CN110189650A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN110189650A CN110189650A CN201910455838.2A CN201910455838A CN110189650A CN 110189650 A CN110189650 A CN 110189650A CN 201910455838 A CN201910455838 A CN 201910455838A CN 110189650 A CN110189650 A CN 110189650A
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- metal frame
- display panel
- display
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- infrared radiating
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a kind of display module and display device, including display panel, positioned at the backlight module of display panel incident side, flexible circuit board and driving chip；Wherein, flexible circuit board includes first and second, and first connect with display panel, and driving chip is set to second；Backlight module includes metal frame and optical diaphragm, and metal frame is located at side of the optical diaphragm far from display panel；Second is bent to side of the metal frame far from display panel；Surface of the metal frame far from display panel side includes first area, and on the direction perpendicular to display panel, orthographic projection of the driving chip in metal frame is located in first area；Surface of the metal frame far from display panel side is provided with infrared radiating coating in first area, and the pyroconductivity of infrared radiating coating is more than or equal to 3000W/ (mK), and the thermal emissivity rate of infrared radiating coating is more than or equal to 0.9.The present invention can improve backlight module heat dissipation, promote the display effect of display module.
Description
[technical field]
The present invention relates to technical field more particularly to a kind of display module and including the display device of the display module.
[background technique]
With the continuous development of display technology, the display screen of narrow frame is by consumers, in order to realize narrow lower frame
Design, existing comprehensive screen display display screen use COF (Chip in driving chip (Integrated Circuit, IC) terminals side
FPC) technology, that is, by driving chip binding (Bonding) flexible circuit board (Flexible Printed Circuit,
FPC it on), compared to COG (Chip on Glass, i.e., the be directly bound driving chip on the glass substrate) technology of use, uses
COF technology without being arranged driving chip binding region on a display panel, it is thus possible to reduce the following width of frame of display panel,
Correspondingly, the lower frame of display module can also reduce.
However, need to turn down flexible circuit board to backlight module the side for deviating from display panel using COF technology, driving
The heat dissipation performance of chip is easily caused to show bad problem by strong influence.
[summary of the invention]
In order to solve the above technical problem, the present invention provides a kind of display module and the display including the display module fills
It sets.
In a first aspect, the embodiment of the present invention provides a kind of display module, including display panel, enter positioned at the display panel
The backlight module of light side, flexible circuit board and driving chip；Wherein, the flexible circuit board includes first and second,
Described first connect with the display panel, and the driving chip is set to described second；The backlight module includes gold
Belong to framework and optical diaphragm, the metal frame are located at side of the optical diaphragm far from the display panel；Described second
Portion is bent to side of the metal frame far from the display panel；The metal frame is far from the display panel side
Surface includes first area, and on the direction perpendicular to the display panel, the driving chip is in the metal frame
Orthographic projection is located in the first area.Surface of the metal frame far from the display panel side is in the first area
It is provided with infrared radiating coating, the pyroconductivity of the infrared radiating coating is more than or equal to 3000W/ (mK), and described infrared
The thermal emissivity rate of radiation coating is more than or equal to 0.9.
Second aspect, the embodiment of the present invention also provide a kind of display device, including show provided by above-mentioned first aspect
Mould group.
Compared with prior art, display module and display device provided in an embodiment of the present invention will be soft using COF technology
Second of property circuit board is bent to side of the metal frame far from display panel of backlight module, and driving chip is set to this
Second, and the region coating one of driving chip position is corresponded in metal frame far from the surface of display panel side
The pyroconductivity of layer infrared radiating coating, the infrared radiating coating is more than or equal to 3000W/ (mK), and the infrared radiating coating
Thermal emissivity rate be more than or equal to 0.9, this infrared radiating coating can be by the heat at driving chip position rapidly in metal frame
It is conducted on surface, and this infrared radiating coating has superpower heat-radiating properties, additionally it is possible to convert heat into far red light
Can, to external radiation, to be effectively improved the heat-sinking capability of backlight module, realizes cooling, promote the display effect of display module.
[Detailed description of the invention]
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this field
For those of ordinary skill, without creative efforts, it can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is a kind of schematic top plan view of display module provided in an embodiment of the present invention；
Fig. 2 is a kind of schematic cross-sectional view in Fig. 1 along the direction AA '；
Fig. 3 is the structural schematic diagram of the metal frame of uncoated infrared radiating coating in the embodiment of the present invention；
Fig. 4 is other regions packet in the embodiment of the present invention on the basis of Fig. 3 to metal frame in addition to first area
Structural schematic diagram after covering material cladding；
Fig. 5 is to be coated with the structure of the metal frame after infrared radiating coating in the embodiment of the present invention on the basis of fig. 4 to show
It is intended to；
Fig. 6 is the structural schematic diagram for removing the metal frame after covering material in the embodiment of the present invention on the basis of Fig. 5；
Fig. 7 is the radiating principle schematic diagram that metal frame is not coated with infrared radiating coating；
Fig. 8 is the radiating principle schematic diagram after metal frame coating infrared radiating coating；
Fig. 9 is the schematic top plan view of another display module provided in an embodiment of the present invention；
Figure 10 is that the vertical view of the metal frame after another coating infrared radiating coating provided in an embodiment of the present invention is shown
It is intended to.
Figure 11 is the schematic top plan view of another display module provided in an embodiment of the present invention；
Figure 12 is a kind of schematic diagram of display device provided in an embodiment of the present invention.
[specific embodiment]
For a better understanding of the technical solution of the present invention, being retouched in detail to the embodiment of the present invention with reference to the accompanying drawing
It states.
It will be appreciated that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
Its embodiment, shall fall within the protection scope of the present invention.
The term used in embodiments of the present invention is only to be not intended to be limiting merely for for the purpose of describing particular embodiments
The present invention.In the embodiment of the present invention and the "an" of singular used in the attached claims, " described " and "the"
It is also intended to including most forms, unless the context clearly indicates other meaning.
It should be appreciated that term "and/or" used herein is only a kind of incidence relation for describing affiliated partner, indicate
There may be three kinds of relationships, for example, A and/or B, can indicate: individualism A, exist simultaneously A and B, individualism B these three
Situation.In addition, character "/" herein, typicallys represent the relationship that forward-backward correlation object is a kind of "or".
It will be appreciated that though device may be described in embodiments of the present invention using term first, second etc., but these
Device should not necessarily be limited by these terms.These terms are only used to for device being distinguished from each other out.For example, not departing from the embodiment of the present invention
In the case where range, first device can also be referred to as second device, and similarly, second device can also be referred to as the first dress
It sets.
As described in background technology part, need to turn down flexible circuit board to backlight module away from aobvious using COF technology
Show the side of panel, the heat dissipation performance of driving chip is easily caused to show bad problem by strong influence.For example, showing
Under mould group working condition, the temperature of driving chip can reach 42.5 DEG C；And with the light-emitting diodes in backlight module in lamp bar
It manages (Light Emitting Diode, LED) granule number to increase, lamp bar temperature can reach 50.5 DEG C, these heats can also transmit
To driving chip position, so that driving chip temperature is excessively high, so that display module can have that ghost does not work when showing,
Display picture normally can not effectively switch.For another example, under the reliability test environment of display module, driving chip temperature, lamp
Temperature and test temperature collective effect, or even can be more than 85 DEG C of heat resisting temperature of optical film material in backlight module, this will
Cause optical film material fold, display module will be unable to normally show.
In view of this, the embodiment of the present invention provides a kind of display module, which includes display panel, is located at display
The backlight module of panel incident side, flexible circuit board and driving chip.Wherein, flexible circuit board includes first and second
Portion, first connect with display panel, and driving chip is set to second；Backlight module includes metal frame and optical diaphragm,
Metal frame is located at side of the optical diaphragm far from display panel；Second be bent to metal frame far from display panel one
Side；Surface of the metal frame far from display panel side includes first area, on the direction perpendicular to display panel, drives core
Orthographic projection of the piece in metal frame is located in first area.Surface of the metal frame far from display panel side is in first area
It is provided with infrared radiating coating, the pyroconductivity of infrared radiating coating is more than or equal to 3000W/ (mK), and infrared radiant material
Thermal emissivity rate be more than or equal to 0.9.
It please refer to Fig. 1 and Fig. 2, wherein Fig. 1 is a kind of vertical view signal of display module provided in an embodiment of the present invention
Figure, Fig. 2 is a kind of schematic cross-sectional view in Fig. 1 along the direction AA '.For ease of understanding, Fig. 1 and Fig. 2 merely illustrate display module
Part-structure.The display module includes display panel 100, positioned at the backlight module 200 of 100 incident side of display panel, flexible electrical
Road plate 300 and driving chip 400；Wherein, flexible circuit board 300 include first 300a and second 300b, first
300a is connect with display panel 100, and driving chip 400 is set to second 300b, and in Fig. 1, driving chip 400 is located at dotted line
In the region that frame M is outlined；Backlight module 200 includes metal frame 210 and optical diaphragm 220, and metal frame 210 is located at optical film
Side of the piece 220 far from display panel 100；Second 300b is bent to side of the metal frame 210 far from display panel 100；
Surface of the metal frame 210 far from 100 side of display panel includes first area 2101, and first area 2101 is located in Fig. 2
In the region that dotted line frame E is outlined；On the direction z perpendicular to display panel 100, driving chip 400 is in metal frame 210
Orthographic projection is located in first area 2101；Surface of the metal frame 210 far from 100 side of display panel is in first area 2101
It is provided with infrared radiating coating 211, the pyroconductivity of infrared radiating coating 211 is more than or equal to 3000W/ (mK), and infrared spoke
The thermal emissivity rate for penetrating coating 211 is more than or equal to 0.9.
Compared with prior art, display module provided in an embodiment of the present invention, using COF technology, by flexible circuit board 300
Second 300b be bent to the metal frame 210 of backlight module 200 far from the side of display panel 100, and driving chip 400
It is set to second 300b of flexible circuit board 300, and on surface pair of the metal frame 210 far from 100 side of display panel
The region of 400 position of driving chip is answered, i.e. first area 2101 is coated with one layer of infrared radiating coating 211, the infrared spoke
The pyroconductivity for penetrating coating 211 is more than or equal to 3000W/ (mK), and the thermal emissivity rate of the infrared radiating coating 211 is more than or equal to
0.9, this infrared radiating coating 211 can be by the heat of 400 position of driving chip rapidly on 210 surface of metal frame
Conduction, and this infrared radiating coating 211 also has superpower heat-radiating properties, can convert heat into far red light energy,
To external radiation, to be effectively improved the heat-sinking capability of backlight module, realizes cooling, promote the display effect of display module.
It should be noted that the definition of pyroconductivity is unit section, the material of length is under the unit temperature difference and when unit
The interior heat directly conducted.The thermal emissivity rate of object is equal to black under the energy and same temperature that object radiates at a certain temperature
The ratio between body radiation energy.The radiance of black matrix is equal to 1, and the radiance of other objects is between 0 and 1.When display module works,
Actually wish that the temperature of backlight module is no more than 40 DEG C, certainly, the temperature of general backlight module is not above 100 DEG C again.Therefore,
In embodiment of the present invention, temperature model of the infrared radiating coating 211 being more than or equal to 40 DEG C and less than or equal to 100 DEG C can be chosen
Thermal emissivity rate in enclosing can be more than or equal to 0.9, to guarantee the performance of its heat loss through radiation.
In general, the main material of metal frame is iron, it is generally (also signable to be using stainless steel, such as 304 stainless steels
06Cr19Ni10 or SUS304 needs to meet nickel content greater than 8%, and chromium content is greater than the 18%) heat radiation of 304 stainless steels
Rate only has 0.05 or so.The thermal emissivity rate of copper also only has 0.05 or so.The pyroconductivity of graphite flake 300~1500W/mK it
Between.It is known that the heat-conductive characteristic or heat-radiating properties of metal frame itself or other common materials are all weaker, Wu Fayou
The heat dissipation of effect ground.
In a kind of optional embodiment, infrared radiating coating 211 includes infra-red radiation nano material, such as infrared
Radiation coating 211 mixes carbon nanotube, so that infrared radiating coating 211 meets pyroconductivity and is more than or equal to 3000W/ (mK),
And thermal emissivity rate is more than or equal to 0.9, so as to be effectively improved the heat-sinking capability of backlight module.
Further, in order to continue to lift up the heat-radiating properties of infrared radiating coating 211, infrared radiating coating 211 may be used also
To include spinelle.Spinelle is the mineral of magnesium aluminum oxide composition, and chemical molecular formula can be expressed as (Mg, Fe, Zn, Mn)
(Al, Cr, Fe)2O4.Increase spinelle as compound infrared radiating body, thermal emissivity rate can achieve 0.93 or more, or even close
The thermal emissivity rate of black matrix.Therefore it can convert heat into far red light energy with superpower heat-radiating properties, to external radiation,
Effectively heat dissipation.
On the basis of the respective embodiments described above, on the direction z perpendicular to display panel 100, infrared radiating coating 211
Thickness be more than or equal to 10nm and be less than or equal to 15nm.To the thickness of infrared radiating coating 211 carry out certain limitation be due to
If the thickness of infrared radiating coating 211 is too small, the ability of its heat dissipation will affect；If the thickness of infrared radiating coating 211
It is too big, and will increase the thickness of display module, do not meet the lightening trend of display module.Therefore, infrared radiating coating is set
211 thickness on the direction z perpendicular to display panel 100 is more than or equal to 10nm and is less than or equal to 15nm.
Next the process of coating infrared radiating coating 211 is described.Fig. 3-Fig. 6 is please referred to, Fig. 3 is that the present invention is real
The structural schematic diagram of the metal frame of uncoated infrared radiating coating in example is applied, Fig. 4 is the basis in the embodiment of the present invention in Fig. 3
On other regions of metal frame in addition to first area are coated with covering material after structural schematic diagram, Fig. 5 is of the invention real
The structural schematic diagram for being coated with the metal frame after infrared radiating coating in example on the basis of fig. 4 is applied, Fig. 6 is the embodiment of the present invention
The structural schematic diagram of the metal frame after covering material is removed on the basis of middle Fig. 5.It is coated with the process tool of infrared radiating coating 211
Body includes the following steps.Step 1: as shown in figure 3, providing a metal frame 210；Step 2: as shown in figure 4, to metal frame
210 other regions in addition to first area 2101 are coated using covering material 212, the effect of covering material 212 herein
It is to be blocked to the region for not needing coating infrared radiating coating 211 in metal frame 210, prevents subsequent coating infra-red radiation
Be applied to when coating in the region that should not be coated with, embodiment of the present invention to its specific material without limitation；Step 3: such as Fig. 5 institute
Show, is coated with infrared radiating coating 211 in the first area of metal frame 210 2101；Step 4: as shown in fig. 6, removing above-mentioned packet
Material 212 is covered, the metal frame 210 after being coated with infrared radiating coating 211 and removing covering material 212, the metal frame are obtained
Body 210 is the metal frame for assembling the backlight module 200 of embodiment of the present invention.In Fig. 3, Fig. 4, Fig. 5 and Fig. 6, a table
Show the inside of metal frame, i.e., subsequent to be assembled into after backlight module close to the side of optical film material, b indicates the outer of metal frame
Side, i.e., the subsequent side far from optical film material after being assembled into backlight module.
It continues to refer to figure 1 and Fig. 2, backlight module 200 further includes light-emitting diode light bar 230, light-emitting diode light bar 230
Positioned at metal frame 210 in the side of display panel 100, Fig. 1, light-emitting diode light bar 230 is located at dotted line frame N and outlines
Region in；On the direction z perpendicular to display panel 100, positive throwing of the light-emitting diode light bar 230 in metal frame 210
Shadow is located in first area 2101.When display module works, the light emitting diode on light-emitting diode light bar 230 needs lasting hair
Light can constantly generate heat, and therefore, the temperature of 230 position of light-emitting diode light bar also can be relatively high.So setting shines
Diode light bar 230 is located in first area 2101 in the orthographic projection in metal frame 210, so that the heat that light emitting diode generates
Heat-radiation heat-dissipating can also be conducted rapidly by infrared radiating coating 211 and be passed through to amount, so as to be effectively improved dissipating for backlight module
Thermal energy power.
Further, as shown in Fig. 2, driving chip 400 is located at second 300b of flexible circuit board 300 close to display surface
The side of plate 100, therefore, driving chip 400 are the equal of being located next to metal frame 210, it is easier to by backlight module
The influence of 200 fevers.The embodiment of the present invention can effectively radiate by coating infrared radiating coating 211, prevent driving chip
400 long-times are in high temperature and influence display effect.
In order to be more convenient for understanding, next describe to increase the substantially original that infrared radiating coating 211 can effectively radiate
Reason.Please refer to Fig. 7 and Fig. 8, wherein Fig. 7 is the radiating principle schematic diagram that metal frame is not coated with infrared radiating coating, and Fig. 8 is
Metal frame is coated with the radiating principle schematic diagram after infrared radiating coating.For ease of understanding, Fig. 7 and Fig. 8 simply show portion
Separation structure.As shown in fig. 7, driving chip 400 ' is located at side of the flexible circuit board 300 ' close to metal frame 210 '.Work as metal
Framework 210 ' is not coated with infrared radiating coating, and light-emitting diode light bar 230 ' is main other than driving chip 400 ' itself
Pyrotoxin, the heat issued are transmitted to 400 ' side of driving chip.Closely due to driving chip 400 ' and metal frame 210 '
, the space between flexible circuit board 300 ' and metal frame 210 ' is also very narrow, therefore in heat dissipation direction substantially diagram
From the bottom up, radiating rate is very slow, and driving chip 400 ' may be for a long time in high temperature.And in Fig. 8, in metal frame
Infrared radiating coating 211 is coated on 210, due to its excellent heat-conductive characteristic and heat-radiating properties, heat dissipation direction in addition to from
Under it is up outer, moreover it is possible to continue to radiate toward the right and left, heat is conducted in infrared radiating coating 211 rapidly from inside to outside, and by heat
Infrared luminous energy (wavelength is generally 1um-13.5um) is converted into the narrow sky between flexible circuit board 300 and metal frame 210
Between radiate, radiating rate is more faster than common heat transfer, thermal convection, thus realize by backlight module amount of localized heat pass through hot spoke
Penetrate rapid cooling.
Optionally, with continued reference to Fig. 2, display module further includes second 300b positioned at flexible circuit board 300 close to aobvious
Show that the foam 500 of 100 side of panel, foam 500 surround driving chip 400；Foam 500 can be double faced adhesive tape, can bond
Flexible circuit board 300 and metal frame 210, and foam 500 has certain thickness and elasticity, can be supported in flexible circuit
Between plate 300 and metal frame 210, driving chip 400 is prevented to be squeezed.In addition, may be used also to protect driving chip 400
Can be the materials such as resin on the surface of driving chip 400 and/or side filling protection sealing 600, the protection sealing 600.
In order to preferably enhance heat-sinking capability, 400 long-time of driving chip is prevented to be in high temperature, can be further disposed at perpendicular to
On the direction z of display panel 100, foam 500 is located in first area 2101 in the orthographic projection in metal frame 210.In addition, being
The structure of protection driving chip 400, herein can also be in side of the flexible circuit board 300 far from backlight module 200 and correspondence
Reinforced structure (not shown) is set in the position where driving chip 400, the reinforced structure is relative to flexible circuit board 300
It is harder, to play the role of support and protection.
Please continue to refer to Fig. 1 and Fig. 2, infrared radiating coating 211 includes the first side being oppositely arranged on x in a first direction
A short side of 211a and the second side 211b, the first side 211a and surface of the metal frame 210 far from 100 side of display panel
210a flushes that (surface of the metal frame 210 far from 100 side of display panel is a rectangle or similar rectangular shape, such as Fig. 1 institute
The round rectangle shown), wherein the long side 210b of first direction x and surface of the metal frame 210 far from 100 side of display panel
Extending direction it is parallel.On this basis, in a first direction on x, first in 211a and second the distance between 211b D1 it is big
In 1/3 of the length L equal to long side 210b, to guarantee the heat-sinking capability of backlight module 200 rapidly and efficiently.Certainly, for the ease of
It is coated with infrared radiating coating 211, it can be side and first of second 300b far from the first side 211a to be arranged on x in a first direction
The distance between 211b and the first side 211a D1 when the distance between 211a D2 is less than second.
Referring to FIG. 9, Fig. 9 is the schematic top plan view of another display module provided in an embodiment of the present invention, along the side AA '
To schematic cross-sectional view it is similar with Fig. 2, therefore no longer show herein.It is identical with display module shown in fig. 1 in present embodiment
Place repeats no more, the difference is that, flexible circuit board 300 further includes third portion 300c, and third portion 300c is located at second
The side of first side 211a of the 300b far from infrared radiating coating 211 is simultaneously fixed with 210 phase of metal frame.As shown in figure 9, third
Portion 300c is usually generally in strip, the extending direction of the strip substantially first direction x.The heat of backlight module 200
Amount is generally focused on second region 300b of flexible circuit board 300.Therefore, it can be set second on x in a first direction
Portion 300b far from first when the side of 211a is with first the distance between 211a D2 less than second in 211b and first while 211a
The distance between D1.
Referring to FIG. 10, Figure 10 is the metal frame after another coating infrared radiating coating provided in an embodiment of the present invention
Schematic top plan view.Something in common in present embodiment, with the metal frame of display module shown in other embodiments
It repeats no more, the difference is that, infrared radiating coating 211 is generally shaped like I-shaped.Specifically, infrared spoke is being set
When penetrating coating 211, shape can be carried out according to the temperature height distribution situation of metal frame 210 under display module working condition and set
Meter.Inventor has found that " work " word is generally presented in the high-temperature area of metal frame 210 under display module working condition by test
Shape, therefore, it is I-shaped that first area 2101, which can be set, the high-temperature region of metal frame 210 under display module working condition
Domain is located in first area 2101, the shape of the infrared radiating coating 211 of coating also substantially I-shaped.Specifically, first
Region 2101 includes the first subregion 2101a, the second subregion 2101b and third subregion 2101c, the second subregion 2101b
Between the first subregion 2101a and third subregion 2101c, on second direction y, the length of the first subregion 2101a
The length L3 of L1 and third subregion 2101c are all larger than the length L2, the first subregion 2101a, second of the second subregion 2101b
Subregion 2101b and third subregion 2101c together form I-shaped；Wherein, second direction y and metal frame 210 are remote
The extending direction of the short side 210a on the surface from 100 side of display panel is parallel.As needed for coating infrared radiating coating 211
Material typically cost is relatively high, expensive, and the shape of setting dispensing area in this way can save needed for infrared radiating coating 211
Material, reduce the cost of manufacture of display module.
Figure 11 is please referred to, Figure 11 is the schematic top plan view of another display module provided in an embodiment of the present invention, along AA '
The schematic cross-sectional view in direction is similar with Fig. 2, therefore no longer shows herein.Phase in present embodiment, with display module shown in fig. 1
It is repeated no more with place, the difference is that, it is recessed that metal frame 210 is provided with one on the edge far from 2101 side of first area
To the notch P inside metal frame 210, notch P is correspondingly arranged with the notch on display panel, for placing camera shooting
The devices such as head, earpiece, details are not described herein again.
It is understood that further include other the necessary structures for being assembled into display module in the various embodiments described above of the present invention,
It can also include the fixed double-sided glue between second 300b and metal frame 210 of flexible circuit board 300 by taking Fig. 2 as an example
700, for fixing flexible circuit board 300 and metal frame 210.And the outer edge of metal frame 210 would generally be to close to display
To form accommodating space, display module can also include in the accommodating space of metal frame 210 for the side bending of panel 100
Glue frame 240.Optical film material 220 can specifically include reflector plate 221, light guide plate 222, the first diffusion sheet 223, brightness enhancement film 224
With the structures such as the second diffusion sheet 225, also it is not limited thereto certainly, the present invention is not especially limited this, these optical film materials
220 also are located in the accommodating space of metal frame 210.
Display panel 100 then includes the first polaroid 130 set gradually, array substrate 110, counter substrate 120 and the
Two polaroids 140 are additionally provided with liquid crystal layer (not shown), flexible electrical between certain array substrate 120 and counter substrate 140
First 300a of road plate 300 is electrically connected in the array substrate 110 of display panel 100.There is array in array substrate 110
The sub-pixel of arrangement is provided with thin film transistor (TFT) and pixel electrode, grid and the grid line electricity of thin film transistor (TFT) in each sub-pixel
Connection, source electrode are electrically connected with data line, and drain electrode is electrically connected with pixel electrode, and grid line is used for transmission scanning signal, i.e. film crystal
The control signal of pipe, data line are used for transmission data-signal, i.e. pixel voltage signal needed for pixel electrode；Array substrate or
Public electrode is additionally provided in counter substrate.When display module works, backlight module provides backlight to display panel, in correspondence
Grid line control under, the corresponding data line of the source electrode of thin film transistor (TFT) is by thin film transistor (TFT) to the corresponding pixel electrode of draining
Implement charge and discharge, forms electric field between pixel electrode and public electrode, pass through the electric field control between pixel electrode and public electrode
The deflection of liquid crystal molecule processed, to reach display function.
Cover sheet 900, display panel 100 and guarantor can also be arranged in side of the display panel 100 far from backlight module 200
It can be bonding by optical cement 800 between protecting cover plate 900.
Certainly, also there is no it is shown in fig. 2, details are not described herein again there are also part-structure for display module.
Based on the same inventive concept, the embodiment of the invention also provides a kind of display device, Figure 12 is the embodiment of the present invention
A kind of structural schematic diagram of the display device provided, with reference to Figure 12, which includes any of the above-described embodiment of the present invention
The display module 1000 of offer.In present embodiment, which is mobile phone, in other optional embodiments of the invention
In, which can also be that tablet computer, notebook etc. arbitrarily have the equipment of display function.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent substitution, improvement and etc. done be should be included within the scope of the present invention.
Claims (12)
1. a kind of display module characterized by comprising display panel, positioned at the backlight module of the display panel incident side,
Flexible circuit board and driving chip；Wherein,
The flexible circuit board includes first and second, and described first connect with the display panel, the driving core
Piece is set to described second；
The backlight module includes metal frame and optical diaphragm, and the metal frame is located at the optical diaphragm far from described aobvious
Show the side of panel；
Described second is bent to side of the metal frame far from the display panel；
Surface of the metal frame far from the display panel side includes first area, perpendicular to the display panel
On direction, the driving chip is located in the first area in the orthographic projection in the metal frame；
The metal frame is provided with infrared radiating coating in the first area far from the surface of the display panel side,
The pyroconductivity of the infrared radiating coating is more than or equal to 3000W/ (mK), and the thermal emissivity rate of the infrared radiating coating is big
In equal to 0.9.
2. display module according to claim 1, which is characterized in that the infrared radiating coating includes carbon nanotube.
3. display module according to claim 2, which is characterized in that the infrared radiating coating further includes spinelle.
4. display module according to claim 1 to 3, which is characterized in that on the direction perpendicular to the display panel,
The thickness of the infrared radiating coating is more than or equal to 10nm and is less than or equal to 15nm.
5. display module according to claim 1, which is characterized in that the backlight module further includes LED light lamp
Item, the light-emitting diode light bar are located at the metal frame close to the side of the display panel；
On the direction perpendicular to the display panel, orthographic projection position of the light-emitting diode light bar in the metal frame
In in the first area.
6. display module according to claim 1, which is characterized in that the driving chip is located at described second close to institute
State the side of display panel.
7. display module according to claim 6, which is characterized in that further include being located at described second close to the display
The foam of panel side, the foam surround the driving chip；
On the direction perpendicular to the display panel, orthographic projection of the foam in the metal frame is located at described first
In region.
8. display module according to claim 1, which is characterized in that the infrared radiating coating includes in a first direction
First be oppositely arranged while and when second, first side and surface of the metal frame far from the display panel side
Short side flushes, wherein the long side on surface of the first direction with the metal frame far from the display panel side is prolonged
It is parallel to stretch direction.
9. display module according to claim 8, which is characterized in that in said first direction, first side and institute
State the distance between second side is more than or equal to the length of the long side 1/3.
10. display module according to claim 8, which is characterized in that the flexible circuit board further includes third portion, described
Third portion is located at described second side far from first side and fixes with the metal frame；
In said first direction, described second far from described first while side with described first while the distance between be less than
Described second the distance between while with described first.
11. display module according to claim 8, which is characterized in that the first area be I-shaped, described first
Region include the first subregion, the second subregion and third subregion, second subregion be located at first subregion with
Between the third subregion, in a second direction, the length of the length of first subregion and the third subregion is equal
Greater than the length of second subregion；
Wherein, the extending direction of the short side on the second direction and surface of the metal frame far from the display panel side
In parallel.
12. a kind of display device, which is characterized in that including such as described in any item display modules of claim 1-11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910455838.2A CN110189650A (en) | 2019-05-29 | 2019-05-29 | Display module and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910455838.2A CN110189650A (en) | 2019-05-29 | 2019-05-29 | Display module and display device |
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Family
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| CN201910455838.2A Pending CN110189650A (en) | 2019-05-29 | 2019-05-29 | Display module and display device |
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| CN114077079A (en) * | 2020-08-19 | 2022-02-22 | 苹果公司 | Display panel bend stiffener |
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