CN110252590A - A kind of point glue equipment of novel pipe cap - Google Patents
A kind of point glue equipment of novel pipe cap Download PDFInfo
- Publication number
- CN110252590A CN110252590A CN201910409409.1A CN201910409409A CN110252590A CN 110252590 A CN110252590 A CN 110252590A CN 201910409409 A CN201910409409 A CN 201910409409A CN 110252590 A CN110252590 A CN 110252590A
- Authority
- CN
- China
- Prior art keywords
- pipe cap
- dispenser
- point glue
- glue equipment
- fixedly installed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
Abstract
The present invention relates to pipe cap production fields, disclose a kind of point glue equipment of novel pipe cap, including pipe cap placement plate and dispenser；The upside of pipe cap placement plate offers several groups pipe cap placing groove in rectanglar arrangement, the bottom end of dispenser is communicated with dispensing bar, the bottom of dispensing bar is communicated with syringe needle, the outer diameter of syringe needle is set as 0.5mm, the side of dispensing bar is fixedly installed semiconductor cooler, and semiconductor cooler includes cooling fin, cool guiding block and cooling piece；Cooling fin and cooling piece are connected to the two sides up and down of cool guiding block, and one end of cooling fin is communicated to the top of syringe needle by temperature transfer tube.The invention has the advantages that plastic emitting is uniform, and it is high-quality, it is practical.
Description
Technical field
The present invention relates to pipe cap production field, the point glue equipment of specifically a kind of novel pipe cap.
Background technique
In pipeline field, pipe cap with more and more extensive, demand is also being continuously increased.Pipe cap is in pipeline field
Effect be also not limited to pipe plugging, various novel effect pipe caps come into being.
It is raw that Chinese patent (notification number: 102896470 A of CN, the day for announcing: 2013.01.30) discloses a kind of pipe cap with hole
Production. art is pressed into pipe cap using steel pipe, according to pipe cap with hole size, material requirement, suitable tubing is selected to carry out blanking, if
Blanking material base outer diameter is greater than pipe cap outer diameter, needs to carry out variable diameter processing to material base, then carries out heat treatment and compression moulding.The hair
Bright to solve conventionally produced pipe cap with hole, pipe cap outer arc wall thickness is difficult to control, and pipe cap shape does not reach requirement, material use
The problems such as rate is low, and production efficiency is low, high production cost.But the production technology does not have function for dispensing glue to pipe cap, nowadays
Existing pipe cap point glue equipment has that plastic emitting is of poor quality, and plastic emitting is uneven in the market, to seriously affect colloid after pipe cap point
Amount.
Summary of the invention
It is mentioned above in the background art to solve the purpose of the present invention is to provide a kind of point glue equipment of novel pipe cap
Problem.
To achieve the above object, the invention provides the following technical scheme: a kind of point glue equipment of novel pipe cap, including pipe cap
Placement plate and dispenser；The upside of pipe cap placement plate offers several groups pipe cap placing groove in rectanglar arrangement, pipe cap placing groove
Inside is placed with to pipe cap ontology for dispensing glue, and the bottom end of dispenser is communicated with dispensing bar, and the bottom of dispensing bar is communicated with syringe needle, needle
The outer diameter of head is set as 0.5mm, greatly improves the uniformity of plastic emitting.The side of dispensing bar is fixedly installed semiconductor refrigerating
Device, semiconductor cooler include cooling fin, cool guiding block and cooling piece；Cooling fin and cooling piece are connected to the upper and lower of cool guiding block
The upper surface two sides of two sides, cooling piece connect DC power supply by conducting wire, determine dissipating by changing the polarity of DC current
Refrigeration or heating are realized on backing, one end of cooling fin is communicated to the top of syringe needle by temperature transfer tube.By semiconductor system
Cooler carries out temperature control to syringe needle, to guarantee the consistency of plastic emitting quality.
As a further solution of the present invention: the bottom of pipe cap placement plate is fixedly installed with two groups of suckers, the setting of sucker
The stability of pipe cap placement plate bottom can be enhanced.
As a further solution of the present invention: extension board, extension board upper surface are fixedly installed on the left of pipe cap placement plate
Fixed placement has elevator, and the top output port of elevator is provided with elevating lever, and starting elevator drives elevating lever to move up and down.
As a further solution of the present invention: the top of elevating lever is fixedly installed with sliding seat, sliding seat by support rod
Front side be fixedly installed with the first cylinder, the output end of the first cylinder is provided with First piston bar, and the end of First piston bar is solid
Dingan County is equipped with the dispenser mounting base parallel with sliding seat outer surface, and the first cylinder of starting drives First piston bar to be moved forward and backward,
And then dispenser mounting base is driven to be moved forward and backward.
As a further solution of the present invention: being fixedly installed sliding rail in the middle part of the side of dispenser mounting base, slided on sliding rail
Dynamic to be connected with the sliding slot being provided with inside fixed block, one end of fixed block is fixedly mounted on the link block for being fixed on dispenser top
On, by the back-and-forth motion of dispenser mounting base, so that entire dispenser be driven to be moved forward and backward.Elevating lever is driven by elevator
It moves up and down, so that sliding seat be driven to move up and down, and then drives dispenser to move up and down and carry out dispensing operation.
As a further solution of the present invention: the right end of sliding seat is equipped with the second cylinder, the second cylinder by support plate
Side be provided with second piston bar, the end of second piston bar is connected on dispenser by connecting rod, passes through the second cylinder
It drives second piston bar to move left and right, and then the sliding slot at the top of dispenser is driven to horizontally slip on the slide rail.
As further scheme of the invention: the lower surface of the semiconductor cooler is provided with water-cooling head, water-cooling head
Bottom be placed with heat-dissipating pipe, the setting of water-cooling head can reduce the semiconductor cooler internal heat generated at work, heat dissipation
The setting of pipe further increases the efficiency of water-cooling head heat dissipation for accelerating the temperature leak inside water-cooling head.
Compared with prior art, the beneficial effects of the present invention are: being connected directly in the upper surface two sides of cooling piece by conducting wire
Then galvanic electricity source changes the polarity of DC current to determine to realize refrigeration or heating on a heat sink, one end of cooling fin passes through
Temperature transfer tube is communicated to the top of syringe needle.Temperature control is carried out to syringe needle by semiconductor cooler, to guarantee colloid out
The consistency of amount；By setting 0.5mm for the outer diameter of syringe needle, the uniformity of plastic emitting is greatly improved；It is radiated by setting
Pipe and water-cooling head further increase the efficiency of water-cooling head heat dissipation.The invention has the advantages that plastic emitting is uniform, high-quality, practicability
By force.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of embodiment one in a kind of point glue equipment of novel pipe cap.
Fig. 2 is the structural schematic diagram of semiconductor cooler in a kind of point glue equipment of novel pipe cap.
Fig. 3 is the attachment structure schematic diagram of sliding slot and sliding rail in a kind of point glue equipment of novel pipe cap.
Fig. 4 is the overlooking structure diagram of pipe cap placement plate in a kind of point glue equipment of novel pipe cap.
Fig. 5 is the overlooking structure diagram of dispenser in a kind of point glue equipment of novel pipe cap.
Fig. 6 is the structural schematic diagram of embodiment two in a kind of point glue equipment of novel pipe cap.
Wherein: pipe cap placement plate 10, sucker 11, extension board 12, elevator 13, elevating lever 14, support rod 15, sliding seat
16, dispenser mounting base 17, sliding rail 18, link block 19, dispenser 20, dispensing bar 21, syringe needle 22, semiconductor cooler 23, temperature
Degree transfer tube 24, cooling fin 25, cool guiding block 26, cooling piece 27, water-cooling head 28, heat-dissipating pipe 29, sliding slot 30, the first cylinder 31, the
One piston rod 32, fixed block 33, pipe cap placing groove 34, pipe cap ontology 35, the second cylinder 36, second piston bar 37, connecting rod 38.
Specific embodiment
The technical solution of the patent is explained in further detail With reference to embodiment.
Embodiment one
Please refer to Fig. 1-5, a kind of point glue equipment of novel pipe cap, including pipe cap placement plate 10 and dispenser 20；Pipe cap placement plate
10 bottom is fixedly installed with two groups of suckers 11, and the setting of sucker 11 can enhance the stability of 10 bottom of pipe cap placement plate.Pipe cap
The upside of placement plate 10 offers several groups pipe cap placing groove 34 in rectanglar arrangement, and the inside of pipe cap placing groove 34 is placed with to point
The pipe cap ontology 35 of glue.The left side of pipe cap placement plate 10 is fixedly installed with extension board 12, and 12 upper surface fixed placement of extension board has
Elevator 13, the top output port of elevator 13 are provided with elevating lever 14, and starting elevator 13 drives elevating lever 14 to move up and down.
The top of elevating lever 14 is fixedly installed with sliding seat 16 by support rod 15, and the front side of sliding seat 16 is fixedly installed with the first cylinder
31, the output end of the first cylinder 31 is provided with First piston bar 32, and the end of First piston bar 32 is fixedly installed with and sliding seat
The parallel dispenser mounting base 17 in 16 outer surfaces, the first cylinder 31 of starting drives First piston bar 32 to be moved forward and backward, and then drives
Dispenser mounting base 17 is moved forward and backward.It is fixedly installed sliding rail 18 in the middle part of the side of dispenser mounting base 17, is slided on sliding rail 18
It is connected with the sliding slot 30 being provided with inside fixed block 33, one end of fixed block 33, which is fixedly mounted on, is fixed on 20 top of dispenser
On link block 19, by the back-and-forth motion of dispenser mounting base 17, so that entire dispenser 20 be driven to be moved forward and backward.Pass through lifting
Machine 13 drives elevating lever 14 to move up and down, so that sliding seat 16 be driven to move up and down, and then drive dispenser 20 move up and down into
Row dispensing operation.The right end of sliding seat 16 is equipped with the second cylinder 36 by support plate, and the side of the second cylinder 36 is provided with
The end of two piston rods 37, second piston bar 37 is connected on dispenser 20 by connecting rod 38, is driven by the second cylinder 36
Second piston bar 37 moves left and right, and then the sliding slot 30 at 20 top of dispenser is driven to horizontally slip on sliding rail 18.Dispenser 20
Bottom end be communicated with dispensing bar 21, the bottom of dispensing bar 21 is communicated with syringe needle 22, and the outer diameter of the syringe needle 22 is set as 0.5mm,
Greatly improve the uniformity of plastic emitting.The side of dispensing bar 21 is fixedly installed semiconductor cooler 23, semiconductor cooler
23 include cooling fin 25, cool guiding block 26 and cooling piece 27；Cooling fin 25 and cooling piece 27 are connected to the upper and lower of cool guiding block 26
The upper surface two sides of two sides, cooling piece 27 connect DC power supply by conducting wire, are determined by changing the polarity of DC current
Refrigeration or heating are realized on cooling fin 25, one end of cooling fin 25 is communicated to the top of syringe needle 22 by temperature transfer tube 24.It is logical
It crosses semiconductor cooler 23 and temperature control is carried out to syringe needle 22, to guarantee the consistency of plastic emitting quality.
The working principle of the invention is: by that will be placed in pipe cap placing groove 34 to pipe cap ontology 35 for dispensing glue, then
Start the glue that semiconductor cooler 23 controls inside syringe needle 22 to stablize, be moved before and after then controlling syringe needle 22 by the first cylinder 31
It is dynamic, drive second piston bar 37 to move left and right by the second cylinder 36, and then drive the sliding slot 30 at 20 top of dispenser in sliding rail
It horizontally slips on 18, syringe needle 22 is subsequently controlled by elevator 13 and moves up and down progress dispensing operation.
Embodiment two
Refering to Fig. 6, on the basis of example 1, the lower surface of the semiconductor cooler 23 is provided with water-cooling head 28, water cooling
First 28 bottom is placed with heat-dissipating pipe 29, and the setting of water-cooling head 28 can reduce that semiconductor cooler 23 is internal at work to be generated
Heat, the setting of heat-dissipating pipe 29 further increase the effect of the heat dissipation of water-cooling head 28 for accelerating the temperature leak inside water-cooling head 28
Rate.
The preferred embodiment of the patent is described in detail above, but this patent is not limited to above-mentioned embodiment party
Formula within the knowledge of one of ordinary skill in the art can also be under the premise of not departing from this patent objective
It makes a variety of changes.
Claims (8)
1. a kind of point glue equipment of novel pipe cap, including pipe cap placement plate (10) and dispenser (20)；Pipe cap placement plate (10)
Upside offers several groups pipe cap placing groove (34) in rectanglar arrangement, which is characterized in that the bottom end connection of dispenser (20) is a little
Glue bar (21), the bottom of dispensing bar (21) are communicated with syringe needle (22), and the outer diameter of syringe needle (22) is set as 0.5mm, dispensing bar (21)
Side be fixedly installed semiconductor cooler (23), semiconductor cooler (23) include cooling fin (25), cool guiding block (26) and
Cooling piece (27)；Cooling fin (25) and cooling piece (27) are connected to the two sides up and down of cool guiding block (26), cooling fin (25)
One end is communicated to the top of syringe needle (22) by temperature transfer tube (24).
2. a kind of point glue equipment of novel pipe cap according to claim 1, which is characterized in that the bottom of pipe cap placement plate (10)
Portion is fixedly installed with two groups of suckers (11).
3. a kind of point glue equipment of novel pipe cap according to claim 1 or 2, which is characterized in that pipe cap placement plate (10)
Left side be fixedly installed with extension board (12), extension board (12) upper surface fixed placement has elevator (13), elevator (13)
Top output port is provided with elevating lever (14).
4. a kind of point glue equipment of novel pipe cap according to claim 3, which is characterized in that the top of elevating lever (14) is logical
It crosses support rod (15) to be fixedly installed with sliding seat (16), be fixedly installed on front side of sliding seat (16) the first cylinder (31), first
The output end of cylinder (31) is provided with First piston bar (32), and the end of First piston bar (32) is fixedly installed with and sliding seat
(16) the parallel dispenser mounting base (17) in outer surface.
5. a kind of point glue equipment of novel pipe cap according to claim 4, which is characterized in that dispenser mounting base (17)
It is fixedly installed sliding rail (18) in the middle part of side, is slidably connected on sliding rail (18) and be provided with the internal sliding slot of fixed block (33)
(30), one end of fixed block (33) is fixedly mounted on the link block (19) for being fixed on dispenser (20) top.
6. a kind of point glue equipment of novel pipe cap according to claim 5, which is characterized in that the right end of sliding seat (16) is logical
It crosses support plate to be equipped with the second cylinder (36), the side of the second cylinder (36) is provided with second piston bar (37), second piston bar
(37) end is connected on dispenser (20) by connecting rod (38).
7. a kind of point glue equipment of novel pipe cap according to claim 1, which is characterized in that semiconductor cooler (23)
Lower surface is provided with water-cooling head (28).
8. a kind of point glue equipment of novel pipe cap according to claim 7, which is characterized in that put the bottom of water-cooling head (28)
It is equipped with heat-dissipating pipe (29).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910409409.1A CN110252590A (en) | 2019-05-16 | 2019-05-16 | A kind of point glue equipment of novel pipe cap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910409409.1A CN110252590A (en) | 2019-05-16 | 2019-05-16 | A kind of point glue equipment of novel pipe cap |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110252590A true CN110252590A (en) | 2019-09-20 |
Family
ID=67913283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910409409.1A Pending CN110252590A (en) | 2019-05-16 | 2019-05-16 | A kind of point glue equipment of novel pipe cap |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110252590A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0282748B1 (en) * | 1987-03-16 | 1991-03-13 | Siemens Aktiengesellschaft | Apparatus for the dosed application of an adhesive |
| CN102054892A (en) * | 2009-11-10 | 2011-05-11 | 上海空间电源研究所 | Ultrathin spatial solar battery gluing and encapsulating mechanism |
| CN102671813A (en) * | 2012-04-27 | 2012-09-19 | 陈明 | Colloid body conveying mechanism |
| CN206613668U (en) * | 2017-03-14 | 2017-11-07 | 珠海桑贝思精密科技有限公司 | Washing machine knob process equipment |
| CN208810481U (en) * | 2018-09-18 | 2019-05-03 | 闻泰通讯股份有限公司 | Dispenser |
-
2019
- 2019-05-16 CN CN201910409409.1A patent/CN110252590A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0282748B1 (en) * | 1987-03-16 | 1991-03-13 | Siemens Aktiengesellschaft | Apparatus for the dosed application of an adhesive |
| CN102054892A (en) * | 2009-11-10 | 2011-05-11 | 上海空间电源研究所 | Ultrathin spatial solar battery gluing and encapsulating mechanism |
| CN102671813A (en) * | 2012-04-27 | 2012-09-19 | 陈明 | Colloid body conveying mechanism |
| CN206613668U (en) * | 2017-03-14 | 2017-11-07 | 珠海桑贝思精密科技有限公司 | Washing machine knob process equipment |
| CN208810481U (en) * | 2018-09-18 | 2019-05-03 | 闻泰通讯股份有限公司 | Dispenser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190920 |
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| RJ01 | Rejection of invention patent application after publication |