CN110216284A - A kind of embedded laser selective melting 3D printing substrate - Google Patents
A kind of embedded laser selective melting 3D printing substrate Download PDFInfo
- Publication number
- CN110216284A CN110216284A CN201910490734.5A CN201910490734A CN110216284A CN 110216284 A CN110216284 A CN 110216284A CN 201910490734 A CN201910490734 A CN 201910490734A CN 110216284 A CN110216284 A CN 110216284A
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- CN
- China
- Prior art keywords
- card slot
- substrate
- test block
- operation test
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/30—Platforms or substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention proposes a kind of embedded laser selective melting 3D printing substrate, including substrate, bolt hole, grid scale, card slot, operation test block and fixed abaculus, substrate is equipped at least two for installing fixed bolt hole, substrate surface is equipped with grid scale, substrate is equipped at least one card slot parallel to each other, dismountable operation test block is equipped in card slot, operation test block is fixed in card slot by the fixation abaculus of wedge.In this application, the card slot built-in type on substrate is equipped with the different operation test block of size specification, and is accurately positioned, and the substrate zero-bit after operating test block installation does not have to adjustment, and the operation test block after work can be with rapid removal, without re-working to substrate.Card slot can place required operation test block using abnormity design, side, and the other side achievees the effect that fixed by being inserted into fixed abaculus, and the position of card slot and size can be set according to testing.
Description
Technical field
The present invention relates to 3D printing field more particularly to a kind of embedded laser selective melting 3D printing substrates.
Background technique
Increasing material manufacturing is commonly called as 3D printing, is to have merged CAD, material processing and forming technique, with digital mould
Based on type file, by software and digital control system by dedicated metal material, nonmetallic materials and biomaterial for medical purpose, press
It is successively accumulated according to modes such as extruding, sintering, melting, photocuring, injections, produces the manufacturing technology of physical item.
Wherein, fusing SLM (Selective Laser Melting) technology in selective laser is using metal powder as former material
Material, according to the hierarchy slicing information of molded part three-dimensional CAD model, scanning system control laser beam is acted in region to be formed
Powder melts powder, forms after cooling, scans through one layer, and workbench declines certain altitude, repaves one layer of powder, is melting,
It accumulates repeatedly like this, the molding until completing entire part.Selective laser fusing metal 3D printing can directly manufacture metal
Part has the advantages that protrusion.When printing metal parts, same material or similar materials are generallyd use as substrate, allow zero
For part " length " on substrate, while due to being quickly cooled down in print procedure, the part of printing can generate very big stress, cause to beat
Part deformation during print, part is printed upon on substrate, and part deformation can be effectively prevented.
After the completion of part printing, the part of needs can be scaled off from substrate by wire cutting, then to substrate surface
It is machined out, so that it may substrate be put into and reused.
In the test of SLM printing technology or research process, the progress partial printing test on sample is often used,
For example it is placed on substrate using 20mm × 20mm × 20mm metal coupons and carries out laser scanning, or printed on small metal block
Sample is tested.Subjects would generally be welded on substrate, or be fixed using fixture, in the actual operation process band
The problem of coming convenience and economy, for example, using welding method, experiment metal coupons can not flexible positioning, test complete
Metal coupons are removed afterwards relatively difficult；If fixed using fixture, due to printer spaces compact, need using structure
Complicated fixture, and the zero-bit for adjusting substrate can be more complicated.
Summary of the invention
The purpose of the invention is to provide a kind of embedded laser selective melting 3D printing substrate, facilitate test
Operation test block is positioned and is fixed, and the operation test block of multiple and different specifications can be one-time fixed, and substrate may be reused,
And quickly determine the zero-bit of substrate.
To achieve the goals above, the present invention proposes a kind of embedded laser selective melting 3D printing substrate, including base
Plate, bolt hole, grid scale, card slot, operation test block and fixed abaculus, the substrate are equipped at least two for installing fixation
The bolt hole, the substrate surface be equipped with grid scale, the substrate be equipped at least one card parallel to each other
Slot, the card slot is interior to be equipped with dismountable operation test block, and the fixed abaculus that the operation test block passes through wedge is fixed in institute
It states in card slot.
Further, in the embedded laser selective melting 3D printing substrate, the bolt hole is symmetrically set
In four edges of the substrate.
Further, in the embedded laser selective melting 3D printing substrate, the card slot is special-shaped card slot,
The upper width of the card slot is less than the lower width of card slot, and the side interior angle of the card slot is right angle.
Further, in the embedded laser selective melting 3D printing substrate, upper width of the card slot etc.
In the upper width of the operation test block, the lower width of the card slot is equal to the lower width and the fixed abaculus of the operation test block
Lower width, the depth of the card slot is equal to the thickness of the operation test block.
Further, in the embedded laser selective melting 3D printing substrate, the card slot is divided into big card slot
With small card slot, the width of the big card slot is 20~30mm, and the width of the small card slot is 40~60mm.
Further, in the embedded laser selective melting 3D printing substrate, the substrate and the operation
The material of test block is metal.
Further, in the embedded laser selective melting 3D printing substrate, the material of the fixed abaculus
For the soft Heat Conduction Material such as copper alloy.
Compared with prior art, the beneficial effects are mainly reflected as follows:
1) the operation test block that installation by adhering has size specification different on substrate, and be accurately positioned, operation test block peace
Substrate zero-bit after dress does not have to adjustment, and after the completion of 3D printing test or experiment, operation test block can not be had to rapid removal, substrate
It re-works.
2) Embedded card slot can place required operation test block using abnormity design, side, and the other side passes through insertion
Fixed abaculus achievees the effect that fixed, and the position of card slot and size can be set according to experiment.The depth of card slot with
The height of test block is consistent, and the zero-bit for being installed metacoxal plate remains unchanged.
3) it is scanned by the laser of 3D printer, grid scale is carved by high temperature melting in substrate surface, facilitates metal
Test block is positioned.
4) the fixation abaculus of wedge uses Interference Fit Design, can at the desired position fix operation test block.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of embedded laser selective melting 3D printing substrate in the present invention；
Fig. 2 is the side structure schematic view of substrate in Fig. 1.
Specific embodiment
Embedded laser selective melting 3D printing of the invention is carried out in more detail with substrate below in conjunction with schematic diagram
Description, which show the preferred embodiment of the present invention, it should be appreciated that those skilled in the art can modify described herein
Invention, and still realize advantageous effects of the invention.Therefore, following description should be understood as those skilled in the art's
It is widely known, and it is not intended as limitation of the present invention.
In the description of the present invention, it should be noted that " transverse direction ", " vertical if any term " center " for the noun of locality
To ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top",
The indicating positions such as "bottom", "inner", "outside", " clockwise ", " counterclockwise " and positional relationship are orientation based on the figure or position
Relationship is set, the narration present invention is merely for convenience of and simplifies description, rather than the device or element of indication or suggestion meaning are necessary
It constructs and operates with specific orientation, with particular orientation, should not be understood as limiting specific protection scope of the invention.
In the present invention, except as otherwise clear stipulaties and restriction, should make if any term " assembling ", " connected ", " connection " term
Broad sense goes to understand, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It is also possible to mechanical connect
It connects；It can be directly connected, be also possible to be connected by intermediary, can be and be connected inside two elements.For ability
For the those of ordinary skill of domain, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
The present invention is more specifically described by way of example referring to attached drawing in the following passage.According to following explanation, the present invention
The advantages of and feature will become apparent from.It should be noted that attached drawing is all made of very simplified form and uses non-accurate ratio,
Only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
As shown in Figure 1, the present invention proposes a kind of embedded laser selective melting 3D printing substrate 010, including substrate
010, bolt hole 011, grid scale 030, card slot, operation test block 040 and fixed abaculus 023, substrate 010 are equipped with for installing
Fixed bolt hole 011, bolt hole 011 are symmetrically set to four edges of substrate 010, substrate 010 and corresponding printer
Mating, thickness and mounting means are consistent with substrate commonly, facilitate and carry out installation and zero-bit adjustment.010 surface of substrate is set
There is grid scale 030, by corresponding printer, melted on 010 surface of substrate by laser, form accurately positioning grid,
The spacing of grid scale 030 can be adjusted according to the size of substrate 010 and the needs of experiment.Substrate 010 is equipped with extremely
A few card slot parallel to each other, card slot is interior to be equipped with dismountable operation test block 040, operates fixation of the test block 040 by wedge
Abaculus 023 fixes in card slot.
Further, in the present embodiment, card slot is special-shaped card slot, and the upper width of card slot is less than the lower width of card slot, card
The side interior angle of slot is right angle.The upper width of card slot is equal to the upper width of operation test block 040, and the lower width of card slot is equal to operation examination
The lower width of the lower width of block 040 and fixed abaculus 023, the depth of card slot are equal to the thickness of operation test block 040.Grasped in insertion
After making test block 040, the zero-bit of substrate 010 is remained unchanged.And card slot extends transversely through monolith substrate 010, facilitates operation test block 040
Installation can fill in the fixation abaculus 023 of wedge in side after being packed into operation test block 040.Operation test block 040 can be fixed on entirely
Any one position of card slot.The quantity of card slot can be increased or be reduced according to the quantity of operation test block 040, card slot
Position can be adjusted according to the needs of test.
A variety of various sizes of card slots can be set simultaneously on substrate 010 if needed, card slot is divided into big card slot 022 and small
Card slot 021, the width of big card slot 022 are 20~30mm, and the width of small card slot 021 is 40~60mm.
Specifically, substrate 010 and the material of operation test block 040 are metal, and the material of fixed abaculus 023 is copper alloy etc.
Soft Heat Conduction Material.Fixed abaculus 023 is fastened on test block 040 is operated in card slot behind predetermined position, and is heated in substrate 010
Fixing abaculus 023 afterwards can suitably expand, and guarantee that operation test block 040 will not loosen.It, can be by fixed abaculus 023 after the completion of printing
Extraction is convenient to removal operation test block 040, and the length of fixed abaculus 023 can according to need cutting.
To sum up, in the present embodiment, the embedded laser selective melting 3D printing substrate of proposition, has the advantage that
1) the operation test block that installation by adhering has size specification different on substrate, and be accurately positioned, operation test block peace
Substrate zero-bit after dress does not have to adjustment, and after the completion of 3D printing test or experiment, operation test block can not be had to rapid removal, substrate
It re-works.
2) Embedded card slot can place required operation test block using abnormity design, side, and the other side passes through insertion
Fixed abaculus achievees the effect that fixed, and the position of card slot and size can be set according to experiment.The depth of card slot with
The height of test block is consistent, and the zero-bit for being installed metacoxal plate remains unchanged.
3) it is scanned by the laser of 3D printer, grid scale is carved by high temperature melting in substrate surface, facilitates metal
Test block is positioned.
4) the fixation abaculus of wedge uses Interference Fit Design, can at the desired position fix operation test block.
The above is only a preferred embodiment of the present invention, does not play the role of any restrictions to the present invention.Belonging to any
Those skilled in the art, in the range of not departing from technical solution of the present invention, to the invention discloses technical solution and
Technology contents make the variation such as any type of equivalent replacement or modification, belong to the content without departing from technical solution of the present invention, still
Within belonging to the scope of protection of the present invention.
Claims (7)
1. a kind of embedded laser selective melting 3D printing substrate, which is characterized in that including substrate, bolt hole, grid scale,
Card slot, operation test block and fixed abaculus, the substrate are equipped at least two for installing the fixed bolt hole, the base
Plate surface is equipped with grid scale, and the substrate is equipped at least one card slot parallel to each other, and being equipped in the card slot can
The operation test block of disassembly, the operation test block are fixed in the card slot by the fixed abaculus of wedge.
2. embedded laser selective melting 3D printing substrate according to claim 1, which is characterized in that the bolt hole
Symmetrically it is set to four edges of the substrate.
3. embedded laser selective melting 3D printing substrate according to claim 1, which is characterized in that the card slot is
Special-shaped card slot, the upper width of the card slot are less than the lower width of card slot, and the side interior angle of the card slot is right angle.
4. embedded laser selective melting 3D printing substrate according to claim 3, which is characterized in that the card slot
Upper width is equal to the upper width of the operation test block, the lower width of the card slot be equal to the lower width of the operation test block with it is described
The lower width of fixed abaculus, the depth of the card slot are equal to the thickness of the operation test block.
5. embedded laser selective melting 3D printing substrate according to claim 4, which is characterized in that the card slot point
For big card slot and small card slot, the width of the big card slot is 20~30mm, and the width of the small card slot is 40~60mm.
6. embedded laser selective melting 3D printing substrate according to claim 1, which is characterized in that the substrate and
The material of the operation test block is metal.
7. embedded laser selective melting 3D printing substrate according to claim 1, which is characterized in that the fixation is embedding
The material of block is the soft Heat Conduction Materials such as copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910490734.5A CN110216284B (en) | 2019-06-06 | 2019-06-06 | Embedded laser selective melting 3D printing substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910490734.5A CN110216284B (en) | 2019-06-06 | 2019-06-06 | Embedded laser selective melting 3D printing substrate |
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| Publication Number | Publication Date |
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| CN110216284A true CN110216284A (en) | 2019-09-10 |
| CN110216284B CN110216284B (en) | 2021-05-04 |
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| CN201910490734.5A Active CN110216284B (en) | 2019-06-06 | 2019-06-06 | Embedded laser selective melting 3D printing substrate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111468722A (en) * | 2020-04-01 | 2020-07-31 | 长沙新材料产业研究院有限公司 | Novel substrate, method and application for verifying 3D printing metal powder |
| CN114082991A (en) * | 2021-10-29 | 2022-02-25 | 北京工业大学 | Assembled substrate for powder bed melting additive manufacturing and using method thereof |
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| CN108380876A (en) * | 2018-03-22 | 2018-08-10 | 昆明理工大学 | A kind of combined laser selective melting metal 3D printing substrate |
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2019
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Patent Citations (6)
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|---|---|---|---|---|
| WO1990009282A1 (en) * | 1989-02-20 | 1990-08-23 | Dai Nippon Insatsu Kabushiki Kaisha | Decorative sheet and method of production thereof |
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| CN111468722A (en) * | 2020-04-01 | 2020-07-31 | 长沙新材料产业研究院有限公司 | Novel substrate, method and application for verifying 3D printing metal powder |
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| Publication number | Publication date |
|---|---|
| CN110216284B (en) | 2021-05-04 |
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