CN110201555A - A kind of hollow fiber composite membrane and its encapsulating method of resin high strength bond - Google Patents
A kind of hollow fiber composite membrane and its encapsulating method of resin high strength bond Download PDFInfo
- Publication number
- CN110201555A CN110201555A CN201910611814.1A CN201910611814A CN110201555A CN 110201555 A CN110201555 A CN 110201555A CN 201910611814 A CN201910611814 A CN 201910611814A CN 110201555 A CN110201555 A CN 110201555A
- Authority
- CN
- China
- Prior art keywords
- resin
- composite membrane
- fiber composite
- hollow fiber
- high strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 61
- 239000011347 resin Substances 0.000 title claims abstract description 61
- 239000012528 membrane Substances 0.000 title claims abstract description 59
- 239000002131 composite material Substances 0.000 title claims abstract description 41
- 239000012510 hollow fiber Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004080 punching Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 15
- -1 polytetrafluoroethylene Polymers 0.000 claims description 14
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 12
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 229920000728 polyester Polymers 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 229920006231 aramid fiber Polymers 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 4
- 230000004323 axial length Effects 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 229920002301 cellulose acetate Polymers 0.000 claims description 2
- 239000011152 fibreglass Substances 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 2
- 239000011118 polyvinyl acetate Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 239000004695 Polyether sulfone Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims 1
- 229920006393 polyether sulfone Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 238000000926 separation method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000002033 PVDF binder Substances 0.000 description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 4
- 235000012489 doughnuts Nutrition 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
- B01D67/0002—Organic membrane manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
- B01D69/08—Hollow fibre membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
- B01D69/12—Composite membranes; Ultra-thin membranes
Abstract
The invention belongs to technical field of membrane separation, it is related to and discloses a kind of hollow fiber composite membrane of resin high strength bond, it from outside to inside include separating layer, supporting layer and hollow cavity, separation layer surface is provided with several holes, hole passes through separating layer and enters supporting layer, when making membrane module, resin encapsulating is goed deep into entering supporting layer in hole.The invention also discloses the encapsulating method of the film, includes the following steps: that hollow fiber composite membrane 1) is sent into perforating device punching, generate several holes, which enters supporting layer through hollow fiber composite membrane separating layer；2) resin encapsulating is entered step in the hole 1) generated, resin passes through hole and separating layer and part supporting layer high strength bond.The present invention a kind of hollow fiber composite membrane and its encapsulating method of resin high strength bond, greatly promote the adhesion strength of film and resin, extend the service life of film and component, with simple process, it is easy to operate, the advantages of production efficiency can be effectively improved, reduce production cost.
Description
Technical field
The invention belongs to technical field of membrane separation, and in particular to a kind of hollow fiber composite membrane of resin high strength bond and
Its encapsulating method.
Background technique
Why composite membrane has more advantage, and becomes the form of most widely used commercialization membrane material at present, main base
Type selecting can be carried out respectively in the separating layer and support layer material of composite membrane and is optimized.It can be obtained by adjusting the property of separating layer
High-throughput and high rejection is obtained, suitable pore structure and excellent mechanicalness can also be obtained by adjusting the property of supporting layer
Energy.Hollow fiber composite membrane then combines the respective advantage of hollow membrane and composite membrane, such as the high density and compound of loading of hollow membrane
The superelevation mechanical strength of film and excellent permselective property energy overcome doughnut homogeneous membrane and are easy fracture of wire and permselective property
The low shortcomings of energy.
When making membrane module, generally film and film, film and shell are potted using resin, but doughnut is compound
Membrane structure can not significantly change the adhesion strength of film and resin, and especially when separating layer aperture is smaller, material is not easy to bond, such as
When separating layer material is the polytetrafluoroethylene (PTFE) of low surface tension, resin is just difficult to enter supporting layer through separating layer, ties
Fruit be easy to cause the weak bonding of resin Yu UF membrane layer, existing encapsulating mode all only simply sealing resins between film wire,
Resin is only in conjunction with film wire superficial face, and with enhancing supporting layer without any active force, and in actual use, there are resins and film point
Absciss layer, UF membrane layer and supporting layer two weak bonding links, increase the risk that film is removed from resin, membranous system are caused to make
With being greatly reduced for service life.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of resin and easily propagates through separating layer in encapsulating, with supporting layer
In conjunction with and not blocking the inner cavity of hollow membrane, greatly improve the bond strength of resin and film, extend making for film and its component
With the hollow fiber composite membrane and its encapsulating method of the resin high strength bond in service life.
For achieving the above object, the present invention adopts the following technical scheme that:
A kind of hollow fiber composite membrane of resin high strength bond, from outside to inside include separating layer, supporting layer and hollow cavity,
It when making membrane module, is potted using resin, the separation layer surface is provided with several holes, and hole enters across separating layer
Supporting layer, when making membrane module, resin encapsulating is goed deep into entering supporting layer in hole.Hole passes through separating layer and enters supporting layer, but
It is not through supporting layer, when encapsulating had not only improved adhesion strength but also will not block inner cavity.
Preferably, described hole is distributed within the scope of 1 ~ 100 mm of film axial length, numbers of hole is every film 1 ~ 100
A, hole diameter is 50 ~ 1000 μm.Hole is distributed in the axis that can control encapsulating within the scope of 1 ~ 100 mm of film axial length
To thickness.
Preferably, the hollow fiber composite membrane be looping method or cladding process prepare there is looping or coating separation
The film of layer and micropore supporting layer, the looping or coating separating layer material of film are polytetrafluoroethylene (PTFE), Kynoar, polysulfones, polyethers
Sulfone, polyvinyl chloride, polyethylene, polypropylene, polyacrylonitrile, cellulose acetate or polyamide, the micropore supporting layer of film are polyester, gather
It is acid imide, poly(p-phenylene terephthalamide), polytetrafluoroethylene (PTFE), carbon fiber, aramid fiber, polyvinyl chloride, polyurethane, polyamide, profound
Wu Yan, stainless steel or fiberglass braided tube.It is suitble to the hollow fiber composite membrane of multiple material.
Preferably, the resin is Lauxite, polyvinyl acetate resin, polyacrylic resin, polyurethane, epoxy
Resin or organosilicon.A variety of binding resins are applicable in.
A kind of encapsulating method of the hollow fiber composite membrane of resin high strength bond, includes the following steps:
1) hollow fiber composite membrane is sent into perforating device punching, generates several holes, which runs through hollow fiber composite membrane
Separating layer enters supporting layer；
2) resin encapsulating is entered step in the hole 1) generated, resin is high-intensitive by hole and separating layer and part supporting layer
Bonding.
Preferably, perforating device described in step 1) is steel needle or laser boring.
Preferably, high strength bond intensity described in step 2 is greater than 100 N.
The hollow fiber composite membrane and its encapsulating method of a kind of resin high strength bond of the invention, pass through
Beat several holes on the encapsulating end of hollow fiber composite membrane, resin easily propagates through hole and enters supporting layer when encapsulating, with
Inner cavity of the supporting layer high strength bond without blocking film, greatly promotes the adhesion strength of film and resin, prevents film wire in reality
It is detached from from resin when use, to extend the service life of film and its component.It is easy to operate with simple process, it can be effective
The advantages of improving production efficiency, reducing production cost.
Detailed description of the invention
Fig. 1 is the cross section structure schematic diagram of hollow fiber composite membrane described in the embodiment of the present invention 1.
Fig. 2 is the punching schematic diagram of hollow fiber composite membrane shown in FIG. 1.
Fig. 3 is the part punching schematic diagram of hollow fiber composite membrane described in embodiment 7.
Fig. 4 is the schematic cross-section after the punching of hollow fiber composite membrane described in embodiment 1 and comparative example 1.
Diagram: 1 separating layer, 2 supporting layers, 3 holes, 4 perforating devices, 5 hollow cavities,
6 do not run through the hole of separating layer.
Specific embodiment
Below with reference to Fig. 1 ~ 4, the present invention is described further with specific embodiment.
Embodiment 1
A kind of hollow fiber composite membrane of resin high strength bond includes as shown in Fig. 1 separating layer 1, supporting layer from outside to inside
2 and hollow cavity 5, when making membrane module, it is potted using resin, 1 surface of separating layer is provided with several holes 3,
Hole 3 passes through separating layer 1 and enters supporting layer 2, and when making membrane module, resin encapsulating is goed deep into entering supporting layer 2 in hole 3.
The quantity of the embodiment hole 3 is 48.Select Kynoar (PVDF) doughnut of cladding process preparation multiple
Film is closed, for the coating separating layer 1 of the film with a thickness of 100 μm, supporting layer 2 is polyester (PET) hollow braiding of 2.0 mm of outer diameter
Pipe.
A kind of encapsulating method of the hollow fiber composite membrane of resin high strength bond, includes the following steps:
1) hollow fiber composite membrane feeding perforating device 4 is punched, as shown in Fig. 2, perforating device 4 is four 300 μm of outer diameter
Steel needle, adjacent 8 mm of steel needle spacing, hole 3 is distributed within the scope of 50 mm of film axial length, as shown in attached drawing 1, attached drawing 2, is
The schematic diagram of the hole 3 formed after the hollow fiber composite membrane and four steel needle punchings.The depth of hole 3 is 500 μm, altogether
It 48, is uniformly distributed on 1 surface of separating layer, hole 3 enters supporting layer 2 through PVDF coating separating layer 1；
2) encapsulating that the hollow fiber composite membrane after punching carries out subsequent epoxy resin is encapsulated.It is right after resin solidification is complete
The bonding situation of composite membrane and resin is measured.
The adhesion strength of the film and epoxy resin is 150 N, and resin does not enter the hollow cavity 5 of the hollow woven tube of PET,
As a result as shown in the embodiment 1 of table 1.
Wherein: the adhesion strength measuring method that the present embodiment uses is measured using omnipotent testing machine for mechanical properties.
Embodiment 2
Other than it will coat separating layer thickness and be substituted for 20 μm, sealed according to material same as Example 1 and technique encapsulating
Dress.
The adhesion strength of the film and epoxy resin is 135 N, and resin does not enter the inner cavity of the hollow woven tube of polyester, as a result
As shown in the embodiment 2 of table 1.
Embodiment 3
Other than polyester (PET) hollow woven tube is substituted for the hollow woven tube of basalt, according to material same as Example 2
It is encapsulated with technique encapsulating.
The adhesion strength of the film and epoxy resin is greater than 300 N, and resin does not enter the inner cavity of the hollow woven tube of basalt,
As a result as shown in the embodiment 3 of table 1.
Embodiment 4
Other than the Kynoar (PVDF) for preparing cladding process is substituted for the polytetrafluoroethylene (PTFE) of looping method preparation, press
It is encapsulated according to material same as Example 3 and technique encapsulating.
The adhesion strength of the film and epoxy resin is greater than 300 N, and resin does not enter the inner cavity of the hollow woven tube of basalt,
As a result as shown in the embodiment 4 of table 1.
Embodiment 5
Other than the hollow woven tube of basalt is substituted for aramid fiber (Aramid) hollow woven tube, according to same as Example 4
Material and the encapsulation of technique encapsulating.
The adhesion strength of the film and epoxy resin is greater than 300 N, and resin does not enter the inner cavity of the hollow woven tube of aramid fiber, knot
Fruit is as shown in the embodiment 5 of table 1.
Embodiment 6
Other than epoxy resin is replaced generating polyurethane, encapsulated according to material same as Example 5 and technique encapsulating.
The adhesion strength of the film and polyurethane is greater than 300 N, and resin does not enter the inner cavity of the hollow woven tube of aramid fiber, as a result
As shown in the embodiment 6 of table 1.
Embodiment 7
Other than the steel needle that the surrounding of perforating device 4 is equipped with 4 300 μm of outer diameter is substituted for the steel needle of 500 μm of 1 outer diameter,
It is encapsulated according to material same as Example 6 and technique encapsulating.As shown in Fig. 3, it is formed after being punched for the film with 1 steel needle
Hole 3 schematic diagram.
The adhesion strength of the film and polyurethane is greater than 300 N, and resin does not enter the inner cavity of the hollow woven tube of aramid fiber, as a result
As shown in the embodiment 7 of table 1.
Comparative example 1
Other than hole depth is substituted for 50 μm, as shown in Fig. 4, separating layer is not coated through PVDF after film punching, is formed
The hole 6 for not running through separating layer, encapsulates according to material same as Example 1 and technique encapsulating.
The adhesion strength of the film and epoxy resin is 80 N, and resin does not enter the inner cavity of the hollow woven tube of polyester, as a result
As shown on Table 1 comparative example 1.
Comparative example 2
Other than not being sent into perforating device punching, encapsulated according to material same as Example 1 and technique encapsulating.
The adhesion strength of the film and epoxy resin is 50 N, and resin does not enter the inner cavity of the hollow woven tube of polyester, as a result
As shown in the comparative example 2 of table 1.
Table 1
The hollow fiber composite membrane intensity that can be seen that method encapsulating of the invention with comparative example from above-described embodiment is significantly greater than
Go deep into the encapsulating of supporting layer without punching, even larger than without the conventional encapsulating of punching, substantially increases film and its component
Service life.
It is in summary only presently preferred embodiments of the present invention, practical range not for the purpose of limiting the invention, Fan Yibenshen
Please equivalent changes and modifications made by the content of the scope of the patents, all should be technology scope of the invention.
Claims (7)
1. a kind of hollow fiber composite membrane of resin high strength bond, include from outside to inside separating layer (1), supporting layer (2) and
Hollow cavity (5) is potted, it is characterised in that: described separating layer (1) surface is provided with when making membrane module using resin
Several holes (3), hole (3) pass through separating layer (1) and enter supporting layer (2), and when making membrane module, hole is goed deep into resin encapsulating
(3) enter supporting layer (2) in.
2. a kind of hollow fiber composite membrane of resin high strength bond according to claim 1, it is characterised in that: the hole
Hole (3) is distributed within the scope of 1 ~ 100 mm of film axial length, and hole (3) number is every film 1 ~ 100, and hole (3) diameter is
50~1000 μm。
3. a kind of hollow fiber composite membrane of resin high strength bond according to claim 1, it is characterised in that: described
Hollow fiber composite membrane be looping method or cladding process prepare with looping or coat separating layer (1) and micropore supporting layer (2)
Film, the looping or coating separating layer (1) material of film are polytetrafluoroethylene (PTFE), Kynoar, polysulfones, polyether sulfone, polyvinyl chloride, gather
Ethylene, polypropylene, polyacrylonitrile, cellulose acetate or polyamide, the micropore supporting layer (2) of film are polyester, polyimides, poly- pair
Phenylene terepthalamide, polytetrafluoroethylene (PTFE), carbon fiber, aramid fiber, polyvinyl chloride, polyurethane, polyamide, basalt, stainless steel
Or fiberglass braided tube.
4. a kind of hollow fiber composite membrane of resin high strength bond according to claim 1, it is characterised in that: described
Resin is Lauxite, polyvinyl acetate resin, polyacrylic resin, polyurethane, epoxy resin or organosilicon.
5. a kind of encapsulating method of the hollow fiber composite membrane of resin high strength bond according to any one of claims 1-4,
It is characterized by comprising following steps:
1) hollow fiber composite membrane is sent into perforating device (4) punching, generates several holes (3), which runs through hollow fibre
It ties up composite membrane separating layer (1) and enters supporting layer (2)；
2) resin encapsulating is entered step in the hole (3) 1) generated, resin is propped up by hole (3) and separating layer (1) and part
Support layer (2) high strength bond.
6. the encapsulating method of the hollow fiber composite membrane of resin high strength bond according to claim 5, it is characterised in that:
Perforating device described in step 1) (4) is steel needle or laser boring.
7. the encapsulating method of the hollow fiber composite membrane of resin high strength bond according to claim 5, it is characterised in that:
High strength bond intensity described in step 2 is greater than 100 N.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910611814.1A CN110201555A (en) | 2019-07-08 | 2019-07-08 | A kind of hollow fiber composite membrane and its encapsulating method of resin high strength bond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910611814.1A CN110201555A (en) | 2019-07-08 | 2019-07-08 | A kind of hollow fiber composite membrane and its encapsulating method of resin high strength bond |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110201555A true CN110201555A (en) | 2019-09-06 |
Family
ID=67796732
Family Applications (1)
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|---|---|---|---|
| CN201910611814.1A Pending CN110201555A (en) | 2019-07-08 | 2019-07-08 | A kind of hollow fiber composite membrane and its encapsulating method of resin high strength bond |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111115799A (en) * | 2020-01-06 | 2020-05-08 | 浙江长兴求是膜技术有限公司 | Anti-pollution hollow fiber membrane biological reaction component |
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