CN110233926A - Power management method and electronic device - Google Patents

Power management method and electronic device Download PDF

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Publication number
CN110233926A
CN110233926A CN201810177770.1A CN201810177770A CN110233926A CN 110233926 A CN110233926 A CN 110233926A CN 201810177770 A CN201810177770 A CN 201810177770A CN 110233926 A CN110233926 A CN 110233926A
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CN
China
Prior art keywords
power
electronic device
heat source
temperature
predetermined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201810177770.1A
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Chinese (zh)
Inventor
汪威定
潘颖轩
李翰林
萧志远
胡哲铨
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MediaTek Inc
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MediaTek Inc
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Priority to CN201810177770.1A priority Critical patent/CN110233926A/en
Publication of CN110233926A publication Critical patent/CN110233926A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
    • H04M1/724—User interfaces specially adapted for cordless or mobile telephones
    • H04M1/72448—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions
    • H04M1/72454—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions according to context-related or environment-related conditions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W52/00—Power management, e.g. TPC [Transmission Power Control], power saving or power classes
    • H04W52/04—TPC
    • H04W52/18—TPC being performed according to specific parameters
    • H04W52/22—TPC being performed according to specific parameters taking into account previous information or commands
    • H04W52/228—TPC being performed according to specific parameters taking into account previous information or commands using past power values or information
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W52/00—Power management, e.g. TPC [Transmission Power Control], power saving or power classes
    • H04W52/04—TPC
    • H04W52/18—TPC being performed according to specific parameters
    • H04W52/28—TPC being performed according to specific parameters using user profile, e.g. mobile speed, priority or network state, e.g. standby, idle or non transmission
    • H04W52/288—TPC being performed according to specific parameters using user profile, e.g. mobile speed, priority or network state, e.g. standby, idle or non transmission taking into account the usage mode, e.g. hands-free, data transmission, telephone
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W52/00—Power management, e.g. TPC [Transmission Power Control], power saving or power classes
    • H04W52/04—TPC
    • H04W52/30—TPC using constraints in the total amount of available transmission power
    • H04W52/36—TPC using constraints in the total amount of available transmission power with a discrete range or set of values, e.g. step size, ramping or offsets
    • H04W52/367—Power values between minimum and maximum limits, e.g. dynamic range

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Environmental & Geological Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)

Abstract

The present invention provides a kind of power management methods and electronic device for electronic device.The electronic device includes multiple heat sources.The power management method is the following steps are included: determine whether be likely to reduce using associated user experience on the electronic device with reference at least one of the temperature of the electronic device, power and operation scenario；And, if it is determined that being likely to reduce using associated user experience on the electronic device, then the power budget between multiple heat source is distributed, avoids enter into the electronic device or delay into heat regulation mode, thus, it is possible to provide good overall customer experience.

Description

Power management method and electronic device
Technical field
The present invention relates to power budgets to distribute (power budget allocation), and more specifically it relates to a kind of Power management method and relevant electronic device, for according on the electronic device using associated user experience (user Experience, UX) it whether will be sustainable (sustain) selectively to distribute multiple heat sources of the electronic device Power budget between (heat source).
Background technique
The decline of performance caused by overheating in order to prevent, traditional electronic device can be more than predetermined thermal in the temperature of electronic device Enter thermal conditioning (or protection) mode (thermal throttling mode) when threshold value.For example, working as the circuit board of electronic device Temperature be more than predetermined thermal threshold value when, trigger thermal conditioning.
However, prematurely carrying out thermal conditioning will lead to and electronics when multiple circuit units of electronic device operate simultaneously Reducing or being deteriorated using associated user experience on device.For example, being performed simultaneously game application and charging in electronic device In the case where process, the temperature of circuit board is increased rapidly, and the temperature of the circuit board, which rises, (executes trip from central processing unit Play application) and charging circuit (execute charging process) temperature rising, and, the temperature of circuit board is rapidly reached predetermined thermal threshold Value.Therefore, electronic device early (earlier) will adjust or reduce (throttle) central processing unit (central Processing unit, CPU) power, this will lead to user visual experience decline.
Therefore, it is necessary to a kind of novel power management mechanisms to solve the above problems.
Summary of the invention
In view of this, one of the objects of the present invention is to provide a kind of power management method and relevant electronic device, with It solves the above problems.
According to an embodiment of the invention, providing a kind of illustrative power management method for electronic device.The electricity Sub-device includes multiple heat sources, and multiple heat source is used to execute the application on the electronic device, and, the power management method packet It includes: being determined with reference at least one of the temperature of the electronic device, power and operation scenario and the application on the electronic device Whether associated user experience, which is likely to, reduces；And, however, it is determined that go out the user experience and be likely to reduce, then distributes multiple Power budget between heat source makes the electronic device avoid enter into or delay into heat regulation mode.
According to an embodiment of the invention, providing a kind of illustrative electronic device.The illustrative electronic device includes Multiple heat sources and system power distributor circuit.System power distributor circuit is used for temperature, power and behaviour with reference to the electronic device Make at least one of scene to determine whether be likely to reduce using associated user experience on the electronic device；If Determine that the user experience is likely to reduce, then distribute the power budget between multiple heat source, make the electronic device avoid into Enter or delays into heat regulation mode.
Whether above-mentioned technical proposal is likely to reduce on electronic device by determination using associated user experience Power budget between the multiple heat sources of (in other words, if will be sustainable) selectively to distribute electronic device, makes this Electronic device is avoided enter into or is delayed into heat regulation mode, thus, it is possible to provide good overall customer experience.
Those skilled in the art, can be beyond all doubt after the following detailed descriptions for reading preferred embodiment shown in attached drawing Ground understands object of the present invention and other purposes.Detailed description will provide in the following embodiments with reference to attached drawing.
Detailed description of the invention
By reading subsequent detailed description and with reference to attached drawing the examples given, the present invention can be more fully understood, Wherein:
Fig. 1 shows a kind of exemplary electronic device according to embodiments of the present invention；
Fig. 2 is the schematic diagram for showing a kind of implementation of electronic device shown in FIG. 1；
Fig. 3 shows circuit caused by electronic device shown in Fig. 2 is distributed using power budget according to embodiments of the present invention The variation of plate temperature and frame rate；
Fig. 4 shows a kind of exemplary system associated with power budget shown in Fig. 3 distribution according to embodiments of the present invention The schematic diagram of system power；
Fig. 5 shows the variation of circuit board temperature and power consumption in electronic device shown in Fig. 2 according to embodiments of the present invention；
Fig. 6 is a kind of flow chart of exemplary power management method for electronic device according to an embodiment of the present invention；
Fig. 7 is a kind of flow chart of exemplary power management method for electronic device of the embodiment of the present invention；
Fig. 8 is a kind of embodiment of electronic device shown in FIG. 1；
Fig. 9 be the system power distributor circuit shown in Fig. 8 that shows according to embodiments of the present invention using illustrative methods come Determine whether the flow chart of distribution power budget；
Figure 10 is whether the determining user experience using application shown according to embodiments of the present invention is likely to reduced step A kind of flow chart of rapid implementation；
Figure 11 is the one kind shown in Fig. 9 for determining whether to meet the step of exiting standard shown according to embodiments of the present invention The flow chart of implementation；
Figure 12 be show according to embodiments of the present invention it is a kind of for determining the stream of the illustrative methods of heat source priority list Cheng Tu.
In the following detailed description, for illustrative purposes, numerous specific details are set forth, so as to those skilled in the art Member can thoroughly understand the embodiment of the present invention.It will be apparent, however, that can there is no the case where these details The one or more embodiments of lower implementation, different embodiments can combine according to demand, and should not be only limitted to listed by attached drawing For embodiment.
Specific embodiment
It is depicted below as the preferred embodiment that the present invention is implemented, is only used to enumerate and illustrates technical characteristic of the invention, and The scope being not intended to limit the invention.Use some vocabulary specific to censure in specification and claims in the whole text Element, one of ordinary skill in the art should be appreciated that manufacturer may call same element using different titles.Cause This, in a manner of present specification and claims are not using the difference of title as distinct elements, but functionally with element Difference make diacritical benchmark.Term used in the present invention " element ", " system " and " device " can be and computer phase The entity of pass, wherein the computer can be the combination of hardware, software or hardware and software.It is described below and claim Term "comprising" and " comprising " of the book mentioned in are open language, therefore should be construed to " including, but are not limited to ... " The meaning.In addition, term " coupling " means directly or indirectly to be electrically connected.Therefore, if it is described herein that a device is coupled to separately One device, then another device can be directly electrically connected in by representing the device, or indirect through other devices or connection means Ground is electrically connected to another device.
Wherein, unless otherwise directed, corresponding numbers and symbols is usually directed to corresponding portion in the different attached drawings of each attached drawing Point.The attached drawing drawn clearly illustrates the relevant portion of embodiment and is not drawn necessarily to scale.
Term " basic " used herein " substantially " refers to that within the acceptable range, those skilled in the art are able to solve Technical problem to be solved basically reaches technical effect to be achieved.For example, it " is substantially equal to " and refers to and do not influencing As a result when correctness, the acceptable mode for having certain error with " being equal to " of technical staff.
Power management mechanism proposed by the present invention refers to the system information of electronic device (for example, temperature and/or power letter Breath) and/or current operation scenario (operating scenario) it is associated to detect the application of operation on the electronic device User experience (for example, primary user experience, alternatively, the associated user experience of foreground application) whether be sustainable, and, If will not be it is sustainable, user experience reduce before (for example, before thermal conditioning is triggered) correspondingly distribution electronics dress The system power budget between multiple heat sources set.As an example rather than limitation implementation, the power proposed Heat source (for example, main heat source, such as executes the heat source of high-priority applications) the more function of distribution of administrative mechanism to high priority The function of the heat source (for example, secondary heat source, such as executes the heat source of low priority applications) of low priority is distributed in rate and/or reduction Rate.Therefore, the power management mechanism proposed is by dynamically distributing electronic device between multiple heat sources of electronic device System power budget, the power management mechanism proposed can not only maintain primary user to experience (primary user Experience), but also time user experience (secondary user experience) can be maximized, thus, so that electric Sub-device provides good overall customer experience under system power budget.Offer further described below.
Fig. 1 shows a kind of exemplary electronic device according to embodiments of the present invention.Electronic device 100 includes multiple heat sources HS1-HSN, wherein heat source H S1-HSNEach of be to be applied for executing at least one application with providing with this at least one The circuit of associated user experience.As an example rather than limitation implementation, heat source H S1-HSNEach of can To be that (it may include central processing unit (CPU) and/or graphics processing unit (graphics processing to processing module Unit, GPU)), wireless network module (for example, Wireless Fidelity (wireless fidelity, WiFi) module), charging module, Modulation /demodulation module (modem module), backlight module (backlight module) or camera model (camera module)。
Electronic device 100 can set hot threshold value.When the temperature for detecting electronic device 100 is more than the hot threshold value, electronics Device 100 can trigger thermal conditioning to reduce the process performance of electronic device 100.For example, working as the shell temperature of electronic device 100 When (chassis temperature or circuit board temperature) is more than hot threshold value, electronic device 100 triggers thermal conditioning to reduce electricity The clock frequency of sub-device 100.Further, since power consumption (power consumption) meeting of each heat source is so that detect The temperature of electronic device 100 increases, and therefore, which can correspond to heat source H S1-HSN(system power is pre- for shared power budget Calculate), wherein as heat source H S1-HSNWhen needing power more more than the system power budget, due to the lasting rising of temperature, because This, when the temperature of electronic device 100 is more than scheduled hot threshold value, electronic device 100 triggers thermal conditioning.
In order to avoid due to heat source H S1-HSNBetween interfere with each other and lead to user experience reduction (for example, too early into Row thermal conditioning), electronic device 100 can also include but is not limited to 110, power temperature sensor (temperature sensor) Sensor (power sensor) 120 and system power distribute (system power allocation, SPA) circuit 130, In, electronic device 100 can with frame of reference information (e.g., including the Current Temperatures of electronic device 100 and the letter of current power Breath) and/or current operation scenario come selectively/adaptively distribute heat source H S1-HSNBetween power budget (for example, setting Determine heat source H S1-HSNIn the power constraint of at least part heat source such as reduce the power budget of time heat source, increase main heat source Power budget).In some instances, as heat source H S1-HSNWhen needing power more more than the system power budget, if electronics Power required for the main heat source of device 100 is greater than the system power budget, then method provided by the present application will be so that electronics fills 100 are set to delay into heat regulation mode；If power required for the main heat source of electronic device 100 is lower than the system power budget, Then method provided by the present application will be so that electronic device avoids enter into heat regulation mode, to keep good under Power budgets Overall customer experience.
The temperature TD of 110 detection electronic installation 100 of temperature sensor, wherein the temperature TD detected can be but unlimited In bare crystalline (die)/chip (chip) junction temperature (junction temperature), the temperature of circuit board, the temperature of cell apparatus The temperature of the shell (chassis) of degree or electronic device 100.The power P D of 120 detection electronic installation 100 of power sensor. As an example rather than the implementation of limitation, power sensor 120 can directly measure (measure) electronic device 100 Power consumption, with determine power P D (for example, power sensor 120 can be realized by power meter (power meter)).Show another In example, power sensor 120 can be according to system information (for example, the clock frequency of CPU and operating characteristics point (operating Performance point, OPP)) calculate electronic device 100 power consumption, so that it is determined that power P D is (for example, power sensor 120 can be realized by processor).In another example, power sensor 120 can be detected related to the power consumption of electronic device 100 Other system informations (for example, network throughput or frame rate) of connection, determine power P D in an indirect way.In an optional example In, the power P D detected can be the index of indicated horsepower information.
System power distribution (SPA) circuit 130 is coupled to heat source H S1-HSN, temperature sensor 110 and power sensor 120, system power distributes the operation scenario SR of (identify) electronic device 100 for identification of (SPA) circuit 130, and refers to At least one of the temperature TD that detects, the power P D detected and operation scenario SR decide whether to distribute heat source H S1-HSN Between power budget.For example, using heat source H S in electronic device 1001Come run application in the case where (for example, using including The processing module of CPU and GPU executes game application), system power distribution (SPA) circuit 130 with reference to the temperature TD detected, The power P D and operation scenario SR detected applies the whether very possible (is of associated user experience with this to determine Likely to) (in another words, it is determined that applying whether associated user experience will be sustainable with this) is reduced, to determine Whether heat source H S is distributed1-HSNBetween power budget.When determining to be likely to reduce using associated user experience with this (in another words, it is determined that going out situation when applying associated user experience will be unsustainable with this), system power distribute (SPA) electricity Road 130 adjusts or compacting heat source HS2(for example, charging module), to distribute heat source H S1-HSNBetween power budget, wherein heat Source HS1Than heat source HS2It is applied with greater need for operation.In other words, system power distribution (SPA) circuit 130 is distributed to secondary by reduction (secondary) heat source is (for example, heat source H S2) power keep main (primary) heat source (for example, heat source H S1) associated User experience, to keep the good overall customer experience of electronic device 100 under power budget.
To facilitate the understanding of the present invention, illustrative embodiment is given below, to further describe proposed power Administrative mechanism.It should be noted that realizing to be also feasible using other circuits of architectural framework shown in FIG. 1.Please refer to figure 2, Fig. 2 be the schematic diagram for showing a kind of implementation of electronic device 100 shown in FIG. 1.In this implementation, electronic device 200 can realize that electronic device 200 includes but is not limited to by portable electronic device (for example, mobile phone or tablet computer) Casing 202, printed circuit board (printed circuit board, PCB) 204, controller 210, processing module 211 (for example, Including CPU and GPU), Wireless Fidelity (WiFi) module 212, charging module 213, modulation /demodulation module 214 and backlight module 215. Controller 210, processing module 211, WiFi module 212, charging module 213, modulation /demodulation module 214 and backlight module 215 can To be integrated in application processor (application processor, AP) 206, wherein application processor (AP) 206 can be set It sets on PCB 204.It should be noted that structure shown in Fig. 2 is not meant to limitation of the present invention.
In addition, heat source H S shown in FIG. 11-HSNAt least part can by processing module 211, WiFi module 212, fill Electric module 213, modulation /demodulation module 214 and backlight module 215 are realized.In one example, user relevant to application or heat source Experience can by corresponding performance indicator (such as, frame rate (frame rate, FPS), network speed (network speed), fill Electric speed (charging speed) etc. is embodied.For example, processing module 211 can execute it is relevant to image/video processing Using, and user experience relevant to frame rate is correspondingly provided；WiFi module 212 can execute and the data in wireless network Relevant application is transmitted, and user experience associated with wireless transmission rate is correspondingly provided；Charging module 213 can execute Application relevant to power supply, and user experience associated with charge rate is correspondingly provided；Modulation /demodulation module 214 can To execute application relevant to the data transmission in action net, and correspondingly provide user associated with network transmission speed Experience；And backlight module 215 can execute application relevant to light supply (light supply), and correspondingly provide with The associated user experience of screen intensity.
Electronic device 200 may further include multiple temperature sensor 221-226 (221,222,223,224,225, 226), wherein temperature sensor 110 shown in FIG. 1 can be realized by one of them in temperature sensor 221-226.Temperature Degree sensor 221 can detecte bare crystalline/junction temperature of chip of processing module 211, and temperature sensor 222 can detecte WiFi module 212 bare crystalline/junction temperature of chip, temperature sensor 223 can detecte bare crystalline/junction temperature of chip of charging module 213, temperature sensor 224 can detecte bare crystalline/junction temperature of chip of modulation /demodulation module 214, and temperature sensor 225 can detecte backlight module 215 Bare crystalline/junction temperature of chip, and, temperature sensor 226 can detecte the temperature of PCB 204.In addition, in a kind of illustrative realization In mode, the temperature that electronic device 200 (or AP 206) is detected according at least one of temperature sensor 221-226 is true The temperature of fixed/estimation electronic device 200 (casing 202, alternatively, PCB 204, alternatively, AP 206).It should be noted that one In implementation, AP 206 can be according to the temperature determination/estimation PCB that at least one of temperature sensor 221-225 is detected 204 temperature.
Further, processing module 211 according to system information (for example, cpu clock frequency, operating characteristics point (OPP) and/ Or frame rate) power (power consumption) of electronic device 200 is calculated, and, controller 210 is with reference to one or more temperature for detecting Processing module 211, WiFi module 212, charging module 213, modulation /demodulation module 214 and backlight are executed with the power that detects Power budget distribution between module 215.In other words, power sensor 120 and system power distribution (SPA) electricity shown in FIG. 1 Road 130 can be realized by the CPU of processing module 211 and controller 210 respectively.
For illustrative purposes, it is described below what the operation of electronic device 200 was applied in execution game application and quick charge Embodiment in exemplary operation scene.However, it is not intended that being limitation of the present invention.Fig. 3 is referred to incorporated by reference to Fig. 2. Fig. 3 shows circuit board temperature caused by electronic device 200 shown in Fig. 2 is distributed using power budget according to embodiments of the present invention With the variation of frame rate.In this embodiment, user plays the trip on electronic device 200 while electron device 200 charges Play, and, electronic device 200 has sufficient electricity, for example, the remaining capacity of electronic device 200 is greater than predetermined charge value, In, which applies (heavy) the CPU/GPU load (for example, three-dimensional (three-dimensional, 3D) game) of weight, with And electronic device 200 runs quick charge using processing module 211 come running game application and using charging module 213 Using.Controller 210 identifies the operation of electronic device 200 in the operation scenario for executing game application and quick charge application. In addition, controller 210 can will be related with the game application in the case where electronic device 200 has enough battery capacities User experience be identified as electronic device 200 primary user experience, and, will with the quick charge apply related user experience It is identified as the secondary user experience of electronic device 200.
Firstly, considering the case where electronic device 200 does not use power budget distribution to be operated in Fig. 3.Due to Game application and/or quick charge application are executed on electronic device 200 will make 204 heating of PCB, thus, the temperature of PCB 204 Degree (being indicated by circuit board temperature Tpcb_OF) rises rapidly, cause to carry out ahead of time thermal conditioning (for example, on time point t1, circuit Plate temperature Tpcb_OF is more than 50 DEG C of hot threshold value) and performance decline.Particularly, processing module is distributed to since thermal conditioning reduces 211 power, therefore, processing module 211 is it is impossible to meet the requirement of the computing capability of complex scene C1, C2, C3, and electronic device 200 frame rate (being indicated by frame rate FPS_OF) therefore declines.
On the contrary, in the case where electronic device 200 is distributed using power budget proposed by the present invention, when determining and swim Play is likely to (ought determine that user experience related with game application will be unsustainable when reducing using related user experience When), controller 210 determines to adjust or suppress the power of charging module 213, to keep user experience related with game application (i.e. primary user experiences).As an example rather than limitation implementation, when the temperature for determining PCB 204 in time point t2 (being indicated by circuit board temperature Tpcb_SPA) is more than predetermined temperature (being less than 50 DEG C of hot threshold value, for example, 40 DEG C) and electronic device 200 Frame rate (being indicated by frame rate FPS_SPA) be more than pre-determined frame rate (for example, 60fps) (that is, the power of processing module 211 Greater than predetermined power) when, controller 210 executes power budget distribution by way of adjusting or suppressing charging module 213.Cause This does not use power budget to distribute the case where being operated compared to electronic device 200, and circuit board temperature Tpcb_SPA is slow It increases, so that a possibility that electronic device 200 enters heat regulation mode very little (is less likely to), i.e. electronic device 200 can delay entrance or avoid enter into heat regulation mode.Moreover, even if electronic device 200 enter heat regulation mode (for example, Time point t3), since controller 210 is in advance adjusted charging module 213, processing module 211 has foot Enough computing capabilitys handle complex scene C1, C2, C3.Therefore, frame rate FPS_SPA is metastable (such as frame rate Shown in the curve of FPS_SPA), greatly decline (such as frame rate FPS_OF without occurring on complex scene C1, C2, C3 Shown in curve).To be mentioned during multiple applications are performed simultaneously using power management method proposed by the present invention The processing capacity of electronic device is risen, and there is good overall customer experience.
Fig. 4 is referred to incorporated by reference to Fig. 3, Fig. 4 shows related to power budget shown in Fig. 3 distribution according to embodiments of the present invention A kind of schematic diagram of exemplary system power of connection.In the exemplary embodiment, when main heat source (for example, processing module 211) Power (current power consumption of processing module 211) no more than electronic device 200 provide system power budget (for example, predetermined function Rate PSUS1) when, electronic device 200 is ensured that and will not trigger thermal conditioning (in other words, the temperature of casing 202 or PCB 204 are ensured that The hot threshold value for being used to determine whether triggering thermal conditioning is not exceeded).In other words, when the power of processing module 211 is no more than pre- Determine power PSUS1When, user experience (or primary user's experience) relevant to game application is sustainable.
However, when the temperature (for example, temperature of casing 202/PCB 204) for detecting electronic device 200 is greater than predetermined temperature Spend (for example, 40 DEG C) (predetermined temperature be less than triggering thermal conditioning hot threshold value, for example, the temperature of casing 202/PCB 204 be used for Determine whether trigger thermal conditioning hot threshold value between difference be less than predetermined value) and processing module 211 power be greater than predetermined function Rate PSUS1When, it means that electronic device 200 will likely trigger thermal conditioning.If controller 210 determines user experience (for example, user experience relevant to game application) is likely to reduce, therefore carries out power budget distribution.For example, controller 210 Power budget distribution can be executed by adjusting or suppressing heat source associated with time user experience.For example, controller 210 can To adjust or suppress charging module 213, to reduce the power for distributing to charging module 213, so that original (originally) is answered At least part for distributing to the power of quick charge application is released to processing module 211, to maintain needed for game application High frame rate.It should be noted that adjust quick charge operation after, in response to quick charge apply and generate processing mould Power consumption and/or the temperature raising of block 211 can reduce, and correspondingly, and the power of processing module 211 can be less than or equal to pre- Determine power PSUS1。
Other than maintaining primary user's experience, the power management mechanism proposed can maximize time user experience.It please tie It closes Fig. 2 and refers to Fig. 5.Fig. 5 shows the circuit board temperature and function in electronic device 200 shown in Fig. 2 according to embodiments of the present invention The variation of consumption.In this embodiment, user activates low on electronic device 200 while charging to electronic device 200 Power consumption application (for example, game or video playback applications for applying light CPU/GPU load), wherein electronic device 200 is at Module 211 is managed to run low-power consumption application and run quick charge application using charging module 213.Controller 210 identifies The operation of electronic device 200 is in executing the operation scenario that low-power consumption is applied and quick charge is applied.In addition, in electronic device 200 In the case where enough battery capacities, controller 210 can will be identified as electricity using relevant user experience to low-power consumption The primary user of sub-device 200 experiences, and, electronic device 200 will be identified as using relevant user experience to quick charge Secondary user experience.
In the embodiment shown in fig. 5, due to the power P of processing module 211CON(for example, the CPU in processing module 211 Current power consumption) be substantially less than predetermined power PSUS2, therefore, controller 210 is determined to low-power consumption using relevant user Experience is sustainable.This means that controller 210 does not need to adjust or suppress charging module 213.Particularly, controller 210 Maximizing time user experience (example while keeping primary user's experience (for example, applying relevant user experience to low-power consumption) Such as, relevant user experience is applied to quick charge).
In view of the above, the power management mechanism proposed is dynamically divided before electronic device triggers thermal conditioning Limited power budget between multiple heat sources with electronic device.Therefore, the power management mechanism proposed can not only be kept Primary user's experience, but also time user experience can be maximized, to provide the good overall customer experience of electronic device.
It note that the purpose that above description is merely to illustrate, be not meant to limitation of the present invention.In an optional design In, for determining that the primary user of electronic device experiences whether sustainable predetermined power can be greater than corresponding to minimum acceptable system The power threshold for performance of uniting, it is ensured that electronic device not only can be to avoid triggering thermal conditioning, but also meets performance requirement.Another In optional design, which can be adjusted according to different operation scenarios or application, the predetermined power is for determining electricity Whether primary user's experience of sub-device is sustainable.For example, the predetermined power of corresponding high power consumption application is (for example, shown in Fig. 3 Predetermined power PSUS1) power for corresponding to low-power consumption application can be less than (for example, predetermined power P shown in fig. 5SUS2)。
In addition, the power management mechanism proposed can be summarised in Fig. 6.Fig. 6 is one kind according to an embodiment of the present invention The flow chart of exemplary power management method for electronic device, wherein electronic device may include multiple heat sources.Assuming that knot Fruit is essentially identical, then step does not need to execute in strict accordance with sequence shown in fig. 6.For example, not departing from the scope of the present invention In the case of can increase step.In addition, being for the purpose of illustration, power management method shown in fig. 6 is filled with reference to electronics shown in Fig. 2 200 are set to describe.This is not intended as limitation of the invention.In electronic device 100 shown in Fig. 1 or it is being based on Fig. 1 institute It is also feasible that power management method shown in fig. 6 is used in other electronic devices that the electronic device 100 shown is realized.Fig. 6 institute The power management method shown is summarized as follows.
Step 610: starting.
Step 620: the temperature of detection electronic installation.
Step 630: the power of detection electronic installation.
Step 640: identifying the operation scenario of electronic device.
Step 650: with reference at least one of the temperature detected, the power detected and operation scenario, it is determined whether Distribute the power budget between multiple heat sources.It should be noted that step 620 to the one kind of step 650 only for ease of understanding is shown Example property detailed description, be intended to illustrate electronic device according in the temperature of the electronic device, power and operation scenario at least One determines whether the power budget distributed between multiple heat sources, and the present invention is not limited to the detailed description of the exemplary.
In step 620, the temperature detected may include the temperature of the casing of electronic device, the temperature of circuit board, naked Crystalline substance/chip junction temperature, and/or, the temperature of cell apparatus.As an example rather than limitation implementation, electronic device 200 It can use the temperature that at least one of temperature sensor 221-226 carrys out detection electronic installation 200.
In act 630, power sensor (for example, power meter) can be used to measure the power of electronic device.According to The system information of electronic device is also feasible come the power for detecting/calculating electronic device.As an example rather than limitation Implementation, the CPU of processing module 211 may include the first cluster (cluster) and the second cluster, wherein the first cluster can It there are four core (core) and is operated on first frequency (for example, 800MHz) with tool, and, the second cluster can have two cores And operation is on second frequency (for example, 2GHz).Processing module 211 can be worked as according to current operating characteristics point (OPP) to calculate Preceding power consumption.In an implementation, the function of different operating characteristics points is answered in the verification that each cluster is shown in table 1 below Consumption.
Table 1
OPP The core (mW) of first cluster The core (mW) of second cluster
OP0 400 900
OP1 200 600
OP2 100 400
For example, when the first cluster operation is on operating characteristics point OP2 and the second cluster operation is on operating characteristics point OP0 When, processing module 211 can calculate current power consumption with reference table 1, be equal to 2200 (100 × 4+900 × 2) mW.Electronic device The calculated current power consumption can be used as the above-mentioned power detected by 200.
In an optional design, processing module 211 can also calculate current power consumption with reference to cpu load.For example, first The cpu load of cluster be equal to 360% and second cluster cpu load be equal to 180% in the case where, calculated current power consumption It will be 1980 (100 × 4 × 360/400+900 × 2 × 180/200) mW.In other alternative design, in addition to dynamic power consumption, place Reason module 211 can also obtain the current power consumption with reference to quiescent dissipation.For example, the cpu load in the first cluster is equal to 360%, the cpu load of the second cluster is equal to 180%, and, it is calculated current in the case that CPU leakage power is 300mW Power consumption will be 2280 (1980+300) mW.
In step 640, electronic device can identify operation scenario (current operation scenario) according to system information, wherein The operation scenario is associated with performed one or more application.As an example rather than limitation implementation, electronics Device 200 can be with reference power/temperature information (for example, processing module 211, WiFi module 212, charging module 213, modulatedemodulate Power/temperature information of at least one of mode transfer block 214 and backlight module 215), frame rate, battery capacity, and/or, quilt The data volume of transmission come identify current operation scenario whether with game application, charging application, for taking pictures or video record Photograph application, video playback applications and WiFi sharing application are associated.
In step 650, electronic device is with reference at least one in the temperature detected, the power and operation scenario that detect It is a to determine whether to be likely to reduce using associated user experience on electronic device, it determines whether to distribute multiple Power budget between heat source.In an implementation, electronic device determines whether operation scenario is predetermined scene, and correspondingly Determine whether be likely to reduce to using relevant user experience.As an example rather than limitation implementation, work as electronics (predetermined field when operation of device 200 is in predetermined scene (for example, low battery scene or camera scene (photograph application is activated)) Scape is meeting so that being likely to reduced scene to using relevant user experience), electronic device 200 determines to execute power budget point With (for example, increasing the power for distributing to charging module 213 when predetermined scene is low cell condition, alternatively, when predetermined scene is Increase the power for distributing to processing module 211 when camera scene), to keep good overall customer experience.
In another embodiment, whether the rate of change for the temperature that electronic device confirmly detects is greater than predetermined speed, And correspondingly determine whether be likely to reduce to using relevant user experience.As an example rather than limitation realization side Formula, when controller 210 determines the rate of change of the bare crystalline junction temperature of processing module 211 greater than predetermined speed, casing 202 (or PCB 204) temperature will rise rapidly so that electronic device 200 probably triggering thermal conditioning to reduce operating characteristics.Cause This, controller 210 can the rate of change of at least bare crystalline junction temperature of reference process module 211 determine whether user experience very may be used It can reduce.
In another implementation, electronic device determines whether operation scenario is predetermined scene first, wherein is determining After operation scenario is not predetermined scene, whether the rate of change for the temperature that electronic device confirmly detects is greater than predetermined speed, Or whether the temperature confirmly detected is greater than predetermined temperature, and/or, whether the power confirmly detected is greater than predetermined power, So that it is determined that whether being likely to reduce to using relevant user experience.For example, if the current operation scenario of electronic device is not Predetermined scene, and, the temperature of electronic device is greater than predetermined temperature, and (wherein, which is less than for triggering thermal conditioning Predetermined thermal threshold value) and power be greater than predetermined power, then can determine that with apply associated user experience will be likely to reduce.
In addition, being answered when determining with this in the case where electronic device runs application using the first heat source in multiple heat sources When being likely to reduce with relevant user experience, electronic device adjusts the Secondary Heat Source in multiple heat sources, to distribute multiple heat sources Between power budget, wherein the first heat source than Secondary Heat Source with greater need for operation apply.For example, the first heat source is (alternatively, first First application performed by heat source) it is higher than the priority of Secondary Heat Source (alternatively, the second application performed by Secondary Heat Source).
After the above paragraph for reading Fig. 1 to Fig. 5, the technical staff in the technical field should be understood that shown in fig. 6 The operation of each step omits further description for simplicity herein.
It should be noted that provided power management mechanism will distribute the power budget between multiple heat sources in determination When, heat source priority can also be determined according to system information and current operation scenario, and more according to heat source priority distribution Power budget between a heat source.Referring to FIG. 7, Fig. 7 is a kind of exemplary function for electronic device of the embodiment of the present invention The flow chart of rate management method, wherein the electronic device includes multiple heat sources.For illustrative purposes, power tube shown in Fig. 7 Reason method is described with reference to electronic device 100 shown in FIG. 1.However, this is not limitation of the present invention.It can be in Fig. 2 institute It is used shown in Fig. 7 in the electronic device 200 shown or in the other electronic devices realized based on electronic device 100 shown in FIG. 1 Power management method.Power management method shown in Fig. 7 may be summarized as follows.
Step 710: starting.
Step 720: the system information of electronic device is read, to identify the current operation scenario of electronic device.For example, system Power distribution (SPA) circuit 130 read electronic device 100 system information (for example, power information, temperature information, frame rate, Battery capacity, and/or, the data volume transmitted), to identify the operation scenario SR of electronic device 100.
Step 730: frame of reference information and the operation scenario identified are related to the application on electronic device to determine User experience whether be likely to reduce.If it is, entering step 742；Otherwise, 746 are entered step.For example, system power Distribution 130 reference operation scene SR of (SPA) circuit and electronic device 100 system information come determine on electronic device 100 Whether will be likely to drop using relevant user experience (for example, primary user experiences, alternatively, to the user experience of foreground application) It is low, to decide whether to distribute heat source H S1-HSNBetween power budget.
Step 742: heat source priority list is constructed according to current operation scenario (alternatively, and system information).For example, system Power distribution (SPA) circuit 130 constructs/generates heat source priority list PR according to operation scenario SR, wherein heat source priority list PR It can indicate to maintain and the priority orders of one or more heat sources needed for the relevant user experience of application used.
Step 744: distributing the power budget between multiple heat sources according to heat source priority list.For example, system power distributes (SPA) circuit 130 distributes heat source H S according to heat source priority list PR1-HSNBetween power budget.
Step 746: the power for distributing to heat source not being adjusted.In other words, power budget batch operation is not executed.
In step 730, system power distribution (SPA) circuit 130 is at least with reference to the temperature TD and operation scenario detected SR determines whether to be likely to reduce using relevant user experience on electronic device 100, determines whether distribution heat Source HS1-HSNBetween power budget.In an optional design, system power distribution (SPA) circuit 130 is with reference to the temperature detected Degree TD, the power P D that detects and operation scenario SR come determine on electronic device 100 using relevant user experience whether It is likely to reduce.
In step 742, the high priority heat source in heat source priority list PR can be highly relevant with the execution of application Heat source.As an example rather than the implementation of limitation, executing game application in the operation of electronic device 100 and quickly filling In the operation scenario SR of electricity application, and, operation scenario SR (or system information) indicates that electronic device 100 has enough electricity In the case where the electricity of pond, heat source priority list PR can indicate for executing game application heat source (e.g., including CPU and GPU Processing module) priority ratio be used for execute quick charge application heat source (for example, charging module) priority it is higher.Cause This, in step 744, system power distributes (SPA) circuit 130 and is adjusted to quick charge using associated heat source (or compacting), to increase the power for distributing to heat source associated with game application, to keep use relevant to game application Family experience.
In another example, it operates in electronic device 100 in the operation scenario for executing game application and quick charge application In SR, and, in the case that operation scenario SR (or system information) indicates that electronic device 100 has low battery, heat source precedence table PR can indicate the priority ratio of the heat source (for example, charging module) for executing quick charge application for executing game application Heat source (for example, processing module includes CPU and GPU) priority it is higher.Therefore, in step 744, system power distribution (SPA) (or compacting) is adjusted to heat source associated with game application in circuit 130, is answered with increasing to distribute to quick charge With the power of associated heat source, so that it is guaranteed that the normal operating of electronic device 100.
In step 746, system power distribution (SPA) circuit is not to distributing to heat source H S1-HSNPower be adjusted. For example, electronic device 100 refers to heat source HS1-HSNEach temperature detection result (for example, the temperature of temperature sensor 221-225 is examined Survey result) determine whether to adjust heat source H S respectively1-HSN, (determine whether be likely to drop to using relevant user experience It is low), if user experience is less likely to reduce, not to heat source H S1-HSNBetween power carry out thermal conditioning operation.
It note that if result is essentially identical, step does not need to execute in strict accordance with sequence shown in Fig. 7.For example, After identifying current operation scenario (step 720), the power management method proposed can be on determining and electronic device Using relevant user experience whether be likely to reduce (step 730) before construct heat source priority list (step 742).
To facilitate the understanding of the present invention, example implementations are given below, it is pre- with the power for further describing proposed Point counting is matched.However, it is not intended that being limitation of the present invention.Fig. 8 is referred to incorporated by reference to Fig. 1.Fig. 8 is electronics dress shown in FIG. 1 Set a kind of 100 embodiment.Electronic device 800 may include system power distribution (SPA) circuit 830 and heat shown in FIG. 1 Source HS1-HSN, wherein system power distribution (SPA) circuit 130 shown in FIG. 1 can be distributed (SPA) circuit 830 by system power To realize.System power distributes the system information that (SPA) circuit 830 receives or reads electronic device 800, selectively to distribute Heat source H S1-HSNBetween power budget, wherein system information can indicate but the temperature TD that is not limited to detect is (for example, Fig. 1 Shown in temperature sensor 110 generate, be not shown in Fig. 8), the power P D that detects is (for example, power sensing shown in FIG. 1 What device 120 generated, be not shown in Fig. 8), frame rate, battery capacity and/or the data volume transmitted.In the present embodiment, system Power distribution (SPA) circuit 830 can include but is not limited to scene detection circuit (scenario detection circuit) 831, it distributes and determines circuit (allocation determination circuit) 832, priority classification device (priority Classifier) 833, power distributing circuit (power allocation circuit) 834 and wake-up circuit (wake-up circuit)835。
Scene detection circuit 831 can identify operation scenario SR according to system information, distribute and determine that circuit 832 can basis System information and operation scenario SR decide whether distribution power budget, and, priority classification device 833 can be according to system information Heat source priority list PR is generated/determined with operation scenario SR.Determine that circuit 832 is determined to need distribution power budget when distributing When, power distributing circuit 834 distributes heat source H S according to heat source priority list PR1-HSNBetween power budget (for example, setting Heat source H S1-HSNPower constraint).In addition, wake-up circuit 835 can periodically or aperiodically activation scenario detects electricity Road 831.
In an illustrative embodiment, scene detection circuit 831 receives heat source H S1-HSNTemperature detection result TD1-TDN(for example, temperature detection result of temperature sensor 221-225 shown in Fig. 2), wherein temperature detection result TD1- TDNScene detection circuit 831 can be helped to identify operation scenario SR.In the embodiment of another exemplary, distributes and determine electricity Road 832 can receive or read temperature detection result TD1-TDN, this aid in determining whether distribution power budget.In another realization In, temperature detection result TD1-TDNIt may include in system information.
Fig. 9 is referred to incorporated by reference to Fig. 8.Fig. 9 is the system power shown in Fig. 8 distribution shown according to embodiments of the present invention (SPA) circuit 830 determines whether the flow chart of distribution power budget using illustrative methods.Method shown in Fig. 9 can be total It ties as follows.
Step 930: starting.Determine that circuit 832 receives system information (including the temperature TD detected and inspection for example, distributing The power P D measured) and operation scenario SR.
Step 932: distribute determine 832 frame of reference information of circuit and operation scenario SR determine user experience (for example, with Heat source H S1-HSNIn the associated user experience of the first heat source, wherein the highest priority of the first heat source) whether be likely to drop It is low.If it is, entering step 942；Otherwise, 934 are entered step.
Step 934: distributing and determine 832 frame of reference information of circuit and operation scenario SR whether to determine electronic device 800 Satisfaction exits standard.If it is, entering step 944；Otherwise, 946 are entered step.
Step 942: distributing and determine that 832 indicated horsepower distributor circuit 834 of circuit adjusts or limit heat source H S1-HSNSecond Heat source (power in other words, reducing Secondary Heat Source), and return step 932.
Step 944: distributing and determine that the releasing of 832 indicated horsepower distributor circuit 834 of circuit (changes speech to the adjusting of Secondary Heat Source It, does not reduce the power of Secondary Heat Source), and return step 932.For example, in the case where Secondary Heat Source has been conditioned, when point When with determining that circuit 832 determines that the satisfaction of electronic device 800 exits standard and needs not continue to adjust Secondary Heat Source, distribution is true Determine adjusting of 832 indicated horsepower distributor circuit 834 of the circuit releasing to Secondary Heat Source.
Step 946: not to distributing to heat source H S1-HSNPower be adjusted, and return step 932.In other words, exist User experience associated with the first heat source is less likely to reduce and in the case that electronic device 800 does not meet the standard of exiting, System power distribution (SPA) circuit 830 is not to distributing to heat source H S1-HSNIt is adjusted.
It note that if result is essentially identical, step does not need to execute according to precise sequence shown in Fig. 9.Another In design, system power distribution (SPA) circuit 830 can constantly determine the need for distributing with reference to method shown in Fig. 9 Power budget.For example, running application (for example, foreground application, such as game application) using the first heat source in electronic device 800 In the case where, distribution determines that circuit 832 is determined and applies relevant user experience (for example, use associated with the first heat source to this Family experience) whether it is likely to reduce (step 932).(example when determining to be likely to reduce using relevant user experience to this Such as, the first heat source is loaded in the complicated scene of game of processing by high CPU/GPU) when, it distributes and determines 832 indicated horsepower of circuit 834 de-regulation of distributor circuit or compacting Secondary Heat Source, to maintain to apply relevant user experience (step 942) to this.Next, When distributing determining circuit 832 and determining that the satisfaction of electronic device 800 exits standard (for example, the first heat source is in the simple trip of processing Light CPU/GPU load is placed when scene of playing) when, it distributes and determines that 832 indicated horsepower distributor circuit 834 of circuit releases Secondary Heat Source Adjusting (step 934 and step 944).
In other alternative design, distributes and determine that circuit 832 can be determined referring initially to system information and operation scenario SR Whether satisfaction exits standard (step 934).Determine be unsatisfactory for exiting standard after, distribute determine circuit 832 can determine with Whether this is likely to reduce (step 932) using relevant user experience, wherein when be unsatisfactory for exiting standard and with this using phase When the user experience of pass is less likely to be lowered, system power distribution (SPA) circuit 830 is not to distributing to heat source H S1-HSNFunction Rate is adjusted (step 946).
Figure 10 is whether the determination shown according to embodiments of the present invention is likely to reduce to using relevant user experience A kind of flow chart of implementation of step (step 932).For illustrative purposes, method shown in Fig. 10 is with reference to shown in Fig. 8 System power distribution (SPA) circuit 830 describe.In addition, the temperature TD shown in Fig. 8 detected can be processing module (multiple heat source H S1-HSNIn one of them, processing module 211 such as shown in Fig. 2) bare crystalline junction temperature TJ, and, Fig. 8 institute The power P D detected shown can be the power P of processing moduleC.However, this is not limitation of the present invention.
Firstly, in step 1020, distributing and determining that circuit 832 determines whether operation scenario SR is predetermined scene SRP1.Example Such as, when determining that operation scenario SR is predetermined scene SRP1When, it distributes and determines that circuit 832 is capable of determining that and applies relevant use Family experience be likely to reduce, therefore, distribute determine 832 indicated horsepower distributor circuit 834 of circuit adjust Secondary Heat Source, with maintain with Using associated user experience (step 942) performed by first heat source or first heat source.
In one embodiment, predetermined scene SRP1The operation scenario that the temperature TD that can be makes to detect persistently rises.Example Such as, predetermined scene SRP1It can be the camera scene that photograph application is activated.Since continuously performing for photograph application will lead to excess temperature Situation (the temperature TD or bare crystalline junction temperature T detectedJIt is too high) so that the user experience that control is mutually applied is likely to reduce, therefore, It distributes and determines that 832 indicated horsepower distributor circuit 834 of circuit adjusts or suppress Secondary Heat Source, distribute to photograph application pair to increase The power for the first heat source (for example, processing module) answered.
In another implementation, predetermined scene SRP1It can be the operation scenario for making electronic device 800 stop working.Example Such as, predetermined scene SRP1It can be low battery scene of the battery capacity less than the predetermined percentage (for example, 15%) of battery capacity. Since user experience relevant to the one or more application operated on electronic device 800 is probably in low battery scene It reduces, wherein cell apparatus 800 is probably closed because of power of battery deficiency, therefore, is distributed and is determined 832 indicated work of circuit Rate distributor circuit 834 adjusts or compacting Secondary Heat Source, to increase the power for distributing to the first heat source (for example, charging module).
It is predetermined scene SR when determining operation scenario SR notP1When, it distributes and determines that circuit 832 at least refers to bare crystalline junction temperature TJ Whether (for example, the temperature TD detected) determines and is likely to reduce using relevant user experience.In one embodiment (being not shown in Figure 10) distributes and determines that circuit 832 can directly determine bare crystalline junction temperature TJRate of change Δ TJWhether it is greater than predetermined Rate (for example, 10 DEG C/s), wherein as rate of change Δ TJWhen greater than set rate, distributes and determine that circuit 832 is determined and answered It is likely to reduce with relevant user experience.Determine that circuit 832 determines rate of change Δ T for example, distributingJWhether pre- constant speed is greater than Rate RT1.As rate of change Δ TJGreater than set rate RT1When (step 1033), distributes and determine 832 indicated horsepower distributor circuit of circuit 834 adjust Secondary Heat Source, to maintain and apply relevant user experience (step 942)；As rate of change Δ TJNo more than predetermined Rate RT1When, it distributes and determines that circuit 832 is determined and apply associated user experience to be sustainable, it is then determined whether Satisfaction exits standard (step 934).
In another embodiment, it distributes and determines that circuit 832 determines bare crystalline junction temperature TJWhether predetermined temperature is greater than, and, Power PCWhether predetermined power is greater than, wherein as bare crystalline junction temperature TJGreater than predetermined temperature and power PCWhen greater than predetermined power, point It determines to be likely to reduce to using relevant user experience with determining circuit 832.Determine that the determination of circuit 832 is naked for example, distributing Brilliant junction temperature TJWhether predetermined temperature T is greater thanTRIP1, and, power PCWhether predetermined power P is greater thanS1(step 1031 and step 1032), wherein as bare crystalline junction temperature TJGreater than predetermined temperature TTRIP1And power PCGreater than predetermined power PS1When, it distributes and determines circuit 832 determine to be likely to reduce to using relevant user experience, and, indicated horsepower distributor circuit 834 adjusts Secondary Heat Source (step 942).In addition, in the embodiment shown in fig. 10, determining bare crystalline junction temperature TJNo more than predetermined temperature TTRIP1And/or Power PCNo more than predetermined power PS1Later, it distributes and determines that circuit 832 determines bare crystalline junction temperature TJRate of change Δ TJWhether it is greater than Set rate RT1(step 1033).
Trigger thermal conditioning since different operation scenarios corresponds to different standards, wherein the different operation scenario with Predetermined scene SRP1Therefore difference distributes and determines that circuit 832 can refer to different operation scenarios to determine aforementioned make a reservation for At least one of rate of change, predetermined temperature and predetermined power.As an example rather than limitation implementation, work as determination Operation scenario SR is and predetermined scene SR outP1Different predetermined scene SRP2(for example, environment temperature be more than specific temperature (for example, 60 DEG C) high environment temperature scene) when, distribute determine circuit 832 judge bare crystalline junction temperature TJWhether predetermined temperature T is greater thanTRIP2With And power PCWhether predetermined power P is greater thanS2, to judge whether user experience is likely to reduce (step 1036 and step 1037), wherein predetermined temperature TTRIP2(for example, 55 DEG C) are smaller than predetermined temperature TTRIP1(for example, 60 DEG C), and, predetermined function Rate PS2(for example, 600mW) is smaller than predetermined power PS1(for example, 900mW).In another example, scene detection circuit 831 is true Making operation scenario SR is predetermined scene SRP2(for example, high environment temperature scene) distributes and determines that circuit 832 can directly determine change Change rate Δ TJWhether set rate R is greater thanT2, so that it is determined that whether user experience is likely to reduce (step 1038), wherein pre- Constant speed rate RT2It can be different from (for example, being less than) set rate RT1。
In brief, when determine to using it is relevant experience be likely to reduce and operation scenario SR be predetermined scene SRP2 When, above-mentioned predetermined temperature is equal to the first temperature threshold (TTRIP2), and, above-mentioned predetermined power is equal to the first power threshold (PS2)； When determining and be likely to reduce using relevant user experience and operation scenario SR is neither predetermined scene SRP1Nor predetermined Scene SRP2When, above-mentioned predetermined temperature is equal to second temperature threshold value (TTRIP1), above-mentioned predetermined power is equal to the second power threshold (PS1), wherein second temperature threshold value (TTRIP1) it can be different from the first temperature threshold (TTRIP2), and, the second power threshold (PS2) it can be different from the first power threshold (PS1).In one example, if predetermined scene SRP2For high environment temperature scene, then Two temperature threshold (TTRIP1) the first temperature threshold (T can be greater thanTRIP2), and, the second power threshold (PS2) first can be greater than Power threshold (PS1)。
The purpose being merely to illustrate above, is not meant to limitation of the present invention.In some embodiments, with predetermined field Scape SRP1Associated set rate RT1It can be equal to and predetermined scene SRP2Associated set rate RT2.Moreover, it is assumed that result Essentially identical, then step does not need the execution of precise sequence as shown in Figure 10.It in the alternative design, can be before step 1031 Step 1033 is executed, and/or, step 1038 is executed before step 1036.It, can be in step 1031 in another alternate design Step 1032 is executed before, and/or, step 1037 is executed before step 1036.
Figure 11 is that show according to embodiments of the present invention shown in Fig. 9 determines whether to meet the step of exiting standard (step 934) a kind of flow chart of implementation.For illustrative purposes, method shown in Figure 11 refers to system power shown in Fig. 8 (SPA) circuit 830 is distributed to describe.In addition, the temperature TD shown in Fig. 8 detected can be the bare crystalline junction temperature T of processing moduleJ (heat source H S1-HSNIn one of them, processing module 211 such as shown in Fig. 2), and, the power shown in Fig. 8 detected PD can be the power P of processing module detectedC.However, this is not limitation of the present invention.
In the present embodiment, it distributes and determines that circuit 832 judges bare crystalline junction temperature TJWhether predetermined temperature is less than, and/or, judgement Power PCWhether predetermined power is less than, wherein when judging bare crystalline junction temperature TJLess than predetermined temperature or power PCLess than predetermined function When rate, distributes and determine that circuit 832 determines that satisfaction exits standard.Determine that circuit 832 judges bare crystalline junction temperature T for example, distributingJWhether Less than predetermined temperature TEX1, alternatively, power PCWhether predetermined power P is less thanEX1(step 1131 and step 1132), wherein when sentencing Disconnected bare crystalline junction temperature T outJLess than predetermined temperature TEX1, alternatively, power PCLess than predetermined power PEX1When, it distributes and determines that circuit 832 can To determine to meet the standard that exits, and indicated horsepower distributor circuit 834 releases the adjusting (step 944) of Secondary Heat Source.In addition, It distributes and determines that circuit 832 is determining bare crystalline junction temperature TJNot less than predetermined temperature TEX1And power PCNot less than predetermined power PEX1 In the case where, it distributes and determines circuit 832 not to distributing to heat source Power be adjusted (step 946).
Thermal conditioning is triggered since different operation scenarios corresponds to different standards, it distributes and determines that circuit 832 can join Different operation scenarios is examined to determine at least one of aforementioned predetermined temperature and predetermined power.For example, distribution determines Circuit 832 determines whether operation scenario SR is predetermined scene (step 1120) first, for example, the temperature field high environment (ambient) Scape.After determining that operation scenario SR is predetermined scene, distributes and determine that circuit 832 determines bare crystalline junction temperature TJWhether it is less than predetermined Temperature TEX2And/or power PCWhether predetermined power P is less thanEX2, determine whether to meet and exit standard (step 1136 and step 1137), wherein predetermined temperature TEX2Predetermined temperature T can be less thanEX1, and, predetermined power PEX2Predetermined power can be less than PEX1。
In brief, when determine to meet to exit standard and operation scenario SR be predetermined scene when, above-mentioned predetermined temperature etc. In the first temperature threshold (TEX2), and, above-mentioned predetermined power is equal to the first power threshold (PEX2)；Mark is exited when determining to meet When quasi- and operation scenario SR is not predetermined scene, above-mentioned predetermined temperature is equal to second temperature threshold value (TEX1), and, it is above-mentioned predetermined Power is equal to the second power threshold (PEX1)；Wherein, second temperature threshold value can be different from the first temperature threshold, and, the second function Rate threshold value can be different from the first power threshold.In one example, if predetermined scene SR is high environment temperature scene, the second temperature The first temperature threshold can be greater than by spending threshold value, and, the second power threshold can be greater than the first power threshold.
The purpose being merely to illustrate above, is not meant to limitation of the present invention.For example, it is assumed that result is essentially identical, Then step does not need to execute according to precise sequence shown in Figure 11.In the alternative design, step 1132 can step 1131 it Preceding execution.In another alternate design, step 1137 can execute before step 1136.In addition, being used to determine whether to meet The predetermined temperature for exiting standard can be less than or equal to for determining whether user experience is likely to reduced predetermined temperature.Example Such as, predetermined temperature T shown in Figure 11EX1(for example, 55 DEG C) are less than predetermined temperature T shown in Fig. 10TRIP1(for example, 60 DEG C), and/ Or, predetermined temperature T shown in Figure 11EX2(for example, 50 DEG C) are less than predetermined temperature T shown in Fig. 10TRIP2(for example, 55 DEG C).This Outside, it is used to determine whether that the predetermined power for meeting the standard that exits can be less than or equal to for determining whether user experience is likely to Reduced predetermined power.For example, predetermined power P shown in Figure 11EX1Predetermined power P shown in Fig. 10 can be equal toS1(for example, 900mW), and/or, predetermined power P shown in Figure 11EX2Predetermined power P shown in Fig. 10 can be equal toS2(for example, 600mW).
As described above, the power management mechanism proposed is with reference to the operation identified before executing power budget distribution Scene determines heat source priority.Referring again to Fig. 8.In the present embodiment, priority classification device 833 is according to before performed Multiple heat sources are categorized into different priority by the demand of platform application.For example, priority classification device 833 can be by multiple heat sources point Class be the first priority P C1, the second priority P C2 and third priority PC3, wherein with the first priority P C1 heat source with Foreground application is highly relevant, and the heat source with the second priority P C2 is related at least one background application, and, there is third The heat source of priority P C3 is unrelated with foreground application and at least one background application.Therefore, in order to maintain to answer performed foreground User experience (that is, primary user experiences), the system power budget of electronic device 800 can be distributed to preferably with first The heat source of priority P C1, and, electronic device 800 preferably adjust or limit with the other PC3 of third priority heat source (or Heat source with the second priority level PC2), to increase the power for distributing to other heat sources.
Next, priority classification device 833 reference operation scene SR determines heat source H S1-HSNEach priority, and it is corresponding Ground generates or generates heat source priority list PR.In heat source H S1-HSNIncluding processing module (for example, processing module shown in Fig. 2 211), network module (for example, WiFi module shown in Fig. 2 212 and/or modulation /demodulation module 214) and charging module (for example, Charging module 213 shown in Fig. 2) an example in, each priority of processing module, network module and charging module can be shown In following table 2, wherein table 2 is also shown corresponding to the preferential of the not operation scenario of startup power budget allocation (or SPA) Grade classification.
Table 2
Since identical application can be divided into different priority in different operation scenarios, priority classification device The 833 heat source priority list PR generated can have different contents according to different operation scenarios.By taking table 2 as an example, in electronics Device 800 determines the case where startup power budget allocation and its battery capacity are less than threshold value (for example, 15% of battery capacity) Under (that is, low cell condition), heat source priority list PR can be specific heat source priority list, indicate that charging module has the One priority P C1, and, each of processing module and network module have the second priority P C2.In electronic device 800 In the other case of determining startup power budget allocation and its battery capacity sufficient (for example, default scene), heat source priority Table PR can be the heat source priority list of default, indicate that processing module has the first priority P C1, network module has second Priority P C2, and, charging module has third priority PC3.
It should be noted that the purpose that priority classification shown in table 2 is merely to illustrate, is not meant to the present invention Limitation.For example, the content of heat source priority list PR can be adjusted according to design requirement/consideration.
Figure 12 be show according to embodiments of the present invention it is a kind of for determining the stream of the illustrative methods of heat source priority list Cheng Tu.For illustrative purposes, method shown in Figure 12 distributes (SPA) circuit 830 with system power shown in Fig. 8 to describe. Method shown in Figure 12 may be summarized as follows.
Step 1240: starting.
Step 1242: priority classification device 833 determines whether operation scenario SR corresponds to specific heat source priority list.If It is then to enter step 1244；Otherwise, 1246 are entered step.By way of example rather than limited significance, when operation scenario SR is When low battery scene, operation scenario SR is determined as (example corresponding with specific heat source priority list by priority classification device 833 Such as, expression charging module shown in table 2 has the specific heat source priority list of the first priority P C1)；As operation scenario SR For default scene when, priority classification device 833 can determine operation scenario SR correspond to default heat source priority list (for example, The heat source priority list of default shown in table 2, instruction charging module have the other PC3 of third priority).
Step 1244: priority classification device 833 is electric as power distribution is supplied to using the specific heat source priority list The heat source priority list PR on road 834.
Step 1246: priority classification device 833 is electric as power distribution is supplied to using the heat source priority list of the default The heat source priority list PR on road 834.
The technical staff in the technical field is after the above paragraph of ocr sheet 2 and Fig. 8, it should be appreciated that shown in Figure 12 The operation of each step omit further description herein for simplicity.
In detailed description above, for illustrative purposes, numerous specific details are set forth, so as to technical field In technical staff can thoroughly understand the embodiment of the present invention.It will be apparent, however, that can there is no these specific Implement one or more embodiments in the case where details, different embodiments can combine according to actual needs, and should not It is only limitted to embodiment cited by attached drawing.
Although the present invention is described by way of example and according to preferred embodiment, it should manage Solution, the present invention is not limited to disclosed embodiments.On the contrary, it be intended to cover various modifications and similar structure (such as Those skilled in the art will be apparent).Therefore, scope of the appended claims should be endowed widest explanation, to contain Cover all these modifications and similar structure.

Claims (14)

1. a kind of power management method, which is characterized in that the power management method is used for the electronic device including multiple heat sources, should Multiple heat sources are used to execute the application on the electronic device, and, which includes:
It is determined with reference at least one of the temperature of the electronic device, power and operation scenario and the application on the electronic device Whether associated user experience, which is likely to, reduces；And
If it is determined that be likely to reduce using associated user experience on the electronic device, then distribute multiple heat source it Between power budget, so that the electronic device is avoided enter into or is delayed into heat regulation mode.
2. power management method as described in claim 1, which is characterized in that when determining and the application phase on the electronic device When associated user experience is likely to reduce, the step of power budget between the multiple heat source of the distribution, includes:
Reduce the power of the Secondary Heat Source in multiple heat source, with the power budget distributed between multiple heat source, wherein the electricity Sub-device runs the application using the first heat source in multiple heat source, and, first heat source than the Secondary Heat Source with greater need for Operation application.
3. power management method as claimed in claim 2, which is characterized in that the Secondary Heat Source reduced in multiple heat source Power, with distribute between multiple heat source power budget the step of include:
Heat source priority list is generated according to the operation scenario, and, which is determined according to the heat source priority list, In, which shows that the priority of first heat source is higher than the priority of the Secondary Heat Source.
4. power management method as described in claim 1, which is characterized in that the temperature with reference to the electronic device, power Determine whether be likely to drop using associated user experience on the electronic device at least one of operation scenario Low step includes:
When the operation scenario be the first predetermined scene when, it is determined that go out on the electronic device using associated user experience It is likely to reduce；And
When the operation scenario is not first predetermined scene, at least determines with reference to the temperature of the electronic device and filled with the electronics Whether that sets is likely to reduce using associated user experience.
5. power management method as claimed in claim 4, which is characterized in that first predetermined scene is camera scene or low electricity Pond scene.
6. power management method as claimed in claim 4, which is characterized in that described at least to come with reference to the temperature of the electronic device It determines and includes: the step of whether being likely to reduction using associated user experience on the electronic device
Determine whether the rate of change of the temperature is greater than predetermined speed；
Wherein, when the rate of change of the temperature is greater than the set rate, it is determined that go out related to the application on the electronic device The user experience of connection is likely to reduce.
7. power management method as claimed in claim 4, which is characterized in that described at least to come with reference to the temperature of the electronic device It determines and includes: the step of whether being likely to reduction using associated user experience on the electronic device
Determine whether the temperature is greater than the first predetermined temperature and whether the power is greater than the first predetermined power；
Wherein, when the temperature is greater than first predetermined temperature and the power is greater than first predetermined power, it is determined that go out and this It is likely to reduce using associated user experience on electronic device.
8. power management method as claimed in claim 7, which is characterized in that described at least to come with reference to the temperature of the electronic device Determine whether be likely to the step of reducing using associated user experience on the electronic device further include:
First predetermined temperature and first predetermined power are determined according to the operation scenario；
Wherein, when the operation scenario is the second predetermined scene, which is equal to the first temperature threshold, this is first pre- Power is determined equal to the first power threshold；And when the operation scenario is not second predetermined scene, first predetermined temperature etc. In second temperature threshold value, which is equal to the second power threshold, wherein second temperature threshold value is different from first temperature Threshold value is spent, the second power threshold is different from first power threshold.
9. power management method as claimed in claim 8, which is characterized in that second predetermined scene is high environment temperature field Scape, and, which is greater than first temperature threshold, which is greater than first power threshold.
10. power management method as claimed in claim 2, which is characterized in that when the function of the Secondary Heat Source in multiple heat source Rate is reduced, and when determining with being less likely to reduce using associated user experience on the electronic device, the power Management method further include:
Determine whether the temperature is lower than the second predetermined temperature or whether the power is lower than the second predetermined power；And
When the temperature is lower than second predetermined power lower than second predetermined temperature or the power, stop reducing second heat The power in source.
11. a kind of electronic device, comprising:
Multiple heat sources, for executing the application on the electronic device；
And
System power distributor circuit comes true at least one of temperature, power and the operational scenarios with reference to the electronic device It is fixed whether to be likely to reduce using associated user experience on the electronic device；If it is determined that on the electronic device It is likely to reduce using associated user experience, then distributes the power budget between multiple heat source, keep away the electronic device Exempt to enter or delay into heat regulation mode.
12. electronic device as claimed in claim 11, which is characterized in that related to the application on the electronic device when determining When the user experience of connection is likely to reduce, which reduces the power of the Secondary Heat Source in multiple heat source, With the power budget distributed between multiple heat source；
Wherein, which runs the application using the first heat source in multiple heat source, and, first heat source than this Two heat sources are applied with greater need for operation.
13. electronic device as claimed in claim 12, which is characterized in that the power of the Secondary Heat Source in multiple heat source is subtracted It is small, and, which is also used to determine whether the temperature of the electronic device is less than predetermined temperature, alternatively, should Whether the power of electronic device is less than predetermined power, with after the power for reducing the Secondary Heat Source in multiple heat source determination be The no power for continuing to reduce the Secondary Heat Source；And when the temperature of the electronic device is less than the predetermined temperature or the electronic device Power be less than the predetermined power when, the system power distributor circuit stop reduce the Secondary Heat Source power.
14. electronic device as claimed in claim 12, which is characterized in that the system power distributor circuit is also used to according to the behaviour Make scene and generates heat source priority list, and, which is determined according to the heat source priority list, wherein the priority list Show that the priority of first heat source is higher than the priority of the Secondary Heat Source.
CN201810177770.1A 2018-03-05 2018-03-05 Power management method and electronic device Withdrawn CN110233926A (en)

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Application publication date: 20190913