CN110265578A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN110265578A CN110265578A CN201910569223.2A CN201910569223A CN110265578A CN 110265578 A CN110265578 A CN 110265578A CN 201910569223 A CN201910569223 A CN 201910569223A CN 110265578 A CN110265578 A CN 110265578A
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- inorganic layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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Abstract
The present invention relates to technical field of display panel, a kind of display panel and display device are disclosed.The display panel includes substrate and encapsulated layer.Substrate defines viewing area and the non-display area around viewing area setting.Encapsulated layer covers substrate setting.Wherein, dummy is embedded between the substrate in encapsulated layer or in encapsulated layer and non-display area.By the above-mentioned means, the present invention can improve the packaging effect of display panel encapsulated layer, in favor of the narrow frame design of display panel.
Description
Technical field
The present invention relates to technical field of display panel, more particularly to a kind of display panel and display device.
Background technique
Currently, active matrix type organic light emitting diode (Active Matrix Organic Light Emitting
Display, AMOLED) display has a vast market application.However, current displayer is limited to its encapsulation knot
The packaging effect of structure, the encapsulating structure of displayer frame region needs to have enough width, to avoid in AMOLED
The problem of leading to encapsulating structure peeling off phenomenon in the laser cutting process of display, inducing package failure.In this way, just
Cause the width of the frame region of displayer larger, is unfavorable for the narrow frame design of displayer.
Summary of the invention
In view of this, the invention mainly solves the technical problem of providing a kind of display panel and display device, it can
Improve the packaging effect of display panel encapsulated layer, in favor of the narrow frame design of display panel.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of display panel is provided, the display
Panel includes substrate and encapsulated layer.Substrate defines viewing area and the non-display area around viewing area setting.Encapsulated layer covering
Substrate setting.Wherein, dummy is embedded between the substrate in encapsulated layer or in encapsulated layer and non-display area.
In one embodiment of this invention, encapsulated layer include be cascading along the direction far from substrate it is first inorganic
Layer and the second inorganic layer, the first inorganic layer cover substrate setting；Wherein, between the first inorganic layer and the second inorganic layer or first
Dummy is embedded between substrate in inorganic layer and non-display area.
In one embodiment of this invention, between the first inorganic layer and the second inorganic layer or the first inorganic layer and non-display
It is arranged fluted between substrate in area, dummy is filled in groove.
In one embodiment of this invention, groove is located at the first inorganic layer close to the surface of the second inorganic layer；Or groove position
In the second inorganic layer close to the surface of the first inorganic layer；Or the part of groove is located at the first inorganic layer close to the table of the second inorganic layer
Face, and the remainder of groove is located at the second inorganic layer close to the surface of the first inorganic layer.
In one embodiment of this invention, display panel further includes dykes and dams, and dykes and dams are set in the non-display area of substrate, and first
Inorganic layer covers dykes and dams setting and groove is set between the first inorganic layer and dykes and dams；Wherein, groove is located at dykes and dams close to the first nothing
The surface of machine layer；Or groove is located at the first inorganic layer close to the surface of dykes and dams；Or the part of groove is located at dykes and dams close to the first nothing
The surface of machine layer, and the remainder of groove is located at the first inorganic layer close to the surface of dykes and dams.
In one embodiment of this invention, encapsulated layer, which is located at the definition of the part in non-display area, first edge protection zone,
The first inorganic layer in first edge protection zone directly covers substrate setting, and groove is set to the first nothing in first edge protection zone
Between machine layer and substrate；Wherein, groove is located at substrate close to the surface of the first inorganic layer；Or to be located at the first inorganic layer close for groove
The surface of substrate；Or the part of groove is located at substrate close to the surface of the first inorganic layer, and the remainder of groove is located at first
Inorganic layer is close to the surface of substrate.
In one embodiment of this invention, encapsulated layer, which is located at the definition of the part in non-display area, second edge protection zone,
Encapsulated layer in second edge protection zone includes at least two package blocks being spaced apart from each other, and package blocks directly contact substrate setting simultaneously
And it is formed between adjacent package blocks fluted.
In one embodiment of this invention, area of the package blocks close to the end of substrate is less than its end far from substrate
Area, so that the slot bottom area of groove is greater than its notch area.
In one embodiment of this invention, the material of dummy is photoresponse type self-repair material, force-responsive type selfreparing
At least one of material and thermal response-type self-repair material.
In order to solve the above technical problems, another technical solution that the present invention uses is: providing a kind of display device, this is aobvious
Showing device includes driving circuit and such as the display panel that above-described embodiment is illustrated, driving circuit couples display panel, is used for
Driving display panel realizes its display function.
The beneficial effects of the present invention are: be different from the prior art, the present invention provides a kind of display panel, in encapsulated layer,
Or dummy is embedded between the substrate in encapsulated layer and non-display area.In this way, in the laser cutting process of display panel
During causing defect to invade encapsulated layer inside, defect can encounter inbuilt dummy, and dummy can be in encapsulated layer
Defect is repaired, and defect can be prevented to continue to invade encapsulated layer, generates removing because of defect intrusion to reduce encapsulated layer
Degree, also mean that the packaging effect of display panel encapsulated layer is improved, allow for display panel be in it is non-display
Smaller width is designed in part in area, in favor of the narrow frame design of display panel.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets implementation of the invention
Example, and be used to explain the principle of the present invention together with specification.In addition, these attached drawings and verbal description are not intended to by appointing
Where formula limits the scope of the inventive concept, but illustrates by referring to specific embodiments for those skilled in the art of the invention
Concept.
Fig. 1 is that the invention shows the structural schematic diagrams of one embodiment of panel；
Fig. 2 is the structure of the setting form first embodiment of the groove between the first inorganic layer and the second inorganic layer of the invention
Schematic diagram；
Fig. 3 is the structure of the setting form second embodiment of the groove between the first inorganic layer and the second inorganic layer of the invention
Schematic diagram；
Fig. 4 is the structure of the setting form 3rd embodiment of the groove between the first inorganic layer and the second inorganic layer of the invention
Schematic diagram；
Fig. 5 is the structure of the setting form fourth embodiment of the groove between the first inorganic layer and the second inorganic layer of the invention
Schematic diagram；
Fig. 6 is the structural representation of the setting form first embodiment of the groove between the first inorganic layer and dykes and dams of the invention
Figure；
Fig. 7 is the structural representation of the setting form second embodiment of the groove between the first inorganic layer and dykes and dams of the invention
Figure；
Fig. 8 is the structural representation of the setting form 3rd embodiment of the groove between the first inorganic layer and dykes and dams of the invention
Figure；
Fig. 9 is the structural representation of the setting form first embodiment of the groove between the first inorganic layer and substrate of the invention
Figure；
Figure 10 is the structural representation of the setting form second embodiment of the groove between the first inorganic layer and substrate of the invention
Figure；
Figure 11 is the structural representation of the setting form 3rd embodiment of the groove between the first inorganic layer and substrate of the invention
Figure；
Figure 12 is the structural schematic diagram of one embodiment of the display device of that present invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the embodiment of the present invention, to this
Technical solution in inventive embodiments is clearly and completely described, it is clear that described embodiment is that a part of the invention is real
Example is applied, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creation
Property labour under the premise of every other embodiment obtained, shall fall within the protection scope of the present invention.In the absence of conflict, under
The feature in embodiment and embodiment stated can be combined with each other.
For the poor technical problem of packaging effect for solving display panel encapsulated layer in the prior art, an implementation of the invention
Example provides a kind of display panel, which includes substrate and encapsulated layer.Substrate definition has viewing area and around viewing area
The non-display area of setting.Encapsulated layer covers substrate setting.Wherein, the substrate in encapsulated layer or in encapsulated layer and non-display area it
Between be embedded with dummy.It is described in detail below.
In traditional display panel, it is limited to the encapsulation performance that the encapsulated layer of display panel has at present, is simultaneously
Guarantee that the encapsulated layer of display panel has enough encapsulation performances and packaging effect, to avoid the laser cutting of display panel
Journey leads to defect, and (including water oxygen, crackle etc., being specifically cut by laser process causes encapsulated layer to crack, and extraneous water oxygen
Along crackle can enter encapsulated layer) induce encapsulated layer removing (peeling) in intrusion encapsulated layer and the problem of package failure, it is necessary to
Encapsulated layer in display panel non-display area has enough width, this results in the envelope in its non-display area of conventional display panels
The width for filling layer is larger, limits the part that display panel is in non-display area and designs smaller width, is unfavorable for display panel
Narrow frame design.
In view of this, one embodiment of the invention provides a kind of display panel, in the presence of solving the above-mentioned prior art
The technical issues of.
Referring to Fig. 1, Fig. 1 is that the invention shows the structural schematic diagrams of one embodiment of panel.
In one embodiment, display panel includes substrate 1.Definition has viewing area 11 and around viewing area 11 on substrate 1
Non-display area 12.Viewing area 11 is the region of display panel luminescence display, and non-display area 12 is arranged around viewing area 11, non-
Viewing area 12 is without luminescence display.It is understood that viewing area 11 and non-display area 12 are located at the same side of substrate 1.
Display panel further includes encapsulated layer 3.Encapsulated layer 3 covers substrate 1 and is arranged.Preferably, it is fixed to cover substrate 1 for encapsulated layer 3
Justice has the one side of viewing area 11 and non-display area 12.Certainly, encapsulated layer 3 can also cover in other embodiments of the invention
Other surfaces of the substrate 1 in addition to definition has the side of viewing area 11 and non-display area 12, it is not limited here.
It should be noted that the substrate 1 of the present embodiment is defined as the functional film layer collection of the display panel below of encapsulated layer 3
It closes, for example including substrate, (if display panel is flexible display panels, substrate is flexible substrate, such as (Polyimide gathers PI
Acid imide) substrate etc.), buffer layer, interlayer dielectric layer, luminescent layer and the transistor array part of display panel etc..
In this example it is shown that defect caused by the laser cutting process of panel (including water oxygen, crackle etc.) can edge
It spreads, invaded inside encapsulated layer 3 between each film layer in encapsulated layer 3 or between encapsulated layer 3 and substrate 1.Defect sprawling,
Encapsulated layer 3 is invaded, peeling-off between peeling off phenomenon or encapsulated layer 3 and substrate 1 between the film layer of encapsulated layer 3, cause is caused
Make 3 package failure of encapsulated layer.
In view of this, being embedded between substrate 1 in the present embodiment in encapsulated layer 3 or in encapsulated layer 3 and non-display area 12
Functive 4, functive 4 is for encapsulation function needed for enhancing encapsulated layer 3.During defect invades 3 inside of encapsulated layer, defect
Inbuilt functive 4 between the substrate 1 in encapsulated layer 3 or in encapsulated layer 3 and non-display area 12 can be encountered, functive 4 can hinder
Only defect continues to invade encapsulated layer 3, to reduce the degree that encapsulated layer 3 generates removing because of defect intrusion, also means that aobvious
Show that the packaging effect of panel encapsulated layer 3 is improved, the part design for allowing for display panel to be in non-display area 12 is more
Small width, in favor of the narrow frame design of display panel.
It should be noted that functive 4 may include dummy, dummy has repair function, can be in encapsulated layer 3
Defect repaired, and then prevent defect continue sprawling, intrusion encapsulated layer 3；Functive 4 also may include water oxygen barrier bodies,
Water oxygen barrier bodies can obstruct water oxygen, to prevent to continue along the water oxygen that crackle invades sprawling, intrusion encapsulated layer 3；Certainly, functive
4 equally may include extinction body etc., and extinction body can absorb the laser of ultraviolet band or infrared band, i.e. extinction body can absorb
Laser used in the cutting action of display panel, so as to absorb the part that cutting laser used is radiated to encapsulated layer 3,
The structure for avoiding laser damage encapsulated layer, the defects of leading to water oxygen sprawling, intrusion encapsulated layer 3.It is understood that functive 4
It may include at least one of dummy, water oxygen barrier bodies and extinction body.
Specifically, when functive 4 selects dummy, the material of dummy is preferably photoresponse type self-repair material, power
At least one of response type self-repair material and thermal response-type self-repair material.Since laser is in the mistake of cutting display panel
Cheng Zhonghui will lead to encapsulated layer 3 and crack form to display panel transfer laser energy and heat, laser energy and heat
Defect is simultaneously spread in encapsulated layer 3, is invaded in encapsulated layer 3 so as to cause the defects of water oxygen by the defect of crackle form.Its
In, laser energy can induce photoresponse type self-repair material and repair to the defects of encapsulated layer 3, and heat can induce hot sound
Type self-repair material is answered to repair the defects of encapsulated layer 3, and (i.e. crackle form is scarce for the film layer tearing of encapsulated layer 3
Fall into) can also valence response type self-repair material defect is repaired.Defect is repaired, it will be able to defect be prevented to continue to invade
Enter to inside encapsulated layer 3, to reduce the degree that encapsulated layer 3 generates removing because of defect intrusion, also means that display panel
The packaging effect of encapsulated layer 3 is improved, and smaller width is designed in the part for allowing for display panel to be in non-display area 12
Degree, in favor of the narrow frame design of display panel.
The photoresponse type self-repair material, force-responsive type self-repair material and thermal response-type self-repair material of the present embodiment
It is specifically as follows polyurethane presoma, microcapsule polymer, hydrogen bond type polyethers thiocarbamide, shape-memory polymer (Shape
Memory Polymer, SMP, such as SMP epoxy resin etc.).And the photoresponse type self-repair material, force-responsive of the present embodiment
The presoma of type self-repair material and thermal response-type self-repair material is preferably based on Diels-Alder (diels-A Er
Moral) structure photocuring selfreparing polyurethane or microcapsule polymer (such as cycle pentadiene dimer and Ge Labu (Grubbs)
Catalyst disperses compound capsule).Suitable self-repair material can be selected to make in conjunction with different product demands and cutting technique
For functive 4.
When functive 4 selects water oxygen barrier bodies, the material of water oxygen barrier bodies is preferably SiNxOyOr porous montmorillonite etc..
The SiN of high nitrogen oxygen ratioxOyIt can play the role of improving the package strength of encapsulated layer 3, to prevent crackle in encapsulated layer 3 etc. from lacking
The defects of further to spreading inside encapsulated layer 3, capable of also preventing along the water oxygen of crackle intrusion encapsulated layer 3 is fallen into further to encapsulation
3 inside sprawling of layer, plays the role of obstructing water oxygen.And porous montmorillonite can absorb water oxygen, thus the defects of preventing water oxygen into
One step equally plays the role of obstructing water oxygen to spreading inside encapsulated layer 3.
When functive 4 selects extinction body, extinction body is preferably the micro-nano knot for having and absorbing ultraviolet light or infrared light function
At least one of structure or nano material, such as metal oxide, Titanium and graphene-based material etc..Functive 4 can
The energy for effectively absorbing cutting the used laser of display panel prevents laser energy further to invading inside display panel,
Destroy the internal structure (including encapsulated layer 3 etc.) of display panel.
Above as can be seen that display panel provided by the embodiment of the present invention, in encapsulated layer or encapsulated layer and non-aobvious
Show and is embedded with functive between the substrate in area.In this way, which the laser cutting process in display panel leads to defect intrusion envelope
During filling layer inside, defect can encounter inbuilt functive, functive for encapsulation function needed for enhancing encapsulated layer, with
Defect can be prevented to continue to invade encapsulated layer, to reduce the degree that encapsulated layer generates removing because of defect intrusion, also just meaned
The packaging effect of display panel encapsulated layer improved, the part design for allowing for display panel to be in non-display area is more
Small width, in favor of the narrow frame design of display panel.
Please continue to refer to Fig. 1.In one embodiment, encapsulated layer 3 includes being cascading along the direction far from substrate 1
First inorganic layer 31 and the second inorganic layer 32.First inorganic layer 31 covers substrate 1 and is arranged.First in viewing area 11 is inorganic
Layer 31 and second may further include that organic layer participates in composition encapsulated layer 3 between inorganic layer 32, and the be located in non-display area 12
It does not include organic layer, the first inorganic layer being typically situated in non-display area 12 between one inorganic layer 31 and the second inorganic layer 32
Both 31 and the second inorganic layer 32 directly contact.Certainly, in other embodiments of the invention, encapsulated layer 3 can also include more
More inorganic layers and organic layer alternates the encapsulating structure of stacking to form inorganic layer and organic layer.And in the present embodiment
The maximum limit while setting of first inorganic layer 31 and the second inorganic layer 32 enables to encapsulated layer 3 to have enough encapsulation performances
Encapsulated layer 3 is thinned to degree.
Further, between the first inorganic layer 31 and the second inorganic layer 32 or in the first inorganic layer 31 and non-display area 12
Substrate 1 between be arranged fluted 5, functive 4 is filled in groove 5.Groove 5 is located at the first inorganic layer 31 and the second inorganic layer
Between substrate 1 between 32, or in the first inorganic layer 31 and non-display area 12.The functive 4 filled in groove 5 can hinder
Only lacking between the substrate 1 between the first inorganic layer 31 and the second inorganic layer 32 or in the first inorganic layer 31 and non-display area 12
Further intrusion encapsulated layer 3 is fallen into, can be reduced between the first inorganic layer 31 and the second inorganic layer 32 or the first inorganic layer 31 and non-
The degree that film layer is removed between substrate 1 in viewing area 12.
In one embodiment, fluted 5 are arranged between the first inorganic layer 31 and the second inorganic layer 32, functive 4 is filled in
In groove 5.Groove 5 is located at the first inorganic layer 31 close to the surface of the second inorganic layer 32, as shown in Figure 2；Or groove 5 is located at second
Inorganic layer 32 is close to the surface of the first inorganic layer 31, as shown in Figure 3；Or the part of groove 5 is located at the first inorganic layer 31 close to
The surface of two inorganic layers 32, and the remainder of groove 5 is located at the second inorganic layer 32 close to the surface of the first inorganic layer 31, such as schemes
Shown in 4.
By the above-mentioned means, to bury functive 4, the first inorganic layer between the first inorganic layer 31 and the second inorganic layer 32
31 and the second defect between inorganic layer 32 can encounter the first inorganic layer 31 and the second nothing during invading 3 inside of encapsulated layer
The inbuilt functive 4 of institute between machine layer 32, functive 4 can prevent defect from continuing to invade encapsulated layer 3, so that it is inorganic to reduce first
The degree for generating removing between layer 31 and the second inorganic layer 32 because of defect intrusion, can improve the packaging effect of encapsulated layer 3.
Certainly, the part of above-mentioned groove 5 is located at the first inorganic layer 31 close to the surface of the second inorganic layer 32, and groove 5
Remainder is located at the case where the second inorganic layer 32 is close to the surface of the first inorganic layer 31, it is understood that is the first inorganic layer 31
It excessively fills and occurs excessive with the functive 4 on the second inorganic layer 32.Also, the cross sectional shape of groove 5 is not limited to rectangle, ladder
The regular figures such as shape or irregular figure, it is not limited here.It is equally applicable in following embodiments.
In one embodiment, groove 5 occupies the film layer space of 32 part of the first inorganic layer 31 and/or the second inorganic layer, with
Form the space for filling functive 4.That is, the first inorganic layer 31 and the second inorganic layer 32 are used to form groove 5
Part vacancy, and then form the space for filling functive 4.For example, the part of groove 5 is located at the first inorganic layer 31 and leans on
The surface of nearly second inorganic layer 32, and the remainder of groove 5 is located at the second inorganic layer 32 close to the surface of the first inorganic layer 31,
That is the part vacancy of groove 5 is used to form on both the first inorganic layer 31 and the second inorganic layer 32 surface close to each other, in turn
Form groove 5 to fill functive 4, as shown in Figure 4.
In this way, which functive 4 can not only prevent the defect between the first inorganic layer 31 and the second inorganic layer 32 from continuing
Invade encapsulated layer 3.The functive 4 that the groove 5 being arranged in the first inorganic layer 31 and the second inorganic layer 32 is filled equally can
The defect inside the first inorganic layer 31 and the second inorganic layer 32 is prevented to continue to invade encapsulated layer 3, further to improve encapsulated layer 3
Packaging effect.
In alternative embodiments, with above-described embodiment the difference is that groove 5 and prevent take up the first inorganic layer 31 and
The space of functive 4 is filled to be formed in the film layer space of second inorganic layer 32.Instead first inorganic layer 31 and second
The part that inorganic layer 32 is used to form groove 5 is integrally recessed, and then forms groove 5 to fill functive 4, and groove 5 is not worn
In the first inorganic layer 31 and the second inorganic layer 32.For example, the part of groove 5 is located at the first inorganic layer 31 close to second
The surface of inorganic layer 32, and the remainder of groove 5 is located at the second inorganic layer 32 close to the surface of the first inorganic layer 31, i.e., first
The part that groove 5 is used to form on both inorganic layer 31 and the second inorganic layer 32 surface close to each other is integrally recessed, and then shape
At groove 5 to fill functive 4, and groove 5 is not arranged in the first inorganic layer 31 and the second inorganic layer 32, as shown in Figure 5.
In this way, which inbuilt functive 4 can prevent defect from continuing between the first inorganic layer 31 and the second inorganic layer 32
Encapsulated layer 3 is invaded, to improve the packaging effect of encapsulated layer 3.And the first inorganic layer 31 and/or the second inorganic layer 32 be used to form it is recessed
The part of slot 5 forms groove 5 by way of being integrally recessed, so that the first inorganic layer 31 and second of 5 position of groove is inorganic
Effective package length of layer 32 increases, so that defect is prolonged along the path that the first inorganic layer 31 and the second inorganic layer 32 are invaded
It is long, so as to further improve the packaging effect of encapsulated layer 3.
Further, the part for being used to form groove 5 for the first inorganic layer 31 and the second inorganic layer 32 is integrally recessed, into
And groove 5 is formed to fill functive 4, and groove 5 is not arranged in the situation in the first inorganic layer 31 and the second inorganic layer 32,
The cross sectional shape of groove 5 is preferably trapezoid etc., i.e., the area of notch be less than slot bottom area, it is inorganic to further increase first
Effective package length of layer 31 and the second inorganic layer 32 extends defect along the road that the first inorganic layer 31 and the second inorganic layer 32 are invaded
Diameter, as shown in Figure 5.
Please continue to refer to Fig. 1.In one embodiment, display panel further includes dykes and dams 2, and dykes and dams 2 are located at the non-display of substrate 1
In area 12.Dykes and dams 2 are used for the preparation for assisting completing encapsulated layer 3, such as the barrier structure of organic layer in encapsulated layer 3, prevent
The organic material for being used to prepare organic layer is excessive etc..First inorganic layer 31 covers dykes and dams 2 and is arranged, and the first inorganic layer 31 and dike
Fluted 5 are arranged between dam 2, functive 4 is filled in groove 5.
Specifically, groove 5 is located at the first inorganic layer 31 close to the surface of dykes and dams 2, as shown in Figure 6；Or groove 5 is located at dykes and dams
2 close to the surface of the first inorganic layer 31, as shown in Figure 7；Or the part of groove 5 is located at the first inorganic layer 31 close to the table of dykes and dams 2
Face, and the remainder of groove 5 is located at dykes and dams 2 close to the surface of the first inorganic layer 31, as shown in Figure 8.
By the above-mentioned means, to bury functive 4, the first inorganic layer 31 and dike between the first inorganic layer 31 and dykes and dams 2
Defect between dam 2 can encounter the inbuilt function of institute between the first inorganic layer 31 and dykes and dams 2 during invading 3 inside of encapsulated layer
Energy body 4, functive 4 can prevent defect from continuing to invade encapsulated layer 3, to reduce between the first inorganic layer 31 and dykes and dams 2 because lacking
It falls into intrusion and generates the degree removed, the packaging effect of encapsulated layer 3 can be improved.
It is understood that the first inorganic layer 31 can be as described in above-described embodiment, groove 5 occupies the first inorganic layer 31
The film layer space divided, to form the space for filling functive 4；Or first inorganic layer 31 be used to form the part of groove 5
Whole recess, and then groove 5 is formed to fill functive 4, and groove 5 is not arranged in the first inorganic layer 31, herein just not
It repeats again.And the groove 5 formed on dykes and dams 2 then needs to occupy the space of dykes and dams 2, groove 5 shows as being arranged in dykes and dams 2.
Please continue to refer to Fig. 1.In one embodiment, encapsulated layer 3, which is located at the definition of the part in non-display area 12, the first side
Edge protection zone 33.Specifically, first edge protection zone 33 is with respect to dykes and dams 2 far from viewing area 11.First edge protection zone 33 is used for
Extend the encapsulation distance of viewing area 11 to display panel cutting line 6, so that the defect generated in encapsulated layer 3 caused by cutting
It needs just to reach viewing area 11 by longer path, to play a protective role to viewing area 11.First edge protection zone 33
The first interior inorganic layer 31 directly covers the setting of substrate 1, and groove 5 is set to 31 He of the first inorganic layer in first edge protection zone 33
Between substrate 1 and it is filled with functive 4.
Specifically, in first edge protection zone 33, groove 5 is located at the first inorganic layer 31 close to the surface of substrate 1, such as schemes
Shown in 9；Or groove 5 is located at substrate 1 close to the surface of the first inorganic layer 31, as shown in Figure 10；Or the part of groove 5 is located at first
Inorganic layer 31 is close to the surface of substrate 1, and the remainder of groove 5 is located at substrate 1 close to the surface of the first inorganic layer 31, such as schemes
Shown in 11.
By the above-mentioned means, in the first inorganic layer 31 in first edge protection zone 33 and embedded function between substrate 1
Body 4, process of the defect between the first inorganic layer 31 and substrate 1 inside intrusion encapsulated layer 3 in first edge protection zone 33
In can encounter between the first inorganic layer 31 and substrate 1 the inbuilt functive 4 of institute, functive 4 can prevent defect from continuing intrusion envelope
Layer 3 is filled, to reduce the first inorganic layer 31 in first edge protection zone 33 and generate removing because of defect intrusion between substrate 1
Degree, the packaging effect of encapsulated layer 3 can be improved.
It is understood that the first inorganic layer 31 can be as described in above-described embodiment, groove 5 occupies the first inorganic layer 31
The film layer space divided, to form the space for filling functive 4；Or first inorganic layer 31 be used to form the part of groove 5
Whole recess, and then groove 5 is formed to fill functive 4, and groove 5 is not arranged in the first inorganic layer 31, herein just not
It repeats again.And the groove 5 formed on substrate 1 then needs to occupy the space of substrate 1, groove 5 shows as being arranged in substrate 1.
Please continue to refer to Fig. 1.In one embodiment, the part that encapsulated layer 3 is located in non-display area 12 there is also defined second
Edge-protected area 34.Specifically, second edge protection zone 34 with respect to dykes and dams 2 far from viewing area 11, and second edge protection zone
34 also opposite first edge protection zones 33 are far from viewing area 11.Wherein, the cutting of the closely display panel of second edge protection zone 34
Line 6, second edge protection zone 34 are the cutting trough in display panel.
Encapsulated layer 3 in second edge protection zone 34 includes at least two package blocks 341 being spaced apart from each other, package blocks 341
Directly contact substrate 1.The package blocks 341 being spaced apart from each other can effectively prevent defect caused by cutting display panel along encapsulated layer
3 intrusion display panels, have the function that protection.Groove 5 is formed between adjacent package blocks 341, for filling functive 4.It cuts
Groove 5 and therein can be encountered by cutting when defect caused by display panel intrudes into the encapsulated layer 3 of second edge protection zone 34
Functive 4, and then defect can be prevented to continue to invade encapsulated layer 3.
Certainly, the substrate 1 between adjacent package blocks 341 can also accordingly be recessed, to participate in forming groove 5, herein
Without limitation.
Further, package blocks 341 are less than the area of its end far from substrate 1 close to the area of the end of substrate 1, with
The slot bottom area of groove 5 is set to be greater than its notch area, i.e. the cross sectional shape of groove 5 is preferably trapezoid, and fills in groove 5
Functive 4, functive 4 can be thermal response-type self-repair material etc..The package blocks 341 being spaced apart from each other are by interrupting encapsulated layer 3
Mode formed, and cross sectional shape is the groove 5 of trapezoid, has the effect of good interrupting encapsulated layer 3；And it cuts aobvious
Show that panel causes package blocks 341 are heated to generate defect, heated melt of thermal response-type self-repair material repairs defect, thus
It prevents defect from continuing to invade encapsulated layer 3 along defect intrusion path, improves the packaging effect of encapsulated layer 3.
It should be noted that can be set in encapsulated layer 3 or between encapsulated layer 3 and substrate 1 in non-display area 12
One or more grooves 5, and the depth of groove 5 is preferably 1~3 μm, such as 1.5 μm, 2 μm, 2.5 μm etc., is not limited herein
It is fixed.
Based on described above, groove 5 is preferably arranged through the first inorganic layer 31 and the second inorganic layer 32, and groove 5
It is middle to fill full functive 4.Groove 5 be set to dykes and dams on, between adjacent embankments, in first edge protection zone 33 and second edge protect
It protects in area 34, as shown in Figure 1.In this way, the first inorganic layer 31 and interior, the first inorganic layer 31 of the second inorganic layer 32 and the second nothing
Between machine layer 32, between the first inorganic layer 31 and substrate 1 and the defect between the first inorganic layer 31 and dykes and dams 2 intrusion seal
Functive 4 can be encountered during dress layer 3, functive 4 can prevent defect from continuing to invade encapsulated layer 3, to reduce encapsulated layer 3
The degree of removing is generated because of defect intrusion, and then improves the packaging effect of encapsulated layer 3.
In conclusion display panel provided by the embodiment of the present invention, in encapsulated layer or encapsulated layer and non-display area
Functive is embedded between interior substrate.In this way, which the laser cutting process in display panel causes defect to invade encapsulated layer
In internal process, defect can encounter inbuilt functive, and functive is for encapsulation function needed for enhancing encapsulated layer, with can
It prevents defect from continuing to invade encapsulated layer, to reduce the degree that encapsulated layer generates removing because of defect intrusion, also means that aobvious
Show that the packaging effect of panel encapsulated layer is improved, the part design for allowing for display panel to be in non-display area is smaller
Width, in favor of the narrow frame design of display panel.
Figure 12 is please referred to, Figure 12 is the structural schematic diagram of one embodiment of the display device of that present invention.
In one embodiment, display device 7 includes driving circuit 71 and display panel 72.The coupling display of driving circuit 71
Panel 72, for driving display panel 72 to realize its display function.Wherein, the display panel 72 of the present embodiment is above-described embodiment
Described in display panel, details are not described herein again.
In addition, in the present invention unless specifically defined or limited otherwise, the arts such as term " connected ", " connection ", " stacking "
Language shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be direct phase
Even, can also indirectly connected through an intermediary, the interaction that can be connection or two elements inside two elements is closed
System.For the ordinary skill in the art, above-mentioned term in the present invention specific can be understood as the case may be
Meaning.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of display panel, which is characterized in that the display panel includes:
Substrate, the substrate define viewing area and the non-display area around viewing area setting；
Encapsulated layer, the encapsulated layer cover the substrate setting；
Wherein, dummy is embedded between the substrate in the encapsulated layer or in the encapsulated layer and the non-display area.
2. display panel according to claim 1, which is characterized in that the encapsulated layer includes along the side far from the substrate
To the first inorganic layer and the second inorganic layer being cascading, first inorganic layer covers the substrate setting；
Wherein, between first inorganic layer and second inorganic layer or in first inorganic layer and the non-display area
The substrate between be embedded with the dummy.
3. display panel according to claim 2, which is characterized in that first inorganic layer and second inorganic layer it
Between or first inorganic layer and the non-display area in the substrate between be arranged fluted, the dummy is filled in
In the groove.
4. display panel according to claim 3, which is characterized in that
The groove is located at first inorganic layer close to the surface of second inorganic layer；Or
The groove is located at second inorganic layer close to the surface of first inorganic layer；Or
The part of the groove is located at first inorganic layer close to the surface of second inorganic layer, and the residue of the groove
Part is located at second inorganic layer close to the surface of first inorganic layer.
5. display panel according to claim 3, which is characterized in that the display panel further includes dykes and dams, the dykes and dams
In the non-display area of the substrate, first inorganic layer covers the dykes and dams setting and the groove set on described
Between first inorganic layer and the dykes and dams；
Wherein, the groove is located at the dykes and dams close to the surface of first inorganic layer；Or
The groove is located at first inorganic layer close to the surface of the dykes and dams；Or
The part of the groove is located at the dykes and dams close to the surface of first inorganic layer, and the remainder quartile of the groove
In first inorganic layer close to the surface of the dykes and dams.
6. display panel according to claim 3, which is characterized in that the encapsulated layer is located at the portion in the non-display area
Definition is divided to have first edge protection zone, first inorganic layer in the first edge protection zone directly covers the substrate and sets
It sets, the groove is set between first inorganic layer and the substrate in the first edge protection zone；
Wherein, the groove is located at the substrate close to the surface of first inorganic layer；Or
The groove is located at first inorganic layer close to the surface of the substrate；Or
The part of the groove is located at the substrate close to the surface of first inorganic layer, and the remainder quartile of the groove
In first inorganic layer close to the surface of the substrate.
7. display panel according to claim 3, which is characterized in that the encapsulated layer is located at the portion in the non-display area
Point definition has a second edge protection zone, and the encapsulated layer in the second edge protection zone includes at least two being spaced apart from each other
Package blocks, the package blocks directly contact and are formed with the groove between the substrate setting and the adjacent package blocks.
8. display panel according to claim 7, which is characterized in that face of the package blocks close to the end of the substrate
Product is less than the area of its end far from the substrate, so that the slot bottom area of the groove is greater than its notch area.
9. display panel according to any one of claims 1 to 8, which is characterized in that the material of the dummy rings for light
Answer at least one of type self-repair material, force-responsive type self-repair material and thermal response-type self-repair material.
10. a kind of display device, which is characterized in that the display device includes that driving circuit and such as claim 1 to 9 are any
Display panel described in, the driving circuit couples the display panel, for driving the display panel to realize its display
Function.
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| CN201910569223.2A CN110265578B (en) | 2019-06-27 | 2019-06-27 | Display panel and display device |
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|---|---|---|---|
| CN201910569223.2A CN110265578B (en) | 2019-06-27 | 2019-06-27 | Display panel and display device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107180923A (en) * | 2017-07-20 | 2017-09-19 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof and display device |
| CN108899437A (en) * | 2018-07-06 | 2018-11-27 | 京东方科技集团股份有限公司 | Oled device and its manufacturing method |
| CN109216424A (en) * | 2018-09-18 | 2019-01-15 | 京东方科技集团股份有限公司 | A kind of flexible display substrates protective film and flexible base board |
| CN109616506A (en) * | 2018-12-18 | 2019-04-12 | 武汉华星光电半导体显示技术有限公司 | It is displayed in full screen panel and preparation method thereof |
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2019
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107180923A (en) * | 2017-07-20 | 2017-09-19 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof and display device |
| CN108899437A (en) * | 2018-07-06 | 2018-11-27 | 京东方科技集团股份有限公司 | Oled device and its manufacturing method |
| CN109216424A (en) * | 2018-09-18 | 2019-01-15 | 京东方科技集团股份有限公司 | A kind of flexible display substrates protective film and flexible base board |
| CN109616506A (en) * | 2018-12-18 | 2019-04-12 | 武汉华星光电半导体显示技术有限公司 | It is displayed in full screen panel and preparation method thereof |
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