CN110195245A - Point plating appts and point plating production line - Google Patents
Point plating appts and point plating production line Download PDFInfo
- Publication number
- CN110195245A CN110195245A CN201910430969.5A CN201910430969A CN110195245A CN 110195245 A CN110195245 A CN 110195245A CN 201910430969 A CN201910430969 A CN 201910430969A CN 110195245 A CN110195245 A CN 110195245A
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- mould group
- material strip
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- 238000007747 plating Methods 0.000 title claims abstract description 162
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 53
- 239000000243 solution Substances 0.000 claims abstract description 45
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 238000002347 injection Methods 0.000 claims abstract description 13
- 239000007924 injection Substances 0.000 claims abstract description 13
- 238000004804 winding Methods 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims description 38
- 238000009413 insulation Methods 0.000 claims description 37
- 239000007921 spray Substances 0.000 claims description 31
- 238000009434 installation Methods 0.000 claims description 22
- 238000005096 rolling process Methods 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 10
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 8
- 229920002530 polyetherether ketone Polymers 0.000 claims description 8
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 7
- KACAUYDQOUENGF-UHFFFAOYSA-N [Ta].[Ru].[Ir] Chemical compound [Ta].[Ru].[Ir] KACAUYDQOUENGF-UHFFFAOYSA-N 0.000 claims description 4
- 238000007373 indentation Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 11
- 238000009713 electroplating Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 9
- 230000009471 action Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000002708 enhancing effect Effects 0.000 description 3
- 238000004880 explosion Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of plating appts and point plating production line, it is related to field of electroplating, including plating wheel, feed strip winding, and is rotated with material strip；Point plated electrode mould group carries out a plating to material strip injection plating solution；Sealing capping, seal point plated electrode mould group inject plating solution to plated electrode mould group；Rotating mechanism, supporting point plating wheel rotation.Point plating wheel wraps around material strip, as material strip constantly conveys, point plating wheel is under the support of rotating mechanism as material strip rotates together, material strip is limited in specific position to convey, simultaneously, sealing capping is sealed a plated electrode mould group, and plating solution constantly is injected to plated electrode mould group, puts plated electrode mould group in the case where plating action of hydraulic force, plating solution is accurately sprayed to the specific position of material strip and carries out a plating, point plating is more accurate, material is saved, the coating of extra injection is avoided the occurrence of, without secondary removal, process is reduced, entire point plating process is high-efficient.
Description
Technical field
The present invention relates to electroplating technologies, more specifically, it relates to a kind of plating appts and point plating production line.
Background technique
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique of the surface of metal or other materials product attachment layer of metal film is set to prevent metal oxygen to play using electrolysis
The effects of changing, improving wearability, electric conductivity, reflective, corrosion resistance and having improved aesthetic appearance.
When carrying out plating processing to electronic component, the electroplating device that the prior art uses is mostly bath trough, and workpiece is soaked
Enter and carry out whole plating in bath trough, this mode, which will cause unplated piece, can also be plated one layer of gold without the part of plating
Belong to, and the part of extra plating usually requires to cut off, or extra coating is ground off, and has both caused the waste of material in this way,
Manufacturing procedure is increased again, causes the increase of production cost.
Summary of the invention
In view of the deficiencies of the prior art, the present invention intends to provide a kind of plating appts and point plating production line,
Have the advantages that a plating is accurate, it is few, high-efficient to save material, process.
To achieve the above object, the present invention provides the following technical scheme that
In a first aspect, a kind of plating appts are provided, including
Point plating wheel, feed strip winding, and rotated with material strip；
Point plated electrode mould group carries out a plating to material strip injection plating solution；
Sealing capping, seal point plated electrode mould group inject plating solution to plated electrode mould group；
Rotating mechanism, supporting point plating wheel rotation, and motor mould group is plated for fixed point.
By adopting the above technical scheme, point plating wheel wraps around material strip, and as material strip constantly conveys, point plating wheel is in rotating mechanism
Support under rotate together with material strip, material strip is limited in specific position and is conveyed, simultaneously, sealing capping is to a plating
Electrode mould group is sealed, and constantly injects plating solution to plated electrode mould group, puts plated electrode mould group in the case where plating action of hydraulic force,
Plating solution is accurately sprayed to the specific position of material strip and carries out a plating, and point plating is more accurate, saves material, avoids the occurrence of extra injection
Coating reduce process without secondary removal, it is entire that put plating process high-efficient.
Further, described plated electrode mould group includes surrounding the insulation upper cover to form chamber, insulation lower cover,
Through-hole of the insulation upper cover setting for electroplate liquid indentation chamber；
The liquid outlet of interface setting and chamber that the insulation lower cover and the upper cover that insulate are affixed, the liquid outlet includes edge
The outwardly extending spray tank of interface；
The inner wall coated anode coating of the spray tank.
By adopting the above technical scheme, insulation upper cover and insulation lower cover surround to form chamber, and plating solution is pressed into chamber via through-hole,
The upper cover that insulate and insulation lower cover two parts split settings can be replaced respectively if one damages, and save replacement cost.Exhausted
Outwardly extending spray tank, spray tank and chamber is arranged in the interface of edge lower cover, when plating solution is pressed into chamber, passes through hydrojet
Slot sprays outward, is then sprayed on material strip by the accurate place of spray tank one by one, no longer needs to remove extra plating solution, saves plating
Liquid simultaneously reduces process, improves electroplating efficiency.In addition, leading for spray tank inner wall can be enhanced in the anodic coating of spray tank inner wall coating
Electrically, accelerate electronics flowing velocity, point plating attachment degree is high, rate is fast, more uniformly.
Further, the liquid storage groove being connected to liquid outlet is arranged in the insulation lower cover.
By adopting the above technical scheme, liquid storage groove is to lower recess, can be in liquid storage groove inner product when plating solution is pressed into chamber
It is poly-, to can guarantee there are enough plating solutions to spray out of spray tank in injection plating solution every time, guarantee the steady of plating solution the amount of injection
It is fixed, the plumpness and stability of enhancing point plating.
Further, the gear liquid piece that the insulation lower cover setting limitation electroplate liquid is flowed out to liquid outlet direction.
By adopting the above technical scheme, gear liquid piece water conservancy diversion plating solution flows to liquid outlet and is sprayed, and avoids plating solution to other directions
Outflow reduces plating solution waste, avoids the cleaning of extra plating solution.
Further, the insulation upper cover, insulation lower cover are made of PEEK material.
By adopting the above technical scheme, the PEEK material coefficient of expansion is low, is not easy deformation, can accomplish effectively to seal, facilitate
Plating solution is avoided to leak out from gap, in addition PEEK insulated with material coefficient is high, helps to reduce invalid plating.
Further, the anodic coating is ruthenium-iridium-tantalum.
By adopting the above technical scheme, there is excellent electric conductivity and corrosion resistance, service life is permanent, and electroplating effect is more preferable.
Further, the rotating mechanism includes support shaft, and the support shaft is arranged rolling bearing group, the rolling bearing group
Be arranged for installation point plating wheel mounting base, the mounting base include the axle sleeve being set in outside rolling bearing group and be located at axle sleeve
First installation position of the one end for tie point plating wheel, one end setting of the support shaft close to the first installation position are plated for fixed point
Second installation position of electrode mould group.
By adopting the above technical scheme, rolling bearing group is arranged between mounting base and support shaft to be rotatablely connected, frictional force
Small, material strip is easier to rotate when being wrapped on a plating wheel, conveys more stable.Mounting base is taken turns in the setting of one end of axle sleeve for a plating
The installation position of connection facilitates an installation and replacement for plating wheel.The second installation position is arranged close to one end of the first installation position in support shaft,
Second installation position is for fixing electroplated electrode mould group, then when carrying out plating, material strip is around point plating wheel, with the conveying of material strip,
Material strip applies frictional force to point plating wheel, and point plating wheel is fixed in the mounting base rotated centered on support shaft, and material strip then drives
Point plating wheel rotation, mounting base pivoting friction is small, facilitates plating wheel rotation, and put plated electrode mould group be connected to support shaft one end it is solid
Fixed motionless, after carrying out a plating to the specific position of material strip injection plating solution, point plating wheel rotation, material strip is fed forward to the next position,
Continue spray site plating, to realize continuously point plating injection, improves electroplating efficiency.
Further, the point plating wheel includes the wheel rim of feed strip winding and connect with wheel rim and be installed on rotating mechanism
Wheel seat.
By adopting the above technical scheme, wheel seat is installed on rotating mechanism and is rotated, so that wheel rim connected to it be supported to turn
Dynamic, wheel rim is especially provided for material strip winding, then when web feed, wheel rim can be driven to rotate together with wheel seat.
Further, the sealing element for preventing plating solution from revealing downwards is arranged in the wheel seat.
By adopting the above technical scheme, sealing element is set inside wheel seat, and avoiding plating solution from revealing downwards influences mounting base and support
Axis rotation.
Second aspect provides a kind of point plating production line, including puts plating appts as described above.
By adopting the above technical scheme, a plating is accurately carried out by plating appts, reduces wastage of material, and being not necessarily to will be more
Remaining coating removal, reduces process, improves electroplating efficiency.
It further, further include that material conveying is brought to the Dian Dufuliao mechanism of point plating appts.
By adopting the above technical scheme, material strip is accurately delivered to electroplanting device using Fu Liao mechanism and carries out exact position
Point plating, the accuracy and stability of enhancing point plating, further increases electroplating efficiency.
In conclusion the invention has the following advantages:
1. material strip, which is limited in exact position, to be electroplated, and the accurate of a plating is helped to improve by rotating mechanism and point plating wheel
Degree；
2. being sprayed outward by spray tank when plating solution is pressed into chamber, being then sprayed onto material strip by the accurate place of spray tank one by one
On, it no longer needs to remove extra plating solution, saves plating solution and reduce process, improve electroplating efficiency；
3. the electric conductivity of spray tank inner wall can be enhanced in the anodic coating of spray tank inner wall coating, accelerate electronics flowing velocity, point
It is fast, more uniform to plate attachment degree height, rate；
4. material strip to be accurately delivered to the point plating of electroplanting device progress exact position using Fu Liao mechanism, enhancing point plates accurate
Property and stability, further increase electroplating efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of midpoint plating appts of the present invention；
Fig. 2 is the perspective view of the explosion of midpoint plating appts of the present invention；
Fig. 3 is the perspective view of the explosion of rotating mechanism in the present invention；
Fig. 4 is the structural schematic diagram of plated electrode mould group in midpoint of the present invention；
Fig. 5 is the perspective view of the explosion of plated electrode mould group in midpoint of the present invention；
Fig. 6 is the enlarged diagram in the portion A in Fig. 5；
Fig. 7 is the structural schematic diagram that production line is plated at midpoint of the present invention；
Fig. 8 is the structural schematic diagram of midpoint Du Fuliao of the present invention mechanism.
In figure: 1, support frame；2, rotational structure is electroplated；3, point plating wheel；31, wheel seat；32, wheel rim；4, plated electrode mould group is put；
40, sealing capping；41, insulate upper cover；42, insulate lower cover；421, interface；422, spray tank；423, liquid storage groove；424, it keeps off
Liquid piece；43, chamber；44, through-hole；45, liquid outlet；5, support shaft；51, the second installation position；61, first bearing；62, the second axis
It holds；63, sealing element；7, mounting base；71, axle sleeve；72, the first installation position；8, Dian Dufuliao mechanism.
Specific embodiment
With reference to the accompanying drawings and embodiments, the present invention will be described in detail.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, those skilled in the art
Member can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but as long as at this
All by the protection of Patent Law in the scope of the claims of invention.
Embodiment 1
A kind of plating appts, referring to FIG. 1 and FIG. 2, including rotating mechanism 2, point plating wheel 3, point plated electrode mould group 4 and sealing capping
40。
Wherein rotating mechanism 2 is used to support 3 rotation of plating wheel, and is used for fixed point plated electrode mould group 4, and point plating wheel 3 twines
It is rotated together around material strip and with web feed, material strip is limited in the position for needing point plating injection.Sealing capping 40 is for close
Seal point plated electrode mould group 4, and plating solution is injected to plated electrode mould group 4.When electroplated electrode mould group is uninterruptedly sprayed, point plating wheel 3
Material strip is driven persistently to be fed forward, as next needs point plating position that plating injection switches over material strip is sprayed.
Referring to Fig. 2, point plating wheel 3 includes the wheel rim of feed strip winding and connect with wheel rim and be installed on rotating mechanism 2
Wheel seat.
Referring to Fig. 3, rotating mechanism 2 includes support shaft 5, and support shaft 5 is fixedly connected on bracket, and bracket is solid by fastener
It is placed due on other devices, facilitating to install.
Support shaft 5 is rotatably connected to the mounting base 7 for installation point plating wheel 3, and mounting base 7 is carried out centered on support shaft 5
Rolling bearing group is arranged specially between mounting base 7 and support shaft 5 and reduces frictional resistance for rotation, and rolling bearing group includes point
Not Wei Yu 7 both ends of mounting base first bearing 61 and second bearing 62, two bearings be set reduce when mounting bases 7 rotate and put
Width enhances the position precision of web feed.
In addition, plating solution leaks to downwards the normal rotation of rolling bearing group influence mounting base 7, second bearing 62 in order to prevent
Sealing element 63 is arranged in side far from first bearing 61, and the outside of the first bearing 61 in mounting base 7 of sealing element 63 completely cuts off up and down,
By plating solution barrier in mounting base 7, sealing element 63 is bearing sealed ring in the present embodiment.
Mounting base 7 includes the axle sleeve 71 being set in outside rolling bearing group and is located at 71 one end of axle sleeve for tie point plating wheel
3 the first installation position 72, axle sleeve 71 is cylindrical, is set in outside first bearing 61 and second bearing 62.
First installation position 72 includes the bracing ring being fixedly connected on outside axle sleeve 71, and bracing ring is flat annulus, annulus
Interval opens up upward through hole, and through hole is worn for the first fastener with fixed point plating wheel 3.
Support shaft 5 is used for the second installation position 51 of fixed point plated electrode mould group 4 close to one end setting of the first installation position 72,
Second installation position 51 includes the threaded hole opened up positioned at support shaft 5 close to 72 one end of the first installation position, and fastener wears a plating electricity
It is fixed on threaded hole after pole mould group 4, to realize supporting and fixing for 5 pairs of point plated electrode mould groups 4 of support shaft.
When carrying out plating, material strip is wrapped in 3 outside of plating wheel and is fed forward, and point plating wheel 3 is fixed in mounting base 7, and
Mounting base 7 is constantly rotated centered on support shaft 5, and then material strip is limited in specific position, and this time point plated electrode mould group 4 to
The specific position accurately sprays plating solution, carries out accurate point plating to position, and after the completion of putting plating, mounting base 7 and point plating take turns 3 turns
Dynamic, web feed to the next position continuously carries out plating injection, and it is more efficient to guarantee that point plates accurate while point plating.
Referring to Fig. 4 and Fig. 5, point plated electrode mould group includes insulation upper cover 41 and insulation lower cover 42.
The upper cover 41 that insulate is in dome shape, and edge extends downwardly, and covers insulation lower cover 42.The upper cover 41 that insulate and insulation lower cover
42 are affixed, and the two is surrounded, and chamber 43 is formed at the two center.In addition, the center setting of insulation upper cover 41 extend upward through it is logical
Hole 44 is pressed into chamber 43 for plating solution.
Insulation lower cover 42 is similarly dome shape, and interface is arranged in the edge for the lower cover 42 that insulate and insulation 41 place of being affixed of upper cover
421, interface 421 is closely affixed around insulation lower cover 42 1 weeks, insulation lower cover 42 by interface 421 and insulation upper cover 41,
Plating solution is limited in chamber 43 by the two cooperation.
The liquid outlet 45 being connected to chamber 43 is arranged in the interface 421 of insulation lower cover 42, and liquid outlet 45 is located at insulation lower cover
42 side, whole is in outward an arc surface, and plating solution flows to liquid outlet 45 via chamber 43, then sprays to material by liquid outlet 45
Band carries out accurate point plating.The angle of arcwall face is 100 ° to 150 °, and the spray angle less than 100 ° is too small, point plating low efficiency,
Spray angle greater than 150 ° is too big, influences material strip winding.
Liquid outlet 45 includes being provided with interface 421 and along the outwardly extending spray tank 422 of interface 421, spray tank
422 are extended from inside to outside by insulation lower cover 42, in a row diverging arrangement, and connecting chamber 43 and insulation 42 side of lower cover, periphery is just
Constitute arc surface well.In the present embodiment, spray tank 422 is rectangular channel, and notch is rectangular, the ejection plating solution figure side of being similarly
Shape is attached to after material strip carries out plating, and coating is not in extra overlapping, more uniformly.
In the present embodiment, insulation upper cover 41, insulation lower cover 42 are all made of PEEK material, i.e. polyether-ether-ketone is made, PEEK material
Expect that the coefficient of expansion is low, is not easy deformation, can accomplish effectively to seal, help avoid plating solution and leaked out from gap, in addition PEEK material
Expect that insulating coefficient is high, helps to reduce invalid plating.
In order to enhance electric conductivity when 422 hydrojet of spray tank, in the inner wall coated anode coating of spray tank 422.Anode applies
Layer is adopted as ruthenium-iridium-tantalum, and ruthenium-iridium-tantalum enhances the electric conductivity of 422 inner wall of spray tank, accelerates electronics flowing velocity, point plating attachment degree is high,
Rate is fast, more uniform.
Referring to Fig. 5 and Fig. 6, liquid storage groove 423 is arranged in insulation lower cover 42, and liquid storage groove 423 is the sector to lower recess, fan
The edge of shape extends to liquid outlet 45, is connected to spray tank 422, and when carrying out plating, plating solution gathers in liquid storage groove 423,
It is directly sprayed outward by spray tank 422 after being under pressure, guarantees that the plating solution of sufficient amount carries out spray site plating, put plating uniformly, matter
It measures.
The gear liquid piece 424 that the insulation setting limitation plating solution of lower cover 42 is flowed out to 45 direction of liquid outlet, gear liquid piece 424 is self-insulating
The annulus that lower cover 42 upwardly extends, annulus extension angle is the fan-shaped region unmasked portion of liquid storage groove 423, then by plating solution
It limits and is flowed into liquid storage groove 423, plating solution is avoided to cause plating solution to waste to other angles injection.
Embodiment 2
A kind of point plating production line, reference Fig. 7 and Fig. 8 further include that material conveying is brought to point including the point plating appts in such as embodiment 1
The Dian Dufuliao mechanism 8 of plating appts.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
Those of ordinary skill for, several improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of plating appts, it is characterised in that: including
Point plating wheel (3), feed strip winding, and rotated with material strip；
Point plated electrode mould group (4) carries out a plating to material strip injection plating solution；
Sealing capping (40), seal point plated electrode mould group (4) inject plating solution to plated electrode mould group (4)；
Rotating mechanism (2), supporting point plating wheel (3) rotation, and motor mould group is plated for fixed point.
2. according to claim 1 plating appts, it is characterised in that: described plated electrode mould group (4) includes surrounding to be formed
The insulation upper cover (41) of chamber (43), insulation lower cover (42),
Through-hole (44) of insulation upper cover (41) setting for electroplate liquid indentation chamber (43)；
The liquid outlet being connected to chamber (43) is arranged with the interface (421) that upper cover (41) are affixed that insulate in insulation lower cover (42)
(45), the liquid outlet (45) includes along interface (421) outwardly extending spray tank (422)；
The inner wall coated anode coating of the spray tank (422).
3. according to claim 2 plating appts, it is characterised in that: insulation lower cover (42) setting and liquid outlet (45)
The liquid storage groove (423) of connection.
4. according to claim 2 plating appts, it is characterised in that: the insulation lower cover (42) setting limitation electroplate liquid to
The gear liquid piece (424) of liquid outlet (45) direction outflow.
5. according to any one of claims 1 to 3 plating appts, it is characterised in that: the insulation upper cover (41), insulation lower cover
(42) it is made of PEEK material.
6. according to any one of claims 1 to 3 plating appts, it is characterised in that: the anodic coating is ruthenium-iridium-tantalum.
7. according to claim 1 plating appts, it is characterised in that: the rotating mechanism (2) includes support shaft (5), institute
It states support shaft (5) and is arranged rolling bearing group, the rolling bearing group is arranged the mounting base (7) for plating wheel (3) for installation point, described
Mounting base (7) includes the axle sleeve (71) being set in outside rolling bearing group and is located at axle sleeve (71) one end for tie point plating wheel
(3) the first installation position (72), one end setting of the support shaft (5) close to the first installation position (72) are used for fixed point plated electrode
The second installation position (51) of mould group (4).
8. according to claim 1 plating appts, it is characterised in that: the point plating wheel (3) includes the wheel of feed strip winding
Circle and the wheel seat (31) that rotating mechanism (2) are connect and be installed on wheel rim (32).
9. according to claim 8 plating appts, it is characterised in that: it is close that the wheel seat setting prevents plating solution from revealing downwards
Sealing (63).
10. a kind of point plating production line, it is characterised in that: including as described in any one of claim 1 to 9 plating appts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910430969.5A CN110195245A (en) | 2019-05-22 | 2019-05-22 | Point plating appts and point plating production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910430969.5A CN110195245A (en) | 2019-05-22 | 2019-05-22 | Point plating appts and point plating production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110195245A true CN110195245A (en) | 2019-09-03 |
Family
ID=67753011
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910430969.5A Pending CN110195245A (en) | 2019-05-22 | 2019-05-22 | Point plating appts and point plating production line |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112301390A (en) * | 2020-12-16 | 2021-02-02 | 河南琳德自动化科技有限公司 | Electroplating anode water bag and electroplating machine |
| CN112725853A (en) * | 2021-01-27 | 2021-04-30 | 新恒汇电子股份有限公司 | Method for selectively electroplating intelligent card carrier band |
| CN115305539A (en) * | 2022-09-14 | 2022-11-08 | 江苏成裕金属表面科技有限公司 | Production process of nano ceramic electroplating point plating electroplating line with diameter of 500 mm |
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| CN202705522U (en) * | 2012-08-31 | 2013-01-30 | 成都宏明双新科技股份有限公司 | Spot plating device |
| CN208517551U (en) * | 2018-08-04 | 2019-02-19 | 东莞普瑞得五金塑胶制品有限公司 | A kind of plating appts |
| CN210104105U (en) * | 2019-05-22 | 2020-02-21 | 安徽永基电子科技有限公司 | Point plating device and point plating production line |
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2019
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Patent Citations (3)
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|---|---|---|---|---|
| CN202705522U (en) * | 2012-08-31 | 2013-01-30 | 成都宏明双新科技股份有限公司 | Spot plating device |
| CN208517551U (en) * | 2018-08-04 | 2019-02-19 | 东莞普瑞得五金塑胶制品有限公司 | A kind of plating appts |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112725853B (en) * | 2021-01-27 | 2022-09-09 | 新恒汇电子股份有限公司 | Method for selectively electroplating intelligent card carrier band |
| CN115305539A (en) * | 2022-09-14 | 2022-11-08 | 江苏成裕金属表面科技有限公司 | Production process of nano ceramic electroplating point plating electroplating line with diameter of 500 mm |
| CN115305539B (en) * | 2022-09-14 | 2024-05-28 | 江苏成裕金属表面科技有限公司 | Production process of 500-millimeter-diameter nano ceramic electroplating point plating electroplating line |
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