CN110177430B - Device and method for removing reaction layer of ceramic copper-clad plate - Google Patents
Device and method for removing reaction layer of ceramic copper-clad plate Download PDFInfo
- Publication number
- CN110177430B CN110177430B CN201910320503.XA CN201910320503A CN110177430B CN 110177430 B CN110177430 B CN 110177430B CN 201910320503 A CN201910320503 A CN 201910320503A CN 110177430 B CN110177430 B CN 110177430B
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- Prior art keywords
- clad plate
- ceramic copper
- heating pipe
- fixture
- copper
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- 239000000919 ceramic Substances 0.000 title claims abstract description 57
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 37
- 238000005530 etching Methods 0.000 claims abstract description 22
- 239000000126 substance Substances 0.000 claims abstract description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 14
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000000243 solution Substances 0.000 claims description 11
- 239000011259 mixed solution Substances 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 5
- 239000004809 Teflon Substances 0.000 claims description 4
- 229920006362 Teflon® Polymers 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 230000002045 lasting effect Effects 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 239000012286 potassium permanganate Substances 0.000 claims description 3
- 235000013024 sodium fluoride Nutrition 0.000 claims description 3
- 239000011775 sodium fluoride Substances 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 abstract description 14
- 238000003756 stirring Methods 0.000 abstract description 3
- 239000011435 rock Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a device for removing a reaction layer of a ceramic copper-clad plate, which comprises an etching box, a heating pipe, a fixture, a titanium nitride ceramic copper-clad plate, a reciprocating plate, an eccentric wheel motor, an air suction system and a temperature control system, wherein the heating pipe is arranged in the etching box, the heating pipe is arranged around the fixture, the titanium nitride ceramic copper-clad plate is arranged in the fixture, the air suction system is arranged above the fixture, the temperature control system is connected with the heating pipe, the reciprocating plate is connected with the eccentric wheel motor, and the etching box is arranged above the reciprocating plate. This device that reaction layer was removed to ceramic copper-clad plate through the reciprocating structure that eccentric wheel motor constitutes, guarantees that the product is in whole device that removes the reaction layer, constantly rocks the stirring back and forth, fully guarantees the homogeneity of chemical solution temperature and to the contact and the corruption of reaction layer, has the performance that can be quick, thorough removal ceramic copper-clad plate titanium nitride, can get rid of ceramic copper-clad plate titanium nitride in batches.
Description
Technical Field
The invention relates to the technical field of ceramic copper-clad plates, in particular to a device for removing a reaction layer of a ceramic copper-clad plate and a removing method thereof.
Background
A copper-clad plate is also called a base material, a reinforcing material is soaked with resin, one side or two sides of the reinforcing material are coated with copper foil, and a plate-shaped material formed by hot pressing is called a copper-clad laminate, which is a basic material of a PCB (printed circuit board), and is often called a base material, and when the copper-clad laminate is used for producing a multi-layer plate, the copper-clad laminate is also called a core plate;
the reaction layer in the ceramic copper-clad plate plays a role of bonding the copper layer and the ceramic layer, however, the reaction layer in the non-pattern area cannot be removed together when the copper layer is etched, and the electric performance of the pattern area can be influenced finally because the reaction layer is conductive.
Disclosure of Invention
The invention aims to provide a device and a method for removing a reaction layer of a ceramic copper-clad plate, so as to solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a device of reaction layer is removed to pottery copper-clad plate, includes etching case, heating pipe, frock clamp, titanium nitride pottery copper-clad plate, reciprocating plate, eccentric wheel motor, system of induced drafting, temperature control system, be equipped with the heating pipe in the etching case, the heating pipe sets up around frock clamp, be equipped with titanium nitride pottery copper-clad plate in the frock clamp, frock clamp top is equipped with the system of induced drafting, temperature control system is connected with the heating pipe, reciprocating plate is connected with the eccentric wheel motor, reciprocating plate top is equipped with the etching case.
Preferably, the heating pipe is a teflon heating pipe, and the heating pipe is U-shaped.
Preferably, the material of frock clamp is epoxy, be equipped with the check in the frock clamp.
Preferably, the etching box is made of polymethyl methacrylate, and is U-shaped.
The method for removing the reaction layer of the ceramic copper-clad plate comprises the following steps of;
step one, placing the ceramic copper-clad plate etched with the copper layer into an ultrasonic cleaner for ultrasonic treatment for 1-5min, and removing residual substances after the surface of the ceramic copper-clad plate is etched;
step two, inserting the cleaned ceramic copper-clad plate into a corresponding fixture clamp, putting the ceramic copper-clad plate and the fixture together into an etching box filled with mixed liquid, and sleeving a reciprocating plate and an eccentric wheel motor;
step three, opening an eccentric wheel motor to enable the ceramic copper-clad plate to continuously shake back and forth in the mixed solution;
step four, opening a heating pipe, and keeping the temperature of the solution between 25 and 35 ℃ through a temperature control system and an air suction system;
step five, after lasting for 5-10min, taking out the tooling, flushing the ceramic copper-clad plate, wherein the reaction layer of the non-pattern area is not dissolved;
and step six, immersing the washed ceramic copper-clad plate into 5% -20% dilute hydrochloric acid solution to remove the oxide layer, and then washing and drying the ceramic copper-clad plate.
Preferably, the components of the mixed solution are as follows: nitric acid, sulfuric acid, hydrochloric acid, hydrofluoric acid, hydrogen peroxide, sodium fluoride and/or potassium permanganate.
Preferably, the mixed solution is hydrogen peroxide and hydrofluoric acid, and the ratio of the hydrogen peroxide to the hydrofluoric acid is 1:1/10.
The invention provides a device and a method for removing a reaction layer of a ceramic copper-clad plate, which have the beneficial effects that:
1. the reciprocating structure formed by the eccentric wheel motor ensures that the product continuously shakes and stirs back and forth in the whole device for removing the reaction layer, fully ensures the uniformity of the temperature of the chemical solution and the contact and corrosion to the reaction layer, ensures the safety in the process of removing the titanium nitride by the air suction system and the temperature control system, has the performance of rapidly and thoroughly removing the titanium nitride of the ceramic copper-clad plate, can remove the titanium nitride of the ceramic copper-clad plate in a large batch, and is beneficial to popularization and use;
2. the device is matched with the mixed solution, so that the reaction layer of the ceramic copper-clad plate can be removed rapidly and effectively, the electric performance of a pattern area is prevented from being influenced by the conduction of the reaction layer, and the performance of the ceramic copper-clad plate is ensured.
Drawings
Fig. 1 is a front view of a device for removing a reaction layer from a ceramic copper-clad plate according to the present invention.
In the figure: 1. etching box, 2, heating pipe, 3, frock clamp, 4, titanium nitride pottery copper-clad plate, 5, reciprocating plate, 6, eccentric wheel motor, 7, induced draft system, 8, temperature control system.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the present invention provides a technical solution: the utility model provides a device of ceramic copper clad laminate except that reaction layer, includes etching case 1, heating pipe 2, frock clamp 3, titanium nitride ceramic copper clad laminate 4, reciprocal board 5, eccentric wheel motor 6, induced draft system 7 and temperature control system 8 for control the operating temperature of whole device, prevent that overheated equipment from ageing, product copper layer oxidation and the problem of safety, be equipped with heating pipe 2 in the etching case 1, be used for the heating of chemical solution, heating pipe 2 can select for use one of Teflon heating pipe, stainless steel electric heating pipe, ceramic heating pipe or quartz heating pipe, heating pipe 2 sets up around frock clamp 3, and frock clamp 3 selects one of epoxy, polymethyl methacrylate or low-pressure high-density polyethylene for use, be equipped with titanium nitride ceramic copper clad laminate 4 in the frock clamp 3, frock clamp 3 top is equipped with induced draft system 7 for in time get rid of volatilized a small amount of chemical vapor because of the heating, system 8 is connected with heating pipe 2, reciprocal board 5 is connected with eccentric wheel motor 6, can drive reciprocal board 5 reciprocal operation through round motor 6, frock clamp 5 top is equipped with epoxy, 1, polymethyl methacrylate or low-density polyethylene etching case 1 for etching.
As a preferable scheme, the heating pipe 2 is a teflon heating pipe, and the heating pipe is U-shaped and is used for heating various corrosive liquids, and has excellent ageing resistance and good bending performance.
As a preferred scheme, further, the material of frock clamp 3 is epoxy, has good insulativity, and is resistant to chemical corrosion, has better oil resistance and solvent resistance, be equipped with the check in the frock clamp 3, can place the titanium nitride pottery copper-clad plate 4 that needs the processing alone.
Preferably, the etching box 1 is made of polymethyl methacrylate, and the etching box 1 is U-shaped, has excellent transparency and has outstanding aging resistance.
The method for removing the reaction layer of the ceramic copper-clad plate comprises the following steps of;
step one, placing the ceramic copper-clad plate etched with the copper layer into an ultrasonic cleaner for ultrasonic treatment for 1-5min, and removing residual substances after the surface of the ceramic copper-clad plate is etched;
step two, inserting the cleaned ceramic copper-clad plate into a corresponding fixture clamp 3, putting the ceramic copper-clad plate and the fixture into an etching box 1 filled with mixed liquid, and sleeving a reciprocating plate 5 and an eccentric wheel motor 6;
the reciprocating structure of the reciprocating plate 5 formed by the eccentric wheel motor 6 ensures that the product continuously shakes and stirs back and forth in the whole device for removing the reaction layer, and fully ensures the uniformity of the temperature of the chemical solution and the contact and corrosion of the reaction layer of the titanium nitride ceramic copper-clad plate 4;
step three, opening an eccentric wheel motor 6 to enable the ceramic copper-clad plate to continuously shake back and forth in the mixed solution;
the components of the mixed solution are as follows: nitric acid, sulfuric acid, hydrochloric acid, hydrofluoric acid, hydrogen peroxide, sodium fluoride and one or more of potassium permanganate;
the mixed solution is preferably hydrogen peroxide and hydrofluoric acid, and the ratio of the hydrogen peroxide to the hydrofluoric acid is 1:1/10;
step four, opening a heating pipe, and keeping the temperature of the solution between 25 and 35 ℃ through a temperature control system 8 and an air suction system 7;
the working temperature of the whole device is controlled through a temperature control system 8, equipment aging caused by overheating is prevented, a copper layer of a product is oxidized, and safety problems are solved, and a small amount of chemical steam volatilized due to heating is timely removed through an air suction system 7;
step five, after lasting for 5-10min, taking out the tooling, flushing the ceramic copper-clad plate, wherein the reaction layer of the non-pattern area is not dissolved;
and step six, immersing the washed ceramic copper-clad plate into 5% -20% dilute hydrochloric acid solution to remove the oxide layer, and then washing and drying the ceramic copper-clad plate.
In the description of the present invention, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "other end," "upper," "one side," "top," "inner," "front," "center," "two ends," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operate in a particular orientation; also, unless expressly stated or limited otherwise, the terms "provided," "mounted," "disposed," and the like should be construed broadly, and may be fixedly attached, detachably attached, or integrally formed, for example; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (2)
1. The method for removing the reaction layer of the ceramic copper-clad plate is characterized in that the reaction layer plays a role in bonding a copper layer and a ceramic layer and is characterized in that: the device for removing the reaction layer by adopting the ceramic copper-clad plate comprises an etching box (1), a heating pipe (2), a fixture (3), the ceramic copper-clad plate (4), a reciprocating plate (5), an eccentric wheel motor (6), an air suction system (7) and a temperature control system (8), wherein the heating pipe (2) is arranged in the etching box (1), the heating pipe (2) is arranged around the fixture (3), the ceramic copper-clad plate (4) is arranged in the fixture (3), the air suction system (7) is arranged above the fixture (3), the temperature control system (8) is connected with the heating pipe (2), the reciprocating plate (5) is connected with the eccentric wheel motor (6), and the etching box (1) is arranged above the reciprocating plate (5);
the heating pipe (2) is a Teflon heating pipe, and the heating pipe (2) is U-shaped;
the fixture clamp (3) is made of epoxy resin, and a grid is arranged in the fixture clamp (3);
the etching box (1) is made of polymethyl methacrylate, and the etching box (1) is U-shaped;
the method for removing the reaction layer of the ceramic copper-clad plate comprises the following steps:
step one, placing the ceramic copper-clad plate etched with the copper layer into an ultrasonic cleaner for ultrasonic treatment for 1-5min, and removing residual substances after the surface of the ceramic copper-clad plate is etched;
step two, inserting the cleaned ceramic copper-clad plate into a corresponding fixture (3), putting the ceramic copper-clad plate and the fixture (3) into an etching box (1) filled with a mixed solution, and sleeving a reciprocating plate (5) and an eccentric wheel motor (6);
step three, opening an eccentric wheel motor (6) to enable the ceramic copper-clad plate to continuously shake back and forth in the mixed solution;
step four, opening a heating pipe, and keeping the temperature of the solution between 25 and 35 ℃ through a temperature control system (8) and an air suction system (7);
step five, after lasting for 5-10min, taking out the fixture (3), flushing the ceramic copper-clad plate, wherein the reaction layer of the non-pattern area is not dissolved;
and step six, immersing the washed ceramic copper-clad plate into 5% -20% dilute hydrochloric acid solution to remove the oxide layer, and then washing and drying the ceramic copper-clad plate.
2. The method for removing a reaction layer from a ceramic copper-clad plate according to claim 1, wherein the method comprises the following steps: the components of the mixed solution are as follows: nitric acid, sulfuric acid, hydrochloric acid, hydrofluoric acid, hydrogen peroxide, sodium fluoride and/or potassium permanganate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910320503.XA CN110177430B (en) | 2019-04-20 | 2019-04-20 | Device and method for removing reaction layer of ceramic copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910320503.XA CN110177430B (en) | 2019-04-20 | 2019-04-20 | Device and method for removing reaction layer of ceramic copper-clad plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110177430A CN110177430A (en) | 2019-08-27 |
| CN110177430B true CN110177430B (en) | 2024-04-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910320503.XA Active CN110177430B (en) | 2019-04-20 | 2019-04-20 | Device and method for removing reaction layer of ceramic copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110177430B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000002836A (en) * | 1998-06-23 | 2000-01-15 | 윤종용 | Etching device for semiconductor device and etching method |
| JP2007294596A (en) * | 2006-04-24 | 2007-11-08 | Etsujo Kagi Kofun Yugenkoshi | Method and apparatus of etching manufacturing process of panel |
| CN202576240U (en) * | 2012-04-05 | 2012-12-05 | 江西沃格光电科技有限公司 | Glass substrate reduction etching groove |
| CN103238380A (en) * | 2010-12-28 | 2013-08-07 | 株式会社德山 | Metallized substrate, metal paste composition, and method for producing metallized substrate |
| CN203233601U (en) * | 2013-03-29 | 2013-10-09 | 厦门大学 | Semi-automatic PCB corrosion box |
| CN103681299A (en) * | 2012-09-10 | 2014-03-26 | 洛阳鼎晶电子科技有限公司 | Chemical etching device used for manufacturing ultrathin silicon single chip |
| CN104087942A (en) * | 2014-07-24 | 2014-10-08 | 广西新天德能源有限公司 | Etching waste liquid treatment equipment |
| CN108040435A (en) * | 2017-12-12 | 2018-05-15 | 北京科技大学 | A kind of aluminum nitride ceramic substrate circuit lithographic method |
| CN207468487U (en) * | 2017-11-09 | 2018-06-08 | 蓝思科技（长沙）有限公司 | A kind of thin slice Etaching device |
| CN109208002A (en) * | 2017-07-01 | 2019-01-15 | 江苏纳沛斯半导体有限公司 | A kind of energy-saving automatic metal etching machine |
-
2019
- 2019-04-20 CN CN201910320503.XA patent/CN110177430B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000002836A (en) * | 1998-06-23 | 2000-01-15 | 윤종용 | Etching device for semiconductor device and etching method |
| JP2007294596A (en) * | 2006-04-24 | 2007-11-08 | Etsujo Kagi Kofun Yugenkoshi | Method and apparatus of etching manufacturing process of panel |
| CN103238380A (en) * | 2010-12-28 | 2013-08-07 | 株式会社德山 | Metallized substrate, metal paste composition, and method for producing metallized substrate |
| CN202576240U (en) * | 2012-04-05 | 2012-12-05 | 江西沃格光电科技有限公司 | Glass substrate reduction etching groove |
| CN103681299A (en) * | 2012-09-10 | 2014-03-26 | 洛阳鼎晶电子科技有限公司 | Chemical etching device used for manufacturing ultrathin silicon single chip |
| CN203233601U (en) * | 2013-03-29 | 2013-10-09 | 厦门大学 | Semi-automatic PCB corrosion box |
| CN104087942A (en) * | 2014-07-24 | 2014-10-08 | 广西新天德能源有限公司 | Etching waste liquid treatment equipment |
| CN109208002A (en) * | 2017-07-01 | 2019-01-15 | 江苏纳沛斯半导体有限公司 | A kind of energy-saving automatic metal etching machine |
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| CN108040435A (en) * | 2017-12-12 | 2018-05-15 | 北京科技大学 | A kind of aluminum nitride ceramic substrate circuit lithographic method |
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| Publication number | Publication date |
|---|---|
| CN110177430A (en) | 2019-08-27 |
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