CN110176405B - Spring pin test connector suitable for semiconductor wafer manufacturing - Google Patents
Spring pin test connector suitable for semiconductor wafer manufacturing Download PDFInfo
- Publication number
- CN110176405B CN110176405B CN201910308603.0A CN201910308603A CN110176405B CN 110176405 B CN110176405 B CN 110176405B CN 201910308603 A CN201910308603 A CN 201910308603A CN 110176405 B CN110176405 B CN 110176405B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a spring pin test connector suitable for manufacturing semiconductor wafers, which structurally comprises a spring top, a connector and an anti-skidding spring pin, wherein the spring top and the anti-skidding spring pin are of an integrated structure, the anti-skidding spring pin comprises a test round head, an inner suction strip, a clamping layer and an interlayer, the test round head is positioned between adsorption discs, when the connector is used for testing wafers, water mist on the periphery is absorbed by a main water suction layer, so that a sticky ball is firstly contacted with an object by sucking the inner part of the inner layer, a stable angle is propped against the surface to push an inner core inwards, a force transmission arc of the anti-skidding spring pin extrudes inwards, an air bag above the force transmission arc is stressed, a power-assisted support rod positioned on the surface of a suction pressure bag is stressed together and unfolded towards two sides to ensure that the sticky ball stretches out in an expanding groove, the adsorption discs are more stably adhered, and the spring pin can be more accurately tested, the test device can not slide or even be misplaced, and the test effect is prevented from being influenced.
Description
Technical Field
The present invention relates generally to the field of semiconductor technology, and more particularly to a pogo pin test connector suitable for use in semiconductor wafer manufacturing.
Background
When the semiconductor wafer is manufactured in the south wind, a little fog is adhered to the surface, the wafer is required to be detected through the spring pin connector after the wafer is manufactured, partial problems in batch production are prevented, and subsequent work is delayed.
Based on the above findings, the present inventors found that the conventional pogo pin test connector for semiconductor wafer fabrication mainly has the following disadvantages, for example:
the pogo pin is round-head-shaped and smooth, and when the pogo pin is positioned on a wafer with a lot of water mist for testing, the pogo pin slides a lot when being fixed, so that the pogo pin is easily dislocated to influence the testing result.
It is therefore desirable to provide a pogo pin test connector suitable for use in semiconductor wafer manufacturing.
Disclosure of Invention
In order to solve the problem that the pogo pin is round-head-shaped and smooth, when the pogo pin is positioned on a wafer with a little water mist for testing, the pogo pin slides a little when being fixed, so that the pogo pin is easy to misplace, and the testing result is influenced.
The invention relates to a purpose and an effect of a spring pin test connector suitable for manufacturing a semiconductor wafer, which are achieved by the following specific technical means:
the structure of the anti-skid spring needle comprises a spring top, a connector and an anti-skid spring needle.
The spring top and the anti-skidding spring needle are of an integrated structure, the anti-skidding spring needle penetrates through the connector, and the spring top is embedded into the connector.
The anti-skidding spring needle is including test button head, absorption dish, interior suction strip, card layer, interlayer, the test button head is located between the absorption dish, interior suction strip is installed between card layer and test button head, the card layer is embedded into inside the interlayer, the test button head is located between the interlayer.
As a further improvement of the invention, the inner suction strip comprises a main water absorption layer, a water storage bag and a support rod, wherein the water storage bag is connected with the main water absorption layer, the water storage bag is arranged inside the support rod, the water storage bag is in a gourd-shaped structure, and the support rod is in an arc-shaped structure.
As a further improvement of the invention, the water storage bag comprises a middle suction strip, an inner layer, diffusion suction strips and inner suction cotton, wherein the middle suction strip penetrates through the inner suction cotton, the diffusion suction strips are arranged in the inner layer, the diffusion suction strips are connected with the bottom ends of the middle suction strips, the number of the diffusion suction strips is four, the diffusion suction strips are circularly and uniformly distributed, and the number of the inner suction cotton is three.
As a further improvement of the invention, the adsorption disc comprises three main sticky soft walls, expansion grooves and sticky balls, wherein the expansion grooves are embedded in the main sticky soft walls, the sticky balls are uniformly distributed in the expansion grooves, the sticky balls are connected with the main sticky soft walls through the expansion grooves, and the number of the sticky balls is three.
As a further improvement of the invention, the sticky ball comprises an expansion angle, a rubber pad, a power-assisted support rod, a pressure absorption bag, an air bag and a pressure-applied arc, wherein the expansion angle is arranged on the outer surface of the pressure-applied arc, the rubber pad is arranged below the power-assisted support rod, the pressure absorption bag is communicated with the air bag, the power-assisted support rod is of a water-drop structure, and the number of the pressure absorption bags is two.
As a further improvement of the invention, the pressure-bearing arc comprises a force-transmitting arc, stabilizing angles, uniform balls and an inner core, wherein the inner core is arranged in the force-transmitting arc, the stabilizing angles are uniformly distributed among the uniform balls, the inner core is of a semicircular structure, and the uniform balls are of a spherical structure.
As a further improvement of the invention, the angle of exhibition includes edge buckles, an exhibition layer, and elastic edges, the elastic edges are attached to the outer surface of the exhibition layer, the edge buckles are connected with the exhibition layer, the exhibition layer is provided with four, and the elastic edges are made of rubber materials and have certain elasticity.
Compared with the prior art, the invention has the following beneficial effects:
when the connector is to test a wafer, the test round head of the connector needs to be pushed against the wafer, the main water absorption layer absorbs water mist on the periphery, the test round head is placed down by sucking the inner layer, the sticky ball can contact an object firstly, the stable angle can be abutted to the surface, the inner core of the sticky ball is pushed inwards, the force transmission arc extrudes the stress inwards, the air bag above the force transmission arc is stressed, the assisting support rods on the surface of the suction and pressure bag are stressed together and expand towards two sides, the sticky ball stretches out in the expansion groove, the adsorption disc is more firmly adhered, the spring needle can be more fixedly and accurately tested, the spring needle cannot slide to some extent, even misplacement is avoided, and the test effect is prevented from being influenced.
Drawings
FIG. 1 is a schematic diagram of a pogo pin test connector suitable for semiconductor wafer fabrication according to the present invention.
Fig. 2 is a left-view internal structural schematic diagram of an anti-slip pogo pin according to the present invention.
Fig. 3 is a front view of an internal suction strip according to the present invention.
FIG. 4 is a schematic view of a front view of the internal structure of a reservoir of the present invention.
Fig. 5 is a schematic front view of an internal structure of an adsorption tray according to the present invention.
Fig. 6 is a schematic front view of the inner structure of the sticky ball according to the present invention.
FIG. 7 is a schematic view of the front view of the internal structure of a pressed arc according to the present invention.
Fig. 8 is a schematic view of a front view of an internal structure of a field angle according to the present invention.
In the figure: the device comprises a spring top-1, a connector-2, an anti-skidding spring needle-3, a test round head-31, an adsorption disc-32, an internal suction strip-33, a clamping layer-34, an interlayer-35, a main water absorption layer-331, a water storage bag-332, a supporting rod-333, a middle suction strip-3321, an inner layer-3322, a diffusion suction strip-3323, internal suction cotton-3324, a main sticky soft wall-321, an expanding groove-322, a sticky ball-323, a spread angle-3231, a rubber pad-3232, a force-assisting supporting rod-3233, a suction and pressure bag-3234, an air bag-3235, a pressure-bearing arc-3236, a force-transferring arc-32361, a stable angle-32362, a uniform ball-32363, an inner core-32364, a side buckle-32311, a spread layer-32312 and an elastic side-32313.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
example (b):
as shown in figures 1 to 8:
the invention provides a pogo pin test connector suitable for semiconductor wafer manufacturing, which structurally comprises a pogo pin 1, a connector 2 and an anti-skidding pogo pin 3.
The spring top 1 and the anti-skidding spring needle 3 are of an integrated structure, the anti-skidding spring needle 3 penetrates through the connector 2, and the spring top 1 is embedded into the connector 2.
The inner suction bar 33 comprises a main water absorption layer 331, a water storage bag 332 and a support rod 333, the water storage bag 332 is connected with the main water absorption layer 331, the water storage bag 332 is installed inside the support rod 333, the water storage bag 332 is of a gourd-shaped structure, the support rod 333 is of an arc-shaped structure, and the water storage bag 332 can rapidly absorb water absorbed by the main water absorption layer 331 and release the main water absorption layer 331 rapidly.
The water storage bag 332 comprises middle suction bars 3321, an inner layer 3322, diffusion suction bars 3323 and inner suction cotton 3324, the middle suction bars 3321 penetrate through the inner suction cotton 3324, the diffusion suction bars 3323 are installed inside the inner layer 3322, the diffusion suction bars 3323 are connected with the bottom ends of the middle suction bars 3321, the diffusion suction bars 3323 are four and are uniformly distributed in a circular manner, the inner suction cotton 3324 is three, the distribution positions of the diffusion suction bars 3323 can enable the diffusion suction bars 3323 to comprehensively dilute the peripheral water and convey the water upwards, the middle suction bars 3321 can convey the water absorbed at the bottom upwards quickly, and the inner suction cotton 3324 can expand the internal water absorption capacity.
The adsorption disc 32 comprises a main sticky soft wall 321, an expansion groove 322 and sticky balls 323, wherein the expansion groove 322 is embedded into the main sticky soft wall 321, the sticky balls 323 are uniformly distributed inside the expansion groove 322, the sticky balls 323 are connected with the main sticky soft wall 321 through the expansion groove 322, the number of the sticky balls 323 is three, the sticky balls 323 can be stably adhered to an object contacted with the outside, and the expansion groove 322 expands the space for extrusion movement of the sticky balls 323.
The sticky ball 323 comprises an expansion angle 3231, a rubber pad 3232, a boosting support rod 3233, a suction and pressure bag 3234, an air bag 3235 and a compression arc 3236, wherein the expansion angle 3231 is mounted on the outer surface of the compression arc 3236, the rubber pad 3232 is arranged below the boosting support rod 3233, the suction and pressure bag 3234 and the air bag 3235 are communicated, the boosting support rod 3233 is of a water drop-shaped structure, the suction and pressure bag 3234 is provided with two pressure bags, the boosting support rod 3233 controls the overall tension, the suction and pressure bag 3234 can assist objects in contact to be stressed together, the expansion angle 3231 can expand the degree of the objects, and the range of the objects is limited.
The stressed arc 3236 comprises a force transmission arc 32361, a stabilizing angle 32362, an even ball 32363 and an inner core 32364, wherein the inner core 32364 is installed inside the force transmission arc 32361, the stabilizing angle 32362 is evenly distributed among the even balls 32363, the inner core 32364 is of a semicircular structure, the even balls 32363 are of a spherical structure, the stabilizing angle 32362 can enable objects to be stably adhered, and the even balls 32363 can move more smoothly without falling.
The stretching angle 3231 comprises an edge buckle 32311, a stretching layer 32312 and four elastic edges 32313, the elastic edges 32313 are attached to the outer surface of the stretching layer 32312, the edge buckle 32311 is connected with the stretching layer 32312, the number of the stretching layers 32312 is four, the elastic edges 32313 are made of rubber materials and have certain elasticity, the stretching degree of the stretching layer 32312 can be expanded, and the elastic edges 32313 can drive the contacting objects to return when resistance is lost.
The specific use mode and function of the embodiment are as follows:
in the invention, when a wafer is tested by a connector, a test round head 31 is required to be pressed against the wafer, water mist at the periphery is absorbed by a main water absorption layer 331, so that the test round head is sucked into an inner layer 3322, the test round head is collected in all directions by a diffusion suction strip 3323, the test round head is guided into an inner suction cotton 3324 by a middle suction strip 3321, the test round head 31 is put down, a sticky ball 323 contacts an object firstly, a stable angle 32362 is abutted against the surface and is separated by a uniform ball 32363, the uniform ball 32363 and the stable angle 32362 are stressed together to push an inner core 32364 inwards, a force transmission arc 32361 is stressed to extrude inwards, an air bag 3235 above the force transmission arc 32361 is stressed to push the gas in the suction and pressure bag 3234 to expand, a force boosting support rod 3233 positioned on the surface of the suction and pressure bag 3234 is expanded together to two sides, and a side buckle 32312 clamped in the inner part is pulled to expand, the sticky ball 323 is stretched in the expanding groove 322, so that the adsorption disc 32 is more firmly adhered, the spring needle can be more fixedly and accurately tested, the spring needle cannot slide to some extent or even be staggered, and the test effect is prevented from being influenced.
The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.
Claims (2)
1. The utility model provides a pogo pin test connector suitable for semiconductor wafer makes, its structure includes spring top (1), connector (2), anti-skidding pogo pin (3), spring top (1) and anti-skidding pogo pin (3) structure as an organic whole, anti-skidding pogo pin (3) run through inside connector (2), inside the embedding of spring top (1) in connector (2), its characterized in that:
the anti-skidding pogo pin (3) comprises test round heads (31), adsorption discs (32), an internal absorption strip (33), a clamping layer (34) and interlayer (35), wherein the test round heads (31) are located between the adsorption discs (32), the internal absorption strip (33) is installed between the clamping layer (34) and the test round heads (31), the clamping layer (34) is embedded into the interlayer (35), and the test round heads (31) are arranged between the interlayers (35);
the internal absorption strip (33) comprises a main water absorption layer (331), a water storage bag (332) and a support rod (333), the water storage bag (332) is connected with the main water absorption layer (331), the water storage bag (332) is installed inside the support rod (333), the water storage bag (332) comprises a middle absorption strip (3321), an inner layer (3322), a diffusion absorption strip (3323) and internal absorption cotton (3324), the middle absorption strip (3321) penetrates through the internal absorption cotton (3324), the diffusion absorption strip (3323) is installed inside the inner layer (3322), and the diffusion absorption strip (3323) is connected with the bottom end of the middle absorption strip (3321);
the adsorption disc (32) comprises a main sticky soft wall (321), an expanding groove (322) and a sticky ball (323), the expanding groove (322) is embedded into the main sticky soft wall (321), the sticky ball (323) is uniformly distributed in the expanding groove (322), the sticky ball (323) is connected with the main sticky soft wall (321) through the expanding groove (322), the sticky ball (323) comprises an expansion angle (3231), a rubber pad (3232), a power-assisted support rod (3233), a pressure suction bag (3234), an air bag (3235) and a pressure-applied arc (3236), the expansion angle (3231) is arranged on the outer surface of the pressure-applied arc (3236), the rubber pad (3232) is arranged below the power-assisted support rod (3233), the pressure-applied bag (3234) is communicated with the air bag (3235), the pressure-applied arc (3236) comprises a force-applied arc (32361), a stable angle (32362), a uniform force-applied ball (32364) and an inner core (32364), the stabilizing angle (32362) is uniformly distributed among the uniform balls (32363).
2. The pogo pin test connector of claim 1, wherein: the angle of exhibition (3231) includes limit knot (32311), exhibition layer (32312), elasticity limit (32313) laminating in exhibition layer (32312) surface, limit knot (32311) is connected with exhibition layer (32312).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910308603.0A CN110176405B (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector suitable for semiconductor wafer manufacturing |
| CN202110071338.6A CN113035731A (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector and use method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910308603.0A CN110176405B (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector suitable for semiconductor wafer manufacturing |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110071338.6A Division CN113035731A (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector and use method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110176405A CN110176405A (en) | 2019-08-27 |
| CN110176405B true CN110176405B (en) | 2021-03-26 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910308603.0A Active CN110176405B (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector suitable for semiconductor wafer manufacturing |
| CN202110071338.6A Withdrawn CN113035731A (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector and use method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110071338.6A Withdrawn CN113035731A (en) | 2019-04-17 | 2019-04-17 | Spring pin test connector and use method |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN110176405B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110975990B (en) * | 2019-11-22 | 2021-03-30 | 林国盛 | Rotary drum material crusher who contains singlechip optic fibre laser lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002022768A (en) * | 2000-07-10 | 2002-01-23 | Nec Eng Ltd | Pogo pin for inspecting integrated circuit package |
| US6655983B1 (en) * | 1999-05-28 | 2003-12-02 | Nhk Spring Co., Ltd. | Electrical test probe provided with a signal transmitting wire having an enlarged portion for preventing the wire from coming out of the probe |
| CN1521895A (en) * | 2003-02-13 | 2004-08-18 | Smk株式会社 | Press fitting type spring connector |
| CN200953030Y (en) * | 2006-08-04 | 2007-09-26 | 宏亿国际股份有限公司 | Wafer test card |
| CN101261296A (en) * | 2006-11-22 | 2008-09-10 | 台湾积体电路制造股份有限公司 | Semiconductor element test structure |
| CN109283367A (en) * | 2018-10-22 | 2019-01-29 | 苏州创测半导体设备有限公司 | A kind of spring needle test connector suitable for semiconductor crystal wafer manufacture |
-
2019
- 2019-04-17 CN CN201910308603.0A patent/CN110176405B/en active Active
- 2019-04-17 CN CN202110071338.6A patent/CN113035731A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6655983B1 (en) * | 1999-05-28 | 2003-12-02 | Nhk Spring Co., Ltd. | Electrical test probe provided with a signal transmitting wire having an enlarged portion for preventing the wire from coming out of the probe |
| JP2002022768A (en) * | 2000-07-10 | 2002-01-23 | Nec Eng Ltd | Pogo pin for inspecting integrated circuit package |
| CN1521895A (en) * | 2003-02-13 | 2004-08-18 | Smk株式会社 | Press fitting type spring connector |
| CN200953030Y (en) * | 2006-08-04 | 2007-09-26 | 宏亿国际股份有限公司 | Wafer test card |
| CN101261296A (en) * | 2006-11-22 | 2008-09-10 | 台湾积体电路制造股份有限公司 | Semiconductor element test structure |
| CN109283367A (en) * | 2018-10-22 | 2019-01-29 | 苏州创测半导体设备有限公司 | A kind of spring needle test connector suitable for semiconductor crystal wafer manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110176405A (en) | 2019-08-27 |
| CN113035731A (en) | 2021-06-25 |
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| CB03 | Change of inventor or designer information |
Inventor after: Xie Jijiao Inventor after: Peng Hongqi Inventor before: Peng Hongqi |
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| CB03 | Change of inventor or designer information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210303 Address after: 510700 Room 305, building 3, 9 Xiangshan Road, Huangpu District, Guangzhou City, Guangdong Province Applicant after: Guangzhou Juxin Technology Information Co.,Ltd. Address before: 510630 Electronic Technology Research Institute, No.61, Zhongshan Avenue West, Tianhe District, Guangzhou City, Guangdong Province Applicant before: Peng Hongqi |
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Effective date of registration: 20220614 Address after: 523000 Room 101, building 1, No. 9, Qifen street, Liaobu Town, Dongguan City, Guangdong Province Patentee after: DONGGUAN JINGDUAN PRECISION HARDWARE PRODUCTS CO.,LTD. Address before: 510700 Room 305, building 3, 9 Xiangshan Road, Huangpu District, Guangzhou City, Guangdong Province Patentee before: Guangzhou Juxin Technology Information Co.,Ltd. |
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| TR01 | Transfer of patent right |