CN110209015A - Glue spreader spraying method and system - Google Patents
Glue spreader spraying method and system Download PDFInfo
- Publication number
- CN110209015A CN110209015A CN201910461250.8A CN201910461250A CN110209015A CN 110209015 A CN110209015 A CN 110209015A CN 201910461250 A CN201910461250 A CN 201910461250A CN 110209015 A CN110209015 A CN 110209015A
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- Prior art keywords
- spraying
- spray head
- radius
- wafer
- scanning area
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
- B05B12/122—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus responsive to presence or shape of target
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
- B05B13/0431—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with spray heads moved by robots or articulated arms, e.g. for applying liquid or other fluent material to 3D-surfaces
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The present invention provides a kind of glue spreader spraying method and systems, are related to the technical field of IDE, the radius including obtaining wafer to be sprayed；Scanning area radius is determined according to the radius of wafer, and wherein scanning area radius is greater than the radius of wafer；The spraying profile of spray head in glue spreader is set in the coordinate system pre-established；When spray head completes primary spraying according to spraying profile, chuck rotates once according to predetermined angle and direction；When the spraying number of spray head reaches default spraying number, terminate the spraying to wafer.The present invention can effectively improve the efficiency and uniformity of wafer spraying.
Description
Technical field
The present invention relates to the technical fields of IDE, more particularly, to a kind of glue spreader spraying method and system.
Background technique
With the fast development of IC industry, atomizing glue spreader generally uses the mist of ultrasonic nozzle realization photoresist
Change, drives spray head to be fixed on the wafer on wafer-supporting platform to vacuum suction mode by workbench and carry out accurate spraying.Atomizing gluing
In the machine course of work, wafer is fixed on wafer-supporting platform in a manner of vacuum suction, spraying process generally by multiple spraying superposition Lai
It completes, when spray head completes certain spraying, workbench drives spray head to spraying position next time.Existing glue spreader spray-bonding craft
In algorithm, using rectangular spraying profile, but chuck cannot rotate, and have that spraying uniformity is poor and spray efficiency is low etc. asks
Topic.
Summary of the invention
In view of this, can effectively improve wafer spray the purpose of the present invention is to provide glue spreader spraying method and system
The efficiency and uniformity of painting.
In a first aspect, the embodiment of the invention provides a kind of glue spreader spraying methods, wherein the described method includes:
Obtain the radius of wafer to be sprayed；
Scanning area radius is determined according to the radius of the wafer, wherein the scanning area radius is greater than the wafer
Radius；
The spraying profile of spray head in the glue spreader is set in the coordinate system pre-established；
When the spray head completes primary spraying according to the spraying profile, chuck is revolved according to predetermined angle and direction
Turn primary；
When the spraying number of the spray head reaches default spraying number, terminate the spraying to the wafer.
Further, the described the step of spraying profile of spray head in the glue spreader is set in the coordinate system pre-established
Include:
Rising for the spray head is determined according to the scanning area radius and the scanning area center of circle in the coordinate system
Point；
The spray head is arranged alternately to move since the starting point along the X-direction and Y direction of the coordinate system；
Wherein, in moving process along the y axis, the unit distance moved along Y-axis is set and moves number；And
The moving distance along X-axis is respectively provided in moving process along the x axis every time.
Further, described be arranged along the step of moving distance of X-axis includes:
According to the scanning area radius, the unit distance moved along Y-axis, move number and range formula determination
Each moving distance along X-axis, wherein the range formula are as follows:
Wherein, Sx is the moving distance along X-axis, and Rx is the scanning area radius, and N is current mobile time obtained
Number, S are the unit distance moved along Y-axis.
Further, the method also includes:
Since the starting point, monitor that the spray head is greater than or equal to scanning area along the accumulation distance that Y-axis moves
When diameter, determine that the spray head completes primary spraying according to the spraying profile.
Further, the method also includes:
After each chuck is rotated according to predetermined angle and direction, the spray head return to the starting point and according to
The spraying profile is sprayed again.
Further, the predetermined angle includes 15 degree of multiple.
Further, the scanning area radius is equal to the radius of the wafer and the sum of the numerical value of scanning extended range；
The scanning extended range is to be accelerated and/or slowed down the error distance generated based on the spray head.
Further, the region of the spraying profile is circle.
Further, the default spraying number is at least one times of the period number of revolutions of the chuck；Wherein, described
The period number of revolutions of chuck is the number that the chuck rotates a circle according to the predetermined angle and direction.
Second aspect, the present invention provides a kind of glue spreader paint finishings, wherein includes:
Acquisition unit, for obtaining the radius of wafer to be sprayed；
Scanning element, for determining scanning area radius according to the radius of the wafer, wherein the scanning area radius
Greater than the radius of the wafer；
Spray unit, for the spraying profile of spray head in the glue spreader to be arranged in the coordinate system pre-established；
Rotary unit is used in the case where completing primary spraying according to the spraying profile whenever the spray head, chuck
Rotated once according to predetermined angle and direction；
Counting unit, for terminating to institute in the case where the spraying number when the spray head reaches default spraying number
State the spraying of wafer.
The embodiment of the present invention bring it is following the utility model has the advantages that
The present invention provides a kind of glue spreader spraying method and systems, true according to the radius for obtaining wafer to be sprayed first
Determine scanning area radius (radius that the radius is greater than wafer)；Then, it is arranged in glue spreader in the coordinate system pre-established and sprays
The spraying profile of head；When spray head completes primary spraying according to spraying profile, chuck is rotated according to predetermined angle and direction
Once；Finally, terminating the spraying to wafer when the spraying number of spray head reaches default spraying number.With block in the prior art
Disk, which cannot rotate, spraying profile immobilizes compares, and is calculated in aforesaid way provided by the present embodiment based on wafer radius
The efficiency of wafer spraying can be improved in spraying profile, and spraying terminates rear chuck rotation predetermined angle every time, and wafer spray can be improved
The uniformity of painting.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is glue spreader spraying method flow chart provided in an embodiment of the present invention；
Fig. 2 is scanning area radius schematic diagram provided in an embodiment of the present invention；
Fig. 3 is spray head track schematic diagram provided in an embodiment of the present invention；
Fig. 4 is glue spreader paint finishing schematic diagram provided in an embodiment of the present invention.
Icon: 101- acquisition unit；102- scanning element；103- spray unit；104- rotary unit；105- counts single
Member.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with embodiment, it is clear that described reality
Applying example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, the common skill in this field
Art personnel every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
It cannot be rotated in view of existing glue spreader chuck, spraying caused by spraying profile cannot be calculated according to wafer radius is equal
The problem that even property is poor, spray efficiency is low, a kind of glue spreader spraying method provided in an embodiment of the present invention and system, can effectively mention
The efficiency and uniformity of high wafer spraying.
For convenient for understanding the present embodiment, first to a kind of glue spreader spraying method disclosed in the embodiment of the present invention
It describes in detail.
Embodiment one:
A kind of glue spreader spraying method flow chart, this method shown in referring to Fig.1 specifically include that
Step S100 obtains the radius of wafer to be sprayed.
Step S200 determines scanning area radius according to the radius of wafer, and wherein scanning area radius is greater than the half of wafer
Diameter.
Further, scanning area radius is equal to the radius of wafer and the sum of the numerical value of scanning extended range；Scanning extension
Distance is the error distance generated that accelerated based on spray head and/or slowed down.
For example, scanning extended range is dr, then scanning area radius Rx=R+dr as shown in Fig. 2, wafer radius is R.
Specifically, due to spray head the edge zone of scanning area carry out direction reorganization, so the movement speed of spray head
It carries out changing the direction of motion after deceleration is zero, carries out uniform motion after carrying out accelerating to pre-set velocity.Therefore, scanning extension
Distance can guarantee that spray head completes the process for accelerating and/or slowing down, and make spray head in the spraying uniform motion of wafer.
The spraying profile of spray head in glue spreader is arranged in step S300 in the coordinate system pre-established.
In one embodiment, the region of spraying profile is circle.It is of course also possible to use it according to actual needs
Its spraying profile, herein without limiting.
This gives a kind of in the coordinate system pre-established is arranged the tool of the spraying profile of spray head in glue spreader
Body embodiment, specific steps are referring to as follows:
Rising for the spray head is determined according to the scanning area radius and the scanning area center of circle in the coordinate system
Point；Spray head is arranged alternately to move along the X-direction of coordinate system and Y direction from the off.
A kind of embodiment is included in moving process along the y axis, and the unit distance moved along Y-axis is arranged and moves time
Number；And along the x axis in moving process, it is being respectively provided with the moving distance along X-axis every time.
A kind of specific steps of moving distance this gives setting along X-axis are referring to as follows:
The unit distance that moves according to scanning area radius, along Y-axis moves number and range formula determines every time along X
The moving distance of axis, wherein range formula are as follows:
Wherein, Sx is the moving distance along X-axis, and Rx is scanning area radius, and N is the current mobile number obtained, and S is edge
The mobile unit distance of Y-axis.
In the present embodiment, when the accumulation distance for from the off, monitoring spray head and moving along Y-axis is greater than or equal to scanning
When regional diameter, determine that spray head completes primary spraying according to spraying profile.
Specifically, false coordinate system center point coordinate is (x0, y0), the coordinate of starting point is (x1, y1), wherein x1=x0,
Y1=Rx-y0, the distance that spray head is calculated in starting point according to formula (1), is moved along X-axis negative direction first, then again along Y-axis losing side
To Moving Unit distance, the distance then calculated further according to formula (1) moves along X-axis positive direction that (the every movement of Y-axis is primary, X-axis
Moving distance changes primary), such X-direction and Y direction are alternately mobile to complete primary spraying, in spraying profile such as Fig. 3
Shown in dotted line.In primary spraying, the mobile unit distance of Y-axis and mobile number are determined according to scanning area diameter, Y-axis
Mobile unit distance and mobile number seizes the opportunity ability when (i.e. the mobile accumulation distance of Y-axis) is greater than or equal to scanning area diameter
It can guarantee that wafer is all sprayed, otherwise spray head moves along Y-axis negative direction by continuing and continues to spray.
Step S400, when spray head completes primary spraying according to spraying profile, chuck is according to predetermined angle and direction
Rotation is primary.
In one embodiment, predetermined angle includes 15 degree of multiple.
This gives after each chuck is rotated according to predetermined angle and direction, spray head returns to the starting point
And it is sprayed again according to spraying profile.
Step S500 terminates the spraying to wafer when the spraying number of spray head reaches default spraying number.
This gives at least one times of the period number of revolutions that default spraying number is chuck；Wherein, chuck
Period number of revolutions is the number that chuck rotates a circle according to predetermined angle and direction.
Specifically, spraying number determines that thickness is thicker according to the coating thickness of wafer, spraying number is more, to make to spray
Uniformly, after each spraying, chuck rotates once, and rotation angle is pre-set angle, is 15 degree of multiple,
Multiple is determined by spraying process, after each spraying, spray head is sprayed next time after returning to starting point.
The present invention provides a kind of glue spreader spraying methods, comprising: true according to the radius for obtaining wafer to be sprayed first
Determine scanning area radius (radius that the radius is greater than wafer)；Then, it is arranged in glue spreader in the coordinate system pre-established and sprays
The spraying profile of head；When spray head completes primary spraying according to spraying profile, chuck is rotated according to predetermined angle and direction
Once；Finally, terminating the spraying to wafer when the spraying number of spray head reaches default spraying number.With block in the prior art
Disk, which cannot rotate, spraying profile immobilizes compares, and is calculated in aforesaid way provided by the present embodiment based on wafer radius
The efficiency of wafer spraying can be improved in spraying profile, and spraying terminates rear chuck rotation predetermined angle every time, and wafer spray can be improved
The uniformity of painting.
Embodiment two:
Referring to a kind of glue spreader paint finishing schematic diagram shown in Fig. 4, which is specifically included that
Acquisition unit 101, for obtaining the radius of wafer to be sprayed；
Scanning element 102 determines scanning area radius for the radius according to wafer, and wherein scanning area radius is greater than crystalline substance
Round radius；
Spray unit 103, for the spraying profile of spray head in glue spreader to be arranged in the coordinate system pre-established；
Rotary unit 104, in the case where completing primary spraying according to spraying profile whenever spray head, chuck according to
Predetermined angle and direction rotate once；
Counting unit 105, for terminating to wafer in the case where the spraying number when spray head reaches default spraying number
Spraying.
The present invention provides a kind of glue spreader paint finishings, comprising: true according to the radius for obtaining wafer to be sprayed first
Determine scanning area radius (radius that the radius is greater than wafer)；Then, it is arranged in glue spreader in the coordinate system pre-established and sprays
The spraying profile of head；When spray head completes primary spraying according to spraying profile, chuck is rotated according to predetermined angle and direction
Once；Finally, terminating the spraying to wafer when the spraying number of spray head reaches default spraying number.With block in the prior art
Disk, which cannot rotate, spraying profile immobilizes compares, and is calculated in aforesaid way provided by the present embodiment based on wafer radius
The efficiency of wafer spraying can be improved in spraying profile, and spraying terminates rear chuck rotation predetermined angle every time, and wafer spray can be improved
The uniformity of painting.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description
Specific work process, can be with reference to the corresponding process in preceding method embodiment one, details are not described herein.
The flow chart and block diagram in the drawings show the system of multiple embodiments according to the present invention, method and computer journeys
The architecture, function and operation in the cards of sequence product.In this regard, each box in flowchart or block diagram can generation
A part of one module, section or code of table, a part of the module, section or code include one or more use
The executable instruction of the logic function as defined in realizing.It should also be noted that in some implementations as replacements, being marked in box
The function of note can also occur in a different order than that indicated in the drawings.For example, two continuous boxes can actually base
Originally it is performed in parallel, they can also be executed in the opposite order sometimes, and this depends on the function involved.It is also noted that
It is the combination of each box in block diagram and or flow chart and the box in block diagram and or flow chart, can uses and execute rule
The dedicated hardware based system of fixed function or movement is realized, or can use the group of specialized hardware and computer instruction
It closes to realize.
In addition, in the description of the embodiment of the present invention unless specifically defined or limited otherwise, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Glue spreader spraying method and the computer program product of system provided by the embodiment of the present invention, including store place
The computer readable storage medium of the executable non-volatile program code of device is managed, the instruction that said program code includes can be used for
Previous methods method as described in the examples is executed, specific implementation can be found in embodiment of the method, and details are not described herein.
In several embodiments provided herein, it should be understood that disclosed system and method can pass through it
Its mode is realized.The apparatus embodiments described above are merely exemplary, for example, the division of the unit, only
A kind of logical function partition, there may be another division manner in actual implementation, in another example, multiple units or components can combine
Or it is desirably integrated into another system, or some features can be ignored or not executed.Another point, shown or discussed phase
Coupling, direct-coupling or communication connection between mutually can be through some communication interfaces, the INDIRECT COUPLING of device or unit or
Communication connection can be electrical property, mechanical or other forms.
The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple
In network unit.It can select some or all of unit therein according to the actual needs to realize the mesh of this embodiment scheme
's.
It, can also be in addition, the functional units in various embodiments of the present invention may be integrated into one processing unit
It is that each unit physically exists alone, can also be integrated in one unit with two or more units.
It, can be with if the function is realized in the form of SFU software functional unit and when sold or used as an independent product
It is stored in the executable non-volatile computer-readable storage medium of a processor.Based on this understanding, of the invention
Technical solution substantially the part of the part that contributes to existing technology or the technical solution can be with software in other words
The form of product embodies, which is stored in a storage medium, including some instructions use so that
One computer equipment (can be personal computer, server or the network equipment etc.) executes each embodiment institute of the present invention
State all or part of the steps of method.And storage medium above-mentioned includes: USB flash disk, mobile hard disk, read-only memory (ROM, Read-
Only Memory), random access memory (RAM, Random Access Memory), magnetic or disk etc. are various can be with
Store the medium of program code.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of glue spreader spraying method characterized by comprising
Obtain the radius of wafer to be sprayed；
Scanning area radius is determined according to the radius of the wafer, wherein the scanning area radius is greater than the half of the wafer
Diameter；
The spraying profile of spray head in the glue spreader is set in the coordinate system pre-established；
When the spray head completes primary spraying according to the spraying profile, chuck rotates one according to predetermined angle and direction
It is secondary；
When the spraying number of the spray head reaches default spraying number, terminate the spraying to the wafer.
2. the method according to claim 1, wherein described be arranged the gluing in the coordinate system pre-established
The step of spraying profile of spray head, includes: in machine
The starting point of the spray head is determined according to the scanning area radius and the scanning area center of circle in the coordinate system；
The spray head is arranged alternately to move since the starting point along the X-direction and Y direction of the coordinate system；
Wherein, in moving process along the y axis, the unit distance moved along Y-axis is set and moves number；And each
Along the x axis in moving process, it is respectively provided with the moving distance along X-axis.
3. according to the method described in claim 2, it is characterized in that, described be arranged along the step of moving distance of X-axis includes:
According to the scanning area radius, the unit distance moved along Y-axis, move number and range formula determination every time
The moving distance along X-axis, wherein the range formula are as follows:
Wherein, Sx is the moving distance along X-axis, and Rx is the scanning area radius, and N is the current mobile number obtained, S
For the unit distance moved along Y-axis.
4. according to the method described in claim 2, it is characterized in that, the method also includes:
Since the starting point, monitor that the spray head is greater than or equal to scanning area diameter along the accumulation distance that Y-axis moves
When, determine that the spray head completes primary spraying according to the spraying profile.
5. according to the method described in claim 2, it is characterized in that, the method also includes:
After each chuck is rotated according to predetermined angle and direction, the spray head returns to the starting point and according to described
Spraying profile is sprayed again.
6. the method according to claim 1, wherein the predetermined angle includes 15 degree of multiple.
7. the method according to claim 1, wherein the scanning area radius be equal to the wafer radius and
Scan the sum of the numerical value of extended range；
The scanning extended range is to be accelerated and/or slowed down the error distance generated based on the spray head.
8. the method according to claim 1, wherein the region of the spraying profile is circle.
9. the method according to claim 1, wherein the period that the default spraying number is the chuck rotates
At least one times of number；Wherein, the period number of revolutions of the chuck is that the chuck is revolved according to the predetermined angle and direction
The number to circle.
10. a kind of glue spreader paint finishing characterized by comprising
Acquisition unit, for obtaining the radius of wafer to be sprayed；
Scanning element, for determining scanning area radius according to the radius of the wafer, wherein the scanning area radius is greater than
The radius of the wafer；
Spray unit, for the spraying profile of spray head in the glue spreader to be arranged in the coordinate system pre-established；
Rotary unit, in the case where completing primary spraying according to the spraying profile whenever the spray head, chuck to be pressed
It is rotated once according to predetermined angle and direction；
Counting unit, for terminating to the crystalline substance in the case where the spraying number when the spray head reaches default spraying number
Round spraying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910461250.8A CN110209015B (en) | 2019-05-31 | 2019-05-31 | Spraying method and system of glue spreader |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910461250.8A CN110209015B (en) | 2019-05-31 | 2019-05-31 | Spraying method and system of glue spreader |
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| CN110209015B CN110209015B (en) | 2022-05-31 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112275496A (en) * | 2020-10-29 | 2021-01-29 | 上海应用技术大学 | Guide rail type automatic spraying machine for experiment |
| CN112619933A (en) * | 2020-12-11 | 2021-04-09 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Spraying method and spraying system of glue spreader |
| CN113389109A (en) * | 2021-05-31 | 2021-09-14 | 湖南三一路面机械有限公司 | Liquid spraying control method and system for road roller, road roller and readable storage medium |
| CN114669452A (en) * | 2022-03-26 | 2022-06-28 | 宁波芯健半导体有限公司 | Ultrathin chip gum coating method, coating device and storage medium |
| CN115055301A (en) * | 2022-05-30 | 2022-09-16 | 上海应用技术大学 | Automatic spraying machine with visual positioning function for experiments |
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| CN112275496A (en) * | 2020-10-29 | 2021-01-29 | 上海应用技术大学 | Guide rail type automatic spraying machine for experiment |
| CN112275496B (en) * | 2020-10-29 | 2022-04-01 | 上海应用技术大学 | Guide rail type automatic spraying machine for experiment |
| CN112619933A (en) * | 2020-12-11 | 2021-04-09 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Spraying method and spraying system of glue spreader |
| CN113389109A (en) * | 2021-05-31 | 2021-09-14 | 湖南三一路面机械有限公司 | Liquid spraying control method and system for road roller, road roller and readable storage medium |
| CN113389109B (en) * | 2021-05-31 | 2022-04-12 | 湖南三一路面机械有限公司 | Liquid spraying control method and system for road roller, road roller and readable storage medium |
| CN114669452A (en) * | 2022-03-26 | 2022-06-28 | 宁波芯健半导体有限公司 | Ultrathin chip gum coating method, coating device and storage medium |
| CN115055301A (en) * | 2022-05-30 | 2022-09-16 | 上海应用技术大学 | Automatic spraying machine with visual positioning function for experiments |
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