CN110272707B - Isocyanate adhesive composite material and routing fiberboard manufactured by same - Google Patents

Isocyanate adhesive composite material and routing fiberboard manufactured by same Download PDF

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Publication number
CN110272707B
CN110272707B CN201910546172.1A CN201910546172A CN110272707B CN 110272707 B CN110272707 B CN 110272707B CN 201910546172 A CN201910546172 A CN 201910546172A CN 110272707 B CN110272707 B CN 110272707B
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component
solid content
adhesive composition
fiberboard
composite material
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CN110272707A (en
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王向硕
涂松
胡兵波
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Wanhua Chemical Group Co Ltd
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Wanhua Chemical Group Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • B27N1/02—Mixing the material with binding agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/12—Moulding of mats from fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/20—Moulding or pressing characterised by using platen-presses
    • B27N3/203—Moulding or pressing characterised by using platen-presses with heating or cooling means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
    • C08G18/6492—Lignin containing materials; Wood resins; Wood tars; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent

Abstract

The invention relates to an isocyanate adhesive composite material for a fiberboard and a hollow-milled fiberboard manufactured by the same. The adhesive composition material for isocyanate is isocyanate adhesive, double-crown silica composite material and lignin wood material. The milled fiber board is formed by mixing the separation fiber and the adhesive under the condition of hot pressing. The fiberboard prepared by the adhesive has good routing performance and good dimensional stability.

Description

Isocyanate adhesive composite material and routing fiberboard manufactured by same
Technical Field
The invention belongs to the field of artificial board manufacturing, and particularly relates to an isocyanate adhesive composite material and a routing fiberboard manufactured by the same.
Background
The fiber board is one of three fields of artificial boards, and has wide use value in the fields of furniture, vehicles, ships, sound equipment and the like. The hollowed fiberboard can be carved and hollowed due to uniform density, compact fiber and high internal bonding strength, and the hollowed board can obtain various patterns and patterns required by customers, so that the hollowed fiberboard has wide application in the fields of door frames, furniture, cabinets and the like.
However, the routing processing performance of the common fiber board currently supplied in the market cannot meet the requirements of furniture manufacturing enterprises. The reason is that the common fiber board has the defects of rough fiber, uneven section structure and density, low internal bonding strength and the like, and the hollowed surface is soft, rough, fluffy and poor in plastic uptake, so that the requirements of soft and fine fiber, consistent section structure, even density, national standard-reaching mechanical properties and the like cannot be met.
In recent years, people solve the routing hair swelling problem of aldehyde-containing urea resin adhesive routing fiber boards (containing aldehyde) by changing fiber quality, adjusting a hot pressing process and the like. Patent CN107030841A discloses a preparation method of E0-level low-suction-expansion routing fiberboard, which is characterized in that the preparation method of urea-formaldehyde resin adhesive is improved and optimized, the production process parameters of screening abrasive disc, hot grinding and hot pressing for preparing the fiberboard are adjusted, the water resistance of the routing fiberboard is improved, the appearance effect of a smooth and fine routing section is obtained, and the problem of moisture absorption deformation easily occurring in the routing processing or veneering processing (adopting water-based adhesive) process is solved. Patent CN105479580B discloses a technology for removing impurities from wood chips by adding an auxiliary agent composed of sodium carbonate and polyacrylamide, which changes the problems of permeability and diffusivity of wood chip raw materials in the cooking process, and simultaneously, a specially-made grinding disc is adopted to improve the fiber quality when cooking the wood chips, thereby preparing a routing fiberboard with improved performance. The patent CN101298159B discloses a manufacturing process of a medium density fiberboard suitable for routing board processing, which comprises the steps of slicing tree species with similar specific gravity into wood chips with uniform sizes, and selecting fibers with specific meshes to prepare a urea resin routing board with uniform density through specific cooking temperature and cooking time.
However, when the process method for routing the fiber board with aldehyde is applied to the routing fiber board without aldehyde processed by isocyanate adhesive, the problems of plate routing hair, poor dimensional stability and the like still exist. This is because when the isocyanate adhesive is used to process a formaldehyde-free board, the amount of the applied adhesive is small, the isocyanate excessively penetrates into the fiber matrix, and the bonding manner is point bonding, so that it is difficult to form a distinct adhesive layer. At present, the problem of routing hair and size stability needs to be improved through multiple routing modes for the formaldehyde-free routing fiber board which is sold in the market and takes isocyanate as an adhesive, so that the production efficiency and the economic benefit are greatly reduced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an isocyanate adhesive composite material for formaldehyde-free routing fiber boards, and the composite material can solve the routing hair and dimensional stability problems of the existing isocyanate adhesive routing fiber boards.
The invention also aims to provide an aldehyde-free routing fiberboard prepared by the isocyanate adhesive composition material.
In order to achieve the purpose, the invention adopts the following technical scheme:
the isocyanate adhesive composite material for the routing fiberboard comprises a component A and a component B, wherein:
the component A is isocyanate, and accounts for 60-80% of the solid content of the composite material, preferably 70-78%;
the component B is an aqueous dispersion containing B1 and B2, and the solid content of the component B accounts for 20-40% of the solid content of the combined material, preferably 22-30%;
the B1 is a double-canopy layer silicon dioxide composite material, and accounts for 30-70%, preferably 40-60% of the solid content of the B component dispersion liquid; the B2 is lignin wood material, and accounts for 30-70%, preferably 40-60% of the solid content of the B component dispersion liquid.
According to the invention, the secondary framework is formed by cooperatively coating the filling fiber with the double-canopy layer silicon dioxide composite material and the lignin wood material, so that the problems of routing hair and size stability of the fiberboard are solved:
firstly, the inner crown of the double-crown-layer silicon dioxide composite material is tightly connected to silicon dioxide particles through covalent bonds, and the organic flexible polyoxyethylene ether carbon chains are wrapped on the particles coated by the inner crown through electrostatic self-assembly, so that a special double-crown-layer structure is formed. The unique rigid-flexible structure can fill fiber gaps which are not bonded by the isocyanate adhesive, and also can flexibly wrap the fiber gaps, so that uniform coating is realized in the filling process; simultaneously, unique double-canopy layer structure can effectively slide under the effect of electrostatic force when saw cutting, can offset the huge stress that forms when saw cutting again.
Secondly, the double-crown layer can play a role in coating, but cannot form tight bridging, and easily causes viscous flow in high-temperature sawing to enrich the organic layer, so that the invention also adds a lignin wood material for synergistic bonding. The active hydroxyl of the lignin can react with isocyanate, so that the high-strength and high-modulus fiber can be effectively bridged after the lignin is coated, and double-crown silica particles can be effectively fixed in the plate structure to form a complete secondary framework. The synergistic effect can effectively ensure that the cross section of the routing fiber board prepared by the adhesive can be kept smooth when the routing fiber board is sawed and routed, so that a good routing effect is achieved. It is worth noting that the lignin wood material can form new bonding lines in the gluing process, so that isocyanate is prevented from excessively permeating into fibers, glue consumption can be reduced to a certain extent, and the mechanical strength of the board can be improved.
In the invention, the coping of the B1 is organosilicon quaternary ammonium salt, preferably one or more of 3- (trimethoxysilylpropyl) dimethyloctadecyl ammonium chloride, 3- (trimethoxysilylethyl) dimethyloctadecyl ammonium chloride, 3- (trimethoxysilylpropyl) dimethylhexadecyl ammonium chloride and 3- (trimethoxysilylpropyl) dimethyldodecyl ammonium chloride, and more preferably 3- (trimethoxysilylpropyl) dimethyloctadecyl ammonium chloride.
In the invention, the outer crown of B1 is fatty alcohol polyoxyethylene ether sulfonate, preferably fatty alcohol polyoxyethylene ether sulfonate with the polymerization degree n of 10-20, more preferably one or more of potassium lauryl polyoxyethylene ether sulfonate, potassium tetradecanol polyoxyethylene ether sulfonate, potassium hexadecanol polyoxyethylene ether sulfonate and potassium octadecanol polyoxyethylene ether sulfonate, and further preferably potassium tetradecanol polyoxyethylene ether sulfonate.
In the invention, the preparation method of B1 comprises the following steps:
(1) and (3) inner crown grafting: dispersing silicon dioxide powder in water to obtain a suspension, adding the suspension into the inner crown solution, and removing a supernatant after reaction to obtain inner crown grafted silicon dioxide;
(2) self-assembly of the outer crown: preparing an outer crown aqueous solution and adjusting the pH value, placing the inner crown graft silicon dioxide particles which are stirred and dispersed in a reaction kettle, adding the outer crown solution to react after the pH value is adjusted to be the same, and washing, drying and removing residual solvent of a product to obtain the double-crown silicon dioxide composite material.
In the invention, the coping solution in the step (1) is a methanol solution of the coping, and the concentration is 60-64 wt%.
In the invention, the reaction temperature in the step (1) is room temperature, and the reaction time is 16-24 h.
In the invention, the concentration of the corona solution in the step (2) is 9.5-12.5 wt%.
In the invention, the reaction temperature in the step (2) is 50-70 ℃, and the reaction time is 16-24 h.
In the invention, the PH value is adjusted to 7-11 in the step (2).
In the invention, the preparation steps of the B2 lignin woody material component are as follows:
I. the bark was extracted with 1 wt% sodium hydroxide at 90 ℃ for 2h and the bark residue was treated with hot water washing for fibrillation.
The treated bark residue was soaked in water (2 wt%) for 24 hours, and the bark was pulverized and fibrillated using an ultra-fine pulverizer, and then homogenized under high pressure using a high-pressure homogenizer. And standing the homogenized suspension for 24 hours to settle solid matters, finally separating the upper layer and the lower layer of the suspension to obtain lower-layer solid matters, and drying to obtain the lignin wood material.
In the invention, the component B1 and the component B2 are added into water and stirred and dispersed to obtain the component B, and the solid content of the dispersion liquid is 10-50 wt%, preferably 30-45 wt%.
In the present invention, the isocyanate of component A is polymethylene polyphenyl polyisocyanate and/or its derivative, preferably polymethylene polyphenyl polyisocyanate having NCO% of 29-32.8%, functionality of 2.9-3.3 and viscosity of 150-250cp (25 ℃). The A component may be a polyisocyanate of the Wannate series of Wanhua chemical group, Inc., such as PM-100, PM-200, PM-400, PM-600, PM-700, CW20, CW30, PM300E, 9132 FC.
In the invention, the isocyanate adhesive combination material has the following action modes: the silica particles of flexible parcel enter into the space that the isocyanate each point bonded, rigid particle effective filling supports, the fibre also can effectively be wrapped up to flexible two crowns simultaneously, violent stress variation can well be resisted to unique two canopy layer structure, lignin wooden material carries out secondary parcel and bridging to the fibre of two canopy layer silica particles parcel, effectively formed the secondary skeleton, sufficient fibre has further been guaranteed to be wrapped up completely, consequently when the routing, the phenomenon that the routing cross section is hairy can not appear even under higher rotational speed and walking beam speed. Meanwhile, the excellent size stability of the composite material can be ensured due to less influence of the external environment.
An aldehyde-free routing fiberboard prepared by adopting the isocyanate adhesive composite material.
In the invention, the glue application amount in the preparation of the routing fiber board is as follows: the component A is 30-40kg/m3The component B (based on the solid content mass) is 10-20kg/m3。
In the invention, the moisture content of the dried fiber is controlled to be 7.8-10 wt% during the preparation of the routing fiber board.
In the invention, the steps of preparing the formaldehyde-free routing fiberboard by using the isocyanate adhesive composition material are as follows:
s1: the wood chip treatment process comprises the steps of preheating wood chips in a preheating bin, wherein the preheating temperature is 90-98 ℃, the steam pressure of a cooking tank is 0.7-0.8 MPa, the cooking time is 3-5 min, the cooking temperature is 140-180 ℃, the water content of the wood chips is homogenized, and the fiber separation efficiency and the fiber separation uniformity are improved;
s2: a fiber preparation process, namely, wood chips enter a defibrator through a belt type screw, the gap between grinding discs is controlled to be less than or equal to 0.28mm, the fiber separation yield is 18-20 tons/hour, and wood fibers of 80-100 meshes are prepared;
s3: the sizing process, the component A is pumped into the entrance in the spraying pipe through a sizing pump, the component B is pumped into the entrance of the spraying pipe through another sizing pump, and the component A and the component B are sprayed on the fiber through a high-pressure nozzle and are uniformly mixed with the fiber;
s4: drying procedure, after sizing, drying for 7-10s, and controlling the water content of the raw material at 7.8-10 wt%.
S5: a sorting step of removing foreign matters such as lumps, fiber clusters, fiber bundles and the like;
s6: a paving procedure, namely performing slab prepressing on the fibers at the pressure of 10.15-11.35 MPa after the fibers are paved by air flow, and trimming the slabs;
s7: hot pressing, wherein the hot pressing temperature is 230-160 ℃, a five-section hot pressing temperature area is adopted, the hot pressing pressure is 0-40 MPa, and the hot pressing coefficient is 11.5-13.5 s/mm;
s8: and (5) post-treatment, cooling and curing for more than 72h, and sawing.
In the present invention, the pressures are gauge pressures.
The invention has the beneficial effects that:
(1) the engraving and milling effect of the fiberboard manufactured by the isocyanate adhesive is effectively improved, after one-time engraving and milling, the engraving and milling section is smooth and burr-free, and the production process and appearance requirements can be met without multiple times of engraving and milling.
(2) Good dimensional stability is maintained, and in a dimensional stability test, the length deformation is less than +/-0.4 percent, and the thickness deformation is less than +/-0.51 percent; meanwhile, the internal bonding strength is improved by about 10 percent under the condition of keeping other mechanical properties without loss.
(3) The formaldehyde-free routing fiberboard with excellent performance and no formaldehyde is obtained.
Detailed Description
The present invention is further described below with reference to specific examples, which are only exemplary and do not limit the scope of the present invention in any way. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention, and that such changes and modifications may be made without departing from the spirit and scope of the invention.
The following examples and comparative examples were carried out on a medium density fiberboard continuous production line (12mm board thickness).
The examples and comparative examples were as follows:
CW 20: a mixture of polyfunctional isocyanate and diphenylmethane diisocyanate, having an NCO content of 30.5-32.0%, a functionality of 3.1-3.3, a viscosity of 150-250cp at 25 ℃, Tanhua chemical group Co., Ltd;
CW 30: a mixture of polyfunctional isocyanate and diphenylmethane diisocyanate, having an NCO content of 30.5-32.0%, a functionality of 3.1-3.3, a viscosity of 150-250cp at 25 ℃, Tanhua chemical group Co., Ltd;
9132 FC: a polyfunctional isocyanate derivative having an NCO content of 29.0 to 30.0%, a functionality of 2.9 to 3.1, a viscosity of 225cp at 25 ℃, Tanhua chemical group Co., Ltd;
silicon dioxide: chemical purity, denland chemical ltd;
3- (trimethoxysilylpropyl) dimethyloctadecyl ammonium chloride: 64 wt% methanol solution, Bailingwei technologies, Beijing;
3- (trimethoxysilylpropyl) dimethyltetradecylammonium chloride: 64 wt% methanol solution, Bailingwei technologies, Beijing;
3- (trimethoxysilylpropyl) dimethylhexadecylammonium chloride: 64 wt% methanol solution, Bailingwei technologies, Beijing;
potassium tetradecanol polyoxyethylene ether sulfate: chemical purity, Bailingwei technologies, Beijing;
potassium cetyl alcohol polyoxyethylene ether sulfate: chemical purity, Bailingwei technologies, Beijing;
potassium octadecanol polyoxyethylene ether sulfate: chemical purity, Bailingwei technologies, Beijing;
pine bark: industrial purity, sheng agriculture ltd, guangzhou city;
sodium hydroxide: chemical purity, Bailingwei technologies, Beijing;
the apparatus used mainly in the examples and comparative examples:
ultra-fine grinding machine: DMS-07, Qingdao Linrui precision machines, Inc.;
a high-pressure homogenizer: VMK163, shanghai brocade bamboo mechanical devices limited;
hot press: 4-size continuous flat press, difenbach, germany;
the performance and the dimensional stability of the plate are tested according to a method specified by the GB17657-2013 standard; the bonding strength, static bending strength, elastic modulus and bonding strength in the plate are detected by a universal tester AI-7000S of high-speed rail detection instrument, Inc. The constant temperature and humidity box used for the dimensional stability test is a GT7005 model constant temperature and humidity test box of a high-speed rail detection instrument Limited company. The density of the plate is detected by a section density detector DAX5000 of automatic detection and control equipment of Grakon, Inc.
Example 1
1. Preparation of adhesive B1 component
(1) And (3) inner crown grafting: 100kg of silica particles are dispersed with 500kg of water to give a suspension. This was added to a 25L solution of 3- (trimethoxysilylpropyl) dimethyloctadecyl ammonium chloride. The suspension was stirred at room temperature for 24 hours, and then the supernatant was discarded to obtain the intracoronary-coated silica.
(2) Self-assembly of the outer crown: 10.5 wt% of a tetradecanol polyoxyethylene ether potassium sulfate aqueous solution is prepared, and the pH is adjusted to 10.5. And (2) placing the silica coated with the inner crown and dispersed by stirring in a reaction kettle, adjusting the pH value to the same value, adding 37.8kg of a tetradecanol polyoxyethylene ether potassium sulfate aqueous solution, reacting at 70 ℃ for 24 hours to fully perform the reaction, then removing the solvent, washing the obtained product with methanol and water respectively, drying at 100 ℃ for 48 hours, and removing the residual solvent to obtain the double-crown layer silica composite material.
2. Preparation of adhesive B2 component
I. 100kg of pine bark was extracted with 1 wt% sodium hydroxide solution at 90 ℃ for 2h and the bark residue was treated with hot water washing for fibrillation.
The treated bark residue was soaked in de-watered (2 wt%) for 24 hours, then the bark was pulverised fibrillated using an ultra fine particle pulveriser, and then homogenized using a high pressure homogenizer at a pressure of 208MPa for 2 hours. And standing the homogenized suspension for 24 hours to settle solid matters, finally separating the upper layer and the lower layer of the suspension to obtain lower-layer solid matters, and drying to obtain the lignin wood material.
3. Preparation of adhesive B component
40 parts by mass of the B1 component and 60 parts by mass of the B2 component were dissolved in 100 parts by mass of water to obtain a 50 wt% solid content of the B component.
4. Preparation of routing fiberboard from isocyanate adhesive composite material
S1: wood chip treatment: and cutting the wood raw material by using a drum chipper to prepare the wood chips with the length of 21-26mm, the width of 15-20 mm and the thickness of 3-4 mm. Washing the wood chips, placing the washed wood chips at 90-98 ℃ for pre-cooking, and then cooking the wood chips in a cooking tank for 3 minutes under the conditions that the steam pressure is 0.7-0.8 MPa and the temperature is 160-165 ℃;
s2: preparing fibers: enabling the wood chips to enter a defibrator through a belt type screw, controlling the gap between grinding discs to be 0.28mm, and preparing wood fibers of 80-100 meshes, wherein the fiber separation yield is 18-20 tons/hour;
s3: sizing fiber: pumping the component A (Wanhua chemical CW20) into an inlet of a spraying pipe through a sizing pump, pumping the component B into an inlet of the spraying pipe through another sizing pump, spraying the component A and the component B on fibers through a high-pressure nozzle, and uniformly mixing the component A and the components B with the fibers; the glue application amount of the component A is 30kg/m3The glue application amount of the component B (pure solid content) is 11kg/m3。
S4: and (3) drying: drying for 10.0s after sizing, wherein the water content of the dried fiber is 8.5%;
s5: sorting: removing foreign matters such as rubber blocks, fiber clusters, fiber bundles and the like;
s6: paving and forming: mechanically paving the fibers, then pre-pressing the board blank at the pressure of 10.15-11.35 MPa, and trimming the board blank;
s7: hot pressing of the plate: the hot pressing temperatures of the first, second, third, fourth and fifth regions of the continuous flat pressing machine are set to 220-. Setting the hot pressing pressure corresponding to the first to fifth areas to be 31.5-33.0 MPa, 16.5-19.5 MPa, 3.0-4.0 MPa, 12.5-14.5 MPa and 5.3-5.8 MPa, and carrying out hot pressing on the pre-pressed plate blank with the hot pressing coefficient of 12 s/mm;
s8: plate post-treatment: and (3) placing the hot-pressed board in an indoor condition of 20-30 ℃ and 50-70% of relative humidity for 72h at constant temperature and humidity, sanding and polishing by a sander, and sawing to obtain the required medium-density fiberboard product.
The density of the plate is 775Kg/m3The proximal, intermediate and distal minimum/average densities were 91.5%, 90.8% and 91.3%, respectively.
The performance of the panels was tested and the results are shown in table 1.
Example 2
The main preparation process of this example is the same as example 1, and differs from example 1 as follows:
1. preparation of adhesive B1 component
(1) And (3) inner crown grafting: 100kg of silica particles are dispersed with 500kg of water to give a suspension. This was added to a 25L solution of 3- (trimethoxysilylpropyl) dimethyloctadecyl ammonium chloride. The suspension was stirred at room temperature for 20 hours, and then the supernatant was discarded to obtain the intracoronary-coated silica.
(2) Self-assembly of the outer crown: 10.5 wt% of a potassium cetyl polyoxyethylene ether sulfate aqueous solution was prepared and the pH was adjusted to 10. And (2) placing the silica coated with the inner crown and dispersed by stirring in a reaction kettle, adjusting the pH value to the same value, adding 33.6kg of a hexadecanol polyoxyethylene ether potassium sulfate aqueous solution, reacting at 60 ℃ for 20 hours to fully perform the reaction, then removing the solvent, washing the obtained product with methanol and water respectively, drying at 100 ℃ for 48 hours, and removing the residual solvent to obtain the double-crown layer silica composite material.
3. Preparation of adhesive B component
50 parts by mass of the B1 component and 50 parts by mass of the B2 component were dissolved in 178 parts by mass of water to obtain a 36 wt% solid content of the B component.
4. Preparation of routing fiberboard from isocyanate adhesive composite material
S3: sizing fiber: the glue application amount of the component A (Wanhua chemical CW20) is 31kg/m3The glue application amount (pure solid content) of the component B is 20kg/m3；
S4: and (3) drying the fiber: the moisture content of the dried fiber was 8.8%.
The density of the plate is 772Kg/m3The proximal, intermediate and distal minimum/average densities were 91.3%, 90.8% and 91.5%, respectively.
The performance of the panels was tested and the detailed results are shown in table 1.
Example 3
The main preparation process of this example is the same as example 1, and differs from example 1 as follows:
1. preparation of adhesive B1 component
(1) And (3) inner crown grafting: 100kg of silica particles are dispersed with 500kg of water to give a suspension. This was added to a 28L solution of 3- (trimethoxysilylpropyl) dimethylhexadecylammonium chloride. The suspension was stirred at room temperature for 20 hours, and then the supernatant was discarded to obtain the intracoronary-coated silica.
(2) Self-assembly of the outer crown: 10.5 wt% of a tetradecanol polyoxyethylene ether potassium sulfate aqueous solution was prepared and the pH was adjusted to 11. Placing the stirred and dispersed silica coated by the inner crown in a reaction kettle, adjusting the pH value to the same value, adding 37.8kg of a tetradecanol polyoxyethylene ether potassium sulfate aqueous solution, reacting for 20h at 65 ℃ to fully perform the reaction, then removing the solvent, washing the obtained product with methanol and water respectively, drying for 48h at 100 ℃, removing the residual solvent, and obtaining the double-crown layer silica composite material.
3. Preparation of adhesive B component
60 parts by mass of the B1 component and 40 parts by mass of the B2 component were dissolved in 150 parts by mass of water to obtain a 40 wt% solid content of the B component.
4. Preparation of routing fiberboard from isocyanate adhesive composite material
S3: sizing fiber: the glue application amount of the component A (Wanhua chemical CW20) is 38kg/m3The glue application amount (pure solid content) of the component B is 9.5kg/m3；
S4: and (3) drying the fiber: the moisture content of the dried fiber was 9.3%.
The density of the plate is 777Kg/m3The proximal, intermediate and distal minimum/average densities were 89.3%, 90.1% and 89.9%, respectively.
The performance of the panels was tested and the detailed results are shown in table 1.
Example 4
The main preparation process of this example is the same as example 1, and differs from example 1 as follows:
1. preparation of adhesive B1 component
(1) And (3) inner crown grafting: 100kg of silica particles are dispersed with 500kg of water to give a suspension. This was added to a solution of 23L of 3- (trimethoxysilylpropyl) dimethyltetradecylammonium chloride. The suspension was stirred at room temperature for 18h, and then the supernatant was discarded to obtain the coronally coated silica.
(2) Self-assembly of the outer crown: 10.5 wt% of a tetradecanol polyoxyethylene ether potassium sulfate aqueous solution was prepared, and the pH was adjusted to 8.5. And (2) placing the silica coated with the inner crown and dispersed by stirring in a reaction kettle, adjusting the pH value to the same value, adding 37.8kg of a tetradecanol polyoxyethylene ether potassium sulfate aqueous solution, reacting at 50 ℃ for 18h to fully perform the reaction, then removing the solvent, washing the obtained product with methanol and water respectively, drying at 100 ℃ for 48h, and removing the residual solvent to obtain the double-crown layer silica composite material.
3. Preparation of adhesive B component
45 parts by mass of the B1 component and 55 parts by mass of the B2 component were dissolved in 233 parts by mass of water to obtain a 30 wt% solid content of the B component.
4. Preparation of routing fiberboard from isocyanate adhesive composite material
S3: sizing fiber: the glue application amount of the component A (Wanhua chemical 9132FC) is 31kg/m3The glue application amount (pure solid content) of the component B is 10kg/m3；
S4: and (3) drying the fiber: the water content of the dried fiber is 9.5 percent;
s7: hot-press molding: the hot pressing coefficient was 11.5 s/mm.
The density of the plate is 772Kg/m3The proximal, middle and distal minimum/average densities were 91.3%, 90.2% and 90.4%, respectively.
The performance of the panels was tested and the detailed results are shown in table 1.
Example 5
The main preparation process of this example is the same as example 1, and differs from example 1 as follows:
1. preparation of adhesive B1 component
(1) And (3) inner crown grafting: 100kg of silica particles are dispersed with 500kg of water to give a suspension. This was added to a 23L solution of 3- (trimethoxysilylpropyl) dimethyloctadecyl ammonium chloride. The suspension was stirred at room temperature for 18h, and then the supernatant was discarded to obtain the coronally coated silica.
(2) Self-assembly of the outer crown: preparing 10.5 wt% of an aqueous solution of potassium stearyl polyoxyethylene ether sulfate and adjusting the pH value to 7. And (2) placing the silica coated with the inner crown and dispersed by stirring in a reaction kettle, adjusting the pH value to the same value, adding 37.8kg of octadecanol polyoxyethylene ether potassium sulfate aqueous solution, reacting at 55 ℃ for 18h to fully perform the reaction, then removing the solvent, washing the obtained product with methanol and water respectively, drying at 100 ℃ for 48h, and removing the residual solvent to obtain the double-crown layer silica composite material.
3. Preparation of adhesive B component
67 parts by mass of the B1 component and 33 parts by mass of the B2 component were dissolved in 426 parts by mass of water to obtain a 19 wt% solid content of the B component.
4. Preparation of routing fiberboard from isocyanate adhesive composite material
S3: sizing fiber: the glue application amount of the component A (Wanhua chemical CW30) is 35kg/m3The glue application amount (pure solid content) of the component B is 16kg/m3；
S4: and (3) drying the fiber: the moisture content of the dried fiber was 8.9%.
The density of the plate is 767Kg/m3The proximal, intermediate and distal minimum/average densities were 91.5%, 91% and 89.9%, respectively.
The performance of the panels was tested and the detailed results are shown in table 1.
Example 6
The main preparation process of this example is the same as example 1, and differs from example 1 as follows:
1. preparation of adhesive B1 component
(1) And (3) inner crown grafting: 100kg of silica particles are dispersed with 500kg of water to give a suspension. This was added to a 23L solution of 3- (trimethoxysilylpropyl) dimethyloctadecyl ammonium chloride. The suspension was stirred at room temperature for 16h and then the supernatant was discarded to give the coronally coated silica.
(2) Self-assembly of the outer crown: 10.5 wt% of a tetradecanol polyoxyethylene ether potassium sulfate aqueous solution was prepared, and the pH was adjusted to 9.5. Placing the stirred and dispersed silica coated by the inner crown in a reaction kettle, adjusting the pH value to the same value, adding 37.8kg of a tetradecanol polyoxyethylene ether potassium sulfate aqueous solution, reacting for 16h at 60 ℃ to fully perform the reaction, then removing the solvent, washing the obtained product with methanol and water respectively, drying for 48h at 100 ℃, removing the residual solvent, and obtaining the double-crown layer silica composite material.
3. Preparation of adhesive B component
32 parts by mass of the B1 component and 68 parts by mass of the B2 component were dissolved in 900 parts by mass of water to obtain a 10 wt% solid content of the B component.
4. Preparation of routing fiberboard from isocyanate adhesive composite material
S3: sizing fiber: the glue application amount of the component A (Wanhua chemical CW20) is 33kg/m3The glue application amount (pure solid content) of the component B is 13.5kg/m3；
S4: and (3) drying the fiber: the moisture content of the dried fiber was 7.5%.
The density of the plate is 773Kg/m3The proximal, middle and distal minimum/average densities were 91.0%, 88.5% and 87.6%, respectively.
The performance of the panels was tested and the detailed results are shown in table 1.
Example 7
The main preparation process of this example is the same as example 1, and differs from example 1 as follows:
1. preparation of adhesive B1 component
(1) And (3) inner crown grafting: 100kg of silica particles are dispersed with 500kg of water to give a suspension. This was added to a 25L solution of 3- (trimethoxysilylpropyl) dimethyloctadecyl ammonium chloride. The suspension was stirred at room temperature for 16h and then the supernatant was discarded to give the coronally coated silica.
(2) Self-assembly of the outer crown: 10.5 wt% of a tetradecanol polyoxyethylene ether potassium sulfate aqueous solution is prepared, and the pH is adjusted to 8. Placing the stirred and dispersed silica coated by the inner crown in a reaction kettle, adjusting the pH value to the same value, adding 37.8kg of a tetradecanol polyoxyethylene ether potassium sulfate aqueous solution, reacting for 16h at 70 ℃ to fully perform the reaction, then removing the solvent, washing the obtained product with methanol and water respectively, drying for 48h at 100 ℃, removing the residual solvent, and obtaining the double-crown layer silica composite material.
3. Preparation of adhesive B component
37 parts by mass of the B1 component and 63 parts by mass of the B2 component were dissolved in 122 parts by mass of water to obtain a 45 wt% solid content of the B component.
4. Preparation of routing fiberboard from isocyanate adhesive composite material
S3: sizing fiber: the glue application amount of the component A (Wanhua chemical CW20) is 37kg/m3The glue application amount (pure solid content) of the component B is 10.5kg/m3；
S4: and (3) drying the fiber: the moisture content of the dried fiber was 7.9%.
The density of the board is 794Kg/m3The proximal, middle and distal minimum/average densities were 87.5%, 90.7% and 89.9%, respectively.
The performance of the panels was tested and the detailed results are shown in table 1.
Comparative example 1
The main preparation process of this comparative example differs from example 1 as follows:
4. preparation of routing fiberboard from isocyanate adhesive composite material
S3: sizing fiber: the component B is not added;
s4: and (3) drying the fiber: the moisture content of the dried fiber was 9.4%.
The density of the plate is 769Kg/m3The proximal, intermediate and distal minimum/average densities were 88.7%, 90.3% and 91.5%, respectively.
The performance of the panels was tested and the detailed results are shown in table 1.
Comparative example 2
The main preparation process of this comparative example differs from example 1 as follows:
3. preparation of adhesive B component
100 parts by mass of the component B1 was dissolved in 100 parts by mass of water to obtain a 50 wt% solid content of the component B.
4. Preparation of routing fiberboard from isocyanate adhesive composite material
S3: sizing fiber: the glue application amount of the component A (Wanhua chemical CW20) is 33kg/m3The glue application amount (pure solid content) of the component B is 11kg/m3；
S4: and (3) drying the fiber: the moisture content of the dried fiber was 8.3%.
The density of the plate is 775Kg/m3The lowest density/average density at the near end, the middle end and the far end is 91.1 percent and 90.2 percent respectively、90.5％。
The performance of the panels was tested and the detailed results are shown in table 1.
Comparative example 3
The main preparation process of this comparative example differs from example 1 as follows:
3. preparation of adhesive B component
Dissolving 100 parts by mass of the component B2 in 100 parts by mass of water to obtain a component B with a solid content of 50 wt%;
4. preparation of routing fiberboard from isocyanate adhesive composite material
S3: sizing fiber: the glue application amount of the component A (Wanhua chemical CW20) is 34kg/m3The glue application amount (pure solid content) of the component B is 11kg/m3；
S4: and (3) drying the fiber: the moisture content of the dried fiber was 8.7%.
The density of the plate material is 782Kg/m3The proximal, intermediate and distal minimum/average densities were 91.5%, 90.3% and 90.8%, respectively.
The performance of the panels was tested and the detailed results are shown in table 1.
TABLE 1 comparison of sheet Properties
Figure BDA0002104074520000161
The comparison of the performances of the plate shows that after the component B is added in the embodiments 1 to 7, the hair phenomenon does not occur on the sections of various grooves by routing, the dimensional stability is obviously improved, and the bonding strength in the plate is slightly improved. Comparative example 1 no component B was added, and hair appeared more clearly on the milled cross-section, and the groove surface was rough. In comparative examples 2 and 3, the component B only contains the silica composite material with double canopy or the lignin wood material, and the hair phenomenon of different degrees also appears in the actual routing effect, which indicates that the most ideal effect can be achieved under the synergistic effect of the component B1 and the component B2. In conclusion, the fiberboard prepared by using the isocyanate adhesive of the double-crown silicon dioxide composite material and the lignin wood material has good routing performance and dimensional stability.

Claims (18)

1. The isocyanate adhesive composite material for the routing fiberboard is characterized by comprising a component A and a component B, wherein:
the component A is isocyanate and accounts for 60-80% of the solid content of the composite material;
the component B is an aqueous dispersion containing B1 and B2, and the solid content of the component B accounts for 20-40% of the solid content of the composite material;
the B1 is a double-canopy layer silicon dioxide composite material and accounts for 30-70% of the solid content of the B component dispersion liquid; the B2 is a lignin wood material and accounts for 30-70% of the solid content of the B component dispersion liquid;
wherein, the inner crown of B1 is organosilicon quaternary ammonium salt, and the outer crown is fatty alcohol polyoxyethylene ether sulfonate.
2. The adhesive composition according to claim 1, wherein the composition A accounts for 70-78% of the solid content of the composition;
the solid content of the component B water dispersion liquid accounts for 22-30% of the solid content of the composite material;
the B1 accounts for 40-60% of the solid content of the B component dispersion liquid; the B2 accounts for 40-60% of the solid content of the B component dispersion liquid.
3. The adhesive composition of claim 1, wherein the coping of B1 is one or more of 3- (trimethoxysilylpropyl) dimethyloctadecyl ammonium chloride, 3- (trimethoxysilylethyl) dimethyloctadecyl ammonium chloride, 3- (trimethoxysilylpropyl) dimethylhexadecyl ammonium chloride, and 3- (trimethoxysilylpropyl) dimethyldodecyl ammonium chloride.
4. The adhesive composition of claim 1, wherein the coping of B1 is 3- (trimethoxysilylpropyl) dimethyloctadecyl ammonium chloride.
5. The adhesive composition according to claim 1, wherein the outer crown of B1 is fatty alcohol-polyoxyethylene ether sulfonate with a polymerization degree n of 10-20.
6. The adhesive composition as claimed in claim 1, wherein the corona of B1 is one or more of potassium lauryl polyoxyethylene ether sulfonate, potassium tetradecanol polyoxyethylene ether sulfonate, potassium cetyl polyoxyethylene ether sulfonate and potassium stearyl polyoxyethylene ether sulfonate.
7. The adhesive composition as claimed in claim 1, wherein the crown of B1 is potassium tetradecanol polyoxyethylene ether sulfonate.
8. The adhesive composition according to any one of claims 1 to 7, wherein the preparation method of B1 comprises the following steps:
(1) and (3) inner crown grafting: dispersing silicon dioxide powder in water to obtain a suspension, adding the suspension into the inner crown solution, and removing a supernatant after reaction to obtain inner crown grafted silicon dioxide;
(2) self-assembly of the outer crown: preparing an outer crown aqueous solution and adjusting the pH value, placing the inner crown graft silicon dioxide particles which are stirred and dispersed in a reaction kettle, adding the outer crown solution to react after the pH value is adjusted to be the same, and washing, drying and removing residual solvent of a product to obtain the double-crown silicon dioxide composite material.
9. The adhesive composition as claimed in claim 8, wherein the solution of the coping in step (1) is methanol solution of the coping.
10. The adhesive composition according to claim 8, wherein the reaction temperature in the step (1) is room temperature, and the reaction time is 16-24 h.
11. The adhesive composition according to claim 8, wherein in the step (2), the reaction temperature is 50-70 ℃, and the reaction time is 16-24 h; adjusting the pH value to 7-11.
12. The adhesive composition according to any one of claims 1 to 7, wherein the component B is obtained by adding the component B1 and the component B2 into water and stirring and dispersing, and the solid content of the dispersion is 10-50 wt%.
13. The adhesive composition according to any one of claims 1 to 7, wherein the solid content of the B component dispersion is 30 to 45 wt%.
14. The adhesive composition of claim 1, wherein the isocyanate of component A is polymethylene polyphenyl polyisocyanate and/or its derivative.
15. The adhesive composition as claimed in claim 1, wherein the isocyanate component A is polymethylene polyphenyl polyisocyanate having NCO% of 29-32.8%, functionality of 2.9-3.3 and viscosity of 150-250cp (25 ℃), and/or derivatives thereof.
16. An aldehyde-free milled fiberboard prepared using the isocyanate adhesive composition of any one of claims 1-15.
17. The routed fiberboard of claim 16, wherein the amount of glue applied when preparing the routed fiberboard is: the component A is 30-40kg/m3The component B is 10-20kg/m in terms of solid content mass3。
18. The routed fiberboard of claim 16 or 17, wherein the moisture content of the dried fiber is controlled to be 7.8 to 10 wt% when the routed fiberboard is prepared.
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