CN110184595A - A kind of phosphor-copper bar brightening liquid - Google Patents
A kind of phosphor-copper bar brightening liquid Download PDFInfo
- Publication number
- CN110184595A CN110184595A CN201910577363.4A CN201910577363A CN110184595A CN 110184595 A CN110184595 A CN 110184595A CN 201910577363 A CN201910577363 A CN 201910577363A CN 110184595 A CN110184595 A CN 110184595A
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- CN
- China
- Prior art keywords
- phosphor
- copper bar
- acid
- brightening liquid
- added
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
Abstract
The present invention relates to a kind of phosphor-copper bar brightening liquid and preparation method thereof.The present invention consists of the following mass percentage components: the water-based thickener 2%-4% after sulfuric acid 8.0%-12.0%, hydrogen peroxide 63.0%-65.0%, organic acid 6.0%-8.0%, ethylene glycol 3.0%-5.0%, benzotriazole 3.0%-5.0%, OP-10 surfactant 7.0%-9.0%, activation.The comprehensive performances such as brightening liquid oil removing of the invention, derusting, passivation can make rapidly phosphorous copper balls to be electroplated clean bright；It is nontoxic, pollution-free and can be operated at normal temperature.
Description
Technical field
The present invention relates to a kind of phosphor-copper bar brightening liquid and preparation method thereof.
Background technique
It is further stringent to the requirement of quality of coating in electroplating industry with the development of electroplating technology, crystallite phosphorus-copper anode matter
The quality of amount plays very important effect to the raising of plating solution performance and electroplating quality.Crystallite phosphorus-copper anode is texture knot
Structure passes through the crystallite state copper ball of controlled micro crystallization treatment process, changes the texture structure of metal, improves the fortune of crystal molecule
Kinetic force and diffusivity；The anodic phosphorous copper film of crystal grain refinement adapts to PCB electroplating technology requirement copper-base surface layer in actual production
It is uniformly dissolved, copper particles from getting loose phenomenon caused by being reduced to a greater extent because of copper ball dissolution unevenness, to improve the utilization of copper
Rate.Reduce cupprous generation, not only improved quality of coating but also increase anode utilization rate effectively improve plating plate quality.But corrode
Phenomenon is ubiquitous, it is annual therefore caused by waste of material and economic loss it is inestimable.The corrosion and protection problem of phosphorous copper balls
Temperature is also gradually increasing.The first hot alkali degreasing of traditional coating protection technique, acid pickling and rust removing after washing, not only complex process,
It is seriously polluted, and efficiency is extremely low, and there is also the wastes of industrial chemicals and the energy.F in some treatment fluids-, NO2-, Cr3+Etc. toxicity
Ion component complicated difficult remains problem to handle.
Summary of the invention
In order to solve the problems in the prior art, the purpose of the present invention is to provide a kind of phosphor-copper bar brightening liquid of Effictive nuisancelless
And preparation method thereof.
The specific technical solution of the present invention is as follows:
A kind of phosphor-copper bar brightening liquid, consists of the following mass percentage components:
Sulfuric acid 8.0%-12.0%, hydrogen peroxide 63.0%-65.0%, organic acid 6.0%-8.0%, ethylene glycol 3.0%-5.0%, three nitrogen of benzo
Water-based thickener 2%-4% after azoles 3.0%-5.0%, OP-10 surfactant 7.0%-9.0%, activation；
Specifically, the organic acid is citric acid, acetic acid or 1-hydroxy ethylidene-1,1-diphosphonic acid.
A method of preparing above-mentioned phosphor-copper bar brightening liquid, comprising the following steps: quality percentage according to claim 1
Than weighing dosage of each component, hydrogen peroxide being added in bright dipped finish slot, sequentially adds organic acid, ethylene glycol, three nitrogen of benzo
Azoles is slowly added to the concentrated sulfuric acid while stirring, and water-based thickener is added when temperature is down to 20-30 DEG C while stirring, obtains brightener.
The invention has the following advantages:
The comprehensive performances such as brightening liquid oil removing of the invention, derusting, passivation can make rapidly phosphorous copper balls to be electroplated clean bright；Nontoxic,
It is pollution-free and can be operated at normal temperature；The preparation method of brightening liquid solves hydrogen peroxide concentration Gao Shiyi decomposition, reaction rate
The problems such as being unable to control, makes that the operation is more convenient.
Using brightening liquid of the invention treated phosphor-copper bar, exquisite appearance is bright, and no peeling tail and recess etc. do not conform to
Lattice product, will not chemical residue cleaning materials pollution plating system solution, influence electro-coppering product quality, phosphor-copper bar compact crystallization rule
Whole, uniform small grains, segregation-free phenomenon, P elements are evenly distributed, phosphorus content deviation < 0.0030%, and when plating can express delivery shape
At uniformly fine and closely woven Cu3P black film guarantees that copper ion release uniform and stable and black film are not fallen off for a long time, it is ensured that electro-coppering produces
Quality.
Specific embodiment
Embodiment 1
A kind of phosphor-copper bar brightening liquid, consists of the following mass percentage components:
Sulfuric acid 8.0%, hydrogen peroxide 65%, citric acid 7.0%, ethylene glycol 5.0%, benzotriazole 4.0%, OP-10 surfactant
8.0%, the water-based thickener 3.0% after activating.
The method of above-mentioned phosphor-copper bar brightening liquid, comprising the following steps: mass percent according to claim 1 weighs
Hydrogen peroxide is added in bright dipped finish slot in dosage of each component, sequentially adds organic acid, ethylene glycol, benzotriazole, slowly adds
Enter the concentrated sulfuric acid while stirring, water-based thickener is added when temperature is down to 25 DEG C while stirring, obtains brightener.
Embodiment 2
A kind of phosphor-copper bar brightening liquid, consists of the following mass percentage components:
Sulfuric acid 12.0%, hydrogen peroxide 63%, acetic acid 6.0%, ethylene glycol 4.0%, benzotriazole 4.0%, OP-10 surfactant
8.0%, the water-based thickener 3.0% after activating.
The method of above-mentioned phosphor-copper bar brightening liquid, comprising the following steps: mass percent according to claim 1 weighs
Hydrogen peroxide is added in bright dipped finish slot in dosage of each component, sequentially adds organic acid, ethylene glycol, benzotriazole, slowly adds
Enter the concentrated sulfuric acid while stirring, water-based thickener is added when temperature is down to 28 DEG C while stirring, obtains brightener.
Embodiment 3
A kind of phosphor-copper bar brightening liquid, consists of the following mass percentage components:
Sulfuric acid 10.0%, hydrogen peroxide 64%, 1-hydroxy ethylidene-1,1-diphosphonic acid 7.0%, ethylene glycol 4.0%, benzotriazole 4.0%, OP-10 table
Water-based thickener 3.0% after face activating agent 8.0%, activation.
The method of above-mentioned phosphor-copper bar brightening liquid, comprising the following steps: mass percent according to claim 1 weighs
Hydrogen peroxide is added in bright dipped finish slot in dosage of each component, sequentially adds organic acid, ethylene glycol, benzotriazole, slowly adds
Enter the concentrated sulfuric acid while stirring, water-based thickener is added when temperature is down to 30 DEG C while stirring, obtains brightener.
Claims (3)
1. a kind of phosphor-copper bar brightening liquid, which is characterized in that consist of the following mass percentage components: sulfuric acid 8.0%-12.0%,
Hydrogen peroxide 63.0%-65.0%, organic acid 6.0%-8.0%, ethylene glycol 3.0%-5.0%, benzotriazole 3.0%-5.0%, OP-10 table
Water-based thickener 2%-4% after face activating agent 7.0%-9.0%, activation.
2. a kind of phosphor-copper bar brightening liquid as described in claim 1, it is characterised in that: the organic acid be citric acid, acetic acid or
1-hydroxy ethylidene-1,1-diphosphonic acid.
3. a kind of method for preparing phosphor-copper bar brightening liquid described in claim 1, which comprises the following steps: by power
Benefit require 1 described in mass percent, weigh dosage of each component, hydrogen peroxide is added in bright dipped finish slot, has sequentially added
Machine acid, ethylene glycol, benzotriazole, are slowly added to the concentrated sulfuric acid while stirring, and water-based thickener is added when being down to 20-30 DEG C in temperature
It stirs simultaneously, obtains brightener.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910577363.4A CN110184595A (en) | 2019-06-28 | 2019-06-28 | A kind of phosphor-copper bar brightening liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910577363.4A CN110184595A (en) | 2019-06-28 | 2019-06-28 | A kind of phosphor-copper bar brightening liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110184595A true CN110184595A (en) | 2019-08-30 |
Family
ID=67724269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910577363.4A Pending CN110184595A (en) | 2019-06-28 | 2019-06-28 | A kind of phosphor-copper bar brightening liquid |
Country Status (1)
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| CN (1) | CN110184595A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111996575A (en) * | 2020-09-08 | 2020-11-27 | 宁波江丰电子材料股份有限公司 | Surface treatment method of CuP electroplating anode material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102747371A (en) * | 2012-07-17 | 2012-10-24 | 许泽波 | Chemical polish for copper and alloy surface treatment and preparation method thereof |
| CN104388961A (en) * | 2014-11-14 | 2015-03-04 | 平高集团有限公司 | Copper cleaning agent and preparation method thereof |
| CN108411314A (en) * | 2018-04-02 | 2018-08-17 | 深圳市祥盛兴科技有限公司 | A kind of copper and copper alloy surface cleaning solution and preparation method thereof |
-
2019
- 2019-06-28 CN CN201910577363.4A patent/CN110184595A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102747371A (en) * | 2012-07-17 | 2012-10-24 | 许泽波 | Chemical polish for copper and alloy surface treatment and preparation method thereof |
| CN104388961A (en) * | 2014-11-14 | 2015-03-04 | 平高集团有限公司 | Copper cleaning agent and preparation method thereof |
| CN108411314A (en) * | 2018-04-02 | 2018-08-17 | 深圳市祥盛兴科技有限公司 | A kind of copper and copper alloy surface cleaning solution and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 胡磊等: "新型铜及铜合金酸洗光亮剂研究", 《中国洗涤用品工业》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111996575A (en) * | 2020-09-08 | 2020-11-27 | 宁波江丰电子材料股份有限公司 | Surface treatment method of CuP electroplating anode material |
| CN111996575B (en) * | 2020-09-08 | 2023-01-17 | 宁波江丰电子材料股份有限公司 | Surface treatment method of CuP electroplating anode material |
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| PB01 | Publication | ||
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Application publication date: 20190830 |