering
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B27/00—Tempering or quenching glass products
- C03B27/012—Tempering or quenching glass products by heat treatment, e.g. for crystallisation; Heat treatment of glass products before tempering by cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of high conducting transparent glass base circuit board production methods that can be used as building materials, including substrate choosing system, conducting medium production, conducting medium printing, circuit detection, tempering, finished circuit detecting step.The present invention is using the high silver paste of conductivity as conducting medium, use the glass without tempering as substrate, general glass tempering process tempering can be used, make silver paste sintering on glass while tempering, allow to guarantee that flatness and stress of glass etc. meet building glass requirement.Secondly, silver-colored molecule is interpenetrated with glass molecule using the high silver paste of conductivity as conducting medium, conducting medium is increased in the adhesion strength of glass surface, improves circuit board matrix on-state rate.Meanwhile conducting medium being printed on to the air level of glass matrix by screen printing technique, the usage amount of the thickness of route, the printing reduction silver paste of thin and thick can be realized by the change of web plate, be conducive to glass base circuit board in the popularization and application of every profession and trade.
Description
Technical field
The present invention relates to electronographic device production field and building fields, and the high conducting that specially can be used as building materials is saturating
The production of bright glass base circuit board production method more particularly to safety glass base circuit board for building.
Background technique
With the fast development of electronic technology, electronic technology is all widely used in all trades and professions, wherein schedule
It often needs that some information such as advertisement, news are presented to masses by imaging device in life, allows people quickly to grasp relevant
Information.
The public places such as building, high-speed rail, airport frequently with the illuminators such as luminescence chip, led are sticked by alite paste
It is attached on tempered glass, then each illuminator is linked together by conducting wire, tempered glass is as adhesive matrix and light penetrating object
Effect, switched by the display color that control system controls each illuminator, the combination of color penetrates glass, to present not
Same image frame.But due to the presence of illuminator and conducting wire, cause imaging device volume big, imaging back side conducting wire is various,
Influence the translucency of glass.Meanwhile illuminator generates amount of heat when luminous, alite paste is easy aging, causes illuminator de-
Fall influence imaging performance, and often need to carry out auxiliary heat dissipation using air-conditioning to radiate, occupy image glass backside space and
Aesthetics is unfavorable for being widely applied for image glass.
In order to solve the problems such as volume is big existing for image glass, quantity of heat production is high, conduction is poor, space utilization rate is poor, specially
Benefit to propose height application No. is 201610076820.8 and transparent glass base circuit board be connected, including glass substrate, glass substrate are
Reinforced glass substrate, the surface of reinforced glass substrate is equipped with is being dried by the electrocondution slurry for being printed in reinforced glass substrate air surface
It is roasting, then be placed in 550~600 DEG C of temperature environments 300~360 seconds, be subsequently placed in 710~730 DEG C of temperature environments maintain 120~
220 seconds, finally cool down after conducting wire with reinforced glass substrate melt surface.In the technology, although solving to a certain extent
The volume of traditional image glass is big but tempered glass needs to be placed in secondary tempering in 710~730 DEG C of temperature, with national standard
It is proposed in GB15763.2-2005 " safety glass part 2 tempered glass for building " appendix A .2, two is carried out to tempered glass
Secondary heat treatment the relevant technologies are not inconsistent.The standard, which explicitly points out the entire secondary heat treatment process of glass fire box temperature should be avoided, is more than
320 DEG C, if glass surface temperature is more than 300 DEG C, the tempering stress that will lead to glass can be relaxed due to overheat, cause glass
Explosion or bending cause that the refractive index of glass is big, the imaging is not clear to influencing its safety and planarization.The technical method will
Tempered glass is placed in secondary in hot environment for a long time, it is clear that building materials grade standard is not achieved, there are security risk, therefore this method
Product cannot be used in the region required to safety completely, it is difficult to meet the use of public situation.
Therefore, be badly in need of develop it is a kind of it is high conducting, the glass base circuit board production side that transparency is high, small in size, calorific value is small
Method, to meet the demand of current electronic imaging field.
Summary of the invention
It is an object of the invention to can be used as the high conducting transparent glass base circuit board production method of building materials, has height and lead
Logical, the features such as transparency is high, glass flatness is high, space occupancy rate is low, aesthetics is high, solves the glass base electricity of the prior art
The problem of road plate manufacturing process.
To achieve the above object, the invention provides the following technical scheme: a kind of high conducting transparent glass that can be used as building materials
Base circuit board production method, it is characterised in that the following steps are included:
S1, substrate choosing system: selecting the glass of non-tempering to be used as circuit board matrix, according to it is required by glass be cut into it is specific greatly
Small size, and grinding process is carried out to edge and is cleaned, the glass that the circuit board matrix (100) is selected can be common float glass process
Glass, ultra-clear glasses, anti reflection glass etc.；
S2, conducting medium production: production two kinds of electrocondution slurries of high temperature silver paste and low temperature silver paste are as conducting medium；
S3, conducting medium printing:
S3-1 prepares before printing: circuit board matrix is placed in specific printing environment, using the tin face instrument detection electricity
Road plate matrix, the tin face of discrimination circuit plate matrix and air level；The air level is cleaned using deionized water, is air-dried
50S-60S makes air level surface be in dustless clean state；The printing environment is 22 DEG C -26 DEG C of room temperature, humidity
40-60% it is dustless, without electrostatic cleaning condition；
S3-2, upper piece: it chooses a certain amount of high temperature silver paste and is placed in screen process press, it under certain environmental conditions, will
The glass substrate is placed on screen process press workbench, and the tin face is in contact with workbench；
The printing of S3-3 circuit: it chooses a certain amount of high temperature silver paste and is placed in screen process press, the screen process press is set
There is steel wire, the steel wire is equipped with mesh, and the high temperature silver paste under external force, is printed on the air layer of glass
Face；
The circuit board matrix for being painted with silver paste is placed room temperature natural air drying for a period of time or is placed in 100- by S3-4, drying
1-5min is dried at a temperature of 200 DEG C；
Whether S4, circuit detection have broken string using the circuit on circuit board matrix obtained in magnifying glass detection S5, adopt
It is mended with the high temperature silver paste point；
S5, tempering: glass substrate being placed in 650 DEG C of -720 DEG C of temperature environments and keeps the temperature 150S-550S, then cooling
For 60S-550S to room temperature, the cooling procedure conveys the air of certain wind pressure to cooling chamber simultaneously；
Finished circuit detection: S6 after the completion of tempering, using general-purpose table look-up circuit with the presence or absence of open circuit, selects low temperature
Silver paste repairs the breaking place；
Wherein, the step S2 high temperature silver paste matches a certain amount of bonding by 65%-85% high sintering Active silver powder
Agent (cryogenic glass powder), adhesion promoter, curing agent, non-activated thinner, reactive diluent, sagging inhibitor composition；It is described
Low temperature silver paste match a certain amount of binder (synthetic resin), attachment in 1-2 μm of silver powder by the average grain diameter of 65%-80%
Power promotor, curing agent, non-activated thinner, reactive diluent, sagging inhibitor composition；
Wherein, the step S2 high temperature silver paste and low temperature silver paste during the sintering process, add the colorant of different colours
To control the route color with glass sintering face.
Wherein, the circuit diagram shape one that the mesh form and circuit board matrix that the step S3-3 steel wire is equipped with are equipped with
It causes, the mesh mesh number and aperture can be adjusted according to the thickness of circuit diagram route, and the circuit diagram lines can be by not
The art pattern of similar shape, the circuit diagram have including by conductor wire, signal wire, contact, the circuit diagram carries on the back circuit board
Matrix line roadway applications have the antirust paint of different colours to show the color of demand.
Wherein, conventional steel can be used in specific temperature and soaking time and cooling means described in the step S5
Change/half tempered method, the warm temperature, soaking time, cooling time, wind pressure according to the used type of furnace, thickness of glass,
Glass kind etc. is adjusted.
Compared with prior art, beneficial effects of the present invention are as follows:
1. avoiding the glass in circuit sintering process as circuit board matrix using the simple glass without tempering
Secondary tempering reduces the breakage rate of glass, and glass flatness and stress can be allowed to meet building materials requirement, and high-flatness ensures
The safety of glass base circuit board and imaging definition are conducive to glass base circuit board in the use of display imaging industry, guarantee
Its translucency and clarity.
2. energy consumption consumes circuit at work using conductivity high high temperature silver paste and low temperature silver paste as conducting medium
Less, conduction property is strong, reduces the calorific value of circuit, without additional addition cooling device, reduces imaging device volume and space
Utilization rate improves the aesthetics of imaging device.Meanwhile during glass is High temperature tempered, silver-colored molecule is easy and glass molecule
It interpenetrates, improves the attraction between conducting medium and glass molecule, increase conducting medium in the adherency of glass surface
Power reduces the expulsion rate of conducting medium, improves circuit board matrix on-state rate and reduces maintenance cost.
3. silver paste is printed on glass air level using screen printing technique, add on steel wire in advance according to circuit diagram
The corresponding mesh of work guarantees different location route according to the thickness and width arrangement mesh quantity of route in circuit diagram and aperture
Thickness, thin and thick, avoid the same size of all routes, cause high voltage position be circuit electricity shortage, low-voltage position be electricity
Road waste, is conducive to the rational deployment of route, reduces the usage amount of silver paste, reduces route printing cost.Meanwhile it being printed in route
Multiple circuit detection, reduces fault rate.
Detailed description of the invention
Fig. 1 is the flow diagram of glass base circuit board production method in the present invention.
Fig. 2 is the structural schematic diagram of glass base circuit board in the present invention.
Fig. 3 is the part-structure figure of the steel wire of glass base circuit board in the present invention.
Fig. 4 is the schematic diagram after the illuminator welding of glass base circuit board in the present invention.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
A kind of high conducting transparent glass base circuit board production method that can be used as building materials, feature as shown in attached drawing 1-4
Be the following steps are included:
Substrate choosing system: S1 selects the glass of non-tempering as circuit board matrix 100, glass is cut into spy according to required
Determine size dimension, and grinding process is carried out to edge and is cleaned, the circuit board matrix 100.
Preferably, the glass of step S1 is common float glass, ultra-clear glasses, anti reflection glass etc..
S2, conducting medium production: production two kinds of electrocondution slurries of high temperature silver paste and low temperature silver paste are as conducting medium 200；
S3, conducting medium printing:
S3-1 prepares before printing: circuit board matrix 100 is placed in specific printing environment, using described in the detection of tin face instrument
Circuit board matrix 100, the tin face 101 of discrimination circuit plate matrix 100 and air level 102；The air level 102 uses
Deionized water cleaning, air-dries 50S-60S, 102 surface of air level is made to be in dustless clean state；The printing environment is room
22 DEG C -26 DEG C of interior temperature, humidity 40-60% it is dustless, without electrostatic cleaning condition；
S3-2, upper piece: under certain environmental conditions, the glass substrate 100 being placed in screen process press work
On platform, the tin face 101 is in contact with workbench；
The printing of S3-3 circuit: it chooses a certain amount of high temperature silver paste and is placed in screen process press, the screen process press is set
There is steel wire 400, the steel wire 400 is equipped with mesh 401, and the high temperature silver paste under external force, is printed on glass
Air level 102；
The circuit board matrix 100 for being painted with silver paste is placed room temperature natural air drying for a period of time or is placed in by S3-4, drying
1-5min is dried at a temperature of 100-200 DEG C；
S4, circuit detection are disconnected using whether the circuit on circuit board matrix 100 obtained in magnifying glass detection S5 has
Line is mended using the high temperature silver paste point；
Tempering: S5 glass substrate is placed in 650 DEG C of -720 DEG C of temperature environments and keeps the temperature 150S-550S, makes silver paste molecule
It is interpenetrated with glass molecule, then cooling 60S-550S to room temperature, the cooling procedure is certain to cooling chamber conveying simultaneously
The air of wind pressure；
Finished circuit detection: S6 after the completion of tempering, using general-purpose table look-up circuit with the presence or absence of open circuit, selects low temperature
Silver paste repairs the breaking place；
Preferably, high temperature silver paste described in step S2 is a certain amount of glutinous by 65%-85% high sintering Active silver powder proportion
Mixture (cryogenic glass powder), adhesion promoter, curing agent, non-activated thinner, reactive diluent, sagging inhibitor composition；Institute
The low temperature silver paste stated matches a certain amount of binder (synthetic resin), attached in 1-2 μm of silver powder by the average grain diameter of 65%-80%
Adhesion promoter, curing agent, non-activated thinner, reactive diluent, sagging inhibitor composition.
Preferably, the high temperature silver paste and low temperature silver paste need to place refrigerating chamber refrigeration after completing, and when use need to return
50-80 minutes warm, stirring 5-10 minutes, and flowing uniform to silver paste liquid can continuously start to print clockwise, the height
The conductive paste that warm silver paste and low temperature silver paste are finished puts back to refrigerator after need to sealing in time, and not load in mixture with new conductive paste
Preferably, high temperature silver paste described in step S2 and low temperature silver paste during the sintering process, add the color of different colours
To control the route color with glass sintering face, the colorant shows color after the completion of sintering and is combined into different figures material
Case.
Preferably, the circuit diagram that 401 shape of mesh and circuit board matrix 100 that step S3-3 steel wire 400 is equipped with are equipped with
200 shapes are consistent, and 401 mesh number of mesh and aperture can be adjusted according to the thickness of 200 route of circuit diagram, the electricity
Road Figure 200 lines can be had by art pattern of different shapes, the circuit diagram 200 including by conductor wire 210, signal wire 220,
Contact 230, the circuit diagram 200 are carried on the back antirust paint of 100 circuit surface 240 of circuit board matrix coated with different colours and are needed with showing
The color asked.
Preferably, series connection and wire laying mode in parallel can be used in the conductor wire 210, and the signal wire 220 is used for
Control the work of illuminator 300.
Preferably, steel wire 400 described in step S3-3 needs whether to block optical test mesh 401 before printing.
Preferably, in the S3 after the completion of silk screen printing, it need to check that silver paste circuit with the presence or absence of broken string, breaks if it exists
Road selects high temperature silver paste to repairing at the broken string；
Preferably, conventional tempering/half can be used in specific temperature and soaking time and cooling means described in step S5
Toughening method, the warm temperature, soaking time, cooling time, wind pressure are according to the used type of furnace, thickness of glass, glass
Kind etc. is adjusted.
Preferably, after the completion of glass tempering, using the circuit on circuit board matrix 100 obtained in magnifying glass detection S5
Whether there is broken string, mended using the high temperature silver paste point, scrapes off the high temperature silver paste beyond circuit pack after silver paste is dry, it is ensured that repair
Route is consistent with primary circuit thickness, thin and thick after multiple.
Claims (5)
1. a kind of high conducting transparent glass base circuit board production method that can be used as building materials, it is characterised in that the following steps are included:
S1, substrate choosing system: selecting the glass of non-tempering as circuit board matrix (100), according to it is required glass is cut into it is specific
Size dimension, and grinding process is carried out to edge and is cleaned, the glass that the circuit board matrix (100) is selected can be common floating
Method glass, ultra-clear glasses, anti reflection glass etc.；
S2, conducting medium production: production two kinds of electrocondution slurries of high temperature silver paste and low temperature silver paste are as conducting medium (200)；
S3, conducting medium printing:
S3-1 prepares before printing: circuit board matrix (100) is placed in specific printing environment, described using the detection of tin face instrument
Circuit board matrix (100), the tin face (101) of discrimination circuit plate matrix (100) and air level (102)；The air level
(102) it is cleaned using deionized water, air-dries 50S-60S, air level (102) surface is made to be in dustless clean state；Described
Printing environment be 22 DEG C -26 DEG C of room temperature, humidity 40-60% it is dustless, without electrostatic cleaning condition；
S3-2, upper piece: it chooses a certain amount of high temperature silver paste and is placed in screen process press, it under certain environmental conditions, will be described
Glass substrate (100) be placed on screen process press workbench, the tin face (101) is in contact with workbench；
The printing of S3-3 circuit: it chooses a certain amount of high temperature silver paste and is placed in screen process press, the screen process press is equipped with steel
Silk screen (400), the steel wire (400) are equipped with mesh (401), and the high temperature silver paste under external force, is printed on glass
The air level (102) of glass；
The circuit board matrix (100) for being painted with silver paste is placed room temperature natural air drying for a period of time or is placed in and is less than by S3-4, drying
1-5min is dried at a temperature of 100-200 DEG C；
Whether S4, circuit detection have broken string using the circuit on circuit board matrix (100) obtained in magnifying glass detection S5,
It is mended using the high temperature silver paste point；
S5, tempering: glass substrate being placed in 650 DEG C of -720 DEG C of temperature environments and keeps the temperature 150S-550S, then cools down 60S-
For 550S to room temperature, the cooling procedure conveys the air of certain wind pressure to cooling chamber simultaneously；
Finished circuit detection: S6 after the completion of tempering, using general-purpose table look-up circuit with the presence or absence of open circuit, selects low temperature silver paste
The breaking place is repaired；
2. can be used as the high conducting transparent glass base circuit board production method of building materials as described in claim 1, which is characterized in that
High temperature silver paste described in step S2 matches a certain amount of binder (low temperature glass by 65%-85% high sintering Active silver powder
Powder), adhesion promoter, curing agent, non-activated thinner, reactive diluent, sagging inhibitor composition；The low temperature silver paste by
The average grain diameter of 65%-80% matches a certain amount of binder (synthetic resin), adhesion promoter, solid in 1-2 μm of silver powder
Agent, non-activated thinner, reactive diluent, sagging inhibitor composition；
3. can be used as the high conducting transparent glass base circuit board production method of building materials as described in claim 1, which is characterized in that
High temperature silver paste described in step S2 and low temperature silver paste during the sintering process, add the colorant of different colours to control and burn with glass
The route color of junction.
4. can be used as the high conducting transparent glass base circuit board production method of building materials as described in claim 1, which is characterized in that
Circuit diagram (200) shape that mesh (401) shape and circuit board matrix (100) that step S3-3 steel wire (400) is equipped with are equipped with
Unanimously, the mesh (401) mesh number and aperture can be adjusted according to the thickness of circuit diagram (200) route, the circuit
Figure (200) lines can be had by art pattern of different shapes, the circuit diagram (200) including by conductor wire (210), signal wire
(220), contact (230), the circuit diagram (200) carry on the back circuit board matrix (100) circuit surface (240) and are coated with different colours
Antirust paint is to show the color of demand.
5. can be used as the high conducting transparent glass base circuit board production method of building materials as described in claim 1, which is characterized in that
Conventional tempering/half tempered method can be used in specific temperature described in step S5 and soaking time and cooling means, described
Warm temperature, soaking time, cooling time, wind pressure are adjusted according to the used type of furnace, thickness of glass, glass kind etc..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910672636.3A CN110278655A (en) | 2019-07-24 | 2019-07-24 | A kind of high conducting transparent glass base circuit board production method can be used as building materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910672636.3A CN110278655A (en) | 2019-07-24 | 2019-07-24 | A kind of high conducting transparent glass base circuit board production method can be used as building materials |
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| Publication Number | Publication Date |
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| CN110278655A true CN110278655A (en) | 2019-09-24 |
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ID=67965242
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| CN201910672636.3A Withdrawn CN110278655A (en) | 2019-07-24 | 2019-07-24 | A kind of high conducting transparent glass base circuit board production method can be used as building materials |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112986154A (en) * | 2021-02-03 | 2021-06-18 | 重庆神华薄膜太阳能科技有限公司 | Float glass tin surface detection device and detection method |
-
2019
- 2019-07-24 CN CN201910672636.3A patent/CN110278655A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112986154A (en) * | 2021-02-03 | 2021-06-18 | 重庆神华薄膜太阳能科技有限公司 | Float glass tin surface detection device and detection method |
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Application publication date: 20190924 |
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