CN110196343A - Probe assembly and its probe structure - Google Patents
Probe assembly and its probe structure Download PDFInfo
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- CN110196343A CN110196343A CN201810159408.1A CN201810159408A CN110196343A CN 110196343 A CN110196343 A CN 110196343A CN 201810159408 A CN201810159408 A CN 201810159408A CN 110196343 A CN110196343 A CN 110196343A
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- interconnecting piece
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- Measuring Leads Or Probes (AREA)
Abstract
The present invention discloses a kind of probe assembly and its probe structure.Probe structure includes one first base portion, one second base portion, an interconnecting piece and a contact portion.First base portion includes that one first contact-segment and one are connected to the first linkage section of the first contact-segment.First contact-segment is connected to the first side of the first butting section with one first butting section and one.Second base portion includes one second contact-segment, one second linkage section and one is electrically connected at passive device between the second contact-segment and the second linkage section.Second contact-segment is connected to the second side of the second butting section with one second butting section and one.First linkage section of the first base portion and the second linkage section of the second base portion are connected to interconnecting piece.Contact portion is connected to interconnecting piece.Whereby, the present invention can improve Power Integrity by the setting of passive device.
Description
Technical field
The present invention relates to a kind of probe assembly and its probe structure more particularly to a kind of probes applied to wafer probe cards
Component and its probe structure.
Background technique
Firstly, probe is mainly welded on printing electricity by the cantalever type probe card of the prior art one by one by artificial mode
On the plate of road, meanwhile, probe is fixed by an adhesion (such as epoxy resin).For example, " probe disclosed in TW I447397
Card " Patent Case, probe 33 are to be fixed on circuit board 34 using the holding parts 36 for including epoxy resin.
But it is above-mentioned in the prior art, after epoxy cure, cantalever type probe card can be made to become not easy to repair.
In other words, when a wherein tissue damage, the cantalever type probe card of the prior art and the spy that can not individually replace the damage
Needle, it is necessary to replace whole group cantalever type probe card.
Furthermore the bonding wire mode of the cantalever type probe card of the prior art, need be by intensive wire rod to be fanned out to
(Fan-out) technique, and because artificial bonding wire need more wide space, so transmission path is longer.Therefore, it will lead to signal biography
Defeated inferior quality.Further, the probe line footpath of the cantalever type probe card of the prior art is wider, therefore in addition to lateral row in wiring
Except column, still have to carry out vertical stack.But more than the needle number or when spacing is small, the degree of difficulty that will lead to probe arrangement increases.
Furthermore, it is understood that existing cantalever type probe card structure, transmission path is too long, and impedance is unable to control, transmission quality
It is more bad.Meanwhile power supply signal can be because transmission path be too long, and probe cross section product is narrow, inductance characteristic will be such that power supply hinders
It is anti-to rise with frequency, it causes voltage to decline and makes test yield bad.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of probe assembly and its spy in view of the deficiencies of the prior art
Needle construction can effectively improve cantalever type probe characteristic not easy to repair, meanwhile, can improve transmission quality and reduce maintenance at
This.Meanwhile the influence of inductance in the transmission path of probe structure can be reduced.
In order to solve the above technical problems, a wherein technical solution of the present invention is to provide a kind of probe knot
Structure comprising one first base portion, one second base portion, an interconnecting piece and a contact portion.First base portion connects including one first
Touching section and one be connected to first contact-segment the first linkage section, wherein first contact-segment have one first against
Portion and one be connected to first butting section the first side.Second base portion includes one second contact-segment, one second company
It connects section and one is electrically connected at passive device between second contact-segment and second linkage section, wherein described
Two contact-segments are connected to the second side of second butting section with one second butting section and one.The institute of first base portion
Second linkage section for stating the first linkage section and second base portion is connected to the interconnecting piece.The contact portion is connected to
The interconnecting piece.
Further, the cross section of first linkage section perpendicular to first linkage section extending direction, it is described
The cross section of second linkage section is perpendicular to the extending direction of second linkage section, and the cross section of the interconnecting piece is perpendicular to described
The extending direction of interconnecting piece, wherein the shape of the cross section of first linkage section is described transversal with the interconnecting piece
The shape in face is different each other, and the cross section of the shape of the cross section of second linkage section and the interconnecting piece
Shape is different each other.
Further, the area of the cross section of first linkage section is greater than the cross section of the interconnecting piece
Area, and the area of the cross section of second linkage section be greater than the interconnecting piece the cross section area.
Further, the probe structure is a cantilever probe structure.
Further, the extending direction of first contact-segment is different each other with the extending direction of the interconnecting piece, and
The extending direction of second contact-segment is different each other with the extending direction of the interconnecting piece.
Further, first butting section and second butting section can be connected to a top of one first plate body respectively
Support.
Further, first linkage section and second linkage section are respectively a column structure, the interconnecting piece
For a laminated structure, and the column structure is different from the shape of the laminated structure.
Further, first contact-segment, first linkage section, second contact-segment and second connection
Mono- first direction of Duan Chaoxiang extends, and the interconnecting piece extends towards a second direction, and the first direction and the second party
It is different to each other.
Further, the passive device is a capacitor.
An other technical solution of the present invention is to provide a kind of probe assembly comprising a substrate, one first plate
Body and a probe structure.The substrate has multiple conductive structures.First plate body has multiple first perforations and more
A supporting part, each described supporting part have one adjacent to corresponding first perforation, each described first perforation
First aperture.The probe structure includes one first base portion, one second base portion, an interconnecting piece and a contact portion, wherein described
First base portion includes one first contact-segment and one is connected to the first linkage section of first contact-segment, first contact-segment
The first side of first butting section is connected to one first butting section and one, wherein second base portion includes one
Second contact-segment, one second linkage section and one are electrically connected at the quilt between second contact-segment and second linkage section
Dynamic element, second contact-segment are connected to the second side of second butting section with one second butting section and one,
In, first linkage section of first base portion and second linkage section of second base portion are connected to the connection
Portion, wherein the contact portion is connected to the interconnecting piece.Wherein, a maximum outside diameter of first contact-segment is less than described the
First aperture of one perforation, and a maximum outside diameter of second contact-segment is less than first hole of first perforation
Diameter, so that first contact-segment and second contact-segment can pass through first perforation.Wherein, the first contact-segment electricity
Property be connected to one of them in multiple conductive structures, and second contact-segment is electrically connected at multiple conductive knots
Another in structure.Wherein, first butting section and second butting section are connected to respectively described in corresponding two
Supporting part.
Further, the probe assembly still further comprises one second plate body, and second plate body has multiple the
Two perforations, second plate body are in substantially parallel relationship to first plate body, and the position of multiple second perforations corresponds respectively to more
The position of a first perforation, and each described second perforation has one second aperture.
Further, the probe assembly still further comprises a fixing piece, the fixing piece setting the substrate,
On first plate body and second plate body so that first butting section of the probe structure and described second against
Portion is connected to corresponding two supporting parts respectively.
A wherein beneficial effect of the invention is, probe assembly and its probe structure provided by the embodiment of the present invention,
It can utilize, and " second base portion includes one second contact-segment, one second linkage section and one is electrically connected at described second and connects
The technical solution of passive device between touching section and second linkage section ", and reduce inductance in the transmission path of probe structure
Influence.
Be further understood that feature and technology contents of the invention to be enabled, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, however provided attached drawing is merely provided for reference and description, is not intended to limit the present invention.
Detailed description of the invention
Fig. 1 is a wherein stereoscopic schematic diagram for the probe structure of first embodiment of the invention.
Fig. 2 is an other stereoscopic schematic diagram for the probe structure of first embodiment of the invention.
Fig. 3 is the schematic side view of the probe structure of first embodiment of the invention.
Fig. 4 is the schematic top plan view of the probe structure of first embodiment of the invention.
Fig. 5 is the side elevational cross-section schematic diagram of the V-V hatching line of Fig. 1.
Fig. 6 is the side elevational cross-section schematic diagram of the VI-VI hatching line of Fig. 1.
Fig. 7 is the side elevational cross-section schematic diagram of the VII-VII hatching line of Fig. 1.
Fig. 8 is the schematic side view of an other embodiment for the probe structure of first embodiment of the invention.
Fig. 9 is the schematic side view of the other another embodiment of the probe structure of first embodiment of the invention.
Figure 10 is the wherein one side schematic view of the probe assembly of second embodiment of the invention.
Figure 11 is that the other side of the probe assembly of second embodiment of the invention regards schematic diagram.
Figure 12 is the other another schematic side view of the probe assembly of second embodiment of the invention.
Figure 13 is the stereoscopic schematic diagram of the another embodiment of the probe structure of the embodiment of the present invention.
Figure 14 is the use state diagram of the probe structure of the embodiment of the present invention.
Specific embodiment
It is to illustrate presently disclosed related " probe assembly and its probe knot by particular specific embodiment below
The embodiment of structure ", those skilled in the art can understand advantages of the present invention and effect by content disclosed in this specification.This
Invention can be implemented or be applied by other different specific embodiments, and the various details in this specification may be based on difference
Viewpoint and application carry out various modifications and change without departing from the spirit of the present invention.In addition, attached drawing of the invention is only simple
It is schematically illustrate, not according to the description of actual size, stated.The following embodiments and the accompanying drawings will be explained in further detail of the invention
The relevant technologies content, but the technical scope that disclosure of that is not intended to limit the invention.
It should be understood that although various elements or signal etc. may be described using term first, second, third, etc. herein,
But these elements or signal should not be limited by these terms.These terms are to distinguish an element and another element, Huo Zheyi
Signal and another signal.In addition, as used herein, term "or" may include depending on actual conditions and associated list project
Any of or multiple all combinations.
First embodiment
Firstly, shown in please referring to Fig.1 to Fig.4, and simultaneously refering to fig. 1 shown in 2, Fig. 1 and Fig. 2 are respectively that the present invention first is real
The stereoscopic schematic diagram of a probe structure is applied, Fig. 3 is the schematic side view of first embodiment of the invention probe structure, and Fig. 4 is this hair
The schematic top plan view of the probe structure of bright first embodiment, Figure 12 are the side view signal of the probe assembly of second embodiment of the invention
Figure.The present invention provides a kind of probe assembly M and its probe structure 1, and first embodiment will first introduce the master of probe structure 1 of the present invention
Technical characteristic is wanted, row introduces probe assembly M to second embodiment again.
Hold above-mentioned, please continue to refer to shown in Fig. 1 to Fig. 4, probe structure 1 may include one first base portion 11, one second base portion
12, an interconnecting piece 13 and a contact portion 14.First base portion 11 may include that one first contact-segment 111 and one are connected to first and connect
Touch the first linkage section 112 of section 111.Second base portion 12 may include one second contact-segment 121, one second linkage section 122 and one
The passive device C being electrically connected between the second contact-segment 121 and the second linkage section 122.First linkage section of the first base portion 11
112 and second second linkage section 122 of base portion 12 may connect to interconnecting piece 13.In addition, contact portion 14 may connect to interconnecting piece
13.Preferably, the distance between the second base portion 12 and contact portion 14 are compared to the distance between the first base portion 11 and contact portion 14
It is closer.Furthermore, it is understood that probe structure 1 is a cantilever probe structure 1 for the embodiment of the present invention.
Hold it is above-mentioned, please continue to refer to shown in Fig. 1 and Fig. 2, the first contact-segment 111 can have one first butting section 1111 and
One is connected to the first side 1112 of the first butting section 1111.Second contact-segment 121 can have one second butting section 1211 and
One is connected to the second side 1212 of the second butting section 1211, and contact portion 14 can have a contact side 141.With of the invention real
For applying example, the first contact-segment 111 and the second contact-segment 121 can be the backshank of probe structure 1, with the interface panel that is used for and transfers
The contact jaw (such as conductive structure 21 of Figure 12) of (such as substrate 2 of Figure 12) connects.In addition, the contact portion 14 of probe structure 1
Contact side 141 can in tip it is needle-shaped, to scratch the oxide layer of the tin ball surface of determinand, however, in other embodiments
In, the contact side 141 of probe structure 1 can also be a flat surface, and invention is not limited thereto.
Then, please continue to refer to shown in Fig. 1 to Fig. 3, it is preferable that for the embodiment of the present invention, passive device C can be one
Capacitor, for example, passive device C can be multilayer ceramic capacitor or film flat pattern plate capacitor, so the present invention not as
Limit.In addition, using MEMS (Microelectromechanical Systems, MEMS) technology by passive device C
It is embedded between the second contact-segment 121 of the second base portion 12 and the second linkage section 122.Furthermore, it is understood that the first base portion 11 and second
Base portion 12 can be respectively used to receive different signals, by 14 feed-in determinand of contact portion.Whereby, pass through passive device
The resonance point of C can be used to the source impedance for adjusting different frequency, and the voltage of power supply signal is avoided to decline.For example, work as distance
More in short-term, the inductance in path is then smaller for the transmission path of determinand, therefore the lesser capacitor of capacitance can be used, and corresponding
Resonance point can suppress the source impedance of higher frequency band in the position of higher frequency band, finally can be applied to the test of higher frequency band
Scheme, to meet tomorrow requirement.Meanwhile by the setting of passive device C, power supply needed for offer determinand that can be nearest is kept away
Exempt from the interference of inductance in path, to improve Power Integrity (power integrity, PI).
Hold it is above-mentioned, please continue to refer to shown in Fig. 1 to Fig. 3, the extending direction (Z-direction) and contact portion of the first contact-segment 111
14 extending direction (negative Z direction) is different each other, and the extending direction (Z-direction) of the second contact-segment 121 is also (negative with contact portion 14
Z-direction) extending direction it is different each other.In addition, for example, as shown in figure 3, the extending direction of the first contact-segment 111 with connect
The extending direction of contact portion 14 is substantially opposite and is parallel to each other, meanwhile, the second extending direction of contact-segment 121 and prolonging for contact portion 14
It is substantially opposite and be parallel to each other to stretch direction.That is, the first contact-segment 111, the first linkage section 112, the second contact-segment 121 and
Second linkage section 122 can extend towards a first direction (Z-direction), and interconnecting piece 13 can extend towards a second direction (X-direction),
First direction is different each other with second direction, and with the embodiment of the present invention for, first direction can be generally perpendicular to second direction.
In addition, contact portion 14 can extend towards a third direction (negative Z direction), third direction can be different each other with second direction and with this
For inventive embodiments, third direction can be generally perpendicular to second direction.
Then, also referring to shown in Fig. 5 to Fig. 7, Fig. 5 is the side elevational cross-section schematic diagram of the V-V hatching line of Fig. 1, and Fig. 6 is figure
The side elevational cross-section schematic diagram of 1 VI-VI hatching line, Fig. 7 are the side elevational cross-section schematic diagram of the VII-VII hatching line of Fig. 1.With of the invention real
For applying example, extending direction of the cross section of the first linkage section 112 perpendicular to the first linkage section 112, the cross of the second linkage section 122
Extending direction of the section perpendicular to the second linkage section 122, the extending direction of the cross section of interconnecting piece 13 perpendicular to interconnecting piece 13.Into
For one step, the shape of the cross section of the first linkage section 112 is different each other with the shape of the cross section of interconnecting piece 13, and second connects
The shape for connecing the cross section of section 122 is different each other with the shape of the cross section of interconnecting piece 13.Preferably, first linkage section 112
The area of cross section can be greater than the area of the cross section of interconnecting piece 13, and the area of the cross section of the second linkage section 122 can be greater than
The area of the cross section of interconnecting piece 13.
Further, please continue to refer to shown in Fig. 5 to Fig. 7, it is preferable that the first linkage section 112 and the second linkage section 122
Cross-sectional shape can be in a rectangular-shaped external form (for example, the first linkage section 112 and the second linkage section 122 are respectively a column knot
Structure), in addition, the cross-sectional shape of interconnecting piece 13 and/or contact portion 14 can in the form of sheets (it is laminar rectangular-shaped, for example, interconnecting piece
13 be a laminated structure) external form, in addition, column structure is different from the shape of laminated structure.More specifically, with the present invention
For embodiment, probe structure 1 is preferably with MEMS (Microelectromechanical Systems, MEMS) skill
Probe manufactured by art.In other words, the rectangular-shaped probe structure 1 of the present embodiment compared to circular probe for, the two
Manufacturing process is completely different.
Hold above-mentioned, please continue to refer to shown in Fig. 1 and Fig. 2, the first linkage section 112 of the first base portion 11 is connected to interconnecting piece
13, the second linkage section 122 of the second base portion 12 is connected to interconnecting piece 13, so that the first linkage section 112 can be relative to interconnecting piece
13 form one first exposed surface 1121, and the second linkage section 122 is enabled to form one second exposed table relative to interconnecting piece 13
Face 1221.That is, since the cross-sectional shape of the first linkage section 112 and the cross-sectional shape of the second linkage section 122 can be with
The cross-sectional shape of interconnecting piece 13 dimensionally has completely different characteristic, therefore, the first linkage section 112 and the second linkage section
122, which can be respectively relative to interconnecting piece 13, forms one first exposed surface 1121 and the second exposed surface 1221.Whereby, the first connection
There can be a segment difference between section 112 and interconnecting piece 13, and there can be a segment difference between the second linkage section 122 and interconnecting piece 13, and
So that the first linkage section 112 and the second linkage section 122 are in discrete setting in overall structure relative to interconnecting piece 13.More into
For one step, junction between the first linkage section 112 and interconnecting piece 13 is a turning point, and the turning point can have it is one first naked
Reveal surface 1121.In addition, the junction between the second linkage section 122 and interconnecting piece 13 is a turning point, and the turning point can have
One second exposed surface 1221.
Hold above-mentioned, please continue to refer to shown in Fig. 7, on any cross section of interconnecting piece 13, interconnecting piece 13 can have one
A side (unlabeled in figure) and a second side (unlabeled in figure), first side can have one first width F1, second side
Side can have one second width F2, and the size of the first width F1 is smaller than the size of the second width F2.That is, laminated structure can have
One first width F1 and one second width F2, and the size of the first width F1 is less than the size of the second width F2.Preferably, first
The ratio of width F1 and the second width F2 can be between 0.2 to 0.5, for example, the first width F1 can be 0.1 millimeter
(millimeter, mm), the second width F2 can be between 2 millimeters to 5 millimeters, and so invention is not limited thereto.Furthermore, it is understood that
Since the direction of the stress of contact portion 14 is Z-direction, it is (negative that the length direction (extending direction) of second side is directed towards third direction
Z-direction), and interconnecting piece 13 is that the first linkage section 112 and the second linkage section 122 are contacted with the first side of smaller size, because
This, although the size of the first width F1 less than the size of the second width F2, remains to maintain the contact side 141 of contact portion 14 to abut
Strength on the test object.
Then, please continue to refer to shown in Fig. 1 and Fig. 2, although the first butting section 1111 of the first contact-segment 111 in attached drawing
And second contact-segment 121 the second butting section 1211 be using the external form of inversed hook like as explanation, still, in other embodiments
In, the external form of the first butting section 1111 and the second butting section 1211 can also be concave, system that invention is not limited thereto.Furthermore
In other embodiments, multiple first butting sections 1111 and/or the second butting section 1211 also be can have on probe structure 1,
Invention is not limited thereto.
Then, it please refers to shown in Fig. 8 and Fig. 9, Fig. 8 and Fig. 9 are respectively its of the probe structure of first embodiment of the invention
The schematic side view of his embodiment.Specifically, in other embodiments, the also shape of adjustable probe structure 1 is lifted
For example, for the embodiment of Fig. 8 and Fig. 9, the interconnecting piece 13 of probe structure 1 and the external form of contact portion 14 can adjust, with
Suitable on different determinands, it should be noted that, the present invention is not limited with the external form of interconnecting piece 13 and contact portion 14.
Second embodiment
Firstly, please referring to shown in Figure 10 to Figure 12, Figure 10 to Figure 12 is respectively the probe assembly M of second embodiment of the invention
Assembling process schematic side view.It should be specified, in order to facilitate understanding present embodiment, so spy is only presented in attached drawing
The local structure of needle assemblies M, in order to which each element construction and connection relationship of probe assembly M is clearly presented.It will divide below
The each element construction and its connection relationship of probe assembly M are not introduced.In other words, for the benefit of understanding of attached drawing, Figure 10 to figure
Piece probe structure 1 of only presentation in 12.In addition, in probe structure 1 and previous embodiment provided by a second embodiment
Structure it is similar, details are not described herein.Therefore, when refering to fig. 10 to content shown in Figure 12, also referring again to Fig. 1 to Fig. 2
It is shown.
Hold above-mentioned, please continue to refer to shown in Figure 10, second embodiment of the invention provides a kind of probe assembly M comprising one
Substrate 2, one first plate body 3 and a probe structure 1.Substrate 2 can have multiple conductive structures 21, for example, substrate 2 can be with
For the switching interface panel or space convertor (Space Transformer, ST) of wafer sort.In addition, in other embodiment party
In formula, substrate 2 or printed circuit board, that is to say, that since probe structure 1 can be made with micro electro mechanical system (MEMS) technology
Make, and make size smaller, therefore, installation space converter can not had to, but probe structure 1 is made to be set up directly on printing
On circuit board, whereby, probe structure 1 can be electrically connected at the conductive structure 21 of printed circuit board.
Hold above-mentioned, please continue to refer to shown in Figure 10, the first plate body 3 can have multiple first perforations 31 and multiple supporting parts
32, each supporting part 32 can be respectively adjacent in corresponding first perforation 31, each first perforation 31 has one first hole
Diameter H1.Furthermore it is preferred that probe assembly M may also include one second plate body 4, and the second plate body 4 can for the embodiment of the present invention
With multiple second perforations 41.For example, the second plate body 4 may be generally parallel to the setting of the first plate body 3, multiple second perforations 41
Position correspond respectively to the positions of multiple first perforations 31, and each second perforation 41 has one second aperture H2.
Hold above-mentioned, please continue to refer to shown in Figure 10, and also referring to shown in Fig. 1 and Fig. 2, probe structure 1 may include one
First base portion 11, one second base portion 12, an interconnecting piece 13 and a contact portion 14.First base portion 11 may include one first contact-segment
111 and one be connected to the first contact-segment 111 the first linkage section 112.Second base portion 12 may include one second contact-segment 121,
One second linkage section 122 and one it is electrically connected at passive device C between the second contact-segment 121 and the second linkage section 122.The
First linkage section 112 of one base portion 11 and the second linkage section 122 of the second base portion 12 may connect to interconnecting piece 13.Contact portion 14
It may connect to interconnecting piece 13.In addition, the first contact-segment 111 can have one first butting section 1111 and one be connected to first against
First side 1112 in portion 1111.Second contact-segment 121 can have one second butting section 1211 and one be connected to second against
Second side 1212 in portion 1211, and contact portion 14 can have a contact side 141.It should be noted that institute in second embodiment
The probe structure 1 of offer and the structure in previous embodiment are similar, and details are not described herein.
Then, please continue to refer to shown in Figure 10, W1 cuns of a maximum outside diameter for the first contact-segment 111 is smaller than the first perforation 31
The first aperture H1 size, and the size of a maximum outside diameter W2 of the second contact-segment 121 is smaller than the first of the first perforation 31
The size of aperture H1, so that the first contact-segment 111 and the second contact-segment 121 can pass through the first perforation 31.In addition, the first contact-segment
A 111 maximum outside diameter W1 size is smaller than the size of the second aperture H2 of the second perforation 41, and the one of the second contact-segment 121 is most
Big outer diameter W2 size is smaller than the size of the second aperture H2 of the second perforation 41, so that the first contact-segment 111 and the second contact-segment
121 can pass through the second perforation 41.Furthermore the first contact-segment 111 can be electrically connected at one of them in multiple conductive structures 21,
And second contact-segment 121 can be electrically connected at another in multiple conductive structures 21.
Then, please refer to shown in Figure 11, user can by the relative position of mobile first plate body 3 and the second plate body 4, with
So that 4 mutual dislocation of the first plate body 3 and the second plate body.That is, can be mobile towards X-direction by the first plate body 3, and by the second plate body 4
Towards negative X-direction.Whereby, the first butting section 1111 and the second butting section 1211 of probe structure 1 can be connected to corresponding respectively
Supporting part 32, to achieve the effect that positioning probe structure 1.
Then, please refer to shown in Figure 12, probe assembly M preferably can also further comprise a fixing piece 5 (for example, Gu
A screw can be such as, but not limited to by determining part 5), fixing piece 5 may be provided on substrate 2, the first plate body 3 and the second plate body 4, with
The first butting section 1111 and the second butting section 1211 for making probe structure 1 are connected to corresponding supporting part 32 respectively.In other words
It says, fixing piece 5 can be used for the relative position of positioning probe structure 1 and substrate 2, the first plate body 3 and the second plate body 4.In addition, value
It must illustrate, since probe structure 1 is connected to relatively by the first butting section 1111 and the second butting section 1211 respectively
The supporting part 32 answered, so that probe structure 1 is positioned.Whereby, when wherein a probe structure 1 is damaged failure, can lead to
It crosses and moves the first plate body 3 and the second plate body 4 and be replaced the probe structure of failure 1.
It is worth noting that since the cross-sectional shape of the first linkage section 112 and the second linkage section 122 can be rectangular-shaped in one
External form, and the cross-sectional shape of interconnecting piece 13 can (laminar rectangular-shaped) in the form of sheets external form.Therefore, the second plate is being set
After body 4, making the first contact-segment 111, the first linkage section 112 (the first linkage section 112 of part or the first connection of whole
Section 112), the second contact-segment 121 and the second linkage section 122 (the second linkage section 122 of part or the second linkage section of whole
122) after being all embedded between the second plate body 4 and substrate 2, the first base portion that can be respectively provided with to avoid two probe structures 1
11 and the second interference between base portion 12.
Then, it please refers to shown in Figure 13 and Figure 14, Figure 13 is another embodiment party of the probe structure of the embodiment of the present invention
The stereoscopic schematic diagram of formula, Figure 14 are the use state diagram of the probe structure of the embodiment of the present invention.By Figure 13 compared with Fig. 1
It is found that the probe structure 1 of the probe structure 1 ' of Figure 13 and Fig. 1 it is maximum the difference is that: the probe structure 1 of Fig. 1 is primarily useful for
Power supply is provided, and the probe structure 1 ' of Figure 13 will can be used for providing signal.Therefore, the probe structure 1 ' of Figure 13 does not have the second base
Portion 12.In addition, it should be noted that, all similar with the probe structure of Fig. 11 except the second base portion of probe structure 1 ' 12 of Figure 13, tool
Details are not described herein for body details.
Hold above-mentioned, please continue to refer to shown in Figure 13 and Figure 14, Figure 14 is the top view of multiple probe structures (1,1 ').By scheming
Embodiment shown in 14 will be seen that probe structure (1,1 ') can be arranged according to the measurement Array Design of probe card, in addition, more
(for example, in multiple probe structures (1,1 ') at least within a probe structure (1,1 ') can have construction different each other
Two have different length).That is, the arrangement angle of each probe structure (1,1 ') can be adjusted according to demand.
In addition, the contact side 141 of probe structure (1,1 ') can be electrically connected at determinand contact N.
The beneficial effect of embodiment
A wherein beneficial effect of the invention is, probe assembly M and its probe structure provided by the embodiment of the present invention
1, it can utilize that " the second base portion 12 includes that one second contact-segment 121, one second linkage section 122 and one are electrically connected at second
The technical solution of passive device C " between contact-segment 121 and the second linkage section 122, and reduce in the transmission path of probe structure
The influence of inductance, to improve Power Integrity.
In addition, the embodiment of the present invention can also pass through " the first contact-segment 111 have one first butting section 1111 " and " the
Two contact-segments 121 have the technical solution of one second butting section 1211 ", and probe structure 1 can be allowed individually to substitute, to be formed
One replaceable probe structure 1, and reduce maintenance cost.Meanwhile compared to existing cantilever probe structure, moreover it is possible to shorten
The transmission path of existing cantalever type probe impedance discontinuity, and improve the signal integrity (Signal of transmission quality
Integrity, SI).
Furthermore the probe structure 1 as provided by the embodiment of the present invention is a cantilever probe structure 1, so needle
Point guides outward, it is possible to using the first different plate body 3 of multiple groups, the second plate body 4 and fixing piece 5 by probe structure
1 is fixed on substrate 2.Furthermore, it is understood that reducing thin space (fine pitch) using the probe structure 1 of different length
Processing difficulties degree.Further, since the cross-sectional shape of interconnecting piece 13 and/or contact portion 14 can in the form of sheets (laminar rectangular-shaped)
External form (the first linkage section 112 and the second linkage section 122 are a column structure, and interconnecting piece 13 is a laminated structure, and column knot
Structure is different from the shape of laminated structure), therefore, the demand of micro- spacing can be not only corresponded to, it is strong that required bracing force can also be provided
Degree.
Furthermore, it is understood that the first butting section 1111 and the second butting section 1211 of probe structure 1 can be connected to relatively respectively
Therefore probe structure 1 can be located on substrate 2 by the supporting part 32 for the first plate body 3 answered, so that the first of probe structure 1
Contact-segment 111 and the second contact-segment 121 are electrically connected at the conductive structure 21 on substrate 2.
Content disclosed above is only preferred possible embodiments of the invention, not thereby limits to right of the invention and wants
The protection scope of book is sought, so all equivalence techniques variations done with description of the invention and accompanying drawing content, are both contained in
In the protection scope of claims of the present invention.
Claims (12)
1. a kind of probe structure, which is characterized in that the probe structure includes:
One first base portion, first base portion include that one first contact-segment and one are connected to the first company of first contact-segment
Connect section, wherein first contact-segment is connected to the first side of first butting section with one first butting section and one；
One second base portion, second base portion are electrically connected at described including one second contact-segment, one second linkage section and one
Passive device between second contact-segment and second linkage section, wherein second contact-segment has one second butting section
And one be connected to second butting section the second side；
One interconnecting piece, second linkage section connection of first linkage section and second base portion of first base portion
In the interconnecting piece；And
One contact portion, the contact portion are connected to the interconnecting piece.
2. probe structure according to claim 1, which is characterized in that the cross section of first linkage section is perpendicular to described
The extending direction of first linkage section, extending direction of the cross section of second linkage section perpendicular to second linkage section, institute
State extending direction of the cross section perpendicular to the interconnecting piece of interconnecting piece, wherein the cross section of first linkage section
Shape is different each other with the shape of the cross section of the interconnecting piece, and the shape of the cross section of second linkage section
It is different each other with the shape of the cross section of the interconnecting piece.
3. probe structure according to claim 2, which is characterized in that the area of the cross section of first linkage section
Greater than the area of the cross section of the interconnecting piece, and the area of the cross section of second linkage section is greater than the company
The area of the cross section of socket part.
4. probe structure according to claim 1, which is characterized in that the probe structure is a cantilever probe structure.
5. probe structure according to claim 1, which is characterized in that the extending direction of first contact-segment and the company
The extending direction of socket part is different each other, and the extending direction of the extending direction of second contact-segment and interconnecting piece phase each other
It is different.
6. probe structure according to claim 1, which is characterized in that first butting section and second butting section energy
It is connected to a supporting part of one first plate body respectively.
7. probe structure according to claim 1, which is characterized in that first linkage section and second linkage section point
Not Wei a column structure, the interconnecting piece is a laminated structure, and the column structure is different from the shape of the laminated structure.
8. probe structure according to claim 1, which is characterized in that first contact-segment, first linkage section, institute
The second contact-segment and second linkage section to be stated to extend towards a first direction, the interconnecting piece extends towards a second direction,
And the first direction and the second direction are different each other.
9. probe structure according to claim 1, which is characterized in that the passive device is a capacitor.
10. a kind of probe assembly, which is characterized in that the probe assembly includes:
One substrate, the substrate have multiple conductive structures；
One first plate body, first plate body have multiple first perforations and multiple supporting parts, each described supporting part is adjacent
It is bordering on corresponding first perforation, each described first perforation has one first aperture；And
One probe structure, the probe structure include one first base portion, one second base portion, an interconnecting piece and a contact portion,
Described in the first base portion include that one first contact-segment and one are connected to the first linkage section of first contact-segment, described first
Contact-segment is connected to the first side of first butting section with one first butting section and one, wherein second base portion
Including one second contact-segment, one second linkage section and one be electrically connected at second contact-segment and second linkage section it
Between passive device, second contact-segment have one second butting section and one be connected to second butting section second side
End, wherein first linkage section of first base portion and second linkage section of second base portion are connected to institute
State interconnecting piece, wherein the contact portion is connected to the interconnecting piece；
Wherein, a maximum outside diameter of first contact-segment is less than first aperture of first perforation, and described second
One maximum outside diameter of contact-segment is less than first aperture of first perforation, so that first contact-segment and described second
Contact-segment can pass through first perforation；
Wherein, first contact-segment is electrically connected at one of them in multiple conductive structures, and second contact
Section is electrically connected at another in multiple conductive structures；
Wherein, first butting section and second butting section are connected to corresponding two supporting parts respectively.
11. probe assembly according to claim 10, which is characterized in that the probe assembly still further comprises one second
Plate body, second plate body have multiple second perforations, and second plate body is in substantially parallel relationship to first plate body, multiple described
The position of second perforation corresponds respectively to the position of multiple first perforations, and each described second perforation has one second
Aperture.
12. probe assembly according to claim 10, which is characterized in that it is fixed that the probe assembly still further comprises one
Part, the fixing piece is arranged on the substrate, first plate body and the second plate body, so that the probe structure is described
First butting section and second butting section are connected to corresponding two supporting parts respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810159408.1A CN110196343B (en) | 2018-02-26 | 2018-02-26 | Probe assembly and probe structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810159408.1A CN110196343B (en) | 2018-02-26 | 2018-02-26 | Probe assembly and probe structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110196343A true CN110196343A (en) | 2019-09-03 |
| CN110196343B CN110196343B (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810159408.1A Active CN110196343B (en) | 2018-02-26 | 2018-02-26 | Probe assembly and probe structure thereof |
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| Country | Link |
|---|---|
| CN (1) | CN110196343B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113376413A (en) * | 2020-03-10 | 2021-09-10 | 中华精测科技股份有限公司 | Vertical probe head and double-arm probe thereof |
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| CN1591812A (en) * | 2003-08-27 | 2005-03-09 | 日本电子材料株式会社 | Measuring head for measuring plug-in unit |
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| KR20090124028A (en) * | 2008-05-29 | 2009-12-03 | (주)티에스이 | Probe with extension portion and combination structure using the same |
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| US20130111635A1 (en) * | 2011-10-26 | 2013-05-02 | Samsung Electronics Co., Ltd. | Probe head scanning probe microscope including the same |
| CN203720216U (en) * | 2013-01-21 | 2014-07-16 | 旺矽科技股份有限公司 | Probe module |
| CN104049116A (en) * | 2013-03-15 | 2014-09-17 | 稳懋半导体股份有限公司 | Probe card, probe structure and manufacturing method thereof |
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|---|---|---|---|---|
| JPH08285888A (en) * | 1995-04-17 | 1996-11-01 | Hioki Ee Corp | Line probe provided to z-axis unit of x-y type in-circuit tester |
| US20030132769A1 (en) * | 1996-12-12 | 2003-07-17 | Boll Gregory G. | Probe card for high speed testing |
| CN1591812A (en) * | 2003-08-27 | 2005-03-09 | 日本电子材料株式会社 | Measuring head for measuring plug-in unit |
| WO2007129686A1 (en) * | 2006-05-08 | 2007-11-15 | Tokyo Electron Limited | Probe |
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| US20130111635A1 (en) * | 2011-10-26 | 2013-05-02 | Samsung Electronics Co., Ltd. | Probe head scanning probe microscope including the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113376413A (en) * | 2020-03-10 | 2021-09-10 | 中华精测科技股份有限公司 | Vertical probe head and double-arm probe thereof |
| CN113376413B (en) * | 2020-03-10 | 2023-12-19 | 台湾中华精测科技股份有限公司 | Vertical probe head and double-arm probe thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110196343B (en) | 2021-10-22 |
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