CN110196609B - Tracking switch simulation temperature control method suitable for satellite equipment external heat flow simulation system - Google Patents
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Abstract
The invention discloses an external heat flow simulation temperature control method of a tracking switch for a ground vacuum thermal test of a storage tank of a spacecraft. The invention effectively solves the problem of poor temperature control uniformity of the traditional switch external heat flow simulation temperature control method, and realizes the uniformity, high efficiency and high precision control of the temperature in the spacecraft storage tank thermal test.
Description
Technical Field
The invention belongs to the technical field of ground vacuum thermal tests of a storage tank of a propulsion cabin of a spacecraft, and particularly relates to a tracking switch external heat flow simulation temperature control method for accurately simulating the storage tank of the spacecraft to perform the vacuum thermal tests on the ground, which is used for improving the uniformity of temperature control when the storage tank of the spacecraft simulates the in-orbit external heat flow.
Background
The spacecraft vacuum thermal test is a test for verifying various performances and functions of a spacecraft under specified vacuum and thermal cycle conditions. The method is one of important tests in multiple environmental simulation tests in the spacecraft prototype development stage. The main purpose of the test is to expose the material and manufacturing process defects of the spacecraft under the conditions of vacuum and thermal cycle, and eliminate early failure, thereby greatly improving the reliability of the on-orbit operation of the spacecraft.
In a spacecraft vacuum thermal test, except for simulating vacuum and low-temperature conditions, the temperature of each component on the spacecraft needs to be controlled so as to accurately simulate the actual on-orbit state of on-board equipment, which is very necessary for verifying the correctness of the spacecraft thermal design, improving the spacecraft development quality and ensuring the success of tasks.
The traditional switch external heat flow simulation temperature control method is to output a power supply according to a switch control mode, and the specific control mode is as follows: a) when the temperature of the temperature control thermistor is lower than the lower limit Tmin of the temperature control threshold, the power supply is powered up; b) when the temperature of the temperature control thermistor is higher than the upper limit Tmax of the temperature control threshold, the power supply is powered off; c) the temperature of the temperature control thermistor is within the temperature control threshold range, and the power supply maintains the previous state unchanged.
The traditional switch external heat flow simulation temperature control method has simple software flow, but the temperature control method has the following problems:
(1) the temperature high and low points have larger deviation and poor uniformity in the test process;
(2) the temperature control precision is low in the test process, and control overshoot is easily caused.
In conclusion, the control quality of the traditional switch external heat flow simulation temperature control method is low, so that the test quality cannot be fundamentally ensured. When the spacecraft storage tank is subjected to a vacuum thermal test on the ground, the actual on-orbit state of external heat flow of the spacecraft storage tank needs to be accurately simulated, and the correctness of thermal design is verified. The invention is provided for meeting the test requirements, improving the uniformity of temperature control when the on-board simulation satellite equipment is subjected to off-orbit heat flow and avoiding overshoot.
Disclosure of Invention
In view of the above, the present invention provides a temperature control method for a tracking switch external heat flow simulation temperature control system for a spacecraft storage tank to perform a vacuum thermal test on the ground, so as to overcome the defects and shortcomings in the prior art, ensure temperature uniformity of a temperature control point, and avoid overshoot of target temperature control. In order to achieve the above object, the present invention provides the following technical solutions:
the method for simulating temperature control of heat flow outside a tracking switch for the ground vacuum thermal test of a spacecraft storage box comprises the following steps:
carrying out subarea monitoring on the surface temperature of each spacecraft storage box by using a thermistor, and arranging a main thermistor and a backup thermistor in the same area, wherein each thermistor corresponds to a temperature measuring point;
collecting the temperature of a master thermistor as a tracking temperature reference point;
the control method of the corresponding heating loop in each subarea comprises the following steps:
a) in each 12s control period, firstly judging the highest value TKmax and the lowest value TKmin of the surface temperature reference point of the storage tank;
b) if the TKmax-TKmin is less than or equal to 4 ℃, controlling the temperature according to a traditional switch control mode;
c) if the TKmax-TKmin is more than 4 ℃, executing a tracking switch external heat flow simulation temperature control program, setting the main heating loop and the backup heating loop of the temperature control loop corresponding to the TKmin to be normally-on, setting the main heating loop and the backup heating loop of the temperature control loop corresponding to the TKmax to be normally-off, driving the program control power supply to supply power to the infrared heating cage by preset current target values of normally-on and normally-off, and controlling the surface temperature of the storage tank;
d) comparing the temperature difference of two temperature reference points of the highest value TKmax and the lowest value TKmin in real time, and when the temperature difference is not more than 1 ℃ (TKmax-TKmin is not more than 1 ℃), recovering the corresponding heating loop to be in normal temperature control; during the period, other temperature control points control the temperature according to the traditional switch control mode;
e) when the temperature of any temperature reference point is less than or equal to 8 ℃ or more than or equal to 35 ℃, sending out an error-reporting prompt, and if a tracking temperature control program is executed, exiting the program and recovering to normal temperature control;
f) when the absolute value of the temperature difference between any two temperature reference points is more than or equal to 8 ℃, an alarm is given.
Preferably, the method for simulating temperature control by tracking heat flow outside the switch adopts the method of preferentially ensuring the uniformity of the temperature of the control point. The surface temperature of the storage tank is controlled by controlling the normally-on and normally-off of the highest value TKmax and the lowest value TKmin of the two temperature reference points, and the other temperature control points control the temperature according to the traditional switch control mode.
Preferably, the temperature difference between the highest value TKmax and the lowest value TKmin of the two temperature reference points is monitored and compared in real time, and when the temperature difference is not more than 1 ℃ (TKmax-TKmin is not more than 1 ℃), the corresponding heating loop recovers to normal temperature control; and then continuously monitoring the temperature value of each reference point in real time, and when the temperature difference between the highest value TKmax and the lowest value TKmin is more than 4 ℃ (TKmax-TKmin is more than 4 ℃), starting a new round of external heat flow simulation temperature control process of the tracking switch, and preferentially ensuring the uniformity of the temperature of the control point.
Preferably, the tracking switch external heat flow simulation temperature control method enables the external heat flow simulation temperature control precision of the storage tank to reach +/-0.5 ℃, and the existing traditional switch external heat flow simulation temperature control method cannot meet the temperature control precision requirement.
The method comprises the steps of obtaining the highest value TKmax and the lowest value TKmin of a surface temperature reference point of the storage tank through monitoring, obtaining a temperature difference by subtracting the highest value TKmax and the lowest value TKmin of the surface temperature reference point of the storage tank, and establishing a vacuum thermal test of the actual in-orbit state of the external heat flow of the storage tank by adopting two external heat flow simulation temperature control methods in two stages by taking the temperature difference of 4 ℃ as a mark value; if the TKmax-TKmin is less than or equal to 4 ℃, controlling the temperature according to a traditional switch control mode; if the TKmax-TKmin is more than 4 ℃, executing a tracking switch external heat flow simulation temperature control program, setting a heating loop corresponding to the TKmin to be normally on, namely driving the programmable power supply to heat the infrared cage according to a starting current preset by the program, and setting the heating loop corresponding to the TKmax to be normally off, namely driving the programmable power supply according to a current value preset by the program, and powering off or reducing the temperature of the infrared cage; and establishing a sampling judgment function of a corresponding temperature control program, and obtaining a corresponding current value to drive the program control power supply so as to control the surface temperature of the storage tank.
Preferably, the heat flow simulation temperature control program outside the tracking switch has an intelligent monitoring function. When the temperature of any temperature reference point is less than or equal to 8 ℃ or more than or equal to 35 ℃, overshoot of temperature control is easy to occur, an error alarm is given, if the temperature control process of the tracking switch is executed, the process is exited, and normal temperature control is recovered; when the absolute value of the temperature difference between any two temperature reference points is more than or equal to 8 ℃, an alarm is given.
The method for simulating temperature control of external heat flow of the tracking switch can be popularized to all spacecraft ground vacuum thermal tests, has wide application prospect, and has important significance for improving the technical level of the spacecraft vacuum thermal tests and improving the stability of the thermal tests of the whole satellite and the subsystems. The external heat flow simulation temperature control system of the tracking switch keeps the temperature of a control point between the upper limit and the lower limit of a temperature threshold value on the premise of preferentially ensuring the temperature uniformity of the control point.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
FIG. 1 is a schematic diagram of a method for simulating temperature control of heat flow outside a tracking switch for a spacecraft tank on the ground for vacuum thermal test according to the present invention;
FIG. 2 is a flow chart of the simulation temperature control process of heat flow outside the tracking switch for the vacuum thermal test of the spacecraft tank on the ground.
Detailed Description
The technical scheme of the invention is clearly and completely described below with reference to the accompanying drawings and the detailed description.
The invention discloses a method for simulating and controlling the temperature of heat flow outside a tracking switch for a spacecraft storage tank to perform a vacuum thermal test on the ground, which aims to solve the problems of poor temperature control uniformity and easy overshoot in the prior art and concretely refers to the following embodiments.
Examples
The schematic diagram of the method for simulating temperature control of heat flow outside the tracking switch for the spacecraft storage tank to perform the vacuum thermal test on the ground is shown in figure 1, and the method comprises the following steps:
step S11: the spacecraft storage box is partitioned, the spacecraft storage box comprises an oxygen box and a fuel box, a main temperature control loop and a standby temperature control loop are respectively arranged in each partition, the temperature control interval is set to be [ 19-21 ℃, and the upper limit and the lower limit of a control temperature threshold are respectively 19 ℃ and 21 ℃.
Step S12: and calculating to obtain the target value of the working current of the infrared heating cage to be 0.238A according to the resistance value of the temperature control heating loop and the bearable voltage.
Step S13: and adjusting the corresponding current value output by the programmable power supply according to the working current of the infrared heating cage calculated in the step S12.
Step S14: the program control power supply drives an external heat flow simulation heating system formed by the infrared heating cage to apply corresponding heat flows to 2 main control temperature loops of the spacecraft storage tank.
Step S15: the surface temperature of the storage tank of the spacecraft is changed by heating, so that the resistance values of the 4 temperature-measuring thermistors fixed on the surface of the storage tank of the spacecraft are changed.
Step S16: the data acquisition instrument acquires the resistance value of the thermistor of the temperature sensor and converts the analog quantity into the digital quantity of the temperature to be provided to the temperature control algorithm program of the tracking switch.
The invention discloses a temperature control method of a tracking switch outer heat flow simulation system for a spacecraft storage tank to carry out a vacuum thermal test on the ground, which adopts a temperature difference segmented control method to carry out difference on the highest value TKmax and the lowest value TKmin of a collected storage tank surface temperature measuring point, correspondingly controls a heating circuit infrared cage by judging the range of the difference value, and the temperature control method is shown in figure 2.
Referring to fig. 2, a flow chart of a heat flow simulation temperature control algorithm outside the tracking switch in the control area is shown, which comprises the following steps:
step S21: setting the upper limit and the lower limit of the final temperature control threshold range as 19 ℃ and 21 ℃ respectively; when the highest value TKmax of the temperature measuring point is set to be less than 19 ℃, the programmable power supply is driven to heat according to the step S12 starting current 0.238A, and when the lowest value TKmin of the temperature measuring point is greater than 21 ℃, the programmable power supply is powered off and cooled; when the temperature measuring point 19 ℃ is less than or equal to TKmax and the TKmin is less than or equal to 21 ℃, the temperature difference TKmax-TKmin is set to be less than or equal to 4 ℃, temperature control is performed according to a traditional switch control mode, the temperature difference TKmax-TKmin is greater than 4 ℃, a tracking switch external thermal current simulation temperature control program is executed, a heating loop corresponding to TKmin is set to be normally on, namely the programmable power supply is driven to heat according to the starting current 0.238A, the heating loop corresponding to TKmax is set to be normally off, namely the programmable power supply is powered off, and the output current is 0.
Step S22: the thermistor collects the temperatures of 4 temperature measuring points in two control areas on the surface of the storage tank.
Step S23: in each 12s control period, judging by a program to obtain the highest temperature value TKmax of 4 temperature measuring points on the surface of the storage tank to be 21.5 ℃;
step S24: in each 12s control period, the lowest temperature TKmin of 4 temperature measuring points on the surface of the storage tank is judged to be 17 ℃ by the program.
Step S25: calculating the difference between the highest value and the lowest value of the temperature measuring point, wherein the temperature is 21.5-17 ℃ and 4.5 ℃.
Step S26: and according to the preset target temperature difference control interval in the step S22, judging the temperature difference to be in the temperature interval of 21.5-17 ℃ to 4.5 ℃ and more than 4 ℃, and executing the external heat flow simulation temperature control program of the tracking switch.
Step S27: according to the preset external heat flow simulation temperature control program of the tracking switch in the step S22, the highest temperature value TKmax of the temperature measuring point is 21.5 ℃, the starting current of the programmable power supply is 0.238A; and the lowest temperature value TKmin of the temperature measuring point is equal to the control loop of the subarea where the temperature is 17 ℃, and the starting current of the programmable power supply is 0.
Step S28: the programmable power supply outputs current according to the instruction to drive the film heater of the temperature control loop.
Step S29: the thin film heater releases the heat flow, so that the surface temperature of the storage tank changes according to the change of the heat flow.
Step S210: and the thermistor of the temperature sensor collects 4 temperature measuring points of two subareas on the surface of the storage tank again, stores the temperature and current data of the period, provides the temperature data of the next period for the external heat flow simulation temperature control algorithm program of the tracking switch, and recovers the corresponding heating loop to normal temperature control when the temperature difference is not more than 1 ℃ (TKmax-TKmin is not more than 1 ℃) and repeatedly detects and controls the circulation.
Compared with the existing temperature control method, the invention has the following characteristics and beneficial technical effects:
(1) the invention provides a temperature control method of a tracking switch external heat flow simulation temperature control system for a spacecraft storage tank to carry out a vacuum thermal test on the ground, which sets the heating loops of the highest value TKmax and the lowest value TKmin of temperature reference points as 'normally on' and 'normally off', monitors and compares the temperature difference of the two reference points in real time, and when the temperature difference is not more than 1 ℃ (TKmax-TKmin is not more than 1 ℃), the corresponding heating loops recover to normal temperature control, and repeatedly detects and controls the circulation. The method solves the problem of poor uniformity of the traditional switch external heat flow simulation temperature control method, and preferentially ensures the uniformity of the temperature of the control point.
(2) The invention provides a temperature control method of a tracking switch external heat flow simulation temperature control system for a spacecraft storage tank to carry out a vacuum thermal test on the ground, which establishes a sampling judgment function of a temperature control program to enable the precision of the temperature control system to reach +/-0.5 ℃, and effectively solves the problem of low temperature control precision of the traditional switch external heat flow simulation temperature control method.
(3) The invention provides a temperature control method of a tracking switch external heat flow simulation temperature control system for a spacecraft storage tank to carry out a vacuum thermal test on the ground, which can immediately acquire a starting current value under the conditions of normally on and normally off to drive a program control power supply when the simulated temperature control condition of the tracking switch is met, can improve the temperature control speed of the system during starting, and enables the temperature rising and falling rate to meet certain requirements, so that the temperature control method has the capability of quickly rising and falling the temperature.
(4) The invention provides a temperature control method of a tracking switch external heat flow simulation temperature control system for a spacecraft storage tank to carry out a vacuum thermal test on the ground, when the temperature of any one temperature reference point is less than or equal to 8 ℃ or more than or equal to 35 ℃, or the absolute value of the temperature difference between any two temperature reference points is more than or equal to 8 ℃, the system can give an error-reporting prompt and quit the tracking temperature control program in time, so that the temperature control system has an intelligent monitoring function and can carry out real-time acquisition, reading, storage and calling of temperature values.
Claims (4)
1. The method for simulating temperature control of heat flow outside a tracking switch for the ground vacuum thermal test of a spacecraft storage box comprises the following steps:
carrying out subarea monitoring on the surface temperature of each spacecraft storage box by using a thermistor, and arranging a main thermistor and a backup thermistor in the same area, wherein each thermistor corresponds to a temperature measuring point;
collecting the temperature of a master thermistor as a tracking temperature reference point;
the control method of the corresponding heating loop in each subarea comprises the following steps:
a) in each 12s control period, firstly judging the highest value TKmax and the lowest value TKmin of the surface temperature reference point of the storage tank;
b) if the TKmax-TKmin is less than or equal to 4 ℃, controlling the temperature according to a traditional switch control mode;
c) if the TKmax-TKmin is more than 4 ℃, executing a tracking switch external heat flow simulation temperature control program, setting the main heating loop and the backup heating loop of the temperature control loop corresponding to the TKmin to be normally-on, setting the main heating loop and the backup heating loop of the temperature control loop corresponding to the TKmax to be normally-off, driving the program control power supply to supply power to the infrared heating cage by preset current target values of normally-on and normally-off, and controlling the surface temperature of the storage tank;
d) comparing the temperature difference of two temperature reference points of the highest value TKmax and the lowest value TKmin in real time, and when the temperature of TKmax-TKmin is less than or equal to 1 ℃, recovering the corresponding heating loop to the traditional switch control mode for controlling the temperature; during the period, other temperature control points control the temperature according to the traditional switch control mode;
e) when the temperature of any temperature reference point is less than or equal to 8 ℃ or more than or equal to 35 ℃, sending out an error-reporting prompt, and if a tracking temperature control program is executed, exiting the program and recovering to a traditional switch control mode to control the temperature;
f) when the absolute value of the temperature difference between any two temperature reference points is more than or equal to 8 ℃, an alarm is given.
2. The method as claimed in claim 1, wherein the temperature difference between the highest value TKmax and the lowest value TKmin of the two temperature reference points is monitored and compared in real time, and when TKmax-TKmin is less than or equal to 1 ℃, the corresponding heating loop is restored to the traditional switch control mode for temperature control; and then continuously monitoring the temperature value of each reference point in real time, and starting a new round of simulation temperature control process of heat flow outside the tracking switch when the TKmax-TKmin is more than 4 ℃, so as to preferentially ensure the uniformity of the temperature of the control points.
3. The method according to any one of claims 1-2, wherein the simulated temperature control method of the heat flow outside the tracking switch enables the simulated temperature control accuracy of the heat flow outside the storage tank to be +/-0.5 ℃.
4. The method of any one of claims 1-2, wherein the highest value TKmax and the lowest value TKmin of the reference point of the surface temperature of the storage tank are obtained by monitoring, the highest value TKmax and the lowest value TKmin are obtained by subtracting the two values to obtain a temperature difference, and the temperature difference is taken as a mark value, and the vacuum thermal test of the actual on-track state of the external heat flow of the storage tank is established by adopting two external heat flow simulation temperature control methods in two stages; if the TKmax-TKmin is less than or equal to 4 ℃, controlling the temperature according to a traditional switch control mode; if the TKmax-TKmin is more than 4 ℃, executing a tracking switch external heat flow simulation temperature control program, setting a heating loop corresponding to the TKmin to be normally on, namely driving the programmable power supply to heat the infrared cage according to a starting current preset by the program, and setting the heating loop corresponding to the TKmax to be normally off, namely driving the programmable power supply according to a current value preset by the program, and powering off or reducing the temperature of the infrared cage; and establishing a sampling judgment function of a corresponding temperature control program, and obtaining a corresponding current value to drive the program control power supply so as to control the surface temperature of the storage tank.
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| CN112181023B (en) * | 2020-10-22 | 2021-09-24 | 上海卫星工程研究所 | High-reliability autonomous temperature control method and system for temperature consistency of different areas |
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