CN110223973B

CN110223973B - Electronic device and method of manufacturing or operating an electronic device

Info

Publication number: CN110223973B
Application number: CN201910136766.5A
Authority: CN
Inventors: M·E·塔特尔
Original assignee: Micron Technology Inc
Current assignee: Micron Technology Inc
Priority date: 2018-03-02
Filing date: 2019-02-25
Publication date: 2023-12-22
Anticipated expiration: 2039-02-25
Also published as: US11564331B2; US20210059074A1; US20190274232A1; US10834853B2; CN110223973A

Abstract

The present application relates to electronic devices and methods of manufacturing or operating electronic devices. A semiconductor device includes: a substrate; a first functional circuit attached to the substrate; a first thermal loop attached to the substrate configured to utilize a cryogenic liquid to cool the first functional circuit; a second functional circuit attached to the substrate; and a second thermal loop attached to the substrate configured to cool the second functional circuit without using the cryogenic liquid.

Description

Electronic device and method of manufacturing or operating an electronic device

RELATED APPLICATIONS

The present application contains the subject matter of U.S. patent application entitled "ELECTRONIC device with package-level thermal REGULATOR mechanism" and ASSOCIATED systems, devices, and METHODS (ELECTRONIC DEVICE WITH A PACKAGE-LEVEL THERMAL REGULATOR MECHANISM AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS) directed to Mark Tuttle simultaneous delivery. Related applications are assigned to magnesium phototechnology limited (Micron Technology, inc.) and are identified by docket No. 010829-9249.Us 00. The subject matter of which is incorporated herein by reference.

Technical Field

The present technology relates to electronic devices, and in particular, to electronic devices having card-level temperature adjustment mechanisms.

Background

Electronic devices, such as card-level devices, typically include one or more semiconductor devices or components mounted on another structure, such as a Printed Circuit Board (PCB). For example, an electronic device may include a die or die package (e.g., a processor, memory chip, etc.) that includes functional features, such as for a memory unit, a processor circuit and an imager device, and interconnects electrically connected to the functional features.

Different parts/circuits/devices within an electronic device may behave in different ways at different temperatures. For example, at higher temperatures, the electronic device may experience data errors (e.g., during operation) and/or structural failures (e.g., exacerbated by device operation or independent of device operation). Generally, operating an electronic device at a lower temperature may allow for faster operation and/or better performance (e.g., reduced noise). However, at very low (e.g., low temperature) operating temperatures, some electronic devices may experience other undesirable effects, including performance degradation and/or structural failure (e.g., due in part to thermal gradients between the heat-generating features of the device and other portions of the device).

Disclosure of Invention

In one aspect, the present application provides an electronic device comprising: a substrate; a first functional circuit attached to the substrate; a first thermal loop configured to utilize a cryogenic liquid to cool a first functional circuit; a second functional circuit attached to the substrate; and a second thermal loop configured to cool the second functional circuit without using a cryogenic liquid.

In another aspect, the present application provides a method of manufacturing an electronic device, comprising: providing a printed circuit board; attaching a first functional circuit to the printed circuit board, the first functional circuit configured to process data; attaching a second functional circuit to the printed circuit board, the second functional circuit configured to store data; thermally coupling a first thermal loop to a first functional circuit, the first functional circuit configured to utilize a cryogenic liquid to cool the first functional circuit; and thermally coupling a second thermal loop to the second functional circuit, the second thermal loop configured to cool the second functional circuit without using a cryogenic liquid.

In another aspect, the present application provides a method of manufacturing an electronic device, comprising: providing a printed circuit board; attaching a first functional circuit to the printed circuit board, the first functional circuit configured to process data; providing a second functional circuit including a heating element therein, wherein the second functional circuit is configured to store data; attaching a second functional circuit to the printed circuit board; and immersing the printed circuit board, the first functional circuit, and the second functional circuit in a cryogenic liquid to cool the first functional circuit to a cryogenic temperature, wherein the heating element is configured to heat the second functional circuit to a non-cryogenic temperature.

In another aspect, the present application provides a method of operating an electronic device, comprising: processing data using a first functional circuit and a second functional circuit, wherein the first functional circuit is a logic circuit and the second functional circuit is a data storage circuit; managing a first operating temperature using a cryogenic liquid for the first functional circuit; and managing a second operating temperature for the second functional circuit, wherein the second operating temperature is a non-cryogenic temperature.

Drawings

Fig. 1 is a cross-sectional view of an electronic device in accordance with an embodiment of the present technology.

Fig. 2 is a cross-sectional view of an electronic device in accordance with another embodiment of the present technology.

Fig. 3A is a cross-sectional view of an electronic device along line 3-3 in fig. 3B in accordance with another embodiment of the present technique.

Fig. 3B is a top view of the electronic device of fig. 3A in accordance with another embodiment of the present technique.

FIG. 4 is a flowchart illustrating an example method of manufacturing an electronic device in accordance with an embodiment of the present technology.

FIG. 5 is a flowchart illustrating another example method of manufacturing an electronic device in accordance with an embodiment of the present technology.

FIG. 6 is a flowchart illustrating an example method of operating an electronic device in accordance with an embodiment of the present technology.

FIG. 7 is a block diagram illustrating a system incorporating an electronic device in accordance with an embodiment of the present technology.

Detailed Description

The technology disclosed herein relates to electronic devices (e.g., card-level devices having one or more semiconductor devices thereon), systems including electronic devices, and related methods for manufacturing and operating electronic devices and systems. The term "semiconductor device" generally refers to a solid state device comprising one or more semiconductor materials. Examples of semiconductor devices include logic devices, memory devices, imagers, diodes, and the like. Furthermore, the term "semiconductor device" may refer to a finished device or an assembly or other structure at various stages of processing prior to becoming a finished device. Depending on the context in which it is used, the term "substrate" may refer to a structure that supports an electronic component (e.g., a die), such as a wafer level substrate, or to a singulated die level substrate, another die for die stacking or 3DI applications, or a PCB. Those of skill in the art will recognize that the appropriate steps of the methods described herein may be performed at the wafer level, at the die level, at the package level, or at the card level. Furthermore, conventional semiconductor fabrication techniques may be used to form the structures disclosed herein unless the context indicates otherwise. For example, the material may be deposited using chemical vapor deposition, physical vapor deposition, atomic layer deposition, spin coating, and/or other suitable techniques. Similarly, the material may be removed using plasma etching, wet etching, chemical-mechanical planarization, or other suitable techniques, for example.

Various embodiments of the present technology are described below in the context of regulating an operating temperature of an electronic device. For example, an electronic device may include one or more temperature controlled components (e.g., heating elements, such as die-level heaters, package-level heaters, and/or card-level heaters, cooling devices, etc.) to maintain the temperature of a particular component (e.g., a corresponding operating temperature) at a different temperature.

In some examples, one device or system may include components or subsystems (e.g., logic die) that benefit from lower (e.g., cryogenic) operating temperatures, along with other components or subsystems (e.g., memory die) that benefit from relatively higher operating temperatures. For such devices, the overall device or system may implement a plurality of temperature regulation components (e.g., a first thermal regulator for reducing the operating temperature to at or near a low temperature level and a second thermal regulator for maintaining the operating temperature between the low temperature level and ambient temperature).

In some embodiments, the electronic device may include one or more heating elements (e.g., resistors configured to increase thermal energy independent of circuit/signal contributions) on or embedded within the semiconductor die, substrate, package, PCB, or combination thereof. For example, the first thermal regulator may include a low temperature liquid cooling circuit configured to cool a circuit (e.g., a logic circuit, such as a central processing unit), and the second thermal regulator may include a liquid (e.g., non-low temperature) cooling circuit or an air cooling circuit configured to cool a second circuit (e.g., a memory circuit, such as a dual in-line memory module (DIMM)). Also, for example, the first thermal regulator may include a cryobath for the overall device/system, and the second thermal regulator may include a heating element (e.g., a die-level or package-level heater).

As used herein, the terms "vertical," "lateral," "upper," and "lower" may refer to the relative directions or positions of features in a semiconductor die assembly in view of the orientations shown in the figures. For example, "upper" or "uppermost" may refer to a feature that is positioned closer to the top of the page than another feature. However, these terms should be broadly construed to include semiconductor devices having other orientations, such as inverted or tilted orientations, wherein top/bottom, above/below, up/down, and left/right sides are interchangeable depending on the orientation.

Fig. 1 is a cross-sectional view of an electronic device 100 (e.g., a circuit assembly including a semiconductor die assembly or package, such as a 3DI device or die stack package) in accordance with an embodiment of the present technology. The electronic device 100 may include a circuit substrate 102 (e.g., a PCB) for supporting and/or electrically connecting (e.g., using traces and/or wires on the circuit substrate 102 or traces and/or wires integral to the circuit substrate 102) electronic components (e.g., processors, memory, passive or analog devices, etc.). For example, the electronic device 100 may include a first functional circuit 104 and a second functional circuit 106 attached to a circuit substrate 102.

The electronic device 100 may include components configured to perform different functions. For example, the first functional circuit 104 may include a semiconductor device (e.g., a semiconductor die or package) configured to perform logic manipulation/computation (e.g., for a device including one or more logic dies, such as a processor, central Processing Unit (CPU), etc.). The second functional circuitry 106 may include one or more semiconductor devices 108 (e.g., non-volatile memory, such as magnetic storage devices or flash memory devices, and/or volatile memory, such as Random Access Memory (RAM)) attached to one or more component substrates 110. The second functional circuit 106 may be configured to store data and provide access to previously stored data. In some embodiments, the second functional circuit 106 may include one or more dual in-line memory modules (DIMMs).

Based on the different configurations/functions of the components, the electronic device 100 may include components having different target operating temperatures. For example, the first functional circuit 104 (e.g., including a logic die) may benefit from a lower (e.g., low temperature) operating temperature. The second functional circuit 106 (e.g., a memory device) may benefit from a higher operating temperature than the first functional circuit 104. In some embodiments, the target operating temperature of the second functional circuit 106 may be in a range above the cryogenic temperature and up to at most ambient temperature or about ambient temperature.

Accordingly, the electronic device 100 may include components/circuitry configured to regulate/manage the operating temperature of one or more components thereon. For example, the electronic device 100 may include: a first thermal loop 120 configured to regulate/manage a first operating temperature 126 of the first functional circuit 104; and a second thermal loop 140 configured to regulate/manage a second operating temperature 146 of the second functional circuit 106.

In some embodiments, the first thermal loop 120 may be configured to cool the first functional circuit 104 and/or maintain the first operating temperature 126 at or near a cryogenic temperature. For example, the first thermal circuit 120 may include a cryogenic liquid cooling circuit that includes or utilizes (e.g., circulates) a cryogenic liquid 122 (e.g., in liquid form of argon, helium, nitrogen, etc.) thermally coupled to the first functional circuit 104 (e.g., by a thermal conductor of the first thermal circuit configured to remove thermal energy from the first functional circuit 104). The cryogenic liquid 122 may correspond to a boiling point at or below minus 150 degrees celsius, or a boiling point at or below minus 180 degrees celsius (e.g., cryogenic level).

The cryogenic liquid 122 may be contained within the enclosure 124 and physically separated (e.g., without direct contact) from the first thermal circuit 120. The casing 124 may directly contact or attach (e.g., using thermally conductive mechanical fasteners or adhesives) to the first functional circuitry 104 (e.g., at a surface thereof opposite the circuit substrate 102). The enclosure 124 may include thermally conductive structures configured to transfer thermal energy away from the first thermal circuit 120 (e.g., through direct contact, attachment mechanisms, thermal synchronization, or different heat transfer mechanisms thermally coupled to the first functional circuit 104 and the cryogenic liquid 122).

In some embodiments, the second thermal loop 140 may be configured to cool the second functional circuit 106 for maintaining the second operating temperature 146 above the cryogenic temperature. For example, the second thermal circuit 140 may include a circuit that does not use a cryogenic liquid, such as an air cooling circuit or a liquid cooling circuit that utilizes a non-cryogenic liquid (e.g., water).

Separate cooling circuits (e.g., a first thermal circuit 120 containing/utilizing the cryogenic liquid 122 and a second thermal circuit 140 separate from the first thermal circuit 120) may improve the efficiency of the electronic device 100. The first thermal circuit 120 may maintain the first operating temperature 126 at or near a low temperature and the second thermal circuit 140 may maintain the second operating temperature 146 at a different temperature above the low temperature level. Accordingly, the electronic device 100 may maintain different operating temperatures for the first functional circuit 104 and the second functional circuit 106 corresponding to improved performance of the corresponding circuits. In addition, a separate cooling circuit may allow the electronic device 100 to implement or utilize devices that improve performance at extremely low temperatures (e.g., for supercomputers) along with other relatively inexpensive or readily available support devices (e.g., memory modules).

For brevity, certain aspects of the cooling system are not shown. However, those skilled in the art will understand that the electronic device 100 will include or operate with other components or devices. For example, the first thermal loop 120, the second thermal loop 140, or a combination thereof may further include or be operably coupled to a monitoring circuit that senses an operating temperature of the target device (e.g., the first operating temperature 126 or the second operating temperature 146), a compressor to cool the liquid, a pump to circulate the liquid, a fan, a control circuit that operates different components or devices in the cooling loop (e.g., for adjusting the operating temperature), and so forth.

Fig. 2 is a cross-sectional view of an electronic device 200 (e.g., a circuit assembly including a semiconductor die assembly or package, such as a 3DI device or die stack package) in accordance with another embodiment of the present technology. The electronic device 200 may include a circuit substrate 202 (e.g., a PCB) for supporting and/or electrically connecting (e.g., using traces and/or wires on the circuit substrate 202 or traces and/or wires integral to the circuit substrate 202) electronic components (e.g., processors, memory, passive or analog devices, etc.). For example, the electronic device 200 may include a first functional circuit 204 and a second functional circuit 206 attached to a circuit substrate 202.

The electronic device 200 may include components configured to perform different functions. For example, the first functional circuit 204 may include a semiconductor device (e.g., a semiconductor die or package) configured to perform logic manipulation/computation (e.g., for a device including one or more logic dies, such as a processor, central Processing Unit (CPU), etc.). The second functional circuitry 206 may include one or more semiconductor devices 208 (e.g., non-volatile memory, such as magnetic storage devices or flash memory devices, and/or volatile memory, such as Random Access Memory (RAM)) attached to one or more component substrates 210. The second functional circuitry 206 may be configured to store data and provide access to previously stored data. In some embodiments, the second functional circuit 206 may include one or more dual in-line memory modules (DIMMs).

In some embodiments, the component may include a component cover 212. The component cover 212 (e.g., a housing or enclosure) may enclose or encapsulate the circuit, the component, a portion thereof, or a combination thereof in a corresponding device. As illustrated in fig. 2, some of the second functional circuits (e.g., DIMMs) may include a component cover 212 covering the semiconductor device 208, the component substrate 210, a portion thereof, or a combination thereof. The component cover 212 may physically separate or isolate the covered circuitry from the external environment.

Based on the different configurations/functions of the components, the electronic device 200 may include components having different target operating temperatures. For example, the first functional circuit 204 (e.g., including a logic die) may benefit from a lower (e.g., low temperature) operating temperature. The second functional circuit 206 (e.g., a memory device) may benefit from being higher than the operating temperature of the first functional circuit 204. In some embodiments, the target operating temperature of the second functional circuit 206 may be in a range above the cryogenic temperature and up to at most ambient temperature or about ambient temperature.

Accordingly, the electronic device 200 may include components/circuitry configured to regulate/manage the operating temperature of one or more components thereon. For example, the electronic device 200 may include: a first thermal loop 220 configured to regulate/manage a first operating temperature 226 of the first functional circuit 204; and a second thermal loop 240 configured to regulate/manage a second operating temperature 246 of the second functional circuit 206.

In some embodiments, the first thermal loop 220 may be configured to cool the first functional circuit 204 and/or maintain the first operating temperature 226 at or near a cryogenic temperature. For example, the first thermal loop 220 may include a cryogenic bath for immersing the circuit substrate 202 and components/circuits attached thereto in a cryogenic liquid 222 (e.g., liquid argon, helium, nitrogen, etc.). Accordingly, the cryogenic liquid 222 may directly contact the first functional circuit 204 and reduce the first operating temperature 226. The cryogenic liquid 222 may be contained within an enclosure 224 (e.g., a thermal insulator and/or a sealed container for maintaining the cryogenic liquid 222 and/or vaporized gas enclosed therein and/or circulated through a thermal control system, e.g., an external cooler).

Accordingly, the second thermal loop 240 may be configured to maintain the second operating temperature 246 above the cryogenic temperature. When the second thermal circuit 240 is submerged in the cryogenic liquid 222, the second thermal circuit 240 may heat the second thermal circuit 240 to maintain the second operating temperature 246 above the cryogenic temperature.

In some embodiments, the second thermal loop 240 may include one or more die-level heaters 242 (e.g., resistors attached to the second functional circuit 206 at, for example, a semiconductor level or integral with the second functional circuit 206) configured to directly heat the corresponding circuits/devices. In some embodiments, the second thermal loop 240 may include one or more package-level heaters 244 (e.g., resistors attached to the component substrate 210 or integral with the component substrate 210 and physically separate from the semiconductor device 208) configured to fully heat the second thermal loop 240. The second thermal loop 240 may include a component cover 212 configured to transfer thermal energy from the package-level heater 244 to the semiconductor device 208 (e.g., based on thermally conductive components in the component substrate 210). The second thermal loop 240 may further include a component cover 212 (e.g., an outer layer) configured to thermally isolate the semiconductor device 208 from the cryogenic liquid 222.

Separate thermal control circuits (e.g., a first thermal circuit 220 that utilizes a cryogenic liquid 222 for a cryogenic bath and a second thermal circuit 240 that is separate from the first thermal circuit 220) may improve the efficiency of the electronic device 200. The first thermal circuit 220 may maintain the first operating temperature 226 at or near a low temperature and the second thermal circuit 240 may maintain the second operating temperature 246 at a different temperature above the low temperature level. Accordingly, the electronic device 200 may maintain different operating temperatures for the first functional circuit 204 and the second functional circuit 206 corresponding to improved performance of the corresponding circuits.

Fig. 3A is a cross-sectional view of an electronic device 300 (e.g., a circuit assembly including a semiconductor die assembly or package, such as a 3DI device or die stack package) along line 3-3 in fig. 3B, in accordance with another embodiment of the present technique. The electronic device 300 may include a circuit substrate 302 (e.g., PCB) for supporting and/or electrically connecting (e.g., using traces and/or wires on the circuit substrate 302 or integral with the circuit substrate 302) electronic components (e.g., processors, memory, passive or analog devices, etc.). For example, the electronic device 300 may include a first functional circuit 304 and a second functional circuit 306 attached to a circuit substrate 302.

The electronic device 300 may include components configured to perform different functions. For example, the first functional circuit 304 may include a semiconductor device (e.g., a semiconductor die or package) configured to perform logic manipulation/computation (e.g., for a device including one or more logic dies, such as a processor, central Processing Unit (CPU), etc.). The second functional circuitry 306 may include one or more semiconductor devices 308 (e.g., non-volatile memory, such as magnetic storage devices or flash memory devices, and/or volatile memory, such as Random Access Memory (RAM)) attached to one or more component substrates 310. The second functional circuitry 306 may be configured to store data and provide access to previously stored data. In some embodiments, the second functional circuit 306 may include one or more dual in-line memory modules (DIMMs).

The electronic device 300 may include components having different target operating temperatures based on different configurations/functions of the components. For example, the first functional circuit 304 (e.g., including a logic die) may benefit from a lower (e.g., low temperature) operating temperature. The second functional circuit 306 (e.g., a memory device) may benefit from a higher operating temperature than the first functional circuit 304. In some embodiments, the target operating temperature of the second functional circuit 306 may be in a range above the cryogenic temperature and up to at most ambient temperature or about ambient temperature.

Accordingly, the electronic device 300 may include components/circuitry configured to regulate/manage the operating temperature of one or more components thereon. For example, the electronic device 300 may include: a first thermal loop 320 configured to regulate/manage a first operating temperature 326 of the first functional circuit 304; and a second thermal loop 340 configured to regulate/manage a second operating temperature 346 of the second functional circuit 306.

In some embodiments, the first thermal loop 320 may be configured to cool the first functional circuit 304 and/or maintain the first operating temperature 326 at or near a cryogenic temperature. For example, the first thermal loop 320 can include a cryogenic liquid 322 (e.g., liquid argon, helium, nitrogen, etc.) contained within an enclosure 324 (e.g., a thermal insulator and/or a sealed container for maintaining the cryogenic liquid 322 and/or vaporized gas enclosed therein and/or circulated through a thermal control system, such as an external cooler). The enclosure 324 may enclose the first functional circuitry 304 therein such that the cryogenic liquid 322 directly contacts the first functional circuitry 304 for cooling the circuitry and lowering the first operating temperature 326.

Accordingly, the second thermal circuit 340 may be configured to maintain the second operating temperature 346 above the cryogenic temperature. When the second thermal circuit 340 is submerged in the cryogenic liquid 322, the second thermal circuit 340 may heat the second thermal circuit 340 to maintain the second operating temperature 346 above the cryogenic temperature.

In some embodiments, the circuit substrate 302 may include an insulating mechanism 352 (e.g., a thermal insulator, a structure incorporating one or more vacuum layers, etc.) on a top surface of the circuit substrate 302. The insulation mechanism 352 may underlie the first functional circuit 304, the casing 324, the second functional circuit 306, or a combination thereof and be attached to the first functional circuit 304, the casing 324, the second functional circuit 306, or a combination thereof. The insulating mechanism 352 may isolate the thermal effects of the cryogenic liquid 322 from the second functional circuitry 306, the remainder of the circuit substrate 302, or a combination thereof.

Separate thermal control circuits (e.g., a first thermal circuit 320 that utilizes a cryogenic liquid 322 for a cryogenic bath and a second thermal circuit 340 that is separate from the first thermal circuit 320) may improve the efficiency of the electronic device 300. The first thermal circuit 320 may maintain the first operating temperature 326 at or near a low temperature and the second thermal circuit 340 may maintain the second operating temperature 346 at a different temperature above the low temperature level. Accordingly, the electronic device 300 may maintain different operating temperatures for the first functional circuit 304 and the second functional circuit 306 corresponding to improved performance of the corresponding circuits.

Fig. 3B is a top view of the electronic device 300 of fig. 3A in accordance with another embodiment of the present technique. In some embodiments, the insulating mechanism 352 (e.g., thermal insulator) may be on a top surface of the circuit substrate and localized to a portion corresponding to the first functional circuit 304, the first thermal loop 320 (e.g., enclosure 324, cryogenic liquid 322, etc.), or a combination thereof. For example, a peripheral edge of the insulating mechanism 352 may be between the first functional circuit 304 and the second functional circuit 306.

FIG. 4 is a flowchart illustrating an example method 400 of manufacturing an electronic device in accordance with an embodiment of the present technology. For example, the method 400 may be used to manufacture the electronic device 100 of fig. 1, the electronic device 300 of fig. 3A and 3B, or a combination thereof.

At block 402, one or more functional circuits (e.g., semiconductor die, package, circuit card, etc.) may be provided. For example, a first functional circuit (e.g., first functional circuit 104 of fig. 1, first functional circuit 204 of fig. 2, first functional circuit 304 of fig. 3, etc., e.g., a processor or CPU) and a second functional circuit (e.g., second functional circuit 106 of fig. 1, second functional circuit 206 of fig. 2, second functional circuit 306 of fig. 3, etc., e.g., a memory or data storage circuit) may be provided for use in manufacturing an electronic device. In some embodiments, providing functional circuitry may include manufacturing or forming dies (e.g., based on wafer-level processing), assembling or forming packages (e.g., based on attaching and connecting electronic components), assembling or forming circuit cards, and so forth. In some embodiments, providing functional circuitry may include locating a die, a package, a circuit card, components therein, or a combination thereof.

At block 404, a circuit substrate (e.g., circuit substrate 102 of fig. 1, circuit substrate 202 of fig. 2, circuit substrate 302 of fig. 3, etc., e.g., a PCB) may be provided. In some embodiments, providing a circuit substrate may include forming a PCB (e.g., forming vias and/or traces, e.g., based on depositing and removing conductive material and electrical insulation). In some embodiments, providing a circuit substrate may include attaching electronic components (e.g., passive or analog components, digital components, power supplies or connections, etc.). In some embodiments, providing a circuit substrate may include positioning a die, a package, a circuit card, components therein, or a combination thereof.

At block 406, a thermal management loop may be provided for managing an operating temperature of the functional circuit. For example, a first thermal circuit (e.g., first thermal circuit 120 of fig. 1, first thermal circuit 220 of fig. 2, first thermal circuit 320 of fig. 3, etc., e.g., a cryogenic liquid cooling circuit or a cryobath for an overall circuit card or portion thereof) may be provided for managing a first operating temperature of the first functional circuit. The first thermal circuit may include an enclosure (e.g., enclosure 124 of fig. 1, enclosure 224 of fig. 2, enclosure 324 of fig. 3, etc.) configured to contain and/or circulate a cryogenic liquid (e.g., cryogenic liquid 122 of fig. 1, cryogenic liquid 222 of fig. 2, cryogenic liquid 322 of fig. 3, etc.). Also, for example, a second thermal loop (e.g., second thermal loop 140 of fig. 1, second thermal loop 240 of fig. 2, second thermal loop 340 of fig. 3, etc.) may be provided for managing a second operating temperature (e.g., higher than the first operating temperature, e.g., non-cryogenic temperature) of the second functional circuit without using cryogenic liquid. The second thermal circuit may include an air cooling circuit or a liquid cooling circuit that utilizes a non-cryogenic liquid (e.g., water).

In some embodiments, the thermal conductor may be configured for managing the operating temperature. For example, the housing may be attached to the first functional circuit. Also, for example, a casing may be attached over and enclose the first functional circuitry, e.g., over the insulating material/mechanism. And, for example, the thermal synchronization may be connected to the first functional circuit and connected or placed within the enclosure. The second thermal loop may be similarly configured with respect to the second functional circuit.

At block 408, an electronic device may be formed. Forming the electronic device may include assembling, connecting, and/or attaching the components to the circuit substrate. For example, the first functional circuit, the second functional circuit, the first thermal loop, the second thermal loop, or a combination thereof may be attached to the circuit substrate. Forming the electronic device may further include electrically connecting the circuit.

At block 410, the first thermal circuit may be filled or packed with a cryogenic liquid. For example, the enclosure of the first thermal circuit may be filled with a cryogenic liquid. Filling or priming the cryogenic liquid may include completing a cooling circuit, e.g., by connecting a conduit for circulating the cryogenic liquid, connecting to a chiller or supply tank, etc.

Fig. 5 is a flowchart illustrating an example method 500 of manufacturing an electronic device in accordance with an embodiment of the present technology. For example, the method 500 may be used to manufacture the electronic device 200 of fig. 2.

At block 502, one or more functional circuits (e.g., semiconductor die, package, circuit card, etc.) may be provided. For example, a first functional circuit (e.g., first functional circuit 104 of fig. 1, first functional circuit 204 of fig. 2, first functional circuit 304 of fig. 3, etc., e.g., a processor or CPU) and a second functional circuit (e.g., second functional circuit 106 of fig. 1, second functional circuit 206 of fig. 2, second functional circuit 306 of fig. 3, etc., e.g., a memory or data storage circuit) may be provided for use in manufacturing an electronic device. In some embodiments, providing functional circuitry may include manufacturing or forming dies (e.g., based on wafer-level processing), assembling or forming packages (e.g., based on attaching and connecting electronic components), assembling or forming circuit cards, and so forth. In some embodiments, providing functional circuitry may include locating a die, a package, a circuit card, components therein, or a combination thereof.

In some embodiments, providing a functional circuit may include providing a temperature regulating circuit (e.g., a thermal loop). At block 512, one or more heating elements (e.g., the second thermal loop 240 of fig. 2, e.g., resistors) may be provided. For example, the second functional circuit may be equipped with the die-level heater 342 of fig. 3 attached thereto or integrated therein. Also, for example, package-level heater 344 of fig. 3 may be provided.

In some embodiments, forming the second functional circuit may include forming the die-level heater 342 on or integrally with the semiconductor device of the second functional circuit. In some embodiments, forming the second functional circuit may include attaching the package-level heater 344 to a component substrate of the second functional circuit. In some embodiments, forming the second functional circuit may include attaching or forming a component cover.

At block 504, a circuit substrate (e.g., circuit substrate 102 of fig. 1, circuit substrate 202 of fig. 2, circuit substrate 302 of fig. 3, etc., e.g., a PCB) may be provided. In some embodiments, providing a circuit substrate may include forming a PCB (e.g., forming vias and/or traces, e.g., based on depositing and removing conductive material and electrical insulation). In some embodiments, providing a circuit substrate may include positioning a die, a package, a circuit card, components therein, or a combination thereof.

At block 506, the circuit substrate may be populated with components. The fill assembly may include attaching electronic components (e.g., passive or analog components, digital components, power supplies or connections, etc.) to the circuit substrate. The fill assembly may further include an attachment function circuit. For example, the fill assembly may include an attachment logic circuit (e.g., a first functional circuit) and an attachment memory circuit with a heater thereon.

At block 508, a thermal management loop may be provided. In some embodiments, providing a thermal management circuit may include providing a first thermal management circuit configured to contain a cryogenic liquid. For example, providing a thermal management circuit may include providing (e.g., forming or positioning) a housing for a cryogenic bath.

At block 510, an electronic device may be formed. Forming the electronic device may include placing the assembled circuit (e.g., a unitary card) in a housing. Forming the electronic device may further include filling the enclosure with a cryogenic liquid and immersing the assembled circuit in the cryogenic liquid.

Fig. 6 is a flowchart illustrating an example method 600 of operating an electronic device in accordance with an embodiment of the present technology. For example, the method 600 may be used to operate the electronic device 100 of fig. 1, the electronic device 200 of fig. 2, the electronic device 300 of fig. 3A and 3B, or a combination thereof.

At block 602, operating an electronic device may include processing data. For example, the electronic device may process data using a first functional circuit (e.g., first functional circuit 104 of fig. 1, first functional circuit 204 of fig. 2, first functional circuit 304 of fig. 3A and 3B, etc., e.g., a processor or CPU) and a second functional circuit (e.g., second functional circuit 106 of fig. 1, second functional circuit 206 of fig. 2, second functional circuit 306 of fig. 3, etc., e.g., a memory or data storage circuit). At block 612, the electronic device may operate a first functional circuit (e.g., logic circuit). At block 614, the electronic device may operate a second functional circuit (e.g., a memory or data storage device).

At block 604, the electronic device may manage a plurality of different operating temperatures for different components therein. The electronic device may manage different operating temperatures based on operating a thermal regulator loop that is each configured to manage an operating temperature of the corresponding device.

For example, at block 622, the electronic device may adjust an operating temperature (e.g., a first operating temperature) of the first functional circuit using the cryogenic liquid. The electronic device may use a first thermal circuit (e.g., first thermal circuit 120 of fig. 1, first thermal circuit 220 of fig. 2, first thermal circuit 320 of fig. 3A and 3B) configured to contain and utilize a cryogenic liquid to cool the first functional circuit to regulate the operating temperature.

In some embodiments, for example at block 642, adjusting the operating temperature by the first thermal loop may include implementing a cryogenic bath that submerges the first functional circuit in a cryogenic liquid. For example, the first thermal loop 220 may be used to immerse the circuit substrate 202 of fig. 2 and all components attached thereto in the cryogenic liquid 222 of fig. 2. Also, for example, the first thermal loop 320 may be used to enclose a first functional circuit without enclosing a second functional circuit or other components on the circuit substrate 302 of fig. 3A and 3B. Implementing the cryogenic bath may include circulating a cryogenic liquid, supplying a cryogenic liquid, cooling the vaporized gas back to a liquid, or a combination thereof.

In some embodiments, for example, at block 644, adjusting the operating temperature by the first thermal loop may include cooling the first functional circuit by thermal coupling. For example, the first thermal loop 120 (e.g., the enclosure 124 of fig. 1) may be directly attached to the first functional circuit or may be attached by a thermal conductor. The electronics can circulate cryogenic liquid, supply cryogenic liquid, cool the vaporized gas back to liquid, or a combination thereof for the cryogenic liquid in the enclosure 124 to adjust the operating temperature.

Also, for example, at block 624, the electronic device may adjust an operating temperature of the second functional circuit (e.g., a second operating temperature) without using cryogenic liquid or compensating for use of cryogenic liquid elsewhere. The electronic device may adjust the operating temperature using a second thermal loop (e.g., second thermal loop 140 of fig. 1, second thermal loop 240 of fig. 2, second thermal loop 340 of fig. 3A and 3B, etc.) configured to cool the second functional circuit using a non-cryogenic method (e.g., a solution for air cooling or a solution for liquid cooling using a non-cryogenic liquid, for example) or offset the use of the cryogenic liquid elsewhere outside the second thermal loop.

In some embodiments, for example, at block 652, adjusting the operating temperature by the second thermal loop may include heating the second functional circuit. For example, when the second functional circuit is immersed in a cryogenic liquid (e.g., such as for a cryogenic bath for an overall circuit card), one or more heating elements (e.g., die-level heater 242 of fig. 2, package-level heater 244 of fig. 2, etc.) may heat the second functional circuit to maintain its operating temperature above a low temperature level.

In some embodiments, for example, at block 654, adjusting the operating temperature by the second thermal circuit may include separately cooling the second thermal circuit without using a cryogenic liquid. For example, when the second functional circuit is sufficiently isolated or removed from the cryogenic liquid, the second thermal loop may circulate non-cryogenic methods, such as air or water, to cool the second functional circuit.

FIG. 7 is a block diagram illustrating a system incorporating an electronic device in accordance with an embodiment of the present technology. Any of the semiconductor devices having the features described above with reference to fig. 1-6 may be incorporated into a myriad of larger and/or more complex systems, a representative example of which is a system 790 schematically shown in fig. 7. The system 790 may include a processor 792, memory 794 (e.g., SRAM, DRAM, flash, and/or other memory devices), input/output devices 796, and/or other subsystems or components 798. The semiconductor assemblies, devices, and device packages described above with reference to fig. 1-6 may be included in any of the elements shown in fig. 7. The resulting system 790 may be configured to perform any of a wide variety of suitable computing, processing, storage, sensing, imaging, and/or other functions. Accordingly, representative examples of the system 790 include, but are not limited to, computers and/or other data processors, such as desktop computers, laptop computers, network appliances, hand-held devices (e.g., palm-top computers, wearable computers, cellular or mobile phones, personal digital assistants, music players, etc.), tablet computers, multiprocessor systems, processor-based or programmable consumer electronics, network computers, and minicomputers. Additional representative examples of the system 790 include lights, cameras, vehicles, and the like. With respect to these and other examples, system 790 may be housed in a single unit or distributed across multiple interconnected units, e.g., via a communications network. Accordingly, components of system 790 can include local and/or remote memory storage devices and any of a wide variety of suitable computer-readable media.

From the foregoing, it will be appreciated that, although specific embodiments of the inventive technique have been described herein for purposes of illustration, various modifications may be made without deviating from the invention. In addition, certain aspects of the invention described in the context of particular embodiments may be combined or removed in other embodiments. Moreover, while advantages associated with certain embodiments have been described in the context of those embodiments, other embodiments may also exhibit such advantages. Not all embodiments need exhibit such advantages that fall within the scope of the invention. Accordingly, the present disclosure and associated techniques may encompass other embodiments not explicitly shown or described herein.

Claims

1. An electronic device, comprising:

a substrate;

a first functional circuit attached to the substrate;

a first thermal circuit configured to submerge the first functional circuit in a cryogenic liquid to cool the first functional circuit with the cryogenic liquid;

a second functional circuit attached to the substrate; and

a second thermal loop configured to cool the second functional circuit, wherein at least a portion of the second functional circuit is physically isolated from the cryogenic liquid via a component cover.

2. The electronic device of claim 1, wherein the first thermal loop includes a housing configured to contain the cryogenic liquid, wherein the housing is thermally coupled to the first functional circuit.

3. The electronic device of claim 2, wherein the second functional circuit is not directly thermally coupled to the first thermal loop.

4. The electronic device of claim 1, wherein:

the first thermal circuit includes a housing configured to house the cryogenic liquid for implementing a cryogenic bath;

the second functional circuit and the second thermal circuit are immersed in the cryogenic liquid; and

the second thermal loop includes one or more heaters configured to heat the second functional circuit.

5. The electronic device of claim 4, wherein the second thermal loop includes a die-level heater, a package-level heater, or a combination thereof.

6. The electronic device of claim 5, wherein the second thermal loop further comprises:

the package-level heater is attached to the substrate and does not directly contact the second functional circuit, wherein the component cover is attached to the substrate and covers the second functional circuit and the package-level heater, and is configured to transfer thermal energy generated by the package-level heater to the second functional circuit.

7. The electronic device of claim 1, wherein:

the first thermal loop includes a housing attached over the substrate and surrounding the first functional circuit, the housing configured to contain the cryogenic liquid therein; and

the second functional circuit is external to the housing.

8. The electronic device of claim 7, wherein the substrate includes a thermal insulating material beneath the enclosure for surrounding the first functional circuit between the enclosure and the thermal insulating material.

9. The electronic device of claim 8, wherein the second functional circuit is directly attached to and over the insulating material.

10. The electronic device of claim 8, wherein a peripheral edge of the insulating material is between the first functional circuit and the second functional circuit.

11. The electronic device of claim 1, wherein the first functional circuit comprises a semiconductor logic device.

12. The electronic device of claim 1, wherein the second functional circuit comprises a semiconductor memory device.

13. The electronic device of claim 1, wherein:

The first thermal loop is configured to manage an operating temperature of the first functional circuit; and

the second thermal loop is configured to manage an operating temperature of the second functional circuit to be higher than the operating temperature of the first functional circuit.

14. The electronic device of claim 13, wherein the first thermal loop is configured to manage the operating temperature of the first functional circuit to be within a threshold range around a boiling point of the cryogenic liquid.

15. The electronic device of claim 13, wherein the cryogenic liquid comprises a liquid form of argon, helium, or nitrogen.

16. A method of manufacturing an electronic device, comprising:

providing a printed circuit board;

attaching a first functional circuit to the printed circuit board, the first functional circuit configured to process data;

attaching a second functional circuit to the printed circuit board, the second functional circuit configured to store data;

thermally coupling a first thermal circuit to the first functional circuit, the first thermal circuit configured to submerge the first functional circuit in a cryogenic liquid to cool the first functional circuit with the cryogenic liquid; and

A second thermal loop is thermally coupled to the second functional circuit, the second thermal loop configured to cool the second functional circuit, wherein at least a portion of the second functional circuit is physically isolated from the cryogenic liquid via a component cover.

17. The method of claim 16, wherein thermally coupling the first thermal loop includes attaching the first thermal loop to the first functional circuit, the printed circuit board, or a combination thereof.

18. The method according to claim 17, wherein:

the first thermal circuit includes a housing configured to contain the cryogenic liquid; and

thermally coupling the first thermal loop includes attaching the enclosure to the first functional circuit.

19. The method according to claim 16, wherein:

thermally coupling the first thermal circuit includes surrounding the first functional circuit by the enclosure, wherein the cryogenic liquid directly contacts the first functional circuit.

20. The method according to claim 19, wherein:

the printed circuit board comprises a thermal insulating material;

surrounding the first functional circuit by the housing includes:

Attaching the first functional circuit over the insulating material, and

the enclosure is attached over the insulating material.

21. A method of manufacturing an electronic device, comprising:

providing a printed circuit board;

providing a second functional circuit including a heating element therein, wherein the second functional circuit is configured to store data;

attaching the second functional circuit to the printed circuit board; and

immersing the printed circuit board, the first functional circuit, and the second functional circuit in a cryogenic liquid to cool the first functional circuit to a cryogenic temperature, wherein the heating element is configured to heat the second functional circuit to a non-cryogenic temperature, and wherein at least a portion of the second functional circuit is physically isolated from the cryogenic liquid via a component cover.

22. A method of operating an electronic device, comprising:

processing data using a first functional circuit and a second functional circuit, wherein the first functional circuit is a logic circuit and the second functional circuit is a data storage circuit;

Using a cryogenic liquid for the first functional circuit to manage a first operating temperature, wherein the first functional circuit and a second functional circuit are immersed in the cryogenic liquid, and wherein at least a portion of the second functional circuit is physically isolated from the cryogenic liquid via a component cover; and

a second operating temperature for the second functional circuit is managed, wherein the second operating temperature is a non-cryogenic temperature.