CN110194934B - Photovoltaic packaging adhesive film, and preparation method and application thereof - Google Patents
Photovoltaic packaging adhesive film, and preparation method and application thereof Download PDFInfo
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- CN110194934B CN110194934B CN201910355007.8A CN201910355007A CN110194934B CN 110194934 B CN110194934 B CN 110194934B CN 201910355007 A CN201910355007 A CN 201910355007A CN 110194934 B CN110194934 B CN 110194934B
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- China
- Prior art keywords
- adhesive film
- packaging adhesive
- photovoltaic
- parts
- coupling agent
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 173
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 153
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 239000011347 resin Substances 0.000 claims abstract description 49
- 239000002994 raw material Substances 0.000 claims abstract description 46
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 38
- 239000004611 light stabiliser Substances 0.000 claims abstract description 28
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 25
- 239000011159 matrix material Substances 0.000 claims abstract description 24
- 239000002250 absorbent Substances 0.000 claims abstract description 18
- 230000002745 absorbent Effects 0.000 claims abstract description 18
- 238000010894 electron beam technology Methods 0.000 claims description 29
- 238000003475 lamination Methods 0.000 claims description 28
- 238000002156 mixing Methods 0.000 claims description 19
- 238000005266 casting Methods 0.000 claims description 18
- 238000004132 cross linking Methods 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 15
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 12
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 claims description 12
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 12
- 238000005096 rolling process Methods 0.000 claims description 12
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 8
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical group C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- VOLZKMNRPFTYGO-UHFFFAOYSA-N butanedioic acid;1-(1-hydroxyethyl)-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound OC(=O)CCC(O)=O.CC(O)N1C(C)(C)CC(O)CC1(C)C VOLZKMNRPFTYGO-UHFFFAOYSA-N 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 4
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 claims description 4
- 229920006225 ethylene-methyl acrylate Polymers 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 4
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 3
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229960001860 salicylate Drugs 0.000 claims description 3
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 claims description 3
- 150000003505 terpenes Chemical class 0.000 claims description 3
- 235000007586 terpenes Nutrition 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000004103 aminoalkyl group Chemical group 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000003999 initiator Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 28
- 239000010409 thin film Substances 0.000 description 26
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 17
- 239000003504 photosensitizing agent Substances 0.000 description 10
- 238000010030 laminating Methods 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000001514 detection method Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- 239000008393 encapsulating agent Substances 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000004641 Diallyl-phthalate Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 4
- 230000036314 physical performance Effects 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 229920006280 packaging film Polymers 0.000 description 3
- 239000012785 packaging film Substances 0.000 description 3
- 229920006124 polyolefin elastomer Polymers 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- -1 alkyl phenolic resin Chemical compound 0.000 description 2
- HXBPYFMVGFDZFT-UHFFFAOYSA-N allyl isocyanate Chemical compound C=CCN=C=O HXBPYFMVGFDZFT-UHFFFAOYSA-N 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 2
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- OSWPMRLSEDHDFF-UHFFFAOYSA-N methyl salicylate Chemical compound COC(=O)C1=CC=CC=C1O OSWPMRLSEDHDFF-UHFFFAOYSA-N 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229960000969 phenyl salicylate Drugs 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- GDESWOTWNNGOMW-UHFFFAOYSA-N resorcinol monobenzoate Chemical compound OC1=CC=CC(OC(=O)C=2C=CC=CC=2)=C1 GDESWOTWNNGOMW-UHFFFAOYSA-N 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- OOXSLJBUMMHDKW-UHFFFAOYSA-N trichloro(3-chloropropyl)silane Chemical compound ClCCC[Si](Cl)(Cl)Cl OOXSLJBUMMHDKW-UHFFFAOYSA-N 0.000 description 2
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical compound C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- KRJRKEPWQOASJN-UHFFFAOYSA-N aniline;trimethoxy(methyl)silane Chemical compound NC1=CC=CC=C1.CO[Si](C)(OC)OC KRJRKEPWQOASJN-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- HGVPOWOAHALJHA-UHFFFAOYSA-N ethene;methyl prop-2-enoate Chemical compound C=C.COC(=O)C=C HGVPOWOAHALJHA-UHFFFAOYSA-N 0.000 description 1
- HEAMQYHBJQWOSS-UHFFFAOYSA-N ethene;oct-1-ene Chemical compound C=C.CCCCCCC=C HEAMQYHBJQWOSS-UHFFFAOYSA-N 0.000 description 1
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 229960001047 methyl salicylate Drugs 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention provides a photovoltaic packaging adhesive film, a preparation method and an application thereof, wherein the photovoltaic packaging adhesive film is prepared from the following raw materials in parts by weight: 1000 parts of a resin matrix; 1-100 parts of an auxiliary crosslinking agent; 1-30 parts of a silane coupling agent; 1-20 parts of an ultraviolet absorbent; 1-10 parts of a light stabilizer. The preparation raw materials of the photovoltaic packaging adhesive film do not contain a thermal initiator. The resin matrix is matched with the assistant crosslinking agent, the silane coupling agent, the ultraviolet absorbent and the light stabilizer to act synergistically, so that the thickness of the packaging component can be thinner, and the weight and the thickness of the packaging component can be greatly reduced. Meanwhile, the photovoltaic packaging adhesive film is excellent in bonding performance and high-temperature resistance when applied to a finished photovoltaic module.
Description
Technical Field
The invention relates to the technical field of packaging adhesive films, in particular to a photovoltaic packaging adhesive film, and a preparation method and application thereof.
Background
At present, the packaging adhesive film used in the photovoltaic industry is generally an EVA (ethylene vinyl acetate) or POE (polyolefin elastomer) adhesive film and is mainly used for bonding a photovoltaic module with a front panel and a back panel. Because of high requirements on bonding strength and weather resistance, the photovoltaic packaging adhesive film mainly comprises a resin matrix, peroxide, an auxiliary crosslinking agent, an ultraviolet absorbent and a light stabilizer. The use mode is that the front panel, the adhesive film, the assembly (such as a battery piece), the adhesive film and the back plate are sequentially paved at normal temperature, and then the front panel, the adhesive film, the assembly (such as a battery piece), the adhesive film and the back plate are laminated in a laminating machine according to certain process conditions, in the process, peroxide is heated under a heating condition to decompose free radicals, and the free radicals and a resin matrix are reacted and combined to initiate crosslinking, so that the high-strength bonding effect is achieved. The main purpose of the cross-linking reaction is to react the resin matrix molecules with linear structures into polymers with three-dimensional structures, so that the self strength and the structural stability of the resin matrix are greatly improved from the molecular layer, the physical performance and the temperature resistance of the resin matrix are greatly improved, and the physical performance requirements of normal use are met.
The commonly used photovoltaic packaging adhesive film is prepared by placing materials such as a resin matrix, peroxide, a crosslinking assistant, an ultraviolet absorbent, a light stabilizer and the like in a high mixing machine for premixing at normal temperature, then feeding the materials into an extruder, shearing and melting the resin matrix by a screw of the extruder, and finally extruding and casting. However, in order to meet the requirement of bonding physical properties of photovoltaic modules, the processing temperature of 80 ℃ cannot be broken through, and meanwhile, the obtained resin matrix cannot form a very thin film when being cast into a film, so that the thickness of the packaging film used in the photovoltaic industry at present is generally thick, and the thinnest film is also more than 100 micrometers.
The excessively thick packaging adhesive film limits the weight and thickness of the packaged photovoltaic module to a certain degree, so that the photovoltaic module which is thinner and thinner cannot be manufactured; meanwhile, the excessively thick packaging adhesive film can be retarded to a certain extent in the application of the thin-film solar module, because the light and thin characteristics of the thin-film solar module and the thick and heavy characteristics of the packaging adhesive film have obvious contradiction.
Disclosure of Invention
In view of the above, the technical problem to be solved by the present invention is to provide a photovoltaic encapsulant film, a preparation method and an application thereof, the photovoltaic encapsulant film provided by the present invention can obtain a thinner thickness, and the adhesive property and the high temperature resistance of the photovoltaic encapsulant film applied to the finished photovoltaic module are both excellent.
The invention provides a photovoltaic packaging adhesive film which is prepared from the following raw materials in parts by weight:
preferably, the adhesive also comprises 100-300 parts by weight of tackifying resin;
the tackifying resin comprises one or more of rosin resin, terpene resin, petroleum resin, acrylic resin, alkyl phenolic resin and ethylene-methacrylic acid copolymer resin.
Preferably, the photosensitizer is 10-50 parts by weight;
the photosensitizer comprises azobisisobutyronitrile.
Preferably, the resin matrix includes an ethylene-vinyl acetate copolymer, an ethylene-octene copolymer, an ethylene-methyl acrylate copolymer, or an ethylene acrylic acid copolymer.
Preferably, in the ethylene-vinyl acetate copolymer, the content of vinyl acetate is 20-35 wt%;
the melt index of the ethylene-octene copolymer is 5-20 g/10 min.
Preferably, the auxiliary crosslinking agent comprises one or more of trimethyl allyl isocyanate, diallyl phthalate and triallyl isocyanurate;
the silane coupling agent comprises one of vinyl silane coupling agent, chlorohydrocarbon silane coupling agent, amino-hydrocarbon silane coupling agent, epoxy-hydrocarbon silane coupling agent and amino-silane coupling agent;
the ultraviolet absorbent comprises one or more of salicylate, benzophenone and benzotriazole;
the light stabilizer comprises one or more of bis (2, 2, 6, 6-tetramethyl-4-piperidyl) sebacate, poly (1-hydroxyethyl-2, 2, 6, 6-tetramethyl-4-hydroxypiperidine) succinate, 2-hydroxy-4-n-octoxybenzophenone and a light stabilizer LQ-292.
The invention also provides a preparation method of the photovoltaic packaging adhesive film, which comprises the following steps:
and mixing the resin matrix, the auxiliary crosslinking agent, the silane coupling agent, the ultraviolet absorbent and the light stabilizer, and performing melting, extrusion casting and rolling to obtain the photovoltaic packaging adhesive film.
The present invention also provides a photovoltaic module comprising:
a back plate;
the first packaging adhesive film layer is compounded on the back plate;
the component layer is compounded on the first packaging adhesive film layer;
a second packaging adhesive film layer compounded on the assembly layer;
the panel is compounded on the second packaging adhesive film layer;
the first packaging adhesive film layer and the second packaging adhesive film layer are independently selected from the packaging adhesive film for photovoltaic or the packaging adhesive film for photovoltaic prepared by the preparation method.
The invention also provides a preparation method of the photovoltaic module, which comprises the following steps:
laying layers according to the sequence of the back plate, the first packaging adhesive film layer, the assembly layer, the second packaging adhesive film layer and the panel, and obtaining a finished photovoltaic assembly after vacuum lamination, irradiation and crosslinking;
the first packaging adhesive film layer and the second packaging adhesive film layer are independently selected from the packaging adhesive film for photovoltaic or the packaging adhesive film for photovoltaic prepared by the preparation method.
Preferably, the temperature of the vacuum lamination is 120-145 ℃;
the irradiation is electron beam irradiation, the intensity of the electron beam irradiation is 10-100 KGY, the depth of the electron beam irradiation is 210-230 mu m, two sides of the composite layer subjected to vacuum lamination are subjected to the electron beam irradiation, and the time for receiving the electron beam irradiation on one side is 30-60 s.
The invention provides a photovoltaic packaging adhesive film which is prepared from the following raw materials in parts by weight: 1000 parts of a resin matrix; 1-100 parts of an auxiliary crosslinking agent; 1-30 parts of a silane coupling agent; 1-20 parts of an ultraviolet absorbent; 1-10 parts of a light stabilizer. The preparation raw materials of the photovoltaic packaging adhesive film do not contain a thermal initiator. The resin matrix is matched with the assistant crosslinking agent, the silane coupling agent, the ultraviolet absorbent and the light stabilizer to act synergistically, so that the thickness of the packaging component can be thinner, and the weight and the thickness of the packaging component can be greatly reduced. Meanwhile, the photovoltaic packaging adhesive film is excellent in bonding performance and high-temperature resistance when applied to a finished photovoltaic module. According to the invention, by further limiting the components of the silane coupling agent, the water-blocking capability of the adhesive film is improved, and the components are better protected, so that the adhesive film is less prone to being damaged by water vapor erosion to a certain extent. The packaging adhesive film disclosed by the invention is applied to the flexible thin film solar module, so that the light and thin characteristics of the thin film solar module can be kept, and the physical performance requirements of the photovoltaic module in normal use can be met.
Experimental results show that the thickness of the photovoltaic packaging adhesive film provided by the invention is smaller and is not more than 50 μm. The packaging adhesive film for photovoltaic in the finished photovoltaic module has excellent bonding strength, and the stripping force is not lower than 1.0N/cm. Meanwhile, the high-temperature resistance of the packaging adhesive film for photovoltaic in the finished photovoltaic module is excellent, and the adhesive does not crack at 85 ℃.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a photovoltaic packaging adhesive film which is prepared from the following raw materials in parts by weight:
the preparation raw material of the photovoltaic packaging adhesive film provided by the invention comprises a resin matrix. The resin matrix is the main raw material of the adhesive film and provides the adhesive film with the basic physical characteristics of melt index, strength, film-forming property and the like. The content of the resin matrix is 1000 parts by weight. In an embodiment of the invention, the resin matrix comprises Ethylene Vinyl Acetate (EVA), ethylene octene (POE), Ethylene Methyl Acrylate (EMA) or Ethylene Acrylic Acid (EAA).
In some embodiments of the present invention, the ethylene-vinyl acetate copolymer contains 20 to 35 wt% of vinyl acetate. In certain embodiments, the ethylene-vinyl acetate copolymer has a vinyl acetate content of 20 wt% or 35 wt%. In certain embodiments of the present invention, the ethylene-octene copolymer has a melt index of 5 to 20g/10 min. In certain embodiments, the ethylene-octene copolymer has a melt index of 5g/10min or 20g/10 min.
The raw materials for preparing the photovoltaic packaging adhesive film also comprise an auxiliary crosslinking agent. In an embodiment of the present invention, the co-crosslinking agent includes one or more of trimethyl allyl isocyanate (TMAIC), diallyl phthalate, and triallyl isocyanurate. According to the invention, the thermal stability and the bonding property of the photovoltaic packaging adhesive film are effectively improved by further defining the components of the auxiliary crosslinking agent.
The content of the auxiliary crosslinking agent is 1-100 parts by weight. In certain embodiments of the present invention, the content of the co-crosslinking agent is 80 parts by weight, 30 parts by weight, 50 parts by weight, 100 parts by weight, or 25 parts by weight.
The raw materials for preparing the photovoltaic packaging adhesive film also comprise a silane coupling agent. In an embodiment of the present invention, the silane coupling agent comprises one of a vinyl silane coupling agent, a chlorohydrocarbyl silane coupling agent, an amino hydrocarbyl silane coupling agent, an epoxy hydrocarbyl silane coupling agent, and an amino silane coupling agent. Specifically, the vinyl silane coupling agent can be vinyl triethoxysilane or vinyl trimethoxysilane; the chlorocarbon silane coupling agent can be gamma-chloropropyltrichlorosilane or gamma-chloropropylmethyldichlorosilane; the amino hydrocarbyl silane coupling agent can be gamma-aminopropyltriethoxysilane or gamma-aminopropyltrimethoxysilane; the epoxy hydrocarbon silane coupling agent can be gamma-urea propyl triethoxy silane or aniline methyl trimethoxy silane; the aminosilane coupling agent can be N- (beta-aminoethyl) -gamma-aminopropylmethyldimethoxysilane or N- (beta-aminoethyl) -gamma-aminopropyltrimethoxysilane.
The silane coupling agent can improve the adhesive property and the thermal stability of the adhesive film without influencing the anti-aging property of the adhesive film, can penetrate through the adhesive film layer to permeate to the lower surface of the packaging film to perform chemical reaction with water molecules penetrating through the packaging film to form a water repellent treatment layer, so that water is inhibited from entering a battery, and the adhesive film adopting the silane coupling agent has good water repellency and can play a better role in protecting components.
The content of the silane coupling agent is 1-30 parts by weight. In certain embodiments of the present invention, the silane coupling agent is present in an amount of 10 parts by weight, 15 parts by weight, 20 parts by weight, 30 parts by weight, or 5 parts by weight.
The raw materials for preparing the photovoltaic packaging adhesive film also comprise an ultraviolet absorber. In an embodiment of the present invention, the ultraviolet absorber includes one or more of salicylic acid esters, benzophenones and benzotriazoles. Specifically, the salicylate can be methyl salicylate or phenyl salicylate; the benzophenone can be 2-hydroxy-4-n-octoxybenzophenone, 2, 4-dihydroxy benzophenone or resorcinol monobenzoate; the benzotriazole may be 2' - (2' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole or 2- (2' -hydroxy-3 ', 5' -bis (a, a-dimethylbenzyl) phenyl) benzotriazole.
The content of the ultraviolet absorbent is 1-20 parts by weight. In certain embodiments of the present invention, the ultraviolet absorber is present in an amount of 5 parts by weight, 8 parts by weight, 3 parts by weight, 4 parts by weight, or 6 parts by weight.
The raw materials for preparing the photovoltaic packaging adhesive film also comprise a light stabilizer. In an embodiment of the invention, the light stabilizer comprises one or more of bis (2, 2, 6, 6-tetramethyl-4-piperidyl) sebacate, poly (1-hydroxyethyl-2, 2, 6, 6-tetramethyl-4-hydroxypiperidine) succinate, 2-hydroxy-4-n-octoxybenzophenone and light stabilizer LQ-292.
The content of the light stabilizer is 1-10 parts by weight. In certain embodiments of the present invention, the light stabilizer is present in an amount of 2 parts by weight, 3 parts by weight, 5 parts by weight, or 8 parts by weight.
In some embodiments of the invention, the raw material for preparing the packaging adhesive film for photovoltaic further comprises tackifying resin. In an embodiment of the present invention, the tackifying resin comprises one or more of rosin resin, terpene resin, petroleum resin, acrylic resin, alkyl phenol resin, and ethylene-methacrylic acid copolymer resin. The tackifying resin can improve the thermal stability of the adhesive film while increasing the adhesive property of the adhesive film, does not influence the anti-aging property of the adhesive film, well improves the elasticity of the adhesive film, has no volatile residues, has no odor, is environment-friendly, has low smoke and no halogen materials, and has excellent processing property.
The content of the tackifying resin is 100-300 parts by weight. In certain embodiments of the present invention, the tackifying resin is present in an amount of 200 parts by weight, 100 parts by weight, or 300 parts by weight.
In some embodiments of the invention, the raw material for preparing the packaging adhesive film for photovoltaic further comprises a photosensitizer. In an embodiment of the present invention, the photosensitizer comprises azobisisobutyronitrile.
The content of the photosensitizer is 10-50 parts by weight. In certain embodiments of the present invention, the photosensitizer is present in an amount of 25 parts by weight.
The preparation raw materials of the photovoltaic packaging adhesive film do not contain a thermal initiator. The resin matrix is matched with the assistant crosslinking agent, the silane coupling agent, the ultraviolet absorbent and the light stabilizer to act synergistically, so that the thickness of the packaging component can be thinner, and the weight and the thickness of the packaging component can be greatly reduced. Meanwhile, the photovoltaic packaging adhesive film is excellent in bonding performance and high-temperature resistance when applied to a finished photovoltaic module. According to the invention, by further limiting the components of the silane coupling agent, the water-blocking capability of the adhesive film is improved, and the components are better protected, so that the adhesive film is less prone to being damaged by water vapor erosion to a certain extent. The packaging adhesive film disclosed by the invention is applied to the flexible thin film solar module, so that the light and thin characteristics of the thin film solar module can be kept, and the physical performance requirements of the photovoltaic module in normal use can be met.
In the invention, the thickness of the photovoltaic packaging adhesive film is thinner and is not more than 50 μm. In the embodiment of the invention, the thickness of the packaging adhesive film for photovoltaic is 30-50 μm.
The invention also provides a preparation method of the photovoltaic packaging adhesive film, which comprises the following steps:
mixing the preparation raw materials, and obtaining a photovoltaic packaging adhesive film after melting, extrusion casting and rolling; the preparation raw materials comprise a resin matrix, an auxiliary crosslinking agent, a silane coupling agent, an ultraviolet absorbent and a light stabilizer.
In an embodiment of the invention, the mixing is performed in a high-speed mixer.
In the embodiment of the invention, the melting temperature is 150-180 ℃. In certain embodiments, the temperature of the melting is 160 ℃, 150 ℃, or 180 ℃. In an embodiment of the invention, the melting is carried out in an extruder. In certain embodiments of the present invention, the raw materials for preparation (resin matrix, co-crosslinking agent, silane coupling agent, ultraviolet absorber, and light stabilizer) are sucked into the extruder through a suction machine before the melting.
In the embodiment of the invention, the rolling speed is 5-40 m/min. In some embodiments of the invention, the rolling speed is 30m/min, 15m/min, 5m/min or 20 m/min.
In certain embodiments of the invention, the preparation feedstock further comprises a tackifying resin. In certain embodiments of the present invention, the starting materials further comprise a photosensitizer.
In the present invention, the components and contents of the raw materials are the same as above, and are not described herein again. In the present invention, the source of the raw material for preparation is not particularly limited, and may be generally commercially available.
The photovoltaic packaging adhesive film can be used for preparing a photovoltaic module, and the specific photovoltaic module can be as follows: the solar cell comprises a monocrystalline silicon cell, a polycrystalline silicon cell, a copper indium gallium selenide thin-film solar cell or a cadmium telluride thin-film solar cell.
The present invention also provides a photovoltaic module comprising:
a back plate;
the first packaging adhesive film layer is compounded on the back plate;
the component layer is compounded on the first packaging adhesive film layer;
a second packaging adhesive film layer compounded on the assembly layer;
the panel is compounded on the second packaging adhesive film layer;
the first packaging adhesive film layer and the second packaging adhesive film layer are independently selected from the packaging adhesive films for photovoltaic.
The back sheet of the present invention is not particularly limited, and a back sheet for photovoltaic modules known to those skilled in the art may be used. In embodiments of the present invention, the backsheet is a PVDF backsheet, a glass backsheet, or a high barrier film. The thickness of the back plate is not particularly limited in the present invention, and may be any thickness known to those skilled in the art. In some embodiments of the present invention, the thickness of the back plate is 50 to 200 μm.
The first packaging adhesive film layer and the second packaging adhesive film layer are independently selected from the packaging adhesive films for photovoltaic. In some embodiments of the present invention, the thickness of the first encapsulation adhesive film layer is 30 to 200 μm; the thickness of the second packaging adhesive film layer is 30-200 mu m.
In an embodiment of the invention, the component layer is a battery sheet. Specifically, the solar cell can be a monocrystalline silicon cell, a polycrystalline silicon cell, a copper indium gallium selenide thin-film solar cell or a cadmium telluride thin-film solar cell. The invention is not limited to any particular thickness of the device layer, as is known to those skilled in the art. In some embodiments of the present invention, the thickness of the component layer is 50 to 100 μm.
The panel of the present invention is not particularly limited, and a panel for photovoltaic modules known to those skilled in the art may be used. In an embodiment of the present invention, the panel is a high barrier film. The thickness of the panel is not particularly limited in the present invention, and may be any thickness known to those skilled in the art. In some embodiments of the present invention, the thickness of the panel is 50 to 200 μm.
In the embodiment of the invention, the thickness of the photovoltaic module is 500-550 μm. In certain embodiments, the photovoltaic module has a thickness of 510 μm, 530 μm, or 550 μm.
The invention also provides a preparation method of the photovoltaic module, which comprises the following steps:
laying layers according to the sequence of the back plate, the first packaging adhesive film layer, the assembly layer, the second packaging adhesive film layer and the panel, and obtaining the finished photovoltaic assembly after vacuum lamination, irradiation and crosslinking.
The materials and thicknesses of the back plate, the first packaging adhesive film layer, the component layer, the second packaging adhesive film layer and the panel are the same as above, and are not described again here.
In the embodiment of the invention, the temperature of the vacuum lamination is 120-145 ℃. In certain embodiments, the temperature of the vacuum lamination is 120 ℃, 135 ℃, or 145 ℃. In the embodiment of the invention, the vacuum degree of the vacuum lamination is-0.06 to-0.09 MPa. In certain embodiments, the vacuum of the vacuum lamination is-0.06 Mpa, -0.08Mpa, or-0.09 Mpa.
In the embodiment of the invention, when the raw material of the packaging adhesive film for photovoltaic contains no photosensitizer, the irradiation is electron beam irradiation. In the embodiment of the invention, the irradiation intensity of the electron beam is 10-100 KGY. In certain embodiments, the electron beam irradiation has an intensity of 30KGY, 50KGY, 60KGY, 80KGY, or 100 KGY. In the embodiment of the invention, the depth of the electron beam irradiation is 210-230 μm. In certain embodiments, the depth of the electron beam irradiation is 210 μm, 220 μm, or 230 μm. In the embodiment of the invention, two sides of the composite layer subjected to vacuum lamination are irradiated by the electron beams, and the time for irradiating one side of the composite layer by the electron beams is 30-60 s. In certain embodiments, the single side is subjected to electron beam irradiation for 30s or 50 s.
Compared with the existing crosslinking method for preparing the photovoltaic module, the electron beam irradiation crosslinking method can further effectively improve the bonding strength and the high temperature resistance of the photovoltaic packaging adhesive film.
In the embodiment of the invention, when the raw material of the packaging adhesive film for photovoltaic contains the photosensitizer, the irradiation is ultraviolet irradiation. In the embodiment of the invention, the intensity of the ultraviolet irradiation is 50-100W/cm2. In certain embodiments, the intensity of the ultraviolet radiation is 100W/cm2. In the embodiment of the invention, the two sides of the composite layer after vacuum lamination are irradiated by the ultraviolet light, and the time for irradiating the single side by the ultraviolet light is 2-3 min. In certain embodiments, the single face acceptsThe time of ultraviolet irradiation is 2 min.
In the photovoltaic module prepared by the invention, the packaging adhesive film for photovoltaic has excellent bonding performance and high temperature resistance. Experimental results show that the photovoltaic packaging adhesive film in the finished photovoltaic module has excellent bonding strength, and the stripping force is not lower than 1.0N/cm. Meanwhile, the high-temperature resistance of the packaging adhesive film for photovoltaic in the finished photovoltaic module is excellent, and the adhesive does not crack at 85 ℃.
In order to further illustrate the present invention, the following examples are provided to describe the encapsulant film for photovoltaic, the preparation method and the application thereof in detail, but they should not be construed as limiting the scope of the present invention.
The starting materials used in the following examples are all generally commercially available.
Example 1
The photovoltaic packaging adhesive film is prepared from the following raw materials in parts by weight:
ethylene-octene copolymer (melt index 5g/10 min): 1000 parts of (A);
ethylene-methacrylic acid copolymer resin: 200 parts of (A);
auxiliary crosslinking agent TMAIC: 80 parts of a mixture;
n- (beta-aminoethyl) -gamma-aminopropylmethyldimethoxysilane coupling agent: 10 parts of (A);
ultraviolet absorbent 2-hydroxy-4-n-octoxy benzophenone: 8 parts of a mixture;
light stabilizer bis (2, 2, 6, 6-tetramethyl-4-piperidinyl) sebacate: and 2 parts.
Mixing the raw materials in a high mixing machine, sucking the mixed raw materials into an extruder through a suction machine, plasticizing and melting at 180 ℃, extruding and casting, rolling at the speed of 30m/min, and casting into a photovoltaic packaging adhesive film with the thickness of 30 mu m.
The packaging adhesive film for photovoltaic is cut according to the required size, and is layered according to the sequence of a high-barrier film (with the thickness of 200 mu m), a first packaging adhesive film layer (the packaging adhesive film for photovoltaic) described above, a component layer (a copper indium gallium selenide thin-film solar cell sheet with the thickness of 50 mu m), a second packaging adhesive film layer (the packaging adhesive film for photovoltaic described above) and the high-barrier film (with the thickness of 200 mu m), and the high-barrier film layer is put into a laminating machine to be subjected to vacuum lamination at the temperature of 145 ℃ (the vacuum degree of the vacuum lamination is-0.09 Mpa). And finally, placing the laminated assembly in electron beam irradiation equipment, and respectively carrying out 30s electron beam irradiation crosslinking on two surfaces of the adhesive film in a mode of controlling irradiation intensity (the intensity is 100KGY) and depth (the depth is 230 mu m) to obtain a finished photovoltaic assembly (the copper indium gallium selenide thin-film solar cell sheet). The thickness of the finished photovoltaic module is 510 mu m through detection.
Example 2
The photovoltaic packaging adhesive film is prepared from the following raw materials in parts by weight:
ethylene-vinyl acetate copolymer (vinyl acetate content 35 wt%): 1000 parts of (A);
co-crosslinking agent diallyl phthalate: 30 parts of (1);
vinyl trimethoxy silane: 15 parts of (1);
ultraviolet absorbent 2'- (2' -hydroxy-3 '-tert-butyl-5' -methylphenyl) -5-chlorobenzotriazole: 5 parts of a mixture;
light stabilizer LQ-292: and 2 parts.
Mixing the raw materials in a high mixing machine, sucking the mixed raw materials into an extruder through a suction machine, plasticizing and melting at 160 ℃, extruding and casting, rolling at the speed of 15m/min, and casting into a photovoltaic packaging adhesive film with the thickness of 50 mu m.
The packaging adhesive film for photovoltaic is cut according to the required size, and is layered according to the sequence of a high-barrier film (with the thickness of 200 mu m), a first packaging adhesive film layer (the packaging adhesive film for photovoltaic) described above, a module layer (a copper indium gallium selenide thin-film solar cell sheet with the thickness of 50 mu m), a second packaging adhesive film layer (the packaging adhesive film for photovoltaic described above) and the high-barrier film (with the thickness of 200 mu m), and the packaging adhesive film is put into a laminating machine to be subjected to vacuum lamination at the temperature of 135 ℃ (the vacuum degree of the vacuum lamination is-0.09 Mpa). And finally, placing the laminated assembly in electron beam irradiation equipment, and respectively carrying out 30s electron beam irradiation crosslinking on two surfaces of the adhesive film in a mode of controlling irradiation intensity (the intensity is 80KGY) and depth (the depth is 220 mu m) to obtain a finished photovoltaic assembly (the copper indium gallium selenide thin-film solar cell sheet). The thickness of the finished photovoltaic module is 550 μm through detection.
Example 3
The photovoltaic packaging adhesive film is prepared from the following raw materials in parts by weight:
ethylene-octene copolymer (melt index 20g/10 min): 1000 parts of (A);
acrylic resin: 100 parts of (A);
co-crosslinking agent triallyl isocyanurate: 50 parts of a mixture;
gamma-chloropropyltrichlorosilane coupling agent: 20 parts of (1);
ultraviolet absorber 2, 4-dihydroxybenzophenone: 4 parts of a mixture;
light stabilizer 2-hydroxy-4-n-octoxy benzophenone: and 3 parts.
Mixing the raw materials in a high mixing machine, sucking the mixed raw materials into an extruder through a suction machine, plasticizing and melting at 150 ℃, extruding and casting, rolling at the speed of 20m/min, and casting into the photovoltaic packaging adhesive film with the thickness of 40 mu m.
The packaging adhesive film for photovoltaic is cut according to the required size, and is layered according to the sequence of a high-barrier film (with the thickness of 200 mu m), a first packaging adhesive film layer (the packaging adhesive film for photovoltaic) described above, a component layer (a copper indium gallium selenide thin-film solar cell sheet with the thickness of 50 mu m), a second packaging adhesive film layer (the packaging adhesive film for photovoltaic described above) and the high-barrier film (with the thickness of 200 mu m), and the high-barrier film is put into a laminating machine to be subjected to vacuum lamination at the temperature of 145 ℃ (the vacuum degree of the vacuum lamination is-0.06 Mpa). And finally, placing the laminated assembly in electron beam irradiation equipment, and respectively carrying out 50s electron beam irradiation crosslinking on two surfaces of the adhesive film in a mode of controlling irradiation intensity (the intensity is 60KGY) and depth (the depth is 220 mu m) to obtain a finished photovoltaic assembly (the copper indium gallium selenide thin-film solar cell sheet). The thickness of the finished photovoltaic module is 530 μm through detection.
Example 4
The photovoltaic packaging adhesive film is prepared from the following raw materials in parts by weight:
ethylene-vinyl acetate copolymer (vinyl acetate content 35 wt%): 1000 parts of (A);
alkyl phenol-formaldehyde resin: 300 parts of (A);
auxiliary crosslinking agent TMAIC: 100 parts of (A);
gamma-aminopropyltrimethoxysilane: 30 parts of (1);
ultraviolet absorber resorcinol monobenzoate: 6 parts of (1);
light stabilizer poly (1-hydroxyethyl-2, 2, 6, 6-tetramethyl-4-hydroxypiperidine) succinate: 5 parts of the raw materials.
Mixing the raw materials in a high mixing machine, sucking the mixed raw materials into an extruder through a suction machine, plasticizing and melting at 180 ℃, extruding and casting, rolling at the speed of 20m/min, and casting into the photovoltaic packaging adhesive film with the thickness of 40 mu m.
The packaging adhesive film for photovoltaic is cut according to the required size, and is layered according to the sequence of a high-barrier film (with the thickness of 200 mu m), a first packaging adhesive film layer (the packaging adhesive film for photovoltaic) described above, a component layer (a copper indium gallium selenide thin-film solar cell sheet with the thickness of 50 mu m), a second packaging adhesive film layer (the packaging adhesive film for photovoltaic described above) and the high-barrier film (with the thickness of 200 mu m), and the high-barrier film layer is put into a laminating machine to be subjected to vacuum lamination at the temperature of 145 ℃ (the vacuum degree of the vacuum lamination is-0.09 Mpa). And finally, placing the laminated assembly in electron beam irradiation equipment, and respectively carrying out 30s electron beam irradiation crosslinking on two surfaces of the adhesive film in a mode of controlling irradiation intensity (the intensity is 50KGY) and depth (the depth is 220 mu m) to obtain a finished photovoltaic assembly (the copper indium gallium selenide thin-film solar cell sheet). The thickness of the finished photovoltaic module is 530 μm through detection.
Example 5
The photovoltaic packaging adhesive film is prepared from the following raw materials in parts by weight:
ethylene acrylic acid copolymer: 1000 parts of (A);
rosin resin: 300 parts of (A);
co-crosslinking agent triallyl isocyanurate: 25 parts of (1);
anilinemethyltrimethoxysilane: 30 parts of (1);
phenyl salicylate: 6 parts of (1);
light stabilizer poly (1-hydroxyethyl-2, 2, 6, 6-tetramethyl-4-hydroxypiperidine) succinate: 8 parts.
Mixing the raw materials in a high mixing machine, sucking the mixed raw materials into an extruder through a suction machine, plasticizing and melting at 180 ℃, extruding and casting, rolling at the speed of 20m/min, and casting into a photovoltaic packaging adhesive film with the thickness of 50 mu m.
The packaging adhesive film for photovoltaic is cut according to the required size, the high-barrier film (with the thickness of 200 mu m), the first packaging adhesive film layer (the packaging adhesive film for photovoltaic) and the component layer (the copper indium gallium selenide thin-film solar cell piece with the thickness of 50 mu m), the second packaging adhesive film layer (the packaging adhesive film for photovoltaic) and the high-barrier film (with the thickness of 200 mu m) are layered in sequence, and the photovoltaic module is placed into a laminating machine to be subjected to vacuum lamination at the temperature of 120 ℃ (the vacuum degree of the vacuum lamination is-0.08 Mpa), so that the finished photovoltaic module (the copper indium gallium selenide thin-film solar cell) is obtained. And finally, placing the laminated assembly in electron beam irradiation equipment, and respectively carrying out 30s electron beam irradiation crosslinking on two surfaces of the adhesive film in a mode of controlling irradiation intensity (the intensity is 30KGY) and depth (the depth is 210 mu m) to obtain a finished photovoltaic assembly (the copper indium gallium selenide thin-film solar cell sheet). The thickness of the finished photovoltaic module is 550 μm through detection.
Example 6
The photovoltaic packaging adhesive film is prepared from the following raw materials in parts by weight:
ethylene-vinyl acetate copolymer (20 wt% vinyl acetate content): 1000 parts of (A);
photosensitizer azobisisobutyronitrile: 25 parts of (1);
co-crosslinking agent triallyl isocyanurate: 25 parts of (1);
vinyltriethoxysilane: 15 parts of (1);
ultraviolet absorbent 2'- (2' -hydroxy-3 '-tert-butyl-5' -methylphenyl) -5-chlorobenzotriazole: 8 parts of a mixture;
light stabilizer LQ-292: 5 parts of the raw materials.
Mixing the raw materials in a high mixing machine, sucking the mixed raw materials into an extruder through a suction machine, plasticizing and melting at 180 ℃, extruding and casting, rolling at the speed of 30m/min, and casting into a photovoltaic packaging adhesive film with the thickness of 30 mu m.
The packaging adhesive film for photovoltaic is cut according to the required size, and is layered according to the sequence of a high-barrier film (with the thickness of 200 mu m), a first packaging adhesive film layer (the packaging adhesive film for photovoltaic) described above, a component layer (a copper indium gallium selenide thin-film solar cell sheet with the thickness of 50 mu m), a second packaging adhesive film layer (the packaging adhesive film for photovoltaic described above) and the high-barrier film (with the thickness of 200 mu m), and the high-barrier film layer is put into a laminating machine to be subjected to vacuum lamination at the temperature of 145 ℃ (the vacuum degree of the vacuum lamination is-0.09 Mpa). Finally, the laminated assembly was placed in an ultraviolet lamp irradiation apparatus to control the irradiation intensity (intensity of 100W/cm)2) Respectively carrying out 120s ultraviolet irradiation crosslinking on two sides of the adhesive film, and obtaining a finished product photovoltaic module (the copper indium gallium selenide thin-film solar cell) after the completion. The thickness of the finished photovoltaic module is 510 mu m through detection.
Comparative example 1
The photovoltaic packaging adhesive film is prepared from the following raw materials in parts by weight:
ethylene-vinyl acetate copolymer (20 wt% vinyl acetate content): 1000 parts of (A);
co-crosslinking agent diallyl phthalate: 30 parts of (1);
peroxide (tert-butyl peroxy-2-ethylhexyl carbonate): 15 parts of (1);
gamma-aminopropyltriethoxysilane: 20 parts of (1);
ultraviolet absorbent 2'- (2' -hydroxy-3 '-tert-butyl-5' -methylphenyl) -5-chlorobenzotriazole: 3 parts of a mixture;
light stabilizer LQ-292: and 2 parts.
Mixing the raw materials in a high mixing machine, sucking the mixed raw materials into an extruder through a suction machine, plasticizing and melting at 80 ℃, extruding and casting, rolling at the speed of 5m/min, and casting into a photovoltaic packaging adhesive film with the thickness of 200 mu m.
The packaging adhesive film for photovoltaic is cut according to the required size, and is layered according to the sequence of a high-barrier back film (with the thickness of 200 mu m), a first packaging adhesive film layer (the packaging adhesive film for photovoltaic) above, a component layer (a copper indium gallium selenide thin-film solar cell with the thickness of 50 mu m), a second packaging adhesive film layer (the packaging adhesive film for photovoltaic) above and a high-barrier front film (with the thickness of 200 mu m), and the components are put into a laminating machine to be subjected to vacuum lamination at the temperature of 145 ℃ (the vacuum degree of the vacuum lamination is-0.09 Mpa), so that the finished photovoltaic component (the copper indium gallium selenide thin-film solar cell) is obtained. The thickness of the finished photovoltaic module is 850 mu m through detection.
Example 7
The performance of the photovoltaic packaging adhesive film in the finished photovoltaic module obtained in the embodiments 1 to 6 and the comparative example 1 is detected, and the peel strength of the photovoltaic packaging adhesive film is obtained according to the standard GB/T2792, as shown in Table 1. According to the dual 85 humid heat aging requirements of the photovoltaic industry, the high temperature resistance of the photovoltaic packaging adhesive film in the obtained finished photovoltaic module is detected, and the table 1 shows. Meanwhile, the thicknesses of the encapsulant films for photovoltaic obtained in examples 1 to 6 and comparative example 1 are given in table 1.
Table 1 results of performance test of photovoltaic encapsulant films in finished photovoltaic modules obtained in examples 1 to 6 and comparative example 1
As can be seen from Table 1, the thickness of the photovoltaic packaging adhesive film prepared by the method is relatively thin and is not more than 50 μm. The packaging adhesive film for photovoltaic in the finished photovoltaic module has excellent bonding strength, and the stripping force is not lower than 1.0N/cm. Meanwhile, the high-temperature resistance of the packaging adhesive film for photovoltaic in the finished photovoltaic module is excellent, and the adhesive does not crack at 85 ℃.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A photovoltaic module, comprising:
a back plate;
the first packaging adhesive film layer is compounded on the back plate;
the component layer is compounded on the first packaging adhesive film layer;
a second packaging adhesive film layer compounded on the assembly layer;
the panel is compounded on the second packaging adhesive film layer;
the first packaging adhesive film layer and the second packaging adhesive film layer are independently selected from packaging adhesive films for photovoltaic;
the photovoltaic packaging adhesive film is prepared from the following raw materials in parts by weight:
1000 parts of a resin matrix;
1-100 parts of an auxiliary crosslinking agent;
1-30 parts of a silane coupling agent;
1-20 parts of an ultraviolet absorbent;
1-10 parts of a light stabilizer;
100-300 parts of tackifying resin;
the resin matrix comprises an ethylene-vinyl acetate copolymer, an ethylene-octene copolymer, an ethylene-methyl acrylate copolymer or an ethylene acrylic acid copolymer;
the auxiliary crosslinking agent is triallyl isocyanurate;
the thickness of the photovoltaic packaging adhesive film is not more than 50 mu m;
the preparation method of the photovoltaic module comprises the following steps:
laying layers according to the sequence of the back plate, the first packaging adhesive film layer, the assembly layer, the second packaging adhesive film layer and the panel, and obtaining a finished photovoltaic assembly after vacuum lamination, irradiation and crosslinking;
the irradiation is electron beam irradiation, the intensity of the electron beam irradiation is 30-100 KGY, the depth of the electron beam irradiation is 210-230 mu m, two sides of the composite layer subjected to vacuum lamination are subjected to the electron beam irradiation, and the time for receiving the electron beam irradiation on one side is 30-60 s.
2. The photovoltaic module of claim 1, wherein the tackifying resin comprises one or more of rosin resin, terpene resin, petroleum resin, acrylic resin, alkyl phenol resin, and ethylene-methacrylic acid copolymer resin.
3. The photovoltaic module according to claim 1, wherein the ethylene-vinyl acetate copolymer has a vinyl acetate content of 20 to 35 wt%;
the melt index of the ethylene-octene copolymer is 5-20 g/10 min.
4. The photovoltaic module of claim 1, wherein the silane coupling agent comprises one of a vinyl silane coupling agent, a chlorohydrocarbyl silane coupling agent, an aminoalkyl silane coupling agent, an epoxyhydrocarbyl silane coupling agent, and an aminosilane coupling agent;
the ultraviolet absorbent comprises one or more of salicylate, benzophenone and benzotriazole;
the light stabilizer comprises one or more of bis (2, 2, 6, 6-tetramethyl-4-piperidyl) sebacate, poly (1-hydroxyethyl-2, 2, 6, 6-tetramethyl-4-hydroxypiperidine) succinate, 2-hydroxy-4-n-octoxybenzophenone and a light stabilizer LQ-292.
5. The photovoltaic module according to claim 1, wherein the preparation method of the packaging adhesive film for photovoltaic comprises the following steps:
and mixing the resin matrix, the auxiliary crosslinking agent, the silane coupling agent, the ultraviolet absorbent, the light stabilizer and the tackifying resin, and melting, extruding, casting and rolling to obtain the photovoltaic packaging adhesive film.
6. A method of making the photovoltaic module of claim 1, comprising the steps of:
laying layers according to the sequence of the back plate, the first packaging adhesive film layer, the assembly layer, the second packaging adhesive film layer and the panel, and obtaining the finished photovoltaic assembly after vacuum lamination, irradiation and crosslinking.
7. The method according to claim 6, wherein the temperature of the vacuum lamination is 120 to 145 ℃.
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| CN113563829B (en) * | 2020-04-23 | 2022-12-20 | 阿特斯阳光电力集团股份有限公司 | Flame-retardant EVA adhesive film and preparation method and application thereof |
| CN112225981B (en) * | 2020-09-18 | 2022-04-12 | 苏州赛伍应用技术股份有限公司 | Solder strip carrier film and preparation method and application thereof |
| CN113881356A (en) * | 2021-11-09 | 2022-01-04 | 江门市聚晖新材料科技有限公司 | High-peel-strength ultraviolet aging resistant EAA packaging adhesive film for photovoltaic cell and preparation method thereof |
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