CN110192442B - Electronic power system and method of manufacturing the same - Google Patents
Electronic power system and method of manufacturing the same Download PDFInfo
- Publication number
- CN110192442B CN110192442B CN201780082834.3A CN201780082834A CN110192442B CN 110192442 B CN110192442 B CN 110192442B CN 201780082834 A CN201780082834 A CN 201780082834A CN 110192442 B CN110192442 B CN 110192442B
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- electronic power
- cooling structure
- substrate
- power module
- power system
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000001816 cooling Methods 0.000 claims abstract description 99
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000002826 coolant Substances 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000000087 stabilizing effect Effects 0.000 claims description 27
- 238000010273 cold forging Methods 0.000 claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 230000032258 transport Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 238000010146 3D printing Methods 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000005242 forging Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to an electronic power system comprising at least one electronic power module. The electronic power module includes a substrate and at least one heat generating component arranged on a first side of the substrate. The electronic power module includes a cooling structure that transports heat away from the electronic power module via a coolant directed by the cooling structure. A cooling structure is arranged on a second side of the substrate opposite the first side. It is an object of the invention to provide an electronic power system with improved cooling. According to the invention, this object is achieved in that the cooling structure is formed integrally with the base plate. The invention also relates to a method for manufacturing the electronic power system.
Description
Technical Field
The present invention relates to an electronic power system comprising at least one electronic power module and a method for manufacturing the electronic power system.
Background
The present invention relates to an electronic power system comprising at least one electronic power module, wherein the electronic power module comprises a substrate and at least one heat generating component arranged on a first side of the substrate; wherein the electronic power module includes a cooling structure for transporting heat away from the electronic component via a coolant directed by the cooling structure; and wherein the cooling structure is arranged on a second side of the substrate opposite the first side.
The coolant may be any of a number of different fluids known in the art. Generally, water with or without small amounts of additives for controlling corrosivity or electrical conductivity may be used. Alternatively, a phase change or two-phase cooling system may be formed using a material designed to undergo a phase change during a cooling cycle. Such a system is a very efficient cooling method and comprises some form of compressor to compress the coolant from a gas to a liquid. This liquid is directed through a heat sink device (such as a condenser) that removes heat from the liquid, and then is directed to a cooling structure after passing through an expansion device that evaporates the liquid. The evaporating liquid undergoes a phase change and absorbs heat from the cooling structure in the process. The gas is then directed through the compressor and the cycle begins again.
The invention also relates to a method for manufacturing an electronic power module of the above type.
Traditionally, electronic power modules in electronic power systems are assembled by mounting heat generating components directly or indirectly on a first side of a substrate. The heat generating component is then typically encapsulated to the exterior of the molded plastic that also covers the remainder of the first side of the substrate.
Separate components including cooling structures may then be attached to either or both sides of the electronic power module to transport heat away from the electronic power module. However, this arrangement has several disadvantages, particularly in situations where strong cooling is required. If a cooling structure using a coolant is attached to the second side of the substrate, the coolant will be guided through the cooling structure to absorb and transport the excess heat away from the electronic power module. However, efficient cooling requires that a high flow rate of the coolant be achieved by providing the coolant at high pressure via a pump. For this reason, the electronic power module will be subjected to high pressures, which may vary due to pressure pulses caused by the pump. Therefore, there is a need to stabilize electronic power modules to avoid micro-cracks, which is typically achieved by using thicker substrates to prevent premature mechanical failure of the electronic power modules. On the other hand, this increases the volume, thickness and weight of the electronic power module.
Disclosure of Invention
It is therefore an object of the present invention to provide an electronic power system with improved cooling.
According to the invention, the above task is solved in that the cooling structure is formed integrally with the base plate.
Thus, the base plate and the cooling structure are not separate components which are only fixed to each other during assembly, but the cooling structure is an integral part of the base plate. In this way, the cooling structure can more effectively increase the rigidity of the substrate than in the prior art, and the overall height of the substrate and cooling structure combination can be reduced without losing the stability of the electronic power module.
In an embodiment, the cooling structure comprises at least one wall structure for reinforcing the substrate and guiding the coolant along the cooling structure. Each wall structure may be a combination of wall elements connected to each other. The at least one wall structure may also direct the flow of coolant from the at least one cooling structure inlet to the at least one cooling structure outlet. The wall structure provides greater stability and rigidity to the substrate than does the spacer fins. In an embodiment, the at least one wall structure changes direction in a cooling structure plane parallel to the second surface. The change of direction may be gradual or abrupt, or both at different locations of the wall structure. In other words, some parts of the wall structure may be straight, while other parts may be curved, for example.
In an embodiment, one of the wall structures comprises at least one stabilizing wall element, wherein the direction of the stabilizing wall element does not change when the substrate extends for at least one third in this direction. This embodiment ensures that at least a part of the at least one wall structure significantly increases the stiffness and stability of the base plate. If the cooling structure comprises several stabilizing wall elements of this type, the stiffness of the entire base plate will be close to the stiffness of a bulky base plate of the same thickness. In an embodiment, the direction of the at least one stabilizing wall element does not change when the substrate extends in this direction for at least half a time. In an embodiment, the direction of the at least one stabilizing wall element does not change when the substrate is fully extended in that direction.
In an embodiment, the electronic power system comprises at least two stable wall elements arranged at a relative angle between 60 ° and 120 °. This embodiment ensures that at least two stabilizing wall elements are arranged almost perpendicularly in the plane of the cooling structure and thus ensures sufficient overall rigidity and stability of the base plate.
In an embodiment, the cooling structure is confined in the plane of the cooling structure by at least three stabilizing wall elements. Depending on the shape of the substrate, the plurality of stabilizing wall elements may thus restrict the cooling structure and thus the flow of coolant in the plane of the cooling structure. The substrate may be rectangular, in which case the cooling structure may be bounded by four stable wall elements meeting at the corners of the cooling structure.
In an embodiment, the cooling structure comprises at least two wall structures forming an interleaved comb pattern to guide a coolant flow along the cooling structure and stabilize the substrate. The interleaved comb pattern is effective in providing both uniform cooling and high stiffness of the substrate. An interlaced comb pattern may be formed between two adjacent stabilizing wall elements. Adjacent stabilizing wall elements may extend in parallel but may also be arranged at an angle with respect to each other.
In an embodiment, the cooling structure comprises both a wall structure and a lateral spacer pin. The cooling structure may further comprise a pin connected to at least one of the wall structures.
In an embodiment, the cooling structure comprises at least three wall structures, each of the wall structures comprising at least one stabilizing wall element, wherein the at least three stabilizing wall elements extend radially towards a common central position. The common center position does not necessarily need to be arranged at the geometric center of the substrate. However, in case the substrates have a certain symmetry, it may be advantageous to arrange the common center position at the geometric center of the plane of the cooling structure. Arranging at least three stabilizing wall elements in a radial arrangement towards a common central position provides a high stability of the base plate. Further, in this embodiment, the cooling structure inlets may be arranged above a common central location such that the center of the substrate receives the strongest cooling. The latter may be desirable in applications where the most heat is generated at the center of the electronic power module. In this embodiment, the cooling structure may comprise further non-radially arranged stabilizing wall elements.
In an embodiment, the wall structures form a polar comb pattern between adjacent stabilizing wall elements around a common central position. In this embodiment, the flow of coolant may then enter the cooling structure near the common central location and then meander radially outward through the polar comb pattern arranged between adjacent stabilizing wall elements until it reaches the cooling structure outlet.
In an embodiment, an electronic power system comprises at least two electronic power modules and a common coolant distributor, wherein the common coolant distributor comprises at least one distributor inlet and at least one distributor outlet connected to each electronic power module. Each distributor inlet may be connected to one or more cooling structure outlets, and each distributor outlet may be connected to one or more cooling structure inlets, and vice versa.
In an embodiment, the common coolant distributor comprises a respective recess for receiving each electronic power module, wherein each recess comprises at least one distributor inlet and at least one distributor outlet.
The above task is also solved by a method for manufacturing an electronic power system comprising at least one electronic power module, wherein the electronic power module comprises a base plate and at least one heat generating component arranged on a first side of the base plate; wherein the electronic power module comprises a cooling structure for transporting heat away from the electronic power module via a coolant directed by the cooling structure; and wherein the cooling structure is arranged on a second side of the substrate opposite to the first side, the method comprising the steps of:
-providing an original substrate,
-forming a cooling structure on the second side of the original substrate such that the cooling structure is an integral part of the substrate,
-fixing the at least one heat generating component to the first side.
In an embodiment, the cooling structure is formed by cold forging the original substrate. For example, the cooling structure may be embossed into the original substrate. Depending on the material of the substrate, cold forging may be more cost effective than other manufacturing methods. Alternatively, the cooling structure may be formed by hot forging, etching, milling, 3D printing, additive manufacturing, sintering, injection molding, casting, or erosion. These alternative methods may be used particularly in the case where the material of the substrate is not suitable for cold forging or the shape of the cooling structure is difficult to realize by cold forging.
Drawings
Preferred embodiments of the present invention will now be described with reference to the accompanying drawings, in which:
figure 1 shows a top view of an electronic power module as part of an electronic power system according to the invention,
figure 2 shows a second embodiment of an electronic power module according to the invention as part of an electronic power system,
figures 3A and 3B show a third embodiment of an electronic power module according to the invention as part of an electronic power system,
figure 4 shows a common coolant distributor as part of an electronic power system according to the invention,
figure 5 shows a fourth embodiment of a base plate of an electronic power system according to the invention,
figure 6 shows a fifth embodiment of a base plate according to the invention as part of an electronic power system,
figure 7 shows the arrangement of twelve adjacent substrates of figure 6 according to an embodiment,
figure 8 shows the embodiment according to figure 7 and a matching common coolant distributor,
fig. 9 shows a flow chart of a manufacturing method according to the invention.
Detailed Description
Fig. 1 shows a simplified depiction of an electronic power system 1 according to a first embodiment of the present invention. The electronic power system 1 comprises an electronic power module 2 having a substrate 3. Furthermore, the electronic power module 2 comprises heat generating components arranged on the first side of the substrate 3, which are not visible from the angle shown. Furthermore, the electronic power module 2 comprises a cooling structure 4 arranged on the second side 5 of the substrate 3.
The cooling structure 4 is formed integrally with the base plate 3. Both of which can be made from a common base starting substrate, for example by cold forging. Alternatively, the cooling structure 4 may also be formed by hot forging, etching, milling, 3D printing, additive manufacturing, sintering, injection moulding, casting or etching.
In this embodiment the cooling structure 4 comprises three wall structures 6 and lateral spacer pins 7. Furthermore, some pins 8 are connected to the wall structure 6.
Furthermore, fig. 1 shows two main flow directions of the coolant, which start from the top downwards and then follow the approximate channel formed by the wall structure 6.
Of course, the electronic power system 1 may comprise a plurality of electronic power modules 2, which may be provided with coolant by a common coolant distributor, as in one of the later embodiments.
The wall structures 6 here each comprise at least one stabilizing wall element 9, the direction of which does not change when the substrate extends in this direction for at least one third.
Fig. 2 shows a second embodiment of the electronic power system 1 according to the invention. The electronic power module 2 here again comprises a base plate 3 with a cooling structure 4 that differs from the previous embodiment. Here, the cooling structure 4 comprises four wall structures 6. One of the wall structures 6 comprises four stabilizing wall elements 9 which confine the cooling structure 4 in a transverse plane. The further wall structure 6 is arranged within the limiting wall structure 6. The wall structures 6 form an interleaved comb-like pattern to guide the coolant along the cooling structure 4. In this embodiment all wall elements are arranged parallel to each other or perpendicular to each other.
Fig. 3A and 3B show an embodiment similar to fig. 2. Here, the electronic power module 2 is shown from the second side in fig. 3A and from the first side of the substrate 3 in fig. 3B.
In fig. 4, a common coolant distributor 10 for three electronic power modules 2 according to fig. 3A and 3B is shown. The common coolant distributor 10 comprises three recesses 11, each arranged to accommodate the cooling structure 4 of the electronic power module 2. In each recess 11 there is arranged a distributor inlet 12 and a distributor outlet 13.
Fig. 5 shows a fourth embodiment of the base plate 3 of the electronic power system 1. For simplicity, the electronic power module 2 and other parts of the electronic power system 1 are omitted. The substrate 3 here again comprises a cooling structure 4. The cooling structure 4 here comprises eight wall structures 6. The wall structures 6 each comprise one stabilizing wall element 9 extending towards the common central position 14. For each stabilizing wall element 9 there is another stabilizing wall element 9 extending in parallel and two other stabilizing wall elements 9 extending perpendicularly. The wall structures 6 form a polar comb pattern between adjacent stabilizing wall elements 9 around a common central location 14.
Fig. 6 shows a fifth embodiment according to the invention. The base plate 3 here comprises a cooling structure 4 with a radial geometry similar to the embodiment according to fig. 5. The main difference in this case is that the substrate 3 and the cooling structure 4 have a rectangular shape in the plane of the cooling structure 4.
Fig. 7 shows an arrangement of twelve substrates 3 arranged adjacent to each other according to the embodiment of fig. 6. All other elements of the electronic power module 2 are again omitted for simplicity.
Fig. 8 shows the same embodiment as fig. 7, wherein additionally a common coolant distributor 10 is placed on top of the cooling structure 4 in order to provide coolant for the electronic power modules 2 and to receive heated coolant flowing out of the cooling structure 4. In this case, the common coolant distributor 10 provides coolant to three adjacent cooling structures 4 through three adjacent distributor outlets 13. Here, the distributor outlets 13 are arranged such that the cold coolant enters the cooling structures 4 at a common central position 14 of each of the cooling structures 4. The heated coolant then exits the cooling structure 4 at the distributor inlet 12. Here, each distributor inlet 13 is connected to several adjacent cooling structures 4 of adjacent electronic power modules 2.
Fig. 9 shows a flow chart of a manufacturing method according to the invention. According to the method, an original substrate is first provided. Then, a cooling structure 4 is formed on the second side of the original substrate, such that the cooling structure 4 is an integral part of the substrate 3. Such a forming process may be performed, for example, by cold forging. Alternatively, the cooling structure 4 may also be formed by hot forging, etching, milling, 3D printing, additive manufacturing, sintering, injection moulding, casting or etching.
Then, at least one heat generating component is secured to the first side of the base plate. Thereby manufacturing an electronic power system 1 comprising at least one electronic power module 2. The electronic power module comprises a substrate and at least one heat generating component arranged on a first side of the substrate 3. The electronic power module 2 comprises a cooling structure 4 for transporting heat away from the electronic power module 2 via a coolant guided by the cooling structure 4. The cooling structure 4 is arranged on a second side 5 of the substrate 3 opposite to the first side.
Claims (8)
1. An electronic power system comprising at least one electronic power module, wherein the electronic power module comprises a substrate and at least one heat generating component arranged on a first side of the substrate; wherein the electronic power module comprises a cooling structure for transporting heat away from the electronic power module via a coolant directed by the cooling structure; and wherein the cooling structure is arranged on a second side of the substrate, opposite the first side, the cooling structure being integrally formed with the substrate,
characterized in that the cooling structure comprises at least three wall structures for reinforcing the base plate and guiding a cooling agent along the cooling structure,
each of the wall structures comprises at least one stabilizing wall element, wherein the stabilizing wall elements extend radially towards a common central position, and
the wall structures form an interleaved polar comb pattern between adjacent stabilizing wall elements around the common central location to direct the coolant flow along the cooling structure and stabilize the substrate.
2. The electrical power system of claim 1, wherein the orientation of the stabilizer wall element does not change when the substrate extends in the direction for at least one-third.
3. Electronic power system according to claim 1, characterized in that the cooling structure is confined in a transverse plane by at least three stabilizing wall elements.
4. Electronic power system according to any of claims 1 to 3, characterized in that the cooling structure comprises lateral insulation pins.
5. Electronic power system according to any of claims 1 to 3, characterized in that it comprises at least two electronic power modules and a common coolant distributor, wherein the common coolant distributor comprises at least one distributor inlet and at least one distributor outlet connected to each electronic power module.
6. Electronic power system according to claim 5, characterized in that the common coolant distributor comprises a respective recess for receiving each electronic power module, wherein each recess comprises at least one distributor inlet and at least one distributor outlet.
7. A method for manufacturing an electronic power system according to any of the preceding claims, the method comprising the steps of:
-providing an original substrate,
-forming a cooling structure on the second side of the original substrate such that the cooling structure is an integral part of the substrate,
-fixing the at least one heat generating component to the first side.
8. The method of claim 7, wherein the cooling structure is formed by cold forging the starting substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011274767.5A CN112423549B (en) | 2017-01-20 | 2017-12-22 | Electronic power system and method for manufacturing same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017101126.9A DE102017101126B4 (en) | 2017-01-20 | 2017-01-20 | Power electronics system and process for its manufacture |
| DE102017101126.9 | 2017-01-20 | ||
| PCT/EP2017/084484 WO2018134031A1 (en) | 2017-01-20 | 2017-12-22 | Electronic power system and method for manufacturing the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011274767.5A Division CN112423549B (en) | 2017-01-20 | 2017-12-22 | Electronic power system and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110192442A CN110192442A (en) | 2019-08-30 |
| CN110192442B true CN110192442B (en) | 2020-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780082834.3A Active CN110192442B (en) | 2017-01-20 | 2017-12-22 | Electronic power system and method of manufacturing the same |
| CN202011274767.5A Active CN112423549B (en) | 2017-01-20 | 2017-12-22 | Electronic power system and method for manufacturing same |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011274767.5A Active CN112423549B (en) | 2017-01-20 | 2017-12-22 | Electronic power system and method for manufacturing same |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10999955B2 (en) |
| CN (2) | CN110192442B (en) |
| DE (1) | DE102017101126B4 (en) |
| WO (1) | WO2018134031A1 (en) |
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| DE102020208749A1 (en) * | 2020-07-14 | 2022-01-20 | Volkswagen Aktiengesellschaft | Process for manufacturing a cooled power electronics module |
| DE102021119213B4 (en) | 2021-07-25 | 2023-02-09 | Fachhochschule Kiel, Körperschaft des öffentlichen Rechts | Helix channel cooler unit |
| DE102021123040B4 (en) | 2021-09-06 | 2023-03-30 | Danfoss Silicon Power Gmbh | Cooler for an electronic component and power module comprising such a cooler |
| WO2024132171A1 (en) | 2022-12-22 | 2024-06-27 | Dynex Semiconductor Limited | A thermal management device for power semiconductor packaging |
| DE102023107033B3 (en) | 2023-03-21 | 2024-06-13 | Danfoss Silicon Power Gmbh | Pressure sintering process using a deformation absorption agent and assembly manufactured thereby |
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| CN204392764U (en) * | 2015-03-12 | 2015-06-10 | 株洲南车奇宏散热技术有限公司 | A kind of cooled plate |
| JP6463505B2 (en) * | 2015-11-25 | 2019-02-06 | 三菱電機株式会社 | Semiconductor device, inverter device and automobile |
| CN106099246A (en) * | 2016-08-12 | 2016-11-09 | 辽宁比科新能源股份有限公司 | A kind of lithium ion battery bag heat-transfer device |
-
2017
- 2017-01-20 DE DE102017101126.9A patent/DE102017101126B4/en active Active
- 2017-12-22 CN CN201780082834.3A patent/CN110192442B/en active Active
- 2017-12-22 CN CN202011274767.5A patent/CN112423549B/en active Active
- 2017-12-22 US US16/477,321 patent/US10999955B2/en active Active
- 2017-12-22 WO PCT/EP2017/084484 patent/WO2018134031A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN112423549A (en) | 2021-02-26 |
| DE102017101126A1 (en) | 2018-07-26 |
| DE102017101126B4 (en) | 2021-08-19 |
| CN112423549B (en) | 2024-08-30 |
| US10999955B2 (en) | 2021-05-04 |
| CN110192442A (en) | 2019-08-30 |
| US20190373777A1 (en) | 2019-12-05 |
| WO2018134031A1 (en) | 2018-07-26 |
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