CN110205504A - A kind of heat treatment for solidification method of liquid metal - Google Patents
A kind of heat treatment for solidification method of liquid metal Download PDFInfo
- Publication number
- CN110205504A CN110205504A CN201910499872.XA CN201910499872A CN110205504A CN 110205504 A CN110205504 A CN 110205504A CN 201910499872 A CN201910499872 A CN 201910499872A CN 110205504 A CN110205504 A CN 110205504A
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- China
- Prior art keywords
- liquid metal
- heat treatment
- liquid
- metallic particles
- metal
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Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/12—Making non-ferrous alloys by processing in a semi-solid state, e.g. holding the alloy in the solid-liquid phase
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a kind of heat treatment for solidification methods of liquid metal, Nano/micron metallic particles is removed into oxide on surface, the Nano/micron metallic particles Uniform Doped by oxide on surface is removed is blended in liquid metal by kneading again, which coats liquid metal；Finally by the metallic particles of liquid state/liquid metal mixture through Overheating Treatment, the characteristics of liquids of liquid metal disappears at this time, it is changed into solid property, and then the metallic particles of liquid metal constituent and doping is made to generate intermetallic compound during heat treatment, so that liquid metal is changed into crystal structure by amorphous amorphous structure, makes liquid metal that there is important industrial application and commercial value.
Description
Technical field
The present invention relates to liquid metals flexible electronic field more particularly to a kind of heat treatment for solidification methods of liquid metal.
Background technique
Liquid metal is a kind of amorphous, non-crystal structure low-melting alloy, has liquid fluidity under room temperature.Cause
This, is difficult to obtain stable form, is difficult to be stabilized after making it be processed into product, and causes it to be difficult to commercialization always and answer
With.However, the high temperature process shaping characteristic relative to solid metal, the characteristics of liquids of liquid metal makes it have the liquid of room temperature
Processing characteristics can reduce equipment cost on a large scale, therefore raising processing efficiency has it in flexible printing electronic field
Important application prospect.
Based on above-mentioned technical background, so that liquid metal is retained liquid processing characteristics, after being formed using printing technology, make
Liquid metal has essential industry application and commercial value with stable solid forms.
Summary of the invention
In order to solve the working fluid characteristic of liquid metal, after so that it is processed into product using characteristics of liquids, has and stablize
Solid forms.The present invention provides a kind of heat treatment for solidification methods of liquid metal, so that liquid metal is obtained stable
Solid forms, while there is high conductivity and tensility.
Liquid metal solidification of the present invention, primarily directed to the heat treatment method of the composite liquefied metal material of metallic particles.Gu
Change the liquid metal for referring to and adulterating metallic particles by heat treatment process, is changed into semisolid or even solid side from liquid
Method.The present invention makes the unformed liquid metal of amorphous be changed into the stable form with solid property by technological means, thus
Make liquid metal that there is important industrial application and commercial value.
The present invention is achieved through the following technical solutions:
A kind of heat treatment for solidification method of liquid metal comprising following steps:
Nano/micron metallic particles is removed into oxide on surface；
The Nano/micron metallic particles Uniform Doped by oxide on surface is removed is blended in liquid metal by kneading,
The surface of metal particles coats liquid metal, and metallic particles/liquid metal mixture shape that is in a liquid state (still retains its liquid at this time
Bulk properties)；
By the metallic particles of liquid state/liquid metal mixture by 80 DEG C~450 DEG C heat treatments, heat treatment time 2
~60 hours, liquid metal was changed into solid-state like by liquid state at this time.
The liquid metal is changed into the solid-state like characteristics of liquids for specifically referring to liquid metal by liquid state and disappears, and is changed into
Solid property, and then the metallic particles of liquid metal constituent and doping is made to generate intermetallic compound during heat treatment, make
Liquid metal is changed into crystal structure by amorphous amorphous structure.
The metallic particles content is 10~70wt%.
The metallic particles be metal simple-substance particle, including nickel (Ni) particle, copper (Cu) particle or iron (Fe) particle or
Person's zinc (Zn) particle etc.；
Wherein, when metal simple-substance particle uses nickel particle, which is 30~45%, and heat treatment temperature is
120 DEG C, heat treatment time is 48 hours；When metal simple-substance particle uses copper particle, which is 25~35%, heat
Treatment temperature is 140 DEG C, and heat treatment time is 24 hours；When metal simple-substance particle uses iron particle, which is
15~30%, heat treatment temperature is 100 DEG C, and heat treatment time is 48 hours.
The liquid metal is that the liquid metal alloy as the main component with gallium, i.e. gallium indium or gallium indium tin liquid metal close
Gold.
The removing oxide on surface, which refers to, removes oxide on surface using weak acid.
The present invention compared with the existing technology, have following advantages and effects
Liquid metal alloy after present invention process solidifies has stable form, mechanical stability, while also having gold
Belong to grade conductivity.
The solidification ratio of present invention process liquid metal can carry out Effective Regulation by doping metals granule content.When mixing
When miscellaneous tenor is enough to react away liquid metal content, liquid metal will be fully cured at this time.When the tenor of doping
When being not enough to react away liquid metal content, liquid metal only has subparticipation solidification at this time, therefore it is special to generate liquid-solid two-phase
Property.
Technical measure is simple and easy to do, realizes that gold occurs for Ga and In atom and the metallic particles of doping in liquid metal
It is chemically reacted between category, forms Ga/ metallic compound and In/ metallic compound.
Metallic particles reacts the present invention with liquid metal generation intermetallic chemical during heat treatment, changes between generation metal
Object is closed, liquid metal is changed into solid phase transition by liquid to realize.
Detailed description of the invention
Liquid metal Ga In-Ni blend shape appearance figure before Fig. 1 present invention is heat-treated.
Liquid metal main ingredient is GaIn/Ga after Fig. 2 present invention heat treatment4Ni3/InNi3Alloy shape appearance figure.
Specific embodiment
The present invention is more specifically described in detail combined with specific embodiments below.
Embodiment 1
By micrometer nickel metallic particles, its surface oxide layer is removed using weak acid, it is then that it is evenly dispersed by grinding
In Liquid metal Ga In, nickel particle content used is 30-45%, forms GaIn-Ni liquid blend.Then, by GaIn-Ni
Liquid blend is placed in 120 DEG C of baking ovens and is heat-treated, and the time is 48 hours.GaIn-Ni liquid blend after heat treatment
Characteristics of liquids disappears, and is changed into Pickering pattern.Main ingredient is changed into GaIn/Ga by GaIn-Ni blend4Ni3/InNi3
Alloy.
As shown in Figure 1, wherein GaIn is amorphous amorphous liquid；As shown in Fig. 2, Ga4Ni3And InNi3For crystalline solid,
Sheet resistance is 28-135m Ω/sq.
Embodiment 2
By nanosized copper metallic particles, its oxide on surface is removed using weak acid, its ball milling blending technology is evenly dispersed
In GaInSn alloy, copper metal content used is 25-35%, forms GaInSn-Cu blend.The liquid that blending is obtained
Liquid GaInSn-Cu compound is printed on PDMS elastic matrix by GaInSn-Cu compound by hiatus mask, is formed
Flexible circuit version is still at this time liquid by the conducting wire that GaInSn-Cu is formed.Then, the GaInSn-Cu circuit version of printing is led to
It crosses at 140 DEG C after being heat-treated 24 hours, main component is changed into GaInSn/Ga by GaInSn-Cu compound2Cu alloy,
Wherein GaInSn is liquid, Ga2Cu is solid-state.It obtains that there is the metal-cured circuit version of the flexible liquid of Pickering pattern, has
There is important economic value.
Embodiment 3
Iron (Fe) nano particle is passed through double rod grindings to be dispersed in liquid GaIn alloy, adulterated iron content is
15-30% forms GaIn-Fe liquid blend.It is formed into liquid in polyethyl acrylate film by flaw version printing
GaIn-Fe conductive pattern.Then, after by the liquid GaIn-Fe conductive pattern of printing by being heat-treated 48 hours at 100 DEG C,
Main ingredient is changed into GaInFe alloy by GaIn-Fe blend, has stable solid pattern.
As described above, the present invention can be better realized.
Embodiment of the present invention are not limited by the above embodiments, other are any without departing from Spirit Essence of the invention
With changes, modifications, substitutions, combinations, simplifications made under principle, equivalent substitute mode should be, be included in of the invention
Within protection scope.
Claims (6)
1. a kind of heat treatment for solidification method of liquid metal, it is characterised in that include the following steps:
Nano/micron metallic particles is removed into oxide on surface；
The Nano/micron metallic particles Uniform Doped by oxide on surface is removed is blended in liquid metal by kneading, the gold
Metal particles surface coats liquid metal, and metallic particles/liquid metal mixture is in a liquid state shape at this time；
By the metallic particles of liquid state/liquid metal mixture by 80 DEG C~450 DEG C heat treatments, heat treatment time is 2~60
Hour, liquid metal is changed into solid-state like by liquid state at this time.
2. the heat treatment for solidification method of liquid metal according to claim 1, it is characterised in that: the liquid metal is by liquid
Shape is changed into the solid-state like characteristics of liquids for specifically referring to liquid metal and disappears, and is changed into solid property, and then make liquid metal group
Divide and generate intermetallic compound during heat treatment with the metallic particles of doping, turns liquid metal by amorphous amorphous structure
Become crystal structure.
3. the heat treatment for solidification method of liquid metal according to claim 2, it is characterised in that: the metallic particles content is
10~70wt%.
4. the heat treatment for solidification method of liquid metal according to claim 2, it is characterised in that: the metallic particles is metal
Simple substance particle, including nickel particle, copper particle or iron particle；
Wherein, when metal simple-substance particle uses nickel particle, which is 30~45%, and heat treatment temperature is 120 DEG C,
Heat treatment time is 48 hours；
When metal simple-substance particle uses copper particle, which is 25~35%, and heat treatment temperature is 140 DEG C, at heat
Managing the time is 24 hours；
When metal simple-substance particle uses iron particle, which is 15~30%, and heat treatment temperature is 100 DEG C, at heat
Managing the time is 48 hours.
5. the heat treatment for solidification method of liquid metal according to claim 2, it is characterised in that: the liquid metal is with gallium
Liquid metal alloy as the main component, i.e. gallium indium or gallium indium tin liquid metal alloy.
6. the heat treatment for solidification method of liquid metal according to claim 2, it is characterised in that: the removing oxide on surface
Refer to and oxide on surface is gone using weak acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910499872.XA CN110205504A (en) | 2019-06-11 | 2019-06-11 | A kind of heat treatment for solidification method of liquid metal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910499872.XA CN110205504A (en) | 2019-06-11 | 2019-06-11 | A kind of heat treatment for solidification method of liquid metal |
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| CN110205504A true CN110205504A (en) | 2019-09-06 |
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| CN201910499872.XA Pending CN110205504A (en) | 2019-06-11 | 2019-06-11 | A kind of heat treatment for solidification method of liquid metal |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115216162A (en) * | 2022-07-07 | 2022-10-21 | 河北工业大学 | Preparation method of double-phase gallium-indium alloy for flexible electronic printing |
| CN115232603A (en) * | 2022-05-20 | 2022-10-25 | 桂林电子科技大学 | Gallium-based liquid metal thermal interface material capable of being solidified at low temperature and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108441860A (en) * | 2018-06-29 | 2018-08-24 | 北京梦之墨科技有限公司 | A kind of anticorrosion coating material and its application method of room temperature self-curing |
| CN108754192A (en) * | 2018-06-29 | 2018-11-06 | 北京梦之墨科技有限公司 | A kind of raw metal and its preparation and its application method |
| EP3462462A1 (en) * | 2017-09-28 | 2019-04-03 | Ecole Polytechnique Federale De Lausanne (EPFL) EPFL-TTO | Patterned biphasic electrical conductor and methods for producing thereof |
-
2019
- 2019-06-11 CN CN201910499872.XA patent/CN110205504A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3462462A1 (en) * | 2017-09-28 | 2019-04-03 | Ecole Polytechnique Federale De Lausanne (EPFL) EPFL-TTO | Patterned biphasic electrical conductor and methods for producing thereof |
| CN108441860A (en) * | 2018-06-29 | 2018-08-24 | 北京梦之墨科技有限公司 | A kind of anticorrosion coating material and its application method of room temperature self-curing |
| CN108754192A (en) * | 2018-06-29 | 2018-11-06 | 北京梦之墨科技有限公司 | A kind of raw metal and its preparation and its application method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115232603A (en) * | 2022-05-20 | 2022-10-25 | 桂林电子科技大学 | Gallium-based liquid metal thermal interface material capable of being solidified at low temperature and preparation method thereof |
| CN115216162A (en) * | 2022-07-07 | 2022-10-21 | 河北工业大学 | Preparation method of double-phase gallium-indium alloy for flexible electronic printing |
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