CN110222428A - A kind of reliability analysis system and method for system-oriented grade encapsulation SIP device - Google Patents
A kind of reliability analysis system and method for system-oriented grade encapsulation SIP device Download PDFInfo
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Abstract
The invention belongs to the Calculation of Reliability fields in system in package device, and in particular to a kind of reliability analysis system and method for system-oriented grade encapsulation SIP device.By the present invention in that finite element simulation data are constantly compared, verified and are corrected with actual experimental data.The simulated sampling of analogue system is supported by true experimental data, data are more nearly standard value.By the present invention in that being carried out reliability assessment respectively with the reliability analysis model for the system in package device under varying environment to the finite element model of the system in package device under varying environment, ensure that the accuracy of reliability.Reliability results of the invention have FEM Numerical Simulation support, while FEM Numerical Simulation is corrected by a small amount of typical actual experimental result verification again.Not only in the correctness and authenticity that ensure that result, while significantly shortening calculating cycle and experimentation cost.
Description
Technical field
The invention belongs to the Calculation of Reliability fields in system in package device, and in particular to a kind of system-oriented grade encapsulation
The reliability analysis system and method for SIP device.
Background technique
System in package is one of the important development direction of electronic component encapsulation technology, and wherein the calculating of reliability is to be
Important link in irrespective of size packaging design process, and it is reliable for the structure of system in package device under varying environment load
Property is also the most important thing.But due to the diversity of system in package device, the influence of the variability of local environment, it is impossible to for
Each system in package device carries out Calculation of Reliability, therefore, it is necessary to design a kind of system-oriented grade encapsulation SIP device
Reliability analysis system and method carry out the reliability of the effective computing system grade packaging of high speed, to analyze its reliability.
Summary of the invention
The purpose of the present invention is to provide a kind of reliability analysis systems of system-oriented grade encapsulation SIP device.
The purpose of the present invention is realized by following technical solution:
A kind of reliability analysis system of system-oriented grade encapsulation SIP device, including the test of system in package device architecture
Unit, system in package device architecture finite element simulation unit, reliability calculation unit and data storage and display unit；It is described
System in package device architecture test unit under varying environment load system in package device carry out simulation loading examination
It tests, and the test data of the system in package device under obtained varying environment load is imported into system in package device architecture
In finite element simulation unit；The system in package device architecture finite element simulation unit establishes having for system in package device
Meta-model is limited, the test data in conjunction with obtained in system in package device architecture test unit incites somebody to action FEM updating
Obtained revised system in package device architecture finite element model is imported into reliability calculation unit；The reliability
Computing unit to system in package device finite element model calculate structural reliability, and by obtained system in package device can
It is imported into data storage and display unit by property result；The data storage and display unit displays and store reliability meter
Calculate the reliability result for the system in package device that unit is calculated.
The present invention may also include:
The system in package device architecture test unit includes environmental load loading module, device constraints and perimeter strip
Part module and failure variable measurement module；The environmental load loading module applies the environment of simulation to system in package device
Load, and the environmental load data of application are imported into device constraints and boundary condition module and failure variable measurement module；
The device constraints and boundary condition module are according to the environmental load of application, to the boundary supporting condition of system in package device
It is adjusted, makes to be consistent when working in each supporting point and true environment of system in package device, and will be adjusted system-level
The boundary supporting condition of packaging is imported into failure variable measurement module；The failure variable measurement module is according to environment
The boundary support for the environmental load and system in package device that load loading module and device constraints and boundary condition module import
Failure variable of the conditioned measurement by the system in package device of environmental load, and measurement result is imported into system in package device
In part structure finite element imitation unit.
The object of the invention is also to provide the reliability analysis systems based on a kind of system-oriented grade encapsulation SIP device
A kind of analysis method for reliability of system-oriented grade encapsulation SIP device.
A kind of analysis method for reliability of system-oriented grade encapsulation SIP device, comprising the following steps:
Step 1: in system in package device architecture test unit, n kind environmental load F is selectediTo system in package device
Part carries out simulation loading test, measurement failure variable σi；
Step 2: in system in package device architecture finite element simulation unit, according to the geometry of system in package device
Parameter and material properties establish the finite element model of system in package device；Using finite element analysis software, calculate separately to being
The finite element model of irrespective of size packaging applies n kind environmental load FiWhen model stress
Step 3: according to the test result σ of system in package device architecture test uniti, judge to carry in each environment
Under the conditions of lotus,With σiWhether the following conditions are met:
Wherein ε is relative error limit, rule of thumb or depending on actual conditions；If being calculated for each environmental load
It arrivesWith σiIt is all satisfied above-mentioned condition, then judges that the finite element model of current system grade packaging meets the requirements and does not do
Amendment；Otherwise the parameter for modifying the finite element model of system in package device, to the finite element model of system in package device into
Row amendment is until meet the requirements；Satisfactory system in package device architecture finite element model is imported into Calculation of Reliability list
In member；
Step 4: in reliability calculation unit, corresponding fail-safe analysis is respectively adopted for each environmental load
The fail-safe analysis result of model computing system grade packaging finite element model；
Step 5: comprehensive all fail-safe analyses are as a result, obtain the reliable of system in package device by way of coupling
Property coupling result.
The beneficial effects of the present invention are:
1) by the present invention in that finite element simulation data are constantly compared, verify and corrected with actual experimental data.
The simulated sampling of analogue system is supported by true experimental data, data are more nearly standard value.
2) by the present invention in that with the reliability analysis model for the system in package device under varying environment, to difference
The finite element model of system in package device under environment carries out reliability assessment respectively, ensure that the accuracy of reliability.
3) reliability results of the present invention have FEM Numerical Simulation support, while FEM Numerical Simulation is again by few
Measure typical actual experimental result verification amendment.Not only in the correctness and authenticity that ensure that result, while significantly contracting
Short calculating cycle and experimentation cost.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of the reliability analysis system of system-oriented grade encapsulation SIP device.
Fig. 2 is system in package device architecture finite element simulation cell schematics of the invention.
Fig. 3 is reliability calculation unit schematic diagram of the invention.
Specific embodiment
The present invention is described further with reference to the accompanying drawing.
The invention belongs to the Calculation of Reliability fields in system in package device, wherein relating to for system-level envelope
Load test, the measurement of component failure variable and the device finite element model for filling device are established, imitative by obtaining correct finite element
True result replaces a large amount of multiple actual experimental data, and simulation result is substituted into reliability analysis model and calculates its finite element mould
The reliability of type, to analyze the reliability of the finite element model.
The present invention includes a kind of principle design of the reliability analysis system of system-oriented grade encapsulation SIP device, such as Fig. 1 institute
Show.
A kind of reliability analysis system of system-oriented grade encapsulation SIP device includes system in package device architecture test sheet
Member, system in package device architecture finite element simulation unit, reliability calculation unit and data storage and display unit.
1) system in package device architecture test unit
System in package device architecture test unit, including simulation system grade packaging environmental load loading module, device
Part constraint and boundary condition module and failure variable measurement module, carry out simulation loading test and failure to system in package device
Variable measurement.
Due to working environment, the environmental load that system in package device is subject to is also varied, thus for
For system in package device, environmental load is the key point for influencing experimental result.During the test, to system in package
Device applies environmental load (such as mechanics, temperature and humidity, electromagnetism, attached dirt, salt fog).Such as: mechanical loading is mainly reflected in vibration
Aspect, load are applied to the Support Position of system in package device, and load manner is mainly reflected in oscillating load.Temperature loading
It is mainly reflected in thermal expansion and contraction, for different operating environment requirements, adjusts corresponding ring around system in package device
Border temperature.The load for completing test according to this applies module.In terms of humidity load is mainly reflected in hygral expansion, the main body of electromagnetic environment
It is now electromagnetic field, attached dirt environment and salt mist environment are mainly reflected in be placed in salt fog in the attached dirt of device surface and by device.
Apply module compared to environmental load, device constraints and boundary condition module be also influence test result it is important because
One of element.For different working environments, the boundary supporting condition of device is also different, so to be directed in experimentation different
Working environment carrys out the boundary condition of adjusting device.To guarantee that boundary support does not influence the accuracy of test data, while to guarantee
Supporting point has enough strength and stiffness, close with the external applied load feature, geometry and constraint type height of real structure.Cause
This, needs to select reasonable connection type according to actual design situation, make each support point and true feelings when selecting connection type
Condition is consistent substantially.
Variable measurement fail all in accordance with the corresponding apparatus measures specifically used.
The environmental load type according to given by design department and load range value select n load Fi(i=1,
2 ..., n), it is loaded using system in package device architecture test unit, can obtain n failure variable measurements σi(i=
1,2,...,n)。
2) system in package device architecture finite element simulation unit
According to the geometric parameter (length etc. of each structural unit in system in package device) and material of device architecture
Expect attribute (such as density, elasticity modulus, Poisson's ratio), establishes the finite element model of system in package device architecture.Utilize system
Grade packaging structural test unit carries out simulation loading test and stress measurement to system in package device and carries out to the model
Amendment, the precision of analogue system is verified by true test data.
Finite element analysis be by loading problem to see that the problem of replace solving.But it is simply asked due to using
Topic has resulted in this solution not instead of Exact Solutions solved, an approximate solution instead of practical problem.Although finite element
What analysis and solution went out is approximate solution, but since many practical problems are difficult to acquire Exact Solutions, adds finite element analysis computation
Precision is high and is suitable for various complicated shapes, thus it becomes a kind of effective project analysis means.
System in package device finite element simulation unit is mainly to establish geometric parameter and material properties based on device
Finite element model.But component units density or other attributes due to device and non-homogeneous, cause limit element artificial module meter
Calculating result, there is a certain error with actual experimental result.When establishing finite element model, need to utilize system in package device
The experimental result of structural test unit is modified finite element model, and the essence of analogue system is verified by actual experimental data
Degree, as shown in Figure 2.
According to the geometric parameter and material properties of system in package device, the finite element of system in package device is tentatively established
Model.Using finite element analysis software, load F is applied to model1, by the stress σ that model is calculatedF1.By system-level envelope
It fills and the stress measurement σ in simulation loading test is carried out to system in package device obtained in device architecture test unit1And have
The stress σ that limit meta software is calculatedF1Compare, judge | σF1-σ1|/σ1≤ ε, wherein ε is relative error limit, usually by passing through
It tests or actual conditions provides.If meeting above-mentioned condition then to think for load F1, which meets the requirements；If being unsatisfactory for above-mentioned
Condition is then modified the parameter of model, is modified to model, until meeting the requirements.For load Fi(i=1,2 ...,
N), it needs model to meet condition for each load, needs to compare and correct repeatedly, until utilizing system in package device
Structure finite element imitation unit obtains satisfactory finite element model.
3) reliability calculation unit
It is an object of the invention to invent a kind of analysis method for reliability of system-oriented grade encapsulation SIP device, by this
Method establishes a kind of reliability analysis system of system-oriented grade encapsulation SIP device.And the judging quota of the system is then system
The reliability of grade packaging.
Reliability refers to that product under prescribed conditions and in the defined time, completes the ability of predetermined function, and reliable
The probability metrics of property are reliability.Reliability is divided into basic reliability and mission reliability, the former considers to include supplying with maintenance
Related reliability, the latter only consider that the failure for causing mission failure influences.The present invention only considers mission reliability.
The present invention passes through reliability calculation unit, the reliability of computing system grade packaging.The present invention uses reliability
Analysis model carrys out the reliability of computing system grade packaging finite element model, to assess the reliability of device.But due to device
It is also different to test applied environmental load for the difference of part local environment.Therefore, for the system-level envelope under varying environment load
For filling device, required reliability analysis model is also different.The present invention uses different for the model of varying environment load
Reliability analysis model, eventually by coupled modes, its reliability of comprehensive assessment proposes reliability coupling result.Fig. 3 be
Irrespective of size packaging reliability calculation unit schematic diagram.
4) data storage and display unit
Storage and display final data.Reliability calculation unit is capable of the reliability of computing system grade packaging.It is counting
After the completion of calculation, which shows that user can learn calculating according to display unit for acquired results data transmission display unit
As a result.Calculation result data is sent to data storage cell storage simultaneously, to facilitate subsequent query and call comparison.
It is an object of the invention to being compared by using experimental data and finite element simulation data, continuous to correct
Limit element artificial module, then by the way that the reliability of the model will be calculated in simulation result substitution reliability analysis model, thus right
The reliability of system in package device is assessed.
Substantially process is as follows:
1) true experimental data is obtained by specifically test
Establish system in package device architecture pilot system.Main purpose is, it is obtained according to actual experimental as a result,
It is compared with the calculated result of limit element artificial module, is verified by actual experimental result, corrects finite element model.Wherein
The system in package device of a small amount of different sizes, material is only needed to be tested.
2) it establishes, correct limit element artificial module
By establishing limit element artificial module, environmental load, boundary condition and constraint, calculated result and truthful data are given
It compares, so that limit element artificial module is constantly corrected, until the result for obtaining being consistent with test data.It is revised
Limit element artificial module can carry out analog simulation for the system in package device of extensive different sizes, material, save
Experimentation cost and time.
3) reliability calculating is carried out
Data are extracted in sampling from correct FEM Numerical Simulation, and it is reliable to calculate it by using reliability analysis model
Degree, so that the reliability to limit element artificial module is assessed.
The invention belongs to the Calculation of Reliability fields in system in package device, specifically design a kind of system-oriented grade encapsulation
The reliability analysis system and method for SIP device.Specifically include such as lower unit: system in package device architecture test unit has
Limit first simulation unit, reliability calculating unit, data storage and display unit.The limit element artificial module of system in package device
It is compared and corrects with true experimental data, obtain the simulation result being consistent with actual experimental, by largely emulating knot
Sampling carries out Calculation of Reliability in fruit, and wherein Calculation of Reliability is according to reliability analysis model.Advantages of the present invention mainly has: the
One, by the present invention in that finite element simulation data are constantly compared, verified and are corrected with actual experimental data.By true
Experimental data support the simulated sampling of analogue system, data are more nearly standard value.Second, by the present invention in that with for not
With the reliability analysis model of the system in package device under environment, to the finite element of the system in package device under varying environment
Model carries out reliability assessment respectively, ensure that the accuracy of reliability.Third, reliability results of the present invention are limited
First simulation result is supported, while FEM Numerical Simulation is corrected by a small amount of typical actual experimental result verification again.Not only protecting
The correctness and authenticity of result have been demonstrate,proved, while significantly having shortened calculating cycle and experimentation cost.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (3)
1. a kind of reliability analysis system of system-oriented grade encapsulation SIP device, it is characterised in that: including system in package device
Structural test unit, system in package device architecture finite element simulation unit, reliability calculation unit and data storage and display
Unit；Mould is carried out to the system in package device under varying environment load in the system in package device architecture test unit
Quasi- load test, and the test data of the system in package device under obtained varying environment load is imported into system in package
In device architecture finite element simulation unit；The system in package device architecture finite element simulation unit establishes system in package
The finite element model of device, the test data in conjunction with obtained in system in package device architecture test unit repair finite element model
Just, and by obtained revised system in package device architecture finite element model it imported into reliability calculation unit；It is described
Reliability calculation unit structural reliability, and the system in package that will be obtained are calculated to system in package device finite element model
The reliability result of device is imported into data storage and display unit；The data storage and display unit displays and store
The reliability result for the system in package device that reliability calculation unit is calculated.
2. a kind of reliability analysis system of system-oriented grade encapsulation SIP device according to claim 1, feature exist
In: the system in package device architecture test unit includes environmental load loading module, device constraints and boundary condition mould
Block and failure variable measurement module；The environment that the environmental load loading module applies simulation to system in package device carries
Lotus, and the environmental load data of application are imported into device constraints and boundary condition module and failure variable measurement module；Institute
The device constraints stated and boundary condition module according to the environmental load of application, to the boundary supporting condition of system in package device into
Row adjustment, makes to be consistent when working in each supporting point and true environment of system in package device, and by system-level envelope adjusted
The boundary supporting condition of dress device is imported into failure variable measurement module；The failure variable measurement module is carried according to environment
The boundary support bar of environmental load and system in package device that lotus loading module and device constraints and boundary condition module import
Part measures the failure variable of the system in package device by environmental load, and measurement result is imported into system in package device
In structure finite element imitation unit.
3. the reliability analysis system based on a kind of system-oriented grade encapsulation SIP device described in claim 1 it is a kind of towards
The analysis method for reliability of system in package SIP device, which comprises the following steps:
Step 1: in system in package device architecture test unit, n kind environmental load F is selectediTo system in package device into
The test of row simulation loading, measurement failure variable σi；
Step 2: in system in package device architecture finite element simulation unit, according to the geometric parameter of system in package device
And material properties, establish the finite element model of system in package device；Using finite element analysis software, calculate separately to system-level
The finite element model of packaging applies n kind environmental load FiWhen model stress
Step 3: according to the test result σ of system in package device architecture test uniti, judge in each environmental load condition
Under,With σiWhether the following conditions are met:
Wherein ε is relative error limit, rule of thumb or depending on actual conditions；If each environmental load is calculatedWith σiIt is all satisfied above-mentioned condition, then judges that the finite element model of current system grade packaging meets the requirements and does not repair
Just；Otherwise the parameter for modifying the finite element model of system in package device carries out the finite element model of system in package device
Amendment is until meet the requirements；Satisfactory system in package device architecture finite element model is imported into reliability calculation unit
In；
Step 4: in reliability calculation unit, corresponding reliability analysis model is respectively adopted for each environmental load
The fail-safe analysis result of computing system grade packaging finite element model；
Step 5: comprehensive all fail-safe analyses are as a result, obtain the reliability coupling of system in package device by way of coupling
Close result.
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| CN111680395B (en) * | 2020-04-27 | 2023-05-26 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Reliability comprehensive verification test method and device, electronic equipment and storage medium |
| CN116227297A (en) * | 2023-03-14 | 2023-06-06 | 宁波均胜新能源研究院有限公司 | Electronic product reliability verification method and system |
| CN116227297B (en) * | 2023-03-14 | 2023-08-15 | 宁波均胜新能源研究院有限公司 | Electronic product reliability verification method and system |
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