CN110238279A - A kind of quality intelligent monitoring stamping die - Google Patents
A kind of quality intelligent monitoring stamping die Download PDFInfo
- Publication number
- CN110238279A CN110238279A CN201910466344.4A CN201910466344A CN110238279A CN 110238279 A CN110238279 A CN 110238279A CN 201910466344 A CN201910466344 A CN 201910466344A CN 110238279 A CN110238279 A CN 110238279A
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- CN
- China
- Prior art keywords
- foil gauge
- temperature
- compensating plate
- balance weight
- personal computer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C51/00—Measuring, gauging, indicating, counting, or marking devices specially adapted for use in the production or manipulation of material in accordance with subclasses B21B - B21F
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The invention discloses a kind of quality intelligents to monitor stamping die, it include: that pressure detecting module includes the first foil gauge, the second foil gauge, the first temperature-compensating plate and second temperature compensating plate, first foil gauge, second foil gauge, first temperature-compensating plate and the second temperature compensating plate are connected using half-bridge;First foil gauge, second foil gauge, first temperature-compensating plate and the second temperature compensating plate are evenly arranged in lower balance weight side wall;The pressure detecting module is connect with industrial personal computer, and the industrial personal computer is for acquiring data and obtaining mould punching force by the data operation.Quality intelligent of the invention monitors stamping die, and the precision for detecting stamping press is higher, and is able to achieve the intellectual monitoring to stamping press.
Description
Technical field
The present invention relates to stamping die fields, monitor stamping die more particularly to a kind of quality intelligent.
Background technique
As shown in Figure 1, general stamping die includes the upper die holder 1 and lower die holder 2 being oppositely arranged, it is provided on upper die holder 1
Cavity plate is provided with punch-pin on lower die holder 2, and lower balance weight 2a is provided with around punch-pin and the lower balance weight 2a is arranged in lower die
On seat 2, the lower surface of upper die holder 1 is provided with the upper balance weight 1a being oppositely arranged with lower balance weight 2a, when upper mold 1 and lower die 2 are closed
When mould, the upper surface of upper balance weight 1a is bonded with the lower surface of lower balance weight 2a.Upper balance weight and lower balance weight are in stamping die
Assist formation effect has been gone up, has been mounted on die joint, shares clamping pressure.On stretch pressing mold, upper die holder and lower die holder
Between be provided with blank holder, blank holder is looped around around the punch-pin, and the lower surface of blank holder is arranged in upper balance weight at this time.
CN103317025B discloses a kind of intelligent pressure detection pressurization stamping die, using pre-buried in punch-pin and cavity plate
Pressure sensor detects pressure.It needs to be machined out mold due to installing pressure sensor in mold, increases punching
The unreliability and unstability of pressure, machining accuracy difficulty are protected, and then influence pressure testing results.In addition, due to pressure
Sensor needs the pressure by mold, so the material requirements to sensor is higher.Stamping die is mainly used in sheet metal component
The manufacturing, the state for monitoring mold and stamping equipment is a task of intelligent Manufacturing Technology.Automobile production is automatic at present
The high feature of change degree, the quality of mold tooling and service life just seem quite important, and mold tooling is in production maintenance at present
Be primarily present: maintenance frequency is more under mold line, the time is long, and mold repair is costly, and die life is short, the current fortune of mold tooling
The problems such as monitoring missing of row state.Since the stamping press of monitoring mold plays important work to the quality-monitoring of stamping products
With, therefore it is higher for the required precision of stamping press detection.
Since the temperature of automobile metal plate work mold in forming process can constantly change, temperature will affect automobile stamping
The quality of part, so being also required to be monitored the temperature of the punching course of automobile die.
Therefore those skilled in the art are dedicated to developing a kind of stamping press detection accuracy height, monitor more accurate quality intelligent
Monitor stamping die.
Summary of the invention
In view of the above drawbacks of the prior art, technical problem to be solved by the invention is to provide a kind of detections of stamping press
Precision is high, monitors more accurate quality intelligent monitoring stamping die.
To achieve the above object, the present invention provides a kind of quality intelligents to monitor stamping die, comprising:
Pressure detecting module includes the first foil gauge, the second foil gauge, the first temperature-compensating plate and second temperature compensating plate,
First foil gauge, second foil gauge, first temperature-compensating plate and the second temperature compensating plate use half-bridge
Connection;First foil gauge, second foil gauge, first temperature-compensating plate and the second temperature compensating plate are uniform
It is pasted onto lower balance weight side wall;
The pressure detecting module is connect with industrial personal computer, and the industrial personal computer is for acquiring data and by the data operation
Obtain mould punching force.
Preferably, first foil gauge, first temperature-compensating plate, second foil gauge and the second temperature
The input terminal and output end of compensating plate are sequentially connected end to end;Have between first foil gauge and the second temperature compensating plate
The anode connection of first terminals, first terminals and power supply, second foil gauge and first temperature are mended
Repaying has the second terminals between piece, second terminals are connect with the cathode of the power supply;First foil gauge and institute
Stating has third terminals between the first temperature-compensating plate, the anode of the third terminals and output voltage connects, and described the
There is the 4th terminals, the cathode of the 4th terminals and output voltage between two foil gauges and the second temperature compensating plate
Connection.
Preferably, the operational formula of the mould punching force F are as follows:
Wherein, E: lower balance weight elasticity modulus is a definite value;
ε: to strain,
D: the diameter of balance weight;
K: the sensitivity coefficient of foil gauge;
ε1: the strain of the first foil gauge;
ε2: the strain of the second foil gauge;
The initial resistivity value of R1: the first foil gauge;
The initial resistivity value of R2: the second foil gauge;
The initial resistivity value of R3: the first temperature-compensating plate;
R4: the initial resistivity value of second temperature compensating plate;
The R1: the first foil gauge of Δ generates resistance value increment in punching course;
The R2: the second foil gauge of Δ generates resistance value increment in punching course;
ΔRT: the resistance value increment that the first temperature-compensating plate and second temperature compensating plate are generated due to the variation of temperature.
Preferably, the industrial personal computer opens report when the industrial personal computer detects that mould punching force is greater than or equal to 145 ton hours
Alarm device.
Preferably, being provided with thermal infrared imager on the outside of the lower die holder, the thermal infrared imager is for detecting the lower die
The temperature of seat;The height of the thermal infrared imager between the height of the upper die holder and the range of the height of the lower die holder,
The thermal infrared imager is connect with the industrial personal computer.
Preferably, when the industrial personal computer detects the temperature of the lower die holder more than or equal to 50 degree, the industrial personal computer
Open the warning device.
Preferably, the lower balance weight on the lower die holder is provided with the pressure detecting module.
Preferably, being provided with the pressure detecting module on the lower balance weight of part, it is provided with the pressure detecting mould
The lower balance weight of block is uniformly distributed on the lower die seat.
Preferably, first foil gauge, second foil gauge, first temperature-compensating plate and the second temperature
The axial dimension along lower balance weight of compensating plate is less than the axial dimension of lower balance weight.
The beneficial effects of the present invention are: quality intelligent of the invention monitors stamping die, the pressure detecting module knot of setting
Structure is simple;Foil gauge is affixed on to the outer wall of lower die holder balance weight, is not required to be machined out mold, has ensured the integrality of mold
With the stability of detection process;The deflection that balance weight is measured by foil gauge acquires related data with industrial personal computer and is located
Mould punching force is obtained after reason, detection mould punching force precision is high;Due to balance weight in punching course vulnerable to vibration, foil gauge
Using half-bridge downlink connection, to guarantee linear property, accuracy and the anti-interference of the signal measured;Before guaranteeing mold integrality
It puts, the health status of the Life cycle of mold can be perceived, to the detection of mould punching force and temperature so as to intelligence
The realization of energy manages and maintains mold.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of stamping die.
Fig. 2 is the structural schematic diagram of embodiment of the invention quality intelligent monitoring stamping die.
Fig. 3 is the module map of embodiment of the invention quality intelligent monitoring stamping die.
Fig. 4 is the structural schematic diagram of embodiment of the invention pressure detecting module.
Specific embodiment
Present invention will be further explained below with reference to the attached drawings and examples:
As shown in Figures 2 to 4, the embodiment of the invention discloses a kind of quality intelligents to monitor stamping die, comprising: pressure inspection
Surveying module includes the first foil gauge r1, the second foil gauge r2, the first temperature-compensating plate r3 and second temperature compensating plate r4, and first answers
Become piece r1, the second foil gauge r2, the first temperature-compensating plate r3 to connect with second temperature compensating plate r4 using half-bridge.First foil gauge
R1, the second foil gauge r2, the first temperature-compensating plate r3 and second temperature compensating plate r4 are uniformly pasted onto lower balance weight 2a side wall.The
One temperature-compensating plate is for compensating the first foil gauge, and second temperature compensating plate is for compensating the second foil gauge.First foil gauge r1
It is consistent with the direction in the direction pasted the second foil gauge r2 and stamping press.When punching press, since lower balance weight is by upper mold
Stamping press, lower balance weight can deform, and the first foil gauge and the second foil gauge can also deform and generate its deformation
The resistance value of electric signal, the first foil gauge and the second foil gauge can change, and bridge output voltage value is caused to change.Due to
The temperature for the balance weight that lower balance weight will lead to by the stamping press of upper mold rises, and since temperature rises, will lead to foil gauge
In addition to because resistance change occurs for deformation, also to increase because of temperature causes the resistance value of foil gauge to increase, influence, which measures, is answered
The precision of change, therefore the first temperature-compensating plate of setting and second temperature compensating plate are respectively used to counteracting the first foil gauge and second and answer
Become piece to be affected by temperature.
In the present embodiment, at least one lower balance weight is provided with pressure detecting module.In other embodiments, lower die holder
Lower balance weight on 2 is provided with pressure detecting module.In other embodiments, pressure inspection is provided on the lower balance weight 2a in part
Module is surveyed, the lower balance weight 2a for being provided with pressure detecting module is evenly distributed on lower die holder 2.On partly or entirely lower balance weight
Pressure detecting module is set, there is the lower balance weight institute of pressure detecting module by the logical operation module calculating and setting in industrial personal computer
The average value for the stamping press being subject to keeps the punching press force value measured more acurrate, and precision is higher.In certain embodiments, on lower die holder 2
With 10 lower balance weight 2a, wherein being provided with pressure detecting module on 6 lower balance weight 2a and being evenly distributed on lower die holder 2
On.
In the present embodiment, digital analog converter 5 is provided in industrial personal computer 6, data-signal is converted to mould by digital analog converter 5
Quasi- signal, is presented industrial personal computer by the analog signal of relational graph or temperature variations between stamping press and strain
On display screen on industrial personal computer, be conducive to industrial personal computer and mould punching force is monitored, facilitates the observation of technical staff.
In the present embodiment, pressure detecting module is connect with industrial personal computer 6.Industrial personal computer 6 can be used for acquiring pressure detecting mould
Related data on block, and related data is constantly calculated into mould punching force by logical operation module, then pass through digital-to-analogue conversion
Device is converted, so that the analog signal of treated mould punching force is presented on the display screen of industrial personal computer by industrial personal computer, is had
Mould punching force is monitored conducive to industrial personal computer, facilitates the observation of operator.
In the present embodiment, thermal infrared imager 7 is provided on the outside of lower die holder 2, thermal infrared imager 7 is for detecting lower die holder 2
Temperature;The height of thermal infrared imager 7 is between the height of upper die holder 1 and the range of the height of lower die holder 2, thermal infrared imager 7
It is connect with industrial personal computer 6.By on collected data feedback to industrial personal computer, industrial personal computer will be counted thermal infrared imager by digital analog converter
It is believed that number analog signal is converted to, the monitoring and operation to be presented on the display screen of industrial personal computer, convenient for industrial personal computer to temperature
The observation of member.
In the present embodiment, the first foil gauge r1, the first temperature-compensating plate r3, the second foil gauge r2 and second temperature compensation
The input terminal and output end of piece r4 is sequentially connected end to end, and has first to connect between the first foil gauge r1 and second temperature compensating plate r4
Line end 4e, the first terminals 4e and power supply U.Anode connection, have between the second foil gauge r2 and the first temperature-compensating plate r3
Second terminals 4f, the second terminals 4f and power supply U.Cathode connection, the first foil gauge r1 and the first temperature-compensating plate r3 it
Between have third terminals 4h, third terminals 4h and output voltage UyAnode connection, the second foil gauge r2 and second temperature
There is the 4th terminals 4g, the 4th terminals 4g and output voltage U between compensating plate r4yCathode connection.
In the present embodiment, the first foil gauge r1, the first temperature-compensating plate r3, the second foil gauge r2 and second temperature compensation
The resistance value of the original state of piece r4 is equal.In order to calculate mould punching force, industrial personal computer acquires the number in pressure detecting module
According to include the first foil gauge resistance value R1 increment and/or the second foil gauge resistance value R2 increment, the first temperature-compensating plate
The increment of the resistance value R4 of resistance value R3 and/or second temperature compensating plate, supply voltage U., output voltage Uy.In other implementations
In example, the original state of the first foil gauge r1, the first temperature-compensating plate r3, the second foil gauge r2 and second temperature compensating plate r4
Resistance value is unequal.
In the present embodiment, the operational formula of mould punching force F are as follows:
Wherein, E: lower balance weight elasticity modulus is a definite value;
ε: to strain,
D: the diameter of balance weight;
K: the sensitivity coefficient of foil gauge;
ε1: the strain of the first foil gauge;
ε2: the strain of the second foil gauge;
The initial resistivity value of R1: the first foil gauge;
The initial resistivity value of R2: the second foil gauge;
The initial resistivity value of R3: the first temperature-compensating plate;
R4: the initial resistivity value of second temperature compensating plate;
The R1: the first foil gauge of Δ generates resistance value increment in punching course;
The R2: the second foil gauge of Δ generates resistance value increment in punching course;
ΔRT: the resistance value increment that the first temperature-compensating plate and second temperature compensating plate are generated due to the variation of temperature.
In the present embodiment, the first foil gauge r1 and the second foil gauge r2 is identical foil gauge.First temperature-compensating plate
R3 and second temperature compensating plate r4 is identical temperature-compensating plate.
In the present embodiment, when industrial personal computer 6 detects that mould punching force is greater than or equal to 145 ton hours, industrial personal computer 6 opens report
Alarm device 8.When industrial personal computer 6 detects the temperature of lower die holder 2 more than or equal to 50 degree, 6 open alarming device 8 of industrial personal computer.Report
Alarm device need to shut down in time for reminding operator abnormal conditions occur and carry out maintenance to mold.
In the present embodiment, the first foil gauge r1, the second foil gauge r2, the first temperature-compensating plate r3 and second temperature compensation
The axial dimension along lower balance weight 2a of piece r4 is less than the axial dimension of lower balance weight 2a.It prevents due to the first foil gauge r1,
Two foil gauge r2, the first temperature-compensating plate r3 and second temperature compensating plate r4 are directly contacted with the balance weight of upper die holder, are improved and are surveyed
The precision of amount.
Quality intelligent of the invention monitors stamping die, pastes foil gauge and temperature in the outer wall of the lower balance weight of lower die holder
Compensating plate, temperature-compensating plate are affected by temperature for dummy gauge, are acquired related data by industrial personal computer and are transported
Calculation obtains stamping press, and on the reality screen being shown on industrial personal computer, intellectual monitoring management is simultaneously safeguarded in time.Infrared heat is set
As temperature of the instrument to lower die holder is monitored, convenient for monitoring the generation of abnormal conditions, management of the intelligent realization to mold in time
And maintenance.Pressure detecting module and thermal infrared imager, which is arranged, simultaneously can be monitored die pressure and temperature, Jin Erke
To perceive the health status of the Life cycle of mold.
Quality intelligent of the invention monitors stamping die, and the pressure detecting modular structure of setting is simple;Foil gauge is affixed on
The outer wall of lower die holder balance weight is not required to be machined out mold, has ensured the integrality of mold and the stability of detection process;
The deflection that balance weight is measured by foil gauge obtains mould punching force with industrial personal computer acquisition related data and after being handled,
It is high to detect mould punching force precision;Due to balance weight in punching course vulnerable to vibration, foil gauge uses half-bridge downlink connection, to protect
Demonstrate,prove linear property, accuracy and the anti-interference of the signal measured;Under the premise of guaranteeing mold integrality, to mould punching force with
And the detection of temperature can perceive the health status of the Life cycle of mold, the management so as to intelligent realization to mold
And maintenance.
The preferred embodiment of the present invention has been described in detail above.It should be appreciated that those skilled in the art without
It needs creative work according to the present invention can conceive and makes many modifications and variations.Therefore, all technologies in the art
Personnel are available by logical analysis, reasoning, or a limited experiment on the basis of existing technology under this invention's idea
Technical solution, all should be within the scope of protection determined by the claims.
Claims (9)
1. a kind of quality intelligent monitors stamping die, it is characterized in that: including:
Pressure detecting module includes the first foil gauge (r1), the second foil gauge (r2), the first temperature-compensating plate (r3) and the second temperature
It spends compensating plate (r4), first foil gauge (r1), second foil gauge (r2), first temperature-compensating plate (r3) and institute
Second temperature compensating plate (r4) is stated to connect using half-bridge;First foil gauge (r1), second foil gauge (r2), described
One temperature-compensating plate (r3) and the second temperature compensating plate (r4) are uniformly pasted onto lower balance weight (2a) side wall;
The pressure detecting module is connect with industrial personal computer (6), and the industrial personal computer (6) is for acquiring data and being transported by the data
Calculation obtains mould punching force.
2. quality intelligent as described in claim 1 monitors stamping die, it is characterized in that: first foil gauge (r1), described
The input terminal and output end of first temperature-compensating plate (r3), second foil gauge (r2) and the second temperature compensating plate (r4)
It is sequentially connected end to end;There are the first terminals between first foil gauge (r1) and the second temperature compensating plate (r4)
(4e), first terminals (4e) and power supply (U.) anode connection, second foil gauge (r2) and described first
There is the second terminals (4f) between temperature-compensating plate (r3), second terminals (4f) and the power supply (U.) cathode connect
It connects;There is third terminals (4h) between first foil gauge (r1) and first temperature-compensating plate (r3), the third
Terminals (4h) and output voltage (Uy) anode connection, second foil gauge (r2) and the second temperature compensating plate (r4)
Between there is the 4th terminals (4g), the 4th terminals (4g) and output voltage (Uy) cathode connection.
3. quality intelligent as claimed in claim 2 monitors stamping die, it is characterized in that: the operation of the mould punching force F is public
Formula are as follows:
Wherein, E: lower balance weight elasticity modulus is a definite value;
ε: to strain,
D: the diameter of balance weight;
K: the sensitivity coefficient of foil gauge;
ε1: the strain of the first foil gauge;
ε2: the strain of the second foil gauge;
The initial resistivity value of R1: the first foil gauge;
The initial resistivity value of R2: the second foil gauge;
The initial resistivity value of R3: the first temperature-compensating plate;
R4: the initial resistivity value of second temperature compensating plate;
The R1: the first foil gauge of Δ generates resistance value increment in punching course;
The R2: the second foil gauge of Δ generates resistance value increment in punching course;
ΔRT: the resistance value increment that the first temperature-compensating plate and second temperature compensating plate are generated due to the variation of temperature.
4. quality intelligent as described in claim 1 monitors stamping die, it is characterized in that: when the industrial personal computer (6) detect mould
Have stamping press and is greater than or equal to 145 ton hours, industrial personal computer (6) open alarming device (8).
5. quality intelligent as claimed in claim 4 monitors stamping die, it is characterized in that: being provided on the outside of the lower die holder (2)
Thermal infrared imager (7), the thermal infrared imager (7) are used to detect the temperature of the lower die holder (2);The thermal infrared imager (7)
Height between the height of the upper die holder (1) and the range of the height of the lower die holder (2), the thermal infrared imager (7)
It is connect with the industrial personal computer (6).
6. quality intelligent as claimed in claim 5 monitors stamping die, it is characterized in that: when the industrial personal computer (6) detect institute
When stating the temperature of lower die holder (2) more than or equal to 50 degree, the industrial personal computer (6) opens the warning device (8).
7. quality intelligent as described in claim 1 monitors stamping die, it is characterized in that: the lower balance on the lower die holder (2)
Block is provided with the pressure detecting module.
8. quality intelligent as described in claim 1 monitors stamping die, it is characterized in that: setting on the lower balance weight (2a) of part
Be equipped with the pressure detecting module, be provided with the pressure detecting module the lower balance weight (2a) be evenly distributed on it is described under
On die holder (2).
9. quality intelligent as described in claim 1 monitors stamping die, it is characterized in that: first foil gauge (r1), described
Second foil gauge (r2), first temperature-compensating plate (r3) and the second temperature compensating plate (r4) along lower balance weight (2a)
Axial dimension be less than lower balance weight (2a) axial dimension.
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CN201910466344.4A CN110238279A (en) | 2019-05-31 | 2019-05-31 | A kind of quality intelligent monitoring stamping die |
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