CN110190011B - Etching device - Google Patents
Etching device Download PDFInfo
- Publication number
- CN110190011B CN110190011B CN201910416261.4A CN201910416261A CN110190011B CN 110190011 B CN110190011 B CN 110190011B CN 201910416261 A CN201910416261 A CN 201910416261A CN 110190011 B CN110190011 B CN 110190011B
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- China
- Prior art keywords
- roller
- etching
- sub
- substrate
- blocking part
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Abstract
The present invention provides an etching apparatus, including: an etching chamber, wherein an etching solution is contained in the etching chamber; an inlet and an outlet are respectively arranged on two opposite side walls of the etching chamber, and the position of the outlet corresponds to the position of the inlet; the outlet and the inlet are both provided with a blocking part, the blocking part comprises a first sub-blocking part and a second sub-blocking part, the first sub-blocking part is positioned on one side of the outlet or the inlet, which is close to the substrate, and the etching chamber is internally provided with the substrate; the transmission device is arranged below the substrate and comprises at least one first roller and at least one second roller, the diameter of the first roller is larger than that of the second roller, and the initial height of the top of the first roller is equal to that of the top of the first sub-blocking part. The etching device can avoid Mura generated in etching and improve the yield of products.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display, in particular to an etching device.
[ background of the invention ]
The manufacture of the display panel includes an etching process, wherein the etching process includes wet etching and dry etching, and the current wet etching mode includes a spraying mode, a soaking mode and a coating mode.
However, the sidewall of the etching chamber of the conventional etching apparatus is provided with a barrier, when the substrate enters the soaking mode from the spraying mode, the substrate needs to be moved into the etching chamber by the roller, and since the roller is located at a lower position, the barrier on the inlet side needs to be moved downward so that the roller can transfer the substrate into the etching chamber, and when the barrier on the inlet side moves downward, the liquid level of the etching solution in the etching chamber is lowered, so Mura is easily generated during etching, and the yield of products is reduced.
Therefore, there is a need to provide an etching apparatus to solve the problems of the prior art.
[ summary of the invention ]
The invention aims to provide an etching device which can improve the product yield.
To solve the above technical problem, the present invention provides an etching apparatus, comprising:
an etching chamber, wherein an etching solution is contained in the etching chamber; an inlet and an outlet are respectively arranged on two opposite side walls of the etching chamber, and the position of the outlet corresponds to the position of the inlet; the outlet and the inlet are both provided with a blocking part, the blocking part comprises a first sub-blocking part and a second sub-blocking part, the first sub-blocking part is positioned on one side of the outlet or the inlet, which is close to the substrate, and the etching chamber is internally provided with the substrate;
the spraying part is arranged above the etching chamber; the spraying part is used for spraying etching liquid to the substrate;
at least one liquid knife arranged between the spraying part and the substrate; the liquid knife is used for coating etching liquid on the substrate;
the transmission device is arranged below the substrate and comprises at least one first roller and at least one second roller, the diameter of the first roller is larger than that of the second roller, and the initial height of the top of the first roller is equal to that of the top of the first sub-blocking part.
The etching device comprises an etching chamber, wherein an inlet and an outlet are respectively arranged on two opposite side walls of the etching chamber, and the position of the outlet corresponds to the position of the inlet; the outlet and the inlet are both provided with a blocking part, the blocking part comprises a first sub-blocking part and a second sub-blocking part, the first sub-blocking part is positioned on one side of the outlet or the inlet, which is close to the substrate, and the etching chamber is internally provided with the substrate; the etching chamber contains etching solution; the spraying part is arranged at the top of the etching chamber; the spraying part is used for spraying etching liquid to the substrate; at least one liquid knife arranged between the spraying part and the substrate; the liquid knife is used for coating etching liquid on the substrate; the transmission device is arranged below the substrate and comprises at least one first roller and at least one second roller, the diameter of the first roller is larger than that of the second roller, the initial height of the top of the first roller is equal to that of the top of the first sub-blocking part, and due to the fact that the rollers with different diameters are arranged, and the initial height of the top of the roller with the larger diameter is equal to that of the top of the first sub-blocking part, the height of the blocking part does not need to be reduced when the substrate is moved, liquid level reduction of etching liquid is avoided, Mura is avoided being generated in etching, and product yield is improved.
[ description of the drawings ]
FIG. 1 is a schematic structural diagram of an etching apparatus according to the present invention in a first operation mode.
FIG. 2 is a schematic structural diagram of an etching apparatus according to the present invention in a second operation mode.
[ detailed description ] embodiments
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. In the present invention, directional terms such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", etc. refer to directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
As shown in fig. 1, an etching apparatus 100 of the present invention is a wet etching apparatus, and includes an etching chamber 10, a shower unit 20, a liquid knife 30, a substrate 40, and a transfer device.
The etching chamber 10 contains etching solution; an inlet 14 and an outlet 15 are respectively arranged on two opposite side walls of the etching chamber 10, and the position of the inlet 14 corresponds to the position of the outlet 15; i.e., wherein the etching chamber 10 comprises an upper portion 101 and a lower portion 102, wherein the upper portion 101 and the lower portion 102 are spaced apart. In one embodiment, the lower portion 102 contains an etching solution therein. Wherein a substrate 40 is disposed within the etching chamber 10. The bottom of the etching chamber 10 is provided with a liquid inlet 11 and a liquid outlet 12. Wherein the number of the liquid inlet 11 and the liquid outlet 12 can be one or more.
Wherein a blocking portion 70 is provided at both the outlet 15 and the inlet 14, wherein the blocking portion 70 is particularly provided outside a sidewall corresponding to the outlet 15 or the inlet 14. The barrier 70 includes a first sub-barrier 71 and a second sub-barrier 72. The first sub-barrier 71 is located on a side of the outlet 15 or the inlet 14 close to the substrate 40, that is, the first sub-barrier 71 is located below the outlet 15 or the inlet 14. For example, in the initial state, the first sub-barrier 71 and the corresponding second sub-barrier 72 are spaced, wherein the distance between the first sub-barrier 71 and the corresponding second sub-barrier 72 is equal to the width of the inlet or the outlet. In one embodiment, when the etching apparatus is in the second operation mode, such as the soaking mode, and the substrate 40 is transferred into the etching chamber 10, the first sub-barrier 71 and the second sub-barrier 72 on the corresponding side may also abut against each other, so that a closed space is formed between the upper portion 101 and the lower portion 102, and the etching solution may be filled in the whole etching chamber. It is understood that the first sub-barrier 71 and the corresponding second sub-barrier 72 may be continuously spaced.
The spraying part 20 is arranged above the etching chamber 10, namely, is positioned at the upper part 101; the shower unit 20 is used to shower an etching solution onto the substrate 40. Wherein the shower part 20 includes a shower pipe 21 and a plurality of spray nozzles 22 disposed below the shower pipe 21. Wherein the nozzles 22 are arranged in the axial direction of said shower 21.
The liquid knife 30 is arranged between the spraying part 20 and the substrate 40; the liquid knife 30 is used to apply an etching liquid to the substrate 40. In order to further improve the yield of etching, in one embodiment, the etching apparatus 100 includes two liquid knives 30, and the two liquid knives 30 are respectively located at two opposite sides of the substrate 40. Of course, it is understood that the number of the liquid knives 30 may be one or more than two.
The transmission device is arranged below the substrate 40, the transmission device comprises at least one first roller 50 and at least one second roller 60, and the diameter of the first roller 50 is larger than that of the second roller 60. The initial height of the top of the first roller 50 is equal to the initial height of the top of the first sub stopper 71.
Wherein, in one embodiment, the initial height of the top of the second roller 60 is less than the initial height of the top of the first roller 50. Wherein a difference between an initial height of the top of the second roller 60 and an initial height of the top of the first stopper 50 ranges from 0.1cm to 10 cm.
The etching apparatus further includes a first control module and a second control module (both not shown), the first control module is used for controlling the first roller 50 to rotate, and the second control module is used for controlling the second roller 60 to rotate.
When the etching apparatus 100 is in the first operating mode, the first roller 50 drives the substrate 40 to move back and forth in the horizontal direction, so as to move the substrate from the outside of the etching chamber to the inside of the etching chamber. The first mode of operation is, for example, a spray mode.
As shown in fig. 2, when the etching apparatus is in the second operation mode, the second roller 60 drives the substrate 40 to move back and forth in the horizontal direction. The second mode of operation is, for example, a soak mode.
In conjunction with fig. 1 and 2, during a particular operation, such as when a sensor detects that the substrate 40 is proximate to the etching chamber 10, the first roller 50 rotates to move the substrate 40 from the inlet 14 into the etching chamber 10. When the substrate 40 enters the etching chamber 10, the height of the first roller 50 is lowered, the second roller 60 starts to rotate, and the substrate 40 is driven by the second roller 60 to move back and forth in the horizontal direction. When the substrate 40 needs to be transferred out, the first roller 50 is lifted, and the substrate 40 is transferred out of the outlet 15 by the first roller 50. It will be appreciated that the remaining components operate on the same principle as in the prior art.
Because set up the gyro wheel that two kinds of diameters are different, and the initial height at the top of the great gyro wheel of diameter equals with the initial height at the top of first sub-stopper, consequently can need not reduce the height of stopper when removing the base plate, avoid the liquid level decline of etching solution, and then avoid producing Mura in the etching, improved the product yield.
The etching device comprises an etching chamber, wherein an inlet and an outlet are respectively arranged on two opposite side walls of the etching chamber, and the position of the outlet corresponds to the position of the inlet; the outlet and the inlet are both provided with a blocking part, the blocking part comprises a first sub-blocking part and a second sub-blocking part, the first sub-blocking part is positioned on one side of the outlet or the inlet, which is close to the substrate, and the etching chamber is internally provided with the substrate; the etching chamber contains etching solution; the spraying part is arranged at the top of the etching chamber; the spraying part is used for spraying etching liquid to the substrate; at least one liquid knife arranged between the spraying part and the substrate; the liquid knife is used for coating etching liquid on the substrate; the transmission device is arranged below the substrate and comprises at least one first roller and at least one second roller, the diameter of the first roller is larger than that of the second roller, the initial height of the top of the first roller is equal to that of the top of the first sub-blocking part, and due to the fact that the rollers with different diameters are arranged, and the initial height of the top of the roller with the larger diameter is equal to that of the top of the first sub-blocking part, the height of the blocking part does not need to be reduced when the substrate is moved, liquid level of etching liquid is prevented from falling, Mura is prevented from being generated in etching, and the product yield is improved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (9)
1. An etching apparatus, comprising:
an etching chamber, wherein an etching solution is contained in the etching chamber; an inlet and an outlet are respectively arranged on two opposite side walls of the etching chamber, and the position of the outlet corresponds to the position of the inlet; the outlet and the inlet are both provided with a blocking part, the blocking part comprises a first sub-blocking part and a second sub-blocking part, the first sub-blocking part is positioned below the outlet or the inlet, the second sub-blocking part is positioned above the outlet or the inlet, and a substrate is arranged in the etching chamber;
the spraying part is arranged above the etching chamber; the spraying part is used for spraying etching liquid to the substrate;
at least one liquid knife arranged between the spraying part and the substrate; the liquid knife is used for coating etching liquid on the substrate;
the transmission device is arranged below the substrate and comprises at least one first roller and at least one second roller, the diameter of the first roller is larger than that of the second roller, the initial height of the top of the first roller is equal to that of the top of the first sub-blocking part,
wherein the initial height of the top of the second roller is smaller than the initial height of the top of the first roller, and the first roller can be lifted.
2. The etching apparatus according to claim 1, wherein a difference between an initial height of the top of the second roller and an initial height of the first sub-stopper ranges from 0.1cm to 10 cm.
3. The etching apparatus of claim 1, wherein the first roller drives the substrate to move back and forth in a horizontal direction when the etching apparatus is in the first operating mode.
4. The etching apparatus of claim 1, wherein the second roller drives the substrate to move back and forth in a horizontal direction when the etching apparatus is in the second operating mode.
5. The etching apparatus of claim 4, wherein the first sub-barrier abuts the second sub-barrier on a corresponding side when the etching apparatus is in the second operation mode.
6. The etching apparatus according to claim 1, wherein the first sub-barrier and the second sub-barrier on the corresponding side are spaced apart from each other in an initial state.
7. The etching apparatus of claim 1, further comprising a first control module for controlling the first roller to rotate and a second control module for controlling the second roller to rotate.
8. The etching apparatus of claim 1, wherein the etching apparatus comprises two liquid knives, the two liquid knives being located on opposite sides of the substrate.
9. The etching apparatus according to claim 1, wherein the shower portion includes a shower pipe and a plurality of nozzles disposed below the shower pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910416261.4A CN110190011B (en) | 2019-05-16 | 2019-05-16 | Etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910416261.4A CN110190011B (en) | 2019-05-16 | 2019-05-16 | Etching device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110190011A CN110190011A (en) | 2019-08-30 |
| CN110190011B true CN110190011B (en) | 2021-10-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910416261.4A Active CN110190011B (en) | 2019-05-16 | 2019-05-16 | Etching device |
Country Status (1)
| Country | Link |
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| CN (1) | CN110190011B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101296659B1 (en) * | 2008-11-14 | 2013-08-14 | 엘지디스플레이 주식회사 | Washing device |
| CN102610486A (en) * | 2011-01-24 | 2012-07-25 | 均豪精密工业股份有限公司 | Continuous type semiconductor etching device and continuous type semiconductor etching method |
| CN103928371A (en) * | 2014-04-17 | 2014-07-16 | 京东方科技集团股份有限公司 | Wet etching equipment |
| CN104617018B (en) * | 2015-01-23 | 2017-07-11 | 深圳市华星光电技术有限公司 | A kind of substrate board treatment and substrate processing method using same |
| CN107316826B (en) * | 2017-06-09 | 2020-01-31 | 深圳市华星光电技术有限公司 | Wet etching equipment |
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- 2019-05-16 CN CN201910416261.4A patent/CN110190011B/en active Active
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| Publication number | Publication date |
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| CN110190011A (en) | 2019-08-30 |
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant after: TCL Huaxing Photoelectric Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
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