CN110176405B - Spring pin test connector suitable for semiconductor wafer manufacturing - Google Patents
Spring pin test connector suitable for semiconductor wafer manufacturing Download PDFInfo
- Publication number
- CN110176405B CN110176405B CN201910308603.0A CN201910308603A CN110176405B CN 110176405 B CN110176405 B CN 110176405B CN 201910308603 A CN201910308603 A CN 201910308603A CN 110176405 B CN110176405 B CN 110176405B
- Authority
- CN
- China
- Prior art keywords
- layer
- test
- connector
- sticky
- skidding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (2)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910308603.0A CN110176405B (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector suitable for semiconductor wafer manufacturing |
CN202110071338.6A CN113035731A (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector and use method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910308603.0A CN110176405B (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector suitable for semiconductor wafer manufacturing |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110071338.6A Division CN113035731A (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector and use method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110176405A CN110176405A (en) | 2019-08-27 |
CN110176405B true CN110176405B (en) | 2021-03-26 |
Family
ID=67689539
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910308603.0A Active CN110176405B (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector suitable for semiconductor wafer manufacturing |
CN202110071338.6A Withdrawn CN113035731A (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector and use method |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110071338.6A Withdrawn CN113035731A (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector and use method |
Country Status (1)
Country | Link |
---|---|
CN (2) | CN110176405B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110975990B (en) * | 2019-11-22 | 2021-03-30 | 林国盛 | Rotary drum material crusher who contains singlechip optic fibre laser lamp |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002022768A (en) * | 2000-07-10 | 2002-01-23 | Nec Eng Ltd | Pogo pin for inspecting integrated circuit package |
US6655983B1 (en) * | 1999-05-28 | 2003-12-02 | Nhk Spring Co., Ltd. | Electrical test probe provided with a signal transmitting wire having an enlarged portion for preventing the wire from coming out of the probe |
CN1521895A (en) * | 2003-02-13 | 2004-08-18 | Smk株式会社 | Press fitting type spring connector |
CN200953030Y (en) * | 2006-08-04 | 2007-09-26 | 宏亿国际股份有限公司 | Wafer test card |
CN101261296A (en) * | 2006-11-22 | 2008-09-10 | 台湾积体电路制造股份有限公司 | Semiconductor element test structure |
CN109283367A (en) * | 2018-10-22 | 2019-01-29 | 苏州创测半导体设备有限公司 | A kind of spring needle test connector suitable for semiconductor crystal wafer manufacture |
-
2019
- 2019-04-17 CN CN201910308603.0A patent/CN110176405B/en active Active
- 2019-04-17 CN CN202110071338.6A patent/CN113035731A/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6655983B1 (en) * | 1999-05-28 | 2003-12-02 | Nhk Spring Co., Ltd. | Electrical test probe provided with a signal transmitting wire having an enlarged portion for preventing the wire from coming out of the probe |
JP2002022768A (en) * | 2000-07-10 | 2002-01-23 | Nec Eng Ltd | Pogo pin for inspecting integrated circuit package |
CN1521895A (en) * | 2003-02-13 | 2004-08-18 | Smk株式会社 | Press fitting type spring connector |
CN200953030Y (en) * | 2006-08-04 | 2007-09-26 | 宏亿国际股份有限公司 | Wafer test card |
CN101261296A (en) * | 2006-11-22 | 2008-09-10 | 台湾积体电路制造股份有限公司 | Semiconductor element test structure |
CN109283367A (en) * | 2018-10-22 | 2019-01-29 | 苏州创测半导体设备有限公司 | A kind of spring needle test connector suitable for semiconductor crystal wafer manufacture |
Also Published As
Publication number | Publication date |
---|---|
CN110176405A (en) | 2019-08-27 |
CN113035731A (en) | 2021-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Xie Jijiao Inventor after: Peng Hongqi Inventor before: Peng Hongqi |
|
CB03 | Change of inventor or designer information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210303 Address after: 510700 Room 305, building 3, 9 Xiangshan Road, Huangpu District, Guangzhou City, Guangdong Province Applicant after: Guangzhou Juxin Technology Information Co.,Ltd. Address before: 510630 Electronic Technology Research Institute, No.61, Zhongshan Avenue West, Tianhe District, Guangzhou City, Guangdong Province Applicant before: Peng Hongqi |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220614 Address after: 523000 Room 101, building 1, No. 9, Qifen street, Liaobu Town, Dongguan City, Guangdong Province Patentee after: DONGGUAN JINGDUAN PRECISION HARDWARE PRODUCTS CO.,LTD. Address before: 510700 Room 305, building 3, 9 Xiangshan Road, Huangpu District, Guangzhou City, Guangdong Province Patentee before: Guangzhou Juxin Technology Information Co.,Ltd. |
|
TR01 | Transfer of patent right |