CN110221524A - A kind of LED exposure machine based on LCOS technology - Google Patents
A kind of LED exposure machine based on LCOS technology Download PDFInfo
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- CN110221524A CN110221524A CN201810170337.5A CN201810170337A CN110221524A CN 110221524 A CN110221524 A CN 110221524A CN 201810170337 A CN201810170337 A CN 201810170337A CN 110221524 A CN110221524 A CN 110221524A
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- lcos
- light
- exposure machine
- lens group
- led
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- 238000005516 engineering process Methods 0.000 title claims abstract description 17
- 230000010287 polarization Effects 0.000 claims abstract description 28
- 230000003287 optical effect Effects 0.000 claims abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 230000003321 amplification Effects 0.000 claims description 2
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000011161 development Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 238000001459 lithography Methods 0.000 description 3
- 238000004611 spectroscopical analysis Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
- G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a kind of LED exposure machines based on LCOS technology, including LED light source, lens group, integrating rod, lens group, polarization beam splitter PBS, LCOS, optical projection system and workpiece to be exposed.The light that wherein LED light source issues is assembled by lens group enters integrating rod, it is imaged on LCOS by lens group and polarization beam splitter PBS again after the integrated even light of stick, enter optical projection system through polarization beam splitter PBS reflection again after LCOS reflection, by projection system projects to workpiece to be exposed, workpiece to be exposed is made to form exposure.This exposure machine does not need exposure mask and forms pattern, can reduce process flow and production cost.Since LCOS has high resolution features, thus the exposure of High Resolution may be implemented, this exposure machine is for pushing the development of China's electronic product industry to be of great significance.
Description
Technical field
The present invention relates to a kind of exposure machine more particularly to a kind of LED exposure machines based on LCOS technology.
Background technique
Printed circuit board (pcb) is the substrate of connection, assembling integrated circuit electronic element, and almost all of electronic equipment is all
It is unable to do without printed circuit board.During electronic product research, the design and production of printed circuit board directly influence whole
The quality and cost of a product.In the manufacturing equipment of PCB and microelectronic component, the development of exposure machine is most important.
For traditional exposure machine using high-pressure sodium lamp as light source, the shortcomings that high-pressure sodium lamp light source is not energy-efficient, service life
It is short.The emission spectrum of high-pressure sodium lamp is wider, but only the light of some wave band can be used for exposing, and the light of all band can be made
At the raising of surrounding objects and environment temperature.Compared with high-pressure sodium lamp light source, LED has service life long, energy conservation, spectral line narrow etc. excellent
Gesture is received significant attention and is applied in exposure machine.
With the field of household appliances such as the fast development of electronic industry, especially mobile phone, flat panel TV, video camera product and micro-
The miniature weapons products such as humanoid robot, minute vehicle, miniature torpedo all show that high-accuracy high-resolution LED exposure machine has
Broad application prospect and huge application potential, but up to the present, existing LED exposure machine is not met by high-resolution
Demand.
Conventional exposure machine is to need production mask plate before ROM mask programmable read-only memory is exposed on exposure special pattern simultaneously, will be special by mask plate
Fixed pattern, which is transmitted to be formed on working face, has figuratum exposure.And exposure machine of the present invention does not need exposure mask formation figure
Case can reduce process flow and production cost.And relative to Digital Micromirror Device (Digital Micromirror Device,
Abbreviation DMD) maskless lithography route, the ultraviolet family chip of dmd chip be only capable of at present support 1920 x, 1080 resolution ratio, this hair
It is 5 times for achieving over existing maskless lithography pixel quantity that 4096 x, 2400 resolution ratio, which can be achieved, in the bright exposure machine at present,
And resolution ratio further can be quickly improved in future.
Summary of the invention
The problem to be solved in the present invention is:
Existing LED exposure machine is not met by high-resolution needs of problems.
And the present invention uses a kind of LED exposure machine based on LCOS technology, LCOS, that is, Liquid Crystal on
Silicon liquid crystal on silicon is a kind of reflecting element, and incident p-type polarised light is made to be transformed into s type polarised light, by control LCOS
The switch of each pixel forms required figure, and occurring source of the light as exposing patterns after LCOS reflection, LCOS, which has, to be greater than
Equal to the resolution ratio of 1920 x 1080, it is presently preferred to which 4096 x, 2400 resolution ratio, the high-resolution LED based on LCOS technology expose
The maskless lithography of High Resolution may be implemented in ray machine, this exposure machine has important application value and economic significance,
By the development for pushing China's electronic product industry significantly, China is improved in the competitiveness of electronic technology field.
The present invention provides a kind of LED exposure machine based on LCOS technology, including LED light source (1), lens group (2), integrating rod
(3), lens group (4), polarization beam splitter PBS(5), LCOS(6), optical projection system (7) and workpiece to be exposed (8).Wherein LED light
The light that source (1) issues is assembled by lens group (2) enters integrating rod (3), passes through lens group (4) again after the even light of integrated stick (3)
LCOS(6 is imaged into polarization beam splitter PBS(5)) on, p-type polarised light passes through polarization beam splitter in the light that light source issues
PBS(5 high-resolution LCOS(6 is incident on after)) on, LCOS(6) reflection light be s type polarised light, through polarization beam splitter
PBS(5 enter optical projection system (7) after) reflecting, workpiece to be exposed (8) are projected by optical projection system (7), make workpiece to be exposed
(8) formed exposure, for reduce exposure machine overall volume, exposure machine of the present invention can in optical path any position be added one or
Multiple reflecting mirrors or prism, fold optical path.
The wave-length coverage of the LED light source (1) is 350 ~ 470nm.
The light that the lens group (2) is used to issue LED light source (1) is assembled, and lens group is by N(N >=2) piece lens group
At lens can be spherical lens, be also possible to non-spherical lens, and lens clear aperature range is 10 ~ 120mm.
The even light of light progress that the integrating rod (3) is used to issue LED light source (1), and be shaped to and LCOS(6) length-width ratio
The hot spot to match.
The lens group (4) is imaged onto LCOS(6) on, lens group is by N(N >=2) piece lens form, and lens can be spherical surface
Lens, are also possible to non-spherical lens, and lens clear aperature range is 10 ~ 120mm.
The polarization beam splitter PBS(5) it can be polarization splitting prism and be also possible to polarization spectro piece, polarization spectro member
Part PBS(5) for being divided, p-type polarised light is penetrated, s type polarised light is reflected, s type polarised light and p-type polarised light are at 90 degree
Angle, as shown in Fig. 2, incident light A passes through polarization beam splitter PBS(5), form reflection light As and transmitted ray Ap, reflected light
Line As is s type polarised light, is not involved in system work without effect to imaging, transmitted ray Ap is p-type polarised light, directive LCOS
(6), LCOS(6) so that transmitted ray Ap is transformed into reflection light Bs, Bs the directive polarization beam splitter of s polarization state from p-polarization state
(5), it is reflected by polarization beam splitter (5).
The LCOS(6) i.e. Liquid Crystal on Silicon liquid crystal on silicon, it is a kind of reflecting element, makes incident p
Type polarised light is transformed into s type polarised light, while passing through control LCOS(6) on the switch of each pixel form required figure, LCOS
(6) occurring source of the light as exposing patterns after reflecting, the LCOS(6) there is the resolution for being more than or equal to 1920 x 1080
Rate, it is presently preferred to 4096 x, 2400 resolution ratio.
The optical projection system (7) is used to light project to workpiece to be exposed (8), and optical projection system is made of lens group, can be with
It is amplification system, is also possible to reduction system.
The surface of the workpiece to be exposed (8) is that a plane and optical path are vertical.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the spectroscopy scheme that polarization beam splitter PBS is polarization splitting prism.
Fig. 3 is the spectroscopy scheme that polarization beam splitter PBS is polarization spectro piece.
It should be understood that after having read the contents of the present invention, those skilled in the art the present invention can be done various changes or
Modification, such equivalent forms are equally in the scope of the appended claims of the present application.
Claims (9)
1. a kind of LED exposure machine based on LCOS technology, which is characterized in that including LED light source (1), lens group (2), integrating rod
(3), lens group (4), polarization beam splitter PBS(5), LCOS(6), optical projection system (7) and workpiece to be exposed (8), wherein LED light
The light that source (1) issues is assembled by lens group (2) enters integrating rod (3), passes through lens group (4) again after the even light of integrated stick (3)
LCOS(6 is imaged into polarization beam splitter PBS(5)) on, p-type polarised light passes through polarization beam splitter in the light that light source issues
PBS(5 high-resolution LCOS(6 is incident on after)) on, LCOS(6) reflection light be s type polarised light, through polarization beam splitter
PBS(5 enter optical projection system (7) after) reflecting, workpiece to be exposed (8) are projected by optical projection system (7), make workpiece to be exposed
(8) formed exposure, for reduce exposure machine overall volume, exposure machine of the present invention can in optical path any position be added one or
Multiple reflecting mirrors or prism, fold optical path.
2. a kind of LED exposure machine based on LCOS technology as described in claim 1, which is characterized in that the LED light source (1)
Wave-length coverage be 350 ~ 470nm.
3. a kind of LED exposure machine based on LCOS technology as described in claim 1, which is characterized in that the lens group (2) is used
Assembled in the light issued to LED light source (1), lens group is by N(N >=2) piece lens form, and lens can be spherical lens,
It is also possible to non-spherical lens, lens clear aperature range is 10 ~ 120mm.
4. a kind of LED exposure machine based on LCOS technology as described in claim 1, which is characterized in that the integrating rod (3) is used
Carry out even light in the light that issues to LED light source (1), and be shaped to and LCOS(6) hot spot that matches of length-width ratio.
5. a kind of LED exposure machine based on LCOS technology as described in claim 1, which is characterized in that the lens group (4) at
As arriving LCOS(6) on, lens group is by N(N >=2) piece lens form, and lens can be spherical lens, be also possible to aspherical
Mirror, lens clear aperature range are 10 ~ 120mm.
6. a kind of LED exposure machine based on LCOS technology as described in claim 1, which is characterized in that the polarization spectro member
Part PBS(5) can be polarization splitting prism and be also possible to polarization spectro piece, polarization beam splitter PBS(5) for being divided, to p-type
Polarised light penetrates, and reflects s type polarised light, and s type polarised light and p-type polarised light are at an angle of 90 degrees.
7. a kind of LED exposure machine based on LCOS technology as described in claim 1, which is characterized in that the LCOS(6) i.e.
Liquid Crystal on Silicon liquid crystal on silicon, is a kind of reflecting element, and incident p-type polarised light is made to be transformed into s type polarization
Light, while passing through control LCOS(6) on the switch of each pixel form required figure, LCOS(6) light after reflection is as exposing
The occurring source of light pattern, the LCOS(6) there is the resolution ratio for being more than or equal to 1920 x 1080, it is presently preferred to 4096 x 2400
Resolution ratio.
8. a kind of LED exposure machine based on LCOS technology as described in claim 1, which is characterized in that the optical projection system (7)
For light to be projected to workpiece to be exposed (8), optical projection system is made of lens group, can be amplification system, is also possible to reduce
System.
9. a kind of LED exposure machine based on LCOS technology as described in claim 1, which is characterized in that the workpiece to be exposed
(8) surface is that a plane and optical path are vertical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810170337.5A CN110221524A (en) | 2018-03-01 | 2018-03-01 | A kind of LED exposure machine based on LCOS technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810170337.5A CN110221524A (en) | 2018-03-01 | 2018-03-01 | A kind of LED exposure machine based on LCOS technology |
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| Publication Number | Publication Date |
|---|---|
| CN110221524A true CN110221524A (en) | 2019-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810170337.5A Pending CN110221524A (en) | 2018-03-01 | 2018-03-01 | A kind of LED exposure machine based on LCOS technology |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100043501A (en) * | 2008-10-20 | 2010-04-29 | 삼성전자주식회사 | Apparatus for fabricating bio-chip |
| CN102778820A (en) * | 2012-08-17 | 2012-11-14 | 杭州士兰明芯科技有限公司 | Maskless graphic exposure system based on spatial light modulator |
| CN104539851A (en) * | 2014-12-26 | 2015-04-22 | 中国科学院西安光学精密机械研究所 | High-speed imaging system and method based on pixel optimization coding exposure |
| CN204316623U (en) * | 2014-12-26 | 2015-05-06 | 中国科学院西安光学精密机械研究所 | High-speed imaging system based on pixel optimization coding exposure |
| CN207965472U (en) * | 2018-03-01 | 2018-10-12 | 联士光电（深圳）有限公司 | A kind of LED exposure machine based on LCOS technologies |
-
2018
- 2018-03-01 CN CN201810170337.5A patent/CN110221524A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100043501A (en) * | 2008-10-20 | 2010-04-29 | 삼성전자주식회사 | Apparatus for fabricating bio-chip |
| CN102778820A (en) * | 2012-08-17 | 2012-11-14 | 杭州士兰明芯科技有限公司 | Maskless graphic exposure system based on spatial light modulator |
| CN104539851A (en) * | 2014-12-26 | 2015-04-22 | 中国科学院西安光学精密机械研究所 | High-speed imaging system and method based on pixel optimization coding exposure |
| CN204316623U (en) * | 2014-12-26 | 2015-05-06 | 中国科学院西安光学精密机械研究所 | High-speed imaging system based on pixel optimization coding exposure |
| CN207965472U (en) * | 2018-03-01 | 2018-10-12 | 联士光电（深圳）有限公司 | A kind of LED exposure machine based on LCOS technologies |
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Application publication date: 20190910 Assignee: Beijing mathematical optical core technology Co.,Ltd. Assignor: LIANSHI PHOTOELECTRIC (SHENZHEN) Co.,Ltd. Contract record no.: X2021990000396 Denomination of invention: A LED exposure machine based on LCOS Technology License type: Exclusive License Record date: 20210701 |