CN110208909A - Fibre circuit plate and its manufacturing method, light transmitting device, photoelectric mixed circuit board - Google Patents
Fibre circuit plate and its manufacturing method, light transmitting device, photoelectric mixed circuit board Download PDFInfo
- Publication number
- CN110208909A CN110208909A CN201910581947.9A CN201910581947A CN110208909A CN 110208909 A CN110208909 A CN 110208909A CN 201910581947 A CN201910581947 A CN 201910581947A CN 110208909 A CN110208909 A CN 110208909A
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- Prior art keywords
- circuit plate
- fibre circuit
- optical fiber
- binder course
- substrate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3608—Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/40—Mechanical coupling means having fibre bundle mating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Light Guides In General And Applications Therefor (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
This application discloses a kind of fibre circuit plate and its manufacturing method, light transmitting device, photoelectric mixed circuit boards, the fibre circuit plate includes the multiple fibre circuit plate units being stacked and connection structure, wherein, at least two fibre circuit plate units respectively include bonding pad and stripping area；Connection structure is folded between two bonding pads of two fibre circuit plate units being disposed adjacent, and for connecting two bonding pads of be disposed adjacent two fibre circuit plate units, the two fibre circuit plate units that will be disposed adjacent link together.By the above-mentioned means, the application can provide technical support and convenience for the three-dimensional installation of fibre circuit plate.
Description
Technical field
This application involves optical transport technology fields, more particularly to a kind of fibre circuit plate and its manufacturing method, optical transport
Device, photoelectric mixed circuit board.
Background technique
Light network, which refers to, realizes that the signal between circuit board, chip is connected using light-conductive media (optical fiber, optical waveguide etc.), can
With realize between plate/plate in it is low in energy consumption, rate is high, the transmission of the data of signal integrity.
Fibre circuit plate is a kind of mode for realizing optical interconnection, however fibre circuit plate assembling mode in the related technology is not
It is enough flexible, and occupied space is larger, so that it is impossible to meet install and use demand.
Summary of the invention
The application provides a kind of fibre circuit plate and its manufacturing method, light transmitting device, photoelectric mixed circuit board, Neng Gouwei
The three-dimensional installation of fibre circuit plate provides technical support and convenience.
The technical solution that the application uses is: providing a kind of fibre circuit plate, which includes that stacking is set
The multiple fibre circuit plate units and connection structure set, wherein at least two fibre circuit plate units respectively include bonding pad and
Stripping area；Connection structure is folded between two bonding pads of two fibre circuit plate units being disposed adjacent, for connecting phase
Two bonding pads of two fibre circuit plate units of neighbour's setting, the two fibre circuit plate units that will be disposed adjacent are connected to
Together.
Another technical solution that the application uses is: providing a kind of light transmitting device, which includes as above
The fibre circuit plate and the optical port set on the end of fibre circuit plate, the optical port are used to connect with light docking facilities
It connects, to carry out optical signal transmission.
Another technical solution that the application uses is: providing a kind of photoelectric mixed circuit board, the photoelectric mixed circuit board
Including fibre circuit plate as described above and the circuit lead being arranged on the fibre circuit plate.
Another technical solution that the application uses is: a kind of manufacturing method of fibre circuit plate is provided, this method comprises:
There is provided multiple fibre circuit plate units and connection structure, wherein at least two fibre circuit plate units respectively include connecting
Meet area and stripping area；Two bonding pads of two fibre circuit plate units being disposed adjacent are connected using connection structure, with
Be disposed adjacent two fibre circuit plate units are stacked and are linked together to obtain fibre circuit plate.
The beneficial effect of the application is: being in contrast to the prior art, the application fibre circuit plate includes being stacked
Multiple fibre circuit plate units and connection structure, wherein at least two fibre circuit plate units respectively include bonding pad and stripping
From area；Connection structure is folded between two bonding pads of two fibre circuit plate units being disposed adjacent, adjacent for connecting
Two bonding pads of two fibre circuit plate units being arranged, the two fibre circuit plate units that will be disposed adjacent are connected to one
It rises.By the above-mentioned means, the bonding pad for the fibre circuit plate being disposed adjacent is linked together, so that be disposed adjacent two
The connection of a fibre circuit plate part, and be partially stripped, to facilitate the position that stripping area is further arranged according to actual use demand,
Technical support and convenience are provided for the three-dimensional installation of fibre circuit plate.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.Wherein:
Fig. 1 is the structural schematic diagram of one embodiment of the application fibre circuit plate；
Fig. 2 is the structural schematic diagram of another embodiment of the application fibre circuit plate；
Fig. 3 is one structural schematic diagram of fibre circuit plate unit in the application fibre circuit plate；
Fig. 4 is another structural schematic diagram of fibre circuit plate unit in the application fibre circuit plate；
Fig. 5 is the structural schematic diagram of one embodiment of the application fibre circuit plate；
Fig. 6 is the another structural schematic diagram of fibre circuit plate unit in the application fibre circuit plate；
Fig. 7 is one structural schematic diagram of outlet in the application fibre circuit plate；
Fig. 8 is another structural schematic diagram of outlet in the application fibre circuit plate；
Fig. 9 is the another structural schematic diagram of outlet in the application fibre circuit plate；
Figure 10 is the structural schematic diagram of one embodiment of the application light transmitting device；
Figure 11 is the structural schematic diagram of another embodiment of the application light transmitting device；
Figure 12 is the flow diagram of one embodiment of the application fibre circuit board fabrication method；
Figure 13 is the flow chart of step S12 in Figure 12；
Figure 14 is the flowage structure schematic diagram of one embodiment of the application fibre circuit board fabrication method；
Figure 15 is one flow diagram of manufacturing method of fibre circuit plate unit in the application fibre circuit plate；
Figure 16 is the one process structural schematic diagram of manufacturing method of fibre circuit plate unit in the application fibre circuit plate；
Figure 17 is another flow diagram of manufacturing method of fibre circuit plate unit in the application fibre circuit plate；
Figure 18 is another flowage structure schematic diagram of manufacturing method of fibre circuit plate unit in the application fibre circuit plate.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of embodiments of the present application, rather than whole embodiments.Based on this
Embodiment in application, those of ordinary skill in the art are obtained every other under the premise of not making creative labor
Embodiment shall fall in the protection scope of this application.
Fig. 1 and Fig. 2 are please referred to, Fig. 1 is the structural schematic diagram of one embodiment of the application fibre circuit plate, and Fig. 2 is this Shen
Please another embodiment of fibre circuit plate structural schematic diagram.In the present embodiment, fibre circuit plate 100 is either only pass
The wiring board of optical signals is also possible to transmit the wiring board of the mixed signal (such as photosignal) including optical signal.
In present embodiment, fibre circuit plate 100 may include multiple fibre circuit plate units 10 and connection structure 20.
Fibre circuit plate 100 can be stepped construction, be stacked and formed by multiple fibre circuit plate units 10.Wherein, light
Fine wiring board unit 10 refers to the wiring board of the independent single layer comprising optical fiber or multilayer.It is pointed out that multiple optical fiber
Wiring board unit 10 can refer to two, three or more fibre circuit plate units 10, herein without limitation.
In multiple fibre circuit plate units 10, having at least two fibre circuit plate units 10 includes bonding pad 11 and stripping
From area 12.Wherein, bonding pad 11 is with other fibre circuit plate units 10 for being attached, stripping area 12 then not with other optical fiber
Wiring board unit 10 connects, and therefore, can bend etc. to stripping area 12 according to actual needs and be located at required
Position.Specifically, the specific location relationship of bonding pad 11 and stripping area 12 on fibre circuit plate unit 10 can be according to reality
Demand is configured, such as one end is bonding pad 11, and the other end is stripping area 12, or intermediate is bonding pad 11, and both ends
For stripping area 12 etc., herein without limitation.It should be pointed out that fibre circuit that might not be all in fibre circuit plate 100
Plate unit 10 all has stripping area 12, and part fiber wiring board unit 10 can not also include stripping area 12, and it is whole for
Adjacent fibre circuit plate unit 10 connects, and specifically can then be arranged according to the actual situation.
Connection structure 20 can be folded between two bonding pads 11 of two fibre circuit plate units 10 being disposed adjacent, and be used
In two bonding pads 11 of two fibre circuit plate units 10 that connection is disposed adjacent, two fibre circuits that will be disposed adjacent
Plate unit 10 links together.
Specifically, connection structure 20 can be adhesive-layer, can be formed by coating viscose glue, sticking two-faced adhesive tape etc., to pass through
Bonding realizes the connection between fibre circuit plate unit 10；Or may be fixed pin, screw etc., it is mechanically real
Connection between existing fibre circuit plate unit 10.
Wherein, it can be bonded and be set by adhesive-layer between the bonding pad 11 for two fibre circuit plate units 10 being disposed adjacent
It sets, and then separates setting between stripping area 12, so that a stripping area can be bent relative to adjacent stripping area
Setting.Specifically, can be parallel separately positioned between stripping area 12, i.e., bending setting is not carried out to stripping area 12, as shown in Figure 1；
Alternatively, it is separately positioned at an angle between stripping area 12, i.e., bending setting is carried out to stripping area 12, as shown in Figure 2.For not
Same fibre circuit plate unit 10, can be set different modes.
In present embodiment, the bonding pad 11 for the fibre circuit plate unit 10 being disposed adjacent is linked together, to make
Two 10 parts of the fibre circuit plate unit connection that must be disposed adjacent, and is partially stripped, with facilitate according to actual use demand into
The position of stripping area 12 is arranged in one step, provides technical support and convenience for the three-dimensional installation of fibre circuit plate 100.
Please further together refering to Fig. 3 and Fig. 4, each fibre circuit plate unit 10 can respectively include at least one optical fiber group
Part 14 and at least two substrates 13.
Specifically, at least two substrates 13 stacking interval setting, wherein the quantity of substrate can be two, or
Three or three or more.
Accordingly, the quantity of optical fiber component 14 is one few compared with the quantity of substrate, that is, a for n in the quantity of substrate 11
When, the quantity of optical fiber component 12 is n-1.Specifically, adjacent two substrates, 13 sandwicheds are arranged in each optical fiber component 14
Space in.It should be pointed out that optical fiber component 14 herein is that optical fiber is arranged in two adjacent bases by certain mode
It is formed by between plate.Each optical fiber component 14 may include an optical fiber perhaps a plurality of optical fiber or can also include one group
Optical fiber or multiple groups optical fiber.Wherein, the quantity of optical fiber can according to actual needs, as connected as needed in every group of optical fiber
The model etc. of connector is set as 1,4,8,12,24 etc.；The group number of optical fiber can also be arranged according to demand, herein not
It limits.
Wherein, as shown in figure 3, optical fiber component 14 may include at least one optical fiber in single layer arrangement；Alternatively, including more
Layer stackup and a plurality of optical fiber arranged in a crossed manner, specifically can be with square crossing, or is in that other angles are intersected, as shown in figure 4, including
Two-layer laminate and the first optical fiber 141 and the second optical fiber 142 arranged in a crossed manner；In addition optical fiber component 14 can also include multilayer laminated
And a plurality of optical fiber being staggered.Specifically, every optical fiber can both be of a straight line type arrangement, can also arrange in bending.
Specifically, the optical fiber in optical fiber component 14 can be high temperature optical fiber, for example, coating can in the fibre core outer surface of optical fiber
The coat of resistance to 100 degree or more high temperature, the material of the coat can be high temperature resistant acrylic acid, heat-proof silica gel, polyimides, gold
Belong to etc.；Or the optical fiber in optical fiber component 14 is also possible to ordinary optic fibre, the material of fibre core periphery coat can be epoxy third
Olefin(e) acid ester or polyacrylate etc., are not specifically limited herein.
Further, the quantity of substrate 13 is at least two, and at least two substrates 13 are stacked, and every two is disposed adjacent
Substrate 13 between be folded with a corresponding optical fiber component 14, and each optical fiber component 14 is folded in two be disposed adjacent
Between substrate 13, i.e., the outermost layer of each independent fibre circuit plate unit 10 is substrate 13.
Further, in fibre circuit plate 100, two adjacent fibre circuit plate units 10 are tied by corresponding connection
Structure 20 and link together.In this way, since fibre circuit plate 100 is by independent 10 shape of fibre circuit plate unit
At, thus when some or certain fibre circuit plate units 10 fail wherein, it can be by the fibre circuit plate unit 10 therefrom
It removes and replaces, without replacing entire fibre circuit plate 100 when part fiber wiring board unit 10 fails.
Wherein, the material of substrate 13 can be flexible material, be specifically as follows flexible composite, such as can be with are as follows: poly-
Acid imide, polyethylene terephthalate, dimethyl silicone polymer etc..Substrate 13 uses flexible material, can obtain flexibility
Fibre circuit plate 100, bending repeatedly can be subjected to so that stripping area 12 can be carried out relative to bonding pad 11 it is curved
Folding distortion, to adapt to actual locational requirement.The thickness of substrate 13 can be not more than 100 μm, such as 20 μm -100 μm, specific such as 20
μm, 25 μm, 45 μm, 65 μm, 85 μm, 100 μm etc., be not specifically limited herein.
Wherein, it is provided with binder course 15 between the substrate 13 that every two is disposed adjacent, to connect by the binder course 15
Together, and by binder course 15 by a corresponding optical fiber component 14 it is fixed between two adjacent substrates 13, and ties
Layer 15 is closed to be filled in the remaining space in addition to optical fiber component 14 between corresponding two be disposed adjacent substrate 13.
It should be pointed out that 15 thickness of binder course is difficult to fixed optical fiber when too small, and when thickness is excessive, is difficult to keep light
The flexibility of fine wiring board unit 10.Wherein, thickness herein refers to binder course 15 on the direction of the plate face perpendicular to substrate 13
Thickness.In present embodiment, the thickness in the most thin region of the binder course 15 between two adjacent substrates 13 is greater than optical fiber
Diameter 1/10th and be less than 10 times of diameter of optical fiber, or greater than optical fiber diameter half and be less than optical fiber
Five points with a thickness of fibre diameter in the most thin region of the binder course 15 between 2 times of diameter, such as two adjacent substrates 13
One of, half, 1 times, 2 times, 5 times etc., be not specifically limited herein.
Specifically, the thickness of binder course 15 be not less than 50 μm, can be 50 μm, 60 μm, 70 μm etc., using binder course 15 it
Afterwards, the peel strength between adjacent substrate 13 is not less than 15N/cm.
Specifically, in an application scenarios, binder course 15 is solid within the scope of the first temperature range and/or first pressure
State and for flexibility, within the scope of second temperature range and/or second pressure have mobility, wherein in the first temperature range appoint
Temperature value anticipate no more than the arbitrary temp value in second temperature range.Specifically, at normal temperatures and pressures, or close to normal temperature and pressure
When, binder course 13 is solid-state and has flexibility, and when being heated to certain temperature and/or applying certain pressure, tool
There is certain mobility.Specifically, binder course 15 can be thermoplastic material or thermosetting material.
Wherein it is possible to select the binder course 15 of unlike material according to the practical service environment of fibre circuit plate.Specifically, exist
When need to adapt to hot environment, as described above, optical fiber uses high temperature optical fiber, the material of binder course 15 can for epoxy-resin systems,
At least one of acrylic system, silica gel system；And only need to the operation under common normal temperature environment when, as described above, optical fiber
Using ordinary optic fibre, then the material of binder course 15 is at least one of acrylic system, silica gel system.
Using the binder course 15 of above-mentioned material, when heating and/or pressurizeing to fibre circuit plate unit 10,15 energy of binder course
It is enough to generate the periphery for flowing and being coated on optical fiber, and fill in the space between adjacent substrate 13 in addition to a fiber, thus by light
It is fine fixedly more firm, it due to being not fixed firmly leans on to reduce optical fiber when used for a long time and the case where loosening, being subjected to displacement occurs,
To improve the reliability of fibre circuit plate unit 10 and fibre circuit plate 100.
In an application scenarios, as shown in Figure 3,4, each fibre circuit plate unit 10 may include stacking and interval is set
Two substrates set, 13, optical fiber components 14, the optical fiber component 14 are fixed between two substrates 13 by binder course 15.
Fibre circuit plate 100 corresponding to the fibre circuit plate unit 10 of this application scene is as shown in Figure 5, it should be pointed out that Fig. 5 is only
As an example, not playing restriction effect to the specific structure of fibre circuit plate 100.
In another application scenarios, as shown in fig. 6, each fibre circuit plate unit 10 can also include stacking and be spaced
Three substrates being arranged, 13, two optical fiber components 14, wherein each optical fiber component 14 is set to three by binder course 15 respectively
Substrate 13 is formed by two interval regions.Certainly, in other application scene, the quantity of substrate 13 can also be four
It is a, five etc., can specifically be arranged according to actual needs, be not specifically limited herein.
Further, please continue to refer to Fig. 5, each substrate 13 includes base main body 131 and outlet 132.Wherein, fiber
Mouth 132 is set to the end of base main body 131 along the extending direction of optical fiber, and optical fiber is extended by outlet 132.It may be noted that
, outlet 132 may be provided at one end, both ends, three ends or four ends of substrate 13 etc., is not specifically limited herein.And in light
On fine extending direction, the length of optical fiber is greater than the length of substrate 13, further to connect with optical connector.
In an application scenarios, as shown in fig. 7, the quantity of outlet 132 is one, and the outer edge of outlet 132
Concordant setting.At this point, the optical fiber in optical fiber component 14 corresponding to the substrate 13 is along the outlet 132 in same level
On extend.
In another application scene, as shown in Figure 8, Figure 9, the quantity of outlet 132 be it is multiple, multiple outlets 132 by
Base main body 131 is protruded and is extended to form to the periphery, and is intervally installed, wherein the outer edge of each outlet 132 is concordant
Setting, and each outlet 132 can correspond to one group of optical fiber, as shown in figure 8, or the optical fiber that is intervally installed of corresponding multiple groups, such as
Shown in Fig. 9.It should be pointed out that be arranged since each outlet 132 is spaced, it can be according to actual needs and to each
Outlet 132 carries out bending setting, so as to set different fiber directions for outlet 132.
Further, in this application scene, the length on the extending direction along optical fiber of multiple outlets 132 can phase
Together, it can also be different.For example, when needing the direction being arranged consistent with extending direction of the optical fiber originally at outlet 132, it can
Shorter outlet 132 is set；And have centainly in the extending direction of the direction that needs are arranged and optical fiber originally at outlet 132
Angle when in addition it is contrary when, due to needing certain bending, longer outlet 132 can be set.
Please further 0, Figure 11, Figure 10 are the structural representations of one embodiment of the application light transmitting device refering to fig. 1 together
Figure, Figure 11 is the structural schematic diagram of another embodiment of the application light transmitting device.In present embodiment, light transmitting device can be wrapped
Include fibre circuit plate 100 and the optical port 200 set on the end of fibre circuit plate 100, wherein the optical port 200 is used for
It is connect with light docking facilities, to carry out optical signal transmission.
Wherein, the fibre circuit plate 100 in present embodiment and the light in above-mentioned the application fibre circuit plate embodiment
Fine wiring board 100 is identical, and related detailed content can refer to above embodiment, and details are not described herein again.
It should be pointed out that optical port 200 receives the optical fiber extended by outlet 132, and will be received in turn
Optical fiber connect on other wiring boards.Wherein, for each fibre circuit plate 100, the optical fiber that both ends are extended can pass through
Different modes is connected on the same or different wiring board of quantity.
In an application scenarios, as shown in Figure 10, one end of fibre circuit plate 100 is connected to by optical port 200
One main circuit board 300, other end then pass through optical port 200 and are respectively connected to multiple sub- wiring boards 400.Pass through this side
The optical signal of one position can be respectively transmitted to different location by formula.
In another application scenarios, as shown in figure 11, every one end of fibre circuit plate 100 can pass through optical port
200 are connected to different multiple sub- wiring boards 400, thus realize the sub- wiring board 400 of different location by optical port 200 it
Between mutual light connects.
Specifically, optical port 200 can be single fiber connector or multifiber connector.Single fiber connector only connects a light
Fine connector, multifiber connector can connect the connector of a plurality of optical fiber, and specifically, different multifiber connectors can connect
The item number of the optical fiber connect is different, such as can be 4,8,12,24 etc..
Wherein, in the biggish fiber transmission device of density, multifiber connector can be used.Multifiber can specifically be carried out
It is merged into one group and is connected with corresponding multifiber connector, such as glue can be used to be bonded together, and can be further at every group
The periphery installation protective case of optical fiber, such as plastic protective sleeve, play a certain protective role optical fiber, and can paste on the protective sleeve
If label paper, with information such as the installation sites that marks this group of optical fiber.
Further, the application also provides a kind of photoelectric mixed circuit board, which may include optical fiber cable
Road plate and the circuit lead being arranged on fibre circuit plate.
Wherein, the fibre circuit plate in present embodiment is identical as in above-mentioned the application fibre circuit plate embodiment,
Related detailed content can refer to above embodiment, and details are not described herein again.
It is the process of one embodiment of manufacturing method of the application fibre circuit plate also referring to Figure 12 to Figure 14, Figure 12
Schematic diagram, Figure 13 are the flow diagrams of step S12 in Figure 12, and Figure 14 is that the manufacturing method one of the application fibre circuit plate is implemented
The flowage structure schematic diagram of mode.Wherein, this method comprises:
Step S11: multiple fibre circuit plate units 10 and connection structure 20 are provided；
Wherein, at least two fibre circuit plate units 10 respectively include bonding pad 11 and stripping area 12.
Step S12: two bonding pads of two fibre circuit plate units 10 being disposed adjacent are connected using connection structure 20
11, the two fibre circuit plate units 10 that will be disposed adjacent are stacked and are linked together to obtain fibre circuit plate 100.
Further, Figure 13 is please referred to, connection structure 20 can be adhesive-layer, and above-mentioned steps S12 includes:
Step S121: connection structure 20 is set to two adjacent fibre circuit plate units 10 two bonding pads 11 it
Between；
Step S122: being pressed together multiple fibre circuit plate units 10, by two adjacent fibre circuit plates
Unit 10 is laminated at bonding pad 11 and links together to obtain fibre circuit plate 100.
Wherein, connection structure 20 is glue-line in present embodiment, by being pressed together, may make glue-line can more
It is so even that be distributed between two adjacent bonding pads 11, and can by glue-line bubble and glue-line and bonding pad between
Bubble, which squeezes, to be excluded, so as to stronger that two bonding pads 11 are fixed together.
Wherein, as described in above-mentioned 100 embodiment of the application fibre circuit plate, fibre circuit plate unit 10 may include two
Kind situation, a kind of only includes the optical fiber component 14 of single layer, optical fiber component 14 that is another then including multilayer.
Specifically, light is provided when fibre circuit plate unit 10 only includes two-layer substrate also referring to Figure 15 and Figure 16
The step of fine wiring board unit 10 includes:
Step S21: side is provided with the first substrate 131 of the first binder course 151, side is provided with the second binder course for offer
152 the second substrate 132 and at least one optical fiber 141；
Wherein, the first substrate 131 that side is provided with the first binder course 151 can be by the side of first substrate 131
The first binder course 151 is arranged to obtain, or the first substrate 131 for being provided with the first binder course 151 can also be directly acquired, herein
Without limitation；Similarly, the second substrate 132 that side is provided with the second binder course 152 can also be obtained by aforesaid way.
Step S22: in side arrangement optical fiber 141 of first binder course 151 far from first substrate 131 to form optical fiber component
14, and the second substrate 132 with the second binder course 152 is set in 14 upper cover of optical fiber component, so that optical fiber component 14 is located in
Between one binder course 151 and the second binder course 152, an overall structure is formed；
Step S23: being pressed together overall structure, so that the first binder course 151 and the second binder course 152 mutually melt
Clad optical fiber component 14 after conjunction, and be filled in surplus in addition to optical fiber component 14 between first substrate 131 and the second substrate 132
In complementary space, to obtain fibre circuit plate unit 10.
It should be pointed out that since the first binder course 151 and the second binder course 152 have under heating and/or pressurized conditions
There is certain mobility, therefore, by being pressed together, the first binder course 151 and the second binder course 152 is enabled to merge
It together and fills to the space in addition to optical fiber component 14 between first substrate 131 and the second substrate 132, thus by light
Fibre 141 is fixedly stronger, occurs loosening due to being not fixed firmly to reduce optical fiber 141 when used for a long time, be subjected to displacement
The case where, and can pressing when, by between bubble and binder course inside binder course and optical fiber 141 or combine from base
Bubble discharge between plate, to improve the reliability of fibre circuit plate unit 10 and fibre circuit plate 100.
Further, also referring to Figure 17 and Figure 18, fibre circuit plate unit 10 include three layers and above substrate (with
Illustrate for three layers) when, the step of providing fibre circuit plate unit 10 includes:
Step S31: side is provided with the first substrate 131 of the first binder course 151, the second combination is respectively set in two sides for offer
Layer 152 and the second substrate 132 of third binder course 153, side are provided with the third substrate 133 and extremely of the 4th binder course 154
Few two optical fiber 141；
Identical with above embodiment, the first substrate 131 that side is provided with the first binder course 151 can be by
The side of one substrate 131 is arranged the first binder course 151 and obtains, or can also directly acquire and be provided with the first binder course 151
First substrate 131, herein without limitation；Similarly, the of the second binder course 152 and third binder course 153 is respectively set in two sides
The third substrate 133 that two substrates 132, side are provided with the 4th binder course 154 can be obtained by aforesaid way.
Step S32: in side arrangement optical fiber 141 of first binder course 151 far from first substrate 131 to form the first optical fiber
Component 14a, and in side arrangement optical fiber 141 of the third binder course 153 far from the second substrate 132 to form the second optical fiber component
14b；
Wherein, the mode of the first optical fiber component 14a of arranging and the mode of the second optical fiber component 14b of arrangement can identical may be used
With difference.
Step S33: the second substrate 132 for being placed with the second optical fiber component 14b is covered on the first optical fiber component 14a,
So that the first optical fiber component 14a is located between the first binder course 151 and the second binder course 152, and will be combined with the 4th
The third substrate 133 of layer 154 is covered on the second optical fiber component 14b, so that the second optical fiber component 14b is located in third combination
Between layer 153 and the 4th binder course 154, to form an overall structure；
Step S34: being pressed together overall structure, so that the first binder course 151 and the second binder course 152 mutually melt
The first optical fiber component 14a is coated after conjunction, and is filled between first substrate 131 and the second substrate 132 and is removed the first optical fiber component
The second optical fiber is coated in remaining space except 14a, and after making third binder course 153 and the mutually fusion of the 4th binder course 154
Component 14b, and it is filled in the remaining space in addition to the second optical fiber component 14b between the second substrate 132 and third substrate 133
It is interior, to obtain fibre circuit plate unit 10.
It should be pointed out that obtained fibre circuit plate unit 10 is only one such embodiment party through the above way
Formula, for example, it is also possible to prepare the fibre circuit plate unit 10 being made of five laminar substrates, six laminar substrates, seven laminar substrates etc., herein not
It is specifically limited.
In addition, relevant other structures of fibre circuit plate 100 and function in present embodiment etc. and above-mentioned the application light
Identical in fine wiring board embodiment, related detailed content can refer to above embodiment, and details are not described herein again.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (26)
1. a kind of fibre circuit plate, which is characterized in that the fibre circuit plate includes:
The multiple fibre circuit plate units being stacked, wherein at least two fibre circuit plate units respectively include connecting
Area and stripping area；
Connection structure is folded between two bonding pads of two be disposed adjacent the fibre circuit plate unit, is used for
Connect two bonding pads of two fibre circuit plate units being disposed adjacent, two light that will be disposed adjacent
Fine wiring board unit links together.
2. fibre circuit plate according to claim 1, which is characterized in that each fibre circuit plate unit wraps respectively
It includes:
At least one optical fiber component, wherein each optical fiber component includes at least one optical fiber；
At least two substrates a, wherein optical fiber component and knot are additionally provided between the substrate that every two is disposed adjacent
Layer is closed, the binder course is used to connect two substrates, and the optical fiber component is fixed between two substrates；
Wherein, two adjacent bases in two fibre circuit plate units that the connection structure is used to be disposed adjacent
The respective bonding pad of plate links together.
3. fibre circuit plate according to claim 2, which is characterized in that removing between two substrates being disposed adjacent
Remaining space except the optical fiber component is filled by the binder course.
4. fibre circuit plate according to claim 2, which is characterized in that the institute between two substrates being disposed adjacent
State the most thin region of binder course thickness be greater than the optical fiber diameter 1/10th and be less than the optical fiber diameter 10
Times.
5. fibre circuit plate according to claim 4, which is characterized in that the institute between two substrates being disposed adjacent
State the most thin region of binder course thickness be greater than the optical fiber diameter half and be less than the optical fiber diameter 2
Times.
6. fibre circuit plate according to claim 2, which is characterized in that the binder course in the first temperature range and/or
It is solid-state within the scope of first pressure, there is mobility within the scope of second temperature range and/or second pressure, wherein the first temperature
Arbitrary temp value in range is no more than the arbitrary temp value in second temperature range.
7. fibre circuit plate according to claim 6, which is characterized in that the binder course is thermosetting material or thermoplasticity
Material.
8. fibre circuit plate according to claim 6, which is characterized in that the binder course in the first temperature range and/or
It is flexible material within the scope of first pressure.
9. fibre circuit plate according to claim 2, which is characterized in that the optical fiber is ordinary optic fibre, the binder course
Material be at least one of acrylic system, silica gel system.
10. fibre circuit plate according to claim 2, which is characterized in that the optical fiber is high temperature optical fiber, the binder course
Material be at least one of epoxy-resin systems, acrylic system, silica gel system.
11. fibre circuit plate according to claim 2, which is characterized in that each substrate includes:
Base main body；
Outlet is set to the end of the base main body along the extending direction of the optical fiber, wherein the optical fiber by it is described go out
Fine mouth extends.
12. fibre circuit plate according to claim 11, which is characterized in that the quantity of the outlet is one, and institute
The outer edge for stating outlet is concordantly arranged.
13. fibre circuit plate according to claim 11, which is characterized in that the quantity of the outlet be it is multiple, it is multiple
The outlet is protruded and is extended to form to the periphery by the base main body, and is intervally installed.
14. fibre circuit plate according to claim 13, which is characterized in that the outer edge of each outlet is concordantly set
It sets, and each outlet corresponds to one or more groups of spaced optical fiber.
15. fibre circuit plate according to claim 2, which is characterized in that the optical fiber component includes arranging in single layer
At least one optical fiber.
16. fibre circuit plate according to claim 2, which is characterized in that the optical fiber component includes in stacking and interlocking
Arrangement, or stacking and cross arrangement a plurality of optical fiber.
17. fibre circuit plate according to claim 2, which is characterized in that the material of the substrate is flexible material.
18. fibre circuit plate according to claim 1, which is characterized in that the connection structure is adhesive-layer.
19. fibre circuit plate according to claim 18, which is characterized in that two be disposed adjacent the fibre circuit plate
By adhesive-layer fitting setting between the bonding pad of unit, and the stripping area can be relative to the adjacent stripping
It bends and is arranged from area.
20. a kind of light transmitting device, which is characterized in that including the described in any item fibre circuit plates of such as claim 1-19 and set
Optical port in the end of the fibre circuit plate, the optical port with light docking facilities for connecting, to carry out light letter
Number transmission.
21. light transmitting device according to claim 20, which is characterized in that the optical port is single fiber connector or more
Fiber connector.
22. a kind of photoelectric mixed circuit board, which is characterized in that including the described in any item fibre circuit plates of such as claim 1-19
And the circuit lead on the fibre circuit plate is set.
23. a kind of manufacturing method of fibre circuit plate, which is characterized in that the manufacturing method includes:
There is provided multiple fibre circuit plate units and connection structure, wherein at least two fibre circuit plate units wrap respectively
Include bonding pad and stripping area；
It, will using two bonding pads of two fibre circuit plate units that connection structure connection is disposed adjacent
Two be disposed adjacent the fibre circuit plate unit is stacked and is linked together to obtain the fibre circuit plate.
24. manufacturing method according to claim 23, which is characterized in that the connection structure is adhesive-layer, using described
Two bonding pads of two fibre circuit plate units that connection structure connection is disposed adjacent, will be disposed adjacent two
The step of a fibre circuit plate unit is stacked and is linked together to obtain the fibre circuit plate, comprising:
The connection structure is set between two bonding pads of the fibre circuit plate unit of adjacent two；
Multiple fibre circuit plate units are pressed together, by two adjacent fibre circuit plate units in institute
Stacking at bonding pad is stated to link together to obtain the fibre circuit plate.
25. manufacturing method according to claim 23, which is characterized in that the step of providing fibre circuit plate unit packet
It includes:
There is provided that side is provided with the first substrate of the first binder course, side is provided with the second substrate and at least of the second binder course
One optical fiber；
In side arrangement optical fiber of first binder course far from the first substrate to form optical fiber component, and in the optical fiber
Component upper cover sets the second substrate with second binder course so that the optical fiber component be located in first binder course and
Between second binder course, an overall structure is formed；
The overall structure is pressed together, so that first binder course and second binder course wrap after mutually merging
The optical fiber component is covered, and is filled in surplus in addition to the optical fiber component between the first substrate and the second substrate
In complementary space, to obtain the fibre circuit plate unit.
26. manufacturing method according to claim 23, which is characterized in that the step of providing fibre circuit plate unit packet
It includes:
There is provided that side is provided with the first substrate of the first binder course, the second binder course is respectively set in two sides and third binder course the
Two substrates, side are provided with the third substrate and at least two articles of optical fiber of the 4th binder course；
In side arrangement optical fiber of first binder course far from the first substrate to form the first optical fiber component, and described
Side arrangement optical fiber of the third binder course far from the second substrate is to form the second optical fiber component；
The second substrate for being placed with second optical fiber component is covered on first optical fiber component, so that described first
Optical fiber component is located between first binder course and second binder course, and the third that will have the 4th binder course
Substrate cover is set on second optical fiber component, so that second optical fiber component is located in the third binder course and described
Between 4th binder course, to form an overall structure；
The overall structure is pressed together, so that first binder course and second binder course wrap after mutually merging
First optical fiber component is covered, and is filled between the first substrate and the second substrate and removes first optical fiber component
Except remaining space in, and after the third binder course and the 4th binder course are mutually merged coat second light
Fine component, and it is empty to be filled in the residue in addition to second optical fiber component between the second substrate and the third substrate
In, to obtain the fibre circuit plate unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910581947.9A CN110208909A (en) | 2019-06-30 | 2019-06-30 | Fibre circuit plate and its manufacturing method, light transmitting device, photoelectric mixed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910581947.9A CN110208909A (en) | 2019-06-30 | 2019-06-30 | Fibre circuit plate and its manufacturing method, light transmitting device, photoelectric mixed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110208909A true CN110208909A (en) | 2019-09-06 |
Family
ID=67795495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910581947.9A Pending CN110208909A (en) | 2019-06-30 | 2019-06-30 | Fibre circuit plate and its manufacturing method, light transmitting device, photoelectric mixed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110208909A (en) |
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| WO2021249397A1 (en) * | 2020-06-12 | 2021-12-16 | 中兴通讯股份有限公司 | Circuit board, method for manufacturing circuit board, and electronic device |
| CN114578488A (en) * | 2020-12-01 | 2022-06-03 | 深南电路股份有限公司 | Optical fiber circuit board unit, optical transmission device, and photoelectric hybrid circuit board |
| WO2023197667A1 (en) * | 2022-04-15 | 2023-10-19 | 华为技术有限公司 | Optical backplane and manufacturing method therefor, optical backplane assembly, and communication device |
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